CN111361139A - Ultrasonic friction imprinting method and device for polymer device - Google Patents
Ultrasonic friction imprinting method and device for polymer device Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 229920000642 polymer Polymers 0.000 title claims abstract description 14
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 68
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract 2
- 239000002033 PVDF binder Substances 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 3
- 238000004049 embossing Methods 0.000 claims 9
- 238000009499 grossing Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 239000002086 nanomaterial Substances 0.000 abstract description 2
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012994 photoredox catalyst Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/0255—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using friction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/0261—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using ultrasonic or sonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
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Abstract
本发明涉及一种面向热塑性聚合物器件的超声摩擦压印方法及装置，该方法包括：微进给系统检测到模具与热塑性聚合物达到临界进出状态的步骤；微进给系统对热塑性聚合物施加压力的步骤；在上述任何一个步骤之前、过程中、或之后启动设置在热塑性聚合物器件侧面的超声器的步骤，所述超声器发出的超声频率为200Hz‑40KHz；微进给系统检测热塑性聚合物压印过程的温度场和应力应变场的数据的步骤；微进给系统保持压力一定时间的步骤；停止超声器的步骤；脱模步骤。通过横向超声振动的摩擦作用，使聚合物和模具表面温度升高，使得聚合物熔融，进而在压力作用下实现微纳结构的压印。而且，横向振动不会对热塑性聚合物器件的内部结构产生影响。
The invention relates to an ultrasonic friction imprinting method and device for thermoplastic polymer devices. The method comprises: a micro-feed system detects that a mold and a thermoplastic polymer reach a critical in-out state; The step of pressing; before, during, or after any of the above steps, the step of starting an ultrasonic device arranged on the side of the thermoplastic polymer device, the ultrasonic frequency emitted by the ultrasonic device is 200Hz-40KHz; the micro-feed system detects thermoplastic polymerization The steps of temperature field and stress-strain field data of the material imprinting process; the step of maintaining the pressure for a certain period of time by the micro-feeding system; the step of stopping the ultrasonic device; the step of demolding. Through the friction effect of transverse ultrasonic vibration, the temperature of the polymer and the surface of the mold is increased, so that the polymer is melted, and then the imprinting of the micro-nano structure is realized under the action of pressure. Furthermore, the lateral vibration does not affect the internal structure of the thermoplastic polymer device.
Description
技术领域technical field
本发明涉及一种面向热塑性聚合物器件的压印装置及控制方法，属于微流控芯片领域。The invention relates to an imprinting device and a control method for thermoplastic polymer devices, belonging to the field of microfluidic chips.
背景技术Background technique
目前的超声压印为纵波振动，通过纵波振动使热塑性聚合物熔融，实现压印，但由于聚合物材料的不可压缩性，压出完成后会产生毛边、隆起等缺陷，且纵向振动会对基底材料内部产生破坏性影响。The current ultrasonic imprinting is a longitudinal wave vibration. The thermoplastic polymer is melted by the longitudinal wave vibration to realize imprinting. However, due to the incompressibility of the polymer material, defects such as burrs and bulges will occur after the extrusion is completed, and the longitudinal vibration will affect the substrate. Destructive effects inside the material.
发明内容SUMMARY OF THE INVENTION
本发明所要解决的技术问题是：纵波振动造成热塑性聚合物产生毛边、隆起的问题。The technical problem to be solved by the present invention is that the thermoplastic polymer produces burrs and bulges caused by longitudinal wave vibration.
为解决上述技术问题，本发明采用如下技术方案：一种面向热塑性聚合物器件的超声摩擦压印方法，该方法包括：In order to solve the above-mentioned technical problems, the present invention adopts the following technical scheme: an ultrasonic friction imprinting method for thermoplastic polymer devices, the method comprises:
微进给系统检测到模具与热塑性聚合物达到临界进出状态的步骤；The micro-feed system detects the steps in which the mold and the thermoplastic polymer reach a critical in-out state;
微进给系统对热塑性聚合物施加压力的步骤；the step of applying pressure to the thermoplastic polymer by the micro-feed system;
在上述任何一个步骤之前、过程中、或之后启动设置在热塑性聚合物器件侧面的超声器的步骤，所述超声器发出的超声频率为200Hz-40KHz；Before, during, or after any of the above steps, the step of activating an ultrasonic device arranged on the side of the thermoplastic polymer device, the ultrasonic frequency emitted by the ultrasonic device is 200Hz-40KHz;
微进给系统检测热塑性聚合物压印过程的温度场和应力应变场的数据的步骤；The step of the micro-feed system detecting the data of the temperature field and the stress-strain field of the thermoplastic polymer imprinting process;
微进给系统保持压力一定时间的步骤；Steps in which the micro-feed system maintains the pressure for a certain period of time;
停止超声器的步骤；the step of stopping the sonicator;
脱模步骤。demoulding step.
