CN111326419B - Method for manufacturing circuit - Google Patents
Method for manufacturing circuit Download PDFInfo
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- CN111326419B CN111326419B CN201811547640.9A CN201811547640A CN111326419B CN 111326419 B CN111326419 B CN 111326419B CN 201811547640 A CN201811547640 A CN 201811547640A CN 111326419 B CN111326419 B CN 111326419B
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- liquid metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Abstract
The invention provides a circuit manufacturing method, and relates to the technical field of electronics. The manufacturing method of the circuit provided by the invention comprises the following steps: step S1, providing a base material adhered with liquid metal; step S2, forming a first surface modification layer on the first surface of the base material, wherein the first surface modification layer separates liquid metal; step S3, forming a first groove on the first surface of the substrate, wherein the depth of the first groove is greater than or equal to the thickness of the first surface modification layer; step S4, filling liquid metal in the first groove to form a first liquid metal circuit; and step S5, packaging the first liquid metal circuit on the first surface of the substrate. The technical scheme of the invention can simplify the design of the circuit based on the liquid metal and improve the performance stability of the circuit.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a circuit manufacturing method.
Background
The melting point of the liquid metal is lower than 300 ℃, and the liquid metal has the advantages of good electrical conductivity, low melting point, good thermal conductivity and the like, and becomes a new functional material which develops rapidly in recent years. The liquid metal can be used as a cooling medium, a heat-conducting medium, a welding material, an electronic circuit, an artwork and the like, and has a wide application range.
Since the liquid metal has fluidity during the process of manufacturing the liquid metal-based circuit, there is a certain deviation between the line width of the actually manufactured liquid metal line and the target line width, which results in difficult design and poor performance stability of the liquid metal-based circuit.
Disclosure of Invention
The invention provides a circuit manufacturing method, which can simplify the design of a circuit based on liquid metal and improve the performance stability of the circuit.
The invention provides a circuit manufacturing method, which adopts the following technical scheme:
the manufacturing method of the circuit comprises the following steps:
step S1, providing a base material adhered with liquid metal;
step S2, forming a first surface modification layer on the first surface of the base material, wherein the first surface modification layer separates liquid metal;
step S3, forming a first groove on the first surface of the substrate, wherein the depth of the first groove is greater than or equal to the thickness of the first surface modification layer;
step S4, filling liquid metal in the first groove to form a first liquid metal circuit;
and step S5, packaging the first liquid metal circuit on the first surface of the substrate.
Optionally, in the step S3, the first groove is formed on the first surface of the substrate by a laser ablation process.
Optionally, the method for manufacturing a circuit further includes rolling over the first liquid metal wire using a roller that adheres the liquid metal between the step S4 and the step S5.
Optionally, the adhesion between the liquid metal and the first surface modification layer is F1, the adhesion between the liquid metal and the base material is F2, the adhesion between the liquid metal and the roller is F3, wherein F1 < F3 < F2, and the difference between F3 and F1 is greater than or equal to 0.45 μ η/mm2The difference between F2 and F3 is greater than or equal to 0.45 μ N/mm2。
Optionally, said rolling over the first liquid metal line using a roller that adheres the liquid metal comprises: placing the substrate on a cold plate, wherein the temperature of the cold plate is lower than the melting point of the liquid metal, and the temperature of the roller is higher than the melting point of the liquid metal; and rolling over the first liquid metal line using the roller.
Optionally, the adhesion between the roller and the liquid metal is greater than 40 μ N/mm2。
Optionally, the temperature of the cold plate is at least 40 ℃ below the melting point of the liquid metal and the temperature of the rollers is at least 70 ℃ above the melting point of the liquid metal.
Optionally, the liquid metal comprises gallium indium eutectic alloy and silver coated copper nanoparticles.
Optionally, the step S5 includes: covering the first molded protective film on the first surface of the base material, and pressing the first protective film and the base material.
Optionally, the method for manufacturing the circuit further includes:
step S6, forming a second surface modification layer on a second surface of the substrate, wherein the second surface modification layer separates the liquid metal, and the first surface and the second surface are oppositely disposed;
step S7, forming a second groove on the second surface of the substrate, wherein the depth of the second groove is greater than or equal to the thickness of the second surface modification layer;
step S8, filling the liquid metal in the second groove to form a second liquid metal circuit;
and step S9, packaging the second liquid metal circuit on the second side of the substrate.
Optionally, the method for manufacturing the circuit further includes:
forming a via hole penetrating the second surface modification layer and the substrate between the step S6 and the step S7;
filling the liquid metal in the via hole to form a connecting piece;
the connecting piece is used for electrically connecting the first liquid metal line and the second liquid metal line.
Optionally, the method for manufacturing the circuit further includes: between the step S8 and the step S9, a component is attached to the second surface of the substrate, and a lead of the component is electrically connected to the second liquid metal line.
Further, the manufacturing method of the circuit further comprises the following steps: forming third grooves for placing pins of the component on the second surface of the substrate between the step S6 and the step S8, wherein one end of each third groove is communicated with the second groove, and the depth of each third groove is greater than that of the second groove;
in step S8, the liquid metal is filled in both the second groove and the third groove.
Further, the manufacturing method of the circuit further comprises the following steps: forming a fourth groove on the second face of the base material after the step S8; two ends of the fourth groove are respectively communicated with one third groove, and the fourth groove is used for placing a main body structure of the component; the depth of the fourth groove is smaller than that of the third groove and larger than that of the second groove.
