CN111323942B - Electronic device and frame glue coating method thereof - Google Patents
Electronic device and frame glue coating method thereof Download PDFInfo
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- CN111323942B CN111323942B CN201811530226.7A CN201811530226A CN111323942B CN 111323942 B CN111323942 B CN 111323942B CN 201811530226 A CN201811530226 A CN 201811530226A CN 111323942 B CN111323942 B CN 111323942B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Liquid Crystal (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a frame glue coating method of an electronic device, which comprises the following steps: providing a first substrate, wherein the first substrate is provided with a plurality of substrate areas and at least one outer area, the outer area is positioned outside the substrate areas, and each substrate area comprises a first area and a second area surrounding the first area; lowering the coating head to the frame glue coating height; performing a frame glue coating process on the first substrate, continuously coating glue on the coating head from a glue coating starting point to a glue coating end point, respectively forming frame glue in the second area of each substrate area, and surrounding each frame glue on the corresponding first area; and raising the coating head to a safe height; each frame glue comprises a first glue body part and a second glue body part, the extending direction of the first glue body part is different from that of the second glue body part, each frame glue only has one frame glue overlapping point, and the frame glue overlapping points are formed by the first glue body part and the second glue body part in a crossed mode.
Description
Technical Field
The present invention relates to an electronic device and a frame glue coating method thereof, and more particularly, to an electronic device and a frame glue coating method thereof capable of saving glue coating time and improving glue coating quality.
Background
With the development of technology and technology, electronic devices have become an indispensable article in society, for example, a display or a touch display, which has the characteristics of light and thin profile, low power consumption, no radiation pollution, and the like, and thus, the electronic devices have been widely applied to various portable or wearable electronic products, such as notebook computers (notebook computers), smart phones (smart phones), watches, and vehicle displays, to provide more convenient information transmission and display.
Generally, in the manufacturing process of an electronic device, two structures (for example, two substrates arranged oppositely) in the electronic device are usually adhered, and in this process, a coating head for coating glue is first adjusted to a height at which a glue can be coated, then the glue is coated on the electronic device to form a frame glue, and finally the coating head is adjusted to a safe height to complete the glue coating.
Disclosure of Invention
The invention provides a frame glue coating method of an electronic device, which can coat a plurality of frame glue on a substrate between two times of height adjustment of a coating head so as to save coating time.
In order to solve the above technical problems, the present invention provides a frame glue coating method for an electronic device, comprising the following steps: providing a first substrate, wherein the first substrate is provided with a plurality of substrate areas and at least one outer area, the outer area is positioned at the outer side of the substrate areas, and the substrate areas respectively comprise a first area and a second area surrounding the first area; lowering the coating head to the frame glue coating height; performing a frame glue coating process on the first substrate, continuously coating glue on a coating head from a glue coating starting point to a glue coating end point, forming frame glue in the corresponding second areas in the substrate area, and surrounding the corresponding first areas by each frame glue; and raising the coating head to a safe height; each frame glue comprises a first glue body part and a second glue body part, the extending direction of the first glue body part is different from that of the second glue body part, each frame glue only has one frame glue overlapping point, and the frame glue overlapping points are formed by the first glue body part and the second glue body part in a crossed mode.
In order to solve the above technical problem, the present invention further provides an electronic device, which includes a first substrate, a second substrate, and a sealant. The first substrate is provided with a first area and a second area surrounding the first area, and the first substrate is provided with an electronic element. The second substrate is arranged opposite to the first substrate. The frame glue is arranged between the first substrate and the second substrate, is positioned in the second area and surrounds the first area, is used for adhering the first substrate and the second substrate, and comprises a first glue body part and a second glue body part, wherein the extending direction of the first glue body part is different from that of the second glue body part, only one frame glue overlapping point is arranged in the frame glue, and the frame glue is formed by intersecting the first glue body part and the second glue body part.
In the frame glue coating method of the electronic device, because the frame glue coating process can be carried out from the glue coating starting point to the glue coating end point to finish a plurality of frame glue at one time, namely the coating head coats a plurality of frame glue on the substrate between two times of height adjustment, the coating time can be saved. In addition, due to the position design of the gluing starting point and the gluing end point, the color difference caused by the coincident point of the gluing starting point and the gluing end point can be avoided, or the situation that the frame glue has a gap is avoided, so that the reliability of the electronic device is improved.
Drawings
Fig. 1 is a flowchart illustrating a frame glue coating method of an electronic device according to an embodiment of the invention.
