CN111326440A

CN111326440A - Substrate processing apparatus

Info

Publication number: CN111326440A
Application number: CN201811542542.6A
Authority: CN
Inventors: 童瑞发; 宋香怡
Original assignee: Scientech Corp
Current assignee: Scientech Corp
Priority date: 2018-12-17
Filing date: 2018-12-17
Publication date: 2020-06-23
Anticipated expiration: 2038-12-17
Also published as: CN111326440B

Abstract

A substrate processing apparatus includes a substrate carrying unit, a fluid supply unit, and a control unit. The substrate bearing unit comprises a rotating platform for arranging the substrate. The fluid supply unit includes at least one nozzle disposed corresponding to the turntable and controllably movable within a path through a center of the turntable to supply the processing fluid. The control unit is coupled with the fluid supply unit, comprises a human-computer interface and stores a control program. The human-computer interface is provided with a nozzle control block for an operator to input a control command, and the control unit receives the control command and controls the nozzle by the control program corresponding to the control command. The control unit can be used for the operator to set, change and control the parameters of the nozzle, and can greatly improve the operation flexibility of the substrate processing device.

Description

Substrate processing apparatus

Technical Field

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus in which a nozzle is controlled by a program.

Background

In semiconductor manufacturing, a substrate processing apparatus is often used to etch or clean a substrate. When etching or cleaning a substrate, a nozzle is used to supply a processing solution to the substrate, and the nozzle is moved relative to the substrate so that the processing solution can be uniformly distributed on the surface of the substrate. In a conventional substrate processing apparatus, the moving speed of the nozzle is controlled by a mechanical fixing mechanism. For example, a control disc is used to control the moving speed of a nozzle, the control disc divides 12 equal divisions in 360 degrees to correspond to the path range of a substrate surface, and the moving range of the nozzle corresponds to the path range of the substrate. When the moving speed or moving range of the nozzle needs to be changed, a new control panel needs to be redesigned to correspond to the moving speed or moving range of the nozzle to be changed, so that the operation flexibility of the substrate processing apparatus is greatly reduced.

Disclosure of Invention

It is an object of the present invention to provide a substrate processing apparatus that avoids at least one of the above-mentioned disadvantages of the background art.

In some embodiments, the substrate processing apparatus of the present invention includes a substrate supporting unit, a fluid supplying unit, and a control unit. The substrate bearing unit comprises a rotating platform for arranging the substrate. The fluid supply unit includes at least one nozzle disposed corresponding to the turntable and controllably movable within a path through a center of the turntable to supply the processing fluid. The control unit is coupled with the fluid supply unit, comprises a human-computer interface and stores a control program. The human-computer interface is provided with a nozzle control block for an operator to input a control command, and the control unit receives the control command and controls the nozzle by the control program corresponding to the control command.

In some embodiments, the control program presets N equally spaced and continuously distributed sections corresponding to the path range, where N is not less than 10, and the control command includes selecting two of the N sections as end sections of the nozzle movement range, so that the control program controls the nozzle to move between positions corresponding to the two end sections relative to the turntable.

In some embodiments, the control instructions further comprise setting the moving speed of the nozzle corresponding to each segment within the two end-point segment range, so that the control program controls the moving speed of the nozzle relative to the turntable when the nozzle is located at the position corresponding to each segment.

In some embodiments, the control instructions further include setting a fluid supply amount corresponding to each segment within the two-end segment range, so that the control program controls the processing liquid sprayed by the nozzle at the position corresponding to each segment to correspond to the fluid supply amount.

In some embodiments, the nozzle control block displays a rectangular coordinate frame, the rectangular coordinate frame has a first coordinate axis and a second coordinate axis, the first coordinate axis corresponds to the positions of the N sections, and the second coordinate axis corresponds to the moving speed of the nozzle, the human-machine interface has an input mode for the operator to select a plurality of coordinate positions within a range corresponding to the two end sections on the rectangular coordinate frame to generate the control command, so that the control command includes parameters corresponding to the coordinate positions.

In some embodiments, the nozzle control block displays an orthogonal coordinate frame having a first axis and a second axis, the first axis corresponds to the positions of the N sections, and the second axis corresponds to the fluid supply amount of the nozzle, and the human-machine interface has an input mode for the operator to select a plurality of coordinate positions corresponding to the two end sections on the orthogonal coordinate frame to generate the control command, such that the control command includes parameters corresponding to the coordinate positions.