The circuit manufacturing method provided by the embodiment of the invention has the following process of manufacturing the liquid metal-based circuit by using the circuit manufacturing method: firstly, providing a base material adhered with liquid metal, then forming a first surface modification layer on the first surface of the base material, separating the liquid metal by the first surface modification layer, then forming a first groove on the first surface of the base material, wherein the depth of the first groove is greater than or equal to the thickness of the first surface modification layer, then filling the liquid metal in the first groove to form a first liquid metal circuit, and then packaging the first liquid metal circuit on the first surface of the base material. In the process of filling the liquid metal in the first groove, on one hand, the first groove limits the flow of the liquid metal, and on the other hand, the liquid metal cannot be adhered to the first surface modification layer outside the first groove, so that the line width of the formed first liquid metal circuit is consistent with the width of the first groove, the change of the line width and the width of the first groove due to the liquidity of the liquid metal cannot occur, the design of a circuit based on the liquid metal can be simplified, and the performance stability of the circuit can be improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a first schematic structural diagram of a liquid metal-based circuit according to an embodiment of the present invention;
fig. 2 is a second schematic structural diagram of a liquid metal-based circuit according to an embodiment of the present invention;
fig. 3 is a third schematic structural diagram of a liquid metal-based circuit according to an embodiment of the present invention;
FIG. 4 is a first flowchart of a method for manufacturing a circuit according to an embodiment of the present invention;
FIG. 5 is a first schematic diagram illustrating a process of manufacturing a circuit according to an embodiment of the present invention;
FIG. 6 is a second schematic diagram illustrating a manufacturing process of a circuit according to an embodiment of the present invention;
FIG. 7 is a second flowchart of a method for manufacturing a circuit according to an embodiment of the present invention;
fig. 8 is a third flowchart of a method for manufacturing a circuit according to an embodiment of the present invention;
FIG. 9 is a fourth flowchart of a method for manufacturing a circuit according to an embodiment of the present invention;
FIG. 10 is a schematic diagram illustrating a process from step S6 to step S9 according to an embodiment of the present invention;
FIG. 11 is a schematic diagram illustrating a process from step S6 to step S7 according to an embodiment of the present invention;
FIG. 12 is a schematic diagram illustrating a process from step S8 to step S9 according to an embodiment of the present invention;
FIG. 13 is a schematic structural diagram of an apparatus for fabricating a circuit according to an embodiment of the present invention;
figure 14 is a schematic structural diagram of a robot module according to an embodiment of the present invention;
FIG. 15 is a schematic structural diagram of a laser ablation module according to an embodiment of the present invention;
fig. 16 is a schematic structural diagram of a laser fixing base according to an embodiment of the present invention;
fig. 17 is a schematic structural diagram of a metal filling module according to an embodiment of the present invention;
fig. 18 is a schematic structural diagram of a patch module according to an embodiment of the present invention;
fig. 19 is a schematic structural diagram of a package module according to an embodiment of the invention;
FIG. 20 is a schematic diagram illustrating a partial structure of an apparatus for fabricating a circuit according to an embodiment of the present invention;
FIG. 21 is a first schematic structural diagram of an adhesion roller according to an embodiment of the present invention;
fig. 22 is a second schematic structural diagram of an adhesion roller according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
An embodiment of the present invention provides a liquid metal-based circuit, and specifically, as shown in fig. 1, fig. 1 is a schematic structural diagram of the liquid metal-based circuit provided in the embodiment of the present invention, where the circuit includes:
a base material 1 to which a liquid metal is adhered; a first surface modification layer 2, wherein the first surface modification layer 2 is positioned on the first surface of the substrate 1 and is used for separating liquid metal; the first groove 3 is formed in the first surface of the substrate 1, and the depth of the first groove 3 is larger than or equal to the thickness of the first surface modification layer 2; the first liquid metal circuit 4 is arranged in the first groove 3; and the first protective film 5 covers the first surface of the substrate 1, and is used for encapsulating the first liquid metal circuit 4. The liquid metal can be limited to flow by the arrangement of the first groove 3, and the liquid metal cannot be adhered to the first surface modification layer 2 outside the first groove 3, so that the line width of the formed first liquid metal circuit 4 is consistent with the width of the first groove 3, the liquid metal cannot be changed due to the liquidity of the liquid metal, the design of a circuit based on the liquid metal can be simplified, and the performance stability of the circuit can be improved.
In particular, the base material 1 to which the liquid metal adheres can be realized in two ways:
in a first implementation, the substrate 1 is made of a single material to which the liquid metal can adhere. The base material 1 may be one of a polyvinyl chloride base material, a polyethylene terephthalate base material, a polybutylene terephthalate base material, a polypropylene base material, a polybutylene adipate-terephthalate base material, a silicone rubber base material, a natural rubber base material, an isoprene rubber base material, a styrene butadiene rubber base material, a chloroprene rubber base material, an ethylene propylene rubber base material, a nitrile butadiene rubber base material, a silicone rubber base material, a polysulfide rubber base material, a glass base material, a polyurethane base material, an acrylic base material, a stainless steel base material, a silicon base material, and nylon cloth.
In a second implementation, the substrate 1 includes a body structure and a surface film layer, the body structure is not adhered with the liquid metal, and the surface film layer is adhered with the liquid metal. The base material may be one of printing paper, cardboard, kraft paper, coated paper, aramid paper, copper foil, iron foil, polyethylene film, polycarbonate sheet, polyimide film, polytetrafluoroethylene sheet, cotton cloth, hemp cloth, silk cloth, polyester cloth, polyamide cloth, polypropylene cloth, viscose cloth, dust-free cloth (70% polyester, 30% nylon woven cloth), acetate cloth, and the like.
The liquid metal in the embodiment of the invention is a liquid metal simple substance with a melting point below 300 ℃ and a liquid alloy with a melting point below 300 ℃, or a blend with a melting point below 300 ℃, and the blend comprises at least two of the liquid metal simple substance, the liquid alloy and the functional powder. The liquid metal simple substance can be a mercury simple substance, a gallium simple substance, an indium simple substance or a tin simple substance. The liquid alloy may be one of gallium indium alloy, gallium indium tin alloy, gallium zinc alloy, gallium indium zinc alloy, gallium tin zinc alloy, gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy, bismuth indium tin lead alloy, bismuth tin cadmium alloy, bismuth lead tin alloy, bismuth tin lead cadmium alloy, tin lead alloy, tin copper alloy, tin zinc copper alloy, and tin silver copper alloy.
The functional powder can be at least one of a nickel simple substance, an iron simple substance, a titanium simple substance, a zinc simple substance, a silver simple substance, a copper simple substance, silver-coated copper, iron oxide, copper oxide, zinc oxide, carbon powder, graphene, a carbon nano tube, silicon oxide, boron nitride, bentonite, kaolin and the like.
