CN111403371A - Method for preventing light mixing of L ED CHIP series packaging light - Google Patents
Method for preventing light mixing of L ED CHIP series packaging light Download PDFInfo
- Publication number
- CN111403371A CN111403371A CN202010246156.3A CN202010246156A CN111403371A CN 111403371 A CN111403371 A CN 111403371A CN 202010246156 A CN202010246156 A CN 202010246156A CN 111403371 A CN111403371 A CN 111403371A
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- light
- ink
- emitting
- emitting units
- substrate
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000000084 colloidal system Substances 0.000 claims abstract description 7
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000000565 sealant Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to the technical field of L ED display, in particular to a method for avoiding mixed light emitted by packaging of L ED CHIP series, which comprises a substrate and light-emitting units arranged on the substrate, wherein electrodes of the light-emitting units are communicated with the substrate, the light-emitting units are subjected to L ED CHIP series process packaging and then are subjected to ink covering, if the number of the light-emitting units is 1, the surrounding light-emitting surfaces of the light-emitting units are directly subjected to ink covering, if the number of the light-emitting units is multiple, V-CUT processing is firstly carried out on middle colloid parts among the multiple light-emitting units, and then the surrounding light-emitting surfaces of the light-emitting units and the light-emitting surfaces generated due to the V-CUT processing are subjected to ink covering.
Description
Technical Field
The invention relates to the technical field of L ED display, in particular to a method for avoiding light mixing of L ED CHIP series packages.
Background
Since the package mode of CHIP series L ED is five-sided light emission, the light emitted from the periphery of two adjacent light-emitting units is easy to mix, which affects the overall display effect, the current common use is to reduce the thickness of the sealant of the light-emitting units, but even if the thickness of the sealant of the light-emitting units can reduce the influence of the light mixing problem, the problem can not be solved fundamentally, and the thinning sealant can seriously affect the reliability of the whole package device, such as air tightness.
Disclosure of Invention
The invention mainly solves the problem of light mixing of L ED CHIP series encapsulation, and completely avoids the light mixing problem caused by light emission around L ED CHIP series products by covering the periphery of a single product with printing ink.
The technical scheme of the invention is as follows:
a method for preventing L ED CHIP series packaging from emitting light and mixing light comprises a substrate and a light-emitting unit arranged on the substrate, wherein electrodes of the light-emitting unit are conducted with the substrate, and the light-emitting unit is subjected to L ED CHIP series process packaging and then is covered with ink;
if the number of the light-emitting units is 1, directly covering the light-emitting surfaces around the light-emitting units with ink;
if the number of the light-emitting units is multiple, V-CUT processing is firstly carried out on the middle colloid part among the light-emitting units, and then ink covering is carried out on the light-emitting surfaces at the periphery of the light-emitting units and the light-emitting surfaces generated due to the V-CUT processing.
Further, the ink is opaque black ink.
Further, the thickness of the ink is controlled between 6-12 um.
Preferably, the ink thickness is controlled between 8-10 um.
Preferably, the ink thickness is controlled at 9 um.
Further, the light-emitting surface generated by the V-CUT processing refers to: and after V-CUT processing is carried out on the intermediate colloid between each light-emitting unit, a gap is generated, and light-emitting surfaces generated by two adjacent light-emitting units in the gap are generated.
Further, when the ink is covered, the ink is transferred to the light emitting surface of the light emitting unit through the mold for covering.
Further, after the ink coverage, baking was performed at 140 ℃ -.
Preferably, after the ink coverage is performed, baking is performed at 150 degrees celsius for 5 minutes.
Further, the substrate includes a flat plate type substrate or a multi-layer line array light emitting unit substrate.
The invention has the beneficial effects that:
the invention carries out ink covering on the periphery of L ED CHIP series products to avoid the problem of mixed light caused by peripheral light emission, meanwhile, L ED CHIP series packaging light-emitting units are not limited to 1, a plurality of light-emitting units can be provided, 1 light-emitting unit is directly covered with ink in the peripheral light-emitting area, a plurality of light-emitting units are firstly subjected to V-CUT treatment on the middle colloid part of the product, then the light-emitting surfaces related to the periphery of the light-emitting unit are covered with ink, and the light-emitting surfaces generated by the V-CUT treatment are also covered with ink in an innovative way.
Drawings
FIG. 1 is a schematic illustration of an embodiment of the present invention;
in the figure: a peripheral light emitting surface 1, a V-CUT generated light emitting surface 2, a front light emitting surface 3 and a substrate 4.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.
Example 1:
the invention provides a method for preventing L ED CHIP series packaging from emitting light and mixing light, which comprises a substrate and a light-emitting unit arranged on the substrate, wherein the electrode of the light-emitting unit is conducted with the substrate, and the light-emitting unit is subjected to L ED CHIP series process packaging and then is covered with ink;
if the number of the light-emitting units is 1, directly covering the light-emitting surfaces around the light-emitting units with ink;
if the number of the light-emitting units is multiple, V-CUT processing is firstly carried out on the middle colloid part among the light-emitting units, and then ink covering is carried out on the light-emitting surfaces at the periphery of the light-emitting units and the light-emitting surfaces generated due to the V-CUT processing.
