CN111404357A - Board-level communication device and method based on direct current carrier - Google Patents
Board-level communication device and method based on direct current carrier Download PDFInfo
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- CN111404357A CN111404357A CN202010275415.5A CN202010275415A CN111404357A CN 111404357 A CN111404357 A CN 111404357A CN 202010275415 A CN202010275415 A CN 202010275415A CN 111404357 A CN111404357 A CN 111404357A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/16—Combinations of two or more digital computers each having at least an arithmetic unit, a program unit and a register, e.g. for a simultaneous processing of several programs
- G06F15/163—Interprocessor communication
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
- H02M7/5387—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B3/00—Line transmission systems
- H04B3/54—Systems for transmission via power distribution lines
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Abstract
The embodiment of the invention discloses a board-level communication device and a communication method based on a direct current carrier wave, wherein the board-level communication device based on the direct current carrier wave comprises the following components: the first circuit board and the second circuit board are connected with the first circuit board through a power line; the first circuit board includes: the H-bridge circuit unit and the first singlechip unit; the second circuit board comprises an acquisition circuit unit, a rectifying circuit unit, a second single chip microcomputer unit, a voltage reduction circuit unit and a load unit; one end of the H-bridge circuit unit is connected with the signal output end of the first single chip microcomputer unit; the other end of the rectifier circuit unit is connected with one end of the acquisition circuit unit and one end of the rectifier circuit unit; the other end of the acquisition circuit unit is connected with the signal input end of the second singlechip unit; the other end of the rectifying circuit unit is connected with one end of the voltage reduction circuit unit; the other end of the voltage reduction circuit unit is connected with the load unit and the power supply ends of the second single chip microcomputer unit. The invention transmits signals by changing the current direction to realize board-level communication.
Description
Technical Field
The invention relates to the technical field of board-level communication, in particular to a board-level communication device and a communication method based on direct current carriers.
Background
In board-level MCU communication, there are often A board and B board communication, and the A board still needs to provide the power for B board simultaneously, generally needs VCC and GND and three lines of communication line. At present, in the dc carrier technology in the prior art, an ac waveform or a high-frequency pulse is generally superimposed on a dc, and then an ac or high-frequency signal is coupled out at a receiving end, but the concept is relatively high in cost and complex in circuit.
Disclosure of Invention
The embodiment of the invention provides a board-level communication device and a communication method based on a direct current carrier, the board-level communication device and the communication method based on the direct current carrier realize signal transmission by changing the current direction of a power supply in board-level communication, the circuit structure is simple, and the circuit cost is effectively reduced.
In one aspect, the invention provides a board-level communication device based on a direct current carrier, which comprises a first circuit board, a second circuit board and a power line, wherein the first circuit board is connected with the second circuit board through the power line;
wherein the first circuit board includes: the H-bridge circuit unit and the first singlechip unit;
the second circuit board includes: the circuit comprises an acquisition circuit unit, a rectifying circuit unit, a second single chip microcomputer unit, a voltage reduction circuit unit and a load unit;
one end of the H-bridge circuit unit is connected with the signal output end of the first single chip microcomputer unit;
the other end of the H-bridge circuit unit is connected with one end of the acquisition circuit unit; the other end of the H-bridge circuit unit is also connected with one end of the rectifying circuit unit;
the other end of the acquisition circuit unit is connected with the signal input end of the second single chip microcomputer unit;
the other end of the rectifying circuit unit is connected with one end of the voltage reduction circuit unit;
the other end of the voltage reduction circuit unit is connected with the load unit, and the other end of the voltage reduction circuit unit is also connected with a power supply end of the second single chip microcomputer unit.
The H-bridge circuit unit is used for changing a first direct current power supply of the first circuit board into a first current power supply;
the first single chip microcomputer unit is used for sending a level signal;
the acquisition circuit unit is used for acquiring the signal content of the first current power supply;
the rectifying circuit unit is used for converting the first current power supply into a second direct current power supply;
the second singlechip unit is used for receiving a level signal;
the voltage reduction circuit unit is used for reducing the voltage of the second direct-current power supply to obtain a third direct-current power supply;
the load unit is used for starting when the third direct current power supply is switched on.
In a second aspect, the present invention provides a communication method for a board-level communication device based on a dc carrier, including:
receiving a first current power supply output by a first circuit board;
acquiring voltage information of the voltage of the first current power supply;
and reading a level signal corresponding to the voltage information.