进一步地，面向热塑性聚合物器件的超声摩擦压印方法还包括模具与聚合物无间隙时，微进给系统对热塑性聚合物施加一定的压力，将模具挤压出来的聚合物微凸起抚平的步骤。Further, the ultrasonic friction imprinting method for thermoplastic polymer devices also includes that when there is no gap between the mold and the polymer, the micro-feeding system applies a certain pressure to the thermoplastic polymer to smooth the polymer micro-protrusions extruded from the mold. A step of.
进一步地，热塑性聚合物器件是PC、 PMMA、PVC、 PVDF或 PE器件。Further, the thermoplastic polymer device is a PC, PMMA, PVC, PVDF or PE device.
本发明还提供了一种面向热塑性聚合物器件的超声摩擦压印装置，包括模具、微进给系统、设置在热塑性聚合物器件侧面的超声器， 热塑性聚合物器件设置在模具与微进给系统之间，其特征在于，所述超声器发出的超声频率为200Hz-40KHz。The present invention also provides an ultrasonic friction imprinting device for thermoplastic polymer devices, comprising a mold, a micro-feeding system, an ultrasonic device arranged on the side of the thermoplastic polymer device, and the thermoplastic polymer device is arranged on the mold and the micro-feeding system. It is characterized in that the ultrasonic frequency emitted by the ultrasonic device is 200Hz-40KHz.
进一步地，面向热塑性聚合物器件的超声摩擦压印装置还包括设置在微进给系统之前的粗进给系统。Further, the ultrasonic friction imprinting apparatus for thermoplastic polymer devices further includes a rough feeding system arranged before the micro feeding system.
进一步地，面向热塑性聚合物器件的超声摩擦压印装置还包括设置在检测热塑性聚合物压印过程的温度场和应力应变场的数据的传感器。Further, the ultrasonic rubbing imprinting apparatus for thermoplastic polymer devices further includes a sensor arranged to detect the data of the temperature field and the stress-strain field of the thermoplastic polymer imprinting process.
进一步地，面向热塑性聚合物器件的超声摩擦压印装置还包括超声振动平台，热塑性聚合物器件放置在超声振动平台上，超声沿超声振动平台所在平面传播。Further, the ultrasonic friction imprinting device oriented to the thermoplastic polymer device further includes an ultrasonic vibration platform, the thermoplastic polymer device is placed on the ultrasonic vibration platform, and the ultrasonic wave propagates along the plane where the ultrasonic vibration platform is located.
与现有技术相比，本发明的有益效果在于：通过横向超声振动的摩擦作用，使聚合物和模具表面温度升高，使得聚合物熔融，进而在压力作用下实现微纳结构的压印。横向振动不会对内部结构产生影响。Compared with the prior art, the present invention has the beneficial effect of increasing the temperature of the polymer and the surface of the mold through the friction effect of transverse ultrasonic vibration, so that the polymer is melted, and the micro-nano structure is imprinted under pressure. Lateral vibrations do not affect the internal structure.
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，并可依照说明书的内容予以实施，以下以本发明的较佳实施例并配合附图详细说明如后。The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly, and implement it according to the content of the description, the preferred embodiments of the present invention are described in detail below with the accompanying drawings.
附图说明Description of drawings
图1为本发明一实施例所示的结构示意图。FIG. 1 is a schematic structural diagram of an embodiment of the present invention.
具体实施方式Detailed ways
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明，但不用来限制本发明的范围。The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. The following examples are intended to illustrate the present invention, but not to limit the scope of the present invention.
