CN111344907A

CN111344907A - Radio frequency transmission assembly and electronic equipment

Info

Publication number: CN111344907A
Application number: CN201880073876.5A
Authority: CN
Inventors: 兰尧; 王文; 孙树辉; 陈崇录
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2018-08-23
Filing date: 2018-08-23
Publication date: 2020-06-26
Anticipated expiration: 2038-08-23
Also published as: CN111344907B; WO2020037601A1

Abstract

The application discloses a radio frequency transmission assembly, including at least two connecting pieces. Each connecting piece all includes main part, two connection end portion and coupling portion, and two connection end portion connect respectively in the both ends of main part, and coupling portion connects in the middle part of main part, and coupling portion has the coupling surface, and the coupling surface of two adjacent connecting pieces sets up relatively and forms the condenser each other. The impedance of the radio frequency transmission assembly is controllable. The application also discloses an electronic device.

Description

Radio frequency transmission assembly and electronic equipment

Technical Field

The present application relates to the field of radio frequency signal transmission technologies, and in particular, to a radio frequency transmission assembly and an electronic device using the same.

Background

In electronic devices, it is often necessary to establish a radio frequency path between two components to transmit radio frequency signals. In order to reduce the requirements for assembly tolerances and increase fault tolerance, it is proposed by those skilled in the art that pogo pins or clips can be applied to the rf path. However, most of the pogo pins or clips in the conventional rf path are not impedance controlled, and are only suitable for a very short distance, and once the transmission path is long, the impedance of the pogo pins or clips is greatly increased, which results in a severe mismatch of the impedance of the rf path.

Disclosure of Invention

The application provides a radio frequency transmission assembly and electronic equipment applying the same.

In a first aspect, the present application provides a radio frequency transmission assembly. The radio frequency transmission assembly can be applied to electronic equipment. The radio frequency path of the electronic equipment comprises a first circuit board, a second circuit board and a radio frequency transmission assembly connected between the first circuit board and the second circuit board.

The radio frequency transmission assembly includes at least two connectors. Each connecting piece includes main part, two connection end and coupling portion. The two connecting end parts are respectively connected to two ends of the main body part. When a signal is transmitted through the connector, the signal is transmitted from one of the connection end portions to the other connection end portion through the main body portion. The coupling part is connected to the middle part of the main body part. The middle part of the main body part is positioned between the two ends of the main body part. The coupling portion has a coupling surface. The coupling surfaces of two adjacent connecting pieces are oppositely arranged and form a capacitor between each other. The coupling surfaces of two adjacent connectors correspond to two electrodes of the capacitor, and the air (or other insulating medium) between the coupling surfaces of two adjacent connectors corresponds to a dielectric medium between the two electrodes of the capacitor.

In this embodiment, since the coupling surfaces of two adjacent connectors are disposed to face each other and form a capacitor therebetween, the coupling surfaces of two adjacent connectors have a certain coupling area therebetween. Therefore, the coupling area between two adjacent connecting pieces is increased by additionally arranging the coupling part on the connecting pieces of the radio frequency transmission assembly. The radio frequency transmission assembly has the advantages that the coupling area of the two adjacent connecting pieces in the radio frequency transmission assembly is large, so that the impedance of the radio frequency transmission assembly is small and controllable, the impedance of the radio frequency transmission assembly can be matched with the impedance of the radio frequency transmission lines on the first circuit board and the second circuit board, the impedance matching of a radio frequency channel of the electronic equipment is facilitated, and radio frequency signals are effectively transmitted. Meanwhile, the radio frequency transmission assembly can reduce the insertion loss of the radio frequency channel and improve the transmission efficiency of the radio frequency channel.

In an alternative embodiment, the coupling surfaces of two adjacent connectors are parallel to each other. At this time, the projections of the coupling surfaces of two adjacent connecting pieces on the coupling central plane are partially overlapped or completely overlapped. The coupling center plane is perpendicular to the signal radiation path between two adjacent connecting pieces. Two adjacent connectors have two adjacent coupling surfaces, the two coupling surfaces face each other, and projections of the two coupling surfaces on the coupling central plane are overlapped, wherein the overlapping condition comprises partial overlapping and full overlapping.

In this embodiment, the overlapping area of the projections of the coupling surfaces of two connecting pieces on the coupling central plane is large, and the coupling area between the coupling surfaces of two adjacent connecting pieces is also large. Wherein, the coupling area is approximately the overlapping area of the projection of the coupling surfaces of two adjacent connecting pieces on the coupling central plane. When the projections of the coupling surfaces of two adjacent connecting pieces on the coupling central plane are all overlapped, the connecting pieces can greatly increase the coupling area between the two adjacent connecting pieces under the condition of increasing smaller volume.

In other embodiments, the coupling surfaces of two adjacent connectors may form an included angle therebetween. For example, two coupling surfaces facing each other form an angle between them within 0 ° and 45 °.

In an alternative embodiment, the coupling surface is planar. Alternatively, the coupling surface may be a curved surface with other shapes, such as a cambered surface and a wavy surface.

In an alternative embodiment, the coupling portion includes two coupling surfaces, and the two coupling surfaces are respectively located on two opposite sides of the main body portion. The two coupling surfaces are respectively positioned on two opposite sides of the main body part. In the embodiment, at least two connecting pieces can exchange the relative position relation of each connecting piece when being arranged, and the performance of the radio frequency transmission assembly is not influenced, so that the assembly difficulty of the radio frequency transmission assembly is reduced.

In an alternative embodiment, the radio frequency transmission assembly includes one or more sets of connectors. Each set of connectors includes three connectors arranged in the same direction. The two coupling surfaces of the connecting piece in the middle are respectively arranged opposite to the coupling surfaces of the connecting piece on the two sides. In other words, each group of connecting pieces comprises a first connecting piece, a second connecting piece and a third connecting piece, wherein the second connecting piece is a connecting piece positioned in the middle, and the first connecting piece and the third connecting piece are connecting pieces positioned on two sides. The coupling surface of the second connecting piece facing the first connecting piece is opposite to the coupling surface of the first connecting piece, and a capacitor is formed between the two coupling surfaces. The coupling surface of the second connecting piece facing the third connecting piece is opposite to the coupling surface of the third connecting piece, and a capacitor is formed between the two coupling surfaces.

The connecting pieces located in the middle are used for transmitting radio frequency signals, and the connecting pieces located on two sides are used for transmitting ground signals. The connecting pieces on the two sides can shield the radio frequency signals (transmitted in the connecting piece in the middle), and the radiation of the radio frequency signals is reduced, so that the loss of the radio frequency signals is reduced. And, when the connecting pieces are in multiple groups, the radio frequency signals transmitted in the connecting pieces in different groups have less interference to each other.

The two coupling surfaces of the connecting piece in the middle are respectively and completely opposite to the coupling surfaces of the connecting pieces on the two sides. That is, the projection of the coupling surface of the intermediate connecting element onto its corresponding coupling surface falls completely into the corresponding coupling surface. In other words, the connecting member located in the middle is the second connecting member, and the connecting members located on both sides are the first connecting member and the third connecting member. The projection of the coupling surface of the second connecting piece facing the first connecting piece onto the coupling surface of the first connecting piece falls completely into the coupling surface of the first connecting piece, the two coupling surfaces facing each other. The projection of the coupling surface of the second connection piece facing the third connection piece onto the coupling surface of the third connection piece falls completely into the coupling surface of the third connection piece, the two coupling surfaces facing each other.