The above-described "the depth of the first groove 3 is greater than or equal to the thickness of the first surface modification layer 2" has the purpose of: the problem that the depth of the first groove 3 is too small, the amount of the filled liquid metal is too small, and the resistance of the formed liquid metal circuit 4 is too large is avoided. Preferably, the depth of the first groove 3 is greater than the thickness of the first surface modification layer 2. It should be noted that the depth of the first groove 3 is only illustrated as being equal to the thickness of the first surface modification layer 2 in the drawings, and the present invention is not limited thereto. Optionally, the depth of the first groove 3 is 0.1mm to 0.5 mm.
Optionally, the width of the first groove 3 is 50 micrometers to 200 micrometers, so that the first liquid metal line 4 can meet the requirement of a fine circuit. Under the foregoing conditions, in the embodiment of the present invention, it is preferable to fill the first groove 3 with the doped liquid metal (for example, the liquid metal is selected to include nanoparticles of gallium-indium eutectic alloy and silver-coated copper), because the surface tension of the doped liquid metal is much smaller than that of the undoped liquid metal, it is easy to pass through smaller pores, and can bear smaller line width, so as to better meet the requirement of fine circuit. In addition, the liquid metal comprising the gallium-indium eutectic alloy and the silver-coated copper nanoparticles also has better viscosity and conductivity, gallium in the liquid metal can be oxidized into gallium oxide, the gallium oxide is coated on the surface of the liquid metal to form a compact oxide film, air is prevented from entering the liquid metal, the liquid metal in the liquid metal is ensured not to be oxidized, and the electrical property of the liquid metal cannot change along with time.
Optionally, the surface of the first liquid metal line 4, which is far away from the substrate 1, is flush with the surface of the first surface modification layer 2, which is far away from the substrate 1, so that the situation that excessive liquid metal flows under extrusion in the process of packaging the first liquid metal line 4 due to excessive liquid metal amount, and causes pollution or damage to other positions can be prevented, and the packaging effect can be improved.
Optionally, as shown in fig. 2, fig. 2 is a schematic structural diagram of a liquid metal-based circuit provided in an embodiment of the present invention, where the liquid metal-based circuit in the embodiment of the present invention further includes: a second surface modification layer 7, wherein the second surface modification layer 7 is positioned on the second surface of the base material 1 and is used for separating the liquid metal; a second groove 8, wherein the second groove 8 is arranged on the second surface of the substrate 1, and the depth of the second groove 8 is greater than or equal to the thickness of the second surface modification layer 7; a second liquid metal line 9, the second liquid metal line 9 being disposed in the second groove 8; and the second protective film 10, wherein the second protective film 10 covers the second surface of the substrate 1 and is used for packaging the second liquid metal circuit 9. The circuit with the structure is a double-layer circuit.
It should be noted that, for details of the second surface modification layer 7, the second groove 8, the second liquid metal line 9, and the second protection film 10, reference may be made to the details of the first surface modification layer 2, the first groove 3, the first liquid metal line 4, and the first protection film 5, which are described above, and details are not repeated here.
Further, as shown in fig. 3, fig. 3 is a schematic structural diagram of a liquid metal-based circuit according to an embodiment of the present invention, where the liquid metal-based circuit further includes: the through hole 11 penetrates through the second surface modification layer 7 and the substrate 1; a connection member 12, the connection member 12 being formed of a liquid metal filled in the via hole 11; the connecting member 12 is used to electrically connect the first liquid metal line 4 and the second liquid metal line 9. This arrangement allows electrically connecting the liquid metal line 4 and the second liquid metal line 9 on the first side of the substrate 1.
Further, as shown in fig. 3, the liquid metal-based circuit further includes a component 13, the component 13 is attached to the second surface of the substrate 1, and a pin of the component 13 is electrically connected to the second liquid metal line 9. Of course, if necessary, a component may be attached to the first surface of the substrate 1, and a pin of the component may be electrically connected to the first liquid metal line 4. The above components may be various types such as chips, resistors, capacitors, sensors, and the like, and the embodiment of the present invention is not limited.
Further, as shown in fig. 3, the liquid metal-based circuit further includes a third groove, the third groove is disposed on the second surface of the substrate 1, one end of the third groove is communicated with the second groove 8, the depth of the third groove is greater than that of the second groove 8, the third groove is filled with the liquid metal, and the pin of the component 13 is placed in the third groove. The arrangement enables the pins of the component 13 to be in better contact with the liquid metal, and the performance of the liquid metal-based circuit is improved.
Further, as shown in fig. 3, the liquid metal-based circuit further includes a fourth groove, the fourth groove is disposed on the second surface of the substrate 1, two ends of the fourth groove are respectively communicated with a third groove, the depth of the fourth groove is greater than that of the second groove 8 and smaller than that of the third groove, and the main structure of the component 13 is placed in the fourth groove. So set up and to make the whole structure of components and parts 13 all be located the recess, its upper surface can and the second liquid metal circuit 9 between have very little difference in height, even flush, help components and parts 13 fixed, and help the encapsulation to second liquid metal circuit 9 and components and parts 13. Preferably, the depth of the fourth groove is consistent with the thickness of the main structure of the component 13, and the depth of the third groove is consistent with the length of the pin of the component 13.
It should be noted that, in the embodiment of the present invention, a specific number of any one of the above-mentioned structures is not limited, and may be one or more, and those skilled in the art may select the structure according to actual needs.
The embodiment of the invention provides a circuit based on liquid metal, which comprises: a liquid metal-adhered substrate; a first surface modification layer on the first side of the substrate, the first surface modification layer being phobic from the liquid metal; the first groove is arranged on the first surface of the substrate, and the depth of the first groove is greater than or equal to the thickness of the first surface modification layer; the first liquid metal circuit is arranged in the first groove; the first protective film covers the first surface of the base material and is used for packaging the first liquid metal circuit. The liquid metal can be limited to flow by the arrangement of the first groove, and the liquid metal cannot be adhered to the first surface modification layer outside the first groove, so that the line width of the formed first liquid metal circuit is consistent with the width of the first groove, the liquid metal cannot change due to the liquidity of the liquid metal, the design of a circuit based on the liquid metal can be simplified, and the performance stability of the circuit can be improved.
