CN111362570A - Method for laser processing glass sheet and method and system for laser processing glass sheet chamfer - Google Patents
Method for laser processing glass sheet and method and system for laser processing glass sheet chamfer Download PDFInfo
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- CN111362570A CN111362570A CN202010053221.0A CN202010053221A CN111362570A CN 111362570 A CN111362570 A CN 111362570A CN 202010053221 A CN202010053221 A CN 202010053221A CN 111362570 A CN111362570 A CN 111362570A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
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Abstract
The invention provides a method for processing a glass sheet by laser and a method and a system for processing a chamfer of the glass sheet by laser, wherein the method for processing the chamfer of the glass sheet by laser comprises the following steps: scribing a glass sample contour line and an alignment mark on the whole glass substrate by adopting laser; transferring the scribed substrate to a galvanometer scanning laser system, grabbing an alignment mark by using a camera, and after alignment, performing multiple scanning on the cutting line by using the galvanometer scanning system to complete chamfering by multiple scanning of multiple groups of isomorphic scanning lines. Each group of scanning lines consists of a plurality of homomorphic lines which are homomorphic with the cutting lines and have equal intervals. The number of each group of scanning lines is gradually reduced according to the sequential processing sequence until the number of the scanning lines is 1. The accurate control of the chamfer angle and the chamfer size is realized by setting the laser power, the spot size, the scanning speed, the scanning times of each group of scanning lines and the number of conformal scanning lines. Meanwhile, the method of machining the glass sheet by the laser of chamfering and then demolding is adopted, and the method has the characteristics of high machining efficiency, high precision, strong adaptability and the like.
Description
Technical Field
The invention relates to the field of laser micromachining, in particular to a method for machining a glass sheet by laser and a method and a system for machining a chamfer of the glass sheet by laser.
Background
With the development and popularization of personal consumer electronics, devices such as smart phones and tablet computers are widely used, and a glass cover plate is needed to protect a camera in the devices. Therefore, there is a great demand for a camera glass cover plate. In order to make apron simple to operate to and reduce and collide with and lead to the apron from the cracked risk in edge, generally need carry out the chamfer to camera glass apron and handle. The common chamfering treatment mode mainly comprises methods of mechanical polishing, chemical corrosion and the like. The mechanical polishing and grinding speed is low, and the precision is low; the chemical etching method requires toxic and volatile hydrofluoric acid, so that the production conditions are high, and the waste liquid pollutes the environment.
Disclosure of Invention
The invention aims to provide a method for processing a glass sheet by laser, a method for processing a chamfer of the glass sheet by laser and a system thereof, aiming at solving the problems of low mechanical polishing speed, low precision, environmental pollution caused by chemical corrosion and the like.
The realization method of the invention is as follows:
the invention provides a method for processing a chamfer of a glass sheet by laser, which comprises the following steps:
scribing a glass sample outline and an alignment mark on a glass substrate to form a sample to be processed;
placing a sample to be processed under a galvanometer scanning laser system, setting scanning lines scanned by a galvanometer of the galvanometer scanning laser system into a plurality of groups of isomorphic scanning lines, grabbing an alignment mark on the sample to be processed by using a camera, calculating the global coordinate of the current sample, and ensuring that the scanning lines are aligned with cutting lines;
the method is characterized in that a galvanometer scanning laser system is used for scanning a plurality of groups of isomorphic scanning lines for a plurality of times on a cutting line of a sample to be processed to complete chamfering, and the accurate control on the chamfering size and the chamfering angle can be realized by setting the laser power, the spot size, the scanning speed, the scanning times of each group of scanning lines and the number of isomorphic scanning lines.
The laser used for scanning the line is a general Gaussian beam.
And capturing the alignment mark on the sample to be processed by using a camera, calculating to obtain the global coordinate of the sample, and determining the position and the placing direction of the scanning line according to the coordinate data so as to ensure the alignment of the scanning line and the cutting line. And knowing the global coordinate of the sample, the center of the cutting line can be obtained through calculation, and the software sets the position and the placing direction of each scanning line, so that the concentricity can be kept.
The center of each set of conformal scan lines remains concentric with the cut line and does not rotate.
