CN111384504A - Dielectric filter, communication equipment, method for preparing dielectric block and dielectric filter - Google Patents
Dielectric filter, communication equipment, method for preparing dielectric block and dielectric filter Download PDFInfo
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- CN111384504A CN111384504A CN201910217123.3A CN201910217123A CN111384504A CN 111384504 A CN111384504 A CN 111384504A CN 201910217123 A CN201910217123 A CN 201910217123A CN 111384504 A CN111384504 A CN 111384504A
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Images
Classifications
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- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/03—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on magnesium oxide, calcium oxide or oxide mixtures derived from dolomite
- C04B35/057—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on magnesium oxide, calcium oxide or oxide mixtures derived from dolomite based on calcium oxide
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- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
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- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
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- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/10—Dielectric resonators
- H01P7/105—Multimode resonators
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Abstract
The application discloses dielectric filter, communication equipment, preparation dielectric block and dielectric filter's method for 5G communication system, this dielectric filter includes: the dielectric filter comprises a first dielectric block, a second dielectric block, a third dielectric block, a coupling structure and a metal layer, wherein the coupling structure is arranged on the contact surface of the first dielectric block and the third dielectric block, the coupling structure is arranged on the contact surface of the second dielectric block and the third dielectric block, the first dielectric block, the second dielectric block, the third dielectric block and the coupling structure are integrally formed to obtain the dielectric block, and the metal layer covers the surface of the dielectric block, wherein the dielectric filter is at least made of strontium carbonate, samarium sesquioxide, aluminum oxide and titanium dioxide. The application can avoid the gap at the joint of the first dielectric block and the third dielectric block or the joint of the second dielectric block and the third dielectric block, prevent signal leakage and improve the performance of the dielectric filter.
Description
Technical Field
The application relates to the technical field of communication equipment, in particular to a dielectric filter applied to a 5G communication system, communication equipment, a dielectric block and a dielectric filter preparation method.
Background
With the rapid advance of communication technology, especially in the coming 5G communication era, more rigorous technical requirements are put on system architecture, and while high-efficiency and high-capacity communication is realized, system modules are required to be highly integrated, miniaturized, light-weighted and low-cost. For example, when the 5G Massive MIMO technology further expands the system channel from the current 8 or 16 channels to 32, 64, or even 128 channels, the overall architecture size of the system cannot be too large, and even a certain degree of miniaturization needs to be realized. The microwave filter is used as a core component of a system, and performance parameters, size and cost of the microwave filter have great influence on the performance, architecture size and cost of the system.
The dielectric filter is composed of a plurality of dielectric resonators, has the characteristics of miniaturization and high performance, and receives more and more attention. The volume and the weight of the filter can be greatly reduced by adopting the multimode filter, and as the technology of dielectric materials is mature day by day, the mass production of the multimode dielectric resonator can be realized. However, in the dielectric filter in the prior art, the multimode dielectric resonator and the single-mode dielectric resonator need to be spliced and sintered, and a gap exists at the joint of the multimode dielectric resonator and the single-mode dielectric resonator, which causes signal leakage.
Disclosure of Invention
In order to solve the above problems of the dielectric filter in the prior art, the present application provides a dielectric filter applied to a 5G communication system, a communication device, a method for preparing a dielectric block and a dielectric filter.
In order to solve the above problem, an embodiment of the present application provides a dielectric filter, which at least includes: the device comprises a first dielectric block, a second dielectric block, a third dielectric block, a coupling structure and a metal layer, wherein the coupling structure is arranged on the contact surface of the first dielectric block and the third dielectric block, the coupling structure is arranged on the contact surface of the second dielectric block and the third dielectric block, the first dielectric block, the second dielectric block, the third dielectric block and the coupling structure are integrally formed to obtain the dielectric block, and the metal layer covers the surface of the dielectric block; wherein, the material of the dielectric filter at least comprises strontium carbonate, samarium oxide, aluminum oxide and titanium dioxide.
