CN111319256B - Method for directly manufacturing organic polymer PTC thermosensitive device through 3D printing - Google Patents

Method for directly manufacturing organic polymer PTC thermosensitive device through 3D printing Download PDF

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CN111319256B
CN111319256B CN202010265938.1A CN202010265938A CN111319256B CN 111319256 B CN111319256 B CN 111319256B CN 202010265938 A CN202010265938 A CN 202010265938A CN 111319256 B CN111319256 B CN 111319256B
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ptc
printing
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polymer
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CN111319256A (en
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刘通
诸葛祥群
罗鲲
赵亮
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Changzhou University
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Changzhou University
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/118Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205Means for applying layers
    • B29C64/209Heads; Nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/307Handling of material to be used in additive manufacturing
    • B29C64/314Preparation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/307Handling of material to be used in additive manufacturing
    • B29C64/321Feeding
    • B29C64/336Feeding of two or more materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • B29C64/393Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/21Temperature-sensitive devices

Abstract

A method for directly manufacturing an organic polymer PTC thermosensitive device through 3D printing belongs to the field of thermosensitive composite material manufacturing. The method comprises the steps of firstly weighing powder of a conductive filler and a polymer matrix material in a certain ratio, and preparing raw material powder after drying and blending; then preparing FDM type 3D printing organic PTC consumable materials by using an extruder for melt blending; designing an organic PTC structure and performing 3D printing; finally, the organic PTC device is manufactured. The method has the advantages of simple preparation process, low production cost, convenient popularization and application, and stable performance of the prepared organic PTC.