The embodiment of the invention provides a board-level communication device and a communication method based on direct-current carrier waves, wherein a first circuit board is connected with a second circuit board through a power line, different level signals are sent to an H-bridge circuit unit through a first single chip microcomputer unit on the first circuit board, so that the H-bridge circuit unit converts a first direct-current power supply into a first current power supply with a current direction corresponding to the level signals and outputs the first current power supply to the second circuit board through the power line, and then an acquisition circuit unit acquires the voltage of the first current power supply and outputs the voltage to the second single chip microcomputer unit so as to read the level signals sent by the first single chip microcomputer unit to realize board-level communication; meanwhile, the first current power supply is rectified by the rectifying circuit unit to obtain a second direct current power supply, and the second direct current power supply is subjected to voltage reduction by the voltage reduction circuit unit to output a third direct current power supply to supply power to the second circuit board. The invention realizes signal transmission by changing the current direction of the power supply in board-level communication, has simple circuit structure and effectively reduces the circuit cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic block diagram of a board-level communication device based on a dc carrier according to an embodiment of the present invention;
fig. 2 is a circuit diagram of a first circuit board of a dc carrier based board-level communication device according to an embodiment of the present invention;
fig. 3 is a circuit diagram of a second circuit board of a dc carrier based board-level communication device according to an embodiment of the present invention;
fig. 4 is a flowchart illustrating a communication method of a board-level communication device based on a dc carrier according to an embodiment of the present invention;
fig. 5 is a sub-flowchart of a communication method of a board-level communication device based on a dc carrier according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Referring to fig. 1-3, fig. 1 is a schematic block diagram of a board-level communication device based on a dc carrier according to an embodiment of the present invention; fig. 2 is a circuit diagram of a first circuit board of a dc carrier based board-level communication device according to an embodiment of the present invention; fig. 3 is a circuit diagram of a second circuit board of a board-level communication device based on a dc carrier according to an embodiment of the present invention. In this embodiment, the dc carrier based board level communication apparatus is described with reference to fig. 1 to 3, as shown in fig. 1 to 3, the dc carrier based board level communication apparatus includes: the circuit board comprises a first circuit board A, a second circuit board B and a power line, wherein the first circuit board A is connected with the second circuit board B through the power line;
wherein the first circuit board a includes: an H-bridge circuit unit 11 and a first singlechip unit 12;
the second circuit board B includes: the system comprises an acquisition circuit unit 21, a rectification circuit unit 22, a second singlechip unit 23, a voltage reduction circuit unit 24 and a load unit 25;
one end of the H-bridge circuit unit 11 is connected with a signal output end MCU-TX of the first singlechip unit 12; the other end of the H-bridge circuit unit 11 is connected with one end of the acquisition circuit unit 21; the other end of the H-bridge circuit unit 11 is further connected to one end of the rectifier circuit unit 22; the other end of the acquisition circuit unit 21 is connected with a signal input end MCU-RX of the second single chip microcomputer unit 23; the other end of the rectifying circuit unit 22 is connected with one end of a voltage reduction circuit unit 24; the other end of the voltage-reducing circuit unit 24 is connected with a load unit 25, and the other end of the voltage-reducing circuit unit 24 is also connected with a power supply end of the second single-chip microcomputer unit 23.
The H-bridge circuit unit 11 is configured to change a first direct-current power supply of the first circuit board a into a first current power supply;
the first single chip microcomputer unit 12 is used for sending a level signal;
the acquisition circuit unit 21 is configured to acquire signal content of the first current power supply;
the rectifier circuit unit 22 is used for converting the first current power supply into a second direct current power supply;
the second single chip microcomputer unit 23 is configured to receive a level signal;
the voltage reduction circuit unit 24 is configured to reduce the voltage of the second dc power supply to obtain a third dc power supply;
the load unit 25 is configured to start when the third dc power supply is turned on.
In this embodiment, in board-level MCU communication, the board-level communication device based on dc carrier improves the dc carrier concept in the prior art, and realizes signal transmission by changing the current direction according to the rule of the power supply in dc carrier communication. The first circuit board A and the second circuit board B are connected through the power line, wherein the power line is a direct current power line. In board level communication, the first circuit board a supplies power to the second circuit board B through the power line, and unidirectional communication from the first circuit board a to the second circuit board B is realized only through the power line. The board-level communication device based on the direct current carrier realizes the one-way communication between the first circuit board A and the second circuit board B under the condition that a communication line is not needed, effectively simplifies the circuit structure in the board-level one-way communication, and is beneficial to reducing the circuit cost.
