CN111390382A - Laser cutting machine subregion heat dissipation chip removal mechanism - Google Patents
Laser cutting machine subregion heat dissipation chip removal mechanism Download PDFInfo
- Publication number
- CN111390382A CN111390382A CN202010347032.4A CN202010347032A CN111390382A CN 111390382 A CN111390382 A CN 111390382A CN 202010347032 A CN202010347032 A CN 202010347032A CN 111390382 A CN111390382 A CN 111390382A
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- China
- Prior art keywords
- cutting machine
- laser cutting
- chip removal
- heat dissipation
- board
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a partitioned heat dissipation and chip removal mechanism of a laser cutting machine, which comprises a cutting machine table, wherein a cutting frame plate is arranged on the inner wall of the cutting machine table, a plurality of hoppers are arranged on the inner wall of the cutting machine table and positioned below the cutting frame plate, the bottom of each hopper is fixedly connected with a discharge pipe, an installation hole is formed in the inner bottom wall of the cutting machine table, and a bottom box is fixedly connected inside the installation hole through a connecting column.
Description
Technical Field
The invention relates to the technical field of laser cutting machines, in particular to a partitioned heat dissipation and chip removal mechanism of a laser cutting machine.
Background
Laser cutting is one of thermal cutting methods, in which a workpiece is irradiated with a focused high-power-density laser beam to rapidly melt, vaporize, ablate or reach the ignition point of the irradiated material, and the workpiece is cut by blowing off the molten material with the aid of a high-speed gas stream coaxial with the beam. The optical fiber laser cutting is suitable for cutting metal materials such as stainless steel, carbon steel, aluminum alloy, brass and the like, and has the characteristics of no external force contact, high cutting speed, smooth cut and the like in the cutting process. Therefore, the method is widely used in industrial production.
The energy that releases when laser beam shines the sheet metal surface is adopted to the laser cutting machine technique, make sheet metal melt and blow away the slag by gas, because can produce a large amount of heats with the sheet metal melting, consequently can lead to the inside temperature in workshop higher, we need cooperate the hopper to discharge the hot gas flow, but laser cutting machine's hopper has a plurality ofly, and the every during operation of laser cutting head, only can be located the top of a hopper, in order to be energy-conserving, need avoid carrying out the wasting discharge and the heat absorption to the hopper of non-work area below, therefore we need a laser cutting machine heat dissipation chip removal mechanism who has subregion regulatory function.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a partitioned heat dissipation and chip removal mechanism of a laser cutting machine.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a laser cutting machine subregion heat dissipation chip removal mechanism, includes the cutting board, the cutting frame plate is installed to the inner wall of cutting board, a plurality of hoppers, every are installed to the inner wall of cutting board and the below that is located the cutting frame plate, the equal fixedly connected with discharging pipe in bottom of hopper, the mounting hole has been seted up to the inner diapire of cutting board, the inside of mounting hole is through spliced pole fixedly connected with under casing, the last surface mounting of under casing has the gathering fill, the last surface mounting of gathering fill has a top case, the upper surface of top case is connected and is linked together with the bottom of discharging pipe, the surface mounting of discharging pipe has the solenoid valve, exhaust mechanism is installed in the left side of cutting board, exhaust mechanism is including installing at the left exhaust fan of cutting board and installing the ring tube on top case surface, the intake end of exhaust fan passes through the intercommunication of exhaust tube and ring tube, the dust removal device is characterized in that a filter ring is installed on the inner wall of the top box, a plurality of air holes communicated with the inside of the circular tube are formed in the inner wall of the top box, a through hole is formed in the front face of the bottom box, and a dust removal drawer is installed on the inner wall of the bottom box through a sliding rail.
Preferably, the lower surface mounting of cutting board has the supporting leg, the quantity of supporting leg is four, four the distribution of supporting leg is in the four corners department of cutting board lower surface.
Preferably, a P L C control box is installed on the left side of the cutting machine platform, the P L C control box is coupled with a P L C control system of the laser cutting machine, and the P L C control box is coupled with the electromagnetic valve and the exhaust fan respectively.
Preferably, the material of the filter ring is a stainless steel filter screen, the number of the meshes is 140-160 meshes, and one end of the exhaust fan, which is far away from the exhaust pipe, is communicated with a plant waste gas pipeline.
