CN111384829B - Equipment for positioning and manufacturing punching sheet in motor electrified coil - Google Patents
Equipment for positioning and manufacturing punching sheet in motor electrified coil Download PDFInfo
- Publication number
- CN111384829B CN111384829B CN202010283688.4A CN202010283688A CN111384829B CN 111384829 B CN111384829 B CN 111384829B CN 202010283688 A CN202010283688 A CN 202010283688A CN 111384829 B CN111384829 B CN 111384829B
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- Prior art keywords
- movably connected
- plate
- gear
- extension spring
- guide
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
- H02K15/02—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of stator or rotor bodies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/36—Single-purpose machines or devices
- B24B5/48—Single-purpose machines or devices for grinding walls of very fine holes, e.g. in drawing-dies
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/08—Measuring arrangements characterised by the use of mechanical techniques for measuring diameters
- G01B5/12—Measuring arrangements characterised by the use of mechanical techniques for measuring diameters internal diameters
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to the technical field of manufacturing of an electrified coil in a motor, and discloses equipment for positioning and manufacturing a stator in the electrified coil of the motor, which comprises a turntable, wherein the surface of the turntable is movably connected with a gear, the surface of the gear is movably connected with a screw rod, the surface of the screw rod is movably connected with an extension spring, the surface of the extension spring is movably connected with a movable rod, one end of the movable rod, far away from the extension spring, is movably connected with a polishing disc, the joint of the screw rod and the extension spring is movably connected with a connecting rod, one end of the connecting rod, far away from the screw rod, is movably connected with an expansion plate, the surface of the expansion plate is movably connected with a torsion spring, the surface of the torsion spring is movably connected with a. If the hole grinding size is intact, the detection bag does not contact with the hole, otherwise, the detection bag and the hole contact to generate gas, so that the effects of grinding and polishing the silicon wafer and detecting the aperture are achieved.
Description
Technical Field
The invention relates to the technical field of manufacturing of an electrified coil in a motor, in particular to equipment for positioning and manufacturing a punching sheet in the electrified coil of the motor.
Background
The motor is a device for converting electric energy into mechanical energy, and utilizes an electrified coil to generate a rotating magnetic field and act on a rotor to form magnetoelectric power rotating torque, wherein the electrified coil is usually composed of a plurality of punching sheets, and the punching sheet material is usually a silicon steel sheet which is a thin steel plate with low carbon content and has good conductivity.
In the prior art, silicon slice fragments are usually punched in sequence for manufacturing an electrified coil and then are installed, the manufacturing precision of the method is high, but the conductivity of a silicon steel sheet is influenced by the surface roughness of the silicon steel sheet, so that the punching needs to be carried out by polishing and polishing, the manual or mechanical hand is adopted for processing the silicon steel sheet in the prior art, the silicon steel sheet needs to be transferred and clamped again by using the processing method, the stress load on the surface of the silicon steel sheet can be increased by transferring and clamping, the material on the surface of the silicon steel sheet is damaged, and therefore equipment for positioning and manufacturing the stamped steel in the electrified coil of the motor is produced.
Disclosure of Invention
In order to realize the purposes of positioning, punching, grinding and polishing the silicon wafer and detecting the aperture by utilizing the rotary centrifugal force, the invention provides the following technical scheme: the utility model provides an equipment of piece is stamped in location preparation motor electrical coil, includes the carousel, the surperficial swing joint of carousel has the gear, and the surperficial swing joint of gear has the screw rod, and the surperficial swing joint of screw rod has extension spring, and extension spring's surperficial swing joint has the movable rod, and extension spring's one end swing joint has the polishing dish is kept away from to the movable rod, screw rod and extension spring's junction swing joint has the connecting rod, and the one end swing joint that the screw rod was kept away from to the connecting rod has the expansion board, and the surperficial swing joint of expansion board has torsion spring, and torsion spring's surperficial swing joint has.
The invention has the beneficial effects that:
1. holes are formed in the surface of the silicon wafer in a rotating mode through the rotating plate, the hole expanding plate is pushed to be in contact with the silicon wafer under the action of the guide plate, the holes in the surface of the silicon wafer are ground into set patterns through the hole expanding plate, and therefore the effect of positioning and punching through the rotating centrifugal force is achieved.
2. Leave the guiding axle surface through the rotor plate and stop rotatory, back rotor plate and expand the hole board and be pulled gradually by the deflector and become parallel state by the tilt state, if the hole size of polishing at this moment is intact, then detect the bag and can not contact with the hole, otherwise both contact and detect the bag and produce gas to reach the effect of polishing silicon chip and detection aperture.