Fig. 2 is a schematic top view illustrating a sealant coating process of the sealant coating method of the electronic device according to the first embodiment of the invention.
Fig. 3 is a schematic top view of an electronic device according to a first embodiment of the invention.
Fig. 4 isbase:Sub>A schematic sectional view taken along linebase:Sub>A-base:Sub>A' of fig. 3.
Fig. 5 to 8 are schematic top views illustrating the sealant coating processes of the electronic devices according to the second to fifth embodiments of the present invention.
Wherein the reference numerals are as follows:
110. first substrate
110a electronic component
112. Substrate region
112a first region
112b second zone
114. Outer zone
120. Frame glue
120a first frame glue
120b second sealant
120c third frame glue
120d fourth frame glue
120r glue spreading terminal point
120s gluing starting point
122-1 first colloidal portion
122-1a, 122-2a straight line part
122-1b and 122-2b arc parts
122-1e first end
122-2 second glue part
122-2e second end
122-3 third glue part
122-4 fourth gum portion
122p sealant overlapping point
124. 126 glue connection part
130. Second substrate
140. Display medium layer
CP seal Pattern
D1 A first direction
D2 Second direction
ED electronic device
S1 to S6
Detailed Description
In order to make the present invention more comprehensible to those skilled in the art, preferred embodiments of the present invention are specifically described below, and the present invention will be described in detail with reference to the accompanying drawings. It should be noted that the drawings are simplified schematic drawings, and that only the elements and combinations related to the present invention are shown to provide a clear description of the basic structure or implementation method of the present invention, while the actual elements and layout may be more complicated. In addition, for convenience of description, the elements shown in the drawings are not necessarily drawn to scale, and the specific scale may be adjusted according to design requirements.
It should be noted that, the electronic device ED of the present invention can be, for example, a display (such as a Liquid Crystal Display (LCD), a micro-light-emitting diode (micro-LED) display, an active-matrix organic light-emitting diode (AMOLED) display, etc.), a touch sensor device or other suitable electronic devices, and the electronic device ED can be a flexible electronic device or a non-flexible electronic device according to the requirement, but the invention is not limited thereto. In this document, the electronic device ED is illustrated by taking a liquid crystal display as an example.
Referring to fig. 1 to 4, fig. 1 isbase:Sub>A flowchart illustratingbase:Sub>A sealant coating method of an electronic device according to an embodiment of the present invention, fig. 2 isbase:Sub>A schematic top view illustratingbase:Sub>A sealant coating process of the sealant coating method of the electronic device according to the first embodiment of the present invention, fig. 3 isbase:Sub>A schematic top view illustrating the electronic device according to the first embodiment of the present invention, and fig. 4 isbase:Sub>A schematic cross-sectional view taken alongbase:Sub>A linebase:Sub>A-base:Sub>A' of fig. 3. As shown in fig. 1 and fig. 2, in the frame adhesive coating method of the electronic device of the present embodiment, step S1 is first performed to provide a first substrate 110, wherein the first substrate 110 may have a plurality of substrate areas 112 and at least one outer area 114, and the outer area 114 is located outside the substrate areas 112, in the present embodiment, each substrate area 112 is a top view area of an electronic device ED, the substrate areas 112 are adjacent to each other in the first direction D1, and the outer area 114 surrounds all the substrate areas 112, but the present invention is not limited thereto, and the configuration of the substrate areas 112 and the outer area 114 may be designed according to requirements. Each substrate area 112 may include a first area 112a and a second area 112b surrounding the first area 112a, and herein, since the electronic device ED is exemplified by a liquid crystal display, the first area 112a may be used as a display area for displaying a picture, the second area 112b may be used as a peripheral area for assisting the display area to display the picture, but not limited thereto, and the purposes of the first area 112a and the second area 112b may be changed according to the electronic device ED. In addition, the first substrate 110 may have a plate body for carrying a structure, and includes electronic elements, conductive layers, insulating layers and/or other suitable structures disposed on the plate body, for example, in the embodiment, a portion of the first substrate 110 serving as the first region 112a of the display region may include display elements (such as pixel electrodes and common electrodes), switching elements, data lines and/or scanning lines, etc., and a portion of the second region 112b serving as the peripheral region may include driving circuits (such as gate driving circuits, source driving circuits, touch sensing circuits, esd protection circuits, integrated Circuits (ICs), etc.) and/or peripheral wires, etc., and may be electrically connected to the structures in the first region 112a, but not limited thereto. In addition, the shape of the substrate region 112 may be a circle, an ellipse, a polygon, a shape with a notch, or a shape with a curved edge, and the shape of the first region 112a may also be a circle, an ellipse, a polygon, a shape with a notch, or a shape with a curved edge, and the shapes of the substrate region 112 and the first region 112a may be similar or different, and in this embodiment, the shapes of the substrate region 112 and the first region 112a may be both rectangles, but not limited thereto. It should be noted that, in fig. 2 and fig. 3, the first substrate 110 only shows the substrate area 112, the first region 112a and the second region 112b, and the included internal structure is not shown, and fig. 4 shows a part of the electronic element 110a in the first substrate 110, so as to make the drawings clearer.
