CN111328187B - Printed circuit board and mobile terminal - Google Patents
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- CN111328187B CN111328187B CN202010166327.1A CN202010166327A CN111328187B CN 111328187 B CN111328187 B CN 111328187B CN 202010166327 A CN202010166327 A CN 202010166327A CN 111328187 B CN111328187 B CN 111328187B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
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Abstract
The present invention provides a printed circuit board including: the signal routing layer comprises a radio frequency signal wire, a radio frequency test seat, a signal jumping interlayer arranged below the signal routing layer, and a signal reference layer arranged below the signal jumping interlayer, wherein the signal jumping interlayer is provided with a clearance area which is positioned below the projection of the radio frequency test seat and the radio frequency signal wire. Different from the prior art, the printed circuit board provided by the invention has the advantages that the clearance area is arranged on the signal jump interlayer below the projection of the radio frequency test seat and the radio frequency signal wire, so that the reference planes of the radio frequency test seat and the radio frequency signal wire are both signal reference layers, the continuity of the impedance on the radio frequency link is improved, and the transmission quality of the radio frequency signal is improved.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a printed circuit board and a mobile terminal.
Background
A Printed Circuit Board (PCB) is an important component of an electronic product as a support for electronic components. With the rapid improvement of signal transmission speed and the wide application of high frequency circuits, the reliability of signal transmission becomes a key factor in the success or failure of PCB design, and therefore, in order to improve the reliability of signal transmission, higher requirements are put forward on the layout of the circuit in the PCB. In order to realize complete, reliable and low-interference signal transmission, impedance control design must be performed while the circuit layout in the PCB is performed, so as to ensure the continuity of impedance on the signal transmission path, thereby improving the signal transmission quality.
In the prior art, on a radio frequency transmission link, a radio frequency signal routing line is inconsistent with a reference plane of a rib line inside a radio frequency test seat, so that impedance on the radio frequency link cannot be optimally controlled, and the problem of discontinuous impedance exists in signal transmission, so that signal integrity is poor.
Disclosure of Invention
The invention provides a printed circuit board and a mobile terminal, which effectively solve the problem of poor signal integrity caused by impedance discontinuity on a radio frequency link.
In order to solve the above problems, the present invention provides a printed circuit board including:
the signal routing layer comprises a radio frequency signal wire and a radio frequency test seat;
the signal jumping interlayer is arranged below the signal routing layer and is provided with a clearance area which is positioned below the projection of the radio frequency test seat and the radio frequency signal wire;
and the signal reference layer is arranged below the signal jump interlayer.
In the printed circuit board provided by the invention, the distance between the radio frequency signal line and the signal reference layer is a reference distance, and the reference distance is inversely proportional to the width of the radio frequency signal line.
In the printed circuit board provided by the invention, the width of the radio frequency signal line is any value of 0.35 mm to 0.5 mm.
In the printed circuit board provided by the invention, the radio frequency test seat comprises a signal input end and a signal output end, and the radio frequency signal wire is respectively and electrically connected with the signal input end and the signal output end.
In the printed circuit board provided by the invention, the radio frequency test socket comprises a test socket rib line, two ends of the test socket rib line are respectively and electrically connected with the signal input end and the signal output end, and the test socket rib line, the signal input end, the signal output end and the radio frequency signal line are positioned on the same plane layer, so that the vertical distances between the test socket rib line, the signal input end, the signal output end and the radio frequency signal line and the signal reference layer are the same.
In the printed circuit board provided by the invention, the width of the test seat rib line is any value of 0.4 mm to 0.5 mm.
In the printed circuit board provided by the invention, the clearance area is positioned below the projections of the test socket rib line, the signal input end, the signal output end and the radio frequency signal line.
In the printed circuit board provided by the invention, the signal jump interlayer further comprises a non-clearance area, and the material of the non-clearance area comprises copper.
In the printed circuit board provided by the invention, the impedance of the radio frequency signal line is 50 ohms.
In order to solve the above problem, another aspect of the present invention further provides a mobile terminal including the printed circuit board according to any one of the above aspects.