In addition, an embodiment of the present invention provides a method for manufacturing a circuit, which is used to manufacture the above-mentioned liquid metal-based circuit, and specifically, as shown in fig. 4, fig. 4 is a first flowchart of the method for manufacturing a circuit according to the embodiment of the present invention, where the method for manufacturing a circuit includes:
step S1, providing a liquid metal-adhered substrate.
Step S2, forming a first surface modification layer on the first side of the substrate, the first surface modification layer being free of liquid metal.
Step S3, forming a first groove on the first surface of the substrate, wherein the depth of the first groove is greater than or equal to the thickness of the first surface modification layer.
Step S4, filling liquid metal into the first groove to form a first liquid metal line.
And step S5, packaging the first liquid metal circuit on the first surface of the substrate.
Specifically, as shown in fig. 5, fig. 5 is a first schematic diagram of a process for manufacturing a circuit according to an embodiment of the present invention, where the process for manufacturing a liquid metal-based circuit using the method for manufacturing a circuit includes: firstly, providing a base material 1 adhered with liquid metal, then forming a first surface modification layer 2 on the first surface of the base material 1, separating the first surface modification layer 2 from the liquid metal, then forming a first groove 3 on the first surface of the base material 1, wherein the depth of the first groove 3 is larger than or equal to the thickness of the first surface modification layer 2, then filling the liquid metal in the first groove 3 to form a first liquid metal circuit 4, and then packaging the first liquid metal circuit 4 on the first surface of the base material 1. In the process of filling the liquid metal in the first groove 3, on one hand, the first groove 3 limits the flow of the liquid metal, and on the other hand, the liquid metal cannot be adhered to the first surface modification layer 2 outside the first groove 3, so that the line width of the formed first liquid metal circuit 4 is consistent with the width of the first groove 3, the change of the line width due to the liquidity of the liquid metal cannot occur, and the design of a circuit based on the liquid metal can be simplified and the performance stability of the circuit can be improved.
In order to facilitate those skilled in the art to understand and implement the method for manufacturing the circuit provided above, the embodiment of the invention describes steps S2 to S5 in detail.
A specific manner of forming the first surface modification layer 2 on the first surface of the substrate 1 in step S2 may be: the first surface of the base material 1 is modified with a solution containing a modifying agent and a solvent, and the modified first surface of the base material 1 is dried to form a first surface-modified layer 2 on the first surface of the base material 1.
Optionally, the modifier comprises one or more of behenic acid, stearic acid, palmitic acid, arachidic acid, wood wax, carnauba wax, rice bran wax, jojoba wax, castor wax, bayberry wax, candelilla wax, beeswax, chinese insect wax, wool wax, spermaceti wax, paraffin wax, microcrystalline paraffin wax, petroleum wax, emulsifying wax, montan wax, fischer-tropsch wax, polyethylene wax, polypropylene wax, chlorinated paraffin wax, ethylene-vinyl acetate copolymer wax, and ethylene oxide wax.
Optionally, the solvent comprises one or more of diethyl ether, petroleum ether, n-heptane, n-hexane, cyclohexane, ethyl acetate, methanol, ethanol, acetic acid, chloroform, carbon tetrachloride, benzene, toluene and xylene.
Optionally, the concentration of the modifier in the solution is 1-40 mg/mL, wherein the larger the concentration of the modifier, the smaller the amount of the solution required, and the shorter the modification treatment time, and those skilled in the art can select the modifier according to actual needs.
Optionally, modifying the first side of the substrate 1 by one of dipping, spraying, dripping and printing by using a solution consisting of a modifier and a solvent; the first surface of the modified base material 1 is dried by one of natural drying, air drying, and heat drying (heating temperature is 0 to 200 ℃).
The first grooves 3 may be formed on the first side of the substrate 1 through a laser ablation process in step S3. In the laser ablation process, a beam of high-energy pulse laser is used for irradiating the first surface of the substrate 1, so that the laser irradiation position on the first surface is rapidly heated, melted and evaporated, and then the first groove 3 can be formed on the first surface of the substrate 1. The first groove 3 with a smaller width (50-200 micrometers) can be formed by the laser ablation process, so that the manufacturing method of the circuit can meet the requirement of a refined circuit.
Optionally, in a laser ablation processWith nanosecond-scale thermal laser, i.e. with a pulse width of 10-9～10-10The laser of s is used as a light source, and the power of the laser can be 48W, and the output of the laser is 60%. The laser ablation process can form the first groove 3 in the one-time moving process of the laser ablation equipment so that the efficiency is high, and can also form the first groove 3 in a reciprocating mode by the laser ablation equipment so that the depth controllability of the first groove 3 is good, and a person skilled in the art can select the first groove according to actual needs.
In step S4, the liquid metal may be filled in the first groove 3 by one of printing, coating (dipping, spraying, spin coating), printing, writing, brush coating, and the like, so as to form the first liquid metal line 4.
In step S5, the first liquid metal trace 4 on the first surface of the substrate 1 may be encapsulated in various ways, in a first example, a packaging material is sprayed on the first surface of the substrate 1 to cure the packaging material, and the first liquid metal trace 4 on the first surface of the substrate 1 is encapsulated, in a second example, the first liquid metal trace 4 on the first surface of the substrate 1 is encapsulated by covering the first protective film 5 on the first surface of the substrate 1, and pressing the first protective film 5 and the substrate 1 together (in various pressing ways such as hot pressing and cold pressing). When the first liquid metal circuit 4 on the first surface of the substrate 1 is encapsulated in the manner shown in the second example, the first protective film 5 is formed and generally has a thin and uniform thickness, so that the encapsulation process is simple and easy to operate, the encapsulation time is short, and the encapsulation thickness is controllable.