Then, step S2 is performed, the coating head for coating the sealant is lowered to the sealant coating height, so as to perform subsequent coating. For example, the coating head may have at least two working heights: the frame glue coating height is a height when the coating head normally coats the glue, and the safety height is a height when the coating head does not coat the glue, and the coating head can ensure that the glue is not coated on the first substrate 110 when moving at the safety height. It should be noted that the sealant coating height and the safety height may be determined according to the used equipment and the actual manufacturing condition, in this embodiment, the distance between the sealant coating height and the first substrate 110 is smaller than the distance between the safety height and the first substrate 110, but not limited thereto. Therefore, in step S2 of this embodiment, the coating head can be lowered from a safe height at which the first substrate 110 is not coated with the sealant to a sealant coating height at which the first substrate 110 can be coated with the sealant, but not limited thereto.
Next, step S3 is performed, a frame adhesive coating process is performed on the first substrate 110, in the frame adhesive coating process, the coating head continuously coats the adhesive from the adhesive start point 120S to the adhesive end point 120r to form the frame adhesive 120 in the second region 112b of each substrate region 112, and each frame adhesive 120 surrounds the corresponding first region 112a, that is, each of the plurality of frame adhesives 120 is formed in the second region 112b of one of the substrate regions 112 and surrounds the corresponding first region 112a. In fig. 2, each sealant 120 may have a sealing pattern CP to surround the first region 112a, and the sealing pattern CP of the embodiment is rectangular, but not limited thereto. After the sealant coating process is completed, step S4 is performed to raise the coating head to a safe height, in this embodiment, the coating head may be raised to the safe height from the sealant coating height. It should be noted that "starting from the starting point 120s to continuously coat the sealant to the ending point 120r" means that the sealant is not interrupted during the process from the starting point 120s to the ending point 120r, and the sealant forming the plurality of sealant 120 is continuous and uninterrupted on the first substrate 110 from the starting point 120s to the ending point 120r, that is, in the sealant coating process, the formed plurality of sealant 120 is continuously coated by one frame of the coating head, so in the sealant coating process, the coating head is lowered to the sealant coating height at the starting point 120s and is maintained at the sealant coating height to continuously coat the plurality of sealant 120, and is raised to the safety height after being coated to the ending point 120 r. In addition, the material of the colloid may include silicon oxide (silicone material), epoxy (epoxy) or other suitable adhesive material, and the width of the colloid may be 0.5 millimeters (mm) to 1 mm, but not limited thereto, and the appropriate width may be selected according to the used equipment.
In detail, in fig. 2, the plurality of sealant 120 may include a first sealant 120a, a second sealant 120b, a third sealant 120c and a fourth sealant 120D, which are arranged along the first direction D1 and respectively surround different first regions 112a in fig. 2, and at least one sealant connecting portion 124, 126 may be formed in the outer region 114 during the sealant coating process, and each sealant connecting portion 124, 126 connects two of the plurality of sealant 120, for example, the first sealant 120a may be connected to the second sealant 120b through the sealant connecting portion 124, the second sealant 120b may be directly connected to the third sealant 120c, and the third sealant 120c may be connected to the fourth sealant 120D through the sealant 126, but not limited thereto. In addition, in the embodiment, the sealant connecting portions 124 and 126 may be located on one side of the second direction D2 of the connected sealant 120 and cross the connected sealant 120 in the first direction D1, where the second direction D2 is different from the first direction D1, for example, but not limited to, the second direction D2 is perpendicular to the first direction D1. For disposing the adhesive connecting portions 124 and 126, the size of the outer region 114 in the second direction D2 may be greater than or equal to 2.5 mm, and the size reserved in the outer region may be flexibly increased or decreased according to the layout requirement and the minimum reserved width required by the scribe line, but the invention is not limited thereto. In addition, as shown in fig. 2, in the sealant coating process of the embodiment, the coating head can coat the sealant according to the arrow direction in fig. 2 to complete the coating of the sealant 120 and the sealant connecting portions 124 and 126, that is, the coating head of the embodiment sequentially coats the first sealant 120a, the sealant connecting portion 124, the second sealant 120b, the third sealant 120c, the sealant connecting portion 126, and the fourth sealant 120d from the coating start point 120s to the coating end point 120r, so that the first sealant 120a, the second sealant 120b, the third sealant 120c, and the fourth sealant 120d are sequentially and continuously completed, and the coating of the first sealant 120a is completed first, then the coating of the second sealant 120b is performed, and then the coating of the third sealant 120c is performed after the coating of the second sealant 120b is completed, and so on, but the coating manner and the arrangement positions of the sealant 120 and the sealant connecting portions 124 and 126 are not limited thereto.