In this embodiment, the radio frequency transmission component has a higher utilization rate of the coupling surface of the connecting piece located in the middle, and the coupling area between the coupling surfaces of two adjacent connecting pieces is larger, so that the impedance of the radio frequency transmission component is more controllable. Meanwhile, the connecting pieces on the two sides can fully shield the radio frequency signals (transmitted in the connecting piece in the middle) so as to reduce the loss of the radio frequency signals.

In one group of connecting pieces, the coupling surface of each connecting piece is perpendicular to the arrangement direction of the three connecting pieces. In this case, when the area of each coupling surface is limited, the coupling area between the coupling surfaces of two adjacent connectors is larger.

In an alternative embodiment, the connecting member is a metal spring. The coupling portion is bent with respect to the main body portion. Wherein, the coupling part and the main body part are integrally formed. The connecting piece can be formed by bending an integrated elastic sheet into a main body part, two connecting end parts and a coupling part. In the embodiment, the processing method of the connecting piece is simple, and the formed connecting piece is an integrated piece and has high structural strength.

Wherein, an angle of 85-95 degrees is formed between the coupling part and the main body part. At this moment, the two coupling parts on the two sides of the main body part are approximately perpendicular to the main body part, and the required arrangement space of the connecting pieces is approximately square, so that when the connecting pieces are approximately arranged in one direction, two adjacent connecting pieces can be relatively close to each other, the structure of the radio frequency transmission assembly is relatively compact, and the impedance is relatively small.

Wherein, each connection end portion all includes first end, second end and connects the middle part between first end and second end. The first end is fixedly connected with the main body part, the second end is arranged in a suspended mode, and the middle part protrudes towards the direction far away from the main body part relative to the first end and the second end. At the moment, the middle part of the connecting end part can have certain displacement deformation amount relative to the main body part when abutting against other parts, so that the connecting piece can absorb part of assembly tolerance, the assembly yield is higher, and the application range is wider.

Wherein, the connecting end part can be provided with a propping contact. The abutting contact is arranged in the middle. The end surface of the abutting contact relative to the middle part is protruded, so that the contact reliability with other parts is ensured. The retaining contacts may be formed by stamping.

In an alternative embodiment, the connector is a pogo pin. The coupling portion is mounted on the outer peripheral side of the body portion. The coupling part and the main body part are integrally formed, so that the processing procedure of the connecting piece is simplified, and the structural strength of the connecting piece is increased.

The main body part can be approximately cylindrical, and the coupling part is sleeved outside the main body part. The coupling portion includes a coupling surface. The coupling portion may be substantially cylindrical in shape with an inner circle and an outer circle. The circle in the inner circle and outer square is embodied that a round through hole is formed in the inner side of the coupling part, and the round through hole is matched with the shape of the main body part. The square in the "inner and outer circular" is mainly embodied in that the outer peripheral side surface of the coupling portion includes a flat coupling surface. For example, the coupling portion includes two coupling surfaces, and the two coupling surfaces are respectively located on two opposite sides of the main body portion. The two coupling surfaces can be connected through a plane or a cambered surface. Alternatively, in other embodiments, the coupling portion may include three or four coupling surfaces, and the three or four coupling surfaces may be directly connected to each other or connected by a plane or an arc surface. The positions and the number of the coupling surfaces are different when the positions and the number of the connecting pieces are different.

In an alternative embodiment, both connecting ends are ejector pins; or one of the connecting end parts is a thimble, and the other connecting end part is a conductive elastic sheet. For example, when the connection end is a thimble, the connection end of the other connector can be reliably held when the main body case and the charging case are assembled. When the connecting end part is the conductive elastic sheet, the connecting end part can be welded on the second circuit board, so that the connecting piece can be reliably connected with the second circuit board.

In a second aspect, the present application further provides an electronic device. The electronic device may be a wireless hotspot device. The electronic device includes a radio frequency path. The radio frequency channel comprises a first circuit board, a second circuit board and the radio frequency transmission assembly. The radio frequency transmission assembly is electrically connected between the first circuit board and the second circuit board.

In the application, the coupling part with the coupling surface is arranged on the connecting piece, the coupling surfaces of two adjacent connecting pieces are oppositely arranged, and the capacitors are formed between the coupling surfaces of the two adjacent connecting pieces, so that the coupling area between the two adjacent connecting pieces is increased, the impedance is reduced, the impedance of the radio frequency transmission assembly is controllable, the impedance of the radio frequency transmission assembly is matched with the impedance of the radio frequency transmission line on the first circuit board and the second circuit board, the impedance matching of a radio frequency channel of the electronic equipment is facilitated, and radio frequency signals are effectively transmitted. Meanwhile, the radio frequency transmission assembly can reduce the insertion loss of the radio frequency channel and improve the transmission efficiency of the radio frequency channel.

In an alternative embodiment, the first circuit board is provided with rf signal pads and ground pads. The connecting end of one of the two adjacent connectors of the radio frequency transmission assembly contacts the radio frequency signal pad, and the connecting end of the other connector contacts the grounding pad. For example, the number of the connectors is three, the connector in the middle contacts the rf trace, and the connectors on both sides contact the ground pad.

In an optional embodiment, the number of the rf transmission assemblies is at least two, and the at least two sets of rf transmission assemblies are connected in series between the first circuit board and the second circuit board. Because the quantity of the radio frequency transmission assemblies can be at least two groups, the adjustability of the relative position between the first circuit board and the second circuit board is stronger, the design flexibility of the specific structure and the arrangement position of the at least two groups of radio frequency transmission assemblies is higher, the applicability of a radio frequency channel is higher, and the application range is wider.

In an optional implementation manner, the connecting end portion of each connecting piece of one of the two adjacent sets of rf transmission assemblies has a supporting plane, and the connecting end portion of each connecting piece of the other set of rf transmission assemblies has a supporting contact, and the supporting contact supports the supporting plane.

In this embodiment, two sets of rf transmission assemblies are connected in series, and the connectors of the two sets of rf transmission assemblies are connected in series between the first circuit board and the second circuit board in a one-to-one correspondence. One of the two connecting pieces connected in series is provided with a butting plane, the other connecting piece is provided with a butting contact which butts against the butting plane, so that the butting connection relationship between the two connecting pieces is more reliable.

In an optional implementation manner, the electronic device further includes a host housing, a first group of antennas, a radio frequency chip, a charging housing, and a second group of antennas, wherein the first circuit board, the first group of antennas, and the radio frequency chip are accommodated in the host housing, the radio frequency chip is electrically connected to the first circuit board, the first group of antennas is electrically connected to the radio frequency chip, the second circuit board and the second group of antennas are accommodated in the charging housing, the second group of antennas is electrically connected to the second circuit board, and the radio frequency transmission assembly is installed in the host housing and/or the charging housing.