In order to solve the above technical problem, the present invention further provides a method for preparing a dielectric block, the method being used for preparing the above dielectric block, the method comprising:
providing raw materials corresponding to strontium carbonate, samarium oxide, aluminum oxide and titanium dioxide;
adding an organic solvent and grinding balls and carrying out primary ball milling;
drying the slurry obtained by the primary ball milling, and calcining to obtain a ceramic body;
crushing the ceramic body, adding an organic solvent and grinding balls, and performing secondary ball milling;
drying the slurry obtained by the secondary ball milling;
mixing the obtained powder with a binder to form slurry, and granulating;
dry-pressing and molding in a mold matched with the shape of the dielectric block; and
the binder is removed and sintered again to obtain the dielectric block.
In order to solve the above technical problem, the present invention further provides a method for manufacturing a dielectric filter, the method being used for manufacturing the above dielectric filter, the method including:
providing a dielectric block, wherein the dielectric block is prepared by the method for preparing the dielectric block;
and covering a metal layer on the surface of the dielectric block to obtain the dielectric filter.
In order to solve the above technical problem, the present invention further provides a communication device, which includes an antenna and the above dielectric filter, wherein the antenna is coupled to the dielectric filter.
Compared with the prior art, the dielectric filter comprises a first dielectric block, a second dielectric block, a third dielectric block, a coupling structure and a metal layer, wherein the first dielectric block, the second dielectric block, the third dielectric block and the coupling structure are integrally formed to obtain the dielectric block, and the metal layer covers the surface of the dielectric block; because the first dielectric block, the second dielectric block, the third dielectric block and the coupling structure are integrally formed, gaps are prevented from occurring at the joint of the first dielectric block and the third dielectric block or the joint of the second dielectric block and the third dielectric block, signal leakage is prevented, and the performance of the dielectric filter is improved; in addition, the material of the dielectric filter at least comprises strontium carbonate, samarium sesquioxide, aluminum sesquioxide and titanium dioxide, has low dielectric constant, low loss and near-zero temperature coefficient, and can improve the dielectric property of the dielectric filter.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural view of a dielectric filter according to a first embodiment of the present application;
FIG. 2 is a schematic cross-sectional view along AA of the dielectric filter of FIG. 1;
FIG. 3 is a schematic cross-sectional view of the coupling structure of FIG. 1 in the shape of a Chinese bow;
FIG. 4 is a schematic cross-sectional view of the coupling structure of FIG. 1 in the shape of a C;
fig. 5 is a schematic structural view of a single-mode dielectric resonator of a dielectric filter according to a second embodiment of the present application;
FIG. 6 is a schematic view of the nut of FIG. 5 mounted on a carrier;
fig. 7 is a schematic structural view of a tuning rod of a dielectric filter according to a third embodiment of the present application;
fig. 8 is a schematic structural view of a first tuning hole and a second tuning hole of a dielectric filter according to a fourth embodiment of the present application;
FIG. 9 is a schematic view of an alternate embodiment of the first tuning aperture and the second tuning aperture of FIG. 8;
FIG. 10 schematically shows the results of a test of the microwave dielectric properties of the ceramics provided herein;
FIG. 11 is a schematic flow chart diagram of a method of fabricating a dielectric block according to a first embodiment of the present application;
fig. 12 is a schematic flow chart of a method of manufacturing a dielectric filter according to a first embodiment of the present application;
fig. 13 is a schematic structural diagram of a communication device according to the first embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive step are within the scope of the present application.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Referring to fig. 1-2, fig. 1 is a schematic structural diagram of a dielectric filter according to a first embodiment of the present application; fig. 2 is a schematic cross-sectional view of the dielectric filter along AA of fig. 1. The dielectric filter 10 of the present application is applied to a 5G communication system, and may include at least: a first dielectric block 11, a second dielectric block 12, a third dielectric block 13, a coupling structure 14 and a metal layer 15.
The contact surfaces of the first dielectric block 11 and the third dielectric block 13 are provided with a coupling structure 14, that is, the first dielectric block 11 is connected with the third dielectric block 13 through the coupling structure 14, so that the first dielectric block 11 is coupled with the third dielectric block 13. The contact surface of the second dielectric block 12 and the third dielectric block 13 is provided with a coupling structure 14, that is, the second dielectric block 12 is connected with the third dielectric block 13 through the coupling structure 14, so that the second dielectric block 12 is coupled with the third dielectric block 13.