Description

Method for directly manufacturing organic polymer PTC thermosensitive device through 3D printing
Technical Field
The invention belongs to the field of manufacturing of thermosensitive composite materials, and particularly relates to a technology for directly manufacturing an organic polymer PTC thermosensitive device by using 3D printing. A PTC thermosensitive device is a device in which the resistance changes sharply when a certain temperature range is reached.
Background
The additive manufacturing technology is based on a three-dimensional digital model, and a three-dimensional physical entity completely consistent with the digital model is directly manufactured in a layer-by-layer manufacturing mode by adding materials, and is called as three-dimensional printing or 3D printing. Compared with the traditional material processing method, the 3D printing can greatly reduce the processing procedures, shorten the processing period, increase the material utilization rate and reduce the production cost, can manufacture free-form surface blades, complex inner flow channels and the like which are difficult to process by the traditional method, can quickly and accurately convert the design into a product prototype or directly manufacture parts, and is widely applied to the fields of electronic products, automobiles, aerospace, medical treatment, military industry, geographic information, artistic design and the like.
A PTC thermistor is a semiconductor resistor typically having temperature sensitivity, and its resistance value increases stepwise with an increase in temperature (curie temperature) beyond a certain temperature. The lithium ion battery is mainly used for mobile phones, notebook computers, lithium ion batteries, portable video recorders, charging and discharging wires and the like. An organic PTC material is a conductive polymer composite material with PTC thermosensitive property, in which conductive fillers (such as carbon black, graphite, multi-walled carbon nanotubes, etc.) are uniformly dispersed in a single or multi-phase polymer to obtain a polymer composite material with a conductive function, and related matrix polymers are mainly crystalline polymer composite materials, such as Polyethylene (PE), Polypropylene (PP), nylon (Polyamide, PA-6, PA-66, PA-46, PA-11, PA-12), Polyethylene terephthalate (PET), poly (Ether Ketone) (PEEK), etc., wherein PE is the most common.
With the rapid development of the electronic industry, the kinds of PTC devices become very various, and even if organic PTC devices for the same purpose are used, different sizes are required due to the change of manufacturers or product models, and particularly, recently, the organic PTC devices become increasingly miniaturized, and the structure thereof becomes complicated and diversified. The traditional organic PTC manufacturing method needs to design a processing die according to different products and then put into mass production. The problems exist that the processing cost of the die is expensive, the processing period is long, and the die is not used after the batch of products are processed, so that unnecessary waste is caused. At present, an organic PTC batch production method with strong adaptability and low cost is lacked.
Disclosure of Invention
The invention provides a method for directly manufacturing organic PTC devices in batches by Fused Deposition (FDM)3D printing aiming at the processing diversity requirements of the organic PTC devices, the size of the PTC devices can be adjusted at any time according to the processing requirements, the method has the capability of processing the organic PTC devices with complex shapes, no processing die is needed in the process, the processing cost is low, and the market adaptability is strong.
The technical scheme of the invention is as follows:
A3D printing method for directly manufacturing an organic polymer PTC thermosensitive device is shown in figure 1, and the specific scheme is as follows:
(1) and (3) preparation of raw materials. Weighing powder of a conductive filler and a polymer matrix material in a certain ratio, placing the powder in a drying oven, and drying the powder for 24 hours at the temperature of 60-100 ℃ to remove moisture; and putting the powder into a high-speed mixer for premixing, and blending for 3-10 min to obtain raw material powder.
The polymer matrix material used may be: crystalline polymer composites, such as Polyethylene (PE), Polypropylene (PP), nylon (Polyamide, PA-6, PA-66, PA-46, PA-11, PA-12), Polyethylene terephthalate (PET), Polyetheretherketone (PEEK), or a mixture of several polymers.
The conductive filler can be carbon materials such as carbon nano tubes, graphite, graphene, expanded graphite, carbon black, microcrystalline graphite and the like or mixed fillers of a plurality of fillers in any proportion. The filling amount of the conductive filler is 5-60%.
(2) And preparing the 3D printing material. Adding the raw material powder obtained in the step (1) into a single-screw (or double-screw) extruder, carrying out melt blending to prepare the FDM type 3D printing organic PTC consumable material, and setting the temperature: 160-230 ℃, screw rotation speed: 1-60 r/min, cooling water temperature: 20-60 ℃, traction speed: 10-200 cm/min, wire drawing speed: 10-200 cm/min to obtain a conductive 3D printing wire with the diameter of 1.75mm or 3.0 mm;
by the same method, the polymer matrix material is also made into common 3D printing wires with the diameter of 1.75mm or 3.0mm for later use.
(3) And (4) designing an organic PTC structure. And designing the structure of the PTC by using three-dimensional drawing software according to the use requirement, wherein the structure comprises the PTC and the peripheral insulating protective layer, and repeatedly arranging to form a full-page PTC processing diagram. And exporting the slice file to a 3D printer after the parameters are set.
(4) 3D printing of organic PTC. And (3) filling the common 3D printing consumable material prepared in the step (2) into a No. 1 spray head of an FDM type printer, and allowing a high polymer material of a different substrate from the conductive 3D printing material to be used as an insulating protection layer of the PTC. And (3) filling the conductive 3D printing wire into a No. 2 nozzle of a printer, adjusting parameters of the 3D printer, and then starting to manufacture the full-page organic PTC, wherein the printing temperature is set to be 180-250 ℃.