In specific implementation, the working voltage range that the board-level communication device based on the direct current carrier can apply is between 3.3V and 28V, and the communication architecture that the first circuit board a supplies power to the second circuit board B and the first circuit board a performs one-way communication to the second circuit board B in the working voltage range can use the scheme. Specific examples are: the massage chair main control board is used as the first circuit board A, and the massage chair motor board is used as the second circuit board B; or, the dishwasher key is used as the first circuit board A and the dishwasher control board is used as the second circuit board B; or, the refrigerator main control board is used as the first circuit board A and the refrigerator water pump board is used as the second circuit board B.
The first circuit board A comprises the H-bridge circuit unit 11 and the first single chip microcomputer unit 12, and one end of the H-bridge circuit unit 11 is connected with a signal output end MCU-TX of the first single chip microcomputer unit 12; the other end of the H-bridge circuit unit 11 is connected with one end of the acquisition circuit unit 21; the other end of the H-bridge circuit unit 11 is further connected to one end of the rectifier circuit unit 22; the H-bridge circuit unit 11 is used to change the first dc power supply of the first circuit board a into a first current power supply whose direction is changed regularly, and when the H-bridge circuit unit is applied specifically, when the signal output end MCU-TX of the first single chip outputs logic 1 using a first terminal CN1 and a second terminal CN2 (the first terminal CN1 includes a first port CN1-1 and a second port CN1-2, and the second terminal includes a third port CN2-1 and a fourth port CN2-2), i.e. a high level signal, the H-bridge circuit unit 11 outputs the first current power having a specific current direction (when the bus output is the first port CN1-1: VCC1, the second port CN1-2: GND1, the current direction flows from the first port CN1-1 to the second port CN 1-2); when the signal output end MCU-TX of the first single chip 12 outputs a logic 0, i.e. a low level signal, the H-bridge circuit unit 11 outputs the first current power, and the current direction of the first current power is opposite to the current direction when the signal output end MCU-TX of the first single chip 12 outputs a high level signal (at this time, the bus outputs are the first port CN1-1: GND1, the second port CN1-2: VCC1, and the current direction flows from the second port CN1-2 to the first port CN 1-1).
When the H-bridge circuit unit 11 regularly changes the first dc power supply into the first current power supply with a specific current direction, the first current power supply on the first circuit board a is output to the acquisition circuit unit 21 and the rectifier circuit unit 22 on the second circuit board B through the power line, the rectifier circuit unit 22 rectifies and converts the first current power supply into the second dc power supply, and then the voltage-reducing circuit unit 24 reduces the second dc power supply into the third dc power supply conforming to the working voltages of the second single-chip microcomputer unit 23 and the load unit 25, so as to supply power to the second single-chip microcomputer unit 23 and the load unit 25; meanwhile, the acquisition circuit unit 21 acquires the voltage at the third port CN2-1 to acquire the signal content transmitted on the bus, and then transmits the signal content to the signal input end MCU-RX of the second single chip microcomputer unit 23, so that the second single chip microcomputer unit 23 reads the level signal corresponding to the signal content transmitted on the bus. In specific implementation, when the first current power supply has a specific current direction (at this time, the bus output is the first port CN1-1: VCC1, the second port CN1-2: GND1, and the current direction flows from the first port CN1-1 to the second port CN1-2), the voltage value of the third port CN2-1 is VCC1, and the second mcu unit 23 reads a high level signal; when the first current power supply has a specific current direction (at this time, the bus outputs are the first port CN1-1: GND1, the second port CN1-2: VCC1, and the current direction flows from the second port CN1-2 to the first port CN1-1), the voltage value of the third port CN2-1 is GND1, and the second single chip unit 23 reads a low level signal.
