CN111381336A

CN111381336A - Optical element driving mechanism

Info

Publication number: CN111381336A
Application number: CN202010172286.7A
Authority: CN
Inventors: 鲍和平; 彭坤; 林聪�; 刘富泉
Original assignee: Henan Hozel Electronics Co Ltd
Current assignee: Henan Haoze Electronics Co ltd Kunshan Branch
Priority date: 2020-03-12
Filing date: 2020-03-12
Publication date: 2020-07-07
Anticipated expiration: 2040-03-12
Also published as: CN111381336B

Abstract

The invention discloses an optical element driving mechanism which comprises a shell, a base, a frame, a carrier, an upper spring plate, a lower spring plate, a first group of memory alloy and a second group of memory alloy. The frame, the carrier, the upper spring, the lower spring and the first and second sets of memory alloys are installed in a space defined by the shell and the base, the upper spring movably connects the frame with the carrier, the lower spring movably connects the base with the carrier, the first set of memory alloys are installed on one pair of opposite side portions of the carrier to drive the carrier to move towards one direction along an optical axis, and the second set of memory alloys are installed on the other pair of opposite side portions of the carrier to drive the carrier to move towards the other direction along the optical axis. The invention can provide the maximum thrust and solve the problem of insufficient thrust.

Description

Optical element driving mechanism

Technical Field

The invention relates to the technical field of imaging equipment, in particular to an optical element driving mechanism.

Background

With the great popularization of smart phones, the application range of mobile phone cameras is getting larger, however, the current lens driving mechanism has the phenomenon of electromagnetic interference, auxiliary components such as balls and suspension wires have complex structures, complex assembly and low reliability, and a sensor is needed to assist actual operation. For the scheme of memory alloy driving, most of the current schemes adopt a single memory alloy or two memory alloys are distributed one above the other, and the single-direction thrust is not enough to support the current market demand.

Disclosure of Invention

It is an object of the present invention to provide an optical element driving mechanism that solves the above-mentioned problems of the prior art.

In order to solve the above-mentioned problems, according to an aspect of the present invention, there is provided an optical element driving mechanism including a housing, a base, a frame, a carrier, an upper spring, a lower spring, a first group memory alloy, and a second group memory alloy, the carrier being for mounting an optical element,

the frame, the carrier, the upper spring leaf, the lower spring leaf and the first group of memory alloy and the second group of memory alloy are arranged in a space defined by the shell and the base,

the upper spring plate movably connects the frame with the carrier, the lower spring plate movably connects the base with the carrier,

the first group of memory alloys is arranged on one pair of opposite side parts of the carrier to drive the carrier to move towards one direction along the optical axis, and the second group of memory alloys is arranged on the other pair of opposite side parts of the carrier to drive the carrier to move towards the other direction along the optical axis.

In one embodiment, the carrier has a first side portion and a second side portion, the first side portion is provided with a first memory alloy mounting portion, the second side portion is provided with a second memory alloy mounting portion, the first group of memory alloys is mounted on the first memory alloy mounting portion and fixedly connected with the base at two ends, and the second group of memory alloys is mounted on the second group of memory alloy mounting portion and connected with the base at two ends.

In one embodiment, the first memory alloy installation part is provided with a first wire groove, the first wire groove is provided with an opening facing the base, the first group of memory alloys are installed in the first wire groove, the second memory alloy installation part is provided with a second wire groove, the second wire groove is provided with an opening opposite to the opening direction of the first wire groove, and the second group of memory alloys are installed in the second wire groove.

In one embodiment, the optical element driving mechanism further comprises a snap mounted to the first set of memory alloy mounting portions to confine the first memory alloy within the first wire slot, and a second set of memory alloys mounted to the second memory alloy mounting portions to confine the second set of memory alloys within the second wire slot; in one embodiment, the clip is a metal clip.

In one embodiment, the first memory alloy mounting portion and the second memory alloy mounting portion are respectively a protruding portion protruding outwards from the first side portion of the carrier and the second side portion of the carrier, wherein the first wire groove is arranged on the lower end surface of the protruding portion, and the second wire groove is arranged on the upper end surface of the protruding portion; in one embodiment, the first and second memory alloy mounting portions are of equal height on the carrier.

In one embodiment, the optical element driving mechanism further comprises a clip, and both ends of the first and second sets of memory alloys are fixed to the base by the clip.

In one embodiment, the base has a base first side and a base second side corresponding to the carrier first side and the carrier second side, the clip includes a first clip secured at both ends of the base first side and coupled to the first set of memory alloys and a second clip secured at both ends of the second side and coupled to the second set of memory alloys.

In one embodiment, the first wire clamp and the second wire clamp respectively comprise a vertical part and a horizontal part, the vertical part integrally and upwardly extends from the horizontal part and is provided with a convex part protruding outwards, a step is formed between the convex part and the outer surface of the vertical part, the horizontal part extends along the inner wall of the first side part of the base and is provided with a fixing hole, and the fixing hole is matched with a wire clamp fixing column on a wire clamp mounting part on the base; in one embodiment, the height of the vertical portion of the first wire clamp is higher than the height of the vertical portion of the second wire clamp.