The first dielectric block 11, the second dielectric block 12, the third dielectric block 13 and the coupling structure 14 may be made of the same dielectric material, and the dielectric material may be ceramic. In other embodiments, the dielectric material may also be other materials with high dielectric constant and low loss, such as glass, quartz crystal, or titanate, and the material of the dielectric block is not limited to be the same.
The first dielectric block 11, the second dielectric block 12, the third dielectric block 13 and the coupling structure 14 are integrally formed, namely a mold is provided, and a dielectric material is filled into the mold; sintering the dielectric material to obtain a first dielectric block 11, a second dielectric block 12, a third dielectric block 13 and a coupling structure 14 which are integrally formed; therefore, a gap can be avoided at the joint of the first dielectric block 11 and the third dielectric block 13 or the joint of the second dielectric block 12 and the third dielectric block 13, signal leakage is prevented, and the performance of the dielectric filter 10 is improved.
After the first dielectric block 11, the second dielectric block 12, the third dielectric block 13 and the coupling structure 14 are integrally formed, a dielectric block 16 is obtained, and the dielectric block 16 can be used as a standard module. In the 5G communication system, the standard block can be directly applied to the communication equipment, and the generation efficiency is improved.
The metal layer 15 may be disposed on the surface of the dielectric block 16 for confining an electromagnetic field within the dielectric block 16 to prevent leakage of an electromagnetic signal to form a standing wave oscillation signal within the first dielectric block 11, the second dielectric block 12, the third dielectric block 13, and the coupling structure 14. The material of the metal layer 15 may be a metal material such as silver, copper, aluminum, titanium, tin, or gold, and the metal layer 15 may be covered on the surface of the dielectric block 16 by electroplating, spraying, or welding.
As shown in fig. 2, the first dielectric block 11 and the metal layer 15 covering the first dielectric block 11 form a first multimode dielectric resonator 17, the second dielectric block 12 and the metal layer 15 covering the second dielectric block 12 form a second multimode dielectric resonator 18, and the third dielectric block 13 and the metal layer 15 covering the third dielectric block 13 form a single mode dielectric resonator 19, wherein the first multimode dielectric resonator 17 and the second multimode dielectric resonator 19 are coupled to the single mode dielectric resonator 18.
The first multimode dielectric resonator 17 may be a first three-mode dielectric resonator, the second multimode dielectric resonator 18 may be a second three-mode dielectric resonator, and the three-mode dielectric resonators have cut angles formed on surfaces perpendicular to each other for performing resonant mode coupling, so that the three-mode dielectric resonators generate three resonant modes.
In one embodiment, the first multimode dielectric resonator 17 may be a third multimode dielectric resonator, and the second multimode dielectric resonator 18 may be a first two-mode dielectric resonator.
In one embodiment, the first multimode dielectric resonator 17 may be a second multimode dielectric resonator, and the second multimode dielectric resonator 18 may be a third multimode dielectric resonator.
In other embodiments, the first multimode dielectric resonator 17 and the second multimode dielectric resonator 18 may also be dielectric resonators of three or more modes.
The single-mode dielectric resonator 18 may be square-shaped to achieve positive coupling between the first multimode dielectric resonator 17 and the second multimode dielectric resonator 18. In order to switch the positive coupling between the first multimode dielectric resonator 17 and the second multimode dielectric resonator 18 to the negative coupling, the length of the coupling structure 14 is greater than a half wavelength of the operating frequency of the dielectric filter 10, so that the polarity of the coupling between the first multimode dielectric resonator 17 and the second multimode dielectric resonator 18 is reversed.
The axis C of the dielectric filter 10 may be a central axis of the dielectric filter 10. As shown in fig. 3, the cross-sectional shape of the coupling structure 14 in the direction perpendicular to the axis C of the dielectric filter 10 is a bow shape, in which case the length of the coupling structure 14 is longer than the half wavelength of the operating frequency of the dielectric filter 10, so that the positive coupling between the first multimode dielectric resonator 17 and the second multimode dielectric resonator 18 is switched to the negative coupling.