In the present embodiment, the H-bridge circuit unit 11 includes: a first MOS transistor Q1, a second MOS transistor Q2, a third MOS transistor Q3, a fourth MOS transistor Q4, a first triode Q5, a second triode Q6, a third triode Q7, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a ninth resistor R9, and a tenth resistor R10; one end of the first resistor R1 is connected with the drain of the first MOS transistor Q1, and the other end of the first resistor R1 is connected with one end of the second resistor R2; the other end of the second resistor R2 is connected with the gate of the first MOS transistor Q1; the drain electrode of the first MOS tube Q1 is connected with the drain electrode of the second MOS tube Q2; the source electrode of the first MOS transistor Q1 is connected with the drain electrode of the third MOS transistor Q3 to form a first bridge arm; one end of the third resistor R3 is connected with the drain electrode of the second MOS transistor Q2; the other end of the third resistor R3 is connected with the other end of the fourth resistor R4; one end of the fourth resistor R4 is connected with the gate of the second MOS transistor Q2; the source electrode of the second MOS transistor Q2 is connected with the drain electrode of the fourth MOS transistor Q4 to form a second bridge arm; one end of the fifth resistor R5 is connected with one end of the second resistor R2; the other end of the fifth resistor R5 is connected with the gate of the third MOS transistor Q3; the source electrode of the third MOS tube Q3 is grounded; one end of the sixth resistor R6 is connected with the gate of the fourth MOS transistor Q4; the other end of the sixth resistor R6 is connected with the other end of the fourth resistor R4; the source electrode of the fourth MOS tube Q4 is grounded; the collector of the first triode Q5 is connected with one end of the fifth resistor R5; the base of the first triode Q5 is connected in series with the seventh resistor R7 and the eighth resistor R8 and the base of the second triode Q6; the emitter of the first triode Q5 is grounded; the emitter of the second triode Q6 is connected with a first constant voltage power supply of + 5V; the collector of the second triode Q6 and the ninth resistor R9 are connected in series with the GND 1; the collector of the third triode Q7 is connected with the other end of the sixth resistor R6; the base of the third triode Q7 is connected in series with the tenth resistor R10 and the collector of the second triode Q6; the emitter of the third transistor Q7 is grounded to GND 1.
In one embodiment, the power line includes a first line and a second line; one end of the first circuit is connected to the first bridge arm, and the other end of the first circuit is connected to the second terminal b; one end of the second line is connected to the second bridge arm, and the other end of the second line is connected to the fourth terminal d. The first bridge arm is connected to and outputs from the first line, the second bridge arm is connected to and outputs from the second line, and the first line and the second line together form an output bus of the H-bridge circuit unit 11.
In board level communication, during normal work first circuit board A can give second circuit board B supplies power, simultaneously first circuit board A also can pass through the power cord pair one-way communication is realized to second circuit board B, wherein, H bridge circuit unit 11 is used for with first direct current power supply on the first circuit board A becomes the first current power supply according to law change, first current power supply has specific current direction. The drain of the first MOS transistor Q1 and the drain of the second MOS transistor Q2 on the H-bridge circuit unit 11 are connected and commonly connected to a power supply terminal VCC1 of the first circuit board; the source electrode of the first MOS transistor Q1 is connected with the drain electrode of the third MOS transistor Q3 to form a first bridge arm; the source electrode of the second MOS transistor Q2 is connected with the drain electrode of the fourth MOS transistor Q4 to form a second bridge arm; the source of the third MOS transistor Q3 is grounded GND1, and the source of the fourth MOS transistor Q4 is grounded GND 1; and a first circuit of the power line is connected to the first bridge arm for output, and a second circuit of the power line is connected to the second bridge arm for output.
The first single chip microcomputer unit 12 is mainly used for sending signals, and sends high level signals or low level signals to the H-bridge circuit unit 11 according to task instructions corresponding to the first circuit board a, in practical application, the first single chip microcomputer unit 12 sends level signals corresponding to the task instructions to the H-bridge circuit unit 11 according to task instructions of the first circuit board a, such as main control boards of massage chairs or main keys of dishwashers or main control boards of refrigerators, the H-bridge circuit unit 11 receives the level signals sent by the first single chip microcomputer unit 12, and changes the first direct current power supply on the first circuit board a into the first current power supply with a specific current direction according to rules to be output, so that power supply and one-way communication of the second circuit board B are realized.
In an embodiment, a signal output end MCU-TX of the first single chip microcomputer unit 12 is connected between the seventh resistor R7 and the eighth resistor R8, and the task instruction of the first circuit board a can send a level signal corresponding to the task instruction to the H-bridge circuit unit 11 through the signal output end MCU-TX of the first single chip microcomputer unit 12. In specific implementation, the first circuit board a supplies power to the second circuit board B through the power line and simultaneously realizes one-way communication, wherein the H-bridge circuit unit 11 on the first circuit board is connected with the rectifier circuit unit 22 on the second circuit board B and the acquisition circuit unit 21 during normal operation, so that the first circuit board a supplies power to the second circuit board B and realizes one-way communication.