In one embodiment, the upper spring plate comprises a first portion at the inner ring and a second portion at the outer ring, the first portion and the second portion being connected by a resilient strip, the first portion being connected to the carrier and the second portion being connected to the frame, wherein the first portion forms a closed ring body; in one embodiment, the second portion is comprised of separate frame connections at four corners; in one embodiment, the frame connecting portion is provided with a frame connecting hole.

In one embodiment, the lower spring plate comprises a first part and a second part which are independent from each other, the first part and the second part respectively comprise a carrier connecting part positioned in the middle and base connecting parts positioned at two ends, and the carrier connecting part and the base connecting part are connected through an elastic strip; in one embodiment, the base connecting portion is provided with a base fixing hole, the base is provided with a boss matched with the base connecting portion, and the boss is provided with a lower spring fixing column matched with the base fixing hole.

The optical element driving mechanism provided by the invention adopts four memory alloys for driving in each direction, so that the maximum thrust can be provided, and the problem of insufficient thrust is solved.

Drawings

FIG. 1 is an exploded perspective view of a lens actuation mechanism according to one embodiment of the present invention;

FIG. 2 is a perspective view of a frame of one embodiment of the present invention;

FIG. 3 is a perspective view of the carrier showing the surface of the carrier facing the base according to one embodiment of the invention;

FIG. 4 is a top view of the carrier of FIG. 3;

FIG. 5 is a perspective view of a base of one embodiment of the present invention;

figure 6 is a perspective view of a top spring plate according to one embodiment of the present invention;

figure 7 is a perspective view of a lower spring plate according to one embodiment of the present invention;

figure 8 is a top view of a base with a lower spring installed in accordance with one embodiment of the present invention;

FIGS. 9A-9B are perspective views of a protective clasp according to one embodiment of the invention from different perspectives;

FIG. 10 is a perspective view of a wire clamp of one embodiment of the present invention;

FIG. 11 is a perspective view of a lens driving mechanism of one embodiment of the present invention with the upper reed and housing removed;

FIG. 12 is a top view of a lens actuation mechanism of one embodiment of the present invention with the housing removed;

FIG. 13 is a perspective view of a lens actuation mechanism with the housing removed in accordance with one embodiment of the invention;

fig. 14 is a front view of the lens driving mechanism of fig. 13; and

fig. 15 is a right side view of the lens driving mechanism of fig. 13.

Detailed Description

The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the objects, features and advantages of the invention can be more clearly understood. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but are merely intended to illustrate the spirit of the technical solution of the present invention.

In the following description, for the purposes of illustrating various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. One skilled in the relevant art will recognize, however, that the embodiments may be practiced without one or more of the specific details. In other instances, well-known devices, structures and techniques associated with this application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the following description, for the purposes of clearly illustrating the structure and operation of the present invention, directional terms will be used, but terms such as "front", "rear", "left", "right", "outer", "inner", "outer", "inward", "upper", "lower", etc. should be construed as words of convenience and should not be construed as limiting terms.

Fig. 1 is an exploded perspective view of a lens driving mechanism 100 according to an embodiment of the present invention. As shown in fig. 1, the lens driving mechanism of the present invention generally includes a housing 10, an upper spring 20, a frame 30, a carrier 40, a protective button 50, a memory alloy member 60, a lower spring 70, a clip 90, a mount 80, and a mount metal plate 80B. The upper spring 20, the frame 30, the carrier 40, the protective button 50, the memory alloy component 60, the lower spring 70 and the wire clip 90 are installed in the space defined by the housing 10 and the base 50. Specifically, the upper end of the carrier 40 is movably connected to the frame 30 through the upper spring 20, the first part of the upper spring 20 is connected to the upper end of the carrier 40, the second part of the upper spring is connected to the frame 30, the base embedded metal sheet 80B is embedded into the base 80, and the lower end of the carrier 40 is movably connected to the base 80 through the lower spring 70. The memory alloy assembly 60 comprises a first group of memory alloys 61 and a second group of memory alloys 62, wherein the first group of memory alloys 61 and the second group of memory alloys 62 are respectively arranged on two opposite sides of the carrier 40 and are used for driving the carrier 40 to reciprocate relative to the base 80 and the frame 30 along a direction perpendicular to the base 80, so that the function of zooming is realized. Because four memory alloys in total are adopted for driving in each direction, the maximum thrust can be provided, and the problem of insufficient thrust is solved. The respective components of the lens driving mechanism 100 according to an embodiment of the present invention will be described in detail below.

Fig. 2 is a perspective view of the frame 30, and the frame 30 will be described in detail with reference to fig. 2. As shown in fig. 2, the frame 30 is formed in a rectangular frame or a square frame structure as a whole, and includes two pairs of opposite frame first and

second sides

31 and 32, with a corner 33 formed between the frame first and

second sides

31 and 32. The side of each corner portion 33 facing the housing 10 forms a frame reed mounting portion 34, and the frame reed mounting portion 34 is integrally formed as a right-angled triangular block, two right-angled side edges of which are respectively connected to the inner surfaces of the frame first side portion 31 and the frame second side portion 32 and are preferably integrally formed.