On the other hand, the sealant 120 of the present embodiment may include a first sealant portion 122-1 and a second sealant portion 122-2, an extending direction of the first sealant portion 122-1 is different from an extending direction of the second sealant portion 122-2, and the sealant 120 has only one sealant overlapping point 122p, and the sealant overlapping point 122p is formed by intersecting the first sealant portion 122-1 and the second sealant portion 122-2, that is, the first sealant 120a, the second sealant 120b, the third sealant 120c, and the fourth sealant 120d of the present embodiment each include a first sealant portion 122-1 and a second sealant portion 122-2 having different extending directions, and the sealant overlapping points 122p of the first sealant 120a, the second sealant 120b, the third sealant 120c, and the fourth sealant 120d are formed by intersecting the respective first sealant portion 122-1 and the second sealant portion 122-2. It should be noted that, during the sealant coating process, the sealant overlapping point 122p is a start point and an end point of the seal pattern CP in each sealant 120, and the sealant overlapping point 122p is adjacent to a corner of the substrate region 112. In this embodiment, the first plastic portion 122-1 may extend along the first direction D1/the second direction D2, and the second plastic portion 122-2 extends along the second direction D2/the first direction D1, that is, the first plastic portion 122-1 is perpendicular to the second plastic portion 122-2, so that the first plastic portion 122-1 and the second plastic portion 122-2 form a cross or an X-shaped cross at the sealant overlapping point 122p, but not limited thereto, in other embodiments, the first plastic portion 122-1 and the second plastic portion 122-2 may extend along a direction different from the second direction D2 and the first direction D1. It should be noted that, in the embodiment, the extending direction (the first direction D1) of the first sealant portion 122-1 of the first sealant 120a is different from the extending direction (the second direction D2) of the first sealant portion 122-1 of the second sealant 120b, and the extending direction (the second direction D2) of the second sealant portion 122-2 of the first sealant 120a is different from the extending direction (the first direction D1) of the second sealant portion 122-2 of the second sealant 120b, but the invention is not limited thereto. In addition, each of the sealant 120 of the embodiment may further additionally include a third sealant portion 122-3 and a fourth sealant portion 122-4, the third sealant portion 122-3 is connected between the first sealant portion 122-1 and the fourth sealant portion 122-4, and the fourth sealant portion 122-4 is connected between the third sealant portion 122-3 and the second sealant portion 122-2, and since the substrate region 112 and the first region 112a of the embodiment are rectangular, the extending direction of the third sealant portion 122-3 is the same as the extending direction of the second sealant portion 122-2, and the extending direction of the fourth sealant portion 122-4 is the same as the extending direction of the first sealant portion 122-1, but not limited thereto. It should be noted that the seal pattern CP in the sealant 120 may be formed by at least a portion of the first sealant portion 122-1, the third sealant portion 122-3, the fourth sealant portion 122-4, and at least a portion of the second sealant portion 122-2. In addition, when one of the sealant 120 is coated in the sealant coating process, the first sealant portion 122-1 of the embodiment may be a first coated portion of the sealant 120, and the second sealant portion 122-2 may be a last coated portion of the sealant 120. In detail, the first glue portion 122-1 may have a first end 122-1e aligned with the edge of the substrate area 112, and the second glue portion 122-2 may have a second end 122-2e aligned with the edge of the substrate area 112, so that when one of the glue portions 120 is coated, the coating head enters the substrate area 112 from the first end 122-1e, and simultaneously discharges the glue to coat the first glue portion 122-1, then sequentially coats the third glue portion 122-3, the fourth glue portion 122-4 and the second glue portion 122-2, and finally leaves the substrate area 112 from the second end 122-2e of the second glue portion 122-2, but not limited thereto. In addition, in the embodiment, the first end 122-1e of the first plastic portion 122-1 and the second end 122-2e of the second plastic portion 122-2 may be located outside the sealing pattern CP, that is, the first end 122-1e and the second end 122-2e are not the frame plastic overlapping point 122p, but not limited thereto. In addition, in the embodiment, since the frame adhesives 120 are adjacent to each other in the first direction D1, in order to avoid adhesion of the adjacent frame adhesives 120 to each other in the sealant portions extending along the second direction D2 (for example, the third sealant portion 122-3 of the first frame adhesive 120a and the fourth sealant portion 122-4 of the second frame adhesive 120 b), an appropriate distance is required between the two adjacent sealant portions extending along the second direction D2, and the distance can be fine-tuned according to the precision of the cutting tool.