Preferably, the heat transfer case is installed on the right side of cutting board, the internally mounted of heat transfer case has the circulating pump, the inlet tube is installed to the output of circulating pump, the wet return is installed to the play water end of circulating pump, the inlet tube extends to the inside of cutting board and the inside that goes up the case by the upper surface center department of top case, the one end that the circulating pump was kept away from to the wet return extends to the inside that the gathering was fought, the one end that the inlet tube is located top incasement portion and wet return are located the gathering and fight inside one end and pass through the heat exchange tube intercommunication, the heat exchange tube is copper tubular construction.
Preferably, the right side installation business turn over water pipe of heat transfer case, the surface mounting of business turn over water pipe has the choke valve, business turn over water pipe passes through the tee bend and communicates with the wet return.
The invention has the following beneficial effects:
1. according to the partitioned heat dissipation and chip removal mechanism of the laser cutting machine, the P L C control box is coupled with the P L C control system of the laser cutting machine, so that the opening and closing of the electromagnetic valves on the discharge pipes of the hoppers in the corresponding regions are controlled according to the displacement parameters of the X axis and the Y axis, the synchronization with the laser cutting head is realized, heat absorption and chip removal are performed, only one electromagnetic valve is opened all the time, the other three electromagnetic valves are closed all the time, the wind pressure is increased, the energy is saved, dust in hot air flow is filtered by arranging the filter ring, and the centralized treatment of waste chips is facilitated by arranging the dust removal drawer.
2. According to the partitioned heat dissipation and chip removal mechanism of the laser cutting machine, through the circulating pump, the water inlet pipe, the water return pipe and the heat exchange pipe of the copper spiral tubular structure, heat exchange water can circularly flow in the heat exchange pipe, and exchange heat with hot air through the heat exchange pipe to collect heat generated by laser cutting, and hot water can be discharged, stored and utilized through the water inlet pipe and the water outlet pipe, so that the effect of saving energy is achieved.
Drawings
Fig. 1 is a schematic front sectional structure view of a partitioned heat dissipation and chip removal mechanism of a laser cutting machine according to the present invention;
fig. 2 is a schematic top view of the top box of the partitioned heat dissipation and chip removal mechanism of the laser cutting machine according to the present invention;
FIG. 3 is a schematic view of a top box front-cut structure of the partitioned heat dissipation and chip removal mechanism of the laser cutting machine according to the present invention;
fig. 4 is a schematic structural diagram of a front section (embodiment 2) of a partitioned heat dissipation and chip removal mechanism of a laser cutting machine provided by the invention;
FIG. 5 is a schematic front cross-sectional view of the top box of FIG. 4;
fig. 6 is a schematic front cross-sectional structure view of a heat exchange box of the partitioned heat dissipation and chip removal mechanism of the laser cutting machine provided by the invention.
In the figure, 1 a cutting machine table, 2 cutting frame plates, 3 hoppers, 4 discharge pipes, 5 connecting columns, 6 bottom boxes, 7 gathering buckets, 8 top boxes, 9 electromagnetic valves, 10 exhaust fans, 11 circular pipes, 12 exhaust pipes, 13 filter rings, 14 air holes, 15 dust removal drawers, 16 supporting legs, 17P L C control boxes, 18 heat exchange boxes, 19 circulating pumps, 20 water inlet pipes, 21 water return pipes, 22 heat exchange pipes, 23 water inlet and outlet pipes and 24 throttle valves are arranged.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-3, a laser cutting machine subregion heat dissipation chip removal mechanism, includes cutting board 1, and the lower surface mounting of cutting board 1 has supporting leg 16, and the quantity of supporting leg 16 is four, and four supporting legs 16 distribute in the four corners department of cutting board 1 lower surface.
Exhaust mechanism is installed in cutting board 1's left side, exhaust mechanism is including installing at cutting board 1 left exhaust fan 10 and installing at the ring tube 11 on top case 8 surface, exhaust pipe 12 and ring tube 11's intercommunication is passed through to exhaust fan 10's inlet end, filter ring 13 is installed to top case 8's inner wall, a plurality of intercommunication ring tube 11 inside gas pocket 14 have been seted up to top case 8's inner wall, the through-hole is seted up in the front of under casing 6, dust removal drawer 15 is installed through the slide rail to the inner wall of under casing 6.
The left side of the cutting machine table 1 is provided with a P L C control box 17, the P L C control box 17 is coupled with a P L C control system of the laser cutting machine, the P L C control box 17 is respectively coupled with an electromagnetic valve 9 and an exhaust fan 10, the material of the filter ring 13 is a stainless steel filter screen, the mesh number is 140 and 160 meshes, and one end of the exhaust fan 10 far away from the exhaust pipe 12 is communicated with a plant waste gas pipeline.
