CN111347739B - Seawater-resistant anti-corrosion semiconductive water-blocking tape and preparation method thereof - Google Patents

Seawater-resistant anti-corrosion semiconductive water-blocking tape and preparation method thereof Download PDF

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CN111347739B
CN111347739B CN202010166780.2A CN202010166780A CN111347739B CN 111347739 B CN111347739 B CN 111347739B CN 202010166780 A CN202010166780 A CN 202010166780A CN 111347739 B CN111347739 B CN 111347739B
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seawater
conductive
semiconductive
semi
resistant
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CN111347739A (en
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杨宏艳
俞飞
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Shenyang Tianrong Cable Material Co ltd
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Shenyang Tianrong Cable Material Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0253—Polyolefin fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0276—Polyester fibres
    • B32B2262/0284—Polyethylene terephthalate [PET] or polybutylene terephthalate [PBT]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation
    • Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention discloses a seawater-resistant anti-corrosion semiconductive water-blocking tape and a preparation method thereof, and relates to the technical field of semiconductive water-blocking materials. The seawater-resistant and anti-corrosion semiconductive water-blocking tape consists of a base material layer, a first semiconductive adhesive layer, a semiconductive seawater-resistant material layer, a second semiconductive adhesive layer and a covering layer. The semi-conductive seawater-resistant material layer can be combined with the first semi-conductive adhesive layer and the second semi-conductive adhesive layer in various ways such as bonding, coating, dipping and the like. The manufacturing method of the seawater corrosion resistant semi-conductive water-blocking tape comprises the following steps: 1. manufacturing a base material, 2, applying semi-conductive glue; 3. applying semi-conductive seawater-resistant water-blocking powder, combining the semi-conductive seawater-resistant water-blocking powder with the substrate layer and the covering layer in a compounding and coating mode, and then drying, slitting and packaging to obtain a finished product. The semi-conductive water-blocking tape product has the advantages of high expansion speed in seawater, reliable water-blocking effect and good electrical property. The copper conductor is directly applied to the copper conductor, and basically no verdigris phenomenon is generated. And the production process is simple, the technical performance is stable, and the practicability is strong.

Description

Seawater-resistant anti-corrosion semiconductive water-blocking tape and preparation method thereof
Technical Field
The invention relates to the technical field of semiconductive water-blocking materials, in particular to a seawater-resistant anti-corrosion semiconductive water-blocking tape and a preparation method thereof.
Background
The semi-conductive water-blocking tape is generally formed by compounding two layers of semi-conductive non-woven fabrics and a high polymer water-absorbing material layer positioned in the middle layer, and is directly wrapped on the periphery of a conductor to play the roles of shielding and blocking water. The high molecular water-absorbing resin has a large water absorption rate in pure water due to the properties of the high molecular water-absorbing resin, but the water absorption rate in seawater is one tenth of the water absorption rate of the pure water, so the high molecular water-absorbing resin does not basically expand in seawater and cannot meet the water blocking requirement in a submarine cable. And the copper conductor is directly applied to the outside of the conductor, so that the copper conductor is easy to corrode, the strength of the copper conductor is reduced, and the resistance is obviously increased.
In view of this, the invention is particularly proposed.
Disclosure of Invention
The invention aims to provide a seawater-resistant anti-corrosion semiconductive waterproofing tape and a preparation method thereof so as to solve the problem that the conventional semiconductive waterproofing tape is difficult to use in a submarine cable.
The invention is realized by the following steps:
in a first aspect, an embodiment provides a seawater-resistant and anti-corrosion semiconductive waterproofing tape, which comprises a substrate layer, a first semiconductive adhesive layer, a semiconductive seawater-resistant waterproofing layer, a second semiconductive adhesive layer and a covering layer, wherein the substrate layer, the first semiconductive adhesive layer, the semiconductive seawater-resistant waterproofing layer, the second semiconductive adhesive layer and the covering layer are sequentially arranged;
the semiconductive seawater-resistant material layer comprises the following preparation raw materials in parts by weight: 1-20 parts of a mixture containing acrylate, 0.1-20 parts of a dispersing agent, 0.1-1 part of a conductive agent, 0.001-0.05 part of a cross-linking agent and 0.01-0.5 part of an initiator, wherein the mixture containing acrylate is obtained by mixing and reacting alkali, acrylic acid and a salt-resistant monomer, and the salt-resistant monomer comprises at least one of 4-acetyl acryloyl ethyl acetate and 2-methyl propyl sodium sulfonate.
