CN111361390A - Temperature detection module, drive control module and vehicle-mounted air conditioner - Google Patents
Temperature detection module, drive control module and vehicle-mounted air conditioner Download PDFInfo
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- CN111361390A CN111361390A CN202010219723.6A CN202010219723A CN111361390A CN 111361390 A CN111361390 A CN 111361390A CN 202010219723 A CN202010219723 A CN 202010219723A CN 111361390 A CN111361390 A CN 111361390A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
- B60H1/00—Heating, cooling or ventilating [HVAC] devices
- B60H1/00507—Details, e.g. mounting arrangements, desaeration devices
- B60H1/00585—Means for monitoring, testing or servicing the air-conditioning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
- B60H1/00—Heating, cooling or ventilating [HVAC] devices
- B60H1/00642—Control systems or circuits; Control members or indication devices for heating, cooling or ventilating devices
- B60H1/00735—Control systems or circuits characterised by their input, i.e. by the detection, measurement or calculation of particular conditions, e.g. signal treatment, dynamic models
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
- B60H1/00—Heating, cooling or ventilating [HVAC] devices
- B60H1/00642—Control systems or circuits; Control members or indication devices for heating, cooling or ventilating devices
- B60H1/00735—Control systems or circuits characterised by their input, i.e. by the detection, measurement or calculation of particular conditions, e.g. signal treatment, dynamic models
- B60H1/00807—Control systems or circuits characterised by their input, i.e. by the detection, measurement or calculation of particular conditions, e.g. signal treatment, dynamic models the input being a specific way of measuring or calculating an air or coolant temperature
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Inverter Devices (AREA)
Abstract
The invention provides a temperature detection module, a drive control module and a vehicle-mounted air conditioner, wherein the temperature detection module comprises: circuit substrate and temperature detect circuit, temperature detect circuit sets up on circuit substrate, and temperature detect circuit includes: the temperature sensor interface comprises a first group of interfaces and a second group of interfaces, and the first group of interfaces are suitable for being connected with a plurality of external temperature sensors; one end of the first magnetic bead of any path is suitable for being connected with the second group of interfaces; and one end of each current-limiting resistor is suitable for being connected with the other end of the corresponding first magnetic bead, and the other end of each current-limiting resistor is suitable for outputting a temperature signal detected by the temperature sensor. Through the technical scheme of the invention, the interference signal can be prevented from being transmitted to the outside along the temperature sensor.
Description
Technical Field
The invention relates to the field of drive control, in particular to a temperature detection module, a drive control module and a vehicle-mounted air conditioner.
Background
In the related art, temperature sensors are arranged at different positions on a vehicle-mounted air conditioner to detect the position temperatures of the different positions, and the position temperatures are fed back to a driving control circuit of the vehicle-mounted air conditioner to adjust driving parameters of a load in the vehicle-mounted air conditioner, but the current temperature detection circuit has the defect of EMI (electromagnetic interference).
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
To this end, an object of the present invention is to propose a temperature detection module.
Another object of the present invention is to provide a driving control module.
It is still another object of the present invention to provide a vehicle air conditioner.
The technical solution of the first aspect of the present invention provides a temperature detection module, including: circuit substrate and temperature detect circuit, temperature detect circuit sets up on circuit substrate, and temperature detect circuit includes: the temperature sensor interface comprises a first group of interfaces and a second group of interfaces, and the first group of interfaces are suitable for being connected with a plurality of external temperature sensors; one end of the first magnetic bead of any path is suitable for being connected with the second group of interfaces; and one end of each current-limiting resistor is suitable for being connected with the other end of the corresponding first magnetic bead, and the other end of each current-limiting resistor is suitable for outputting a temperature signal detected by the temperature sensor.
In the technical scheme, the temperature sensor interface is installed on the circuit substrate and serves as a connection port between the temperature sensor which is arranged outside and used for collecting the temperature signal and the temperature detection circuit on the circuit substrate, the magnetic bead is added in the temperature detection circuit, namely the first magnetic bead, and the magnetic bead is arranged between the temperature sensor and the current-limiting resistor at the rear end, so that high-frequency interference (more than 30 MHz) occurring on the circuit substrate can be filtered or limited on the circuit substrate, interference signals can be prevented from being transmitted to the outside along the temperature sensor, and then the electric appliance adopting the temperature detection module can be reduced, for example, electromagnetic interference generated by a vehicle-mounted air conditioner.
If a plurality of temperature sensors need to be connected, the detection lines in the temperature detection circuit also have multiple paths, and each detection line at least comprises a first magnetic bead and a current-limiting resistor, so that the temperature signals detected by the temperature sensors are independently output in the form of current or voltage by each detection line through the temperature sensor interfaces, the first magnetic beads and the current-limiting resistors and serve as temperature signals at specified positions, for example, the first detection line detects the outdoor environment temperature, and the second detection line detects the exhaust temperature of the compressor.
