CN111373489B - Slurry for PERC battery and preparation method of slurry - Google Patents

Slurry for PERC battery and preparation method of slurry Download PDF

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CN111373489B
CN111373489B CN201880047100.6A CN201880047100A CN111373489B CN 111373489 B CN111373489 B CN 111373489B CN 201880047100 A CN201880047100 A CN 201880047100A CN 111373489 B CN111373489 B CN 111373489B
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CN111373489A (en
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朱鹏
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Nantong T-Sun New Energy Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System

Abstract

The invention provides a slurry for a PERC battery and a preparation method of the slurry, wherein the slurry comprises a conductive phase, a glass phase and an organic binder, and the conductive phase comprises aluminum powder and aluminum alloy powder; the glass phase comprises glass powder and auxiliary glass powder, and the softening temperature of the auxiliary glass powder is higher than that of the glass powder. The slurry comprises: 65-73 parts by mass of aluminum powder, 3-10 parts by mass of aluminum alloy powder, 1.8-2.2 parts by mass of glass powder, 0.3-0.5 part by mass of auxiliary glass powder and 15-40 parts by mass of organic binder. The aluminum powder, the aluminum alloy powder, the glass powder, the auxiliary glass powder and the organic binder are mixed and then ground and dispersed, and the fineness of the slurry is not more than 15 mu m. The paste is suitable for the back metallization process of the PERC battery, simplifies the production process of the PERC battery, can burn through a passivation film to form stable aluminum-silicon contact, effectively controls back surface recombination, and has wide process adjustment window and stable performance.

Description

Slurry for PERC battery and preparation method of slurry
Technical Field
The invention relates to the field of solar cells and conductive paste, in particular to paste for a PERC cell and a preparation method of the paste.
Background
In order to deal with the dilemma of conventional energy exhaustion required in the future, the new energy industry has received more and more attention and attention in many countries and regions in recent years. The solar cell industry is rapidly developed under the background, and the crystalline silicon solar cell is still the most important product and technology development direction in the industry at present. In recent years, attention has been paid to passivation of a dielectric film used for the back surface of a Cell, and a thin film deposition manufacturing technique and equipment have become more mature, and with the introduction of a laser technique, the yield of a back surface passivation type solar Cell (hereinafter, referred to as "PERC Cell") has been increasing year by year. PERC cell pass passivation film (SiN) x 、SiO 2 、Al 2 O 3 Etc.) to reduce energy loss caused by recombination occurring at the back electrode of the battery, thereby improving conversion efficiency. Among them, the double-sided PERC battery is a new focus of attention in the industry at the present stage, but the process requirement is high, and the battery is now in useThe laser process is mostly adopted to open holes/grooves on the passivation film on the back surface, and then metallization is carried out to realize ohmic contact.
It is also disclosed in the art that the "corrosive slurry" is directly printed on the surface of the passivation layer, and the contact is formed by burning through the passivation layer in the high-temperature sintering process, so that the same effect as that of laser grooving is achieved. However, the back electrode paste needs to be formed by two times of printing, which increases the cost. In order to reduce the process requirement and the production cost, the industry also proposes to use the co-sintering slurry to form a back electrode and burn through a passivation layer to form good ohmic contact at the same time of forming the back electrode by one-time printing. The co-sintering slurry needs to react with a corresponding passivation film in a sintering stage, and also needs to control back surface recombination, so that higher process stability is needed.
Generally, the paste is prepared by uniformly stirring conductive phase powder, glass powder and an organic binder according to a predetermined ratio. In this case, the composition and the ratio of each part of the slurry need to be optimally designed, so as to develop and obtain a slurry with stable performance and suitable for the metallization process of the backside of the PERC battery.
Disclosure of Invention
The invention aims to provide a paste for a PERC battery and a preparation method of the paste, which are suitable for a back metallization process of the PERC battery, can simplify the production process of the PERC battery, and have wide process adjustment window and stable performance.