Furthermore, the galvanometer scanning laser system comprises a laser and a scanning galvanometer, wherein a laser beam emitted by the laser passes through the beam expanding lens and then is emitted to the scanning galvanometer, and the scanning galvanometer is used for deflecting the laser beam and then emitting the laser beam to a sample to be processed from the field lens.
Further, the sample to be processed is placed on a sample stage.
Further, each set of scanning lines is composed of a plurality of isomorphic lines which are isomorphic with the cutting lines and have equal or unequal intervals.
Further, the number of each group of scanning lines is gradually reduced according to the sequential processing sequence until the number of the scanning lines is one.
Further, a glass sample contour and an alignment mark are scribed on the glass substrate by using a Bessel light beam, and the alignment mark is positioned outside the sample contour.
Furthermore, the alignment marks are positioned at four top corners of a rectangle surrounding the contour line of the glass sample; the alignment marks are cross or orthogonal racetrack patterns.
Further, the laser is an ultrafast laser; the ultrafast laser is picosecond laser or femtosecond laser; the laser wavelength is near red laser or visible laser or ultraviolet laser.
The invention discloses a method for processing a glass sheet by laser, which comprises the following steps:
processing the chamfer angle of the glass sheet by adopting the method;
and demolding after chamfering to obtain the processed glass cover plate.
The invention discloses a system for processing a glass sheet chamfer by laser, which comprises a galvanometer scanning laser system, a camera and a sample table for bearing a sample to be processed, wherein scanning lines scanned by a galvanometer of the galvanometer scanning laser system are set into a plurality of groups of homomorphic scanning lines, the homomorphic scanning lines are used for scanning cutting lines for a plurality of times to complete the chamfer, and the camera is used for grabbing an alignment mark on the sample to be processed on the sample table, obtaining the position coordinate of the sample to be processed, ensuring the alignment of the scanning lines and the cutting lines, and ensuring that the centers of the homomorphic scanning lines and the cutting lines are concentric and do not rotate. The non-rotation means that the placing direction of the scanning line is consistent with the cutting line on the glass sample and the scanning line is concentrically placed.
The galvanometer scanning laser system comprises a laser and a scanning galvanometer, wherein a laser beam emitted by the laser passes through the beam expanding mirror and then is emitted to the scanning galvanometer, and the scanning galvanometer is used for projecting the laser beam to the upper end surface or the lower end surface of a sample to be processed from the field lens after deflecting the laser beam.
Compared with the prior art, the invention has the following beneficial effects:
the method adopts Bessel beams to scratch the outline of a glass sample and an alignment mark on a glass substrate; and transferring the scribed substrate to a galvanometer scanning laser system, grabbing an alignment mark by using a camera, and after alignment by software, performing multiple scanning on the Bessel cutting line by using the galvanometer scanning system to complete chamfering by using multiple groups of isomorphic scanning lines. Each group of scanning lines consists of a plurality of conformal lines which are conformal with the Bezier cutting lines and have equal intervals. The number of each group of scanning lines is gradually reduced according to the sequential processing sequence until the number of the scanning lines is 1. The invention can realize the accurate control of the processing efficiency, the chamfer angle and the chamfer angle by setting the laser power density, the scanning speed, the scanning times of each group of scanning lines and the number of conformal scanning lines. The chamfering method is simple, has high accuracy, is convenient for adjusting the chamfer size and angle, is green, environment-friendly and free of chemical pollution, and can be widely applied to processing and producing products such as glass cover plates, glass protection sheets and glass openings of various consumer electronic products.
According to the invention, the camera is used for respectively acquiring the images of the alignment marks, the position coordinates of the glass substrate can be obtained through software calculation, and the software determines the positions of the scanning lines according to the position coordinates, so that the centers of all groups of scanning lines and the Bessel cutting line can be kept concentric without rotation.
