CN111361139A - Ultrasonic friction imprinting method and device for polymer device - Google Patents

Ultrasonic friction imprinting method and device for polymer device Download PDF

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Publication number
CN111361139A
CN111361139A CN202010283505.9A CN202010283505A CN111361139A CN 111361139 A CN111361139 A CN 111361139A CN 202010283505 A CN202010283505 A CN 202010283505A CN 111361139 A CN111361139 A CN 111361139A
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CN
China
Prior art keywords
thermoplastic polymer
ultrasonic
micro
feeding system
friction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010283505.9A
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Chinese (zh)
Inventor
崔良玉
胡高峰
韩建鑫
靳刚
李占杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin University of Technology and Education China Vocational Training Instructor Training Center
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Tianjin University of Technology and Education China Vocational Training Instructor Training Center
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Publication date
Application filed by Tianjin University of Technology and Education China Vocational Training Instructor Training Center filed Critical Tianjin University of Technology and Education China Vocational Training Instructor Training Center
Priority to CN202010283505.9A priority Critical patent/CN111361139A/en
Publication of CN111361139A publication Critical patent/CN111361139A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002Component parts, details or accessories; Auxiliary operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/42Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0255Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using friction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0261Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using ultrasonic or sonic vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023Microembossing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

The invention relates to an ultrasonic friction imprinting method and device for a thermoplastic polymer device, wherein the method comprises the following steps: detecting that the die and the thermoplastic polymer reach a critical in-out state by a micro-feeding system; a step of applying pressure to the thermoplastic polymer by the micro-feeding system; a step of starting an ultrasonic device disposed at a side of the thermoplastic polymer device before, during, or after any of the above steps, the ultrasonic device emitting ultrasonic waves having a frequency of 200Hz to 40 KHz; the micro-feeding system detects the data of the temperature field and the stress strain field of the thermoplastic polymer imprinting process; maintaining the pressure of the micro-feeding system for a certain time; stopping the ultrasonic device; and (5) demolding. The temperature of the polymer and the surface of the mold is raised through the friction effect of transverse ultrasonic vibration, so that the polymer is melted, and then the micro-nano structure is imprinted under the pressure effect. Moreover, the transverse vibration does not affect the internal structure of the thermoplastic polymer device.