The invention has the beneficial effects that: the present invention provides a printed circuit board including: the signal routing layer comprises a radio frequency signal wire, a radio frequency test seat, a signal jumping interlayer arranged below the signal routing layer, and a signal reference layer arranged below the signal jumping interlayer, wherein the signal jumping interlayer is provided with a clearance area which is positioned below the projection of the radio frequency test seat and the radio frequency signal wire. Different from the prior art, the printed circuit board provided by the invention has the advantages that the clearance area is arranged on the signal jump interlayer below the projection of the radio frequency test seat and the radio frequency signal wire, so that the reference planes of the radio frequency test seat and the radio frequency signal wire are both signal reference layers, the continuity of the impedance on the radio frequency link is improved, and the transmission quality of the radio frequency signal is improved.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments according to the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a printed circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic top plan view of an RF test socket configuration according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
It should be noted that the thicknesses and shapes in the drawings of the present invention do not reflect actual proportions, and are merely intended to schematically illustrate various embodiments of the present invention.
Printed circuit boards are one of the important components of the electronics industry, and almost every electronic device, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, and so on, requires the use of printed circuit boards for the electrical interconnection between the various components, provided they have electronic components such as integrated circuits. The printed circuit board is composed of an insulating base plate, connecting leads and a bonding pad for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating base plate. The circuit can replace complex wiring to realize electrical connection among elements in the circuit, thereby simplifying the assembly and welding work of electronic products, reducing the wiring workload in the traditional mode and greatly lightening the labor intensity of workers; and the volume of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved. With the rapid improvement of signal transmission speed and the wide application of high frequency circuits, the reliability of signal transmission becomes a key factor in the success or failure of PCB design, and therefore, in order to realize complete, reliable and low-interference signal transmission, the impedance control design must be performed while the circuit layout in the PCB is performed to ensure the continuity of impedance on the signal transmission path, thereby improving the signal transmission quality.
However, in the prior art, on a radio frequency transmission link, the reference plane of a radio frequency signal routing line and a radio frequency test seat internal rib line is not consistent, so that the impedance on the radio frequency link cannot be optimally controlled, and the problem of impedance discontinuity exists in signal transmission, so that the signal integrity is poor. The application provides a printed circuit board and a mobile terminal, and the problem that the integrity of signals is poor due to impedance discontinuity on a radio frequency link is effectively solved.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention, in which components and relative positions of the components can be visually seen.
As shown in fig. 1, the printed circuit board 10 includes: signal routing layer 11, signal interlayer jump layer 12 and signal reference layer 13. Wherein, the signal routing layer 11 includes a radio frequency signal line 111 and a radio frequency test socket 112; the signal jump interlayer 12 is arranged below the signal routing layer 11, the signal jump interlayer 12 is provided with a clearance area 121, and the clearance area 121 is positioned below the projection of the radio frequency signal line 111 and the radio frequency test seat 112; the signal reference layer 13 is disposed below the signal interlayer jump layer 12.
Further, the impedance of the rf signal line 111 is generally 50 ohms, and when in an ideal state, the width of the rf signal line 111 is generally controlled to be about 7 mils (equal to 0.0254 mm), but in practical applications, because the rf signal line 111 has a high requirement for signal quality, consideration is needed for interference resistance (interference resistance: meaning that the device can prevent electromagnetic interference acting on the device through the antenna input end, the housing of the device, and along the power line), signal attenuation (signal attenuation: when a signal propagates in a transmission medium, a part of energy is converted into heat energy or absorbed by the transmission medium, thereby causing continuous reduction of signal strength, the degree of signal attenuation is not only an important index for evaluating the quality of communication, but also directly affects the characteristics of capacity expansion and upgrade of the communication system, relay distance in the arrangement of the communication transmission cable, and the like), and skin effect (skin effect: when there is an ac or an alternating electromagnetic field in the conductor, the current distribution inside the conductor is not uniform, the current is concentrated in the "skin" part of the conductor, that is to say the current is concentrated in a thin layer on the outside of the conductor, the closer to the surface of the conductor, the higher the current density, and the lower the current actually flows inside the conductor. As a result, the resistance of the conductor increases, and the power loss thereof also increases), and so on, the width of the rf signal line 111 in practical application is controlled to be between 0.35 mm and 0.5 mm, but the impedance of the rf signal line 111 decreases after the rf signal line 111 is thickened, and the impedance is larger as the distance between the rf signal line 111 and the signal reference layer 13 is larger, so in the embodiment of the present application, the impedance of the rf signal line 111 is controlled to be about 50 ohms by using the interlayer reference method. Therefore, when the distance between the rf signal line 111 and the signal reference layer 13 is defined as the reference distance, the reference distance is inversely proportional to the width of the rf signal line 111, that is, the larger the reference distance, the smaller the width of the rf signal line 111, and the smaller the reference distance, the larger the width of the rf signal line 111.