In some embodiments, the input mode allows the operator to continuously select the coordinate position on the rectangular coordinate frame by signal-triggered determination to generate the control command.

In some embodiments, the input mode allows the operator to select a half range of coordinate positions corresponding to one of the two end point sections within the rectangular coordinate frame, and automatically select a half range of coordinate positions corresponding to the other end point section within the rectangular coordinate frame in a mirror symmetry pattern to generate the control command.

In some embodiments, the input mode allows the operator to select two coordinate positions corresponding to the two end point segments and at least one coordinate position corresponding to the two end point segment ranges on the rectangular coordinate frame, and the rest coordinate positions in the two end point segment ranges are automatically selected by the input mode in a manner of forming a line graph corresponding to the coordinate position selected by the operator to generate the control command.

In some embodiments, the control instructions further include setting a liquid supply time from when the nozzle starts to eject the processing liquid to when the nozzle finishes ejecting the processing liquid, and an initial supply position where the nozzle starts to eject the processing liquid with respect to the turntable.

In some embodiments, the control instructions further include setting a number of movements of the nozzle to reciprocate within a range corresponding to the two end zones, an initial supply position at which the nozzle starts to eject the processing liquid with respect to the turntable, and an end supply position at which the nozzle ends to eject the processing liquid with respect to the turntable.

In some embodiments, the control instructions further comprise setting at least one of a start supply position and an end supply position and the at least one of the start supply position and the end supply position is set outside the two end zones, wherein the start supply position is a position at which the nozzle starts to eject the processing liquid relative to the turntable, and the end supply position is a position at which the nozzle ends to eject the processing liquid relative to the turntable.

In some embodiments, the control instruction further includes setting an expected moving time, where the expected moving time is a time when the operator intends to move the nozzle from one end section to another end section, and the control program adjusts the moving speed of the nozzle corresponding to each section within the range of the two end sections, which has been set by the operator, according to the expected moving time, so that the time when the nozzle moves from one end section to another end section matches the expected moving time.

In some embodiments, the control program adjusts the moving speed of the nozzle corresponding to each segment within the two end-point segment range set by the operator in an equal adjustment manner.

In some embodiments, the control program compares an actual moving time of the nozzle from one end section to another end section with the expected moving time according to the actual moving time of the nozzle relative to the turntable, and if the expected moving time is different from the actual moving time, the control program adjusts the moving speed of the nozzle corresponding to each section within the range of the two end sections according to the error value.

In some embodiments, the fluid supply unit includes a plurality of nozzles, and the nozzle control block further allows the operator to select one of the nozzles to be used and input the control command.

In some embodiments, the apparatus further includes a plurality of collecting units respectively corresponding to the nozzles, and the nozzle control block further allows the operator to select the collecting unit corresponding to the nozzle to be used, so that the control unit controls the collecting unit to operate with the corresponding nozzle.

The invention has at least the following effects: the control unit can be used for the operator to set, change and control the parameters of the nozzle, and can greatly improve the operation flexibility of the substrate processing device.

Drawings

Other features and effects of the present invention will become apparent from the following detailed description of the embodiments with reference to the accompanying drawings, in which:

FIG. 1 is a block diagram of an embodiment of a substrate processing apparatus of the present invention;

FIG. 2 is a schematic view of this embodiment;

FIG. 3 is a schematic diagram illustrating the nozzle control block of this embodiment;

FIG. 4 is another schematic diagram illustrating the nozzle control block;

FIG. 5 is a schematic view illustrating a range of paths along which the nozzles of the embodiment move with respect to the turntable;

FIG. 6 is a schematic view illustrating a partial range of movement of the nozzle with respect to the turntable;

FIG. 7 is a schematic view illustrating another partial range of movement of the nozzle relative to the turntable;

FIG. 8 is a schematic view illustrating a further partial range of movement of the nozzle relative to the turntable;

FIG. 9 is a schematic diagram of a rectangular coordinate frame illustrating an aspect of the moving speed of the turntable when the nozzle control block sets the nozzle to be located at the corresponding segment position;