In addition, it can be understood by those skilled in the art that the temperature sensor may not be disposed on the circuit substrate, but connected to a temperature sensor interface on the circuit substrate through a flexible wire, so that the temperature sensor detects the temperature of different positions when mounted at different positions.
In the above technical solution, the temperature sensor interface further includes a third group of interfaces, and the temperature detection circuit further includes: and one end of the second magnetic bead is connected to the third group of interfaces, and the other end of the second magnetic bead is connected to the direct-current power supply.
In this technical scheme, also set up the magnetic bead between DC power supply interface and temperature sensor interface, second magnetic bead promptly can further improve the suppression efficiency to electromagnetic interference outside propagation.
In any one of the above technical solutions, the method further includes: one end of any filter capacitor is connected to one end of the corresponding current-limiting resistor, and the other end of the filter capacitor is grounded.
In this technical scheme, temperature signal can transmit to appointed controller with voltage signal's form, through set up filter capacitor on every way detection circuitry to voltage signal to temperature sensor filters, on the one hand, can prevent that the interference signal in the voltage signal from causing the interference to the controller, and on the other hand, can filter the inside high frequency voltage interference signal of circuit substrate, in order to prevent to transmit to other places through the detection circuitry.
In any one of the above technical solutions, the method further includes: the voltage dividing resistors are arranged in a plurality of ways, and the voltage dividing resistor of any way is connected with the corresponding filter capacitor in parallel.
In the technical scheme, any path of divider resistor is connected in parallel with the corresponding filter capacitor, so that one end of the divider resistor is grounded, each path of divider resistor is suitable for forming a temperature measuring circuit with the corresponding temperature sensor, the temperature sensor is a temperature sensitive device, and the resistance value of the temperature sensor changes when the temperature changes, so that the voltage value between the divider resistor and the temperature sensor changes, and the temperature detection is realized.
In any one of the above technical solutions, the plurality of first magnetic beads and the plurality of second magnetic beads are disposed on the circuit substrate near the temperature sensor interface.
In any of the above technical solutions, a routing length between the interface of the dc power supply and the third group of interfaces is less than or equal to a reference length, the reference length is configured according to a reference coefficient and a shortest distance between the interface of the dc power supply and the third group of interfaces, and the reference coefficient is greater than or equal to 1 and less than or equal to 1.2.
In this technical scheme, first magnetic bead and second magnetic bead need be close to temperature sensor interface C installation as far as possible, because temperature sensor shares a 5 v's power supply line, the power supply line of event temperature sensor interface is walked line and is connected with less route to prevent that electromagnetic interference from getting into the detection circuitry again through the mode of coupling.
A second aspect of the present invention provides a drive control module, including: the temperature detection module defined in the technical solution of the first aspect comprises a circuit substrate and a temperature detection circuit; and the voltage-multiplying booster circuit and the temperature detection circuit are arranged on the same circuit substrate, or the voltage-multiplying booster circuit and the temperature detection circuit are arranged on different circuit substrates, the voltage-multiplying booster circuit comprises a controller and a plurality of paths of power switch tubes, the temperature detection circuit is suitable for being connected with the controller, and the controller is suitable for configuring switch control signals output to the power switch tubes according to temperature signals output by the temperature detection circuit.
Specifically, voltage doubling boost circuit is suitable for according to the operation of a plurality of loads of power supply signal drive, and voltage doubling boost circuit sets up on circuit substrate, and circuit substrate is provided with power source, and voltage doubling boost circuit includes: the input end of the first inductive element is suitable for being connected with the power interface; a plurality of parallel first capacitive elements adapted to be connected to the output of the first inductive element; and the second inductive elements are arranged in a plurality of ways and are suitable for being connected with the plurality of first capacitive elements, and the first capacitive elements are suitable for supplying power to the second inductive elements.
The multiple paths of second inductive elements are arranged on the circuit substrate side by side.
In the technical scheme, the first inductive element is specifically a common mode inductor, the first capacitive element is specifically an energy storage capacitor, the second inductive element is specifically a boost inductor, for example, two voltage-multiplying boost circuits are taken as two paths, the second inductive element (boost inductor) comprises two boost inductors, the two boost inductors are placed in parallel, and mutual interference between the inductors is favorably prevented, so that EMC (ElectroMagnetic Compatibility, namely the ability that equipment and a system can normally work in an ElectroMagnetic environment and cannot form ElectroMagnetic disturbance which cannot be borne by any things in the environment) optimization is realized, and therefore a filtering magnetic ring or a filtering capacitor for optimizing EMC is not required to be added.
In addition, the power interface is suitable for being connected with an alternating current power supply, and the energy storage inductor is suitable for supplying power to devices in the voltage-multiplying booster circuit at the rear end.