In this embodiment, since the second group of antennas may be connected to the rf chip through the rf path, the electronic device may transmit and receive signals through the first group of antennas and the second group of antennas connected to the rf chip, so that the number of antennas of the electronic device for transmitting and receiving signals is increased without increasing the volume of the main chassis, thereby increasing the channel capacity of the electronic device.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device provided in the present application in a use state;

FIG. 2 is a schematic diagram of the electronic device shown in FIG. 1 in another use state;

FIG. 3 is an exploded view of a portion of the electronic device shown in FIG. 1;

FIG. 4 is a schematic diagram of a portion of the electronic device shown in FIG. 1 at line A-A;

FIG. 5 is a schematic diagram of an RF path of the electronic device of FIG. 1 in one embodiment;

FIG. 6 is a schematic diagram of a set of RF transmission components of the RF path of FIG. 5;

FIG. 7 is a schematic structural view of a connector of the RF transmission assembly of FIG. 6;

FIG. 8 is a schematic diagram of an equivalent circuit when signals are transmitted in the two connectors shown in FIG. 6;

FIG. 9 is a schematic diagram of two conventional spring plates and an equivalent model of the two connectors shown in FIG. 6;

FIG. 10 is a graph of a possible insertion loss versus frequency based on the equivalent model of FIG. 9;

FIG. 11 is a schematic diagram of another set of RF transmission components of the RF path of FIG. 5;

FIG. 12 is a schematic structural view of a connector of the RF transmission assembly of FIG. 11;

FIG. 13 is a comparison graph of the initial efficiency of a possible antenna and the switching efficiency after switching through the RF path of FIG. 5;

FIG. 14 is a schematic diagram of an RF path of the electronic device of FIG. 1 in another embodiment;

FIG. 15 is a schematic illustration of a possible insertion loss of the antenna after being switched through the RF path of FIG. 14;

FIG. 16 is a schematic diagram of an RF path of the electronic device of FIG. 1 in a further embodiment;

FIG. 17 is a schematic diagram of a set of RF transmission components of the RF path of FIG. 16;

fig. 18 is a graph of a possible insertion loss versus frequency based on the rf path of fig. 16.

Detailed Description

The following description will be made with reference to the drawings in the embodiments of the present application.

Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of an electronic device 100 provided in the present application in one usage state, and fig. 2 is a schematic structural diagram of the electronic device 100 shown in fig. 1 in another usage state.

The electronic device 100 according to the embodiment of the present application may be a wireless hotspot device, a tablet Computer, a mobile phone, a Personal Computer (PC), a notebook Computer, a vehicle-mounted device, a network television, a wearable device, or the like. The present embodiment will be described by taking an example in which the electronic device 100 is a wireless hotspot device.

The electronic device 100 includes a main body case 10 and a charging case 20. The components of the electronic device 100 are partially located in the main body case 10 and partially located in the charging case 20. The main body case 10 and the charging case 20 are detachably connected. As shown in fig. 1, the main body case 10 may be fixed with the charging case 20; as shown in fig. 2, the main body case 10 may also be detached from the charging case 20.

The main body housing 10 and the charging housing 20 can be matched by a concave-convex structure. For example, one or more grooves or through holes 101 are formed on the main housing 10, one or more protrusions 201 are formed on the charging housing 20, and the protrusions 201 are inserted into the grooves or through holes 101 to fix the main housing 10 and the charging housing 20. An adsorption member such as a magnet assembly, etc. that adsorbs each other may be disposed between the wall surface of the groove or through hole 101 and the protrusion 201. Or, when the protrusion 201 extends into the groove or through hole 101, the inner peripheral wall surface of the groove or through hole 101 and the outer peripheral side wall of the protrusion 201 are in interference fit.

It is understood that, in the present embodiment, the electronic device 100 includes two housings (10, 20), the components of the electronic device 100 can be distributed in the main housing 10 and the charging housing 20 according to the requirement, the main housing 10 and the components accommodated in the main housing 10 together form a part of the electronic device 100, and the charging housing 20 and the components accommodated in the charging housing 20 form another part of the electronic device 100, and the two parts are detachably connected.

In other embodiments, the electronic apparatus 100 may include a housing, for example, a casing of the whole apparatus, and all components of the electronic apparatus 100 are accommodated in the casing of the whole apparatus. Alternatively, the electronic device 100 may include three or more housings in which the components of the electronic device 100 are distributed.

Referring to fig. 3 and fig. 4 together, fig. 3 is an exploded view of a part of the electronic device 100 shown in fig. 1, and fig. 4 is a schematic view of a part of the electronic device 100 shown in fig. 1 at a line a-a.

The electronic device 100 further comprises a first part 40, a second part 50 and a radio frequency path 30. The rf path 30 is connected between the first member 40 and the second member 50. The first component 40 includes, but is not limited to, one or more of an antenna, a radio frequency Chip, a baseband Chip, a Power Amplifier (PA), a filter, a Central Processing Unit (CPU), or a System On Chip (SOC). The second component 50 includes, but is not limited to, one or more of an antenna, a radio frequency chip, a baseband chip, a power amplifier, a filter, a central processing unit, or a system-on-chip. The radio frequency path 30 is capable of transmitting one or more of a radio frequency signal, a ground signal, a power signal between the first component 40 and the second component 50. The radio frequency signal includes a high frequency, a very high frequency, and an ultra high frequency, and has a frequency in a range of 300kHz to 300 GHz. The radio frequency signals may include, but are not limited to, Wireless-local-area-network (Wi-Fi) signals, Bluetooth signals, Global Navigation Satellite System (GNSS), 2G (2-Generation Wireless telephone technology, second-Generation cellular communication technology) signals, 3G (3-Generation Wireless telephone technology, third-Generation cellular communication technology) signals, 4G (4-Generation Wireless telephone technology, fourth-Generation cellular communication technology) signals, or 5G (5-Generation Wireless telephone technology, fifth-Generation cellular communication technology) signals.

Wherein, the first part 40 can be accommodated in the main housing 10. The second member 50 may be housed in the charging case 20. The rf path 30 is installed at the main body case 10 and/or the charging case 20. In other words, the rf path 30 may be mounted to the main chassis 10; alternatively, the rf path 30 may be mounted to the charging housing 20; alternatively, a part of the rf path 30 is mounted to the main body case 10, and a part of the rf path 30 is mounted to the charging case 20. As shown in fig. 2 and 4, the present embodiment will be described by taking an example in which a part of the rf path 30 is mounted on the main body case 10 and a part of the rf path 30 is mounted on the charging case 20.

In one embodiment, first component 40 includes a baseband chip 401, an rf chip 402, and a first set of antennas 403. The rf chip 402 is electrically connected to the baseband chip 401, and the first group of antennas 403 is connected to the rf chip 402. Signals are transmitted between the baseband chip 401, the radio frequency chip 402, and the first group of antennas 403. The first set of antennas 403 includes one or more antennas 404.

The second part 50 comprises a second set of antennas 501. The second set of antennas 501 includes one or more antennas 502. The rf path 30 is used to transmit rf signals between the rf chip 402 and the second set of antennas 501. Wherein the second part 50 of the electronic device 100 may further comprise a charging assembly 503.

In this embodiment, since the second group antenna 501 may be connected to the rf chip 402 through the rf path 30, the electronic device 100 may transmit and receive signals through the first group antenna 403 and the second group antenna 501 connected to the rf chip 402, so as to increase the number of antennas of the electronic device 100 for transmitting and receiving signals and improve the channel capacity of the electronic device 100 without increasing the volume of the main chassis 10.