The frame first side 31 cooperates with the base first side, the carrier first side 41 and the first set of memory alloys 61. Approximately the middle position of the first side part 31 of the frame forms the first side part driving avoiding groove 311 of the frame, the two ends of the first side part 31 of the frame form the first side part wire clamp avoiding groove 312 of the frame, the inner surface of the first side part 31 of the frame forms the first frame step part, the bottom of the first side part 31 of the frame adjacent to the first frame step part is arranged and is used as the first group memory alloy installation part 313 of the frame, the height of the first group memory alloy installation part 313 of the frame is gradually reduced from the middle part to the two ends, an upward convex arc-shaped structure is formed, the middle part of the arc-shaped structure is driven by the first side part of the frame to avoid the groove 311, and the two ends of the arc-shaped structure extend to the first side part wire. It will be appreciated by those skilled in the art that the memory alloy mounting portion 313 may also be formed as a slope or other similar structure that slopes from the middle to both ends.

The frame second side 32 cooperates with the carrier second side and the second set of memory alloys. A frame second side portion drive avoiding groove 321 is formed in a substantially middle position of the frame second side portion 32, frame second side portion line clamp avoiding portions 322 are formed at two ends of the frame second side portion 32, a step portion is formed on an inner surface (i.e., a surface close to the carrier) of the frame second side portion 32, the step portion forms a frame second group memory alloy installing portion 323, the frame second group memory alloy installing portion 323 is a downward-recessed arc surface, specifically, the arc surface is recessed towards the middle from the frame second side portion line clamp avoiding portions 322 at the two ends, and the frame second side portion drive avoiding groove 321 forms a lowest point. The two ends of the second group of memory alloy 62 are connected with the wire clamp and matched with the wire clamp avoiding part 322 at the second side part of the frame, and the main part of the second group of memory alloy 62 is matched with the mounting part 323 of the second group of memory alloy of the frame. As will be described in further detail below.

With continued reference to fig. 2, the height of the frame spring mounting portion 34 is higher than the height of the frame second side portion 32, and the bottom surface of the frame second side clip relief portion 322 is located at the same level as the top surface of the frame second side portion 32, in other words, the upper surface of the frame second side portion 32 extends to the left and right to form the bottom surface of the frame second side clip relief portion 322. The four corners 33 are each provided with a post 331, and the posts 331 are higher than the frame first side 31, the frame second side 32, and the frame spring attachment portion 34, so that the posts 331 can protect the upper spring or the like when the housing is attached to the frame.

Fig. 3 is a perspective view of carrier 40 showing the surface of carrier 40 facing the base, carrier 40 being described in detail below with reference to fig. 3. As shown in fig. 3, the carrier 40 has a cylindrical opening 400 formed therein, the cylindrical opening 400 being used for mounting a lens (not shown), and opposite first and second carrier sides 41 and 42 are formed around the cylindrical opening 400, the first carrier side 41 being correspondingly engaged with the first frame side 31 and the first base side 81 and being used for mounting the first set of memory alloys 61, and the second carrier side 42 being correspondingly engaged with the second frame side 32 and the second base side 82 and being used for mounting the second set of memory alloys 62.

The first side portion 41 of the carrier is provided with a first memory alloy mounting portion 411. in one embodiment, the first memory alloy mounting portion 411 is preferably disposed in the middle of the first side portion 41 of the carrier. The first memory alloy mounting portion 411 includes a first protrusion 412 protruding outward from a side surface of the carrier, a surface of the first protrusion 412 facing the base is provided with a wire groove 413 to accommodate the first group of memory alloys 61, a middle portion of the first protrusion 412 is provided with a first straight groove 414 to cooperate with the protection buckle 50, the first straight groove 414 is provided with a first protrusion 415, and the first protrusion 415 is used to cooperate with the fixing hole 53 of the protection buckle 50 to position and fix the protection buckle 50. First stoppers 416 extending in the up-and-down direction are formed at both sides of the first straight groove 415, a first arc-shaped portion 417 is formed at the middle of the first wire groove 413, and the first group memory alloy 61 is installed in the first wire groove 413 and arranged around the first arc-shaped portion 417. The first arc-shaped portion 417 is convex toward the base. The surface of the carrier 40 near the first arc-shaped portion 417 is provided with a protection buckle fixing groove 418, the protection buckle 50 is installed in the first straight groove 415, the fixing hole 53 in the middle portion is matched with the first protrusion 415 and the upper and lower ends are respectively matched and fixed with the protection buckle fixing groove 418 and the corresponding end surface of the first protrusion 412, so that the protection buckle 50 is detachably connected to the first memory alloy installation portion 411 and the first group of memory alloys 61 is limited in the first wire groove 413.

The two opposite first side portions 41 of the carrier 40 are respectively provided with a memory alloy mounting portion 411, the first memory alloy mounting portions 411 arranged on the two first side portions 41 are basically identical in structure, shape and function, and when a first group of memory alloys defined in the wire grooves of the first memory alloy mounting portions are electrified, the carrier is driven to move along the optical axis direction of the lens in a direction away from the base, namely towards the lower direction shown in fig. 3, namely the direction of the shell.

