CN111403326B

CN111403326B - Substrate carrier and lifting structure thereof

Info

Publication number: CN111403326B
Application number: CN201910130970.6A
Authority: CN
Inventors: 潘咏晋; 刘维虔; 褚育辰
Original assignee: Gudeng Precision Industrial Co Ltd
Current assignee: Gudeng Precision Industrial Co Ltd
Priority date: 2019-01-02
Filing date: 2019-02-19
Publication date: 2023-08-29
Anticipated expiration: 2039-02-19
Also published as: TW202026222A; TWI666159B; CN111403326A

Abstract

The invention provides a substrate carrier and a lifting structure thereof. The substrate carrier comprises a containing space, a door plate, two cassette structures and a lifting structure. The accommodating space is formed by an opening, an upper plate, a lower plate, two side plates and a rear plate. The door plate is covered with the opening, the two cassette structures are respectively arranged between the upper plate and the lower plate and lean against the two side plates, and the lifting structure is arranged on the rear plate. The substrate carried in the lifting structure can be lifted by the lifting structure, so that the substrate is suspended and the shock absorbing effect is achieved.

Description

Substrate carrier and lifting structure thereof

Technical Field

The present invention relates to a substrate carrier and a lifting structure thereof, and more particularly to a substrate carrier and a lifting structure thereof capable of lifting and suspending a substrate carried therein after a door is closed.

Background

In the semiconductor industry, techniques for transporting semiconductor blanks or related plate-like sheets during various processes have been practiced for years. Among them, the Substrate (Substrate) is an indispensable base material for fabricating all semiconductor devices. Including common silicon substrates (e.g., wafers), glass substrates, ceramic substrates, and even sapphire substrates.

In the related process, the microstructure manufactured by the semiconductor process is basically a micro-scale or even a nano-scale device. Therefore, the process emphasizes that the operation is performed in a very precise environment, and that no minute particles adhere, which would otherwise result in a decrease in yield of the final semiconductor device.

Therefore, the carriers for carrying the devices required in the semiconductor process are required to have strict air tightness so as to prevent the tiny particles from adhering to the devices during carrying or storing, thereby affecting the yield of the semiconductor products. In addition, the devices carried therein are more resistant to impact or vibration, so as to avoid physical shaking or impact damage to the semiconductor devices such as the substrate.

In the prior art, a plate-like sheet element such as a substrate is lifted and fixed and vibration is avoided by using a pure groove guide angle. However, this technique has a disadvantage in that when the substrate is slid up along the lead angle to be engaged in the groove, since the substrate itself is mostly made of a material having a hardness greater than that of plastic, it is easy to scrape the lead angle during lifting and friction to generate minute particles.

Disclosure of Invention

Based on the problems mentioned in the prior art, the present invention provides a substrate carrier and a lifting structure thereof.

The lifting structure comprises a plurality of inclined supporting arms and at least one supporting piece. Wherein the plurality of diagonal support arms are disposed in a substrate carrier, and the at least one supporting member is connected to the plurality of diagonal support arms. The at least one supporting piece supports against at least one substrate placed in the substrate carrier, and the at least one supporting piece lifts the at least one substrate along with closing of a door plate of the substrate carrier.

In a possible embodiment of the present invention, the foregoing lifting structure may be disposed in the substrate carrier. In one embodiment of the present invention, a substrate carrier carrying a lifting structure includes a receiving space, a door, two cassette structures, and a lifting structure. The accommodating space is formed by an opening, an upper plate, a lower plate, two side plates and a rear plate. The door plate is covered with the opening, the two cassette structures are respectively arranged between the upper plate and the lower plate and lean against the two side plates, and the lifting structure is arranged on the rear plate. The lifting structure comprises a plurality of inclined supporting arms which are connected with the rear plate. In addition, at least one supporting piece is arranged as described above and is connected with the plurality of diagonal supporting arms. And at least one substrate is placed in the two cassette structures in sequence.

The foregoing has outlined rather broadly the several features of the present invention in order that the detailed description of the invention may be better understood. The summary of the invention is not an extensive overview of the invention, and is intended to neither identify key or critical elements of the invention nor delineate the scope of the invention, but merely to present several concepts of the invention in a simplified manner.