The method for processing the glass sheet by the laser is completed by processing the V-shaped groove on the cutting line based on the ultrafast laser, and is more environment-friendly compared with a processing method based on chemical corrosion; meanwhile, compared with chamfering methods such as mechanical polishing after demolding and the like, the chamfering method adopting chamfering and demolding is more accurate. The cutting width is controlled by setting isomorphic scanning lines with different numbers and different intervals on different depth planes during chamfering, and complicated operations such as repeated focusing, power compensation and the like are not needed when the cutting planes with different depths are changed. The chamfering method provided by the invention is simple and easy to operate, has high precision, can control the cutting depth and the chamfering angle by adjusting the processing parameters, and is suitable for various processing scenes such as cutting and chamfering of glass camera cover plates, display screens, various through holes and the like of consumer electronics products such as mobile phones and the like.
Drawings
FIG. 1 is a schematic diagram of a sample contour line and an alignment mark provided by an embodiment of the present invention;
FIG. 2 is a schematic diagram of a system for laser processing a chamfer on a glass sheet according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of five conformal scan lines according to an embodiment of the present invention;
FIG. 4 is a top view of a chamfer provided by an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a chamfer provided by an embodiment of the present invention.
In the attached drawing, 1 is a laser, 2 is a beam expander, 3 is a scanning galvanometer, 4 is a camera, 5 is a field lens, and 6 is a sample stage.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a method for processing a chamfer of a glass sheet by laser, which comprises the following steps:
scribing a glass sample outline, namely a cutting line and an alignment mark, on a glass substrate to form a sample to be processed;
placing a sample to be processed under a galvanometer scanning laser system, setting scanning lines scanned by a galvanometer of the galvanometer scanning laser system into a plurality of groups of isomorphic scanning lines, grabbing an alignment mark on the sample to be processed by using a camera, calculating the position coordinate of the current sample, determining the position of the scanning lines according to the obtained position coordinate, and ensuring the alignment of the scanning lines and cutting lines;
the method is characterized in that a galvanometer scanning laser system is used for scanning a plurality of groups of isomorphic scanning lines for a plurality of times on a cutting line of a sample to be processed to complete chamfering, and the accurate control on the chamfering size and the chamfering angle can be realized by setting the laser power, the spot size, the scanning speed, the scanning times of each group of scanning lines and the number of isomorphic scanning lines.
In this example, a bezier 1064nm picosecond laser is used to cut a scribe line on a glass substrate to obtain the desired glass sample profile and alignment mark. The CAD pattern of the sample outline and the alignment mark is shown in figure 1, wherein the sample outline is in a runway shape, the alignment mark is a cross wire, the sample outline and the alignment mark are positioned on four vertex angles of a rectangular frame outside a sample outline, the cutting speed is 30mm/s, the laser repetition frequency is 100kHz, the laser power is 15W, the number of pulses is 1, and the position of a Bessel beam is set to ensure that a glass substrate can be completely cut through. The sample profile and the cross alignment mark use the same laser processing parameters.
The scribed substrate is then transferred to a galvanometer scanning laser system as shown in figure 2. The galvanometer laser scanning system comprises a picosecond laser 1, a beam expander 2, a scanning galvanometer 3, a camera 4, a field lens 5, a sample table 6 and the like, and the camera 4 is used for grabbing an alignment mark to obtain the position coordinate of the sample. Five groups of conformal scan lines are provided in this embodiment, as shown in fig. 3. In each group of isomorphic scanning lines, the distance between the scanning lines is 10 μm, and each group of isomorphic scanning lines sequentially decreases one from left to right and from top to bottom. The centers of the homographic scan lines of each group are arranged to be concentric with the Bezier cut line without rotation. It is necessary that each group of scanning lines have the same shape, and it is not necessary that the scanning pitches are equal, and it is a special case that the pitches are equal. Each group of scanning lines of the present embodiment is composed of a plurality of isomorphic lines which are isomorphic with the bezier cutting lines and have equal or unequal pitches.
The specific process of aligning the scanning line and the cutting line comprises the following steps:
1. moving the motion platform, and sequentially grabbing 3 alignment marks by using a camera;
2. calculating to obtain the position coordinates of 3 alignment marks through a software algorithm;
3. according to the design layout convention of the Bezier cutting line, the position coordinates of the Bezier cutting line and the placing direction of the cutting line at the moment can be calculated;
4. according to the position coordinates and the placing direction of the Bell cutting lines, the position coordinates and the placing direction of the chamfer scanning lines can be set in software and are consistent with that of the Bessel.