As shown in fig. 4, the cross-sectional shape of the coupling structure 14 in the direction perpendicular to the axis C of the dielectric filter 10 is C-shaped, and the length of the coupling structure 14 is longer than the half wavelength of the operating frequency of the dielectric filter 10, so that the positive coupling between the first multimode dielectric resonator 17 and the second multimode dielectric resonator 18 is switched to the negative coupling.
In other embodiments, the coupling structure 14 may have other shapes, such as U-shape, N-shape, etc., which are not described herein.
The present application further provides the dielectric filter of the second embodiment, as shown in fig. 5, the dielectric filter further includes at least one tuning rod 191 and at least one nut 192, the single-mode dielectric resonator 19 is provided with at least one tuning hole 193 corresponding to the tuning rod 191, and the tuning rod 191 is provided in the tuning hole 193 for adjusting the coupling strength between the first multimode dielectric resonator 17 and the second multimode dielectric resonator 18.
The tuning hole 192 is provided with a first hole section 1931 and a second hole section 1932 along the direction of the axis B of the tuning hole 193, the nut 192 is arranged in the first hole section 1931, the nut 192 and the tuning rod 191 can be prevented from protruding out of the surface of the single-mode dielectric resonator 19, and the thickness of the single-mode dielectric resonator 19 is prevented from being increased.
The nut 192 may be fixed on the sidewall of the first hole section 1931 by welding or gluing, and the tuning rod 191 is adjusted to adjust the length of the tuning rod 191 in the second hole section 1932. The longer the length of the tuning rod 191 located in the second hole section 1932, the smaller the coupling strength between the first multimode dielectric resonator 17 and the second multimode dielectric resonator 18; the shorter the length of the tuning rod 191 located in the second hole section 1932, the greater the coupling strength between the first multimode dielectric resonator 17 and the second multimode dielectric resonator 18.
Further, the cross-sectional area of first bore segment 1931 perpendicular to axis B is greater than the cross-sectional area of second bore segment 1932 perpendicular to axis B, the junction of first bore segment 1931 and second bore segment 1932 forming a carrier table upon which nut 192 may also be disposed, as shown in fig. 6.
Further, the shape of the cross-section of the nut 192 may be the same as the shape of the cross-section of the first bore segment 1931, e.g., the cross-section of the nut 192 may be hexagonal or circular in shape. In other embodiments, the cross-sectional shape of the nut 192 is different than the cross-sectional shape of the first bore segment 1931, such as the cross-sectional shape of the first bore segment 1931 being circular and the cross-sectional shape of the nut 192 being hexagonal. To avoid electromagnetic fields from leaking out of the first bore section 1931, the metal layer 15 may further cover the first bore section 1931.
The single-mode dielectric resonator 19 of the present embodiment is provided with a tuning hole 192, and a tuning rod 191 is provided in the tuning hole 193 for adjusting the coupling strength between the first multimode dielectric resonator 17 and the second multimode dielectric resonator 18; and the nut 192 is arranged in the first hole section 1931, the nut 192 and the tuning rod 191 can be prevented from protruding out of the surface of the single-mode dielectric resonator 19, and the thickness of the single-mode dielectric resonator 19 can be prevented from being increased.
The present application further provides a dielectric filter of a third embodiment, as shown in fig. 7, wherein the tuning rod 191 includes a first rod segment 1911 and a second rod segment 1912 arranged along the axis B, and a cross-sectional area of the first rod segment 1912 perpendicular to the axis B is smaller than a cross-sectional area of the second rod segment 1912 perpendicular to the axis B. With respect to the constant-diameter adjusting screw, in the present embodiment, the cross-sectional area of the second rod segment 1912 is set to be larger than that of the first rod segment 1911, so that the gap between the second rod segment 1912 and the second hole segment 1932 is reduced, and leakage of the electromagnetic field can be reduced.
The material of the surface of the tuning rod 191 may be a metal material, and specifically may be a metal material such as silver, copper, aluminum, titanium, or gold, so as to prevent the electromagnetic field from leaking through the tuning rod 191. Further, the material of other regions of the tuning rod 191 may be a non-metallic material, such as plastic or the like. The tuning rod 191 of the present application can reduce costs as compared to prior art adjusting screws that are all made of metal materials.