FIG. 10 is a diagram of the rectangular coordinate frame illustrating another aspect of the moving speed of the turntable when the operator sets the nozzle control block to be at the corresponding segment position;

FIG. 11 is a diagram of the rectangular coordinate frame illustrating another aspect of the moving speed of the turntable when the operator sets the nozzle control block to be at the corresponding segment position;

FIG. 12 is a diagram of the rectangular coordinate frame illustrating another aspect of the moving speed of the turntable when the operator sets the nozzle control block to be at the corresponding segment position;

FIG. 13 is a diagram of the rectangular coordinate frame illustrating another aspect of the moving speed of the turntable when the operator sets the nozzle control block to be at the corresponding segment position; and

fig. 14 is a schematic diagram illustrating the rectangular coordinate frame after the control program of the embodiment adjusts the moving speed according to the desired moving time set by the operator in the nozzle control block.

Detailed Description

Before the present invention is described in detail, it should be noted that in the following description, like elements are represented by like reference numerals.

Referring to fig. 1 to 3 and 5, an embodiment of a substrate processing apparatus 100 according to the present invention includes a substrate supporting unit 1, a fluid supplying unit 2, a controlling unit 3, and a plurality of collecting units 4. The substrate carrying unit 1 includes a turntable 11 for disposing a substrate 5 to carry the substrate 5 for rotation, the substrate 5 being a substrate for semiconductor process, such as a wafer. The fluid supply unit 2 comprises a plurality of nozzles 21 arranged corresponding to the turntable 11 and each nozzle 21 is controllably movable in a path range D through the center C of the turntable 11 to supply a processing liquid, different nozzles 21 being capable of supplying different processing liquids, such as acid, deionized water, etc. Since the center position of the substrate 5 disposed on the turntable 11 is the same as the center position of the turntable 11, the center position is indicated by point C in the figures. The path range D corresponds to the diameter length of the substrate 5, i.e. the moving range of each nozzle 21 corresponds to the diameter of the area of the turntable 11 where the substrate 5 is arranged, the path range D being adjusted according to the size of the substrate 5. The collecting units 4 are respectively disposed corresponding to the types of the liquid supplied by the nozzles 21, for example, the collecting units 4 correspond to the nozzles 21 one-to-one, and when one of the nozzles 21 is operated, the collecting unit 4 corresponding to the nozzle 21 is also operated together to collect the processing liquid spun off by the rotation of the surface of the substrate 5 after the nozzle 21 sprays on the substrate 5.

The control unit 3 is coupled to the fluid supply unit 2 and the collection unit 4 and includes a human-machine interface 31 and stores a control program 32, the human-machine interface 31 has a nozzle control block 311 for an operator to select one of the nozzles 21 to be used and input a control command 312, and the control unit 3 receives the control command 312 and controls the nozzle 21 by the control program 32 corresponding to the control command 312. In addition, the nozzle control block 311 is also used for the operator to select the collecting unit 4 corresponding to the nozzle 21 to be used, so that the control unit 3 controls the collecting unit 4 to work together with the corresponding nozzle 21. In the present embodiment, a plurality of nozzles 21 and a plurality of collecting units 4 are taken as an example for explanation, and it is understood that only one nozzle 21 and one collecting unit 4 may be implemented in the modified embodiment, and the present embodiment is not limited thereto. Since the principle of the control unit 3 receiving the operation of the operator to control the operation of each nozzle 21 is the same in the present embodiment, the following description will only take the operation of a single nozzle 21 as an example.

The control program 32 presets N equally spaced and continuously distributed segments within the corresponding path range D, where N is not less than 10, so as to have better resolution for controlling the movement of the nozzle 21, and the upper limit of N can be adjusted according to the acceptable range of a motor (not shown) driving the nozzle 21, in this embodiment, N is specifically 50. The control command 312 includes selecting two of the N sections as the end sections of the moving range of the nozzle 21, so that the control program 32 controls the nozzle 21 to move between the positions corresponding to the two end sections relative to the turntable 11, and the two end sections may be the same section, i.e. the nozzle 21 is not moved at a certain point.