Optionally, as shown in fig. 6, fig. 6 is a schematic diagram of a second process of manufacturing a circuit according to an embodiment of the present invention, and the method of manufacturing a circuit further includes, between step S4 and step S5, rolling over the first liquid metal line 4 by using a roller 6 adhered with liquid metal, so as to take away excess liquid metal, thereby preventing the excess liquid metal from being squeezed and flowing during the process of packaging the first liquid metal line 4 and causing contamination or damage to other locations. Preferably, the roller 6 is just in contact with the first surface modification layer 2, no pressure or slight pressure is applied between the roller and the first surface modification layer 2, so that the excess liquid metal can be taken away, and the surface of the formed first liquid metal circuit 4 is flush with the first surface modification layer 2, which also helps to improve the packaging effect.
In particular, the particular way in which the excess liquid metal is carried away can be varied by using a roller 6 adhering to the liquid metal to roll over the first liquid metal line 4.
In one example, the adhesion between the liquid metal and the first surface modification layer 2 is F1, the adhesion between the liquid metal and the substrate 1 is F2, the adhesion between the liquid metal and the roller 6 is F3, wherein F1 < F3 < F2, and the difference between F3 and F1 is greater than or equal to 0.45 μ N/mm2The difference between F2 and F3 is greater than or equal to 0.45 μ N/mm2So that the roller 6 can completely stick the liquid metal from the first surface modification layer 2 and at the same time can only stick the excess liquid metal in the first liquid metal line 4, most of the liquid metal will remain in the first liquid metal line 4. It should be noted that the adhesion between the bottom of the first groove 3 and the liquid metal of the substrate 1 after laser ablation is greater than that of F2, i.e. laser ablation is helpful to achieve the above effect.
In yet another example, the substrate 1 is placed on a cold plate, the temperature of which is below the melting point of the liquid metal, the temperature of the rollers 6 is above the melting point of the liquid metal, and the rollers 6 are used to roll over the first liquid metal line 4. Since the temperature of the cold plate is lower than the melting point of the liquid metal, and the temperature of the roller 6 is higher than the melting point of the liquid metal, one side of the first liquid metal line 4 close to the substrate 1 is solid, and the part in contact with the roller 6 is liquid, after the roller 6 is used for rolling over the first liquid metal line 4, the liquid metal in the liquid state is adhered away by the roller 6, and the liquid metal in the solid state still remains in the first liquid metal line 4.
In this case, the adhesion between the roller 6 and the liquid metal is optionally greater than 40 μ N/mm2So that the roller 6 can stick away the liquid metal in the liquid state well. Optionally, the cold plate has a temperature at least 40 ℃ below the melting point of the liquid metal so that the liquid metal can solidify quickly, the rollerThe temperature of the seed is at least 70 ℃ above the melting point of the liquid metal so that the liquid metal can be melted rapidly.
Optionally, as shown in fig. 7, 8, and 9, fig. 7 to 9 are second to fourth flowcharts of a method for manufacturing a circuit according to an embodiment of the present invention, where the method for manufacturing a circuit further includes:
step S6, forming a second surface modification layer on the second surface of the base material, wherein the second surface modification layer is isolated from the liquid metal, and the first surface and the second surface are oppositely arranged;
step S7, forming a second groove on the second surface of the substrate, wherein the depth of the second groove is greater than or equal to the thickness of the second surface modification layer;
step S8, filling liquid metal in the second groove to form a second liquid metal circuit;
and step S9, packaging the second liquid metal circuit on the second side of the substrate.
In the above, the sequence of steps S6 to S9 and steps S2 to S5 is not limited, in the example shown in fig. 7, steps S6 to S9 are executed after steps S2 to S5, in the example shown in fig. 8, steps S6 to S9 are executed before steps S2 to S5, in the example shown in fig. 9, step S6 is executed at the same time as step S2, steps S7 to S9 are executed after steps S2 to S5, and of course, steps S6 and S2 may be executed at the same time as step S7 to step S9 are executed before steps S2 to S5. In the embodiment of the present invention, it is preferable that the step S6 and the step S2 are performed simultaneously to simplify the circuit manufacturing method.
A two-layer circuit can be fabricated using the method of fabricating a circuit as described above. Specifically, as shown in fig. 5 and 10, fig. 10 is a schematic process diagram of steps S6 to S9, which is executed at the same time as step S6 and step S2, and steps S7 to S9 are executed as an example after steps S2 to S5, and the process of manufacturing the liquid metal-based circuit using the manufacturing method of the circuit is as follows: firstly, providing a base material 1 adhered with liquid metal, then forming a first surface modification layer 2 on a first surface of the base material 1 and forming a second surface modification layer 7 on a second surface of the base material 1, wherein the first surface modification layer 2 and the second surface modification layer 7 are both separated from the liquid metal, then forming a first groove 3 on the first surface of the base material 1, the depth of the first groove 3 is more than or equal to the thickness of the first surface modification layer 2, then filling the liquid metal in the first groove 3 to form a first liquid metal circuit 4, then packaging the first liquid metal circuit 4 on the first surface of the base material 1, then forming a second groove 8 on the second surface of the base material 1, the depth of the second groove 8 is more than or equal to the thickness of the second surface modification layer 7, then filling the liquid metal in the second groove 8 to form a second liquid metal circuit 9, and then packaging the second liquid metal circuit 9 on the second surface of the base material 1, for example, the second protective film 10 is formed to cover the second surface of the substrate 1, and the second liquid metal line 9 on the second surface of the substrate 1 is encapsulated by pressing the second protective film 10 and the substrate 1.
In the above process, when the operation is performed on the second surface of the substrate 1, the first liquid metal wiring 9 on the first surface of the substrate 1 is already encapsulated, and therefore, even if the melting point of the first liquid metal wiring 9 is lower than the room temperature and is in a liquid state having fluidity at the room temperature, the fabrication of the two-layer circuit is not affected.
When an electrical connection is required between two layers of the two-layer circuit, optionally, the method for manufacturing the circuit further includes:
as shown in fig. 11, fig. 11 is a schematic process diagram of steps S6 to S7, and a via hole 11 penetrating through the second surface modification layer 7 and the substrate 1 is formed between step S6 and step S7; filling liquid metal in the via hole 11 to form a connecting piece 12; the connecting member 12 is used to electrically connect the first liquid metal line 4 and the second liquid metal line 9. The via hole 11 may be formed by a laser ablation process, and since the boiling point of the liquid metal in the first liquid metal line 4 is much higher than the boiling points of the substrate 1 and the second surface modification layer 7, the first liquid metal line 4 is not damaged during the formation of the via hole 11.