On the first circuit board a, the first single chip microcomputer unit 12 may set different pulse width values to express different logic values through NEC format preset coding communication, when the signal output end MCU-TX of the first single chip microcomputer unit 12 outputs logic 1, the level signal output by the first single chip microcomputer unit 12 is at a high level, and after the H-bridge circuit unit 11 receives the input of the high level signal, the H-bridge circuit unit controls the first transistor Q5, the second transistor Q6, the third transistor Q7, the second MOS transistor Q2 and the third MOS transistor Q3 to be turned off, and controls the first MOS transistor Q1 and the fourth MOS transistor Q4 to be turned on. In order to clarify the direction of the current output by the first circuit board a, the first terminal CN1 is provided between the first line and the second line for the output of the H-bridge circuit unit 11, the first port CN1-1 is connected with the first line, and the second port CN1-2 is connected with the second line; when the output of the signal output end MCU-TX of the first single chip unit 12 is logic 1 and the level signal output by the first single chip unit 12 is high level, the voltage value output by the first port CN1-1 is VCC1, the voltage value output by the second port CN1-2 is GND1, and the current direction of the first current power supply output by the H-bridge circuit unit 11 at this time flows from the first port CN1-1 to the second port CN 1-2. When the output of the signal output end MCU-TX of the first single chip unit 12 is logic 0, the level signal output by the first single chip unit 12 is at low level, the voltage value output by the first port CN1-1 is GND1, the voltage value output by the second port CN1-2 is VCC1, and the current direction of the first current power supply output by the H-bridge circuit unit 11 at this time flows from the second port CN1-2 to the first port CN 1-1.
In the present embodiment, the rectifier circuit unit 22 includes: a first diode D1, a second diode D2, a third diode D3, a fourth diode D4; one end of the first diode D1 and one end of the fourth diode D4 are connected to form a first terminal a of the rectifier circuit unit 22; the other end of the first diode D1 is connected with one end of the second diode D2 to form a second terminal b of the rectifier circuit unit 22; the other end of the second diode D2 is connected to the other end of the third diode D3 to form a third terminal c of the rectifier circuit unit 22; one end of the third diode D3 is connected to the other end of the fourth diode D4 to form a fourth terminal D of the rectifier circuit unit 22. The first terminal a and the third terminal c are connected to the voltage-reducing circuit unit 24; the second terminal b and the fourth terminal d are connected to the H-bridge circuit unit 11.
In practical implementation, when the first current power is output from the first circuit board a to the second circuit board B through the power line, the rectifier circuit unit 22 first converts the current, which changes direction regularly in the first current power, into a direct current through a rectifier bridge, so as to obtain the second direct current power, wherein the first diode D1, the second diode D2, the third diode D3, and the fourth diode D4 form the rectifier bridge B1 in the rectifier circuit unit. The second dc power supply is subjected to voltage reduction processing by the voltage reduction circuit unit 24 to become the third dc power supply, which is used as a working power supply for the second single chip microcomputer unit 23 and the load unit 25.
In this embodiment, the acquisition circuit unit 21 includes: an eleventh resistor R11, a twelfth resistor R12 and a thirteenth resistor R13; one end of the eleventh resistor R11 is connected with a signal input end MCU-RX of the second single chip microcomputer unit 23, and the other end of the eleventh resistor R11 is connected with one end of the twelfth resistor R12; the other end of the twelfth resistor R12 is grounded GND 2; one end of the thirteenth resistor R13 is connected to the second terminal b, and the other end of the thirteenth resistor R13 is connected to the other end of the eleventh resistor R11. When the first current power supply is rectified by the rectifier circuit unit 22, and the acquisition circuit unit 21 also acquires voltage of the first current power supply, in a specific implementation, the second terminal CN2 is disposed on the second circuit board B, the third port CN2-1 is connected to the acquisition circuit unit 21, and the third port CN2-1 is further connected to the second terminal B; the fourth port CN2-2 is connected to the fourth terminal d; the acquisition circuit unit 21 acquires the voltage of the third port CN2-1 to obtain the information content transmitted on the bus.