With reference to fig. 3, the second side portion 42 is provided with a second memory alloy mounting portion 421, the second memory alloy mounting portion 421 includes a second protrusion 422 protruding outward from the side surface of the carrier, an end surface of the second protrusion 422 away from the base (i.e., a lower end surface of the protrusion shown in fig. 3) is provided with a second linear groove 423 for accommodating the second group of memory alloys 62, a middle portion of the second protrusion 422 is provided with a second straight groove 424 for cooperating with the protection buckle 50, the second straight groove 424 is provided with a second protrusion 425, and the second protrusion 425 is used for cooperating with the fixing hole 53 of the protection buckle 50 to position and fix the protection buckle 50. Two sides of the second straight groove 425 form second stoppers 426 extending in the up-down direction, a middle portion of the second linear groove 423 forms a second arc portion 427, the second arc portion 427 protrudes in a direction away from the base, i.e., downward as viewed in fig. 3, and the second group memory alloy 62 is installed in the linear groove 423 and disposed around the second arc portion 427. The second straight groove 425 is provided at the bottom thereof near the base with a snap fixing portion 428, the snap fixing portion 428 is formed by extending outward from the surface of the carrier 40 facing the base (i.e. the upper surface as shown in fig. 3), the protective button 50 is installed in the second straight groove 425, wherein the fixing hole 53 of the protective button 50 is engaged with the second protrusion 425 and the upper and lower ends thereof are engaged and fixed with the lower end surfaces of the snap fixing portion 428 and the second protrusion 422, respectively, so as to detachably connect the protective button 50 to the second memory alloy installation portion 421 and to limit the second group memory alloy 62 in the second wire groove 423.

The two opposite second side portions 42 of the carrier 40 are respectively provided with a memory alloy mounting portion 421, the second memory alloy mounting portions 421 provided on the two second side portions 42 have substantially the same structure, shape and function, and when a second group of memory alloys defined in the wire grooves thereof is energized, the carrier is cooperatively driven to move toward the base along the optical axis direction of the lens, i.e., upward as shown in fig. 3. The first group of memory alloy arranged on the first side part of the carrier and the second group of memory alloy arranged on the second side part of the carrier are matched for driving, so that the carrier can reciprocate along the optical axis direction, and the function of optical zooming is realized.

With continued reference to fig. 3, the surface of carrier 40 facing the mount is provided with lower reed fixing portions 44, lower reed fixing posts 441 are provided on lower reed fixing portions 44, lower reed fixing portions 44 are preferably provided on the lower surface (surface facing the mount) of second side portion 42, and two lower reed fixing posts 44 are preferably provided on the lower surface of each side portion 22. A transition side 43 is provided between the first side 41 and the second side 42, and the first side 41, the second side 42 and the transition side 43 form a regular hexagonal structure of the carrier 40 as a whole. The upper and lower surfaces of the transition side portion 43 are provided with notches 431, and the notches 431 facing the base 80 are provided with supports 432, and the supports 432 protrude toward the base 80.

Fig. 4 is a top view of carrier 40 showing the surface of carrier 40 away from base 80, i.e., the surface facing housing 10. As shown in fig. 4, the surface of the carrier 80 away from the base 80 is provided with a plurality of carrier upper spring mounting portions 45, and the carrier upper spring mounting portions 45 are provided with upper spring positioning holes 451, and the upper spring positioning holes 451 are aligned with the carrier fixing portions 211 of the upper spring 20 to position the upper spring 20 on the carrier 40. In one embodiment, upper spring positioning apertures 451 are distributed on the upper surface (i.e., the surface away from the base) of first side 41 and second side 42 of carrier 40. The surface of the carrier 40 far away from the base 80 is further provided with an avoiding block 46, and when the upper reed 20 is installed on the carrier 40, the avoiding block 46 is avoided. The escape block 46 is formed to protrude a distance from the upper surface of the carrier 40 in a direction away from the base. In one embodiment, the avoiding block 46 is disposed above the first side portion 41 and the second side portion 42 of the carrier 40, and in one embodiment, an upper spring positioning hole 451 and an avoiding block 46 are respectively disposed on the upper surfaces of the first side portion 41 and the second side portion 42, and preferably, the upper spring positioning hole 451 and the avoiding block 46 are disposed at intervals on the surface of the carrier 40 away from the base 80, that is, one positioning hole 451 is disposed around the cylindrical opening 400, and then one avoiding block 46 is disposed. Preferably, the alignment holes 451 and the bypass blocks 46 are evenly spaced around the cylindrical opening 400 on the surface of the carrier 40 away from the base.

Fig. 5 is a perspective view of the base 80, and the base 80 will be described in detail with reference to fig. 5. As shown in fig. 5, the base plate 80 is formed in a rectangular structure as a whole and includes a base plate 80A, a central portion of the base plate 80A is formed with a center hole 800 to be fitted with the cylindrical opening 400 of the carrier 40, two base first side portions 81 facing each other and two base second side portions 82 facing each other are formed around the center hole 800, the base first side portions 81 are fitted with the carrier first side portions 41, the frame first side portions 31, and the first group memory alloy 61, and the base second side portions 82 are fitted with the carrier second side portions 42, the frame second side portions 32, and the second group memory alloy 62.

