CN111378226A - High-thermal-conductivity graphene composite material and preparation method thereof - Google Patents
High-thermal-conductivity graphene composite material and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a high-thermal-conductivity graphene composite material which is prepared from the following raw materials in parts by weight: 30-45 parts of polypropylene powder, 12-22 parts of graphene, 12-22 parts of heat-conducting filler, 2-3 parts of dispersing agent, 3-4 parts of glass fiber and 4-7 parts of maleic anhydride grafted polypropylene; the heat-conducting filler is at least one of aluminum oxide, graphite powder, boron nitride, aluminum nitride and aluminum powder. The high-thermal-conductivity graphene composite material is high in thermal conductivity coefficient and good in thermal conductivity; the tensile strength is high and is equivalent to or even higher than that of a pure PP material; and the bending strength is high, and the material is equivalent to a pure PP material, and has good bending resistance and comprehensive mechanical properties.
Description
Technical Field
The invention relates to the technical field of high polymer materials, and particularly relates to a high-thermal-conductivity graphene composite material and a preparation method thereof.
Background
Polypropylene is a polymer obtained by addition polymerization of propylene. Is white wax-like material, and has transparent and light appearance. The density is 0.89-0.91 g/cm3, the flame retardant is flammable, the melting point is 165 ℃, the softening temperature is about 155 ℃, and the use temperature range is-30-140 ℃. Can resist corrosion of acid, alkali, salt solution and various organic solvents at the temperature of below 80 ℃, and can be decomposed at high temperature and under the action of oxidation. The polypropylene is widely applied to the production of fiber products such as clothes, blankets and the like, medical instruments, automobiles, bicycles, parts, conveying pipelines, chemical containers and the like, and is also used for packaging foods and medicines.
Graphene has very good thermal conductivity. The pure defect-free single-layer graphene has the thermal conductivity coefficient as high as 5300W/mK, is the carbon material with the highest thermal conductivity coefficient, and is higher than that of a single-wall carbon nanotube (3500W/mK) and a multi-wall carbon nanotube (3000W/mK). When it is used as carrier, its thermal conductivity can be up to 600W/mK. In addition, the ballistic thermal conductivity of graphene may shift the lower limit of the ballistic thermal conductivity of carbon nanotubes per unit circumference and length down.
Graphene is one of the materials with the highest known strength, has good toughness and can be bent, the theoretical Young modulus of the graphene reaches 1.0TPa, and the inherent tensile strength is 130 GPa. The reduced graphene modified by the hydrogen plasma also has very good strength, and the average modulus can be larger than 0.25 TPa.
However, the currently used heat conductive materials have the following problems:
1. the heat conduction coefficient is low, the heat conduction performance is poor, the requirements of applications such as heat dissipation or heating cannot be met, and metal materials cannot be replaced as heat conduction materials;
2. the mechanical properties such as tensile strength and the like of the material are seriously influenced due to excessive addition of the heat-conducting filler and the like, and the material is easy to damage in the using process.
Based on the above situation, the invention provides a high-thermal-conductivity graphene composite material and a preparation method thereof, which can effectively solve the above problems.
Disclosure of Invention
The invention aims to provide a high-thermal-conductivity graphene composite material and a preparation method thereof. The high-thermal-conductivity graphene composite material is high in thermal conductivity coefficient and good in thermal conductivity; the tensile strength is high and is equivalent to or even higher than that of a pure PP material; and the bending strength is high, and the material is equivalent to a pure PP material, and has good bending resistance and comprehensive mechanical properties.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
the high-thermal-conductivity graphene composite material is prepared from the following raw materials in parts by weight:
30-45 parts of polypropylene powder, 12-22 parts of graphene, 12-22 parts of heat-conducting filler, 2-3 parts of dispersing agent, 3-4 parts of glass fiber and 4-7 parts of maleic anhydride grafted polypropylene;
the heat-conducting filler is at least one of aluminum oxide, graphite powder, boron nitride, aluminum nitride and aluminum powder.
Preferably, the high thermal conductivity graphene composite material is prepared from the following raw materials in parts by weight: 38 parts of polypropylene powder, 17 parts of graphene, 20 parts of heat-conducting filler, 2.5 parts of dispersant, 3.5 parts of glass fiber and 5.6 parts of maleic anhydride grafted polypropylene;
the heat-conducting filler is at least one of aluminum oxide, graphite powder, boron nitride, aluminum nitride and aluminum powder.