In order to achieve the above object, the present invention provides a paste for a PERC battery, comprising a conductive phase, a glass phase and an organic binder, wherein the conductive phase comprises aluminum powder and aluminum alloy powder, the glass phase comprises glass powder and auxiliary glass powder, and the softening temperature of the auxiliary glass powder is higher than that of the glass powder; the slurry comprises: 65-73 parts by mass of aluminum powder, 3-10 parts by mass of aluminum alloy powder, 1.8-2.2 parts by mass of glass powder, 0.3-0.5 part by mass of auxiliary glass powder and 15-40 parts by mass of organic binder.
As a further improvement of the invention, the aluminum powder and the aluminum alloy powder are both spherical particles, and the median particle size of the aluminum powder is 0.1-20 μm; the median particle size of the aluminum alloy powder is 0.5-5 μm.
As a further improvement of the invention, the glass powder comprises the following components in parts by mass: 30-90 parts of PbO and 5-25 parts of B 2 O 3 2-10 parts of SiO 2 5 to 20 parts of ZnO and 0.1 to 13 parts of M x O y Wherein, said M x O y Is Na 2 O、CaO、K 2 O and Li 2 At least one of O.
As a further improvement of the invention, the glass powder also comprises Al 2 O 3 CuO and P 2 O 5 At least one of (a).
As a further improvement of the invention, the auxiliary glass powder comprises Bi 2 O 3 、B 2 O 3 And ZnO of which the mass composition is Bi 2 O 3 ∶B 2 O 3 ∶ZnO=(3~7)∶(1.5~2.5)∶1。
As a further improvement of the invention, the auxiliary glass powder also comprises SiO 2 、Al 2 O 3 、CuO、TiO 2 、Cr 2 O 3 、NiO、Li 2 O and MnO 2 One or more of them.
As a further improvement of the invention, the median particle size of the glass powder is 0.5-5 μm; the median particle size of the auxiliary glass powder is 0.5-5 μm.
As a further improvement of the invention, the organic binder comprises organic resin, organic solvent and organic auxiliary agent; the organic resin is selected from one or more of ethyl cellulose, butyl acetate cellulose, phenolic resin, polyaldehyde and cellulose ether, and the mass ratio of the organic resin in the organic binder is 5-30%; the organic solvent is selected from one or more of acetone, terpineol, alcohol ester dodeca, butyl carbitol acetate, glycerol and diethylene glycol monobutyl ether, and the mass ratio of the organic solvent in the organic binder is 60-90%; the organic auxiliary agent comprises one or more of phosphate, phosphate salts, carboxylic acids and high-molecular alkyl ammonium salts, and the mass ratio of the organic auxiliary agent in the organic binder is 0.5-10%.
As a further improvement of the invention, the slurry also comprises a thixotropic agent, and the thixotropic agent comprises one or more of fumed silica, organic bentonite, modified hydrogenated castor oil, span-85 and polyamide wax.
The invention also provides a preparation method of the slurry, which mainly comprises the steps of mixing the aluminum powder, the aluminum alloy powder, the glass powder, the auxiliary glass powder and the organic binder according to a set proportion, grinding and dispersing, and ensuring that the fineness of the slurry is not more than 15 mu m.
The beneficial effects of the invention are: the paste for the PERC battery is suitable for the back metallization process of the PERC battery, can simplify the production process of the PERC battery, does not need laser hole forming/groove or secondary printing, and has wide process adjusting window and stable performance. The slurry can form better aluminum-silicon contact after being sintered, and back surface recombination is effectively controlled; besides, the battery piece adopting the slurry has good appearance after being sintered, and has small warping and bending.
Drawings
FIG. 1 is a schematic scanning electron microscope of glass powder in the paste according to the present invention;
FIG. 2 is a partial cross-sectional view of the back surface of a PERC cell made from the slurry of the present invention;
FIG. 3 is a schematic main flow diagram of a slurry preparation method of the present invention;
FIG. 4 is a schematic view of the main flow of the method for preparing glass frit from the paste according to the present invention.