The first side portion 81 has a first blocking plate 813 extending upward (i.e., toward the housing) from the bottom plate 80A at the middle portion thereof, the first blocking plate 813 has a first middle notch 811 at the middle portion thereof, and first two-side notches 812 at both sides of the first blocking plate 813. The first central notch 811 engages the first memory alloy mounting portion 41 of the carrier 40 to thereby avoid the first memory alloy mounting portion 411. The first two-side notches 812 have a smaller width than the first middle notch 811 and are disposed adjacent to the corner portions 83. The inner wall of the baffle 813 near the central hole 800 is provided with a first step portion 814, the first step portion 814 extends from the first two-side notch 812 to the first middle notch 811, and inclines downwards from the first two-side notch 812 to the first middle notch 811, so that the arrangement that the portion near the first two-side notch 812 is high and the portion near the first middle notch 811 is low is formed. The first group of memory alloys 61 mounted on the first memory alloy mounting portion 411 of the carrier 40 is arranged on the step portion 814 and extends on the first step portion 814, and is fixed on the base 80 at both ends by the first clips 91 and is in circuit communication with the base embedded metal sheet 80B, so that a current is introduced into the first group of memory alloys 61 through the base embedded metal sheet 80B to drive the carrier 40 to move in the direction away from the base along the optical axis, which will be described in detail later.

The base second side 82 of the base 80 is similar to the base first side 81, differing primarily in the direction and extent of the slope of the step. Specifically, the second side portion 82 is provided at a middle portion thereof with a second shutter 823 extending upward (i.e., toward the housing) from the bottom plate 80A, the second shutter 823 forms a second middle gap 821 at the middle portion thereof, and forms second both-side gaps 822 at both sides of the second shutter 823. The second central gap 821 cooperates with the second memory alloy mounting portion 42 of the carrier 40 to avoid the second memory alloy mounting portion 421. The second side notches 822 have a width greater than the width of the second middle notch 821 and are disposed adjacent to the corner 83 for avoiding the second clip 92. The inner wall of the baffle 823 close to the central hole 800 is provided with a second step portion 824, the second step portion 824 extends from the second side notch 822 to the second middle notch 821, and is inclined downwards from the second middle notch 821 to the second side notch 822, so that a portion close to the second middle notch 821 is high, and a portion close to the second side notch 822 is low. The second group memory alloy 62 mounted on the second memory alloy mounting portion 421 of the carrier 40 is disposed on the second stepped portion 824 and extends on the second stepped portion 824, and is fixed on the base 80 at both ends by the clips 90 and communicates with the base embedded metal sheet 80B, so that a current is introduced into the second group memory alloy 62 through the base embedded metal sheet 80B to drive the carrier 40 to move in the optical axis direction toward the base direction, which will be described in detail later.

In one embodiment, the slope of the first step 814 is greater than the slope of the second step 824.

The base first side and the base second side are connected by a base corner 83. Each base corner 83 is identical in structure and function, and a description will now be made with respect to one of the base corners 83. The inside of the base corner 83 is provided with a clip mounting portion 831, and the outside of the clip mounting portion 831 is provided with a boss 832 to serve as a lower spring mounting portion, the boss 832 being formed to extend upward from the bottom plate 80A by a distance smaller than the height of the first flap 811 of the first side portion 81 and the second flap 821 of the second side portion 81. The surface of the wire clamp installation part 831 is provided with a wire clamp fixing column 833, the upper surface of the boss 832 is provided with a base lower reed fixing column 834, and a fixing hole 915 of the first wire clamp 91 or a fixing hole 925 of the second wire clamp 92 is matched with the wire clamp fixing column 833, so that the wire clamp 90 is fixedly installed on the wire clamp installation part 831. In one embodiment, the clip 90 may be secured to the base by, for example, heat staking. Base fixing hole 715 of lower spring 70 is fitted with lower spring fixing post 834 of base 80, thereby fixedly mounting the base connecting portion of lower spring 70 on base 80. The base embedded metal sheet 80B is embedded inside the base 80 and provides a circuit connection for the memory alloy set 60.

Fig. 6 is a perspective view of the upper spring 20, and the upper spring 20 will be described in detail with reference to fig. 6. As shown in fig. 6, the upper leaf spring 20 generally comprises a first portion 21 at the inner ring and a second portion 22 at the outer ring, the first portion 21 and the second portion 22 being connected by an elastic strip 23 such that a range of movement is possible between the first portion 21 and the second portion 22. The first portion 21 at the inner circumference is attached to the carrier 40 and the second portion 22 at the outer circumference is attached to the frame 30, so that the carrier 40 and the frame 30 are movably connected by the upper spring 20.

In one embodiment, the first portion 21 includes a closed ring body 210, the closed ring body 210 is equidistantly provided with an upper spring carrier connecting portion 211, and the upper spring carrier connecting portion 211 is provided with a plurality of connecting holes 212 so as to be fixed to the carrier 40 at the upper spring positioning holes 45 by means of gluing, for example. The second part 22 is composed of independent frame connecting parts 221 located at four corners of the upper spring 20, the frame connecting parts 221 are provided with frame connecting holes 222, and the frame connecting parts 221 of the upper spring 20 are fitted with the frame spring mounting parts 34 of the frame 30 and fixed to each other by means of, for example, glue bonding.