Regarding the glue start point 120s and the glue end point 120r, the positions of the glue start point 120s and the glue end point 120r are not located in the closed pattern CP of the frame glue 120, in this embodiment, the glue start point 120s and the glue end point 120r may be located in the outer region 114, and the glue start point 120s and the glue end point 120r may not coincide with each other, but not limited thereto. In another embodiment, one of the glue start point 120s and the glue end point 120r may be located in the outer region 114, and the other may be located in the substrate region 112 but not in the seal pattern CP of the sealant 120. In another embodiment, the glue start point 120s and the glue end point 120r may be located within the outer region 114, and may have an overlap region. In another embodiment, the glue start point 120s and the glue end point 120r may be located in the substrate region 112 but not in the seal pattern CP of the sealant 120, and the glue start point 120s and the glue end point 120r are not coincident with each other. It should be noted that, in order to clearly show the positions of the glue starting point 120s and the glue ending point 120r, the widths of the glue starting point 120s and the glue ending point 120r shown in fig. 2 are larger, but in actual glue application, the widths of the glue starting point 120s and the glue ending point 120r may be larger than, equal to, or smaller than the widths of the glue bodies at other positions, and the invention is not limited thereto.
After step S4, the sealant coating method of the electronic device of the present embodiment can optionally perform step S5, dispose the second substrate 130 on the first substrate 110 and the sealant 120, and adhere the second substrate 130 to the first substrate 110 through the sealant 120. The second substrate 130 may have a conductive layer, an alignment layer, an insulating layer, a light-shielding layer, a color filter layer and/or other suitable structures, which is not limited in the disclosure. In the embodiment, the size of the second substrate 130 may be smaller than the size of the first substrate 110, but not limited thereto, and in another embodiment, the size of the second substrate 130 may be equal to the size of the first substrate 110. It should be noted that the second substrate 130 in fig. 2 to fig. 4 does not show the included internal structure, so as to make the drawings clearer. After step S5, step S6 may be optionally performed in the sealant coating method of the electronic device of the present embodiment, in which the first substrate 110 and the second substrate 130 are cut according to the edge of the substrate region 112 to form a plurality of electronic devices ED, and the formed electronic devices ED may be as shown in fig. 3 and 4, where the electronic devices ED shown in fig. 3 and 4 correspond to the leftmost substrate region 112 of fig. 2 and have the first sealant 120a. Therefore, as shown in fig. 3 and 4, the electronic device ED formed by the method includes the cut first substrate 110, the cut second substrate 130, and the sealant 120, where the first substrate 110 has a first region 112a and a second region 112b surrounding the first region 112a, the first substrate 110 has an electronic element 110a, a conductive layer, an insulating layer, and/or other suitable structures, the second substrate 130 is disposed opposite to the first substrate 110 and exposes a portion of the second region 112b of the first substrate 110, the sealant 120 is disposed between the first substrate 110 and the second substrate 130 and located in the second region 112b to surround the first region 112a, and the sealant 120 is used to adhere the first substrate 110 and the second substrate 130. The details of the first substrate 110, the second substrate 130 and the sealant 120 can refer to the above description, and are not repeated herein. In addition, in fig. 3 and 4, since the first end 122-1e of the first colloid part 122-1 and the second end 122-2e of the second colloid part 122-2 are aligned with one edge of the substrate region 112, respectively, the first end 122-1e and the second end 122-2e are aligned with the edge of the first substrate 110 after cutting. It should be noted that, since the sealant overlapping point 122p of the sealant 120 may have more sealant than other positions, after the second substrate 130 is disposed, the width of the sealant overlapping point 122p may be larger than the width of other positions of the sealant 120, that is, since each sealant 120 has only one sealant overlapping point 122p, after the cutting process, the sealant 120 of each electronic device ED cut out only has one position with a larger width, but the invention is not limited thereto.