Detailed Description
The invention provides a paste for a PERC battery, which is particularly suitable for a metallization process of a back surface electrode of a double-sided PERC battery, and the paste printed on the surface of the PERC battery can be mixed with SiN in a high-temperature sintering process x 、SiO 2 、Al 2 O 3 The film layers react and form a better ohmic contact in the corresponding area.
The paste comprises a conductive phase, a glass phase and an organic binder, wherein the conductive phase comprises aluminum powder and aluminum alloy powder, the glass phase comprises glass powder and auxiliary glass powder, and the softening temperature of the auxiliary glass powder is higher than that of the glass powder; the slurry comprises: 65-73 parts by mass of aluminum powder, 3-10 parts by mass of aluminum alloy powder, 1.8-2.2 parts by mass of glass powder, 0.3-0.5 part by mass of auxiliary glass powder and 15-40 parts by mass of organic binder.
The aluminum powder and the aluminum alloy powder are spherical particles, the median particle size of the aluminum powder is 0.1-20 micrometers, the more preferable particle size is 0.1-3 micrometers, the melting point of the aluminum powder is 450-650 ℃, the more preferable particle size is 500-600 ℃, and the slurry can be used by matching aluminum powders with different particle sizes. The median particle size of the aluminum alloy powder is 0.5-5 μm, more preferably 2-3 μm, and the melting point of the aluminum alloy powder is 400-600 ℃. The aluminum alloy powder is preferably binary or ternary alloy powder, and specifically, the aluminum alloy powder is one or more of aluminum-boron alloy, aluminum-silicon-boron alloy, aluminum-boron-antimony alloy and aluminum-magnesium alloy. In the high-temperature sintering process, the glass phase is firstly melted and infiltrated with aluminum powder and aluminum alloy powder, and the molten aluminum powder is shrunk by the surface tension of the glass phase to form a densified film layer when being cooled. The aluminum powder has small particle size, low melting point and high contraction pressure, and the aluminum alloy powder can avoid aluminum thorn protrusions from being formed on the surface of the film layer. In order to further improve the current transmission performance of the slurry after sintering and reduce series resistance, part of silver powder can be added into the conductive phase, and the median particle size of the silver powder is 0.1-5 mu m.
The glass powder comprises the following components in parts by mass: 30-90 parts of PbO and 5-25 parts of B 2 O 3 2-10 parts of SiO 2 5 to 20 parts of ZnO and 0.1 to 13 parts of M x O y . Wherein M is a first main group element or a second main group element, and M x O y In particular Na 2 O、CaO、K 2 O and Li 2 At least one of O. The softening temperature of the glass powder is 280-400 ℃, and preferably, the softening temperature of the glass powder is controlled to be 280-330 ℃. The glass powder has a low melting point, can be melted in advance in the sintering temperature rise process to fully infiltrate the conductive phase, and is fully settled to facilitate the wetting of the passivation film and the silicon substrate.
The median particle size of the glass powder is 0.5-5 mu m (shown in figure 1), the glass powder is in an amorphous granular shape, powder particles with larger particle sizes are preferably screened out in the actual preparation process, the possibility that the performance of the glass powder is influenced by possible crystal particles is avoided, and the quality of slurry is ensured.
SiO 2 And B 2 O 3 All can form a glass network structure, PbO can be connected with silicon-oxygen tetrahedrons to form a special network structure, so that PbO/SiO 2 The composition system has a wider glass forming area and enables PbO to have better fluxing property, wherein the PbO has a relatively higher proportion, so that the crystallization can be effectively avoided, and the softening temperature of the glass powder can be reduced. B 2 O 3 Low self-melting point, favorable for lowering softening temperature of glass powder and inhibiting expansion coefficient of glass, B 2 O 3 And also to provide the glass with proper fluidity after melting. The ZnO component also contributes to lowering of the melting point of the glass frit and can suppress an increase in the expansion coefficient of the glass, and can be used for adjusting the fluidity of the glass after melting. Except that, M x O y The glass network structure can be damaged in the glass smelting process, the viscosity of the glass feed liquid in a molten state is reduced, and the uniform smelting of glass is facilitated.