Specifically, the reference distance is related to the thickness of each layer of the pcb 10, the thickness of the pcb 10 is different between different devices, and the thickness of each layer of the pcb 10 is isolated by the substrate, and if the substrate is used differently, the thickness distance between each layer is different, and the reference distance is different.
Further, referring to fig. 2, fig. 2 is a schematic top plan view of a radio frequency test socket structure according to an embodiment of the present invention, in which components and relative positions of the components can be visually seen.
As shown in fig. 2, the rf test socket 112 includes: signal input 1121, signal output 1122, and test socket muscle wire 1123. The rf signal line 111 is electrically connected to the signal input end 1121 and the signal output end 1122 (not shown); two ends of the test socket rib wire 1123 are electrically connected to the signal input end 1121 and the signal output end 1122, respectively, and the test socket rib wire 1123, the signal input end 1121, the signal output end 1122 and the radio frequency signal wire 111 are located on the same plane layer, so that the vertical distances between the test socket rib wire and the signal reference layer 13 are the same, and thus the impedance on the radio frequency link can be optimally controlled, so that the impedance of signal transmission is more consistent, and the signal integrity is better.
Specifically, the test socket rib 1123 inside the radio frequency test socket 112 is a mechanical switch similar to a press-fit type elastic sheet, when an external test probe is not pressed into the radio frequency test socket 112, the internal test socket rib 1123 is in a closed state, and a signal passes through the signal input end 1121 to the signal output end 1122 to be in a through state; when the test probe is pressed into the rf test socket 112, the antenna load can be disconnected for testing the rf characteristics of the pcb 10.
Further, the width of the signal input end 1121 and the signal output end 1122 is any value from 0.35 mm to 0.5 mm, and is close to the width of the rf signal line 111, so that the continuity of the impedance on the rf link is improved.
Further, the width of the test seat rib line 1123 is any value from 0.4 mm to 0.5 mm.
Further, the rf test socket 112 is generally disposed on the rf module of the pcb 10 at a location between the conductive network outputs to the antenna feed points.
Further, the signal-bounce spacer layer 12 also includes a non-clearance region 122, and the material of the non-clearance region 122 includes copper.
Further, the signal wiring layer 11 is used for bonding components, chip devices, connectors, and the like.
Different from the prior art, the printed circuit board 10 provided by the embodiment of the present invention includes: the signal routing layer 11, the signal routing layer 11 includes a radio frequency signal line 111 and a radio frequency test socket 112, a signal jump interlayer 12 disposed below the signal routing layer 11, the signal jump interlayer 12 having a clearance area 121, as shown in fig. 1, the clearance area 121 is located below a projection of the radio frequency signal line 111 and the radio frequency test socket 112, and a signal reference layer 13 disposed below the signal jump interlayer 12. Different from the prior art, in the printed circuit board 10 provided in this embodiment, the clearance area 121 is disposed on the signal jump spacer layer 12 below the projections of the radio frequency signal line 111 and the radio frequency test socket 112, so that the reference planes of the radio frequency signal line 111 and the radio frequency test socket 112 are both the signal reference layer 13, thereby improving the continuity of impedance on the radio frequency link and improving the transmission quality of the radio frequency signal.
In addition, according to a modification of the above embodiment, since it is substantially the same as the previous embodiment, the same reference numerals are given. According to this modified embodiment, the printed circuit board 10 includes: signal routing layer 11, signal interlayer jump layer 12 and signal reference layer 13. The signal routing layer 11 includes a radio frequency signal line 111 and a radio frequency test socket 112, and the radio frequency test socket 112 includes a signal input end 1121, a signal output end 1122 and a test socket rib line 1123; the signal jump spacer 12 is disposed below the signal routing layer 11, and the signal jump spacer 12 has a clearance area 121, different from the previous embodiment, the clearance area 121 is located below the projection of the test socket rib 1123, the signal input end 1121, the signal output end 1122, and the rf signal line 111; the signal reference layer 13 is disposed below the signal interlayer jump layer 12.