In the above technical solution, the power interface includes a positive power interface and a negative power interface, the input end of the first inductive element includes a first input end and a second input end, the first input end is suitable for being connected with the positive power interface by using a first section of wiring, the second input end is suitable for being connected with the negative power interface by using a second section of wiring, the first section of wiring and the second section of wiring are arranged in parallel, or a first included angle is defined between the first section of wiring and the second section of wiring, and the first included angle is greater than 0 ° and less than or equal to 5 °.
In the technical scheme, a line (a first line segment) from the positive power interface to the first input end of the common mode inductor and a line (a second line segment) from the negative power interface to the second input end of the common mode inductor are arranged in a parallel line mode, and the area formed by the two lines is very small, so that the electromagnetic field emitted by the two lines is very small, and the EMC optimization is further realized.
In addition, aiming at the arrangement mode that two wires are not completely parallel, the included angle between the two wires can be limited to be not more than 5 degrees, the two wires are parallel or the included angle is less than or equal to 5 degrees, and the arrangement mode is within the protection range of the application.
In any of the above technical solutions, the first inductive element includes a first output end and a second output end, a trace between the first output end and the positive electrode of the first capacitive element is parallel to a trace between the positive electrode of the first capacitive element and the second inductive element, or a second included angle is defined, the second included angle is greater than 0 ° and less than or equal to 5 °; the second output terminal is connected to a ground line on the circuit substrate.
In the technical scheme, the common mode inductor outputs the line reaching the energy storage capacitor, the energy storage capacitor reaches the line of the boost inductor, and the mode of parallel line or near parallel line is also defined, namely the second included angle is less than or equal to 5 degrees, so as to reduce the electromagnetic interference between devices.
In any of the above technical solutions, the plurality of parallel first capacitive elements are disposed between the first inductive element and the plurality of paths of second inductive elements.
In this technical scheme, on the circuit substrate, through placing energy storage capacitor between common mode inductance and multichannel boost inductance, on the one hand, be favorable to the differential mode interference that filtering boost circuit caused, on the other hand can provide the electric energy for boost circuit, and on the other hand again, through keeping apart boost inductance and common mode inductance, prevented two kinds of inductances from producing mutual interference when make full use of space to can promote common mode inductance's efficiency by a wide margin.
In any of the above technical solutions, the length direction of the first inductive element is set along a first direction, the length direction of the second inductive element is set along a second direction, and a third included angle is defined between the first direction and the second direction.
Wherein the third included angle is greater than or equal to 80 ° and less than or equal to 100 °.
In any of the above embodiments, preferably, the third included angle is 90 °.
In the technical scheme, the common mode inductor and the boost inductor are arranged on the circuit substrate in a relative position relationship of 90 degrees or nearly 90 degrees, so that on one hand, the common mode inductor can be prevented from failing due to mutual coupling of the boost inductor and the common mode inductor, and on the other hand, other EMC interference can be prevented from being caused.
In any of the above technical solutions, the voltage-doubling boost circuit further includes a plurality of paths of power switching tubes and a plurality of paths of second capacitive elements, which are correspondingly disposed: the multi-path power switching tubes and the multi-path second inductive elements are arranged correspondingly one by one, each path of power switching tube comprises a conducting circuit and a closing circuit, and the conducting circuit is suitable for connecting the power switching tubes with the corresponding second inductive elements and the first capacitive elements; the voltage-multiplying booster circuit also comprises a plurality of paths of first diodes, second diodes and third capacitive elements, wherein the anodes of the first diodes are connected to the output ends of the corresponding second inductive elements, the cathodes of the first diodes are connected to the third capacitive elements, the closing circuit comprises a first circuit and a second circuit, the first circuit is suitable for connecting the second capacitive elements, the second diodes and the third capacitive elements, and the second circuit is suitable for connecting the first diodes and the second capacitive elements in different paths. The guide cylinder circuit, the first circuit and the second circuit are arranged in parallel.
The second capacitive element is specifically a boost capacitor, the third capacitive element is specifically an electrolytic capacitor for outputting bus voltage, and the anode of the second diode is connected with the cathode of the second diode.
In the technical scheme, one voltage-multiplying booster circuit is taken as an example in a multi-path voltage-multiplying booster circuit, when a power switch tube in the path is switched on, energy is stored in a corresponding booster inductor, and the current trend is that the energy is returned to a plurality of energy storage capacitors connected in parallel from the booster inductor to the power switch tube through a ground wire.
The power switch tube in the circuit comprises two current flow paths after being closed, the first current flow path reaches the electrolytic capacitor from the boost capacitor through the second diode, the second current flow path reaches the boost capacitor of the other current flow path from the first diode, wiring corresponding to the current flow paths is arranged in a parallel mode, and a smaller surrounding area is defined, so that a good effect of preventing electromagnetic emission can be achieved.
In any of the above technical solutions, the second capacitive element is disposed between the second inductive element and the power switch tube.
In the technical scheme, after the boost capacitor is placed on the boost inductor on the circuit substrate, the boost inductor can reach the boost capacitor through the shortest path when energy is released, so that the generation of excessive electromagnetic radiation caused by overlong current path is prevented.