When the specific current direction of the first current power supply flows from the first port CN1-1 to the second port CN1-2, the voltage value of the third port CN2-1 is VCC1, the voltage value of the third port CN2-1 is divided into the input range of the second single chip microcomputer unit 23 through the eleventh resistor R11 and the twelfth resistor R12, and the signal input end MCU-RX of the second single chip microcomputer unit R23 reads a high level signal at this time. When the specific current direction of the first current power supply flows from the second port CN1-2 to the first port CN1-1, the voltage value of the third port CN2-1 is GND1, and the signal input end MCU-RX of the second single chip unit 23 reads a low level signal at this time.
In the present embodiment, the voltage-decreasing circuit unit 24 includes: a first capacitor C1 and a voltage stabilizing chip U1; one end of the first capacitor C1 is connected to the third terminal C, and one end of the first capacitor C1 is also connected to the regulator chip U1; the other end of the first capacitor C1 is grounded. On the second circuit board B, when the first current power is rectified and converted into the second dc power through the rectifier circuit unit 22, because there is a diode drop, the voltage value of one end of the first capacitor C1 is VCC1+0.7V, which is 0.7V higher than the voltage value VCC1 of the first dc power, and the voltage value of the other end of the first capacitor C1 grounded is GND1-0.7V, which is 0.7V lower than the voltage value of the first circuit board a grounded GND 1. The second dc power supply is stepped down by the step-down circuit unit 24, and the step-down circuit unit 24 is composed of the first capacitor C1 and the voltage stabilizing chip U1, and is configured to step down the second dc power supply and output the third dc power supply to the second single chip microcomputer unit 23 and the load unit 25.
In an embodiment, the voltage regulation chip U1 includes a first pin 1, a second pin 2, and a third pin 3, the first pin 1 is connected to one end of the first capacitor C1, the second pin 2 is connected to the GND2, the third pin 3 of the voltage regulation chip U1 is configured to output the third dc power under a voltage regulation condition, wherein when the third dc power is +5V, the voltage regulation chip U1 is a fixed voltage (5V) three-terminal integrated regulator of model number L05, the voltage regulation chip U1 is a three-pin chip, the first pin 1 of the voltage regulation chip U1 is an input pin Vin, the first pin 1 is connected to the positive electrode of the first capacitor C1, the second pin 2 is connected to the ground, the third pin 3 is an output pin Vout, the third pin 3 is configured to output the voltage value of the third dc power at +5V, the second dc power is connected to the positive electrode of the first capacitor C1 through the first capacitor C23, the second pin 3 is configured to supply the second dc power to the load unit of the single chip microcomputer under a 1, and the second load circuit board 82923.
An embodiment of the present invention further provides a communication method of a board-level communication device based on a dc carrier, where the communication method of the board-level communication device based on the dc carrier is applied to the board-level communication device based on the dc carrier, as shown in fig. 4, and the method includes steps S110 to S130.
S110, receiving a first current power supply output by a first circuit board A;
s120, collecting voltage information obtained by voltage of the first current power supply;
and S130, reading a level signal corresponding to the voltage information.
In an embodiment, as shown in fig. 5, step S110 further includes:
s1101, receiving a first level signal sent by a signal output end MCU-TX of the first single chip microcomputer unit 12;
s1102, judging whether the first level signal is in a high level;
s1103, if the first level signal is a high level, the H-bridge circuit unit converts the first direct-current power supply into the first current power supply;
and S1104, outputting the first current power supply to a second circuit board B.
In this embodiment, the communication method of the board-level communication device based on the dc carrier is applied to the above-mentioned board-level communication device based on the dc carrier, and in the board-level communication, the method can establish the communication content of the user level according to the basic cells (0,1) on the bus. The specific application of the method can select the own coding mode for coding according to the actual application requirements of the user. In particular, when the first circuit board a and the second circuit board B perform board-level communication, the method may operate coded communication in NEC format, and different logic values may be expressed by different pulse width values. For example, a preset pulse width value of 0.56ms low +1.69ms high is used to indicate a logic 1; the default pulse width value is 0.56ms low +0.56ms high, indicating a logic 0. When the first circuit board a needs to execute a corresponding logic command according to a task instruction, on the first circuit board a, receiving a first level signal corresponding to the logic command and sent by a signal output end MCU-TX of the first single chip microcomputer unit 12, determining whether the first level signal is a high level, if the pulse width value is 0.56ms low level +1.69ms high level, the first level signal is a high level, the H-bridge circuit unit 11 controls the on/off of relevant components therein according to the first level signal, specifically, controls the first triode Q5, the second triode Q6, the third triode W7, the second MOS W2 and the third MOS W3 to be turned off, and controls the first MOS Q1 and the fourth MOS Q4 to be turned on, so that the first dc power supply becomes a first current power supply, and then is output through the power line, wherein the first current source has a current direction corresponding to when the first level signal is a high level signal.