In addition, after the second substrate 130 is disposed, a display medium layer 140, such as a liquid crystal layer, an electrophoretic layer, or other electroluminescent material, may be selectively formed between the first substrate 110 and the second substrate 130, which is not limited in the disclosure. The display medium layer 140 is surrounded by the seal pattern CP of the sealant 120. In the present embodiment, the display dielectric layer 140 may be formed after the cutting process is completed, but not limited thereto. If the electronic device ED is of another type, the display medium layer 140 may not be disposed, or the display medium layer 140 may be formed before the second substrate 130 is disposed.
In the embodiment, since the sealant coating process can be performed continuously from the starting point 120s to the ending point 120r to complete the sealant 120 in one step, i.e., the coating head coats the sealant 120 on the substrate between two height adjustments, the coating time can be saved. In addition, in the conventional glue spreading technology, the glue spreading start point and the glue spreading end point are overlapped on the seal pattern of the frame glue, however, the glue body of the overlapped point formed by the glue spreading start point and the glue spreading end point is too much, so that the overlapped point has a larger width or has an overflow phenomenon at the overlapped point, thereby affecting the display effect and causing chromatic aberration, and further affecting the reliability of the electronic device and even affecting the experience of a user. In contrast, due to the position design of the glue starting point 120s and the glue ending point 120r of the embodiment (for example, the glue starting point 120s and the glue ending point 120r do not coincide with each other, or the glue starting point 120s and/or the glue ending point 120r are located in the outer region 114), the color difference caused by the coincident point of the glue starting point 120s and the glue ending point 120r can be avoided, or the situation that the sealant 120 has a gap and cannot form the closed pattern CP can be avoided, so as to improve the reliability of the electronic device ED. In addition, in the embodiment, the adhesive connecting portions 124 and 126 disposed on the outer region 114 can adhere the outer region 114 of the first substrate 110 to a supporting body before the cutting process is performed, so that the outer region 114 of the first substrate 110 does not fall off during the cutting process, thereby preventing the falling portion from affecting the cutting process or damaging the electronic device ED.
In addition, the frame glue coating method of the electronic device of the present invention may further include other steps, and the steps may be performed before or after any of the above steps, or may be performed between any two of the above steps. In addition, the steps of the frame glue coating method of the electronic device can be adjusted or changed without departing from the spirit and principles of the present invention.
The electronic device and the sealant coating method thereof of the present invention are not limited to the above embodiments. The following description will continue to disclose other embodiments and variations of the present invention, but in order to simplify the description and to highlight the differences between the embodiments and variations, the same reference numerals are used to identify the same elements, and repeated descriptions are omitted.
Referring to fig. 5 to 8, fig. 5 to 8 are schematic top views of the sealant coating processes of the electronic devices according to the second to fifth embodiments of the present invention, wherein the first substrate 110 and the second substrate 130 in fig. 5 to 8 do not show the internal structures, but only show the substrate region 112, the first region 112a and the second region 112b, so as to make the drawings clearer. As shown in fig. 5, the difference between the present embodiment (second embodiment) and the first embodiment is that the glue coating path in the sealant coating process is different, as shown by the arrow in fig. 5. In the embodiment, the first sealant 120a can be directly connected to the second sealant 120b, the second sealant 120b can be connected to the third sealant 120c through the sealant connecting portion 124, and the third sealant 120c can be directly connected to the fourth sealant 120d, but not limited thereto. In fig. 5, an extending direction (the second direction D2) of the first sealant portion 122-1 of the first sealant 120a is different from an extending direction (the first direction D1) of the first sealant portion 122-1 of the second sealant 120b, an extending direction (the first direction D1) of the second sealant portion 122-2 of the first sealant 120a is different from an extending direction (the second direction D2) of the second sealant portion 122-2 of the second sealant 120b, and the first sealant portion 122-1 of the first sealant 120a and the second sealant portion 122-2 of the second sealant 120b are adjacent to each other in the first direction D1 and have a suitable distance therebetween, which is not limited thereto.