Fig. 7 is a perspective view of the lower spring 70, and fig. 8 is a plan view of the base to which the lower spring is attached. The lower spring 70 will be described in detail with reference to fig. 7 to 8. As shown in fig. 7 to 8, the lower spring 70 integrally includes a first portion 71 and a second portion 72 independent of each other, the first portion 71 includes a carrier link 711 at a middle portion and a base link 712 at both ends, and the carrier link 711 and the base link 712 are connected by an elastic bar 713 so that the carrier link 711 and the base link 712 can move relative to each other within a certain range. The carrier attachment portion 711 is attached to the lower spring attachment portion 44 of the lower surface of the carrier 40. In one embodiment, carrier attachment portion 711 is provided with carrier attachment holes 714 to mate with lower spring attachment posts 441 on carrier 40 such that lower spring attachment posts 441 extend into carrier attachment holes 714 to fixedly attach first portion 71 of lower spring 70 to carrier 40. The base connections 712 at both ends mate with bosses 832 on the base 80. In one embodiment, base attachment portion 712 has base attachment holes 715, base attachment holes 715 are configured to mate with lower spring attachment posts 834 on bosses 832, and lower spring attachment posts 834 are configured to extend into base attachment holes 715, thereby fixedly attaching first portion 71 of lower spring 70 to base 80. Since the carrier link 711 and the base link 712 are connected by the elastic strip, the carrier 40 and the base 80 can move relative to each other.

The second portion 72 includes a carrier link 721 at the middle and a base link 722 at both ends, and the carrier link 721 and the base link 722 are connected by an elastic bar 723 so that the carrier link 721 and the base link 722 can move relative to each other within a certain range. The carrier attachment portion 721 is attached to the lower spring attachment portion 44 on the lower surface of the carrier 40. In one embodiment, carrier attachment portion 721 is provided with carrier attachment holes 724, and carrier attachment holes 724 cooperate with lower spring attachment posts 441 on carrier 40 to extend lower spring attachment posts 441 into carrier attachment holes 724, thereby fixedly attaching second portion 72 of lower spring 70 to carrier 40. The base connections 722 at both ends mate with bosses 832 on the base 80. In one embodiment, base connector 722 is provided with base fastening holes 725, base fastening holes 725 are matched with lower spring fastening posts 834 on boss 832, and lower spring fastening posts 834 are inserted into base fastening holes 725, so that second portion 72 of lower spring 70 is fixedly connected with base 80. The carrier connecting part 721 and the base connecting part 722 are connected by an elastic strip 723, so that the carrier 40 and the base 80 can move mutually.

In one embodiment, the second portion 72 and the first portion 71 have the same structure and shape and are integrally enclosed to form a rectangular structure, with the base connections located at the four corners and the carrier connections located at the two opposite sides. In one embodiment, the carrier connection portions of first and

second portions

71 and 72 mate with lower spring mounting portions 44 provided on the lower surface of second side 42 of carrier 40, and the base connection portions of first and

second portions

71 and 72 mate with bosses 832 on the four corners of base 80, thereby enabling moveable connection of the lower end of carrier 40 to base 80 via first and

second portions

71 and 72.

Fig. 9A-9B are perspective views of the protective clasp 50 from different perspectives. As shown in fig. 9A-9B, the protection buckle 50 includes a protection buckle main body 51, two ends of the protection buckle main body 51 are provided with buckling parts 52, a mounting hole 53 is provided in the middle of the protection buckle main body 51, the buckling parts 52 at two ends are respectively clamped into the protection buckle fixing groove 418 of the first memory alloy mounting part on the carrier 40 and the end part close to the housing or clamped into the buckle fixing part 428 of the second memory alloy mounting part and the end part close to the base of the second memory alloy mounting part, so as to limit the memory alloy in the memory alloy mounting part. In one embodiment, the protection button is a metal protection button, the memory alloy is prevented from falling off by the metal protection button, and the metal protection button can help the memory alloy to dissipate heat.

Fig. 10 is a perspective view of the wire clamp 90. As shown in fig. 10, the wire clip 90 includes a first wire clip 91 and a second wire clip 92. The wire clamp 90 is generally disposed at the wire clamp mounting portion 831 of the corner portion 83 of the base 80, specifically, the first wire clamp 91 is mounted to the first side portion 81 of the base 80, and the second wire clamp 92 is mounted to the second side portion 82 of the base 80. Since the first side 81 of the base 80 is used for matching with the first side 41 of the carrier 40, the second side 82 of the base 80 is used for matching with the second side 42 of the carrier 40, and the memory alloy mounting portions are arranged on the first side 41 and the second side 42 of the carrier 40, the wire groove 413 of the first memory alloy mounting portion 411 on the first side 41 of the carrier 40 is opened towards the base 80, and the wire groove 423 of the second memory alloy mounting portion 421 on the second side 42 of the carrier 40 is opened away from the base 80, so that the first wire clip 91 and the second wire clip 92 are also different.

Specifically, with combined reference to fig. 11, 14 and 15, the first clip 91 has a height that is greater than the height of the second clip 92. This is because the middle portion of the first group of memory alloys 61 mounted on the first side portion 41 of the carrier 40 (i.e., the portion located at the first memory alloy mounting portion 411) is close to the base 80 and close to both ends, i.e., close to the clip portion away from the base 80, so that when described in an arrangement where the base is located below and the case is located above, the first memory alloy 61 mounted on the first side portion 41 of the carrier as a whole forms an arrangement where both ends are high and the middle is low, so that the height of the first clip 91 needs to be higher.