Please refer to fig. 5 to 8, which show the selection of different segments in the 50 segments. As shown in fig. 5, when the operator inputs the control command 312 to select the segments 1 to 50, the control program 32 controls the nozzle 21 to move relative to the turntable 11 within a range corresponding to both ends of the path of the substrate 5, i.e., within the path range D; when the operator inputs the control command 312 to select the segments 1 to 25 as shown in FIG. 6, the control program 32 controls the nozzle 21 to move relative to the turntable 11 within a range from one end of the diameter of the substrate 5 to the center C, i.e., within a local range R; when the operator inputs the control command 312 to select the sectors 13 to 37 as shown in FIG. 7, the control program 32 controls the nozzle 21 to move relative to the turntable 11 within the local range R corresponding to both sides of the center C of the substrate 5; when the operator inputs the control command 312 to select the sectors 13 to 25 as shown in FIG. 8, the control program 32 controls the nozzle 21 to move relative to the turntable 11 within the local range R corresponding to the center C side of the substrate 5. In other words, the operator can set the moving range of the nozzle 21 according to the required process parameters. It should be noted that the path range D and the local range R of the present embodiment are exemplified by the nozzle 21 moving in a straight line, and the moving route of the nozzle 21 can be changed as required, for example, an arc line passing through the center C or an arc line moving between one end of the substrate 5 and the center C, which is not limited by the present embodiment.

The control instructions 312 also include setting the moving speed of the nozzle 21 corresponding to each segment within the two end-point segment range, so that the control program 32 controls the moving speed of the nozzle 21 relative to the turntable 11 when the nozzle is located at the position corresponding to each segment. In the embodiment, as shown in fig. 3, the nozzle control block 311 displays a rectangular coordinate frame having a first coordinate axis and a second coordinate axis, the first coordinate axis corresponds to the positions of the N sections, N is 50 in the embodiment, and the second coordinate axis corresponds to the moving speed of the nozzle 21, in the embodiment, the moving speed is in units of millimeters (mm)/seconds (sec), the human-machine interface 31 has an input mode for the operator to select a plurality of coordinate positions corresponding to the two end sections on the rectangular coordinate frame to generate the control command 312, so that the control command 312 includes parameters corresponding to the coordinate positions.

More specifically, referring to fig. 9 to 13, taking the range of the two end sections selected by the operator as 1 to 50 as an example, fig. 9 shows that the moving speed of the nozzle 21 corresponding to each section selected by the operator is the same as the uniform speed; FIG. 10 shows that the operator selects the section corresponding to the periphery of the substrate 5 to have the nozzle 21 corresponding to the faster moving speed and the section corresponding to the center C of the substrate 5 to have the nozzle 21 corresponding to the slower moving speed; FIG. 11 shows that the operator selects the section corresponding to the periphery of the substrate 5 to make the moving speed of the nozzle 21 slower and the section corresponding to the center C of the substrate 5 closer to make the moving speed of the nozzle 21 faster; FIG. 12 shows that the operator selects the corresponding moving speed of the nozzle 21 per unit sector to be changed regularly in units of a specific number of sectors during the corresponding movement along the diameter of the substrate 5; fig. 13 shows that the operator may also choose to vary the speed of movement of the nozzle 21 irregularly for each segment. That is, the operator can set the setting according to his/her needs, and is not limited.