In an alternative embodiment, the semiconductive seawater-resistant material layer is bonded to the first semiconductive adhesive layer and the second semiconductive adhesive layer by means of bonding, coating or impregnation;
preferably, the material of the substrate layer comprises bonding cloth, spun-bonded cloth, hot-rolled cloth or woven cloth;
preferably, the material of the cover layer is polyester, nylon or polypropylene.
In alternative embodiments, the dispersing agent comprises sodium nonylphenol polyoxyethylene ether sulfate and sorbitan fatty acid ester;
in an alternative embodiment, the dispersant is prepared from a mixture of, by mass, 1: 0.8-1.2 parts of sodium nonylphenol polyoxyethylene ether sulfate and sorbitan fatty acid ester;
in alternative embodiments, the crosslinking agent comprises polyethylene glycol diacrylate and N, N-methylene bisacrylamide; more preferably, the cross-linking agent is prepared from a mixture of 1: 0.8-1.2 of polyethylene glycol diacrylate and N, N-methylene-bisacrylamide;
in alternative embodiments, the initiator comprises sodium persulfate and sodium bisulfite; more preferably, the initiator is prepared from a mixture of monomers having a mass ratio of 2.5 to 3.5: 1 sodium persulfate and sodium bisulfite;
in an alternative embodiment, the conductive agent is furnace black;
in an alternative embodiment, the base is sodium hydroxide.
In an alternative embodiment, the ratio of the mass of the base, acrylic acid and salt-tolerant monomer is 3-3.5: 7-7.5: 1.5-1.9.
In an alternative embodiment, a method of preparing a semiconductive seawater-resistant material for forming a semiconductive seawater-resistant material layer comprises: and mixing the mixture containing the acrylate with a dispersing agent, a conductive agent, a crosslinking agent and an initiator, and carrying out static polymerization to obtain the hydrogel.
In an alternative embodiment, the dispersing agent, the conductive agent and the cross-linking agent are added into the mixture containing the acrylate, inert gas or nitrogen is introduced into the reaction container to replace oxygen in the reaction container, and then the initiator is added;
in an optional embodiment, the time for introducing the inert gas or the nitrogen is 25-35 min;
in an optional embodiment, the steps of drying, crushing and screening are further included after the hydrogel is obtained, so that the powdery semiconductive seawater-resistant material is obtained;
in an alternative embodiment, preparing the hydrogel further comprises preparing a mixture comprising an acrylate salt: alkali, acrylic acid and salt-resistant monomers are mixed and reacted to obtain a mixture containing acrylate.
In a second aspect, embodiments provide a method for preparing any one of the seawater corrosion resistant semi-conductive water blocking tapes, including:
applying semi-conductive glue on one surface of the substrate layer to form a first composite layer;
applying semi-conductive glue on one surface of the covering layer to form a second composite layer;
applying a semi-conductive seawater-resistant material capable of forming a semi-conductive seawater-resistant material layer on the surface of the first composite layer to which the semi-conductive glue is applied to obtain a third composite layer, combining the surface of the third composite layer to which the semi-conductive seawater-resistant material is applied with the surface of the second composite layer to which the semi-conductive glue is applied, or,
and applying a semi-conductive seawater-resistant material capable of forming a semi-conductive seawater-resistant material layer on the surface of the second composite layer applied with the semi-conductive adhesive to obtain a fourth composite layer, and combining the surface of the fourth composite layer applied with the semi-conductive seawater-resistant material with the surface of the first composite layer applied with the semi-conductive adhesive.