For example, the first group of antennas 403 includes 4 antennas 404, the second group of antennas 501 includes 4 antennas 502, and the electronic device 100 includes 8 antennas (404, 502), in some usage environments (e.g., indoors), the main housing 10 can be connected to the charging housing 20, and the 8 antennas (404, 502) can be used to meet the transceiving requirements of a Multiple-Input Multiple-Output (MIMO) system of 8 × 8, so that the channel capacity of the electronic device 100 increases.

Referring to fig. 3 and 4, the rf path 30 includes a first circuit board 60, a second circuit board 70 and an rf transmission assembly 80. The radio frequency transmission assembly 80 is electrically connected between the first circuit board 60 and the second circuit board 70. The radio frequency transmission assembly 80 is capable of transmitting radio frequency signals between the first circuit board 60 and the second circuit board 70.

The first circuit board 60 is accommodated in the main housing 10. The first antenna 403 and the rf chip 402 are housed in the main housing 10. The rf chip 402 is electrically connected to the first circuit board 60. A first set of antennas 403 is electrically connected to rf chip 402. The rf chip 402 may be fixed on the first circuit board 60. The base band chip 401 may be fixed on the first circuit board 60. The first set of antennas 403 may be secured to one or more of the opposing faces of the first circuit board 60. In other embodiments, the first set of antennas 403 may be fixed to the main housing 10.

The second circuit board 70 is accommodated in the charging case 20. The second group antenna 501 is housed in the charging case 20. The second set of antennas 501 is electrically connected to the second circuit board 70. The second set of antennas 501 may be mounted on one or more of the opposing faces of the second circuit board 70. In other embodiments, the second set of antennas 501 may be fixed to the charging housing 20.

The rf transmission assembly 80 is mounted to the main body case 10 and/or the charging case 20. In other words, the rf transmission assembly 80 is mounted to the main body housing 10; alternatively, the rf transmission assembly 80 is mounted to the charging housing 20; alternatively, a part of the rf transmission assembly 80 is mounted to the main body housing 10, and a part of the rf transmission assembly 80 is mounted to the charging housing 20.

In the present embodiment, a part of the rf transmission assembly 80 is mounted on the main body housing 10, and a part of the rf transmission assembly 80 is mounted on the charging housing 20.

Referring to fig. 3 and 4, the rf path 30 includes two rf transmission components 80. Two sets of rf transmission components 80 are connected in series between the first circuit board 60 and the second circuit board 70. One set of rf transmission components 80 is mounted to the main housing 10, and the other set of rf transmission components 80 is mounted to the charging housing 20.

In other embodiments, the number of rf transmission assemblies 80 may be three, four, etc. That is, the number of the rf transmission components 80 is at least two groups, and the at least two groups of the rf transmission components 80 are connected in series between the first circuit board 60 and the second circuit board 70. Because the number of the rf transmission assemblies 80 can be at least two groups, the adjustability of the relative position between the first circuit board 60 and the second circuit board 70 is stronger, and the design flexibility of the specific structure and arrangement position of at least two groups of the rf transmission assemblies 80 is higher, so that the applicability of the rf access 30 is higher, and the application range is wider. For example, the first circuit board 60 is fixed to the main body case 10, and the second circuit board 70 is fixed to the charging case 20. At least two sets of rf transmission assemblies 80 are partially mounted to the main housing 10 and partially mounted to the charging housing 20.

In other embodiments, the number of rf transmission components 80 may be a group. For example, the rf transmission assembly 80 is mounted to the main body case 10 or the charging case 20. When the rf transmission assembly 80 is installed in the main housing 10, one end of the rf transmission assembly 80 contacts the first circuit board 60, and the other end contacts the second circuit board 70 when the main housing 10 is connected to the charging housing 20. When the rf transmission assembly 80 is installed in the charging housing 20, one end of the rf transmission assembly 80 contacts the second circuit board 70, and the other end contacts the first circuit board 60 when the main housing 10 is connected to the charging housing 20.

Referring to fig. 2 and fig. 4, the main housing 10 is provided with a first through hole 102. The charging case 20 is provided with a second communication hole 202. One end of the rf transmission assembly 80 mounted on the main housing 10 contacts the first circuit board 60, and the other end (defined as the first connection end) is exposed or extended out of the main housing 10 through the first connection hole 102. One end of the rf transmission member 80 mounted to the charging housing 20 contacts the second circuit board 70, and the other end (defined as a second connection end) is exposed or protruded out of the charging housing 20 through the second communication hole 202. When the main housing 10 is connected to the charging housing 20, the first connection end is connected to the second connection end, and the two sets of rf transmission assemblies 80 connected in series electrically connect the first circuit board 60 and the second circuit board 70, so that the rf path 30 connects the first component 40 (e.g., the rf chip 402) and the second component 50 (e.g., the second set of antennas 501). As shown in fig. 2, when the main body case 10 is separated from the charging case 20, the first connection terminal is separated from the second connection terminal.

In this embodiment, the rf path 30 can be conducted at one time only by fixing the main body housing 10 to the charging housing 20, and thus the communication mode of the rf path 30 is simple and easy to implement. When the main body housing 10 is mated with the charging housing 20, the first communication hole 102, the second communication hole 202 and the rf path 30 are all surrounded or covered by the two housings, so that the overall appearance of the electronic device 100 is good.

In the present application, when the number of the rf transmission assemblies 80 in the rf path 30 is multiple, the structures of the rf transmission assemblies 80 in the multiple groups of rf transmission assemblies 80 may be the same or different.

Referring to fig. 5 to 7, fig. 5 is a schematic structural diagram of an rf path 30 of the electronic device 100 shown in fig. 1 in an embodiment, fig. 6 is a schematic structural diagram of one group of rf transmission elements 80 of the rf path 30 shown in fig. 5, and fig. 7 is a schematic structural diagram of a connection element 8 of the rf transmission element 80 shown in fig. 6. The two sets of rf transmission components 80 have substantially the same structure, but some differences in detail exist.

Each set of rf transmission assemblies 80 comprises at least two connectors 8. At least two connectors 8 are connected side by side between the first circuit board 60 and the second circuit board 70. The structure of each of the at least two connecting members 8 may be the same or different. The present embodiment is described by taking an example in which the structures of the respective connectors 8 of at least two connectors 8 in a group of rf transmission assemblies 80 are the same. The identical structure of each connecting member 8 is not only beneficial to the mass production of the radio frequency transmission assembly 80, but also beneficial to the simplification of the assembling procedure of the radio frequency transmission assembly 80.

Each connector 8 includes a main body 81, two connecting ends 82, and a coupling portion 83. The two connecting end portions 82 are connected to the two ends 811 of the body portion 81, respectively. When a signal is transmitted in the connector 8, the signal is transmitted from one of the connection end portions 82 to the other connection end portion 82 via the main body portion 81. The coupling portion 83 is connected to the middle portion 812 of the main body portion 81. A middle portion 812 of body portion 81 is located between two ends 811 of body portion 81. The coupling portion 83 is located between the two connecting end portions 82. The coupling portion 83 has a coupling surface 831. The coupling surfaces 831 of two adjacent connecting members 8 are disposed opposite to each other and form a capacitor therebetween. The coupling surfaces 831 of two adjacent connecting members 8 correspond to two electrodes of the capacitor, and the air (or other insulating medium) between the coupling surfaces 831 of two adjacent connecting members 8 corresponds to a dielectric between the two electrodes of the capacitor.