Optionally, as shown in fig. 12, fig. 12 is a schematic process diagram of steps S8 to S9 according to the embodiment of the present invention, and the method for manufacturing the circuit further includes: between step S8 and step S9, the component 13 is attached to the second surface of the substrate 1, and the leads of the component 13 are electrically connected to the second liquid metal wiring 9. Of course, if necessary, a component may be attached to the first surface of the substrate 1 between step S4 and step S5, and the leads of the component may be electrically connected to the first liquid metal lines 4.
Further, as shown in fig. 11 and 12, the method for manufacturing a circuit further includes: between step S6 and step S8, third grooves 14 for placing pins of the component 13 are formed on the second surface of the substrate 1, one end of each third groove 14 is communicated with the second groove 8, and the depth of each third groove 14 is greater than that of the second groove 8; in step S8, liquid metal is filled in both the second groove 8 and the third groove 14. The arrangement enables the pins of the component 13 to be in better contact with the liquid metal, and the performance of the liquid metal-based circuit is improved. Optionally, the third recess 14 and the second recess 8 are formed in one laser ablation process to simplify the manufacturing method of the circuit.
Further, the manufacturing method of the circuit further comprises the following steps: after step S8, forming a fourth groove 15 on the second face of the base material 1; two ends of the fourth groove 15 are respectively communicated with a third groove 14, and the fourth groove 15 is used for placing a main body structure of the component 13; the depth of the fourth groove 15 is smaller than the depth of the third groove 14 and greater than the depth of the second groove 8. The whole structure of the component 13 can be located in the groove by the arrangement, the upper surface of the component can be flush with the second liquid metal line 9 with a small height difference, and the component 13 is fixed and the second liquid metal line 9 is packaged. Preferably, the depth of the fourth recess 15 is consistent with the thickness of the main structure of the component 13, and the depth of the third recess 14 is consistent with the length of the pin of the component 13.
In addition, an embodiment of the present invention further provides an apparatus for manufacturing a circuit, which can be used to execute the above-mentioned method for manufacturing a circuit to manufacture the above-mentioned liquid metal-based circuit, specifically, as shown in fig. 13, fig. 13 is a schematic structural diagram of the apparatus for manufacturing a circuit according to the embodiment of the present invention, and the apparatus for manufacturing a circuit includes:
a robot module 100 for holding and moving a substrate (an initially provided substrate or a substrate after one or more steps), the substrate having a surface modification layer (a first surface modification layer and a second surface modification layer) disposed on a first surface and/or a second surface thereof, the surface modification layer being separated from the liquid metal;
a laser ablation module 200 for performing laser ablation on the substrate to form a groove (the first groove and the second groove are collectively referred to as the first groove and the second groove), the depth of the groove being greater than or equal to the thickness of the surface modification layer;
a metal filling module 300, configured to fill liquid metal in the groove to form a liquid metal line (which is a general term for the first liquid metal line and the second liquid metal line);
a chip module 400 for attaching components to the liquid metal circuit;
and an encapsulation module 500 for encapsulating the liquid metal circuit.
The manufacturing device using the circuit can manufacture a liquid metal-based circuit, and takes the manufacturing of the circuit on the first surface of the substrate as an example, and the specific manufacturing process comprises the following steps:
first, the first surface of the substrate is facing upward through the manipulator module 100, and the substrate is moved to the laser ablation module 200, then the laser ablation module 200 performs laser ablation on the substrate to form a first groove on the first surface of the substrate, then the metal filling module 300 fills liquid metal in the first groove to form a first liquid metal circuit, then the chip mounting module 400 attaches components to the first liquid metal circuit, and finally the packaging module 500 packages the first liquid metal circuit.
The circuit manufacturing apparatus may also be used to manufacture a double-layer circuit, and the specific structure of each module is exemplified in the following content according to the embodiment of the present invention.
Alternatively, as shown in fig. 14, fig. 14 is a schematic structural diagram of a robot module according to an embodiment of the present invention, where the robot module 100 includes a clamping robot 101, a lifting cylinder 102, and an overturning cylinder 103, and both the lifting cylinder 102 and the overturning cylinder 103 are connected to the clamping robot 101; the clamping manipulator 101 is used for horizontally moving the base material 600, the lifting cylinder 102 is used for lifting the clamping manipulator 101, and the overturning cylinder 103 is used for overturning the clamping manipulator 101. The robot module 100 has a simple structure and can well control the movement and the inversion of the substrate 600.
Specifically, the chucking robot 101 may move left and right and/or back and forth to realize the movement of the substrate 2. The left and right movement of the clamping manipulator 101 can make the working width of one clamping manipulator 101 larger, and the application range is wide. The flipping of the gripper robot 101 may effect the flipping of the substrate 600 (i.e., the flipping of the first and second sides of the substrate 600).
Optionally, as shown in fig. 15, fig. 15 is a schematic structural diagram of a laser ablation module according to an embodiment of the present invention, where the laser ablation module 200 includes a laser base 201, a laser head 202, a laser X-axis moving system 203, a laser Y-axis moving system 204, a laser Z-axis moving system 205, a laser holder 206, and a laser support column 207, and the laser holder 206 is used for fixing the substrate 600 during laser ablation; the laser X-axis moving system 203 is erected above the laser base 201 through a laser supporting column 207; the laser Z-axis moving system 205 is connected with the laser X-axis moving system 203 and can move along the laser X-axis moving system 203; the laser head 202 is connected with the laser Z-axis moving system 205 and can move along the laser Z-axis moving system 205; the laser Y-axis moving system 204 is located on the laser base 201, and the laser fixing base 206 is located on the laser Y-axis moving system 204 and can move along the laser Y-axis moving system 204. The laser ablation module 200 has a simple structure and can easily form a groove on the substrate 600.