Wherein the cross-sectional area of the second rod segment 1912 perpendicular to the axis B may be equal to the cross-sectional area of the second bore segment 1932 perpendicular to the axis B, which may further reduce the gap between the second rod segment 1912 and the second bore segment 113, which may avoid leakage of the electromagnetic field of the dielectric resonator.
The first pole segment 1911 is threaded and the second pole segment 1912 may be of a smooth design, i.e., the outer surface of the second pole segment 1912 is smooth, so that the second pole segment 1912 and the second bore segment 1932 are closely fitted to avoid the threads of the tuning rod 191 from wearing the inner wall of the tuning bore 193.
Additionally, first rod segment 1911 may be partially threaded, i.e., the end of first rod segment 1911 adjacent to nut 192 is threaded, and the end of first rod segment 1911 adjacent to second rod segment 1912 is of a smooth design, thereby ensuring that the threads of first rod segment 1911 do not extend into second bore segment 1932.
The present application further provides the dielectric filter of the fourth embodiment, as shown in fig. 8, wherein the at least one tuning hole 193 includes a first tuning hole 1933 and a second tuning hole 1934, and a cross-sectional area of the first tuning hole 1933 perpendicular to the axis B is not equal to a cross-sectional area of the second tuning hole 1934 perpendicular to the axis B.
Wherein the first tuning hole 1933 and the second tuning hole 1934 may be provided on the same surface of the single-mode dielectric resonator 19.
In other embodiments, as shown in fig. 9, the first tuning hole 1933 is provided at a first surface of the single-mode dielectric resonator 19, and the second tuning hole 1934 is provided at a second surface of the single-mode dielectric resonator 19, wherein the first surface of the single-mode dielectric resonator 19 is disposed opposite to the second surface of the single-mode dielectric resonator 19.
The material of the dielectric filter disclosed in the above embodiment may be ceramic, and the ceramic may include strontium carbonate, samarium oxide, aluminum oxide, and titanium dioxide. I.e., the ceramic material consists essentially of the above-described components, it is understood that the ceramic material may also contain small or trace amounts of other substances.
In some embodiments, the strontium carbonate is present in an amount of 48 to 62 mole percent.
In some embodiments, the samarium trioxide is present in an amount ranging from 10% to 24% by mole.
In some embodiments, the alumina is present in a mole percent of 10% to 24%.
In some embodiments, the titanium dioxide comprises between 4% and 18% by mole.
Wherein, mole percent refers to the percentage of the amount of the substance. For example, after mixing 1mol of substance a with 4mol of substance B, the molar percentage of substance a is equal to 1/(1+4) 20%, while the molar percentage of substance B is equal to 4/(1+4) 80%.
The chemical composition of the ceramic can be expressedIs aCaCO3-bSm2O3-cAl2O3-dTiO2Wherein the ratio of a, b, c and d is 0.48-0.62: 0.1-0.24: 0.04-0.18. For example, if the values of a, b, c and d are taken to be 0.5, 0.2 and 0.1, respectively, the chemical composition of the ceramic can be expressed as 0.5CaCO3-0.2Sm2O3-0.2Al2O3-0.1TiO2. Of course, the values of a, b, c and d may take other values within this range. The microwave dielectric properties of the ceramic can be further adjusted by varying the proportions between the chemical components of the ceramic.
In some embodiments, the ceramic may further include a modifying additive, i.e., an additive capable of improving the properties of the ceramic. It should be understood that the modifying additive need not be in a liquid form, but may be in a solid form, etc. In particular, the modifying additive may be Ta2O5、Bi2O3Or SiO2That is, the modifying additive may comprise only Ta2O5、Bi2O3Or SiO2May also include two or three of them. Alternatively, the proportion of the modifying additive may be 0.01 mol% to 1 mol%. That is, the modifying additive is present in an amount of 0.01 to 1 mole percent based on the total material.