And then, the galvanometer 3 is used for scanning the Bessel cutting line for multiple times by multiple groups of homomorphic scanning lines to complete chamfering. The focal length of the field lens 5 is 100mm, the laser adopts a 1064nm picosecond laser 1, the laser repetition rate is 300kHz, the pulse energy is 50 muJ, and the number of pulses is 2. Each group of isomorphic scanning lines are sequentially used from left to right and from top to bottom, the scanning speed is 3000mm/s, and each group of isomorphic scanning lines scans 3 times. And turning over the sample, and chamfering the lower surface of the sample by the same method. The top and side views of the sample after scanning chamfering are shown in fig. 4 and 5, respectively, with the chamfer depths of the upper and lower surfaces being 47.44 μm and 50.16 μm, respectively, the chamfer widths being about 25 μm, and the chamfer angles being 27.8 ° and 26.5 °, respectively. Completely meets the processing requirements.
Further, the laser used for scribing and chamfering is an ultrafast laser, which can be a picosecond laser or a femtosecond laser, and the laser wavelength can be a near-red laser, a visible laser or even an ultraviolet laser. An infrared picosecond laser is generally adopted, the maximum average power is 30w, and the pulse repetition frequency is 100 KHz.
Further, the laser used for scribing is a bessel beam that can completely penetrate the substrate glass. The laser used for scanning the line is a general Gaussian beam.
Further, the alignment mark may be a cross, an orthogonal racetrack pattern, or the like. The alignment marks are located at the four corners of the rectangle surrounding the outline of the glass sample.
Furthermore, the scanning lines scanned by the galvanometer are a plurality of groups of homomorphic scanning lines, and the homomorphic scanning lines are used for scanning the cutting lines for multiple times to complete chamfering. Each group of scanning lines consists of a plurality of isomorphic lines which are isomorphic with the Bezier cutting lines and have equal intervals. The number of each group of scanning lines is gradually reduced according to the sequential processing sequence until the number of the scanning lines is 1.
The second embodiment discloses a method for laser processing a glass sheet, which comprises the following steps:
processing the chamfer angle of the glass sheet by the method of the first embodiment;
and demolding after chamfering to obtain the processed glass cover plate. In this example, a finished glass cover plate was obtained by a method such as demolding or scribing demolding of tempered glass.
EXAMPLE III
Referring to fig. 2, the embodiment discloses a system for laser processing of a glass sheet chamfer, which comprises a galvanometer scanning laser system, an off-axis camera 4 and a sample stage 6 for bearing a sample to be processed, wherein scanning lines scanned by the galvanometer of the galvanometer scanning laser system are set to be a plurality of groups of isomorphic scanning lines, the cutting lines are scanned for a plurality of times by utilizing the isomorphic scanning lines to complete the chamfer, the off-axis camera is used for grabbing an alignment mark on the sample to be processed on the sample stage, the global coordinate of the current sample can be calculated by utilizing software, the alignment of the scanning lines and the cutting lines can be ensured, and the centers of the isomorphic scanning lines and the bezier cutting lines are concentric and do not rotate. The laser beam is deflected by a galvanometer to realize scanning.
Further, the galvanometer scanning laser system comprises a laser 1 and a scanning galvanometer, wherein a laser beam emitted by the laser passes through the beam expander 2 and then is emitted to the scanning galvanometer 3, and the scanning galvanometer 3 is used for deflecting the laser beam and then emitting the laser beam to the upper end surface or the lower end surface of a sample to be processed from the field lens 5.