Preferably, both ends of the expansion plate are movably connected with guide plates, one ends of the guide plates, far away from the expansion plate, are movably connected with the rotating plate, the hole expanding plate is movably connected with the guide plates, and the guide plates mainly guide the hole expanding plate.
Preferably, the guide plate is fixedly connected with a buffer layer inside, and the buffer layer is filled with a bag-shaped substance which can buffer the action of the vibration force generated when the hole expanding plate is contacted with the silicon wafer.
Preferably, the surface of the movable rod is movably connected with a compression spring, the elasticity of the compression spring is smaller than that of the extension spring, and the compression spring can buffer the action of the contact vibration force of the polishing disc and the silicon wafer.
Preferably, the guiding gutter has been seted up to the inside of rotor plate, and the guiding gutter is the crooked design of arc, and the piece that the production of being convenient for polish flows out in the guiding gutter, and the back is changed the moving direction and is flowed out.
Preferably, the interior of the expansion plate is movably connected with a detection bag, the detection bag is arc-shaped, the interior of the detection bag is filled with gas, and the gas flows out when being extruded, otherwise, the gas cannot flow out.
Preferably, the screw rods and the extension springs are grouped and are distributed on two sides of the gear uniformly, so that the silicon wafers can be polished conveniently.
Preferably, the guide direction of the guide plate and the surface of the rotary disc are inclined at an inclined angle.
Drawings
FIG. 1 is a top cross-sectional view of the turntable configuration of the present invention;
FIG. 2 is a schematic view of the structure of the polishing disc of the present invention;
FIG. 3 is an enlarged view of a portion A of FIG. 2;
FIG. 4 is a schematic view of a connecting rod according to the present invention;
FIG. 5 is a schematic view of a guide plate structure according to the present invention;
FIG. 6 is a schematic view of a rotating plate according to the present invention;
fig. 7 is a partial enlarged view of fig. 6 at B.
In the figure: 1-rotating disc, 2-gear, 3-screw, 4-extension spring, 5-movable rod, 6-polishing disc, 7-connecting rod, 8-expanding plate, 9-torsion spring, 10-guide shaft, 11-rotating plate, 12-hole expanding plate, 13-guide plate, 14-buffer layer, 15-compression spring, 16-diversion trench and 17-detection capsule.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, an apparatus for positioning and manufacturing the punching sheet in the electrical coil of the motor comprises a rotating disc 1, wherein the size of the rotating disc 1 is smaller than that of a silicon wafer, 16 ten thousand transistors can be integrated on the silicon wafer with the size of a rice grain, which is another milestone of scientific and technical progress, and the silicon element with the content of 25.8 percent in the crust provides an inexhaustible source for the production of monocrystalline silicon. Since silicon is one of the most abundant elements in the earth crust, for a solar cell, which is a product destined to enter the large-scale market, the advantage of the reserve is also one of the reasons that silicon is a main material of photovoltaic; the surface swing joint of carousel 1 has gear 2, and the surface swing joint of gear 2 has screw rod 3, and the surface swing joint of screw rod 3 has extension spring 4, and screw rod 3 appears with extension spring 4 in groups, and totally two sets of, evenly distributed is in the both sides of gear 2, is convenient for polish the silicon chip simultaneously.
The surface of the extension spring 4 is movably connected with a movable rod 5, the surface of the movable rod 5 is movably connected with a compression spring 15, the elasticity of the compression spring 15 is smaller than that of the extension spring 4, and the compression spring 15 can buffer the action of the contact vibration force of the polishing disc 6 and the silicon wafer; the sanding disc 6 is a sanding plate: the light-weight building material is divided into a double-sided frosted board and a single-sided frosted board, the main raw materials are PC (polycarbonate), PMMA (polymethyl methacrylate), PVC or PET, and the light-weight building material is novel and has high strength, heat insulation and light transmission.
The one end swing joint that extension spring 4 was kept away from to movable rod 5 has the mill 6, and the junction swing joint of screw rod 3 and extension spring 4 has connecting rod 7, and the one end swing joint that screw rod 3 was kept away from to connecting rod 7 has expansion board 8, and the equal swing joint in both ends of expansion board 8 has deflector 13, and the direction of direction and carousel 1 of deflector 13 are inclination, and the surface of slope and carousel 1.
One end of the guide plate 13, which is far away from the expanding plate 8, is movably connected with the rotating plate 11, the hole expanding plate 12 is movably connected with the guide plate 13, and the guide plate 13 mainly guides the hole expanding plate 12; a buffer layer 14 is fixedly connected to the inside of the guide plate 13, a bag-shaped substance is filled in the buffer layer 14, and the bag-shaped substance 14 can buffer the action of vibration force generated when the hole expanding plate 12 is in contact with a silicon wafer.