According to the test result, the dielectric constant of the ceramic is 18 to 22, the Q f value is 43000 to 76000GHz, and the temperature coefficient is-11 to +23 ppm/DEG C. For example, the microwave dielectric property of the ceramic is tested by a network analyzer (Agilent 5071C) at a test frequency of 6.5GHz, and the microwave dielectric property of the ceramic is obtained as follows: dielectric constant ε r18 to 22, dielectric loss Q43000 to 76000GHz, temperature coefficient tauf-11 to +23ppm/° c. Fig. 10 exemplarily shows the test results of the microwave dielectric properties of the ceramics provided herein.
The ceramic mainly comprises strontium carbonate, samarium oxide, aluminum oxide and titanium dioxide, and has low dielectric constant, low loss and near-zero temperature coefficient. Thus, the ceramics provided by the practice of the present application have improved microwave dielectric properties.
The present application further provides a method for preparing a dielectric block according to a first embodiment, in which the dielectric blocks disclosed in the above embodiments are all prepared by the method for preparing a dielectric block, as shown in fig. 11, the method includes the following steps:
s201: raw materials corresponding to strontium carbonate, samarium sesquioxide, aluminum oxide and titanium dioxide are provided.
In some embodiments, the raw materials corresponding to strontium carbonate, samarium trioxide, aluminum oxide, and titanium dioxide may be oxides or carbonates of the corresponding metal elements. Wherein the oxides of the metal elements directly correspond to the components of the dielectric block to be produced, while carbonates of some metal elements can be converted into oxides of the metal elements under the conditions of heating and the like, and thus can also be used as raw materials. In other embodiments, the starting material may also be an alcoholate of the corresponding metal element, in which case the alcoholate of the metal may be converted to the desired oxide using a suitable chemical treatment. The specific method is well known in the art and will not be described herein.
In this embodiment, the molar percentage of the raw material corresponding to strontium carbonate is 48% to 62%, the molar percentage of the raw material corresponding to samarium oxide is 10% to 24%, the molar percentage of the raw material corresponding to aluminum oxide is 10% to 24%, and the molar percentage of the raw material corresponding to titanium dioxide is 4% to 18%. It should be understood that the above mole percentages refer to mole percentages after removal of impurities in the raw materials.
In this embodiment, raw materials may be prepared in accordance with the proportions of the components of the dielectric block. When the mole percentage of each component is known, the required mass of the raw material can be calculated according to parameters such as the molecular weight of each component, the purity of the raw material and the like. The mass required by each component is calculated according to the required mole number and molecular weight of each component, and the required mass of the raw material is calculated according to the required mass of each component and the purity of the raw material. This makes it possible to prepare raw materials of corresponding weights based on the results of the calculation.
In some embodiments, modifying additives may also be added to the raw materials. The modifying additive may be Ta2O5、Bi2O3Or SiO2One or more of the above. The proportion of the modifying additive in the total mole number of all raw materials can be 0.01-0.1%.
S202: adding an organic solvent and grinding balls and carrying out primary ball milling.
In step S202, deionized water, alcohol, acetone, etc. may be used as the organic solvent, zirconium balls, agate balls, etc. may be used as the grinding balls, and ceramic, polyurethane, nylon, etc. may be used in the grinding tank, and planetary mill, stirring mill, tumbling mill, vibrating mill, etc. may be used for the first ball milling. Wherein, in order to improve the ball milling effect, proper dispersant can be added or the pH value of the slurry can be adjusted.
In some embodiments, deionized water may be used as the organic solvent, and zirconia or agate grinding balls may be used, and the weighed raw materials may be charged into a polyurethane ball mill tank and mixed by adding the organic solvent and grinding balls. In step S202, accurately weighed raw materials are poured into a ball mill pot, and deionized water and ZrO are added2The grinding balls are prepared by mixing the raw material, the grinding balls and deionized water in a weight ratio of 1:2 to 4:1 to 2 (for example, 1:3:1.5 or 1:2:1.5), and ball-milling for 20 to 30 hours (for example, 24 to 26 hours).
S203: and drying the slurry obtained by the primary ball milling, and calcining to obtain the ceramic body.
And (3) uniformly mixing the ball-milled materials, discharging and drying, for example, drying the materials at 100-120 ℃.