In an alternative embodiment, the manner of applying the semi-conductive adhesive on the substrate layer or the cover layer is as follows: and applying a semi-conductive glue solution on the substrate layer or the covering layer.
In an alternative embodiment, the semi-conductive glue solution consists of an aqueous acrylic emulsion, a dispersing agent, conductive carbon black and a cross-linking agent;
in an alternative embodiment, the rate of application of the semi-adhesive solution is 10-30 m/min.
In an alternative embodiment, the semi-conductive seawater-resistant material is applied in a powdery semi-conductive seawater-resistant material sprayed by equipment; more preferably, the linear speed is 10-30m/min when spraying;
in alternative embodiments, the bonding is by bonding, compounding or coating;
in an optional embodiment, a primary water-blocking tape is obtained after the combination, and the primary water-blocking tape is dried after being obtained;
in an alternative embodiment, the drying temperature is 120-200 ℃.
The invention has the following beneficial effects:
according to the seawater-corrosion-resistant semiconductive water-blocking tape and the preparation method thereof, the seawater-corrosion-resistant semiconductive water-blocking tape is prepared from the semiconductive seawater-resistant material, and the structure of the water-blocking tape is reasonably arranged, so that the prepared seawater-corrosion-resistant semiconductive water-blocking tape has excellent conductivity, seawater swelling resistance and seawater corrosion resistance. The water-blocking tape is directly applied to a copper conductor and basically has no verdigris phenomenon. And the production process is simple, the technical performance is stable, and the practicability is strong.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are conventional products which are not indicated by manufacturers and are commercially available.
The seawater-resistant anti-corrosion semiconductive waterproofing tape and the preparation method thereof provided by the embodiment of the invention are described in detail below.
The seawater-resistant and anti-corrosion semiconductive water-blocking tape provided by the embodiment of the invention comprises a substrate layer, a first semiconductive adhesive layer, a semiconductive seawater-resistant water-blocking layer, a second semiconductive adhesive layer and a covering layer which are sequentially arranged.
The semiconductive seawater-resistant material layer comprises the following preparation raw materials in parts by weight: 1-20 parts of a mixture containing acrylate, 0.1-20 parts of a dispersing agent, 0.1-1 part of a conductive agent, 0.001-0.05 part of a cross-linking agent and 0.01-0.5 part of an initiator, wherein the mixture containing acrylate is obtained by mixing and reacting alkali, acrylic acid and a salt-resistant monomer, and the salt-resistant monomer comprises at least one of 4-acetyl acryloyl ethyl acetate and 2-methyl propyl sodium sulfonate.
The raw materials for preparing the semi-conductive seawater-resistant material layer comprise the substances, so that the functional components of the semi-conductive seawater-resistant water-blocking material prepared from the materials comprise polyacrylate containing salt-resistant groups and a conductive agent, and the material has the characteristics of good water absorption performance, good expansibility in seawater, capability of meeting the water-blocking requirement in a submarine cable, good seawater corrosion resistance and excellent conductivity. The seawater-resistant and anti-corrosion semiconductive waterproofing tape provided by the embodiment of the invention comprises the semiconductive seawater-resistant material layers, and the structures of the layers are reasonably arranged, so that the seawater-resistant and anti-corrosion semiconductive waterproofing tape provided by the embodiment of the invention has excellent conductivity, seawater swelling resistance and seawater corrosion resistance, and has good protection effect on a conductor inner core, particularly a copper conductor.
Preferably, the dispersing agent comprises sodium nonylphenol polyoxyethylene ether sulfate and sorbitan fatty acid ester; when the dispersing agent is composed of the two substances, the water resistance and seawater corrosion resistance of the semiconductive seawater-resistant material can be ensured.
Further preferably, the dispersant is prepared by mixing, by mass, 1: 0.8-1.2 parts of sodium nonylphenol polyoxyethylene ether sulfate and sorbitan fatty acid ester.