In any of the above technical solutions, the multiple power switch tubes and the multiple first diodes are disposed in parallel at one end of the circuit substrate.
In the technical scheme, at least two power switching tubes and corresponding diodes are placed at one end of the circuit substrate, so that concentrated heat dissipation and/or shielding and other treatment can be better performed on the power devices.
A third aspect of the present invention provides a vehicle-mounted air conditioner, including: a load; according to the driving control module of any one of the above technical schemes, the driving control module comprises a circuit substrate, a plurality of voltage-multiplying voltage boosting circuits and a plurality of temperature detection circuits, wherein the voltage-multiplying voltage boosting circuits and the temperature detection circuits are arranged on the circuit substrate, and the voltage-multiplying voltage boosting circuits are suitable for driving a plurality of loads to operate according to power supply signals.
In this technical solution, the vehicle-mounted air conditioner includes the drive control module in any one of the above technical solutions, and therefore, the vehicle-mounted air conditioner includes all the beneficial effects of the drive control module in any one of the above technical solutions, which is not described herein again.
In the above technical solution, the vehicle-mounted air conditioner further includes: and the temperature sensor is connected with a temperature detection circuit in the drive control module, wherein the temperature sensor comprises at least one of an ambient temperature sensor, a heat exchanger temperature sensor and a compressor exhaust temperature sensor.
Specifically, in on-vehicle air conditioner, ambient temperature sensor installs on the radiating fin edge of air conditioner machine case outside, thereby high frequency interference transmits to air conditioner machine case outside and sends away through temperature sensor through this way detection circuitry easily and causes EMI radiation to exceed standard, through adopting the temperature detection module that above-mentioned scheme was injectd, can effectively restrain high frequency interference to external transmission.
The heat exchanger temperature sensor and the compressor exhaust temperature sensor are arranged on a copper pipe used for conducting a refrigerant, so that the temperature of the refrigerant after heat exchange through the heat exchanger and the exhaust temperature of the compressor can be accurately detected. The high-frequency interference on the circuit substrate can be coupled to the copper pipe through the two temperature sensors, and the temperature detection module defined by the scheme is favorable for absorbing or blocking the high-frequency interference.
In the above technical solution, the load includes a compressor and/or a fan.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 shows a circuit schematic of a temperature detection module according to one embodiment of the invention;
FIG. 2 shows a schematic layout of a temperature detection module according to one embodiment of the invention;
fig. 3 shows a layout diagram of a voltage-doubling boost circuit in a drive control module according to an embodiment of the invention;
fig. 4 shows a circuit schematic of a drive control module according to an embodiment of the invention.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.
As shown in fig. 1, a temperature detection module according to an embodiment of the present invention includes: circuit substrate and temperature detect circuit, temperature detect circuit sets up on circuit substrate, and temperature detect circuit includes: the temperature sensor interface CN21 comprises a first group of interfaces and a second group of interfaces, and the first group of interfaces is suitable for being connected with a plurality of external temperature sensors; a plurality of paths of first magnetic beads L2, L4 and L6 which are arranged in parallel, wherein one end of any path of first magnetic beads (L2, L4 or L6) is suitable for being connected with the second group of interfaces; and a plurality of current limiting resistors R122, R124 and R126 which are arranged in parallel, wherein one end of the current limiting resistor (R122, R124 or R126) of any one path is suitable for being connected with the other end of the corresponding first magnetic bead (L2, L4 or L6), and the other end of the current limiting resistor (R122, R124 or R126) is suitable for outputting a temperature signal detected by the temperature sensor.
In the technical scheme, the temperature sensor interface CN21 is installed on the circuit substrate, and is used as a connection port between the temperature sensor which is arranged outside and used for collecting the temperature signal and the temperature detection circuit on the circuit substrate, magnetic beads are added in the temperature detection circuit, namely, the first magnetic beads L2, L4 and L6, and the magnetic beads are arranged between the temperature sensor and the current limiting resistors R122, R124 and R126 at the rear end, so that high-frequency interference (above 30 MHz) appearing on the circuit substrate can be filtered or limited on the circuit substrate, thereby preventing the interference signal from being transmitted to the outside along the temperature sensor, and further reducing the electromagnetic interference generated by the electric appliance adopting the temperature detection module, such as a vehicle-mounted air conditioner.
If a plurality of temperature sensors need to be connected, the detection lines in the temperature detection circuit also have multiple paths, and each detection line at least comprises the first magnetic beads L2, L4 and L6 and the current limiting resistors R122, R124 and R126, so that each detection line independently outputs the temperature signal detected by the temperature sensor in the form of current or voltage through the temperature sensor interface CN21, the first magnetic beads L2, L4 and L6 and the current limiting resistors R122, R124 and R126, and the temperature signal is used as a temperature signal at a specified position, such as the first detection line for detecting the outdoor environment temperature, and the second detection line for detecting the exhaust temperature of the compressor.