The glass powder also comprises Al 2 O 3 CuO and P 2 O 5 At least one of (1). Al (Al) 2 O 3 Can replace partial SiO 2 Increasing the chemical stability and acid resistance of the glass powder preparation process, and Al 2 O 3 Mass composition ratio is less than SiO 2 Half of that. P is 2 O 5 The CuO can break the glass network structure, and the chemical stability of the glass powder is not influenced by the addition of a small amount of CuO.
The auxiliary glass powder comprises Bi 2 O 3 、B 2 O 3 And ZnO of which the mass composition is Bi 2 O 3 ∶B 2 O 3 ZnO (3-7): (1.5-2.5): (1). The median particle size of the auxiliary glass powder is 0.5-5 mu m, the softening temperature of the auxiliary glass powder is controlled at 380-500 ℃, and furthermore, the auxiliary glass powderThe median particle size of the auxiliary glass powder is preferably 2-5 mu m, and the softening temperature is preferably 400-450 ℃. The softening temperature of the auxiliary glass powder is higher than that of the glass powder, so that the auxiliary glass powder and the glass powder are prevented from melting and settling together to form a thick glass layer, and the series resistance is increased.
Bi 2 O 3 As a better substitute component of PbO, the compound has the functions of reducing the softening temperature of the glass powder and inhibiting the adjustment of the expansion coefficient of the glass, and can also increase the specific gravity of the auxiliary glass powder, thereby being beneficial to the uniform action of the auxiliary glass powder on a conductive phase in the slurry sintering process. Furthermore, the auxiliary glass powder also comprises SiO 2 、Al 2 O 3 、CuO、TiO 2 、Cr 2 O 3 、NiO、Li 2 O and MnO 2 One or more of them. The glass powder and the auxiliary glass powder can be mixed according to a set proportion to obtain a corresponding glass powder composition, so that the slurry production and material management and control are facilitated.
The organic binder comprises organic resin, an organic solvent and an organic auxiliary agent, wherein the organic resin is one or more selected from ethyl cellulose, butyl acetate cellulose, phenolic resin, polyaldehyde and cellulose ether, and the mass ratio of the organic resin in the organic binder is 5-30%; the organic solvent is selected from one or more of acetone, terpineol, alcohol ester dodeca, butyl carbitol acetate, glycerol and diethylene glycol monobutyl ether, and the mass ratio of the organic solvent in the organic binder is 60-90%; the mass ratio of the organic auxiliary agent in the organic binder is 0.5-10%, and the organic auxiliary agent comprises one or more of phosphate, phosphate salts, carboxylic acids and high-molecular alkyl ammonium salts. Besides, the slurry is further adjusted and optimized in performance of the organic binder by other auxiliaries such as a thixotropic agent and the like, wherein the thixotropic agent comprises one or more of fumed silica, organic bentonite, modified hydrogenated castor oil, span-85 and polyamide wax.
Optimization of the organic binder helps the paste to maintain better printing performance. According to practical tests, the paste can be used for printing uniform continuous grid lines with the minimum width of 27 mu m, and the corresponding grid lines have good aspect ratio and morphological characteristics.
Here, we provide examples 1-3 below, and compare them with comparative examples, and refer to fig. 2, which is a partial cross-sectional view of the back surface of the corresponding PERC cell of example 1. The comparative examples are conventional slurries, the examples 1 to 3 and the comparative examples are matched with crystalline silicon wafers of the same specification for printing and sintering to obtain corresponding double-sided PERC batteries and are subjected to electrical property tests, and the performance test comparison results of the examples 1 to 3 compared with the comparative examples are shown in the following table 1:
serial number [Voc(V)] [Is(A)] [FF(%)] [Eff(%)] [Rs] [IVRV2]
Example 1 High 3mV Keeping flat Keep flat Keeping flat Is higher than the original Keep flat
Example 2 High 3mV Is higher than the original Keeping flat Height 0.2 Keeping flat Keeping flat
Example 3 Low 1mV Keeping flat Keeping flat Height of 0.1 Is on the low side Slightly higher than
The slurry of the embodiment 1 comprises the following components in percentage by mass: 68 parts of aluminum powder with the particle size of 2-3 mu m; 5 parts of aluminum-silicon alloy powder, wherein the particle size is also 2-3 mu m; 5 parts of silver powder with the particle size of about 0.1-1 mu m; 2.5 parts of glass powder, 0.5 part of auxiliary glass powder and 19 parts of organic binder. Wherein the glass powder comprises PbO: B 2 O 3 ∶ZnO∶SiO 2 CaO in a ratio of 55: 20: 10: 5: 10, and the glass powder has a softening temperature of 290 ℃ and a median particle size of 2.7 mu m. Bi in the auxiliary glass powder 2 O 3 、B 2 O 3 The mass ratio of ZnO to ZnO is 36: 24: 13, the softening temperature of the auxiliary glass powder is 400 ℃, and the median particle size is 1.4 mu m.