Preferably, the high thermal conductivity graphene composite material is prepared from the following raw materials in parts by weight: 40 parts of polypropylene powder, 20 parts of graphene, 16 parts of heat-conducting filler, 2.8 parts of dispersant, 3.6 parts of glass fiber and 6 parts of maleic anhydride grafted polypropylene;
the heat-conducting filler is at least one of aluminum oxide, graphite powder, boron nitride, aluminum nitride and aluminum powder.
Preferably, the heat conducting filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder.
Preferably, the heat-conducting filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder, and the mass ratio of the heat-conducting filler to the aluminum oxide, the aluminum nitride and the aluminum powder is 10: (18-21): (6-7.5).
Preferably, the thermal conductivity of the aluminum nitride is 260-280 w/m.k.
Preferably, the alumina is nano alumina.
Preferably, the dispersant is dispersant HT-5040.
Preferably, the graphene is nano graphene micro-sheets.
The invention also provides a preparation method of the high-thermal-conductivity graphene composite material, which comprises the following steps:
A. respectively weighing polypropylene powder, graphene, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene according to parts by weight for later use;
B. putting the polypropylene powder and the graphene into a high-speed mixer, and uniformly mixing at a high speed to obtain a primary mixture;
C. and feeding the primary mixture, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene into a double-screw extruder, carrying out melt mixing, extruding, granulating and cooling to obtain the high-heat-conductivity graphene composite material.
The preparation method of the high-thermal-conductivity graphene composite material comprises the steps of putting polypropylene powder and graphene into a high-speed mixer, and uniformly mixing at a high speed to obtain a primary mixture; then, feeding the primary mixture, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene into a double-screw extruder, carrying out melt mixing, extruding, granulating and cooling to obtain the high-heat-conductivity graphene composite material; the preparation method has the advantages that the polypropylene powder and the graphene are uniformly mixed, the problem that the graphene is difficult to be uniformly mixed with the matrix material is solved, the raw materials can be well and uniformly mixed, and the performance of the high-thermal-conductivity graphene composite material is guaranteed.
Wherein, the process condition parameters of high-speed mixing and the process condition parameters of extrusion granulation can refer to the process condition parameters of high-speed mixing and the process condition parameters of extrusion granulation which are conventional in the field, and can be determined by a person skilled in the art according to the needs.
Compared with the prior art, the invention has the following advantages and beneficial effects:
the high-thermal-conductivity graphene composite material disclosed by the invention is prepared by selecting raw materials, optimizing the content of each raw material, and selecting polypropylene powder, graphene, a thermal-conductivity filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene in a proper proportion, so that the respective advantages are fully exerted, the components are mutually supplemented and mutually promoted, the raw material cost is optimized, the problems of uneven mixing and blending caused by the raw materials are reduced, the quality stability of a product is improved, the prepared high-thermal-conductivity graphene composite material is high in thermal conductivity and good in thermal conductivity, can meet the requirements of applications such as heat dissipation or heating, and can replace metal materials to a certain extent as a thermal-conductivity material; the tensile strength is high and is equivalent to or even higher than that of a pure PP material; and the bending strength is high, the material is equivalent to a pure PP material, the bending resistance is good, the comprehensive mechanical property is good, the material is not easy to damage in the using process, and the service life is long.
In the raw materials of the high-thermal-conductivity graphene composite material, the polypropylene powder and other components such as graphene are compounded, so that the polypropylene powder and the graphene are more easily and uniformly mixed, the problem that the graphene is difficult to be uniformly mixed with a matrix material is solved, the raw materials can be well and uniformly mixed, and the performance of the high-thermal-conductivity graphene composite material is ensured.
In the raw materials of the high-thermal-conductivity graphene composite material, the glass fiber mainly plays a role in reinforcement and is matched with other components to play a good synergistic effect, so that the high-thermal-conductivity graphene composite material has good comprehensive mechanical property, is not easy to damage in the using process and has long service life.
In the raw materials of the high-thermal-conductivity graphene composite material, the maleic anhydride grafted polypropylene mainly plays a toughening role and a solubilizer role, and is matched with other components to play a good synergistic role, so that the bending strength of the high-thermal-conductivity graphene composite material is greatly improved, the comprehensive mechanical property is ensured to be good, the high-thermal-conductivity graphene composite material is not easy to damage in the using process, and the service life is long.