In addition, it can be understood by those skilled in the art that the temperature sensor may not be disposed on the circuit substrate, but connected to the temperature sensor interface CN21 on the circuit substrate through a flexible wire, so that the temperature sensor can detect the temperature of different positions when mounted at different positions.
In the above technical solution, the temperature sensor interface CN21 further includes a third group of interfaces, and the temperature detection circuit further includes: and one end of the second magnetic bead is connected to the third group of interfaces, and the other end of the second magnetic bead is connected to the direct-current power supply.
In this technical solution, a magnetic bead, that is, a second magnetic bead, is also provided between the dc power supply interface and the temperature sensor interface CN21, so that the efficiency of suppressing electromagnetic interference from propagating to the outside can be further improved.
In any one of the above technical solutions, the method further includes: the filter capacitors are connected in a multi-path mode, wherein the filter capacitors are connected with the filter capacitors C22, C24 and C26, one end of each filter capacitor C22, C24 and C26 is connected to one end of the corresponding current-limiting resistor (R122, R124 or R126), and the other ends of the filter capacitors C22, C24 and C26 are grounded.
In the technical scheme, the temperature signal can be transmitted to a designated controller in the form of a voltage signal, and the voltage signal of the temperature sensor is filtered by arranging the filter capacitors C22, C24 and C26 on each detection line, so that on one hand, interference signals in the voltage signal can be prevented from causing interference to the controller, and on the other hand, high-frequency voltage interference signals inside the circuit substrate can be filtered to prevent the high-frequency voltage interference signals from being transmitted to other places through the detection lines.
In any one of the above technical solutions, the method further includes: the voltage dividing resistors R132, R134 and R136 are arranged in a plurality of ways. Any path of voltage dividing resistor R132, R134 or R136 is connected with the corresponding filter capacitor C22, C24 and C26 in parallel.
In the technical scheme, the method comprises the following steps of. Any path of voltage dividing resistor R132, R134 or R136 and corresponding filter capacitor C22, C24 and C26 are arranged in parallel, so one end of each of the voltage dividing resistors R132, R134 and R136 is also grounded, each path of voltage dividing resistor R132, R134 and R136 is suitable for forming a temperature measuring circuit with a corresponding temperature sensor, the temperature sensor is a temperature sensitive device, the resistance value of the temperature sensor changes when the temperature changes, and therefore the voltage value between the voltage dividing resistors R132, R134 and R136 and the temperature sensor changes, and temperature detection is achieved.
As shown in fig. 2, in any of the above embodiments, the plurality of first magnetic beads L2, L4, and L6 and the plurality of second magnetic beads are disposed on the circuit board close to the temperature sensor interface CN 21.
In any of the above technical solutions, a routing length between the interface of the dc power supply and the third group of interfaces is less than or equal to a reference length, the reference length is configured according to a reference coefficient and a shortest distance between the interface of the dc power supply and the third group of interfaces, and the reference coefficient is greater than or equal to 1 and less than or equal to 1.2.
In the technical scheme, the first magnetic beads L2, L4, L6 and the second magnetic beads need to be installed as close to the temperature sensor interface CN21C as possible, and since the temperature sensor shares a 5v power supply line, the power supply line at the temperature sensor interface CN21 needs to be wired and connected in a smaller path, so as to prevent electromagnetic interference from entering the detection line again through a coupling manner.
As shown in fig. 4, the driving control module according to the embodiment of the present invention includes: the temperature detection module described in the above embodiment includes a circuit substrate and a temperature detection circuit; the voltage-multiplying booster circuit comprises a circuit substrate and a temperature detection circuit; and the voltage-multiplying booster circuit and the temperature detection circuit are arranged on the same circuit substrate, or the voltage-multiplying booster circuit and the temperature detection circuit are arranged on different circuit substrates, the voltage-multiplying booster circuit comprises a controller and a plurality of paths of power switch tubes, the temperature detection circuit is suitable for being connected with the controller, and the controller is suitable for configuring switch control signals output to the power switch tubes according to temperature signals output by the temperature detection circuit.
The multi-path voltage-doubling booster circuit is shown in fig. 4.
Specifically, the power supply is accessed from power interfaces CN1 and CN2, and reaches energy storage capacitors E4, E6 and E8 after passing through common mode inductor L1, so as to supply power to the following multi-path interleaved voltage-doubling boost circuit.
Taking two staggered voltage-multiplying booster circuits as an example, when the two staggered voltage-multiplying booster circuits work, the power switch tube Q601 and the power switch tube Q602 work alternately, the power switch tube Q601 stores energy for the boosting inductor L603 when being switched on, and after the power switch tube Q601 is switched off, the energy of the boosting inductor L603 is released, on one hand, the boosting capacitor C603 is charged through the first diode D600, on the other hand, the energy reaches the electrolytic capacitor E2 through the boosting capacitor C602 and the second diode D603, and the electrolytic capacitor E2 is charged.