The surface of the expansion plate 8 is movably connected with a torsion spring 9, the interior of the expansion plate 8 is movably connected with a detection bag 17, the detection bag 17 is arc-shaped, the interior of the detection bag 17 is filled with gas, the gas flows out when being extruded, otherwise, the gas cannot flow out; the surface of the torsion spring 9 is movably connected with a guide shaft 10, the surface of the guide shaft 10 is movably connected with a rotating plate 11, and the surface of the rotating plate 11 is movably connected with a hole expanding plate 12; the diversion trench 16 is formed in the rotating plate 11, the diversion trench 16 is designed in an arc-shaped bending mode, so that chips generated by polishing can flow out of the diversion trench 16 conveniently, and then flow out of the diversion trench in a changed moving direction.
When the silicon wafer manufacturing device is used, a silicon wafer to be manufactured is placed on the surface of the turntable 1, the rear driving part enables the gear 2 to rotate, the gear 2 rotates to generate centrifugal force and drive the screw rod 3 to rotate, so the extension spring 4 can be pushed to move in the direction away from the gear 2 under the action of the centrifugal force, the extension spring 4 can pull the connecting rod 7 to move in the direction away from the gear 2, the connecting rod 7 can pull the symmetrical expansion plates 8 to move away from each other, the expansion plates 8 can pull the torsion spring 9 to deform so that the rotating plate 11 is in contact with the guide shaft 10, when the two are in contact, the rotating plate 11 can be driven to rotate by the guide shaft 10 and move towards the surface of the silicon wafer, the rear rotating plate 11 rotates on the surface of the silicon wafer to punch holes, meanwhile, the rotating plate 11 moves to pull the guide plate 13 to gradually contact with the silicon wafer, so the hole expanding plate 12, and the hole expanding plate 12 grinds the surface holes on the surface of the silicon wafer into a set pattern, and the chips generated by grinding flow out of the diversion trench 16.
When the gear 2 drives the extension spring 4 to move, the screw rod 3 is driven by the gear 2 to rotate, so the polishing disc 6 can be pushed by the extended extension spring 4 and driven by the rotating screw rod 3 to rotate, the rear polishing disc 6 is contacted with the silicon wafer, and the extension spring 4 is driven by centrifugal force to move at the moment, so the polishing disc 6 can move from near to far on the surface of the silicon wafer to finish polishing work, then when one hole on the surface of the silicon wafer is polished, the rotating speed of the gear 2 is adjusted, the centrifugal force reduces the extension spring 4 to gradually retract under the action of self elastic force, so the symmetrical connecting rods 7 can be driven by the extension spring 4 to mutually approach, namely the rotating plate 11 leaves the surface of the guide shaft 10 to stop rotating, the rear rotating plate 11 and the parallel hole expanding plate 12 are gradually pulled by the guide plate 13 to change from an inclined state to an inclined state, if the hole size is intact, the sensing capsule 17 does not contact the hole, otherwise the sensing capsule 17 generates gas.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (7)
1. The utility model provides an equipment of punching in location preparation motor circular telegram coil, includes carousel (1), its characterized in that: the surface of the turntable (1) is movably connected with a gear (2), the surface of the gear (2) is movably connected with a screw (3), the surface of the screw (3) is movably connected with an extension spring (4), the surface of the extension spring (4) is movably connected with a movable rod (5), and one end, far away from the extension spring (4), of the movable rod (5) is movably connected with a polishing disc (6);
a connecting rod (7) is movably connected at the joint of the screw rod (3) and the extension spring (4), an expansion plate (8) is movably connected at one end, far away from the screw rod (3), of the connecting rod (7), a torsion spring (9) is movably connected on the surface of the expansion plate (8), a guide shaft (10) is movably connected on the surface of the torsion spring (9), a rotating plate (11) is movably connected on the surface of the guide shaft (10), a hole expanding plate (12) is movably connected on the surface of the rotating plate (11), guide plates (13) are movably connected at two ends of the expansion plate (8), and one end, far away from the expansion plate (8), of each guide plate (13) is movably connected with the rotating plate (11);
the silicon wafer to be manufactured is placed on the surface of the turntable (1), the gear (2) is rotated by the rear driving part, the gear (2) rotates to generate centrifugal force and drive the screw (3) to rotate, so the tension spring (4) can be pushed to move in the direction far away from the gear (2) under the action of the centrifugal force, the tension spring (4) moves to pull the connecting rod (7) to move in the direction far away from the gear (2), the connecting rod (7) moves to pull the symmetrical expansion plates (8) to move away from each other, so the expansion plates (8) can pull the torsion spring (9) to deform to enable the rotating plate (11) to be in contact with the guide shaft (10), when the rotating plate (11) is in contact with the guide shaft (10), the rotating plate (11) is driven to rotate by the guide shaft (10) and moves to the surface of the silicon wafer, holes are formed in the surface of the rear rotating plate (11) in a rotating mode, and meanwhile, the rotating plate, therefore, the hole expanding plate (12) is pushed to contact with the silicon wafer under the action of the guide plate (13), the holes on the surface of the silicon wafer are ground into a set pattern by the hole expanding plate (12), and chips generated by grinding can flow out of the guide groove (16);