In the raw materials of the high-thermal-conductivity graphene composite material, the thermal conductive filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder. The heat-conducting filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder, and the mass ratio of the aluminum oxide to the aluminum nitride to the aluminum powder is 10: (18-21): (6-7.5). Through a large number of experiments, the inventor finds that the heat-conducting filler with the proportion can greatly improve the heat conductivity coefficient of the high-heat-conductivity graphene composite material, remarkably improve the heat-conducting property, is easy to be uniformly dispersed in the raw material system, and also ensures good comprehensive mechanical property, difficult damage in the using process and long service life.
In the raw material of the high-thermal-conductivity graphene composite material, the thermal conductivity coefficient of the aluminum nitride is 260-280 w/m.k. Through a large number of experiments, the inventor finds that the heat conductivity coefficient of the high-heat-conductivity graphene composite material can be further improved and the heat conductivity can be further improved by selecting the high-heat-conductivity aluminum nitride;
in the raw materials of the high-thermal-conductivity graphene composite material, the dispersing agent is HT-5040. Through a large number of experiments, the inventor finds that the dispersant HT-5040 can better enable graphene, heat-conducting filler, dispersant and glass fiber to be uniformly dispersed in polypropylene and maleic anhydride grafted polypropylene in the raw material system of the high-heat-conductivity graphene composite material, so that the heat-conducting property and the mechanical property of the high-heat-conductivity graphene composite material are ensured.
The preparation method has simple process and simple and convenient operation, and saves manpower and equipment cost.
The high-thermal-conductivity graphene composite material is particularly suitable for being used as radiating fins, heating fins and the like, and has the characteristics of easiness in processing and forming, low cost, good radiating or heating effect and the like.
Detailed Description
In order that those skilled in the art will better understand the technical solutions of the present invention, the following description of the preferred embodiments of the present invention is provided in connection with specific examples, which should not be construed as limiting the present patent.
The test methods or test methods described in the following examples are conventional methods unless otherwise specified; the reagents and materials, unless otherwise indicated, are conventionally obtained commercially or prepared by conventional methods.
Example 1:
the high-thermal-conductivity graphene composite material is prepared from the following raw materials in parts by weight:
30 parts of polypropylene powder, 12 parts of graphene, 22 parts of heat-conducting filler, 2 parts of dispersing agent, 3 parts of glass fiber and 4 parts of maleic anhydride grafted polypropylene;
the heat-conducting filler is at least one of aluminum oxide, graphite powder, boron nitride, aluminum nitride and aluminum powder.
In this embodiment, the heat conductive filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder.
In this embodiment, the heat conductive filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder, and the mass ratio of the heat conductive filler to the aluminum oxide, the aluminum nitride and the aluminum powder is 10: 18: 6.
in this example, the thermal conductivity of the aluminum nitride was 260 w/m.k.
In this embodiment, the alumina is nano alumina.
In this example, the dispersant is dispersant HT-5040.
In this embodiment, the graphene is a nanographene microchip.
In this embodiment, the preparation method of the high thermal conductivity graphene composite material includes the following steps:
A. respectively weighing polypropylene powder, graphene, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene according to parts by weight for later use;
B. putting the polypropylene powder and the graphene into a high-speed mixer, and uniformly mixing at a high speed to obtain a primary mixture;
C. and feeding the primary mixture, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene into a double-screw extruder, carrying out melt mixing, extruding, granulating and cooling to obtain the high-heat-conductivity graphene composite material.
Example 2:
the high-thermal-conductivity graphene composite material is prepared from the following raw materials in parts by weight:
45 parts of polypropylene powder, 22 parts of graphene, 12 parts of heat-conducting filler, 3 parts of dispersant, 4 parts of glass fiber and 7 parts of maleic anhydride grafted polypropylene;
the heat-conducting filler is at least one of aluminum oxide, graphite powder, boron nitride, aluminum nitride and aluminum powder.
In this embodiment, the heat conductive filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder.
In this embodiment, the heat conductive filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder, and the mass ratio of the heat conductive filler to the aluminum oxide, the aluminum nitride and the aluminum powder is 10: 21: 7.5.
in this example, the thermal conductivity of the aluminum nitride was 280 w/m.k.
In this embodiment, the alumina is nano alumina.
In this example, the dispersant is dispersant HT-5040.