Example 2 the slurry mass composition was: 65 parts of aluminum powder, wherein the aluminum powder specifically comprises two spherical powders with different particle sizes; 12.7 parts of aluminum-silicon alloy powder with the particle size of 2-3 mu m; 1.8 parts of glass powder, 0.5 part of auxiliary glass powder and 20 parts of organic binder. Wherein the glass powder comprises PbO and B 2 O 3 ∶ZnO∶SiO 2 ∶Li 2 O and CaO are 61: 20: 10: 3, the softening temperature of the glass powder is 320 DEG CThe median particle diameter was 3.6. mu.m. Bi in the auxiliary glass powder 2 O 3 、B 2 O 3 The mass ratio of ZnO to ZnO is 36: 24: 13, the softening temperature of the auxiliary glass powder is 420 ℃, and the median particle size is 2.2 mu m.
Example 3 the slurry mass composition was: 73 parts of aluminum powder with the particle size of 2-3 mu m; 4.8 parts of aluminum-silicon-boron alloy powder with the particle size of 2-3 mu m; 2.2 parts of glass powder, 0.3 part of auxiliary glass powder and 20 parts of organic binder. Wherein the glass powder comprises PbO and B 2 O 3 ∶ZnO∶SiO 2 ∶Na 2 O is 65: 18: 8: 3: 6, the softening temperature of the glass powder is 310 ℃, and the median particle size is 2.4 mu m. Bi in the auxiliary glass powder 2 O 3 、B 2 O 3 The mass ratio of ZnO to ZnO is 70: 20: 10, the softening temperature of the auxiliary glass powder is 390 ℃, and the median particle size is 1.8 mu m.
The invention also provides a preparation method of the slurry, which is shown in figure 3 and comprises the following steps:
weighing corresponding organic resin according to a given proportion, and gradually dissolving and dispersing the organic resin in an organic solvent;
measuring organic auxiliary agents and other auxiliary agents, and adding the organic auxiliary agents and other auxiliary agents into an organic solvent to obtain an organic binder with uniform texture;
and then adding the aluminum powder, the aluminum alloy powder, the glass powder and the auxiliary glass powder into an organic binder according to a set proportion, mixing, and then grinding and dispersing by a three-roller machine, wherein the fineness of the slurry is not more than 15 mu m.
Referring to fig. 4, the preparation method of the glass powder and the auxiliary glass powder is as follows:
weighing raw materials, uniformly mixing the raw materials, placing the mixture into a constant-temperature drying oven, and drying for 2-5 hours, wherein the temperature of the constant-temperature drying oven is set to be 150-250 ℃;
transferring the dried raw materials into a crucible, and then placing the crucible containing the raw materials into a heating chamber to be smelted according to a set program;
cooling the smelted feed liquid by a cold roll to obtain a glass material;
and crushing and screening the glass frit to obtain the glass powder.
Preferably, during the melting process, a protective gas, such as N2 or other inert gas, may be introduced into the heating chamber to prevent the valence state of the glass frit components from changing, and to form more stable compounds; the crucible adopts a platinum crucible to reduce the introduction of impurities. The set program comprises a temperature rise stage and a heat preservation stage, wherein the temperature of the heat preservation stage is set to be 950-1050 ℃, and the duration of the heat preservation stage is set to be 1-2 hours. Except that, adopt the hierarchical screening system of jet milling to smash and sieve the frit after cooling to make glass powder, the supplementary glass powder that makes more even, the particle size span is little, can reduce the introduction of impurity simultaneously.