when the gear (2) drives the extension spring (4) to move, the screw rod (3) is driven by the gear (2) to rotate, so the polishing disk (6) is pushed by the extended extension spring (4) and is driven by the rotating screw rod (3) to rotate, the rear polishing disk (6) is contacted with the silicon wafer, and the extension spring (4) is driven by centrifugal force to move at the moment, so the polishing disk (6) can move from near to far on the surface of the silicon wafer to finish polishing work, after polishing of a hole on the surface of the silicon wafer is finished, the rotating speed of the gear (2) is adjusted, the centrifugal force reduces the extension spring (4) to gradually retract under the action of self elastic force, so the symmetrical connecting rods (7) can be driven by the extension spring (4) to mutually approach, namely the rotating plate (11) leaves the surface of the guide shaft (10) to stop rotating, and the rotating plate (11) and the hole expanding plate (12) are gradually pulled by the guide plate (13) to be changed into a parallel state, if the hole grinding size is intact, the detection bag (17) will not contact with the hole, otherwise the contact between the detection bag (17) and the hole will generate gas.
2. The equipment for positioning and manufacturing the punching sheet in the electrified coil of the motor according to claim 1 is characterized in that: a buffer layer (14) is fixedly connected to the inner part of the guide plate (13), and a cystic substance is filled in the buffer layer (14).
3. The equipment for positioning and manufacturing the punching sheet in the electrified coil of the motor according to claim 1 is characterized in that: the surface of the movable rod (5) is movably connected with a compression spring (15), and the elasticity of the compression spring (15) is smaller than that of the extension spring (4).
4. The equipment for positioning and manufacturing the punching sheet in the electrified coil of the motor according to claim 1 is characterized in that: a diversion trench (16) is formed in the rotating plate (11), and the diversion trench (16) is designed to be arc-shaped and bent.
5. The equipment for positioning and manufacturing the punching sheet in the electrified coil of the motor according to claim 1 is characterized in that: the inside swing joint of expansion board (8) has detection bag (17), detects bag (17) and is the arc outward appearance.
6. The equipment for positioning and manufacturing the punching sheet in the electrified coil of the motor according to claim 1 is characterized in that: the screw rods (3) and the extension springs (4) are arranged in groups, and the two groups are distributed on two sides of the gear (2) uniformly.
7. The equipment for positioning and manufacturing the punching sheet in the electrified coil of the motor according to claim 1 is characterized in that: the guide direction of the guide plate (13) and the rotary table (1) are inclined, and the guide direction is inclined to the surface of the rotary table (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010283688.4A CN111384829B (en) | 2020-04-13 | 2020-04-13 | Equipment for positioning and manufacturing punching sheet in motor electrified coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010283688.4A CN111384829B (en) | 2020-04-13 | 2020-04-13 | Equipment for positioning and manufacturing punching sheet in motor electrified coil |
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| Publication Number | Publication Date |
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| CN111384829A CN111384829A (en) | 2020-07-07 |
| CN111384829B true CN111384829B (en) | 2021-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010283688.4A Active CN111384829B (en) | 2020-04-13 | 2020-04-13 | Equipment for positioning and manufacturing punching sheet in motor electrified coil |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112454111A (en) * | 2020-11-26 | 2021-03-09 | 林新福 | Energy-concerving and environment-protective type polisher polishing cleaning equipment |
| CN112605766A (en) * | 2020-12-04 | 2021-04-06 | 刀智宝 | A brushing oil integration equipment of polishing for wooden table desktop |
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|---|---|
| CN111384829A (en) | 2020-07-07 |
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Effective date of registration: 20210310 Address after: 317600 Xinyuan village, Damaiyu street, Yuhuan City, Taizhou City, Zhejiang Province Applicant after: ZHEJIANG HULONG TECHNOLOGY Co.,Ltd. Address before: No. 229, Wushi village, Jiazhen street, Jiaojiang District, Taizhou City, Zhejiang Province, 317700 Applicant before: Zhou Min |
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