下面将结合附图对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。此外，下面所描述的本发明不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
请参见图1所示，本发明一较佳实施例所示的一种面向热塑性聚合物器件的超声摩擦压印方法，该方法包括：Referring to FIG. 1, a preferred embodiment of the present invention shows an ultrasonic friction imprinting method for thermoplastic polymer devices, the method includes:
微进给系统1检测到模具4与热塑性聚合物器件3达到临界进出状态的步骤；微进给系统1通过位移和压力反馈使模具4与热塑性聚合物器件3达到临界进出状态；The micro-feed system 1 detects that the mold 4 and the
微进给系统1对热塑性聚合物器件3施加压力的步骤，微进给系统1向热塑性聚合物器件3施力，使热塑性聚合物器件3与模具4紧密接触；The step of applying pressure to the
在上述任何一个步骤之前、过程中、或之后启动设置在热塑性聚合物器件3侧面的超声器6的步骤，所述超声器6发出的超声频率为200Hz-40KHz；由此在界面处发生超声摩擦作用，机械能转化为聚合物内能，使得模具4微结构逐渐嵌入受热熔融的聚合物表面，同时被挤压出来的聚合物堆积在周边；Before, during, or after any of the above steps, the step of activating the
微进给系统1检测热塑性聚合物器件3压印过程的温度场和应力应变场的数据的步骤；The micro-feed system 1 detects the temperature field and stress-strain field data of the
微进给系统1保持压力一段时间的步骤；微进给系统1具有力反馈功能，通过压印过程的温度场和应力应变场的在线检测，控制压印过程压力，即影响摩擦的正压力，完成表面摩擦和微进给的精密控制，实现表面熔融深度的有效可控；The micro-feeding system 1 maintains the pressure for a period of time; the micro-feeding system 1 has a force feedback function, through the online detection of the temperature field and the stress-strain field of the imprinting process, it controls the pressure in the imprinting process, that is, the positive pressure that affects the friction, Complete the precise control of surface friction and micro-feed to achieve effective control of surface melting depth;
通过压力检测获得热塑性聚合物器件3与模具4界面的力学状态，待模具4与热塑性聚合物器件3无间隙时，停止超声器6的步骤；The mechanical state of the interface between the
通过力控微进给系统1的压力作用，实现界面熔融区域的结构重构；待保压一定时间后进入脱模步骤，完成制造微流控芯片。Through the pressure action of the force-controlled micro-feeding system 1 , the structural reconstruction of the interface melting area is realized; after maintaining the pressure for a certain period of time, the demolding step is entered to complete the manufacture of the microfluidic chip.
由于模具4在压印热塑性聚合物器件3时，热塑性聚合物器件3的部分会向上突起，面向热塑性聚合物器件3的超声摩擦压印方法还包括模具4与热塑性聚合物器件3无间隙时，微进给系统1对热塑性聚合物器件3施加一定的压力，将模具4挤压出来的聚合物微凸起抚平的步骤。When the mold 4 imprints the
进一步地，热塑性聚合物器件3是PC、 PMMA PVC、 PVDF或 PE器件。Further, the
本发明还提供了一种面向热塑性聚合物器件的超声摩擦压印装置，包括模具4、微进给系统1、设置在热塑性聚合物器件3侧面的超声器6， 热塑性聚合物器件3设置在模具4与微进给系统1之间，超声器6发出的超声频率为200Hz-40KHz。The present invention also provides an ultrasonic friction imprinting device for thermoplastic polymer devices, comprising a mold 4, a micro-feeding system 1, an
进一步地，面向热塑性聚合物器件的超声摩擦压印装置还包括设置在微进给系统1之前的粗进给系统2。Further, the ultrasonic friction imprinting apparatus for thermoplastic polymer devices further includes a
进一步地，面向热塑性聚合物器件的超声摩擦压印装置还包括检测热塑性聚合物压印过程的温度场和应力应变场的数据的传感器。Further, the ultrasonic rubbing imprinting apparatus for thermoplastic polymer devices further includes a sensor for detecting data of the temperature field and the stress-strain field of the thermoplastic polymer imprinting process.
进一步地，面向热塑性聚合物器件的超声摩擦压印装置还包括超声振动平台5，热塑性聚合物器件3放置在超声振动平台5上，超声沿超声振动平台5所在平面传播。Further, the ultrasonic friction imprinting device oriented to the thermoplastic polymer device further includes an
综上所述，通过横向超声在聚合物表面振动，实现摩擦生热，微进给系统1控制压印过程压力、并检测温度场和应力应变场的实时数据，完成表面摩擦和微进给的精密控制，实现表面熔融深度的有效可控，根据模具4的微纳尺寸要求，实现熔融区域的结构重构，完成高密度微流控芯片的制造。而且，横向振动不会对热塑性聚合物内部结构产生影响。To sum up, the frictional heat generation is realized by the transverse ultrasonic vibration on the polymer surface. The micro-feed system 1 controls the pressure in the imprinting process, and detects the real-time data of the temperature field and the stress-strain field to complete the surface friction and micro-feed. Precise control can effectively control the melting depth of the surface. According to the micro-nano size requirements of the mold 4, the structure of the melting area can be reconstructed to complete the manufacture of high-density microfluidic chips. Furthermore, transverse vibrations do not affect the internal structure of the thermoplastic polymer.
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can also be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.
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