Description

Ultrasonic friction imprinting method and device for polymer device
Technical Field
The invention relates to an imprinting device for a thermoplastic polymer device and a control method, and belongs to the field of microfluidic chips.
Background
The existing ultrasonic imprinting is longitudinal wave vibration, and the thermoplastic polymer is melted through the longitudinal wave vibration to realize imprinting, but due to the incompressibility of a polymer material, the defects of burrs, bulges and the like can be generated after the extrusion is finished, and the longitudinal vibration can generate destructive influence on the interior of a substrate material.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: longitudinal wave vibration causes the problems of burrs and bulges of the thermoplastic polymer.
In order to solve the technical problems, the invention adopts the following technical scheme: a method of ultrasonic friction embossing a thermoplastic polymer-oriented device, the method comprising:
detecting that the die and the thermoplastic polymer reach a critical in-out state by a micro-feeding system;
a step of applying pressure to the thermoplastic polymer by the micro-feeding system;
a step of starting an ultrasonic device disposed at a side of the thermoplastic polymer device before, during, or after any of the above steps, the ultrasonic device emitting ultrasonic waves having a frequency of 200Hz to 40 KHz;
the micro-feeding system detects the data of the temperature field and the stress strain field of the thermoplastic polymer imprinting process;
maintaining the pressure of the micro-feeding system for a certain time;
stopping the ultrasonic device;
and (5) demolding.
Further, the ultrasonic friction imprinting method facing the thermoplastic polymer device further comprises the step of applying a certain pressure to the thermoplastic polymer by the microfeeding system when the mold and the polymer are not in clearance so as to smooth the polymer micro-protrusions extruded by the mold.
Further, the thermoplastic polymer device is a PC, PMMA, PVC, PVDF or PE device.
The invention also provides an ultrasonic friction imprinting device facing the thermoplastic polymer device, which comprises a mold, a micro-feeding system and an ultrasonic device arranged on the side surface of the thermoplastic polymer device, wherein the thermoplastic polymer device is arranged between the mold and the micro-feeding system, and the ultrasonic frequency emitted by the ultrasonic device is 200Hz-40 KHz.
Further, the ultrasonic friction imprinting device facing the thermoplastic polymer device further comprises a rough feeding system arranged before the micro feeding system.
Further, the ultrasonic friction imprinting device facing the thermoplastic polymer device further comprises a sensor arranged to detect data of a temperature field and a stress strain field of the thermoplastic polymer imprinting process.
Further, the ultrasonic friction imprinting device facing the thermoplastic polymer device further comprises an ultrasonic vibration platform, wherein the thermoplastic polymer device is placed on the ultrasonic vibration platform, and the ultrasonic waves propagate along the plane of the ultrasonic vibration platform.
Compared with the prior art, the invention has the beneficial effects that: the temperature of the polymer and the surface of the mold is raised through the friction effect of transverse ultrasonic vibration, so that the polymer is melted, and then the micro-nano structure is imprinted under the pressure effect. The transverse vibration does not affect the internal structure.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram according to an embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to fig. 1, a method for ultrasonic friction imprinting of a thermoplastic polymer-oriented device according to a preferred embodiment of the present invention comprises:
a step of detecting that the mold 4 and the thermoplastic polymer device 3 reach a critical in-out state by the micro-feeding system 1; the micro-feeding system 1 enables the die 4 and the thermoplastic polymer device 3 to reach a critical in-and-out state through displacement and pressure feedback;
a step of applying pressure to the thermoplastic polymer device 3 by the micro-feeding system 1, wherein the micro-feeding system 1 applies force to the thermoplastic polymer device 3 to enable the thermoplastic polymer device 3 to be in close contact with the die 4;
a step of starting an ultrasonic device 6 disposed at a side of the thermoplastic polymer device 3 before, during, or after any of the above steps, the ultrasonic device 6 emitting ultrasonic waves having a frequency of 200Hz to 40 KHz; thus, ultrasonic friction action is generated at the interface, mechanical energy is converted into internal energy of the polymer, so that the microstructure of the die 4 is gradually embedded into the surface of the polymer which is heated and melted, and meanwhile, the extruded polymer is accumulated on the periphery;
the micro-feeding system 1 detects the data of the temperature field and the stress strain field of the thermoplastic polymer device 3 in the imprinting process;
a step of maintaining the pressure of the micro-feeding system 1 for a period of time; the micro-feeding system 1 has a force feedback function, controls the pressure in the imprinting process, namely the positive pressure influencing friction, through the online detection of a temperature field and a stress strain field in the imprinting process, finishes the precise control of surface friction and micro-feeding, and realizes the effective control of the surface melting depth;
obtaining the mechanical state of the interface of the thermoplastic polymer device 3 and the mould 4 through pressure detection, and stopping the ultrasonic device 6 when the mould 4 and the thermoplastic polymer device 3 have no clearance;
the structural reconstruction of the interface melting region is realized through the pressure action of the force control micro-feeding system 1; and (5) after maintaining the pressure for a certain time, performing a demoulding step to finish the manufacture of the microfluidic chip.
Since the portion of the thermoplastic polymer device 3 protrudes upward when the mold 4 is used to imprint the thermoplastic polymer device 3, the ultrasonic friction imprinting method facing the thermoplastic polymer device 3 further comprises a step of applying a certain pressure to the thermoplastic polymer device 3 by the microfeeding system 1 when the mold 4 and the thermoplastic polymer device 3 are not in a gap, so as to smooth the polymer microprotrusions extruded from the mold 4.
Further, the thermoplastic polymer device 3 is a PC, PMMA PVC, PVDF or PE device.
The invention also provides an ultrasonic friction imprinting device facing the thermoplastic polymer device, which comprises a mold 4, a micro-feeding system 1 and an ultrasonic device 6 arranged on the side surface of the thermoplastic polymer device 3, wherein the thermoplastic polymer device 3 is arranged between the mold 4 and the micro-feeding system 1, and the ultrasonic frequency emitted by the ultrasonic device 6 is 200Hz-40 KHz.
Further, the ultrasonic friction-imprinting apparatus facing the thermoplastic polymer device further includes a rough-feeding system 2 disposed before the micro-feeding system 1.
Further, the ultrasonic friction imprinting device facing the thermoplastic polymer device further comprises a sensor for detecting data of a temperature field and a stress strain field of the thermoplastic polymer imprinting process.
Further, the ultrasonic friction imprinting device facing the thermoplastic polymer device further comprises an ultrasonic vibration platform 5, wherein the thermoplastic polymer device 3 is placed on the ultrasonic vibration platform 5, and the ultrasonic wave propagates along the plane of the ultrasonic vibration platform 5.
In summary, the surface of the polymer is vibrated by transverse ultrasound to realize frictional heating, the micro-feeding system 1 controls the pressure of the imprinting process and detects real-time data of a temperature field and a stress strain field, so as to finish the precise control of surface friction and micro-feeding, realize the effective control of surface melting depth, realize the structural reconstruction of a melting area according to the micro-nano size requirement of the mold 4, and finish the manufacture of the high-density microfluidic chip. Moreover, the transverse vibration does not affect the internal structure of the thermoplastic polymer.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (7)