In the present embodiment, since the coupling surfaces 831 of two adjacent connection members 8 are disposed opposite to each other and form a capacitor therebetween, a certain coupling area is provided between the coupling surfaces 831 of two adjacent connection members 8. Therefore, in the frequency transmission module 80, the coupling area between two adjacent connectors 8 is increased by adding the coupling portion 83 to the connector 8.

As shown in fig. 6, in one embodiment, the coupling surfaces 831 of two adjacent connecting members 8 are parallel to each other. At this time, the projections of the coupling surfaces 831 of the adjacent two connecting members 8 on the coupling center plane 801 partially overlap or entirely overlap. The coupling center plane 801 is perpendicular to the signal radiation path 802 between two adjacent connectors 8. Two adjacent connecting pieces 8 have two adjacent coupling surfaces 831, the two coupling surfaces 831 face each other, and the projections of the two coupling surfaces 831 on the coupling center plane 801 overlap, and the overlapping condition includes partial overlap and full overlap. The coupling center plane 801 is a virtual plane that is substantially perpendicular to the signal radiation path 802 between two adjacent connectors 8. When the signal radiation paths 802 of the two connectors 8 are changed, the position of the coupling center plane 801 is also changed. For example, two adjacent connecting pieces 8 include two coupling surfaces 831 facing each other, wherein a projection of one coupling surface 831 onto a plane in which the other coupling surface 831 is located overlaps the other coupling surface 831, and the overlapping condition includes partial overlapping and full overlapping.

In the present embodiment, the projection overlapping area of the coupling surfaces 831 of two connecting members 8 on the coupling center plane 801 is large, and the coupling area between the coupling surfaces 831 of two adjacent connecting members 8 is also large. Wherein the coupling area is approximately the overlapping area of the projections of the coupling surfaces 831 of two adjacent connecting pieces 8 on the coupling central plane 801. When the projections of the coupling surfaces 831 of two adjacent connecting pieces 8 on the coupling central plane 801 are all overlapped, the connecting pieces 8 can greatly increase the coupling area between two adjacent connecting pieces 8 with the addition of a smaller volume.

In other embodiments, the coupling surfaces 831 of two adjacent connecting members 8 may form an included angle therebetween. For example, the two coupling surfaces 831 facing each other form an included angle therebetween within 0 ° to 45 °.

As shown in fig. 6, in one embodiment, the coupling surface 831 is planar. In other embodiments, the coupling surface 831 may also be a curved surface with other shapes, such as a cambered surface or a wavy surface.

As shown in fig. 5 and 6, in one embodiment, the coupling portion 83 includes two coupling surfaces 831. The two coupling surfaces 831 are located on opposite sides of the main body 81. The number of the coupling portions 83 is two, the two coupling portions 83 are respectively connected to two side edges 813 of the middle portion 812 of the main body portion 81, and the two side edges 813 are connected between two ends 811 of the main body portion 81. The two coupling surfaces 831 are located on the two coupling portions 83, respectively. In this embodiment, when the at least two connecting members 8 are arranged, the relative position relationship of the connecting members 8 can be exchanged with each other without affecting the performance of the rf transmission assembly 80, thereby reducing the difficulty in assembling the rf transmission assembly 80.

For example, the number of the connectors 8 of the radio frequency transmission assembly 80 is three. The three connecting members 8 are arranged in the same direction. The positions of the three connecting elements 8 can be reversed. The two coupling surfaces 831 of the middle connecting member 8 are respectively disposed opposite to the coupling surfaces 831 of the connecting members 8 on both sides (on the side near the middle connecting member 8).

As shown in fig. 7, the connecting member 8 is a metal spring. The coupling portion 83 is bent with respect to the body portion 81. The coupling portion 83 is integrally formed with the main body portion 81. For example, the connecting member 8 may be formed by bending the main body 81, the two connecting ends 82, and the coupling portion 83 from an integral elastic sheet. In this embodiment, the processing method of the connecting piece 8 is simple, and the formed connecting piece 8 is an integral piece with high structural strength.

Wherein, an angle of 85 ° to 95 ° is formed between the coupling portion 83 and the main body portion 81. At this time, the two coupling portions 83 on the two sides of the main body portion 81 are substantially perpendicular to the main body portion 81, and the required arrangement space of the connecting members 8 is substantially square, so that when the plurality of connecting members 8 are substantially arranged in one direction, the two adjacent connecting members 8 can be relatively close to each other, and the structure of the radio frequency transmission assembly 80 is relatively compact.

Each connecting end portion 82 includes a first end 821, a second end 822, and a middle portion 826 connected between the first end 821 and the second end 822. The first end 821 is fixedly connected to the main body 81, and the second end 822 is suspended. Middle portion 826 projects away from body portion 81 relative to first and second ends 821, 822. At this time, the connection end portion 82 may be substantially in the shape of a "√" or an inverted "√" shape. The middle portion 826 of the connecting end portion 82 has a certain displacement deformation amount relative to the main body portion 81 when abutting against other components, so that the connecting member 8 can absorb part of assembly tolerance, the assembly yield is higher, and the application range is wider.

Wherein, the connecting end 82 can be provided with a contact 823. In this embodiment, the holding contact 823 is disposed in the middle portion 826. The abutting contact 823 is projected relative to the end surface 824 of the middle portion 826, thereby ensuring contact reliability with other components. The holding contact 823 may be formed by punching.

The main body 81 may have one or more through holes 814.

Referring to fig. 8 and 9 together, fig. 8 is a schematic diagram of an equivalent circuit when signals are transmitted in the two connecting members 8 shown in fig. 6, and fig. 9 is a schematic diagram of two conventional elastic pieces and an equivalent model of the two connecting members 8 shown in fig. 6.

When signals are transmitted in the two connecting pieces 8, the connecting pieces 8 are equivalent to an inductor L and a resistor R, and the two connecting pieces 8 are in signal coupling to form an equivalent capacitor C and an equivalent conductance G. The impedance Z of the signal as it travels in the two connectors 8 is:

as shown in fig. 9, the left diagram in fig. 9 is a schematic diagram of an equivalent model of a conventional elastic piece, which includes a main body portion and two connecting end portions connected to two ends of the main body portion, so that the conventional elastic piece is substantially equivalent to the flat trace 41. When signals are transmitted in the two conventional elastic pieces, the impedance Z can easily reach a large value because the coupling area between the two conventional elastic pieces (mainly formed by the main body parts of the two conventional elastic pieces) is small. If the impedance Z is controlled to be close to the impedance of the radio frequency transmission line (50 ohms), the distance between the two elastic sheets needs to be controlled to be extremely small, and the production cannot be realized. The right side of fig. 9 shows a schematic diagram of an equivalent model of the connecting element 8 of the present application, since the connecting element 8 is additionally provided with the coupling portion 83 having the coupling surface 831, and the coupling surfaces 831 of two adjacent connecting elements 8 are oppositely arranged and form a capacitor therebetween, thereby increasing the coupling area between two adjacent connecting elements 8, and the connecting element 8 is approximately equivalent to the coupling wall 42 with a certain height. Because the coupling area of the two connecting pieces 8 is increased, the capacitance C and the conductance G between the two connecting pieces 8 are increased, and the inductance L and the resistance R in the connecting pieces 8 are reduced, so that the impedance Z can be effectively reduced, the impedance Z of the radio frequency transmission assembly 80 can be controlled, and the impedance Z can be close to the radio frequency transmission line impedance, so that the radio frequency path 30 realizes impedance matching.