In other embodiments of the present invention, the uniformly mixed raw materials may also be directly filled into the crucible and then dried, thereby reducing intermediate operation processes. The melted feed liquid can be cooled by deionized water and then crushed by ball milling, and the detailed process is not repeated.
In summary, the glass frit has a low softening temperature and a small expansion coefficient, and the prepared paste is suitable for a back metallization process of a PERC cell. The paste can simplify the production process of the PERC battery, does not need laser drilling/grooving or secondary printing, and has wide process adjusting window and stable performance. In addition, the slurry can form better aluminum-silicon contact after being sintered, so that the back surface recombination is effectively controlled, and the electrical property is balanced; the battery piece adopting the slurry has good appearance after being sintered, smaller warping and bending and better application prospect.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is merely a detailed description of possible embodiments of the present invention, and it is not intended to limit the scope of the invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are intended to be included within the scope of the present invention.

Claims (1)

1. A paste for a PERC cell comprising a conductive phase, a glass phase and an organic binder, characterized in that: the conductive phase comprises aluminum powder and aluminum alloy powder, the glass phase comprises glass powder and auxiliary glass powder, the softening temperature of the auxiliary glass powder is higher than that of the glass powder, and the slurry comprises: 65-73 parts by mass of aluminum powder, 3-10 parts by mass of aluminum alloy powder, 1.8-2.2 parts by mass of glass powder, 0.3-0.5 part by mass of auxiliary glass powder and 15-40 parts by mass of organic binder;
the aluminum powder and the aluminum alloy powder are spherical particles, and the median particle size of the aluminum powder is 0.1-20 mu m; the median particle size of the aluminum alloy powder is 0.5-5 mu m;
the glass powder comprises the following components in parts by mass: 30-90 parts of PbO and 5-25 parts of B 2 O 3 2-10 parts of SiO 2 5 to 20 parts of ZnO and 0.1 to 13 parts of M x O y Wherein, said M x O y Is Na 2 O、CaO、K 2 O and Li 2 At least one of O;
the glass powder also comprises Al 2 O 3 CuO and P 2 O 5 At least one of;
the auxiliary glass powder comprises Bi 2 O 3 、B 2 O 3 And ZnO of which the mass composition is Bi 2 O 3 :B 2 O 3 :ZnO=(3~7):(1.5~2.5):1;
The auxiliary glass powder also comprises SiO 2 、Al 2 O 3 、CuO、TiO 2 、Cr 2 O 3 、NiO、Li 2 O and MnO 2 One or more of the above;
the median particle size of the glass powder is 0.5-5 mu m; the median particle size of the auxiliary glass powder is 0.5-5 mu m;
the organic binder comprises organic resin, an organic solvent and an organic auxiliary agent; the organic resin is selected from one or more of ethyl cellulose, phenolic resin, condensed aldehyde and cellulose ether, and the mass ratio of the organic resin in the organic binder is 5-30%;
the organic solvent is selected from one or more of acetone, terpineol, alcohol ester dodeca, butyl carbitol acetate, glycerol and diethylene glycol monobutyl ether, and the mass ratio of the organic solvent in the organic binder is 60-90%;
the organic auxiliary agent comprises one or more of phosphate, phosphate salts, carboxylic acids and high-molecular alkyl ammonium salts, and the mass ratio of the organic auxiliary agent in the organic binder is 0.5-10%;
the slurry also comprises a thixotropic agent, wherein the thixotropic agent contains one or more of fumed silica, organic bentonite, modified hydrogenated castor oil, span-85 and polyamide wax;
the fineness of the slurry is not more than 15 mu m.
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CN114551000B (en) * 2022-01-28 2023-08-15 广州市儒兴科技股份有限公司 Narrow-linewidth double-sided PERC aluminum paste and preparation method thereof
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