For the convenience of the input of the operator, in the embodiment, the input mode of the human-machine interface 31 allows the operator to continuously select the coordinate position on the rectangular coordinate frame by a signal-triggered determination method to generate the control command 312, such as a touch sliding method or a mouse pressing sliding method, taking the graph shown in fig. 9 as an example, the operator can complete the input by drawing a straight line from the coordinate position with position 1 and moving speed 50 to the coordinate position with position 50 and moving speed 50 on the rectangular coordinate frame by a horizontal sliding; taking the graph shown in fig. 10 as an example, the operator may slide from the position 1 to the position 50 to the coordinate position of the moving speed corresponding to each segment in sequence from the coordinate position with the position 1 and the moving speed 100 on the rectangular coordinate screen, and draw a graph similar to a V shape to complete the input, and so on. In a modified embodiment, the input mode also allows the operator to select a half-range coordinate position of one of the two end point segments on the rectangular coordinate frame, and automatically select a half-range coordinate position of the other end point segment to generate the control command 312 in a mirror symmetry pattern manner, taking the pattern shown in fig. 10 as an example, the operator can set the rectangular coordinate frame to have a corresponding moving speed of each segment within a range of 1 to 25, and then automatically select a corresponding moving speed of each segment within a range of 26 to 50 in a mirror symmetry pattern manner, so that the operator only needs to set a half-range data, which is convenient for the operator to use. In another variation, the input mode allows the operator to select two coordinate positions corresponding to the two end point segments and at least one coordinate position corresponding to the two end point segment ranges on the rectangular coordinate frame, and the rest coordinate positions in the two end point segment ranges are automatically selected by the input mode in a manner of forming a broken line graph corresponding to the coordinate position selected by the operator to generate the control command 312, and further, taking the graph shown in fig. 9 as an example, the operator can select a coordinate position with a position of 1 and a moving speed of 50, a coordinate position with a position of 25 and a moving speed of 50, and a coordinate position with a position of 50 and a moving speed of 50 on the rectangular coordinate frame, that is, the coordinate positions on the connection line can be automatically selected by connecting the coordinate positions in sequence in the input mode, that is, the rest segments not set by the operator set with a corresponding moving speed of 50 by the input mode, by analogy, the coordinate positions in the two end point segment ranges can also be two or more, and taking the graph shown in fig. 10 as an example, the operator can additionally set the coordinate positions of three turning points in the two end point segment ranges, and then sequentially connect the coordinate positions by the input mode to form a line graph similar to a V shape. Understandably, the human-machine interface 31 may have only one of the input modes, or may have more than two of the input modes for the operator to select the desired input mode.

Referring to fig. 3, 9 and 14, the control command 312 further includes setting an expected moving time, where the expected moving time is a time when the operator intends to move the nozzle 21 from one end section to another end section, and the control program 32 adjusts the moving speed of the nozzle 21 corresponding to each section within the range of the two end sections, which has been set by the operator, corresponding to the expected moving time, so that the time when the nozzle 21 moves from one end section to another end section matches the expected moving time. For example, fig. 9 shows the moving speed of the nozzle 21 corresponding to each segment within the two-end segment range that has been set by the operator, and fig. 14 shows the control program 32 adjusting the moving speed of the nozzle 21 corresponding to each segment within the two-end segment range that has been set by the operator in an equivalent adjustment manner. That is, fig. 14 shows the control parameters actually used to control the movement of the nozzle 21 after the control program 32 is automatically adjusted. The control program 32 compares an actual moving time of the nozzle 21 moving from one end section to the other end section with the expected moving time according to the actual moving time of the nozzle 21 relative to the turntable 11, and if the expected moving time and the actual moving time have an error value, the control program 32 adjusts the moving speed of the nozzle 21 corresponding to each section within the range of the two end sections according to the error value. Taking fig. 14 as an example, the time executed by the moving speed of the nozzle 21 corresponding to each segment in the two end-point segment range originally set by the operator is the actual moving time, and if the actual moving time and the expected moving time have the error value, the control program 32 gradually adjusts the actual moving time according to the error value, which is explained in the present embodiment, the time generated by the coordinate position with the position of 1 to 50 and the moving speed of 50 corresponds to the actual moving time, at this time, if the actual moving time is lower than the expected moving time, the control program 32 increases the moving speed with the position of 1 to 50, so that the time generated by the coordinate position with the position of 1 to 50 and the moving speed of 60 corresponds to the actual moving time is the same as or close to the expected moving time.

Referring to fig. 4, the control command 312 further includes setting the fluid supply amount corresponding to each section within the range of the two end-point sections, so that the control program 32 controls the processing liquid sprayed from the nozzle 21 at the position corresponding to each section to correspond to the fluid supply amount. The nozzle control block 311 displays a rectangular coordinate frame having a first coordinate axis and a second coordinate axis, the first coordinate axis corresponds to the positions of the N sections, and the second coordinate axis corresponds to the fluid supply amount of the nozzle 21, the human-machine interface 31 has an input mode for the operator to select a plurality of coordinate positions corresponding to the ranges of the two end sections on the rectangular coordinate frame to generate the control command 312, so that the control command 312 includes parameters corresponding to the coordinate positions. In the present embodiment, the rectangular coordinate frame for inputting the moving speed of the nozzle 21 and the rectangular coordinate frame for inputting the fluid supply amount of the nozzle 21 can be switched by the operator selecting the moving speed option or the fluid supply amount option on the nozzle control block 311. The input mode of the rectangular coordinate frame for inputting the fluid supply amount of the nozzle 21 is the same as the input mode of the rectangular coordinate frame for inputting the moving speed of the nozzle 21, and will not be described again.