As shown in fig. 6, the difference between the present embodiment (the third embodiment) and the first embodiment is that the substrate region 112 and the first region 112a of the present embodiment have different shapes, for example, the substrate region 112 may be rectangular, the first region 112a may be in a shape with a notch, and the sealing pattern CP of the sealant 120 may be in a shape with a notch, but not limited thereto. In an alternative embodiment, the substrate region 112 may be rectangular, and the first region 112a may have a notched shape, but the type of the closed pattern CP of the sealant 120 is different from that of the substrate region 112 and the first region 112a.
As shown in fig. 7, a difference between the present embodiment (fourth embodiment) and the first embodiment is that the substrate region 112 and the first region 112a of the present embodiment can be circular or elliptical, so that the sealing pattern CP of the sealant 120 can be circular or elliptical, and the formed electronic device ED can be circular or elliptical. In fig. 7, the first and second plastic portions 122-1 and 122-2 may respectively include circular arc portions 122-1b and 122-2b and straight portions 122-1a and 122-2a, the circular arc portions 122-1b and 122-2b are partial circular arcs of the closed pattern CP, and the straight portions 122-1a and 122-2a are tangent to the closed pattern CP, that is, a sealant overlapping point 122p formed by crossing the first and second plastic portions 122-1 and 122-2 is located at a boundary between the circular arc portion 122-1b and the straight portion 122-1a of the first plastic portion 122-1 and at a boundary between the circular arc portion 122-2b and the straight portion 122-2a of the second plastic portion 122-2, and the straight portion 122-1a of the first plastic portion 122-1 and the straight portion 122-2a of the second plastic portion 122-2 are tangent to the closed pattern CP at the sealant overlapping point 122 p. It should be noted that although the straight line portion 122-1a of the first plastic portion 122-1 and the straight line portion 122-2a of the second plastic portion 122-2 are parallel to each other, since the arc portion 122-1b of the first plastic portion 122-1 and the arc portion 122-2b of the second plastic portion 122-2 have different extending directions, the extending direction of the whole first plastic portion 122-1 is different from the extending direction of the whole second plastic portion 122-2, and both extending directions are different from the first direction D1 and the second direction D2. In addition, since the extending direction of the whole first plastic part 122-1 is not perpendicular to the extending direction of the whole second plastic part 122-2 in the embodiment, the first plastic part 122-1 and the second plastic part 122-2 form a non-perpendicular < type at the sealant overlapping point 122 p. In addition, the two adjacent sealant 120 are connected to each other through the sealant connecting portions 124 and 126, for example, the sealant connecting portion 124 is connected between the first sealant 120a and the second sealant 120b, and the sealant connecting portion 126 is connected between the second sealant 120b and the third sealant 120c, but in this embodiment, the sealant connecting portions 124 and 126 are straight lines extending along the first direction D1, but not limited thereto. In addition, in the embodiment, after the cutting process is completed, the size of the first substrate 110 after cutting is the same as that of the second substrate 130 after cutting, but not limited thereto.
As shown in fig. 8, the difference between the present embodiment (fifth embodiment) and the first embodiment is that the substrate region 112 of the present embodiment can be a combination of a semicircle and a rectangle (a shape with a curved edge), the first region 112a can be a semicircle or a half ellipse (a shape with a curved edge), and thus, the closed pattern CP of the sealant 120 can be a semicircle or a half ellipse (a combination of a curve and a straight line), and the shape of the formed electronic device ED can be a combination of a semicircle and a rectangle. In fig. 8, the overlapping point 122p of the sealant and the first and second sealant portions 122-1 and 122-2 is substantially the same as that of the fourth embodiment shown in fig. 7, so the description thereof can refer to the description of the fourth embodiment and will not be repeated herein. In addition, the two adjacent sealant 120 are connected to each other through the sealant connecting portions 124 and 126, for example, the sealant connecting portion 124 is connected between the first sealant 120a and the second sealant 120b, and the sealant connecting portion 126 is connected between the second sealant 120b and the third sealant 120c, but in this embodiment, the sealant connecting portions 124 and 126 are straight lines extending along the first direction D1, but not limited thereto. In addition, in the embodiment, after the cutting process is completed, the shape of the cut first substrate 110 is a combination of a semicircle (or a semi-ellipse) and a rectangle, and the shape of the cut second substrate 130 may be a semicircle or a semi-ellipse, and a portion of the second region 112b of the first substrate 110 is exposed, but not limited thereto.