Preferably, the cross-linking agent comprises polyethylene glycol diacrylate and N, N-methylene bisacrylamide, and when the cross-linking agent is formed by the two substances, the water resistance and seawater corrosion resistance of the semiconductive seawater-resistant material can be ensured; further preferably, the cross-linking agent is prepared from a mixture of 1: 0.8-1.2 of polyethylene glycol diacrylate and N, N-methylene-bisacrylamide.
Preferably, the initiator comprises sodium persulfate and sodium bisulfite, and when the initiator is the two substances, the water resistance and seawater corrosion resistance of the semiconductive seawater-resistant material can be ensured; more preferably, the initiator is prepared from the following components in a mass ratio of 2.5-3.5: 1 sodium persulfate and sodium bisulfite;
preferably, the conductive agent is furnace black, the furnace black has excellent conductivity and relatively low price, and the water resistance and corrosion resistance of the material prepared by selecting the furnace black and other raw materials are guaranteed.
Preferably, the alkali is selected from sodium hydroxide, and the inventor conducts creative work to find that the sodium hydroxide can ensure that the semi-conductive seawater-resistant material has better water resistance and seawater corrosion resistance.
Preferably, in order to ensure better water resistance and corrosion resistance of the semiconductive seawater-resistant material, the mass ratio of the alkali, the acrylic acid and the salt-resistant monomer is 3-3.5: 7-7.5: 1.5-1.9.
The preparation method of the semiconductive seawater-resistant material for forming the semiconductive seawater-resistant material layer comprises the following steps:
and mixing the mixture containing the acrylate with a dispersing agent, a conductive agent, a crosslinking agent and an initiator, and carrying out static polymerization to obtain the hydrogel.
The method comprises the following steps:
and S11, adding sodium hydroxide, acrylic acid and salt-resistant monomers into the three-necked bottle in sequence according to the mass ratio, mixing, and performing partial neutralization reaction to obtain a mixture containing acrylate.
S12, adding conductive slurry containing a dispersing agent and a conductive agent and a cross-linking agent into a mixture containing acrylate according to the parts by weight, introducing nitrogen or inert gas into the reaction container to replace oxygen in the reaction container so as to avoid oxygen participating in the reaction to generate unnecessary impurities, then adding an initiator to carry out a static polymerization reaction, and obtaining the hydrogel after the reaction is finished.
Preferably, the nitrogen or inert gas is introduced for 25-35min to ensure sufficient oxygen removal from the reaction vessel.
And S13, drying, crushing and screening the hydrogel to obtain the powdery semiconductive seawater-resistant material.
Preferably, the material of the substrate layer comprises a bonding fabric, a spun-bonded fabric, a hot-rolled fabric or a woven fabric. The covering layer is made of terylene, nylon or polypropylene.
The embodiment provides a preparation method of the seawater-resistant anti-corrosion semiconductive waterproofing tape. The method comprises the following steps:
and S21, applying semi-conductive glue on one surface of the substrate layer to form a first composite layer.
And preparing the base material meeting the requirements according to the specification requirements of the product.
And applying a semi-conductive glue solution on one surface of the substrate layer, wherein the linear speed is preferably 10-30m/min during working so as to form a first semi-conductive glue layer on one surface of the substrate layer to obtain a first composite layer.
In the invention, the semi-conductive adhesive is common semi-conductive adhesive commonly used in the field, in each embodiment provided by the invention, the semi-conductive adhesive solution mainly comprises aqueous acrylic emulsion, dispersant, conductive carbon black and cross-linking agent,
and S22, applying semi-conductive glue on one surface of the covering layer to form a second composite layer.
And manufacturing the covering layer meeting the requirements according to the specification requirements of the product.
And (3) forming a second semi-conductive adhesive layer on one side of the covering layer by using the semi-conductive adhesive solution on one side of the covering layer at the linear speed of preferably 10-30m/min during working so as to obtain a second composite layer. The semi-conductive glue solution used in the step is the same as that used in the previous step.