In this embodiment, through setting up P L C control box and laser cutting machine's P L C control system coupling, make it correspond opening and shutting of solenoid valve 9 on regional hopper 3's discharging pipe 4 according to the displacement parameter control of X axle and Y axle, the realization is synchronous with the laser cutting head, absorb heat and the chip removal, make it open only a solenoid valve 9 all the time, all the other three are closed all the time, the wind pressure has been increased, the energy has been practiced thrift, through setting up filter ring 13, make the dirt bits in the hot gas flow filtered, through setting up dust removal drawer 15, be convenient for the centralized processing of sweeps.
Example 2
Referring to fig. 4-6, different from embodiment 1, a heat exchange box 18 is installed on the right side of a cutting machine table 1, a circulation pump 19 is installed inside the heat exchange box 18, a water inlet pipe 20 is installed at an output end of the circulation pump 19, a water return pipe 21 is installed at a water outlet end of the circulation pump 19, the water inlet pipe 20 extends into the cutting machine table 1 and extends into a top box 8 from the center of the upper surface of the top box 8, one end of the water return pipe 21, which is far away from the circulation pump 19, extends into a gathering hopper 7, one end of the water inlet pipe 20, which is located inside the top box 8, is communicated with one end of the water return pipe 21, which is located inside the gathering hopper 7, through a heat exchange pipe 22, the heat exchange pipe 22 is of a copper spiral pipe structure, a water inlet and outlet pipe 23 is installed on the.
In this embodiment, through circulating pump 19, inlet tube 20, wet return 21 and copper spiral tubular structure's heat exchange tube 22, make that heat transfer water can circulate flow in heat exchange tube 22 to carry out the heat transfer through heat exchange tube 22 and hot gas flow, collect the heat that laser cutting produced, can also discharge hot water, storage utilization through business turn over water pipe 23, reach the effect of energy saving.
When the partitioned heat and chip removal mechanism of the laser cutting machine is used, firstly, a control main board in a P L C control box 17 is coupled with a P L C control system of the laser cutting machine through a lead, the P L C control system receives coordinate information of an X axis and a Y axis while laser cutting is carried out, then the positions of laser cutting heads represented by the X axis and the Y axis are analyzed, an electromagnetic valve 9 below a hopper 3 at a corresponding position is opened according to the position information, an exhaust fan 10 is started, hot air and waste chips generated by cutting are sucked into a top box 8, the waste chips contained in air flow are filtered by a filter ring 13 in the top box 8 and finally fall into a dust removal drawer 15, heat in the air flow and a heat exchange pipe 22 generate heat, and water flow in the heat exchange pipe 22 carries heat, so that the mechanism can collect heat generated by laser cutting, and can discharge and store hot water through a water inlet and outlet pipe 23 to achieve the effect of saving energy.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. The utility model provides a laser cutting machine subregion heat dissipation chip removal mechanism, includes cutting board (1), its characterized in that: cutting frame board (2) is installed to the inner wall of cutting board (1), a plurality of hoppers (3) are installed to the inner wall of cutting board (1) and the below that is located cutting frame board (2), every the equal fixedly connected with discharging pipe (4) in bottom of hopper (3), the mounting hole has been seted up to the inner diapire of cutting board (1), spliced pole (5) fixedly connected with under casing (6) is passed through to the inside of mounting hole, the last surface mounting of under casing (6) has the gathering to fight (7), the last surface mounting that the gathering was fought (7) has top case (8), the upper surface of top case (8) is connected and is linked together with the bottom of discharging pipe (4), the surface mounting of discharging pipe (4) has solenoid valve (9), exhaust mechanism is installed in the left side of cutting board (1), exhaust mechanism is including installing at left fan (10) of cutting board (1) and installing at the ring pipe (11) on top exhaust case (8) surface, the air inlet end of exhaust fan (10) passes through the intercommunication of exhaust tube (12) and ring tube (11), filter ring (13) are installed to the inner wall of top case (8), a plurality of intercommunication ring tube (11) inside gas pocket (14) are seted up to the inner wall of top case (8), the through-hole is seted up in the front of under casing (6), dust removal drawer (15) are installed through the slide rail to the inner wall of under casing (6).
2. The partitioned heat dissipation and chip removal mechanism of the laser cutting machine according to claim 1, characterized in that: the lower surface mounting of cutting board (1) has supporting leg (16), the quantity of supporting leg (16) is four, four the distribution of supporting leg (16) is in the four corners department of cutting board (1) lower surface.