Referring to fig. 10, fig. 10 is a graph of a possible insertion loss versus frequency (i.e., a graph of S21) based on the equivalent model shown in fig. 9. The abscissa of fig. 10 represents frequency in gigahertz (GHz); the ordinate represents the insertion loss in decibels (dB). 901 in fig. 10 corresponds to the left equivalent model in fig. 9; 902 corresponds to the right equivalent model in fig. 9. As can be seen from fig. 10, the insertion loss corresponding to the 902 curve is significantly smaller than that corresponding to the 901 curve at the same frequency. The coupling surface 831 is additionally arranged on the connecting piece 8, so that the insertion loss of the radio frequency access 30 using the connecting piece 8 is greatly reduced compared with the insertion loss of the radio frequency access 30 using the traditional elastic piece, and the improvement is obvious.

In one embodiment, referring to fig. 6, when the position and size of the coupling surface 831 of each connecting element 8 are adjusted, the gap S between the coupling surfaces 831 of two adjacent connecting elements 8, that is, the gap between two adjacent connecting elements 8, may also be adjusted, so as to better control the impedance of the rf transmission assembly 80. When the adjacent two connecting members 8 are closer to each other and the distance between the adjacent two coupling surfaces 831 is smaller, the capacitance C increases and the impedance Z of the rf transmission assembly 80 decreases.

Referring to fig. 5, 11 and 12 together, fig. 11 is a schematic structural diagram of another group of rf transmission elements 80 of the rf path 30 shown in fig. 5, and fig. 12 is a schematic structural diagram of the connecting element 8 of the rf transmission element 80 shown in fig. 11.

The radio frequency transmission assembly 80 shown in fig. 12 differs from the radio frequency transmission assembly 80 shown in fig. 6 in that: one of the connection ends 82 of the connection member 8 in the radio frequency transmission assembly 80 shown in fig. 12 has a butting flat 825. A holding plane 825 may be provided on the middle section 826 of the connecting end portion 82. Specifically, the connecting end 82 of each connector 8 of one of the two adjacent sets of rf transmission components 80 (corresponding to fig. 12) has an abutting plane 825, and the connecting end 82 of each connector 8 of the other set of rf transmission components 80 (corresponding to fig. 6) has an abutting contact 823, and the abutting contact 823 abuts against the abutting plane 825.

In the present embodiment, two sets of rf transmission assemblies 80 are connected in series, and the connectors 8 of the two sets of rf transmission assemblies 80 are connected in series between the first circuit board 60 and the second circuit board 70 in a one-to-one correspondence manner. One of the two connecting members 8 connected in series is provided with a contact plane 825, the other connecting member 8 is provided with a contact 823, and the contact 823 contacts the contact plane 825, so that the contact connection between the two connecting members 8 is more reliable.

The radio frequency transmission assembly 80 shown in fig. 6 and the connection member 8 shown in fig. 7 are referred to for the other part design of the radio frequency transmission assembly 80 and the connection member 8 of the present embodiment, and detailed descriptions are omitted.

Further, referring to fig. 13, fig. 13 is a comparison graph of the initial efficiency of a possible antenna and the switching efficiency after switching through the rf path 30 shown in fig. 5. Wherein the antenna under test corresponds to one antenna 502 of the second set of antennas 501 in the present application. The abscissa of fig. 13 represents frequency in megahertz (MHz); the ordinate represents efficiency in decibels (dB). 903 in FIG. 13 represents the initial efficiency of the antenna in the range of 2500 MHz to 2700 MHz; 904 represents the switching efficiency of the antenna in the range of 2500 mhz to 2700 mhz; 905 represents the initial efficiency of the antenna in the range of 3400 mhz to 3580 mhz; 906 represents the switching efficiency of the antenna in the range of 3400 mhz to 3580 mhz. The difference between 904 and 903 and the difference between 906 and 905 represent the insertion loss. As can be seen from fig. 13, after the switching of the rf path 30, the insertion loss of the rf path 30 is less than 2 db, and the antenna efficiency of the whole system (including the rf path 30 and the antenna) is still higher than-3 db, i.e. 50%, so as to meet the index requirements of the mimo system in the B41 frequency band (working frequency: 2496 to 2690MHz) and the B42 frequency band (working frequency: 3400 to 3600 MHz).

Therefore, in the present application, the rf transmission assembly 80 is provided with the coupling portion 83 having the coupling surface 831 on the connecting component 8 (for example, a metal elastic sheet), and the coupling surfaces 831 of two adjacent connecting components 8 are oppositely disposed and form a capacitor therebetween, so that the coupling area between two adjacent connecting components 8 can be increased, thereby reducing impedance, and making the impedance of the rf transmission assembly 80 controllable, and the impedance of the rf transmission assembly 80 is matched with the impedance of the rf transmission lines on the first circuit board 60 and the second circuit board 70, which is beneficial to implementing impedance matching of the rf path 30, and at the same time, the insertion loss of the rf path 30 can be reduced, and the transmission efficiency of the rf path 30 can be improved.

Referring to fig. 5 and 14 together, fig. 14 is a schematic structural diagram of the rf path 30 of the electronic device 100 shown in fig. 1 according to another embodiment.

The radio frequency transmission assembly 80 includes one or more sets of connectors 8. Each set of links 8 comprises three links 8 arranged in the same direction. The rf transmission assembly 80 in the rf path 30 shown in fig. 5 includes a set of connectors 8. The rf transmission assembly 80 in the rf path 30 shown in fig. 14 includes two sets of connectors 8. The part comprised by one of the dashed boxes in fig. 14 is schematically shown as a set of connectors 8.

Wherein, the two coupling surfaces 831 of the connecting piece 8 in the middle are respectively arranged opposite to the coupling surfaces 831 of the connecting pieces 8 at both sides. In other words, each set of connecting members 8 includes a first connecting member, a second connecting member and a third connecting member, the second connecting member is a connecting member located in the middle, and the first connecting member and the third connecting member are connecting members located on both sides. The coupling surface of the second connecting piece facing the first connecting piece is opposite to the coupling surface of the first connecting piece, and a capacitor is formed between the two coupling surfaces. The coupling surface of the second connecting piece facing the third connecting piece is opposite to the coupling surface of the third connecting piece, and a capacitor is formed between the two coupling surfaces.

In one embodiment, the connectors 8 in the middle are used for transmitting radio frequency signals and the connectors 8 on both sides are used for transmitting ground signals. At this time, the connectors 8 at the two sides can shield the radio frequency signal (transmitted in the connector 8 at the middle), and reduce the radiation of the radio frequency signal, so as to reduce the loss of the radio frequency signal. Also, when the connectors 8 are in multiple sets, the radio frequency signals transmitted in different sets of connectors 8 interfere less with each other.

Referring to fig. 5, the present application will now be described with reference to the rf path 30 shown in fig. 5.

The first circuit board 60 is provided with a radio frequency signal pad 61 and a ground pad 62. The radio frequency signal pad 61 and the ground pad 62 are insulated from each other. The first circuit board 60 is further provided with a radio frequency trace 63. One end of the rf trace 63 is used to electrically connect the first component 40 (e.g., the rf chip 402). The other end of the rf trace 63 is connected to the rf signal pad 61. The connection end 82 of one 8 of the two adjacent connectors 8 of the rf transmission assembly 80 contacts the rf signal pad 61, and the connection end 82 of the other connector 8 contacts the ground pad 62. Specifically, of the three connectors 8 of the rf transmission member 80 adjacent to the first circuit board 60, the connector 8 located at the center contacts the rf signal pad 61, and the connectors 8 located at both sides contact the ground pad 62.