Further, the impedance of the rf signal line 111 is generally 50 ohms, and when in an ideal state, the width of the rf signal line 111 is generally controlled to be about 7 mils (equal to 0.0254 mm), but in practical applications, because the rf signal line 111 has a high requirement for signal quality, consideration is needed for interference resistance (interference resistance: meaning that the device can prevent electromagnetic interference acting on the device through the antenna input end, the housing of the device, and along the power line), signal attenuation (signal attenuation: when a signal propagates in a transmission medium, a part of energy is converted into heat energy or absorbed by the transmission medium, thereby causing continuous reduction of signal strength, the degree of signal attenuation is not only an important index for evaluating the quality of communication, but also directly affects the characteristics of capacity expansion and upgrade of the communication system, relay distance in the arrangement of the communication transmission cable, and the like), and skin effect (skin effect: when there is an ac or an alternating electromagnetic field in the conductor, the current distribution inside the conductor is not uniform, the current is concentrated in the "skin" part of the conductor, that is to say the current is concentrated in a thin layer on the outside of the conductor, the closer to the surface of the conductor, the higher the current density, and the lower the current actually flows inside the conductor. As a result, the resistance of the conductor increases, and the power loss thereof also increases), and so on, the width of the rf signal line 111 in practical application is controlled to be between 0.35 mm and 0.5 mm, but the impedance of the rf signal line 111 decreases after the rf signal line 111 is thickened, and the impedance is larger as the distance between the rf signal line 111 and the signal reference layer 13 is larger, so in the embodiment of the present application, the impedance of the rf signal line 111 is controlled to be about 50 ohms by using the interlayer reference method. Therefore, when the distance between the rf signal line 111 and the signal reference layer 13 is defined as the reference distance, the reference distance is inversely proportional to the width of the rf signal line 111, that is, the larger the reference distance, the smaller the width of the rf signal line 111, and the smaller the reference distance, the larger the width of the rf signal line 111.
Specifically, the reference distance is related to the thickness of each layer of the pcb 10, the thickness of the pcb 10 is different between different devices, and the thickness of each layer of the pcb 10 is isolated by the substrate, and if the substrate is used differently, the thickness distance between each layer is different, and the reference distance is different.
Further, the rf signal line 111 is electrically connected to the signal input terminal 1121 and the signal output terminal 1122 (not shown); two ends of the test socket rib wire 1123 are electrically connected to the signal input end 1121 and the signal output end 1122, respectively, and the test socket rib wire 1123, the signal input end 1121, the signal output end 1122 and the radio frequency signal wire 111 are located on the same plane layer, so that the vertical distances between the test socket rib wire and the signal reference layer 13 are the same, and thus the impedance on the radio frequency link can be optimally controlled, so that the impedance of signal transmission is more consistent, and the signal integrity is better.
Specifically, the test socket rib 1123 inside the radio frequency test socket 112 is a mechanical switch similar to a press-fit type elastic sheet, when an external test probe is not pressed into the radio frequency test socket 112, the internal test socket rib 1123 is in a closed state, and a signal passes through the signal input end 1121 to the signal output end 1122 to be in a through state; when the test probe is pressed into the rf test socket 112, the antenna load can be disconnected for testing the rf characteristics of the pcb 10.
Further, the width of the signal input end 1121 and the signal output end 1122 is any value from 0.35 mm to 0.5 mm, and is close to the width of the rf signal line 111, so that the continuity of the impedance on the rf link is improved.
Further, the width of the test seat rib line 1123 is any value from 0.4 mm to 0.5 mm.
Further, the rf test socket 112 is generally disposed on the rf module of the pcb 10 at a location between the conductive network outputs to the antenna feed points.
Further, the signal-bounce spacer layer 12 also includes a non-clearance region 122, and the material of the non-clearance region 122 includes copper.
Further, the signal wiring layer 11 is used for bonding components, chip devices, connectors, and the like.
Different from the prior art, the printed circuit board 10 provided by the embodiment of the present invention includes: the signal routing layer 11, the signal routing layer 11 includes a radio frequency signal line 111 and a radio frequency test socket 112, a signal jump interlayer 12 disposed below the signal routing layer 11, the signal jump interlayer 12 having a clearance area 121, the clearance area 121 being located below a projection of the test socket rib line 1123, the signal input end 1121, the signal output end 1122 and the radio frequency signal line 111, and a signal reference layer 13 disposed below the signal jump interlayer 12. Different from the prior art, in the printed circuit board 10 provided by the present invention, the clearance area 121 is provided on the signal jump spacer layer 12 below the projections of the test socket rib line 1123, the signal input end 1121, the signal output end 1122, and the radio frequency signal line 111, so that the reference planes of the radio frequency signal line 111 and the radio frequency test socket 112 are both the signal reference layer 13, thereby improving the continuity of impedance on the radio frequency link and improving the transmission quality of the radio frequency signal.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention, in which components of the present invention and relative position relationships of the components can be seen visually.