And S23, applying a semi-conductive seawater-resistant material on the surface of the first composite layer, to which the semi-conductive glue is applied, to form a third composite layer, and combining the surface of the third composite layer, to which the semi-conductive seawater-resistant material is applied, with the surface of the second composite layer, to which the semi-conductive glue is applied.
Or applying a semi-conductive seawater-resistant material on the surface of the second composite layer, on which the semi-conductive glue is applied, to form a fourth composite layer, and combining the surface of the fourth composite layer, on which the semi-conductive seawater-resistant material is applied, with the surface of the first composite layer, on which the semi-conductive glue is applied.
The two modes achieve the same technical effect.
Preferably, the application of the semi-conductive seawater-resistant material is to apply the powdery semi-conductive seawater-resistant material by adopting an equipment spraying mode so as to obtain a semi-conductive seawater-resistant water-blocking layer with good uniformity; more preferably, the linear speed at the time of spraying is 10 to 30 m/min.
Preferably, the bonding means is adhesive, composite or coating.
Preferably, a primary water-blocking tape is obtained after bonding, and the finished seawater-resistant anti-corrosion semiconductive water-blocking tape can be obtained after the primary water-blocking tape is obtained and dried. More preferably, in order to ensure the rapidness and no damage to the water-blocking tape, the drying temperature is 120-200 ℃.
The features and properties of the present invention are described in further detail below with reference to examples.
Example 1
The preparation method of the seawater-resistant anti-corrosion semiconductive waterproofing tape provided by the embodiment comprises the following steps:
(1) manufacturing a base material layer: adhesive cloth with single weight of 30g/m 2 0.12mm in thickness;
(2) applying a semi-conductive adhesive on the substrate layer: coating the semi-conductive glue solution on one surface of the bonding cloth in the step (1) at a linear speed of 15m/min in a composite mode to form a first semi-conductive glue layer with the thickness of the first semi-conductive glue layer, and obtaining a first composite layer;
(3) applying semiconductor glue on the covering layer: coating the semiconductive glue solution on one surface of the covering layer in a compounding mode at a linear speed of 15m/min to form a second semiconductive glue layer with the thickness of 15m/min to obtain a second composite layer;
(4) preparing a powdery semiconductive seawater-resistant material:
adding 3.2Kg of sodium hydroxide, 7.2Kg of acrylic acid and 1.59Kg of sodium 2-methylpropanesulfonate into a three-necked bottle in sequence, and carrying out partial neutralization reaction to generate acrylate so as to obtain a mixture containing the acrylate;
adding conductive slurry consisting of 0.4Kg of sodium nonylphenol polyoxyethylene ether sulfate as a dispersant, 0.4Kg of sorbitan fatty acid ester S-40 and 4Kg of furnace black as a conductive agent into a mixture containing acrylate; adding 0.005kg of cross-linking agent polyethylene glycol diacrylate and 0.005kg of N, N-methylene bisacrylamide, introducing nitrogen for 30min, and replacing oxygen in the reactor; then adding 0.15kg of initiator sodium persulfate and 0.05kg of sodium bisulfite for static polymerization to obtain hydrogel;
drying, crushing and screening the hydrogel to obtain the semiconductive seawater-resistant water-blocking powder.
(5) Applying semi-conductive seawater-resistant water-blocking powder: and (3) spraying the semi-conductive water-blocking powder to the surface, provided with the first semi-conductive adhesive layer, of the first composite layer of the product obtained in the step (2) at a linear speed of 15m/min to obtain a third composite layer.
(6) Combining: and combining the surface of the second composite layer provided with the second semi-conductive adhesive layer with the surface of the third composite layer provided with the semi-conductive seawater-resistant waterproof layer in a composite mode.
(5) And (3) drying: and (4) drying the product prepared in the step (4) at 150 ℃, and finishing to obtain the seawater-resistant anti-corrosion semiconductive waterproofing tape.