Correspondingly, when the power switch tube Q602 is turned on, energy is stored in the boost inductor L602, and when the power switch tube Q602 is turned off, the energy in the boost inductor L602 is released, so that the boost capacitor C602 is charged through the diode D601, and the boost capacitor C603 and the diode D603 reach the electrolytic capacitor E2 to charge the electrolytic capacitor E2. An electrolytic capacitor E2 powers the compressor and fan.
As shown in fig. 1, specifically, the voltage-doubling boost circuit is suitable for driving a plurality of loads to operate according to a power supply signal, the voltage-doubling boost circuit is disposed on a circuit substrate 10, as shown in fig. 2, the circuit substrate 10 is provided with a power interface, and the voltage-doubling boost circuit includes: the input end of the first inductive element is suitable for being connected with the power interface; a plurality of parallel first capacitive elements adapted to be connected to the output of the first inductive element; and the second inductive elements are arranged in a plurality of ways and are suitable for being connected with the plurality of first capacitive elements, and the first capacitive elements are suitable for supplying power to the second inductive elements.
Wherein, the plurality of second inductive elements are arranged on the circuit substrate 10 side by side.
In this embodiment, the first inductive element is specifically a common mode inductor L1, the first capacitive element is specifically energy storage capacitors E4, E6 and E8, the second inductive element is specifically a boost inductor, taking a two-way voltage-multiplying boost circuit as an example, the second inductive element (boost inductors L602 and L603) includes two boost inductors L602 and L603, which are placed in parallel, so as to be beneficial for preventing mutual interference between the inductors, so as to achieve EMC (Electro Magnetic Compatibility, that is, the ability of the device and system to work normally in its electromagnetic environment and not to form electromagnetic disturbance that cannot be borne by anything in the environment) optimization, and thus, there is no need to add a filter Magnetic ring or a filter capacitor for optimizing EMC.
In addition, the power interface is suitable for being connected with an alternating current power supply, and the energy storage inductor is suitable for supplying power to devices in the voltage-multiplying booster circuit at the rear end.
As shown in fig. 3, in the above embodiment, the power interface includes a positive power interface CN2 and a negative power interface CN1, the input end of the first inductive element includes a first input end and a second input end, the first input end is suitable for being connected to the positive power interface CN2 by using a first segment of routing, the second input end is suitable for being connected to the negative power interface CN1 by using a second segment of routing, the first segment of routing is parallel to the second segment of routing, or a first included angle is defined between the first segment of routing and the second segment of routing, and the first included angle is greater than 0 ° and less than or equal to 5 °.
In this embodiment, the trace (the first trace section) from the positive power interface CN2 to the first input end of the common mode inductor L1 and the trace (the second trace section) from the negative power interface CN1 to the second input end of the common mode inductor L1 are arranged in a parallel trace manner, and since the area formed by the two traces in a surrounding manner is very small, the electromagnetic field emitted by the two traces is correspondingly very small, thereby further realizing optimization of EMC.
In addition, aiming at the arrangement mode that two wires are not completely parallel, the included angle between the two wires can be limited to be not more than 5 degrees, the two wires are parallel or the included angle is less than or equal to 5 degrees, and the arrangement mode is within the protection range of the application.
In any of the above embodiments, the first inductive element common mode inductor L1 includes a first output terminal and a second output terminal, the first output terminal and the first capacitive element, that is, the trace between the positive electrodes of the energy storage capacitors E4, E6 and E8 connected in parallel are arranged in parallel with the trace between the positive electrode of the first capacitive element and the second inductive element, or define a second included angle, the second included angle is greater than 0 ° and less than or equal to 5 °; the second output terminal is connected to the ground on the circuit substrate 10.
In this embodiment, the common mode inductor L1 output reaches the traces of the energy storage capacitors E4, E6, and E8, and the energy storage capacitors E4, E6, and E8 reach the traces of the boost inductors L602 and L603, which are also defined as parallel traces or traces close to parallel traces, that is, the second included angle is less than or equal to 5 °, so as to reduce the electromagnetic interference between the devices.
In any of the above embodiments, the plurality of parallel first capacitive elements are disposed between the first inductive element and the plurality of paths of second inductive elements.
In this embodiment, on the circuit substrate 10, the energy storage capacitors E4, E6, and E8 are disposed between the common mode inductor L1 and the multi-path boost inductors L602 and L603, which is beneficial to filtering out the differential mode interference caused by the boost circuit, on the other hand, the power can be provided for the boost circuit, and on the other hand, the boost inductors L602 and L603 and the common mode inductor L1 are isolated, so that the mutual interference between the two inductors is prevented while the space is fully utilized, and the efficiency of the common mode inductor L1 can be greatly improved.
As shown in fig. 1, in any of the above embodiments, the length direction of the first inductive element is arranged along the first direction, the length direction of the second inductive element is arranged along the second direction, and a third included angle is defined between the first direction and the second direction.