On the basis of the structure of the laser ablation module 200, the embodiment of the invention can realize the manufacture of the circuit of the curved substrate, and only the laser fixing seat 206 can fix the curved substrate. Optionally, as shown in fig. 16, fig. 16 is a schematic structural diagram of a laser fixing base according to an embodiment of the present invention, where the laser fixing base 206 includes a fixing slot 206a and a plurality of negative pressure ports 206b located at the bottom of the fixing slot 206a, and the curved substrate can be fixed by pumping negative pressure. Optionally, a plurality of negative pressure ports 206b are distributed in an array at the bottom of the fixed card slot 206 a.
Optionally, as shown in fig. 17, fig. 17 is a schematic structural diagram of a metal filling module according to an embodiment of the present invention, where the metal filling module 300 includes a filling base 301, a filling head 302, a filling X-axis moving system 303, a filling Y-axis moving system 304, a filling fixing base 305, a filling supporting column 306, and a filling Z-axis moving system 307, and the filling fixing base 305 is used for fixing the substrate 600 during a liquid metal filling process; wherein the filling X-axis moving system 303 is erected above the filling base 301 by a filling support column 306; the filling Z-axis moving system 307 is connected with the filling X-axis moving system 303 and can move along the filling X-axis moving system 303; the filling head 302 is connected with a filling Z-axis moving system 307 and can move along the filling Z-axis moving system 307; the filling Y-axis moving system 304 is located on the filling base 301, and the filling fixing base 305 is located on the filling Y-axis moving system 304 and can move along the filling Y-axis moving system 304. The metal filling module 300 has a simple structure, and can conveniently fill liquid metal in the groove on the substrate 600.
The fill Y-axis motion system 304 may interface with the laser Y-axis motion system 204 to better facilitate the transfer of the substrate 600. The filling holder 305 may be a holder specially matched with the metal filling module 300, or may be a laser holder transmitted from the laser ablation module 200, and the latter is preferred in the embodiment of the present invention, so as to simplify the structure of the circuit manufacturing apparatus and the circuit manufacturing process. Other fixing seats in the following can also refer to the above, and the details are not described in the following.
Illustratively, the filling head 302 is provided with a laser ranging structure, and the laser ranging structure is used for measuring a vertical distance between the filling head 302 and a position of the substrate 600 to be filled with the liquid metal, so as to improve an effect of filling the liquid metal in the groove, improve performance of the liquid metal line, and realize filling the liquid metal in the groove on the curved substrate.
Optionally, as shown in fig. 18, fig. 18 is a schematic structural diagram of a chip module according to an embodiment of the present invention, where the chip module 400 includes a chip base 401, a chip holder 402, a chip X-axis moving system 403, a chip Y-axis moving system 404, a chip head 405, a component slot 406, and a guide beam 407 extending along a Y-axis, where the chip holder 402 is used to fix the substrate 600 during component attachment; the patch Y-axis moving system 403 is located on the patch base 401, and the patch fixing base 402 is located on the patch Y-axis moving system 404 and can move along the patch Y-axis moving system 404; the patch X-axis moving system 403 is positioned on the patch base 401, and the guide beam 407 is connected with the patch X-axis moving system 403 and can move along the patch X-axis moving system 403; the mounting head 405 is connected with the guide beam 407 and can move along the guide beam 407; the component slot 406 is located on the patch base 401. The chip module 400 has a simple structure, and components can be conveniently attached to the liquid metal lines on the substrate 600.
Likewise, the patch Y-axis motion system 404 may interface with the fill Y-axis motion system 304 to better facilitate the transfer of the substrate 600.
Optionally, as shown in fig. 19, fig. 19 is a schematic structural diagram of a package module according to an embodiment of the present invention, where the package module 500 includes a film covering device 501, a film covering main rail 502, a film supply tray 503, a film take-up tray 504, a film covering sub-rail 505, and a film covering holder 506, where the film covering holder 506 is used for fixing the substrate 600 during a packaging process; the film covering sub-guide rail 505 is connected between the film covering main guide rail 502 and the film covering device 501, and the film covering fixing seat 506 can advance along with the film covering main guide rail 502 and the film covering sub-guide rail 505; the coating device 501 is used to bond the protective film 700 to the base material 600; the film supply tray 503 is used for supplying a protective film 700 (the first protective film or the second protective film is referred to as a whole) to the position where the film coating device 501 is located; the film collecting disc 504 is used for collecting the residual protective film 700 after film coating. The packaging module 500 has a simple structure, can conveniently package the substrate 600, can reduce the packaging thickness by using a film-covering mode for packaging, has uniform and controllable packaging thickness, and improves the packaging efficiency.
The film covering sub-guide 505 can move laterally in a short distance, so that the working width of the packaging module 500 is large without moving or performing complex design on the film covering device 501, the film supply disc 503 and the film collection disc 504, and the application range is wide.
Illustratively, the laminating device is a pressing roller that presses the base material 600 and the protective film 700 by cold pressing or a hot air gun that bonds the base material 600 and the protective film 700 by heating.
Of course, the encapsulation module 500 provided in the embodiment of the present invention may also include a dispenser, and the liquid encapsulation material is coated on the substrate 600 by the dispenser, and the substrate 600 can be encapsulated after the encapsulation material is dried.
Optionally, as shown in fig. 20, fig. 20 is a partial schematic structural diagram of a circuit manufacturing apparatus according to an embodiment of the present invention, and the circuit manufacturing apparatus further includes an adhesion module, where the adhesion module is located between the metal filling module 300 and the patch module 400, and the adhesion module is used for adhering excess liquid metal in the liquid metal line. Redundant liquid metal in the liquid metal circuit is adhered through the adhesion module, the liquid metal can be prevented from being extruded and flowing in the packaging process, pollution or damage to other positions can be avoided, the surface of the liquid metal circuit can be flush with the surface of the surface modification layer, and the packaging effect can be improved.
Illustratively, as shown in fig. 20, the adhesion module includes an adhesion roller 801, an adhesion fixing base 802, an adhesion supporting column 803, an adhesion Y-axis moving system 804 and an adhesion base 805, wherein the adhesion Y-axis moving system 804 is located on the adhesion base 805, the adhesion fixing base 802 is located on the adhesion Y-axis moving system 804 and is movable along the adhesion Y-axis moving system 804, and the adhesion roller 801 is erected above the adhesion base 805 by the adhesion supporting column 803. Preferably, the adhesion roller 801 may move up and down to control whether the adhesion roller 801 is in contact with the liquid metal line, and the magnitude of the pressure between the adhesion roller 801 and the liquid metal line may be adjusted.