After the ball milling is finished and the mixture obtained after drying is required to be calcined at a certain temperature to synthesize the ceramic body, wherein the calcining temperature and the heat preservation time depend on the corresponding formula. For example, in this embodiment, the slurry dried after ball milling can be placed in an alumina crucible and calcined at 1100-1300 ℃ for 1-5 hours (e.g., 2-4 hours) to synthesize a ceramic body.
S204: and (3) crushing the ceramic body, adding an organic solvent and grinding balls, and carrying out secondary ball milling.
The synthesized ceramic body is pulverized. The method of pulverization is not limited in the present application, and for example, it may be pulverized using a pulverizer. In some embodiments, the crushed ceramic body may also be sieved (e.g., 40 mesh).
And pouring the crushed ceramic body into the ball milling tank again for secondary ball milling, wherein the process of the secondary ball milling can be similar to that of the primary ball milling. For example, the ratio of the material, the grinding balls and the deionized water can be kept unchanged, and the crushed ceramic body is subjected to secondary ball milling for 20-30 hours (for example, 24-26 hours). It should be understood that the process of the second ball milling may be different from the first ball milling, for example, the time of the second ball milling may be less than (or greater than) the time of the first ball milling, or the ratio of the materials, milling balls and deionized water in the second ball milling may be different from the first ball milling, for example, may be 1:2: 1.5.
S205: and drying the slurry obtained by secondary ball milling.
Similarly, the ball-milled materials can be uniformly mixed, discharged and dried. In some embodiments, the dried slurry may also be screened (e.g., through a 40 mesh screen).
S206: mixing the obtained powder with a binder to form slurry, and granulating.
In some embodiments, the binder may be a polyvinyl alcohol solution with a concentration of 5 wt% to 11 wt% (e.g., 5 wt% to 8 wt%) (i.e., the polyvinyl alcohol in the binder is 5 wt% to 11 wt%). The binder may account for 10% to 15% of the total mass of the mixed slurry.
In some embodiments, the granulated powder may also be sieved (e.g., 40 mesh).
S207: and (4) carrying out dry pressing forming in a die matched with the shape of the medium block.
Specifically, the granulated powder is placed in a mold matching the shape of the dielectric block, and is dry-pressed under a suitable pressure, for example, the powder may be dry-pressed under a pressure of 100 to 150 MPa.
In this step, the shape of the mold can be selected as desired, for example, if it is desired to perform a test, a mold dedicated for the test can be used to dry-press the powder into a shapeTo facilitate testing. It should be understood that the shape and size of the mold can be arbitrarily selected according to the needs, and is not limited herein.
S208: the binder is removed and sintered again to obtain the dielectric block.
The temperature may be selected to be a suitable temperature for the heat preservation process to remove the binder introduced in step S206, and then the binder is sintered again to finally obtain the desired dielectric block. Specifically, in this embodiment, the molded material may be heat-preserved at 550-650 ℃ for 1-3 hours, and then sintered at 1400-1600 ℃ (e.g., 1450-1550 ℃) for 1-5 hours (e.g., 2-4 hours). In this way, the adhesive added to the material in step S206 can be removed, and a dielectric block of a desired shape can be obtained.
The present application further provides a method of manufacturing a dielectric filter according to a first embodiment, in which the dielectric filters disclosed in the above embodiments are manufactured by the method of manufacturing a dielectric filter, as shown in fig. 12, the method includes the steps of:
s301: a dielectric block is provided.
The dielectric block is a dielectric block prepared by the above method of preparing a dielectric block, i.e., a dielectric block prepared by the above steps S201 to S208. Wherein the shape of the dielectric block is the same as the preset shape of the dielectric filter.
S302: and covering a metal layer on the surface of the dielectric block to obtain the dielectric filter.
The surface of the dielectric block is covered with a metal layer, so that an electromagnetic field is limited in the dielectric block, and the electromagnetic signal is prevented from leaking. The metal layer may be made of silver, copper, aluminum, titanium, tin or gold, and the metal layer may be coated on the surface of the dielectric block by electroplating, spraying or welding.
The present application further provides the communication device of the first embodiment, as shown in fig. 13, the communication device 100 includes an antenna 101 and a dielectric filter 102, the antenna 101 is coupled to the dielectric filter 102, and the dielectric filter 102 is the dielectric filter disclosed in the above embodiments and is not described herein again. The communication device 100 may be a base station or a terminal for 5G communication, and the terminal may specifically be a mobile phone, a tablet computer, a wearable device with a 5G communication function, or the like.