Example 2
The preparation method of the seawater-resistant anti-corrosion semiconductive waterproofing tape provided by the embodiment comprises the following steps:
(1) manufacturing a base material layer: hot rolled cloth with a single weight of 15g/m 2 0.06mm in thickness;
(2) applying a semi-conductive adhesive on the substrate layer: coating the semi-conductive glue solution on one surface of the bonding cloth in the step (1) at a linear speed of 20m/min in a composite mode to form a first semi-conductive glue layer with the thickness of the first semi-conductive glue layer, and obtaining a first composite layer;
(3) applying semiconductor glue on the covering layer: coating the semiconductive glue solution on one surface of the covering layer in a compounding mode at a linear speed of 15m/min to form a second semiconductive glue layer with the thickness of 15m/min to obtain a second composite layer;
(4) preparing a powdery semiconductive seawater-resistant material:
adding 3.2Kg of sodium hydroxide, 7.2Kg of acrylic acid and 1.89Kg of 4-acetyl acryloyl ethyl acetate into a three-necked bottle in sequence, and carrying out partial neutralization reaction to generate acrylate so as to obtain a mixture containing the acrylate;
adding conductive slurry consisting of 0.4Kg of sodium nonylphenol polyoxyethylene ether sulfate serving as a dispersant, 0.4Kg of sorbitan fatty acid ester S-40 and 4Kg of conductive agent furnace black into a mixture containing acrylate; adding 0.005kg of cross-linking agent polyethylene glycol diacrylate and 0.005kg of N, N-methylene bisacrylamide, introducing nitrogen for 30min, and replacing oxygen in the reactor; then adding 0.15kg of initiator sodium persulfate and 0.05kg of sodium bisulfite for static polymerization to obtain hydrogel;
drying, crushing and screening the hydrogel to obtain the semiconductive seawater-resistant water-blocking powder.
(5) Applying semi-conductive seawater-resistant water-blocking powder: and (3) spraying the semi-conductive water-blocking powder to the surface, provided with the first semi-conductive adhesive layer, of the first composite layer of the product obtained in the step (2) at a linear speed of 20m/min to obtain a third composite layer.
(6) Combining: and combining the surface of the second composite layer provided with the second semi-conductive adhesive layer with the surface of the third composite layer provided with the semi-conductive seawater-resistant waterproof layer in a composite mode.
(5) Drying: and (5) drying the product prepared in the step (4) at 180 ℃, and finishing to obtain the seawater-resistant anti-corrosion semiconductive waterproofing tape.
Example 3
This embodiment is substantially the same as embodiment 1 except that:
adding conductive slurry consisting of 10Kg of sodium nonylphenol polyoxyethylene ether sulfate serving as a dispersant, 10Kg of sorbitan fatty acid ester S-40 and 1Kg of furnace black serving as a conductive agent into 1Kg of the prepared mixture containing the acrylate; adding 0.0005kg of cross-linking agent polyethylene glycol diacrylate and 0.0005kg of N, N-methylene bisacrylamide, introducing nitrogen for 35min, and replacing oxygen in the reactor; then, 0.0007kg of sodium persulfate as an initiator and 0.0003kg of sodium bisulfite as an initiator were added thereto to carry out static polymerization to obtain a hydrogel.
Example 4
This embodiment is substantially the same as embodiment 1 except that:
adding 6Kg of sodium hydroxide, 15Kg of acrylic acid and 3Kg of 4-acetyl acryloyl ethyl acetate into a three-necked bottle in sequence, and carrying out partial neutralization reaction to generate acrylate so as to obtain a mixture containing the acrylate;
adding conductive slurry consisting of 0.05Kg of sodium nonylphenol polyoxyethylene ether sulfate serving as a dispersant, 0.05Kg of sorbitan fatty acid ester S-40 and 0.1Kg of conductive agent furnace black into 20Kg of the prepared mixture containing the acrylate; adding 0.025kg of cross-linking agent polyethylene glycol diacrylate and 0.025kg of N, N-methylene bisacrylamide, introducing nitrogen for 25min, and replacing oxygen in the reactor; then, 0.389kg of initiator sodium persulfate and 0.111kg of sodium bisulfite were added to carry out static polymerization to obtain hydrogel.