In an example, as shown in fig. 21, fig. 21 is a schematic structural diagram of a first adhesion roller according to an embodiment of the present invention, in which an adhesion roller 801 includes a rigid shaft 801a and a first elastic layer 801b wrapped around the rigid shaft 801 a. The adhering roller 801 having this structure can be applied to an irregular curved surface. Preferably, the first elastic layer 801b satisfies the definition of adhesion described previously.
In another example, as shown in fig. 22, fig. 22 is a second schematic structural diagram of an adhesion roller according to an embodiment of the present invention, in which the adhesion roller 801 includes an elastic shaft 801c, a plurality of rigid wheels 801d sleeved on the elastic shaft 801c, and a second elastic layer 801e sleeved outside the elastic shaft 801c and the rigid wheels 801 d. The adhesive roller 801 with this structure is suitable for use on a convex surface, when the adhesive roller 801 rolls over the convex surface, the second elastic layer 801e and the elastic shaft 801c stretch to adapt to the undulation of the convex surface, and the rigid wheel 801d drives the adhesive roller 801 to roll.
In yet another example, the adhering roller 801 has a heating component, the adhering base 805 has a cooling component, the cooling component reduces the temperature of the adhering base 805 to be lower than the melting point of the liquid metal, the heating component heats the adhering roller 801 to be higher than the melting point of the liquid metal, when the adhering roller 801 rolls from the liquid metal line, one side of the liquid metal line close to the adhering base 805 is solid, the part in contact with the adhering roller 801 is liquid, after the adhering roller 801 rolls from the liquid metal line, the adhering roller 801 adheres the liquid metal in the liquid state, and the liquid metal in the solid state still remains in the liquid metal line.
It should be noted that the moving systems in the same direction may be connected to each other or integrated into a whole, the bases of adjacent modules may be connected to each other or integrated into a whole, and the fixing seat in each module may be transmitted from the previous module without being separately installed. Each module may include one or more parallel work paths (in the example shown in fig. 15, 17, and 20, each module includes two work paths), and in the use process, the plurality of substrates 600 may be simultaneously transported in the direction from the robot module 100 to the package module 500, and the plurality of substrates 600 may be simultaneously processed, or the substrate 600 on which a circuit is to be fabricated on the first surface may be transported in the direction from the robot module 100 to the package module 500, and the substrate 600 on which a circuit is fabricated on the first surface may be transported in the direction from the package module 500 to the robot module 100, so that the robot module 100 turns over the substrate, and then the substrate 600 may be transported in the direction from the robot module 100 to the package module 500, so that a circuit is fabricated on the second surface of the substrate 600, thereby implementing the fabrication of a two-layer circuit.
In addition, the contents of the liquid metal-based circuit, the circuit manufacturing method, and the circuit manufacturing apparatus according to the embodiments of the present invention are all applicable to each other.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. A method of making a circuit, comprising:
step S1, providing a base material adhered with liquid metal;
step S2, forming a first surface modification layer on the first surface of the base material, wherein the first surface modification layer separates liquid metal;
step S3, forming a first groove on the first surface of the substrate, wherein the depth of the first groove is greater than or equal to the thickness of the first surface modification layer;
step S4, filling liquid metal in the first groove to form a first liquid metal circuit;
step S5, encapsulating the first liquid metal line on the first side of the substrate;
further comprising rolling over the first liquid metal line between the step S4 and the step S5 using a roller that adheres the liquid metal;
wherein the adhesion between the liquid metal and the first surface modification layer is F1, the adhesion between the liquid metal and the base material is F2, the adhesion between the liquid metal and the roller is F3, wherein F1<F3<F2, and the difference between F3 and F1 is greater than or equal to0.45μN/mm2The difference between F2 and F3 is greater than or equal to 0.45 μ N/mm2。
2. The method for manufacturing an electrical circuit according to claim 1, wherein in step S3, the first groove is formed on the first surface of the substrate by a laser ablation process.
3. The method of claim 1, wherein said rolling over the first liquid metal line using a roller that adheres the liquid metal comprises: placing the substrate on a cold plate, wherein the temperature of the cold plate is lower than the melting point of the liquid metal, and the temperature of the roller is higher than the melting point of the liquid metal; and rolling over the first liquid metal line using the roller.
4. The method for manufacturing a circuit according to any one of claims 1 to 3, further comprising:
step S6, forming a second surface modification layer on a second surface of the substrate, wherein the second surface modification layer separates the liquid metal, and the first surface and the second surface are oppositely disposed;
step S7, forming a second groove on the second surface of the substrate, wherein the depth of the second groove is greater than or equal to the thickness of the second surface modification layer;
step S8, filling the liquid metal in the second groove to form a second liquid metal circuit;
and step S9, packaging the second liquid metal circuit on the second side of the substrate.
5. The method of manufacturing a circuit according to claim 4, further comprising:
forming a via hole penetrating the second surface modification layer and the substrate between the step S6 and the step S7;
filling the liquid metal in the via hole to form a connecting piece;
the connecting piece is used for electrically connecting the first liquid metal line and the second liquid metal line.
6. The method of manufacturing a circuit according to claim 4, further comprising: between the step S8 and the step S9, a component is attached to the second surface of the substrate, and a lead of the component is electrically connected to the second liquid metal line.
7. The method of manufacturing a circuit according to claim 6, further comprising: forming third grooves for placing pins of the component on the second surface of the substrate between the step S6 and the step S8, wherein one end of each third groove is communicated with the second groove, and the depth of each third groove is greater than that of the second groove;
in step S8, the liquid metal is filled in both the second groove and the third groove.
8. The method of manufacturing a circuit according to claim 7, further comprising: forming a fourth groove on the second face of the base material after the step S8; two ends of the fourth groove are respectively communicated with one third groove, and the fourth groove is used for placing a main body structure of the component; the depth of the fourth groove is smaller than that of the third groove and larger than that of the second groove.
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