In this embodiment, the graphene is a nanographene microchip.
In this embodiment, the preparation method of the high thermal conductivity graphene composite material includes the following steps:
A. respectively weighing polypropylene powder, graphene, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene according to parts by weight for later use;
B. putting the polypropylene powder and the graphene into a high-speed mixer, and uniformly mixing at a high speed to obtain a primary mixture;
C. and feeding the primary mixture, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene into a double-screw extruder, carrying out melt mixing, extruding, granulating and cooling to obtain the high-heat-conductivity graphene composite material.
Example 3:
the high-thermal-conductivity graphene composite material is prepared from the following raw materials in parts by weight:
38 parts of polypropylene powder, 17 parts of graphene, 20 parts of heat-conducting filler, 2.5 parts of dispersant, 3.5 parts of glass fiber and 5.6 parts of maleic anhydride grafted polypropylene;
the heat-conducting filler is at least one of aluminum oxide, graphite powder, boron nitride, aluminum nitride and aluminum powder.
In this embodiment, the heat conductive filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder.
In this embodiment, the heat conductive filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder, and the mass ratio of the heat conductive filler to the aluminum oxide, the aluminum nitride and the aluminum powder is 10: 19.5: 6.8.
in this example, the thermal conductivity of the aluminum nitride was 270 w/m.k.
In this embodiment, the alumina is nano alumina.
In this example, the dispersant is dispersant HT-5040.
In this embodiment, the graphene is a nanographene microchip.
In this embodiment, the preparation method of the high thermal conductivity graphene composite material includes the following steps:
A. respectively weighing polypropylene powder, graphene, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene according to parts by weight for later use;
B. putting the polypropylene powder and the graphene into a high-speed mixer, and uniformly mixing at a high speed to obtain a primary mixture;
C. and feeding the primary mixture, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene into a double-screw extruder, carrying out melt mixing, extruding, granulating and cooling to obtain the high-heat-conductivity graphene composite material.
Example 4:
the high-thermal-conductivity graphene composite material is prepared from the following raw materials in parts by weight:
40 parts of polypropylene powder, 20 parts of graphene, 16 parts of heat-conducting filler, 2.8 parts of dispersant, 3.6 parts of glass fiber and 6 parts of maleic anhydride grafted polypropylene;
the heat-conducting filler is at least one of aluminum oxide, graphite powder, boron nitride, aluminum nitride and aluminum powder.
In this embodiment, the heat conductive filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder.
In this embodiment, the heat conductive filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder, and the mass ratio of the heat conductive filler to the aluminum oxide, the aluminum nitride and the aluminum powder is 10: 19: 6.5.
in this example, the thermal conductivity of the aluminum nitride was 270 w/m.k.
In this embodiment, the alumina is nano alumina.
In this example, the dispersant is dispersant HT-5040.
In this embodiment, the graphene is a nanographene microchip.
In this embodiment, the preparation method of the high thermal conductivity graphene composite material includes the following steps:
A. respectively weighing polypropylene powder, graphene, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene according to parts by weight for later use;
B. putting the polypropylene powder and the graphene into a high-speed mixer, and uniformly mixing at a high speed to obtain a primary mixture;
C. and feeding the primary mixture, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene into a double-screw extruder, carrying out melt mixing, extruding, granulating and cooling to obtain the high-heat-conductivity graphene composite material.
The following performance tests were performed on the high thermal conductivity graphene composite materials obtained in examples 1 to 4 of the present invention and the comparative example, and the test results are shown in table 1:
the high thermal conductivity graphene composite materials obtained in examples 1 to 4 and a comparative example (pure PP powder) were respectively prepared into standard sample strips, and each performance test was performed, and the test results are shown in table 1.
TABLE 1
As can be seen from the above table, the high thermal conductivity graphene composite material of the present invention has the following advantages: the heat conductivity coefficient is high, and the heat conductivity is good; the tensile strength is high and is equivalent to or even higher than that of a pure PP material; and the bending strength is high, and the material is equivalent to a pure PP material, and has good bending resistance and comprehensive mechanical properties.