As shown in fig. 3, the mobile terminal 300 includes a printed circuit board 10 (not shown) mounted on the mobile terminal 300, and the printed circuit board 10 is provided with an RF circuit 310, a memory 320, an input unit 330, a display unit 340, a sensor 350, an audio circuit 360, a transmission module 370, a processor 380, and a power supply 390. The signal routing layer 11, the signal interlayer jump layer 12 and the signal reference layer 13 in the printed circuit board 10 are disposed on the RF circuit 310.
In particular, the RF circuit 310 is used for receiving and transmitting electromagnetic waves, and implementing interconversion between the electromagnetic waves and electrical signals, thereby communicating with a communication network or other devices. RF circuitry 310 may include various existing circuit elements for performing these functions, such as an antenna, a radio frequency transceiver, a digital signal processor, an encryption/decryption chip, a Subscriber Identity Module (SIM) card, memory, and so forth. RF circuit 310 may communicate with various networks such as the internet, an intranet, a wireless network, or with other devices over a wireless network. The wireless network may comprise a cellular telephone network, a wireless local area network, or a metropolitan area network. The Wireless network may use various Communication standards, protocols, and technologies, including, but not limited to, Global System for Mobile Communication (GSM), Enhanced Data GSM Environment (EDGE), Wideband Code Division Multiple Access (WCDMA), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Wireless Fidelity (Wi-Fi) (e.g., Institute of Electrical and Electronics Engineers (IEEE) standard IEEE802.11 a, IEEE802.11 b, IEEE802.11g, and/or IEEE802.11 n), Voice over Internet Protocol (VoIP), world wide mail Access (Microwave Access for micro), wimax-1, other suitable short message protocols, and any other suitable Protocol for instant messaging, and may even include those protocols that have not yet been developed.
The memory 320 may be configured to store software programs and modules, such as program instructions/modules corresponding to the automatic light supplement system and method for front-facing camera photographing in the foregoing embodiments, and the processor 380 executes various functional applications and data processing by running the software programs and modules stored in the memory 320, so as to implement the function of automatic light supplement for front-facing camera photographing. The memory 320 may include high speed random access memory and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 320 may further include memory located remotely from the processor 380, which may be connected to the mobile terminal 300 via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The input unit 330 may be used to receive input numeric or character information and generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function control. In particular, the input unit 330 may include a touch-sensitive surface 331 as well as other input devices 332. The touch-sensitive surface 331, also referred to as a touch screen or touch pad, may collect touch operations by a user on or near the touch-sensitive surface 331 (e.g., operations by a user on or near the touch-sensitive surface 331 using a finger, a stylus, or any other suitable object or attachment), and drive the corresponding connection device according to a predetermined program. Alternatively, the touch sensitive surface 331 may comprise two parts, a touch detection means and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 380, and can receive and execute commands sent by the processor 380. In addition, the touch-sensitive surface 331 may be implemented using various types of resistive, capacitive, infrared, and surface acoustic waves. The input unit 330 may comprise other input devices 332 in addition to the touch sensitive surface 331. In particular, other input devices 332 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like.
The display unit 340 may be used to display information input by or provided to the user and various graphical user interfaces of the mobile terminal 300, which may be made up of graphics, text, icons, video, and any combination thereof. The Display unit 340 may include a Display panel 341, and optionally, the Display panel 341 may be configured in the form of an LCD (Liquid Crystal Display), an OLED (Organic Light-Emitting Diode), or the like. Further, touch-sensitive surface 331 may overlay display panel 341, and when touch-sensitive surface 331 detects a touch operation thereon or thereabout, communicate to processor 380 to determine the type of touch event, and processor 380 then provides a corresponding visual output on display panel 341 in accordance with the type of touch event. Although in FIG. 3, touch-sensitive surface 331 and display panel 341 are implemented as two separate components for input and output functions, in some embodiments, touch-sensitive surface 331 and display panel 341 may be integrated for input and output functions.
The sensor 350 may be a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor that may adjust the brightness of the display panel 341 according to the brightness of ambient light, and a proximity sensor that may turn off the display panel 341 and/or the backlight when the mobile terminal 300 is moved to the ear. As one of the motion sensors, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally, three axes), can detect the magnitude and direction of gravity when the mobile phone is stationary, and can be used for applications of recognizing the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer and tapping), and the like; as for other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor, which may be further configured on the mobile terminal 300, detailed descriptions thereof are omitted.