The second circuit board 70 is provided with a radio frequency signal pad 71 and a ground pad 72. The radio frequency signal pad 71 and the ground pad 72 are insulated from each other. The second circuit board 70 is further provided with a radio frequency trace 73. One end of the radio frequency trace 73 is used to electrically connect to the second component 50 (e.g., one antenna 502 of the second set of antennas 501). The other end of the rf trace 73 is connected to the rf signal pad 71. The connection end 82 of one 8 of the two adjacent connectors 8 of the rf transmission assembly 80 contacts the rf signal pad 71, and the connection end 82 of the other connector 8 contacts the ground pad 72. Specifically, of the three connectors 8 of the radio frequency transmission component 80 adjacent to the second circuit board 70, the connector 8 located in the middle contacts the radio frequency signal pad 71, and the connectors 8 located on both sides contact the ground pad 72.

Wherein, the two coupling surfaces 831 of the connecting piece 8 located in the middle are respectively completely opposite to the coupling surfaces 831 of the connecting pieces 8 located on both sides. That is, the projection of the coupling surface 831 of the connecting piece 8 located in the middle onto its corresponding coupling surface 831 completely falls into the corresponding coupling surface 831. In other words, the connecting member 8 located in the middle is the second connecting member, and the connecting members 8 located on both sides are the first connecting member and the third connecting member. The projection of the coupling surface of the second connecting piece facing the first connecting piece onto the coupling surface of the first connecting piece falls completely into the coupling surface of the first connecting piece, the two coupling surfaces facing each other. The projection of the coupling surface of the second connection piece facing the third connection piece onto the coupling surface of the third connection piece falls completely into the coupling surface of the third connection piece, the two coupling surfaces facing each other.

In this embodiment, the utilization rate of the rf transmission element 80 for the coupling surfaces 831 of the connecting elements 8 located in the middle is higher, and the coupling area between the coupling surfaces 831 of two adjacent connecting elements 8 is larger, so that the impedance of the rf transmission element 80 is more controllable. Meanwhile, the connectors 8 on both sides can sufficiently shield the radio frequency signal (transmitted in the connector 8 in the middle) to reduce the loss of the radio frequency signal.

Wherein, in a set of the connecting members 8, the coupling surfaces 831 of the respective connecting members 8 are perpendicular to the arrangement direction of the three connecting members 8. At this time, in the case where the area of each coupling surface 831 is limited, the coupling area between the coupling surfaces 831 of the adjacent two connection members 8 is larger.

It is understood that in the embodiment shown in fig. 5, each rf transmission component 80 includes a set of connectors 8 for connecting one antenna 502 to the rf chip 402. In the embodiment shown in fig. 14, each rf transmission assembly 80 includes two sets of connectors 8 for connecting two antennas 502 to the rf chip 402. In other embodiments, corresponding to fig. 4, each rf transmission assembly 80 may include four sets of connectors 8 to enable the four antennas 502 in the charging housing 20 to connect with the rf chip 402 in the main housing 10.

In other embodiments, when the number of the rf transmission assemblies 80 is one, the two connection ends 82 of the connector 8 located in the middle are respectively connected to the rf signal pads 61 on the first circuit board 60 and the rf signal pads 71 on the second circuit board 70, and the two connection ends 82 of the connectors 8 located on the two sides are respectively connected to the ground pads 62 on the first circuit board 60 and the ground pads 72 on the second circuit board 70.

In other embodiments, each set of connectors 8 in the rf transmission assembly 80 may also include two connectors 8.

Further, referring to fig. 15, fig. 15 is a schematic diagram of a possible insertion loss after the antenna is switched through the rf via 30 shown in fig. 14. Wherein the antenna under test corresponds to one antenna 502 of the second set of antennas 501 in the present application. The insertion loss is the difference between the initial efficiency of the antenna and the efficiency of the transition through the rf path 30 of fig. 14. The abscissa of fig. 15 represents frequency in megahertz (MHz); the ordinate represents the insertion loss in decibels (dB). 907 in figure 15 represents the insertion loss of the antenna signal through the first set of connectors 8 in the range of 2500 mhz to 2700 mhz; 908 represents the insertion loss of the antenna signal through the second set of connectors 8 in the range of 2500 mhz to 2700 mhz; 909 represents the insertion loss of the antenna signal through the first set of connectors 8 in the range of 3400 mhz to 3580 mhz; 9010 represents the insertion loss of the antenna signal through the second set of connectors 8 in the range 3400 mhz to 3580 mhz. As can be seen from fig. 15, after the transition of the rf path 30, the insertion loss of the rf path 30 is less than 2 db, and the insertion loss of the rf path 30 is very small, so that the whole system (including the rf path 30 and the antenna) can still maintain high efficiency, so as to meet the index requirements of the mimo system in the B41 and B42 frequency bands. Meanwhile, as can be seen from fig. 15, the insertion loss of the signals in the two groups of connecting elements 8 is close to each other, and both can meet the index requirements of the mimo system in the B41 and B42 frequency bands.

Referring to fig. 16 and 17 together, fig. 16 is a schematic structural diagram of the rf path 30 of the electronic device 100 shown in fig. 1 according to still another embodiment; fig. 17 is a schematic diagram of a set of rf transmission components 80 of the rf path 30 shown in fig. 16.

The rf path 30 of fig. 16 differs from the rf path 30 of fig. 5 in that: the connectors 8 of one of the rf transmission assemblies 80 in the rf path 30 shown in fig. 16 are pogo pins. The following description mainly describes different points between the case where the connecting member 8 is a pogo pin and the case where the connecting member 8 is a metal dome, and the description thereof is omitted here for the sake of brevity.

The rf path 30 includes two sets of rf transmission components 80. The connector 8 of the rf transmission assembly 80 close to the first circuit board 60 is a spring plate, and the rf transmission assembly 80 close to the second circuit board 70 is a pogo pin.

The connector 8 includes a main body 81, two connecting ends 82, and a coupling portion 83. The two connecting end portions 82 are connected to opposite ends of the body portion 81. The coupling portion 83 is attached to the outer peripheral side of the body portion 81. The coupling portion 83 is integrally formed with the body portion 81 to simplify the process of manufacturing the connector 8 and to increase the structural strength of the connector 8. In other embodiments, the coupling portion 83 may be fixedly connected to the main body 81 by assembling.

The main body 81 may be substantially cylindrical, and the coupling portion 83 is disposed outside the main body 81. The coupling portion 83 includes a coupling surface 831. The coupling portion 83 may be a substantially cylindrical shape having an inner circular and an outer circular. The "circle" in the "inner circle outside" is embodied to have a circular through hole inside the coupling portion 83, which is adapted to the shape of the main body portion 81. The "square" in the "outer and inner circular" is mainly embodied in that the outer peripheral side surface of the coupling portion 83 includes a flat coupling surface 831. For example, the coupling portion 83 includes two coupling surfaces 831, and the two coupling surfaces 831 are located on opposite sides of the main body portion 81. The two coupling surfaces 831 can be connected by a plane or an arc surface. Alternatively, in other embodiments, the coupling portion 83 may include three or four coupling surfaces 831, and the three or four coupling surfaces 831 may be directly connected to each other or connected by a flat surface or an arc surface. When the arrangement positions and the number of the connecting members 8 are different, the arrangement positions and the number of the coupling surfaces 831 are also different.