Drawings

FIG. 1 is a schematic view of a substrate carrier according to an embodiment of the invention;

FIG. 2 is a schematic view of a door panel according to an embodiment of the present invention;

FIG. 3 is a schematic view of a door panel according to an embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view of a substrate carrier according to another embodiment of the invention;

FIG. 5 is a schematic cross-sectional view of a substrate carrier according to an embodiment of the invention;

FIG. 6 is a schematic view illustrating the operation of the lifting structure according to the embodiment of the present invention;

FIG. 7 is a schematic view of another operation of the lifting structure according to the embodiment of the present invention.

Reference numerals illustrate:

10. substrate carrier

100. Handle grip

101. An opening

102. Upper plate

103. Lower plate

1031. Inlet port

1032. Air outlet port

104. Side plate

105. Rear plate

106. Upright post

200. Cassette structure

300. Door plank

301. Clamping-proof piece structure

3011. Pressing piece

400. Lifting structure

401. Oblique support arm

402. Supporting piece

S substrate

A1-A3 arrow

Detailed Description

For an understanding of the technical features and practical functions of the present invention, and as may be implemented in accordance with the content of the present invention, the following detailed description will be given with reference to the preferred embodiments shown in the drawings, in which:

referring to fig. 1 and 3, fig. 1 is a schematic structural diagram of a substrate carrier according to an embodiment of the invention; fig. 3 is a schematic structural view of a door panel according to an embodiment of the present invention when the door panel is closed.

As shown in fig. 3, in the present embodiment, the substrate carrier 10 is a front opening unified pod (Front Opening Unified Pod, FOUP). However, in practice, other applications are contemplated as being within the scope of the invention, as may be practiced with other semiconductor containers having a structure similar to that of the invention, and the invention is not limited thereto.

In the present embodiment, at least one handle 100 is disposed on the appearance structure of the substrate carrier 10. Fig. 1 is a schematic view of the substrate carrier 10 after the door 300 of fig. 3 is opened. As shown in fig. 1 and 3, the substrate carrier 10 of the present embodiment includes a receiving space, a door 300, a two-cassette structure 200, and a lifting structure 400.

Wherein the accommodating space is formed by an opening 101, an upper plate 102, a lower plate 103, two side plates 104 and a rear plate 105. The door 300 is covered with the opening 101, the two cassette structures 200 are respectively erected between the upper plate 102 and the lower plate 103 and near the two side plates 104, and the lifting structure 400 is arranged on the rear plate 105.

Further, the two cassette structures 200 of the present embodiment are disposed between the upper plate 102 and the lower plate 103 via the pillars 106, and are adjacent to the two side plates 104. This increases the gas flow efficiency of the holding space of the substrate carrier 10.

Therefore, in the embodiment of the present invention, the lower plate 103 is further provided with at least one gas inlet 1031 and at least one gas outlet 1032 for exchanging the internal gas of the substrate carrier 10 and keeping clean gas circulation inlets and outlets.

The lifting structure 400 in this embodiment mainly includes a plurality of diagonal support arms 401 and at least one supporting member 402 (see fig. 4 and 5). Wherein, a plurality of diagonal support arms 401 are connected with the rear plate, and at least one supporting member 402 is connected with the plurality of diagonal support arms. At least one substrate S (see fig. 6 and 7) is placed in the two-cassette structure 200 in sequence.

In this embodiment, the at least one substrate S may be a wafer, a ceramic substrate, a plastic substrate or a glass substrate, which is not limited in the present invention. Referring to fig. 2, fig. 2 is a schematic view of a door panel according to an embodiment of the invention.

In this embodiment, the inner surface of the door panel 300 (i.e. the surface of the door panel 300 close to the accommodating space) is provided with an anti-clamping piece structure 301, and the anti-clamping piece structure 301 further includes a plurality of pressing pieces 3011. The plurality of pressing pieces 3011 are mutually in a lightning concave shape which are connected in a head-to-tail complementary mode and are used for receiving at least one substrate S. The pressing piece 3011 is designed to be concave in lightning, and the end to end is complementary, so that the risk of damage to the substrate S caused by clamping pieces generated by the substrate S can be avoided.