The high-thermal-conductivity graphene composite material disclosed by the invention is prepared by selecting raw materials, optimizing the content of each raw material, and selecting polypropylene powder, graphene, a thermal-conductivity filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene in a proper proportion, so that the respective advantages are fully exerted, the components are mutually supplemented and mutually promoted, the raw material cost is optimized, the problems of uneven mixing and blending caused by the raw materials are reduced, the quality stability of a product is improved, the prepared high-thermal-conductivity graphene composite material is high in thermal conductivity and good in thermal conductivity, can meet the requirements of applications such as heat dissipation or heating, and can replace metal materials to a certain extent as a thermal-conductivity material; the tensile strength is high and is equivalent to or even higher than that of a pure PP material; and the bending strength is high, the material is equivalent to a pure PP material, the bending resistance is good, the comprehensive mechanical property is good, the material is not easy to damage in the using process, and the service life is long.
In the raw materials of the high-thermal-conductivity graphene composite material, the polypropylene powder and other components such as graphene are compounded, so that the polypropylene powder and the graphene are more easily and uniformly mixed, the problem that the graphene is difficult to be uniformly mixed with a matrix material is solved, the raw materials can be well and uniformly mixed, and the performance of the high-thermal-conductivity graphene composite material is ensured.
In the raw materials of the high-thermal-conductivity graphene composite material, the glass fiber mainly plays a role in reinforcement and is matched with other components to play a good synergistic effect, so that the high-thermal-conductivity graphene composite material has good comprehensive mechanical property, is not easy to damage in the using process and has long service life.
In the raw materials of the high-thermal-conductivity graphene composite material, the maleic anhydride grafted polypropylene mainly plays a toughening role and a solubilizer role, and is matched with other components to play a good synergistic role, so that the bending strength of the high-thermal-conductivity graphene composite material is greatly improved, the comprehensive mechanical property is ensured to be good, the high-thermal-conductivity graphene composite material is not easy to damage in the using process, and the service life is long.
In the raw materials of the high-thermal-conductivity graphene composite material, the thermal conductive filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder. The heat-conducting filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder, and the mass ratio of the aluminum oxide to the aluminum nitride to the aluminum powder is 10: (18-21): (6-7.5). Through a large number of experiments, the inventor finds that the heat-conducting filler with the proportion can greatly improve the heat conductivity coefficient of the high-heat-conductivity graphene composite material, remarkably improve the heat-conducting property, is easy to be uniformly dispersed in the raw material system, and also ensures good comprehensive mechanical property, difficult damage in the using process and long service life.
In the raw material of the high-thermal-conductivity graphene composite material, the thermal conductivity coefficient of the aluminum nitride is 260-280 w/m.k. Through a large number of experiments, the inventor finds that the heat conductivity coefficient of the high-heat-conductivity graphene composite material can be further improved and the heat conductivity can be further improved by selecting the high-heat-conductivity aluminum nitride;
in the raw materials of the high-thermal-conductivity graphene composite material, the dispersing agent is HT-5040. Through a large number of experiments, the inventor finds that the dispersant HT-5040 can better enable graphene, heat-conducting filler, dispersant and glass fiber to be uniformly dispersed in polypropylene and maleic anhydride grafted polypropylene in the raw material system of the high-heat-conductivity graphene composite material, so that the heat-conducting property and the mechanical property of the high-heat-conductivity graphene composite material are ensured.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and these modifications and adaptations should be considered within the scope of the invention.
Claims (10)
1. The high-thermal-conductivity graphene composite material is characterized by being prepared from the following raw materials in parts by weight:
30-45 parts of polypropylene powder, 12-22 parts of graphene, 12-22 parts of heat-conducting filler, 2-3 parts of dispersing agent, 3-4 parts of glass fiber and 4-7 parts of maleic anhydride grafted polypropylene;
the heat-conducting filler is at least one of aluminum oxide, graphite powder, boron nitride, aluminum nitride and aluminum powder.
2. The graphene composite material with high thermal conductivity according to claim 1, wherein the graphene composite material with high thermal conductivity is prepared from the following raw materials in parts by weight: 38 parts of polypropylene powder, 17 parts of graphene, 20 parts of heat-conducting filler, 2.5 parts of dispersant, 3.5 parts of glass fiber and 5.6 parts of maleic anhydride grafted polypropylene;
the heat-conducting filler is at least one of aluminum oxide, graphite powder, boron nitride, aluminum nitride and aluminum powder.