The invention can realize the accurate control of the processing efficiency, the chamfer angle and the chamfer angle by setting the laser power density, the scanning speed, the scanning times of each group of scanning lines and the number of isomorphic scanning lines. The chamfering method disclosed by the invention is simple, high in accuracy, small in edge breakage, convenient in adjustment of the chamfering size and angle, green, environment-friendly and free of chemical pollution, and is widely suitable for processing and producing glass cover plates, glass protection sheets, glass hole-forming products and other products of various consumer electronic products. The invention adopts the ultrafast laser chamfering method, can avoid adopting toxic chemical reagents, and has high processing precision, high speed and high efficiency.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A method for processing a chamfer of a glass sheet by laser is characterized by comprising the following steps:
scribing a glass sample outline, namely a cutting line and an alignment mark, on a glass substrate to form a sample to be processed;
placing a sample to be processed under a galvanometer scanning laser system, setting scanning lines scanned by a galvanometer of the galvanometer scanning laser system into a plurality of groups of isomorphic scanning lines, grabbing an alignment mark on the sample to be processed by using a camera, calculating the position coordinate of the current sample, determining the position of the scanning lines according to the obtained position coordinate, and ensuring the alignment of the scanning lines and cutting lines;
the method is characterized in that a galvanometer scanning laser system is used for scanning a plurality of groups of isomorphic scanning lines for a plurality of times on a cutting line of a sample to be processed to complete chamfering, and the accurate control on the chamfering size and the chamfering angle can be realized by setting the laser power, the spot size, the scanning speed, the scanning times of each group of scanning lines and the number of isomorphic scanning lines.
2. The method of laser processing a chamfer of a glass sheet according to claim 1, wherein: the galvanometer scanning laser system comprises a laser and a scanning galvanometer, wherein a laser beam emitted by the laser passes through a beam expanding lens and then is emitted to the scanning galvanometer, and the scanning galvanometer is used for deflecting the laser beam and then emitting the laser beam to a sample to be processed from a field lens; and placing a sample to be processed on a sample table.
3. The method of laser processing a chamfer of a glass sheet according to claim 1, wherein: each group of scanning lines consists of a plurality of homomorphic lines which are homomorphic with the cutting lines; the center of each set of conformal scan lines remains concentric with the cut line and does not rotate.
4. The method of laser processing a chamfer of a glass sheet according to claim 1 or 3, wherein: the number of each group of scanning lines is gradually reduced according to the sequence of processing until the scanning lines are one.
5. The method of laser processing a chamfer of a glass sheet according to claim 1, wherein: scribing a glass sample outline and an alignment mark on a glass substrate by adopting a Bessel beam; the alignment mark is located outside the outline of the sample.
6. The method of laser processing a chamfer of a glass sheet according to claim 1 or 5, wherein: the alignment marks are positioned at four top corners of a rectangle surrounding the contour line of the glass sample; the alignment marks are cross or orthogonal racetrack patterns.
7. The method of laser processing a chamfer of a glass sheet according to claim 1 or 5, wherein: the laser is ultrafast laser; the ultrafast laser is picosecond laser or femtosecond laser; the laser wavelength is near red laser or visible laser or ultraviolet laser.
8. A method of laser processing a glass sheet comprising the steps of:
processing a glass sheet chamfer using the method of claim 1;
and demolding after chamfering to obtain the processed glass cover plate.
9. The utility model provides a system for laser beam machining glass piece chamfer which characterized in that: the automatic chamfering device comprises a galvanometer scanning laser system, a camera and a sample table used for bearing a sample to be processed, scanning lines scanned by the galvanometer of the galvanometer scanning laser system are set to be multiple groups of isomorphic scanning lines, the cutting lines are scanned for multiple times by utilizing the isomorphic scanning lines to complete chamfering, the camera is used for grabbing alignment marks on the sample to be processed on the sample table, obtaining position coordinates of the sample to be processed, determining the position of the scanning lines according to the obtained position coordinates, and ensuring the alignment of the scanning lines and the cutting lines.
10. The system for laser processing a glass sheet chamfer of claim 9, wherein: the galvanometer scanning laser system comprises a laser and a scanning galvanometer, wherein a laser beam emitted by the laser passes through the beam expanding mirror and then is emitted to the scanning galvanometer, and the scanning galvanometer is used for projecting the laser beam to the upper end surface or the lower end surface of a sample to be processed from the field lens after deflecting the laser beam.
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| CN111843216A (en) * | 2020-07-22 | 2020-10-30 | 江苏亚威艾欧斯激光科技有限公司 | Glass substrate side processing device and processing method thereof |
| CN113399846A (en) * | 2021-06-01 | 2021-09-17 | 武汉先河激光技术有限公司 | Laser chamfering method and device for hard and brittle material |
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