Wherein the third included angle is greater than or equal to 80 ° and less than or equal to 100 °.
In any of the above embodiments, preferably, the third included angle is 90 °.
In this embodiment, by disposing the common mode inductor L1 and the boost inductors L602 and L603 at a relative positional relationship of 90 ° or nearly 90 ° on the circuit substrate 10, it is possible to prevent the common mode inductor L1 from failing due to the mutual coupling of the boost inductors L602 and L603 and the common mode inductor L1, and to prevent EMC interference from other components.
As shown in fig. 2, in any of the above embodiments, the voltage-doubling boost circuit further includes multiple power switch transistors (including a first power switch transistor Q601 and a second power switch transistor Q602) and multiple second capacitive elements (including a first boost capacitor C602 and a second boost capacitor C603), which are correspondingly disposed, the multiple power switch transistors and the multiple second inductive elements are correspondingly disposed one by one, each power switch transistor includes a conducting circuit and a closing circuit, and the conducting circuit is adapted to connect the power switch transistor with the corresponding second inductive element and the first capacitive element (the power switch transistor Q601 and the boost capacitor C602, the power switch transistor Q602 and the boost capacitor C603).
The voltage-multiplying booster circuit further comprises a plurality of paths of first diodes (D600 and D601), wherein the first diode D600 and the power switch tube Q601 in the first path are connected with the booster inductor L603 in the second path, and the first diode D601 and the power switch tube Q602 in the second path are connected with the booster inductor L602 in the first path.
The boost capacitor is connected to the first diode and also to the anode of the second diode D603, the cathode of the second diode is connected to the electrolytic capacitor E2 of the third capacitive element, the anode of the first diode is connected to the output of the corresponding second inductive element, the cathode of the first diode is connected to the third capacitive element, the closing circuit comprises a first line and a second line, the first line is adapted to connect the second capacitive element, the second diode and the third capacitive element, the second line is adapted to connect the first diode and the second capacitive element in the same line. The guide cylinder circuit, the first circuit and the second circuit are arranged in parallel.
The second capacitive element is specifically a boost capacitor, the third capacitive element is specifically an electrolytic capacitor E2 for outputting bus voltage, and the anode of the second diode is connected with the cathode of the second diode.
In this embodiment, for example, one voltage-multiplying voltage boosting circuit is used in the multiple voltage-multiplying voltage boosting circuits, when the power switch tube in the circuit is turned on, energy is stored in the corresponding voltage boosting inductors L602 and L603, and the current flows from the voltage boosting inductors L602 and L603 to the power switch tube and then flows back to the multiple energy storage capacitors E4, E6, and E8 connected in parallel through the ground line.
The power switch tube in the circuit comprises two current flow paths after being closed, the first current flow path reaches the electrolytic capacitor E2 from the boost capacitor through the second diode, the second current flow path reaches the boost capacitor from the first diode, wiring corresponding to the current flow paths is set to be in a parallel mode, and a smaller surrounding area is defined, so that a good effect of preventing electromagnetic emission can be achieved.
As shown in fig. 3, in any of the above embodiments, the second capacitive element (the boost capacitor C602 and the boost capacitor C603) is disposed between the second inductive element (the boost inductor L602 and the boost inductor L604) and the power switch (Q601 and Q602).
In this embodiment, after the boost capacitors are disposed on the boost inductors L602 and L603 on the circuit substrate 10, the boost inductors L602 and L603 can reach the boost capacitors in the shortest path when energy is released, so as to prevent the generation of excessive electromagnetic radiation due to too long current path.
As shown in fig. 3, in any of the above embodiments, the multiple power switches Q601 and Q602 and the multiple first diodes D300 and D301 are disposed side by side at one end of the circuit substrate 10.
In this embodiment, at least two power switching tubes and corresponding diodes are disposed at one end of the circuit substrate 10, so that the power devices can be better subjected to concentrated heat dissipation and/or shielding.
An in-vehicle air conditioner according to an embodiment of the present invention includes: a load; the temperature detection module according to any one of the embodiments above, wherein the temperature detection module includes a circuit substrate and multiple voltage-multiplying voltage boost circuits, the circuit substrate is provided with a copper-clad layer, the voltage-multiplying voltage boost circuits are disposed on the circuit substrate, and the voltage-multiplying voltage boost circuits are adapted to drive multiple loads to operate according to a power supply signal.
In this embodiment, the vehicle-mounted air conditioner includes the driving control circuit described in any one of the above embodiments, and therefore, the vehicle-mounted air conditioner includes all the beneficial effects of the temperature detection module described in any one of the above embodiments, which are not described herein again.
In the above embodiment, the vehicle air conditioner further includes: and the temperature sensor is connected with a temperature detection circuit in the drive control module, wherein the temperature sensor comprises at least one of an ambient temperature sensor, a heat exchanger temperature sensor and a compressor exhaust temperature sensor.