As shown in fig. 1, it is a schematic diagram of a package of 4 light emitting units;
after being packaged to be CUT by an L ED CHIP series normal process, ink covering is carried out on the peripheral light-emitting surface 1 and the light-emitting surface 2 generated by the V-CUT of the product (namely, the light-emitting surface 3 on the front side is removed, ink covering is carried out on other light-emitting surfaces), the ink is opaque black ink, the thickness of the ink is controlled to be 6-12um, peripheral light emitting can be completely avoided through the thickness control, the ink covering is transferred to the peripheral light-emitting surface 1 and the light-emitting surface 2 generated by the V-CUT of the product through a specific die, and the product can be quickly baked at the temperature of 140 ℃ and 160 ℃ for 5 minutes, so that the product is stable in performance.
In this embodiment, the ink thickness is preferably between 8-10um, and most preferably 9 um.
In this embodiment, the light emitting surface generated by the V-CUT processing refers to: and after V-CUT processing is carried out on the intermediate colloid between each light-emitting unit, a gap is generated, and light-emitting surfaces generated by two adjacent light-emitting units in the gap are generated.
In this embodiment, the ink is transferred to the light emitting surface of the light emitting unit by a mold for covering, and after covering, the light emitting unit is baked at 150 ℃ for 5 minutes.
In the present embodiment, the substrate 4 includes a flat substrate or a multi-layer circuit array light emitting unit substrate.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A method for preventing L ED CHIP series packaging from emitting light and mixing light is characterized by comprising a substrate and a light-emitting unit arranged on the substrate, wherein electrodes of the light-emitting unit are conducted with the substrate, and the light-emitting unit is subjected to L ED CHIP series process packaging and then is covered with ink;
if the number of the light-emitting units is 1, directly covering the light-emitting surfaces around the light-emitting units with ink;
if the number of the light-emitting units is multiple, V-CUT processing is firstly carried out on the middle colloid part among the light-emitting units, and then ink covering is carried out on the light-emitting surfaces at the periphery of the light-emitting units and the light-emitting surfaces generated due to the V-CUT processing.
2. The method of claim 1, wherein the ink is opaque black ink to avoid light mixing in an L ED CHIP package.
3. The method of claim 1, wherein the thickness of the ink is controlled to be between 6-12 um.
4. A method of avoiding light mixing in L ED CHIP series packages as claimed in claim 3, wherein the thickness of the ink is controlled between 8-10 um.
5. The method of claim 4, wherein the thickness of the ink is controlled to be 9 um.
6. The method of claim 1, wherein the V-CUT processing is performed to generate a gap between the middle encapsulant of each light emitting unit, and the gap is formed between two adjacent light emitting units.
7. The method of claim 1, wherein the step of covering the light emitting surface of the light emitting unit with the ink is performed by transferring the ink to the mold.
8. The method as claimed in claim 1, wherein the L ED CHIP series package is baked at 160 ℃ for 5 minutes after the ink covering.
9. The method of claim 8, wherein the L ED CHIP series package is baked at 150 degrees Celsius for 5 minutes after the ink covering.
10. The method of claim 1, wherein the substrate comprises a flat substrate or a multi-layer circuit array light emitting unit substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010246156.3A CN111403371A (en) | 2020-03-31 | 2020-03-31 | Method for preventing light mixing of L ED CHIP series packaging light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010246156.3A CN111403371A (en) | 2020-03-31 | 2020-03-31 | Method for preventing light mixing of L ED CHIP series packaging light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111403371A true CN111403371A (en) | 2020-07-10 |
Family
ID=71431423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010246156.3A Pending CN111403371A (en) | 2020-03-31 | 2020-03-31 | Method for preventing light mixing of L ED CHIP series packaging light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111403371A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022222258A1 (en) * | 2021-04-21 | 2022-10-27 | Tcl华星光电技术有限公司 | Display panel |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205319183U (en) * | 2015-12-11 | 2016-06-15 | 江苏鸿佳电子科技有限公司 | Luminous encapsulation LED of single face |
| US20180277725A1 (en) * | 2015-05-29 | 2018-09-27 | Hongli Zhihui Group Co.,Ltd. | Method of packaging csp led and csp led |
| CN110140218A (en) * | 2017-02-02 | 2019-08-16 | 首尔半导体株式会社 | Light emitting diode |
-
2020
- 2020-03-31 CN CN202010246156.3A patent/CN111403371A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180277725A1 (en) * | 2015-05-29 | 2018-09-27 | Hongli Zhihui Group Co.,Ltd. | Method of packaging csp led and csp led |
| CN205319183U (en) * | 2015-12-11 | 2016-06-15 | 江苏鸿佳电子科技有限公司 | Luminous encapsulation LED of single face |
| CN110140218A (en) * | 2017-02-02 | 2019-08-16 | 首尔半导体株式会社 | Light emitting diode |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022222258A1 (en) * | 2021-04-21 | 2022-10-27 | Tcl华星光电技术有限公司 | Display panel |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200710 |
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| RJ01 | Rejection of invention patent application after publication |