In one embodiment, as shown in fig. 17, one of the connection end portions 82 of the connection member 8 is a thimble, and the other connection end portion 82 is a conductive elastic piece. For example, the connecting end 82 near the other set of rf transmission components 80 is a thimble to easily hold the connecting end 82 of the connecting part 8 of the other set of rf transmission components 80 when the main housing 10 is assembled with the charging housing 20. Meanwhile, the part of the charging housing 20 exposed out of the charging housing is only the end of the thimble, so that the electronic device 100 is more attractive, and meanwhile, the user is not easily scratched, so that the user experience is better. The connecting end 82 near the second circuit board 70 is a conductive elastic sheet. The conductive elastic pieces may be soldered on the second circuit board 70 so that the connector 8 is securely connected to the second circuit board 70.

In other embodiments, both connecting ends 82 of the connecting member 8 may be ejector pins. In this case, the connecting piece 8 has a smaller amount of material. The body portion 81, the two connecting end portions 82, and the coupling portion 83 of the connecting member 8 may be integrally molded.

The connecting end 82 of each connecting element 8 of one of the two adjacent sets of rf transmission assemblies 80 has a contact plane 825, the connecting end 82 of each connecting element 8 of the other set of rf transmission assemblies 80 has a contact 823 (i.e. an end of a thimble), and the contact 823 contacts the contact plane 825.

In other embodiments, the structures of the connecting members 8 of the rf transmission assemblies 80 in the rf path 30 can be flexibly combined according to the requirement, such as a combination of metal spring and metal spring, a combination of metal spring and pogo pin, or a combination of pogo pin and pogo pin.

Referring to fig. 18, fig. 18 is a graph of a possible insertion loss versus frequency (i.e., a graph of S21) based on the rf path 30 of fig. 16. The abscissa of fig. 18 represents frequency in gigahertz (GHz); the ordinate represents the insertion loss in decibels (dB). As can be seen from fig. 18, the frequency of the curve from the point M1 to the point M2 corresponds to the B41 band and the B42 band, and the insertion loss of the curve from the point M1 to the point M2 is between 0.87 db and 1.10 db. Therefore, when the connector 8 is a pogo pin in the present application, the insertion loss of the rf path 30 using the connector 8 can be controlled within a small range by adding the coupling surface 831, so as to meet the index requirements of the mimo system in the B41 frequency band and the B42 frequency band.

In the present application, the rf transmission assembly 80 is provided with the coupling portion 83 having the coupling surface 831 on the connecting element 8 (which may be a metal elastic sheet or a pogo pin), and the coupling surfaces 831 of two adjacent connecting elements 8 are oppositely disposed and form a capacitor therebetween, so as to increase the coupling area between two adjacent connecting elements 8, thereby reducing impedance, so that the impedance of the rf transmission assembly 80 is controllable, the impedance of the rf transmission assembly 80 is matched with the impedance of the rf transmission lines on the first circuit board 60 and the second circuit board 70, which is beneficial to the rf path 30 to realize impedance matching, thereby effectively transmitting rf signals. Meanwhile, the rf transmission component 80 can also reduce the insertion loss of the rf path 30, and improve the transmission efficiency of the rf path 30.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

The radio frequency transmission assembly is characterized by comprising at least two connecting pieces, wherein each connecting piece comprises a main body part, two connecting end parts and a coupling part, the two connecting end parts are respectively connected to two ends of the main body part, the coupling part is connected to the middle part of the main body part, the coupling part is provided with a coupling surface, and the coupling surfaces of two adjacent connecting pieces are oppositely arranged and form a capacitor with each other.
The radio frequency transmission assembly of claim 1, wherein the coupling faces of two adjacent connectors are parallel to each other.
The radio frequency transmission assembly according to claim 1 or 2, wherein the coupling portion includes two coupling surfaces, and the two coupling surfaces are respectively located on two opposite sides of the main body portion.
The rf transmission assembly of claim 3, wherein the rf transmission assembly includes one or more sets of the connectors, each set of the connectors includes three connectors arranged in the same direction, and two coupling surfaces of the connector located in the middle are respectively disposed opposite to the coupling surfaces of the connectors located at both sides.
The radio frequency transmission assembly according to claim 4, wherein the connector in the middle is used for transmitting radio frequency signals, the connectors on both sides are used for transmitting ground signals, and the two coupling surfaces of the connector in the middle are respectively and completely opposite to the coupling surfaces of the connectors on both sides.
The radio frequency transmission assembly according to claim 4 or 5, wherein in a set of the connectors, the coupling face of each of the connectors is perpendicular to an arrangement direction of three of the connectors.
The RF transmission assembly of any one of claims 1 to 6, wherein the connecting member is a metal spring, and the coupling portion is bent with respect to the main body portion.
The radio frequency transmission assembly of claim 7, wherein the coupling portion forms an angle of 85 ° to 95 ° with the main body portion.
The rf transmission assembly of claim 7 or 8, wherein each of the connecting end portions includes a first end, a second end, and a middle portion connected between the first end and the second end, the first end is fixedly connected to the main body portion, the second end is suspended, and the middle portion protrudes in a direction away from the main body portion relative to the first end and the second end.
The radio frequency transmission assembly according to any one of claims 1 to 6, wherein the connector is a pogo pin, and the coupling portion is mounted on an outer circumferential side of the main body portion.
The radio frequency transmission assembly of claim 10, wherein both of the connection ends are ejector pins; or one of the connecting end parts is a thimble, and the other connecting end part is a conductive elastic sheet.
A radio frequency transmission assembly according to any of claims 7 to 11, wherein the coupling portion is integrally formed with the body portion.
An electronic device comprising a first circuit board, a second circuit board, and the radio frequency transmission assembly of any of claims 1-12, the radio frequency transmission assembly being electrically connected between the first circuit board and the second circuit board.
The electronic device of claim 13, wherein the first circuit board is provided with a radio frequency signal pad and a ground pad, and a connection end of one of the connectors of two adjacent connectors of the radio frequency transmission assembly contacts the radio frequency signal pad, and a connection end of the other connector contacts the ground pad.
The electronic device of claim 13 or 14, wherein the number of the radio frequency transmission components is at least two groups, and at least two groups of the radio frequency transmission components are connected in series between the first circuit board and the second circuit board.
The electronic device of claim 15, wherein a connecting end of each of the connectors of one of the two adjacent sets of the rf transmission assemblies has a supporting plane, and a connecting end of each of the connectors of the other set of the rf transmission assemblies has a supporting contact, and the supporting contact supports against the supporting plane.
The electronic device according to any one of claims 13 to 16, further comprising a main housing, a first group of antennas, a rf chip, a charging housing, and a second group of antennas, wherein the first circuit board, the first group of antennas, and the rf chip are accommodated in the main housing, the rf chip is electrically connected to the first circuit board, the first group of antennas is electrically connected to the rf chip, the second circuit board and the second group of antennas are accommodated in the charging housing, the second group of antennas is electrically connected to the second circuit board, and the rf transmission assembly is mounted on the main housing and/or the charging housing.