In summary, in the frame sealant coating method of the electronic device of the present invention, since the frame sealant coating process can be performed by continuously coating the sealant from the starting point to the ending point of the sealant coating process to complete a plurality of frame sealants at a time, that is, the coating head coats a plurality of frame sealants on the substrate between two height adjustments, the coating time can be saved. In addition, due to the position design of the gluing starting point and the gluing end point, the color difference caused by the coincident point of the gluing starting point and the gluing end point can be avoided, or the situation that the frame glue has a gap is avoided, so that the reliability of the electronic device is improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A frame glue coating method of an electronic device is characterized by comprising the following steps:
providing a first substrate, wherein the first substrate is provided with a plurality of substrate areas and at least one outer area, the outer area is positioned outside the substrate areas, and the substrate areas respectively comprise a first area and a second area surrounding the first area;
lowering a coating head to a frame glue coating height;
performing a frame glue coating process on the first substrate, wherein the coating head continuously coats a glue body from a glue coating starting point to a glue coating end point to form at least three frame glues, and each frame glue is formed in the second area of one of the plurality of substrate areas and surrounds the first area; and
raising the coating head to a safe height;
each frame sealant comprises a first sealant part and a second sealant part, the extending direction of the first sealant part in the same frame sealant is different from that of the second sealant part, only one frame sealant overlapping point is arranged in each frame sealant, and each frame sealant overlapping point is formed by the intersection of the first sealant part and the second sealant part;
in the sealant coating process, the sealant overlapping points are crossed by the sealant only once, and the sealant overlapping points are crossed by the sealant only once.
2. The frame glue coating method of an electronic device according to claim 1, wherein at least one glue connecting portion is further formed in the outer region during the step of continuously coating the glue in the frame glue coating process, and the glue connecting portion connects two of the frame glues.
3. The method of claim 2, wherein the sealant comprises a first sealant, a second sealant and a third sealant surrounding the first region of the substrate, the second sealant is located between the first sealant and the third sealant, and the first sealant is connected to the second sealant through the sealant connecting portion.
4. The method of claim 1, wherein the sealant comprises a first sealant and a second sealant adjacent to each other, and the first sealant and the second sealant surround different first regions, and the sealant is coated after the first sealant is coated during the continuous coating of the sealant.
5. The frame glue coating method of the electronic device according to claim 1, further comprising:
arranging a second substrate on the first substrate and the frame glue, and adhering the second substrate to the first substrate through the frame glue; and
and carrying out a cutting process on the first substrate and the second substrate, and cutting along the edge of the substrate area to form a plurality of electronic devices.
6. The frame glue coating method of the electronic device according to claim 1, wherein the glue starting point and the glue ending point are located in the outer region.
7. The frame glue coating method of the electronic device according to claim 1, wherein the first region has a shape of a circle, an ellipse, a polygon, a shape with a notch, or a shape with a curved edge.
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| CN201811530226.7A CN111323942B (en) | 2018-12-14 | 2018-12-14 | Electronic device and frame glue coating method thereof |
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| CN201811530226.7A CN111323942B (en) | 2018-12-14 | 2018-12-14 | Electronic device and frame glue coating method thereof |
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| KR20080070356A (en) * | 2007-01-26 | 2008-07-30 | 삼성전자주식회사 | Liquid crystal panel and liquid crystal display having the same |
| CN102169257A (en) * | 2010-02-25 | 2011-08-31 | 上海天马微电子有限公司 | Method for coating frame glues |
| CN104007582A (en) * | 2014-04-29 | 2014-08-27 | 京东方科技集团股份有限公司 | Method for coating frame adhesive and substrate mother board |
| CN106653623A (en) * | 2016-12-29 | 2017-05-10 | 长春海谱润斯科技有限公司 | Display panel and package adhesive coating method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI504978B (en) * | 2013-12-05 | 2015-10-21 | Innolux Corp | Liquid crystal display panel and preparation method thereof |
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|---|---|---|---|---|
| KR20080070356A (en) * | 2007-01-26 | 2008-07-30 | 삼성전자주식회사 | Liquid crystal panel and liquid crystal display having the same |
| CN102169257A (en) * | 2010-02-25 | 2011-08-31 | 上海天马微电子有限公司 | Method for coating frame glues |
| CN104007582A (en) * | 2014-04-29 | 2014-08-27 | 京东方科技集团股份有限公司 | Method for coating frame adhesive and substrate mother board |
| CN106653623A (en) * | 2016-12-29 | 2017-05-10 | 长春海谱润斯科技有限公司 | Display panel and package adhesive coating method |
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