3. The partitioned heat dissipation and chip removal mechanism of the laser cutting machine according to claim 1, wherein a P L C control box (17) is installed on the left side of the cutting machine table (1), the P L C control box (17) is coupled with a P L C control system of the laser cutting machine, and the P L C control box (17) is coupled with the electromagnetic valve (9) and the exhaust fan (10) respectively.
4. The partitioned heat dissipation and chip removal mechanism of the laser cutting machine according to claim 1, characterized in that: the material of the filter ring (13) is a stainless steel filter screen, the mesh number is 140 meshes and 160 meshes, and one end of the exhaust fan (10) far away from the exhaust pipe (12) is communicated with a plant waste gas pipeline.
5. The partitioned heat dissipation and chip removal mechanism of the laser cutting machine according to claim 1, characterized in that: heat transfer case (18) are installed on the right side of cutting machine board (1), the internally mounted of heat transfer case (18) has circulating pump (19), inlet tube (20) are installed to the output of circulating pump (19), wet return (21) are installed to the play water end of circulating pump (19), inlet tube (20) extend to the inside of cutting machine board (1) and by the inside that upper surface center department of top case (8) extended to top case (8), the one end that circulating pump (19) were kept away from in wet return (21) extends to the inside that the gathering was fought (7), inlet tube (20) are located the inside one end of top case (8) and wet return (21) and are located the gathering and fight (7) inside one end and pass through heat exchange tube (22) intercommunication, heat exchange tube (22) are copper spiral tube structure.
6. The partitioned heat dissipation and chip removal mechanism of the laser cutting machine according to claim 5, characterized in that: water inlet and outlet pipe (23) are installed on the right side of heat exchange box (18), the surface mounting of water inlet and outlet pipe (23) has throttle valve (24), water inlet and outlet pipe (23) are through tee bend and wet return (21) intercommunication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010347032.4A CN111390382A (en) | 2020-04-28 | 2020-04-28 | Laser cutting machine subregion heat dissipation chip removal mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010347032.4A CN111390382A (en) | 2020-04-28 | 2020-04-28 | Laser cutting machine subregion heat dissipation chip removal mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN111390382A true CN111390382A (en) | 2020-07-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010347032.4A Pending CN111390382A (en) | 2020-04-28 | 2020-04-28 | Laser cutting machine subregion heat dissipation chip removal mechanism |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130149948A1 (en) * | 2011-05-31 | 2013-06-13 | Trumpf Maschinen Gruesch Ag | Machining Tools, Waste Removal Devices, and Related Methods |
| CN208644408U (en) * | 2018-06-29 | 2019-03-26 | 山东丰田激光科技有限公司 | A kind of two sides air-draft-type laser cutting machine bed |
| CN209035725U (en) * | 2018-09-03 | 2019-06-28 | 江门市盛誉金属制品有限公司 | Laser cutting machine with water cooling plant and dust pelletizing system |
| CN209407668U (en) * | 2018-12-28 | 2019-09-20 | 安徽联合智能装备有限责任公司 | A kind of laser cutting machine with subregion dust exhaust apparatus |
| CN209424763U (en) * | 2019-01-09 | 2019-09-24 | 昆山锐镭精密激光设备有限公司 | A kind of novel optical fiber laser cutting device |
| CN209503262U (en) * | 2018-10-19 | 2019-10-18 | 广州市翔声激光科技有限公司 | A kind of recycling collator of laser marking device condensed water |
-
2020
- 2020-04-28 CN CN202010347032.4A patent/CN111390382A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130149948A1 (en) * | 2011-05-31 | 2013-06-13 | Trumpf Maschinen Gruesch Ag | Machining Tools, Waste Removal Devices, and Related Methods |
| CN208644408U (en) * | 2018-06-29 | 2019-03-26 | 山东丰田激光科技有限公司 | A kind of two sides air-draft-type laser cutting machine bed |
| CN209035725U (en) * | 2018-09-03 | 2019-06-28 | 江门市盛誉金属制品有限公司 | Laser cutting machine with water cooling plant and dust pelletizing system |
| CN209503262U (en) * | 2018-10-19 | 2019-10-18 | 广州市翔声激光科技有限公司 | A kind of recycling collator of laser marking device condensed water |
| CN209407668U (en) * | 2018-12-28 | 2019-09-20 | 安徽联合智能装备有限责任公司 | A kind of laser cutting machine with subregion dust exhaust apparatus |
| CN209424763U (en) * | 2019-01-09 | 2019-09-24 | 昆山锐镭精密激光设备有限公司 | A kind of novel optical fiber laser cutting device |
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Application publication date: 20200710 |
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| RJ01 | Rejection of invention patent application after publication |