For a better understanding of the present invention, please refer to fig. 4 and 5, fig. 4 is a schematic cross-sectional view of a substrate carrier according to another embodiment of the present invention; FIG. 5 is a schematic cross-sectional view of a substrate carrier according to an embodiment of the invention. As shown in fig. 5, in the embodiment of fig. 5, at least one supporting member 402 is a plurality of L-shaped supporting pieces, which are sequentially disposed at the top ends of a plurality of diagonal supporting arms 401. In another embodiment of fig. 4, at least one of the holding members 402 has a strip-like structure.

Therefore, please refer to fig. 4-7 simultaneously. FIG. 6 is a schematic view illustrating the operation of the lifting structure according to the embodiment of the present invention; FIG. 7 is a schematic diagram illustrating another operation of the lifting structure according to the embodiment of the invention. As shown in fig. 4-7, when at least one substrate S is placed in the accommodating space of the substrate carrier 10, each substrate S is first placed in the cassette formed by the two-cassette structure 200 and abuts against at least one abutment member 402 at the rear side, so as to form the state shown in fig. 4 and 6.

Next, as shown in fig. 7, after both cassette structures 200 are fully filled with substrates S, the door 300 may be closed. When the door panel 300 is closed, the pressing piece 3011 is forced to push the substrate S in the direction of arrow A1. Then, the substrate S will conduct the force from the door 300, so that the plurality of diagonal support arms 401 will slightly deform along the direction of arrow A3.

Thereby, the at least one supporting member 402 can support the substrate S and lift the substrate S along the arrow A2, so as to achieve good protection and shock resistance. Through the application of the embodiment of the invention, the problems of damage to the semiconductor element and generation of tiny particles are greatly reduced.

The foregoing description is only illustrative of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, i.e., the invention is not limited to the specific embodiments described herein, but is intended to cover all modifications and variations within the scope of the invention as defined by the appended claims and their equivalents.

Claims

1. A lifting structure, comprising:

a plurality of diagonal support arms disposed in a substrate carrier; and

at least one supporting piece connected with the plurality of inclined supporting arms;

wherein the at least one supporting member supports against at least one substrate placed in the substrate carrier,

the at least one supporting piece lifts the at least one substrate under the state that the at least one supporting piece is kept to be fixed against the at least one supporting piece along with the closing of a door plate of the substrate carrier.

2. The lift structure of claim 1, wherein the substrate carrier is a front opening unified pod.

3. The lift structure of claim 1, wherein the at least one substrate is a wafer, a ceramic substrate, a plastic substrate, or a glass substrate.

4. A substrate carrier, comprising:

the accommodating space is formed by an opening, an upper plate, a lower plate, two side plates and a rear plate;

a door plate which is covered with the opening;

the two cassette structures are respectively arranged between the upper plate and the lower plate and lean against the two side plates; and

a lifting structure disposed on the back plate, the lifting structure comprising:

a plurality of diagonal support arms connected to the back plate;

wherein, at least one substrate is placed in the two cassette structures in sequence;

the at least one supporting piece supports against at least one substrate placed in the substrate carrier, and the at least one supporting piece lifts the at least one substrate under the state that the at least one substrate supports against the at least one supporting piece to be fixed along with the closing of a door plate of the substrate carrier.

5. The substrate carrier of claim 4, wherein the door panel further comprises an anti-clip structure on a side of the door panel adjacent to the receiving space.

6. The substrate carrier of claim 5, wherein the anti-pinch feature comprises a plurality of abutment tabs that are lightning-in-socket complementary end-to-end with one another.

7. The substrate carrier of claim 4, wherein the substrate carrier further comprises at least one handle.

8. The substrate carrier of claim 4, wherein the at least one support member is an elongated structure.

9. The substrate carrier of claim 4, wherein the at least one supporting member is a plurality of L-shaped supporting pieces sequentially disposed on top of the plurality of diagonal supporting arms.

10. The substrate carrier of claim 4, wherein the lower plate further comprises at least one inlet port and at least one outlet port.