3. The graphene composite material with high thermal conductivity according to claim 1, wherein the graphene composite material with high thermal conductivity is prepared from the following raw materials in parts by weight: 40 parts of polypropylene powder, 20 parts of graphene, 16 parts of heat-conducting filler, 2.8 parts of dispersant, 3.6 parts of glass fiber and 6 parts of maleic anhydride grafted polypropylene;
the heat-conducting filler is at least one of aluminum oxide, graphite powder, boron nitride, aluminum nitride and aluminum powder.
4. The graphene composite material with high thermal conductivity according to any one of claims 1 to 3, wherein the thermally conductive filler is a mixture of aluminum oxide, aluminum nitride and aluminum powder.
5. The graphene composite material with high thermal conductivity according to claim 4, wherein the mixture of the aluminum oxide, the aluminum nitride and the aluminum powder is used as the thermal conductive filler, and the mass ratio of the aluminum oxide, the aluminum nitride and the aluminum powder is 10: (18-21): (6-7.5).
6. The graphene composite material with high thermal conductivity as claimed in claim 5, wherein the thermal conductivity of the aluminum nitride is 260-280 w/m-k.
7. The graphene composite material with high thermal conductivity according to claim 6, wherein the alumina is nano alumina.
8. The graphene composite material with high thermal conductivity according to claim 4, wherein the dispersant is dispersant HT-5040.
9. The graphene composite material with high thermal conductivity according to claim 4, wherein the graphene is nano graphene micro-sheets.
10. A method for preparing the high thermal conductivity graphene composite material according to any one of claims 5 to 9, comprising the following steps:
A. respectively weighing polypropylene powder, graphene, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene according to parts by weight for later use;
B. putting the polypropylene powder and the graphene into a high-speed mixer, and uniformly mixing at a high speed to obtain a primary mixture;
C. and feeding the primary mixture, a heat-conducting filler, a dispersing agent, glass fiber and maleic anhydride grafted polypropylene into a double-screw extruder, carrying out melt mixing, extruding, granulating and cooling to obtain the high-heat-conductivity graphene composite material.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2603010A (en) * | 2021-01-26 | 2022-07-27 | Colloids Ltd | A Fusion Welding Composition for High Efficiency Welding |
CN115286858A (en) * | 2022-08-23 | 2022-11-04 | 公元股份有限公司 | High-thermal-conductivity heat-resistant polyethylene pipe and processing method thereof |
WO2023089326A1 (en) * | 2021-11-18 | 2023-05-25 | Senergy Innovations Limited | Conductive polymer composite |
CN117924857A (en) * | 2024-01-17 | 2024-04-26 | 广东德创新材料有限公司 | Polytetrafluoroethylene-based low-thermal-resistance heat dissipation material and preparation method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105273309A (en) * | 2015-10-26 | 2016-01-27 | 李修兵 | Anti-static and flame-retardant graphene-based polypropylene composite and preparation method thereof |
CN108250583A (en) * | 2017-12-01 | 2018-07-06 | 青岛德通纳米技术有限公司 | A kind of heat conductive insulating PP lithium battery casing materials and preparation method thereof |
-
2020
- 2020-03-09 CN CN202010156653.4A patent/CN111378226A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105273309A (en) * | 2015-10-26 | 2016-01-27 | 李修兵 | Anti-static and flame-retardant graphene-based polypropylene composite and preparation method thereof |
CN108250583A (en) * | 2017-12-01 | 2018-07-06 | 青岛德通纳米技术有限公司 | A kind of heat conductive insulating PP lithium battery casing materials and preparation method thereof |
Non-Patent Citations (2)
Title |
---|
李建军主编: "《塑料配方设计》", 31 May 2019, 中国轻工业出版社 * |
薛云飞等编著: "《先进金属基复合材料》", 30 April 2019, 北京理工大学出版社 * |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2603010A (en) * | 2021-01-26 | 2022-07-27 | Colloids Ltd | A Fusion Welding Composition for High Efficiency Welding |
WO2023089326A1 (en) * | 2021-11-18 | 2023-05-25 | Senergy Innovations Limited | Conductive polymer composite |
CN115286858A (en) * | 2022-08-23 | 2022-11-04 | 公元股份有限公司 | High-thermal-conductivity heat-resistant polyethylene pipe and processing method thereof |
CN117924857A (en) * | 2024-01-17 | 2024-04-26 | 广东德创新材料有限公司 | Polytetrafluoroethylene-based low-thermal-resistance heat dissipation material and preparation method thereof |
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