Correspondingly, the second wire clip 92 is mounted on the second side portion 82 of the base 80, and since the second side portion 82 of the base 80 corresponds to the second side portion 42 of the carrier 40, the second side portion 42 of the carrier 40 is provided with a second memory alloy mounting portion 421, and an opening of the wire groove 423 of the second memory alloy mounting portion 421 faces a direction away from the base 80, i.e., a housing direction, so that after the second group of memory alloys 62 are mounted on the second alloy mounting portion 423, when the arrangement that the base is located below and the housing is located above is described, the second group of memory alloys 62 form an arrangement that is high in the middle and low at both ends as a whole, and therefore, the height of the second wire clip 92 mounted on both ends of the second group of memory alloys 62 on the second side portion 42 of the carrier 40 is low.

Referring back to fig. 10, the first wire clip 91 includes a vertical portion 911 and a horizontal portion 912, the vertical portion 911 is integrally formed to protrude upward from the horizontal portion 912 and is provided with a protruding portion 913 protruding outward, and a step 914 is formed between the protruding portion 913 and an outer surface of the vertical portion 911. The horizontal portion 912 extends along an inner wall of the first side portion 81 of the base 80 and is provided with a fixing hole 915, and the fixing hole 915 is engaged with a clip fixing post 833 on the clip mounting portion 831 on the base 80 to fix the first clip 91 to the base 80 by means of, for example, heat staking. The second wire clip 92 includes a vertical portion 921 and a horizontal portion 922, the vertical portion 921 integrally protrudes upward from the horizontal portion 922 to be formed and provided with a protruding portion 923 protruding outward, and a step 924 is formed between the protruding portion 923 and an outer surface of the vertical portion 921. The horizontal portion 922 extends along an inner wall of the second side portion 82 of the base 80 and is provided with a fixing hole 925, and the fixing hole 925 is engaged with a wire clamp fixing post 833 on a wire clamp mounting portion 831 on the base 80 to fix the second wire clamp 92 to the base 80 by means of, for example, heat staking. It is to be noted that the height of the vertical portion 911 of the first clip 91 is higher than the height of the vertical portion 921 of the second clip 92.

An assembled state of the lens driving mechanism 100 according to an embodiment of the present invention will be described with reference to fig. 11 to 15.

Fig. 11 is a perspective view of the lens driving mechanism 100 of one embodiment of the present invention, in which the upper spring and the housing are removed; FIG. 12 is a top view of the lens actuation mechanism 100 with the housing removed according to one embodiment of the present invention; FIG. 13 is a perspective view of the lens actuation mechanism 100 with the housing removed in accordance with one embodiment of the invention; fig. 14 is a front view of the lens driving mechanism 100 of fig. 13; and fig. 15 is a right side view of the lens driving mechanism 100 of fig. 13.

As shown in fig. 11 to 15, the base embedded metal sheet 80B is embedded in the base 80, and the clip 90 is fixed to a clip mounting portion 831 formed inside the corner portion 83 of the base 80, wherein a first clip 91 is provided along the first side portion 81 of the base 80 and is electrically communicated with the base embedded metal sheet 80B, a second clip 92 is provided along the second side portion 82 of the base 80 and is electrically communicated with the base embedded metal sheet 80B, the memory alloy assembly 60 includes a first group memory alloy 61 and a second group memory alloy 62, the first group memory alloy 61 is mounted on a first memory alloy mounting portion 411 provided on the first side portion 41 of the carrier 40 and is fixed by the protection buckle 50, and is fixedly connected at both ends with the first clip 91, respectively. The second group memory alloy 62 is mounted on a second memory alloy mounting portion 421 provided on the second side portion 42 of the carrier 40 and fixed by the protection buckle 50, and is fixedly connected at both ends to the second wire clamp 92. First portion 71 and second portion 72 of lower spring 70 are disposed on a lower surface of opposing second side 82 of base 80 and a lower surface of opposing second side 42 of carrier 40.

Specifically, referring to the arrangement shown in fig. 8, first part 71 of lower spring 70 is disposed at the upper half shown in fig. 8, second part 72 of lower spring 70 is disposed at the lower half shown in fig. 8, carrier mounting part 711 of first part 71 and carrier mounting part 721 of second part 72 are used to connect lower spring mounting part 44 disposed at the lower surface of second side portion 42 of carrier 40, base mounting part 712 of first part 71 and base mounting part 722 of second part 72 are connected to lower spring mounting part 832 on the lower bottom surface of base 80, respectively, and lower spring fixing post 834 is received in base fixing hole 715 of first part 71 and base fixing hole 725 of second part 72 of lower spring 70, thereby movably connecting base 80 to the bottom surface of carrier 40 via lower spring 70.