The transport module 370 (e.g., a Wi-Fi module) may assist a user in sending and receiving e-mail, browsing web pages, accessing streaming media, etc., which provides wireless broadband internet access to the user. Although fig. 3 shows the transmission module 370, it is understood that it does not belong to the essential constitution of the mobile terminal 300 and may be omitted entirely within the scope not changing the essence of the invention as needed.
The processor 380 is a control center of the mobile terminal 300, connects various parts of the entire mobile phone using various interfaces and lines, and performs various functions of the mobile terminal 300 and processes data by operating or executing software programs and/or modules stored in the memory 320 and calling data stored in the memory 320, thereby integrally monitoring the mobile phone. Optionally, processor 380 may include one or more processing cores; in some embodiments, processor 380 may integrate an application processor, which primarily handles operating systems, user interfaces, applications, etc., and a modem processor, which primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into processor 380.
A power supply 390, such as a battery, is used to power the various components and, in some embodiments, may be logically coupled to the processor 380 via a power management system to manage charging, discharging, and power consumption via the power management system. The power supply 390 may also include any component including one or more of a dc or ac power source, a recharging system, a power failure detection circuit, a power converter or inverter, a power status indicator, and the like.
In addition to the above embodiments, the present invention may have other embodiments. All technical solutions formed by using equivalents or equivalent substitutions fall within the protection scope of the claims of the present invention.
In summary, although the preferred embodiments of the present invention have been described above, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (9)
1. A printed circuit board, comprising:
the signal routing layer comprises a radio frequency signal wire and a radio frequency test seat;
the signal jumping interlayer is arranged below the signal routing layer and is provided with a clearance area which is positioned below the projection of the radio frequency test seat and the radio frequency signal wire;
the signal reference layer is arranged below the signal jump interlayer;
the radio frequency test base comprises a test base rib line, a signal input end and a signal output end, two ends of the test base rib line are respectively electrically connected with the signal input end and the signal output end, a radio frequency signal line is respectively electrically connected with the signal input end and the signal output end, and the test base rib line and the radio frequency signal line are located on the same plane layer, so that the vertical distance between the test base rib line and the radio frequency signal line is the same as that between the signal reference layer and the signal reference layer.
2. The printed circuit board of claim 1, wherein the distance of the radio frequency signal line from the signal reference layer is a reference distance, the reference distance being inversely proportional to a width of the radio frequency signal line.
3. The printed circuit board of claim 1, wherein the width of the radio frequency signal line is any value of 0.35 mm to 0.5 mm.
4. The printed circuit board of claim 1, wherein the signal input, the signal output, and the radio frequency signal line are located on a same planar layer such that they are the same vertical distance from the signal reference layer.
5. The printed circuit board of claim 1, wherein the width of the test socket rib line is any value from 0.4 mm to 0.5 mm.
6. The printed circuit board of claim 1, wherein the clearance zone is located below a projection of the test socket trace, the signal input, the signal output, and the radio frequency signal trace.
7. The printed circuit board of claim 1, wherein the signal hop spacer layer further comprises a non-clearance zone, the material of the non-clearance zone comprising copper.
8. The printed circuit board of claim 1, wherein the impedance of the radio frequency signal line is 50 ohms.
9. A mobile terminal, characterized in that it comprises a printed circuit board according to any of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010166327.1A CN111328187B (en) | 2020-03-11 | 2020-03-11 | Printed circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010166327.1A CN111328187B (en) | 2020-03-11 | 2020-03-11 | Printed circuit board and mobile terminal |
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| Publication Number | Publication Date |
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| CN111328187A CN111328187A (en) | 2020-06-23 |
| CN111328187B true CN111328187B (en) | 2022-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010166327.1A Active CN111328187B (en) | 2020-03-11 | 2020-03-11 | Printed circuit board and mobile terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114051316B (en) * | 2022-01-11 | 2022-03-22 | 龙旗电子(惠州)有限公司 | Printed circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5184095A (en) * | 1991-07-31 | 1993-02-02 | Hughes Aircraft Company | Constant impedance transition between transmission structures of different dimensions |
| JP2002016326A (en) * | 2000-06-29 | 2002-01-18 | Toshiba Corp | Printed-wiring board and electronic equipment provided with the board |
| CN1780536A (en) * | 2004-11-25 | 2006-05-31 | 华为技术有限公司 | Impedance adjustment of multi-layer printing circuit board |
| WO2016101265A1 (en) * | 2014-12-26 | 2016-06-30 | 华为技术有限公司 | Radio frequency switch |
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2020
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| CN111328187A (en) | 2020-06-23 |
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