The control instructions 312 further include setting a feeding time, a moving number, an initial feeding position and an end feeding position. The liquid supply time is the time from the beginning of the spraying of the processing liquid to the end of the spraying of the processing liquid by the nozzle 21. The number of times of movement is the number of times of reciprocating movement of the nozzle 21 within the range corresponding to the two end sections, and the unit of one time may be a single pass or a double pass. The initial supply position is a position at which the nozzle 21 starts to eject the processing liquid with respect to the turntable 11, and the initial supply position may be set in one of the two end-point zone ranges or may be set outside the two end-point zone ranges. The supply end position is a position at which the nozzle 21 finishes discharging the processing liquid with respect to the turntable 11, and similarly, the supply end position may be set in one of the two end point zone ranges or may be set outside the two end point zone ranges. In this embodiment, the nozzle control block 311 is provided with options corresponding to the liquid supply time, the moving times, the initial supply position and the end supply position for the operator to input the control command 312. The operator can select the liquid supply time and the initial supply position as the parameters for controlling the process; alternatively, the number of movements, the initial supply position and the final supply position may be selected as parameters for controlling the manufacturing process, depending on the application requirements. In alternative embodiments, the settable parameters of the control command 312 may be adjusted as desired, and unnecessary parameters may be omitted.

The substrate 5 mentioned in the present embodiment may be in the form of a carrier, a wafer, a chip, etc., and may be in the form of a circle or a square, but not limited thereto. The substrate processing apparatus of the present embodiment can be applied to wet processes (etching, cleaning, drying, etc.) of substrates, for example: single substrate wet process, multi-substrate wet process, single square wafer under-ball metal etching, thinned wafer support/peeling, bonding/peeling process, silicon carbide recycled wafer, recycled silicon wafer, etc., but not limited thereto.

In summary, the control unit 3 allows the operator to set and change the parameters for controlling the nozzle 21, thereby greatly improving the flexibility of the operation of the substrate processing apparatus 100.

The above description is only an example of the present invention, and the scope of the present invention should not be limited thereby, and the invention is still within the scope of the present invention by simple equivalent changes and modifications made according to the claims and the contents of the specification.

Claims

1. A substrate processing apparatus, comprising: comprises the following steps:

the substrate bearing unit comprises a rotating table for arranging a substrate;

a fluid supply unit including at least one nozzle disposed corresponding to the turntable and controllably movable within a path through a center of the turntable to supply a processing liquid; and

and the control unit is coupled with the fluid supply unit, comprises a human-computer interface and stores a control program, the human-computer interface is provided with a nozzle control block for an operator to input a control command, and the control unit receives the control command and controls the nozzle by the control program corresponding to the control command.

2. The substrate processing apparatus according to claim 1, wherein: the control program presets N equally spaced and continuously distributed sections corresponding to the path range, wherein N is not less than 10, the control command comprises selecting two of the N sections as end sections of the nozzle moving range, so that the control program controls the nozzle to move between positions corresponding to the two end sections relative to the rotating table.

3. The substrate processing apparatus according to claim 2, wherein: the control command also includes setting the moving speed of the nozzle corresponding to each section in the range of the two end-point sections, so that the control program controls the moving speed of the nozzle relative to the rotating table when the nozzle is located at the position corresponding to each section.

4. The substrate processing apparatus according to claim 3, wherein: the control instruction also comprises the fluid supply quantity corresponding to each section within the range of the two end point sections, so that the control program controls the processing liquid sprayed out when the nozzle is positioned at the position corresponding to each section to correspond to the fluid supply quantity.