Referring to fig. 12, the inner ring (i.e., the first portion) 21 of the upper leaf spring 20 is fixedly coupled to the upper leaf mounting portion 45 on the upper surface of the carrier 40, and the outer ring (i.e., the second portion) 22 of the upper leaf spring 20 is coupled to the upper leaf mounting portion 34 at the corner of the frame 30, thereby movably coupling the carrier 40 to the frame 30. The frame first side driving avoiding groove 312 of the frame 30 and the first middle notch 811 of the base 80 have the same width and cooperate to enclose a rectangular opening to avoid the first memory alloy driving part 411 of the carrier 40. The first side clip avoiding groove 312 of the frame 30 is correspondingly matched with the first two-side notch 812 on the base 80 and forms an opening for avoiding the first clip 712. Similarly, the frame second side driving avoiding groove 322 of the frame 30 and the second middle gap 821 of the base 80 have the same width and cooperate to form a rectangular opening to avoid the second memory alloy driving part 421 on the carrier 40. The frame second side clip avoiding groove 322 of the frame 30 is correspondingly matched with the second two side notches 822 on the base 80 and forms an opening for avoiding the second clip 722.

Referring to fig. 13-15, when the first group of memory alloys 61 on the opposite side is energized, the carrier 40 is driven to move upward (i.e. away from the base 80) relative to the base 80 and the frame 30, and when the second group of memory alloys 62 on the other opposite side is energized, the carrier 40 is driven to move downward (i.e. close to the base 80) relative to the base 80 and the frame 30, so that the carrier 40 can move in the up-and-down direction through controlling the current in the first group of memory alloys 61 and the second group of memory alloys 62, and when a lens is installed in the carrier 40, the carrier 40 can drive the lens to reciprocate along the optical axis direction through controlling the current in the first group of memory alloys 61 and the second group of memory alloys 62, so that the function of zooming can be realized.

While the preferred embodiments of the present invention have been illustrated and described in detail, it should be understood that various changes and modifications of the invention can be effected therein by those skilled in the art after reading the above teachings of the invention. Such equivalents are intended to fall within the scope of the claims appended hereto.

Claims

1. An optical element driving mechanism, comprising a housing, a base, a frame, a carrier, an upper spring, a lower spring, a first set of memory alloys, and a second set of memory alloys, the carrier being for mounting an optical element,

2. An optical element driving mechanism according to claim 1, wherein the carrier has an opposing first side portion of the carrier provided with a first memory alloy mounting portion and an opposing second side portion of the carrier provided with a second memory alloy mounting portion, the first set of memory alloys being mounted to the first memory alloy mounting portion and fixedly connected at both ends to the base, and the second set of memory alloys being mounted to the second set of memory alloy mounting portions and connected at both ends to the base.

3. The optical element driving mechanism according to claim 2, wherein the first memory alloy mounting portion is provided with a first wire groove having an opening facing the base, the first group of memory alloys being mounted in the first wire groove, and the second memory alloy mounting portion is provided with a second wire groove having an opening opposite to the opening of the first wire groove, the second group of memory alloys being mounted in the second wire groove.

4. An optical element drive mechanism as claimed in claim 3, further comprising a clip, wherein the clip is mounted to the first set of memory alloy mounts to confine the first memory alloy within the first wire slot, and the clip is mounted to the second memory alloy mount to confine the second set of memory alloys within the second wire slot; in one embodiment, the clip is a metal clip.

5. The optical element driving mechanism according to claim 3, wherein the first memory alloy mounting portion and the second memory alloy mounting portion are respectively provided with a projection projecting outward from the first side portion of the carrier and the second side portion of the carrier, wherein the first wire groove is provided on a lower end surface of the projection, and the second wire groove is provided on an upper end surface of the projection; in one embodiment, the first and second memory alloy mounting portions are of equal height on the carrier.

6. An optical element driving mechanism according to claim 1, further comprising a clip by which both ends of the first and second sets of memory alloys are secured to the base.

7. An optical element driving mechanism according to claim 6, wherein the base has a base first side and a base second side corresponding to the carrier first side and the carrier second side, the clip comprising a first clip and a second clip, the first clip being secured to both ends of the base first side and being connected to the first set of memory alloys, the second clip being secured to both ends of the second side and being connected to the second set of memory alloys.

8. The optical element driving mechanism according to claim 7, wherein the first clip and the second clip respectively include a vertical portion and a horizontal portion, the vertical portion integrally and upwardly protruding from the horizontal portion and provided with a protruding portion protruding outwardly, the protruding portion forming a step with an outer surface of the vertical portion, the horizontal portion extending along an inner wall of the first side portion of the base and provided with a fixing hole, the fixing hole engaging with a clip fixing post on the clip mounting portion on the base; in one embodiment, the height of the vertical portion of the first wire clamp is higher than the height of the vertical portion of the second wire clamp.

9. The optical element driving mechanism according to claim 1, wherein said upper spring comprises a first portion at an inner circumference and a second portion at an outer circumference, said first portion and said second portion being connected by an elastic strip, said first portion being connected to said carrier, said second portion being connected to said frame, wherein said first portion forms a closed ring body; in one embodiment, the second portion is comprised of separate frame connections at four corners; in one embodiment, the frame connecting portion is provided with a frame connecting hole.

10. The optical element driving mechanism according to claim 1, wherein the lower spring comprises a first portion and a second portion independent from each other, the first portion and the second portion respectively comprise a carrier connecting portion at a middle portion and a base connecting portion at both ends, and the carrier connecting portion and the base connecting portion are connected by an elastic strip; in one embodiment, the base connecting portion is provided with a base fixing hole, the base is provided with a boss matched with the base connecting portion, and the boss is provided with a lower spring fixing column matched with the base fixing hole.