Example 5
This embodiment is substantially the same as embodiment 1 except that:
3.5Kg of sodium hydroxide, 7Kg of acrylic acid and 1.9Kg of ethyl 4-acetylacryloylacetate are added into a three-necked flask in sequence to generate acrylate through partial neutralization reaction, so as to obtain a mixture containing the acrylate.
Examples of the experiments
The seawater-resistant and anti-corrosion semi-conductive water-blocking tape prepared in the examples 1-5 is covered on the surface of a copper conductor, and the performances of the seawater-resistant and anti-corrosion semi-conductive water-blocking tape are tested by adopting JB/T10259-. The results are recorded in table 1.
TABLE 1 test data for various examples
Figure BDA0002407728580000111
As can be seen from the above table, the seawater corrosion resistant semiconductive waterproofing tape provided in examples 1 to 2 has a high expansion rate in seawater, a reliable waterproofing effect, and good electrical properties. Directly wound on a copper conductor, at temperature: 30 ℃ and humidity: and (3) putting the copper conductor into a constant temperature and humidity box under 90% of conditions, and taking out the copper conductor after 7 days, wherein the copper conductor basically has no verdigris phenomenon. And the production process is simple, the technical performance is stable, and the practicability is strong.
In conclusion, the semiconductive seawater-resistant material provided by the invention comprises the semiconductive seawater-resistant material layer, and the structures of the layers are reasonably arranged, so that the seawater-resistant and anti-corrosion semiconductive water-blocking tape provided by the embodiment of the invention has excellent conductivity and seawater corrosion resistance, has good expansion performance in seawater, and has good protection effect on the inner core of the conductor, especially on the copper conductor. According to the preparation method of the seawater corrosion resistant semiconductive waterproofing tape, the seawater corrosion resistant semiconductive waterproofing tape is prepared by adopting the semiconductive seawater corrosion resistant material, so that the prepared seawater corrosion resistant semiconductive waterproofing tape has excellent conductivity, seawater swelling resistance and seawater corrosion resistance.
The cable provided by the invention has excellent conductivity, water resistance and seawater corrosion resistance, and is very suitable for being used as a submarine cable.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (18)

1. The seawater-resistant anti-corrosion semiconductive waterproofing tape is characterized by comprising a substrate layer, a first semiconductive adhesive layer, a semiconductive seawater-resistant waterproofing layer, a second semiconductive adhesive layer and a covering layer which are sequentially arranged;
the semiconductive seawater-resistant water-resistant layer comprises the following preparation raw materials in parts by weight: 2.9975 parts of a mixture containing acrylate, 0.2 part of a dispersing agent, 1 part of a conductive agent, 0.0025 part of a cross-linking agent and 0.05 part of an initiator, wherein the mixture containing acrylate is obtained by mixing and reacting 0.8 part of sodium hydroxide, 1.8 parts of acrylic acid and 0.3975 parts of a salt-resistant monomer, the salt-resistant monomer is 2-methyl sodium propane sulfonate, and the dispersing agent is prepared by mixing and reacting 1: 1, sodium nonylphenol polyoxyethylene ether sulfate and sorbitan fatty acid ester; the cross-linking agent is prepared from the following components in a mass ratio of 1: 1, and N, N-methylene bisacrylamide; the initiator is prepared from the following components in a mass ratio of 3: 1 sodium persulfate and sodium bisulfite.
2. The seawater corrosion resistant semi-conductive waterproofing tape according to claim 1 wherein the semi-conductive seawater corrosion resistant waterproofing layer is bonded to the first semi-conductive adhesive layer and the second semi-conductive adhesive layer by means of bonding, coating or dipping.
3. The seawater corrosion resistant semi-conductive water blocking tape of claim 1, wherein the material of the substrate layer comprises spun-bonded cloth, hot-rolled cloth or woven cloth.