It should be noted that the above embodiments belong to the same inventive concept, and the description of each embodiment has a different emphasis, and reference may be made to the description in other embodiments where the description in individual embodiments is not detailed.
The protection circuit and the control system provided by the embodiment of the present application are described in detail above, and a specific example is applied in the description to explain the principle and the embodiment of the present application, and the description of the above embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A dielectric filter, characterized in that the dielectric filter comprises at least: the device comprises a first dielectric block, a second dielectric block, a third dielectric block, a coupling structure and a metal layer, wherein the coupling structure is arranged on the contact surface of the first dielectric block and the third dielectric block; wherein, the material of the dielectric filter at least comprises strontium carbonate, samarium oxide, aluminum oxide and titanium dioxide.
2. The dielectric filter of claim 1, wherein the strontium carbonate is present in a molar percentage of 48% to 62%, the samarium oxide is present in a molar percentage of 10% to 24%, the aluminum oxide is present in a molar percentage of 10% to 24%, and the titanium dioxide is present in a molar percentage of 4% to 18%.
3. The dielectric filter according to claim 1, wherein the first dielectric block and the metal layer covering the first dielectric block form a first multimode dielectric resonator, the second dielectric block and the metal layer covering the second dielectric block form a second multimode dielectric resonator, the third dielectric block and the metal layer covering the third dielectric block form a single mode dielectric resonator, and the first multimode dielectric resonator and the second multimode dielectric resonator are coupled to the single mode dielectric resonator.
4. The dielectric filter according to claim 3, wherein the coupling polarity between the first multimode dielectric resonator and the second multimode dielectric resonator is reversed when the length of the coupling structure is longer than a half wavelength of the dielectric filter, and the cross-sectional shape of the coupling structure in a direction perpendicular to the axis of the dielectric filter is a bow-like shape or a C-like shape.
5. The dielectric filter according to claim 3, further comprising at least one tuning rod, wherein the single-mode dielectric resonator is provided with at least one tuning hole, and wherein the tuning rod is provided in the tuning hole for adjusting a coupling strength between the first multimode dielectric resonator and the second multimode dielectric resonator.
6. The dielectric filter of claim 1, wherein the dielectric filter material has a chemical composition of aCaCO3-bSm2O3-cAl2O3-dTiO2Wherein the ratio of a, b, c and d is 0.48-0.62: 0.1-0.24: 0.04-0.18.
7. The dielectric filter of claim 6, wherein the material of the dielectric filter further comprises a modifying additive, the modifying additive is 0.01% > -E, E1% of the modified additive is Ta2O5、Bi2O3Or SiO2A combination of one or more of the above.
8. A method of making a dielectric block, wherein the method is used to make a dielectric block according to any of claims 1-7, the method comprising:
providing raw materials corresponding to strontium carbonate, samarium oxide, aluminum oxide and titanium dioxide;
adding an organic solvent and grinding balls and carrying out primary ball milling;
drying the slurry obtained by the primary ball milling, and calcining to obtain a ceramic body;
crushing the ceramic body, adding an organic solvent and grinding balls, and performing secondary ball milling;
drying the slurry obtained by the secondary ball milling;
mixing the obtained powder with a binder to form slurry, and granulating;
dry-pressing and molding in a mold matched with the shape of the dielectric block; and
removing the binder and sintering again to obtain the dielectric block.
9. A method for producing a dielectric filter, the method being used for producing a dielectric filter according to any one of claims 1 to 7, the method comprising:
providing a dielectric block prepared by the method of claim 8;
and covering a metal layer on the surface of the dielectric block to obtain the dielectric filter.
10. A communication device, characterized in that the communication device comprises an antenna and a dielectric filter according to any of claims 1-7, the antenna being coupled to the dielectric filter.
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CN101367651A (en) * | 2008-09-26 | 2009-02-18 | 广东风华高新科技股份有限公司 | High-frequency low-temperature sintered ceramics dielectric material and method of manufacturing obtained electrical condenser |
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