Specifically, in the vehicle-mounted air conditioner, the ambient temperature sensor is installed on the edge of the radiating fin outside the air conditioner case, the temperature signal is T1 shown in fig. 1, high-frequency interference is easily transmitted to the outside of the air conditioner case through the detection circuit and is emitted out through the temperature sensor, accordingly, EMI radiation exceeds the standard, and transmission of the high-frequency interference to the outside can be effectively inhibited through the temperature detection module limited by the scheme.
The heat exchanger temperature sensor and the compressor exhaust temperature sensor are mounted on a copper pipe for conducting the refrigerant, and temperature signals of the heat exchanger temperature sensor and the compressor exhaust temperature sensor are T2 and T3 shown in figure 1, so that the temperature of the refrigerant after heat exchange through the heat exchanger and the exhaust temperature of the compressor can be accurately detected. The high-frequency interference on the circuit substrate can be coupled to the copper pipe through the two temperature sensors, and the temperature detection module defined by the scheme is favorable for absorbing or blocking the high-frequency interference.
In the above embodiments, the load comprises a compressor and/or a fan.
In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless expressly limited otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "front", and "front" are used herein,
The directions or positional relationships indicated by "rear" and the like are based on the directions or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or unit must have a specific direction, be configured and operated in a specific direction, and thus, should not be construed as limiting the present invention.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In addition, a plurality described in the present application is specifically at least two.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a temperature detection module, its characterized in that includes circuit substrate and temperature detect circuit, temperature detect circuit set up in on the circuit substrate, temperature detect circuit includes:
the temperature sensor interface comprises a first group of interfaces and a second group of interfaces, and the first group of interfaces are suitable for being connected with a plurality of external temperature sensors;
a plurality of paths of first magnetic beads arranged in parallel, wherein one end of any path of the first magnetic beads is suitable for being connected with the second group of interfaces;
and one end of each current-limiting resistor is suitable for being connected with the other end of the corresponding first magnetic bead, and the other end of each current-limiting resistor is suitable for outputting a temperature signal detected by the temperature sensor.
2. The temperature sensing module of claim 1, wherein the temperature sensor interface further comprises a third set of interfaces, the temperature sensing circuit further comprising:
and one end of the second magnetic bead is connected to the third group of interfaces, and the other end of the second magnetic bead is connected to a direct-current power supply.
3. The temperature sensing module of claim 2, further comprising:
one end of the filter capacitor in any path is connected to one end of the corresponding current-limiting resistor, and the other end of the filter capacitor is grounded.
4. The temperature sensing module of claim 3, further comprising:
the filter circuit comprises a plurality of paths of divider resistors, wherein any path of divider resistor is connected with the corresponding filter capacitor in parallel.
5. The temperature detection module of any one of claims 2 to 4,
the first magnetic beads and the second magnetic beads are arranged on the circuit substrate close to the temperature sensor interface.
6. The temperature detection module of any one of claims 2 to 4,
the wiring length between the interface of the direct current power supply and the third group of interfaces is smaller than or equal to a reference length, the reference length is configured according to a reference coefficient and the shortest distance between the interface of the direct current power supply and the third group of interfaces, and the reference coefficient is larger than or equal to 1 and smaller than or equal to 1.2.
7. A drive control module, comprising:
the temperature detection module of any one of claims 1 to 6, comprising a circuit substrate and a temperature detection circuit;
the voltage-multiplying booster circuit and the temperature detection circuit are arranged on the same circuit substrate, or the voltage-multiplying booster circuit and the temperature detection circuit are arranged on different circuit substrates, the voltage-multiplying booster circuit comprises a controller and a plurality of paths of power switch tubes, the temperature detection circuit is suitable for being connected with the controller, and the controller is suitable for configuring switch control signals output to the power switch tubes according to temperature signals output by the temperature detection circuit.
8. An in-vehicle air conditioner, characterized by comprising:
a load;
the drive control module of claim 7, adapted to drive a plurality of loads to operate according to the power supply signal.
9. The vehicle air conditioner according to claim 8, further comprising:
a temperature sensor connected with a temperature detection circuit in the drive control module,
wherein the temperature sensor comprises at least one of an ambient temperature sensor, a heat exchanger temperature sensor, and a compressor discharge temperature sensor.
10. The vehicle air conditioner according to claim 8 or 9,
the load comprises a compressor and/or a fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010219723.6A CN111361390A (en) | 2020-03-25 | 2020-03-25 | Temperature detection module, drive control module and vehicle-mounted air conditioner |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010219723.6A CN111361390A (en) | 2020-03-25 | 2020-03-25 | Temperature detection module, drive control module and vehicle-mounted air conditioner |
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| CN111361390A true CN111361390A (en) | 2020-07-03 |
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| CN202010219723.6A Pending CN111361390A (en) | 2020-03-25 | 2020-03-25 | Temperature detection module, drive control module and vehicle-mounted air conditioner |
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