4. The seawater corrosion resistant semi-conductive water blocking tape of claim 1, wherein the material of the cover layer is terylene, nylon or polypropylene.
5. The seawater corrosion resistant semiconductive waterproofing tape according to claim 1 wherein the conductive agent is furnace black.
6. The seawater-corrosion-resistant semiconductive waterproofing tape according to any one of claims 1 to 5, wherein the preparation method of the semiconductive seawater-resistant material forming the semiconductive seawater-resistant waterproofing layer comprises: and mixing the mixture containing the acrylate with the dispersing agent, the conductive agent, the crosslinking agent and the initiator, and carrying out static polymerization to obtain the hydrogel.
7. The seawater corrosion resistant semiconductive waterproofing tape according to claim 6, wherein said dispersant, said conductive agent and said crosslinking agent are added to said acrylate-containing mixture, and then an inert gas or nitrogen gas is introduced into a reaction vessel to displace oxygen therein, followed by addition of said initiator.
8. The seawater-resistant anti-corrosion semiconductive waterproofing tape according to claim 7, wherein the time for introducing the inert gas or nitrogen is 25 to 35 min.
9. The seawater corrosion resistant semiconductive waterproofing tape according to claim 6, wherein the obtaining of the hydrogel further comprises drying, crushing and screening to obtain a powdery semiconductive seawater corrosion resistant material.
10. The seawater corrosion resistant semi-conductive waterproofing tape according to claim 6 wherein the preparing of the hydrogel further comprises preparing the acrylate containing mixture: and mixing and reacting the sodium hydroxide, the acrylic acid and the salt-tolerant monomer to obtain the mixture containing the acrylate.
11. A method for preparing the seawater corrosion resistant semi-conductive water blocking tape according to any one of claims 1 to 10, comprising:
applying semi-conductive glue on one surface of the substrate layer to form a first composite layer;
applying a semi-conductive adhesive on one surface of the covering layer to form a second composite layer;
applying a semi-conductive seawater-resistant material capable of forming the semi-conductive seawater-resistant water blocking layer on one surface of the first composite layer, which is applied with the semi-conductive glue, to obtain a third composite layer, combining the surface of the third composite layer, which is applied with the semi-conductive seawater-resistant material, with the surface of the second composite layer, which is applied with the semi-conductive glue,
or applying a semiconductive seawater-resistant material capable of forming the semiconductive seawater-resistant water-blocking layer on the surface, applied with the semiconductive glue, of the second composite layer to obtain a fourth composite layer, and combining the surface, applied with the semiconductive seawater-resistant material, of the fourth composite layer with the surface, applied with the semiconductive glue, of the first composite layer.
12. The method for preparing seawater corrosion resistant semi-conductive waterproofing tape according to claim 11,
the mode of applying the semi-conductive adhesive on the substrate layer or the covering layer is as follows: and applying a semi-conductive glue solution on the base material layer or the covering layer.
13. The preparation method of the seawater-resistant anti-corrosion semiconductive waterproofing tape according to claim 12, wherein the semiconductive glue solution consists of an aqueous acrylic emulsion, a dispersant, conductive carbon black and a crosslinking agent.
14. The preparation method of the seawater-resistant anti-corrosion semiconductive waterproofing tape according to claim 13, wherein the linear speed when the semiconductive glue solution is applied is 10 to 30 m/min.
15. The preparation method of the seawater corrosion resistant semiconductive waterproofing tape according to claim 14, wherein the semiconductive seawater resistant material is applied in a powdery form by spraying with equipment.
16. The method for preparing the seawater corrosion resistant semi-conductive water-blocking tape according to claim 15, wherein the linear speed is 10-30m/min when spraying.
17. The method for preparing the seawater corrosion resistant semi-conductive waterproofing tape according to claim 11 wherein the primary waterproofing tape is obtained after the bonding and dried after the primary waterproofing tape is obtained.
18. The preparation method of the seawater corrosion resistant semi-conductive water-blocking tape according to claim 17, wherein the drying temperature is 120-200 ℃.
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