1. A method of ultrasonic friction embossing a thermoplastic polymer-oriented device, the method comprising:
detecting that the die and the thermoplastic polymer reach a critical in-out state by a micro-feeding system;
a step of applying pressure to the thermoplastic polymer by the micro-feeding system;
a step of starting an ultrasonic device disposed at a side of the thermoplastic polymer device before, during, or after any of the above steps, the ultrasonic device emitting ultrasonic waves having a frequency of 200Hz to 40 KHz;
the micro-feeding system detects the data of the temperature field and the stress strain field of the thermoplastic polymer imprinting process;
maintaining the pressure of the micro-feeding system for a certain time;
stopping the ultrasonic device;
and (5) demolding.
2. The method of claim 1, further comprising the step of applying a pressure to the thermoplastic polymer by the microfeeding system while the mold is free of space from the polymer, thereby smoothing the polymer microprotrusions extruded from the mold.
3. The ultrasonic friction embossing method towards thermoplastic polymer devices according to claim 1 or 2, characterized in that said thermoplastic polymer devices are PC, PMMA PVC, PVDF or PE devices.
4. An ultrasonic friction imprinting device facing a thermoplastic polymer device comprises a mold, a micro-feeding system and an ultrasonic device arranged on the side surface of the thermoplastic polymer device, wherein the micro-feeding system pushes the mold to move towards the thermoplastic polymer, and the ultrasonic frequency emitted by the ultrasonic device is 200Hz-40 KHz.
5. The ultrasonic friction embossing apparatus for thermoplastic polymer devices as claimed in claim 4, wherein the ultrasonic friction embossing apparatus for thermoplastic polymer devices further comprises a rough feeding system disposed before the micro feeding system.
6. The ultrasonic friction embossing apparatus for thermoplastic polymer devices as claimed in claim 4, wherein the ultrasonic friction embossing apparatus for thermoplastic polymer devices further comprises a sensor disposed at the data for detecting the temperature field and the stress strain field of the thermoplastic polymer embossing process.
7. The ultrasonic friction embossing apparatus for thermoplastic polymer devices of claim 4, wherein the ultrasonic friction embossing apparatus for thermoplastic polymer devices further comprises an ultrasonic vibration platform, the thermoplastic polymer devices are placed on the ultrasonic vibration platform, and the ultrasonic waves propagate along the plane of the ultrasonic vibration platform.
CN202010283505.9A 2020-04-13 2020-04-13 Ultrasonic friction imprinting method and device for polymer device Pending CN111361139A (en)

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113650279A (en) * 2021-08-19 2021-11-16 天津大学 Polymer ultrasonic-assisted linear friction imprinting device and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113650279A (en) * 2021-08-19 2021-11-16 天津大学 Polymer ultrasonic-assisted linear friction imprinting device and method

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