When the first current power is output to the second circuit board B through the power line, first, the first current power is processed by the rectifier bridge B1 of the rectifier circuit unit 22, and is converted into the second dc power, which is then transmitted to the voltage-reducing circuit unit 24. When the first current power is input into the rectifier circuit unit 22, the acquisition circuit unit 21 also acquires the voltage of the first current power, and the voltage is divided by an eleventh resistor R11 and a twelfth resistor R12 in the acquisition circuit unit 21 and output to the signal input end MCU-RX of the second single chip microcomputer unit 23. If the pulse width value is 0.56ms low level +0.56ms high level, which is used to represent a logic 0, the first level signal is low level, and controls the first transistor Q5, the second transistor Q6, the third transistor Q7, the second MOS transistor Q2 and the third MOS transistor Q3 to be turned on, and controls the first MOS transistor Q1 and the fourth MOS transistor Q4 to be turned off, the specific current direction of the output first current power supply is also opposite to that when the first level signal is high level, and the level signal finally read by the second single chip unit 23 is low level.
According to the board-level communication device and the communication method based on the direct current carrier, the power supply in board-level communication realizes signal transmission in a mode of changing the current direction, the circuit structure is simple, and the circuit cost is effectively reduced.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A board-level communication device based on DC carrier, comprising: the circuit board comprises a first circuit board, a second circuit board and a power line, wherein the first circuit board is connected with the second circuit board through the power line;
wherein the first circuit board includes: the H-bridge circuit unit and the first singlechip unit;
the second circuit board includes: the circuit comprises an acquisition circuit unit, a rectifying circuit unit, a second single chip microcomputer unit, a voltage reduction circuit unit and a load unit;
one end of the H-bridge circuit unit is connected with the signal output end of the first single chip microcomputer unit;
the other end of the H-bridge circuit unit is connected with one end of the acquisition circuit unit; the other end of the H-bridge circuit unit is also connected with one end of the rectifying circuit unit;
the other end of the acquisition circuit unit is connected with the signal input end of the second single chip microcomputer unit;
the other end of the rectifying circuit unit is connected with one end of the voltage reduction circuit unit;
the other end of the voltage reduction circuit unit is connected with the load unit, and the other end of the voltage reduction circuit unit is also connected with a power supply end of the second single chip microcomputer unit;
the H-bridge circuit unit is used for changing a first direct current power supply of the first circuit board into a first current power supply;
the first single chip microcomputer unit is used for sending a level signal;
the acquisition circuit unit is used for acquiring the signal content of the first current power supply;
the rectifying circuit unit is used for converting the first current power supply into a second direct current power supply;
the second singlechip unit is used for receiving a level signal;
the voltage reduction circuit unit is used for reducing the voltage of the second direct-current power supply to obtain a third direct-current power supply;
the load unit is used for starting when the third direct current power supply is switched on.
2. The dc carrier based board-level communication device of claim 1, wherein the H-bridge circuit unit comprises: the circuit comprises a first MOS tube, a second MOS tube, a third MOS tube, a fourth MOS tube, a first triode, a second triode, a third triode, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor and a tenth resistor;
one end of the first resistor is connected with the drain electrode of the first MOS tube, and the other end of the first resistor is connected with one end of the second resistor;
the other end of the second resistor is connected with the grid electrode of the first MOS tube;
the drain electrode of the first MOS tube and the drain electrode of the second MOS tube are connected with a power supply end;
the source electrode of the first MOS tube is connected with the drain electrode of the third MOS tube to form a first bridge arm;
one end of the third resistor is connected with the drain electrode of the second MOS tube;
the other end of the third resistor is connected with the other end of the fourth resistor;
one end of the fourth resistor is connected with the grid electrode of the second MOS tube;
the source electrode of the second MOS tube is connected with the drain electrode of the fourth MOS tube to form a second bridge arm;
one end of the fifth resistor is connected with one end of the second resistor;
the other end of the fifth resistor is connected with the grid electrode of the third MOS tube;
the source electrode of the third MOS tube is grounded;
one end of the sixth resistor is connected with the grid electrode of the fourth MOS tube;
the other end of the sixth resistor is connected with the other end of the fourth resistor;
the source electrode of the fourth MOS tube is grounded;
a collector of the first triode is connected with one end of the fifth resistor;
the base electrode of the first triode is connected with the base electrode of the second triode through the seventh resistor and the eighth resistor;
the emitting electrode of the first triode is grounded;
the emitter of the second triode is connected with a first constant voltage power supply;
the collector of the second triode is grounded through the ninth resistor;
the collector of the third triode is connected with the other end of the sixth resistor;
the base electrode of the third triode is connected with the collector electrode of the second triode through the tenth resistor;
and the emitter of the third triode is grounded.