5. The substrate processing apparatus according to claim 3, wherein: the nozzle control block displays a rectangular coordinate picture, the rectangular coordinate picture has a first coordinate axis and a second coordinate axis, the first coordinate axis corresponds to the positions of the N sections, the second coordinate axis corresponds to the moving speed of the nozzle, and the human-computer interface has an input mode for the operator to select a plurality of coordinate positions corresponding to the ranges of the two end point sections on the rectangular coordinate picture so as to generate the control command, so that the control command comprises parameters corresponding to the coordinate positions.

6. The substrate processing apparatus according to claim 4, wherein: the nozzle control block displays a rectangular coordinate frame, the rectangular coordinate frame has a first coordinate axis and a second coordinate axis, the first coordinate axis corresponds to the positions of the N sections, the second coordinate axis corresponds to the fluid supply amount of the nozzle, the human-computer interface has an input mode for the operator to select a plurality of coordinate positions corresponding to the range of the two end point sections on the rectangular coordinate frame so as to generate the control command, and the control command comprises parameters corresponding to the coordinate positions.

7. The substrate processing apparatus according to claim 5 or 6, wherein: the input mode is used for the operator to continuously select the coordinate position on the rectangular coordinate picture in a signal-triggered judging mode so as to generate the control command.

8. The substrate processing apparatus according to claim 5 or 6, wherein: the input mode is used for the operator to select the coordinate position of the half range of the adjacent one of the two end point sections in the rectangular coordinate frame, and the input mode automatically selects the coordinate position of the half range of the adjacent other end point section in a mirror symmetry pattern mode to generate the control command.

9. The substrate processing apparatus according to claim 5 or 6, wherein: the input mode is used for the operator to select two coordinate positions corresponding to the two end point sections and at least one coordinate position corresponding to the two end point section range on the rectangular coordinate frame, and the rest coordinate positions in the two end point section range are automatically selected by the input mode in a mode of forming a line graph corresponding to the coordinate position selected by the operator so as to generate the control command.

10. The substrate processing apparatus according to claim 3 or 4, wherein: the control command further includes setting a liquid supply time and an initial supply position, wherein the liquid supply time is a time from the beginning of the spraying of the processing liquid to the end of the spraying of the processing liquid by the nozzle, and the initial supply position is a position at which the spraying of the processing liquid by the nozzle relative to the rotating table is started.

11. The substrate processing apparatus according to claim 3 or 4, wherein: the control command further includes setting a number of times of movement, which is a number of times of reciprocating movement of the nozzle within a range corresponding to the two end zones, a start supply position, which is a position at which the nozzle starts to eject the processing liquid with respect to the turntable, and an end supply position, which is a position at which the nozzle ends to eject the processing liquid with respect to the turntable.

12. The substrate processing apparatus according to claim 3 or 4, wherein: the control instructions further include setting at least one of a start supply position and an end supply position, the at least one of the start supply position and the end supply position being set outside the two end zones, wherein the start supply position is a position at which the nozzle starts to eject the processing liquid relative to the turntable, and the end supply position is a position at which the nozzle ends to eject the processing liquid relative to the turntable.

13. The substrate processing apparatus according to claim 3 or 4, wherein: the control instruction also comprises expected moving time, the expected moving time is the time when the operator wants to make the nozzle move from one end section to the other end section correspondingly, the control program adjusts the moving speed of the nozzle corresponding to each section in the range of the two end sections which is set by the operator corresponding to the expected moving time, so that the time when the nozzle moves from one end section to the other end section is in accordance with the expected moving time.

14. The substrate processing apparatus according to claim 13, wherein: the control program adjusts the moving speed of the nozzle corresponding to each section in the range of the two end sections set by the operator in an equivalent adjusting mode.

15. The substrate processing apparatus according to claim 14, wherein: the control program compares the actual moving time of the nozzle moving from one end point section to the other end point section corresponding to the rotating platform with the expected moving time, and if the expected moving time and the actual moving time have a difference value, the control program adjusts the moving speed of the nozzle corresponding to each section in the range of the two end point sections according to the error value.

16. The substrate processing apparatus according to claim 1, wherein: the fluid supply unit comprises a plurality of nozzles, and the nozzle control block is also used for the operator to select one of the nozzles to be used and input the control command.

17. The substrate processing apparatus according to claim 16, wherein: the nozzle control block is used for the operator to select the collecting unit corresponding to the nozzle to be used so that the control unit controls the collecting unit to work together with the corresponding nozzle.