3. The dc carrier based board-level communication device of claim 2, wherein the signal output terminal of the first mcu is connected between the seventh resistor and the eighth resistor.
4. The dc carrier-based board-level communication device according to claim 2, wherein the rectifying circuit unit comprises: the diode comprises a first diode, a second diode, a third diode and a fourth diode;
the anode of the first diode and the anode of the fourth diode are connected to form a first terminal of the rectifying circuit unit;
the cathode of the first diode is connected with the anode of the second diode to form a second terminal of the rectifying circuit unit;
the negative electrode of the second diode is connected with the negative electrode of the third diode to form a third terminal of the rectifying circuit unit;
the anode of the third diode is connected with the cathode of the fourth diode to form a fourth terminal of the rectifying circuit unit;
the first terminal and the third terminal are connected to the step-down circuit unit;
the second terminal and the fourth terminal are connected to the H-bridge circuit unit.
5. The DC carrier based board level communication device of claim 4, wherein the power line comprises a first line and a second line;
one end of the first circuit is connected to the first bridge arm, and the other end of the first circuit is connected to the second terminal;
one end of the second line is connected to the second bridge arm, and the other end of the second line is connected to the fourth terminal.
6. The DC carrier based board-level communication device according to claim 5, wherein the acquisition circuit unit comprises: an eleventh resistor, a twelfth resistor, and a thirteenth resistor;
one end of the eleventh resistor is connected with the signal input end of the second single chip microcomputer unit, and the other end of the eleventh resistor is connected with one end of the twelfth resistor;
the other end of the twelfth resistor is grounded;
one end of the thirteenth resistor is connected with the second terminal, and the other end of the thirteenth resistor is connected with the other end of the eleventh resistor.
7. The dc carrier-based board-level communication device of claim 6, wherein the voltage-reducing circuit unit comprises: a first capacitor and a voltage stabilizing chip;
one end of the first capacitor is connected with the third terminal, and one end of the first capacitor is also connected with the voltage stabilizing chip; the other end of the first capacitor is grounded.
8. The dc carrier based board-level communication device of claim 7, wherein the voltage regulator chip comprises: a first pin, a second pin, and a third pin;
the first pin is connected with one end of the first capacitor;
the second pin is grounded;
and the third pin outputs the third direct current power supply in a voltage-stabilized manner.
9. A communication method of a dc carrier based board level communication device according to any of claims 1 to 8, comprising the following steps performed by the second circuit board:
receiving a first current power supply output by a first circuit board;
acquiring voltage information of the voltage of the first current power supply;
and reading a level signal corresponding to the voltage information.
10. The communication method of the dc carrier based board-level communication device according to claim 9, further comprising the following steps executed by the first circuit board:
receiving a first level signal sent by a signal output end of a first singlechip unit;
judging whether the first level signal is at a high level;
if the first level signal is a high level, controlling the H-bridge circuit unit to convert the first direct current power supply into the first current power supply;
and outputting the first current power supply to a second circuit board.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010275415.5A CN111404357A (en) | 2020-04-09 | 2020-04-09 | Board-level communication device and method based on direct current carrier |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010275415.5A CN111404357A (en) | 2020-04-09 | 2020-04-09 | Board-level communication device and method based on direct current carrier |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112910504A (en) * | 2021-01-14 | 2021-06-04 | 北京智米科技有限公司 | Direct current carrier communication system and device |
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2020
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112910504A (en) * | 2021-01-14 | 2021-06-04 | 北京智米科技有限公司 | Direct current carrier communication system and device |
| CN112910504B (en) * | 2021-01-14 | 2023-03-10 | 北京智米科技有限公司 | Direct current carrier communication system and device |
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