(5) Organic PTC device fabrication. And (3) placing the printed full-page organic PTC between two layers of copper foils, and carrying out hot-pressing treatment, wherein the pressure is set to be 0.1-5.0 MPa, and the temperature is set to be 80-150 ℃. And cutting the whole organic PTC after hot pressing to obtain a batch of organic PTC devices.
(6) By repeating the steps (4) and (5), continuous production of the organic PTC device can be realized.
The method has the advantages of simple preparation process, low production cost, convenient popularization and application, and stable performance of the prepared organic PTC.
The invention has the beneficial effects that:
(1) the method directly manufactures the PTC structural element by using a 3D printing technology, can replace a die stamping process in the traditional processing, reduces the production cost of enterprises, and improves the material utilization rate;
(2) the method can flexibly adjust the structure and the size of the organic PTC device according to the use requirement, and realize differential production;
(3) the method can prepare the organic PTC device with stable performance, synchronously complete PTC insulation packaging, reduce processing procedures and play a role in protection.
Drawings
Fig. 13D prints a process flow diagram for the continuous manufacture of organic PTC devices;
fig. 2 is a schematic diagram of an organic PTC full-page 3D printing structure, in which: 1 represents a No. 1 nozzle printing insulation consumable, and 2 represents a corresponding No. 2 nozzle printing conductive consumable;
FIG. 3 is a schematic view of a manufacturing method of an organic PTC device, in which a 3D printed full-page PTC sample is arranged in the middle, an upper conductive copper foil and a lower conductive copper foil are 0.05mm thick, and a yellow arrow indicates a hot-pressing direction;
fig. 43D prints PTC device resistivity-temperature relationship test results (conductive consumable composition: 5 wt.% carbon nanotubes, 20 wt.% graphite, 75 wt.% high density polyethylene).
Detailed Description
(1) Preparation of raw materials: weighing 5g of carbon nano tube, 20g of graphite powder and 75g of high-density polyethylene (HDPE) powder, and drying in an oven at 80 ℃ for 24h to remove water; putting the powder into a high-speed mixer for mixing for 5min to obtain an original blending raw material;
wherein the HDPE powder (600 mesh) is from Shenzhen Baosheng polymer materials Limited, and industrial-grade multi-wall carbon nanotubes (MWNTs, TF-25001, inner diameter of 3-5nm, outer diameter of 5-15nm, length of 3-12 μm, and specific surface area > 233m2(g, purity > 95 wt%) from Tulingevolutionary science and technology, and microcrystalline graphite (400 mesh, crystal size of 0.1mm or less) from Huabang mineral products, Inc., Shijiazhuang, Hebei province.
(2) Preparation of 3D printing consumables: drawing the raw materials obtained in the step (1) in a single-screw extruder, setting the temperature of a second zone to be 180 ℃, the temperature of a third zone to be 190 ℃, adjusting the temperature of cooling water to be 60 ℃, adding the mixed raw materials into a charging hopper when the temperature reaches the set temperature, adjusting the extrusion speed to be 15r/min, the traction speed to be 300r/min and the drawing speed to be 5r/min, measuring the diameter of the extruded wires by using a vernier caliper, and finely adjusting the traction speed to keep the diameter of the conductive 3D printing consumable to be 1.75 mm; the resistivity of the consumable measured by a four-electrode method at normal temperature is 0.03 omega.m;
by adopting the same method, a common 1.75mm insulated 3D printing wire can be manufactured, in the embodiment, a PET consumable material is used as an insulated protective layer material, an insulated part in a PTC structure is printed, and the PET consumable material is purchased from Tan warships with Taobao network and Teddy.
(3) Organic PTC structural design: a model can be drawn by adopting three-dimensional digital modeling software, and the sizes of the PTC and the peripheral insulating part are designed according to actual requirements. In the embodiment, the PTC outer layer is provided with an insulating protective layer of 1mm, the size of an organic PTC sample is 3 multiplied by 6mm, the whole thickness is 0.5mm, each row of the whole plate is 8, 15 rows are totally formed, 120 samples are formed in one whole plate, the samples are sliced by adopting Cura14.07 software, and the whole plate structure is shown in figure 2.
(4) 3D printing of organic PTC: leading-in 3D printer finished piece model, insulating PET consumptive material is printed to No. 1 shower nozzle, and electrically conductive consumptive material is printed to No. 2 shower nozzle, and the layer height of setting and printing is 0.2mm, and printing temperature is 230 ℃, and the bottom plate temperature is 80 ℃, and printing speed is 10mm/s, and the filling rate is 100%, prints out the full version PTC sample of organic PTC and the regular interval of protective layer.
(5) Production of organic PTC material: and (3) taking out the printed sample in the step (4), placing the sample between two copper foils, preserving the heat for 5min at 120 ℃ under the pressure of 1MPa by using a flat vulcanizing machine, and performing compression molding, wherein the structure of the sample is shown in figure 3. And (4) cutting by adopting a special machine to obtain a batch of PTC devices.
(6) By repeating the steps (4) and (5), continuous production of the organic PTC device can be realized.
(7) And (3) detecting the performance of the organic PTC: randomly extracting a manufactured 3D printed PTC sample, respectively welding wires on copper sheets at two sides, connecting the copper sheets to the positive electrode and the negative electrode of a universal meter, placing the universal meter in a heating oven, and measuring the change relation of resistance along with temperature. The experimentally measured resistivity curves with temperature are shown in fig. 4. The 3D printed PTC device has a normal temperature resistivity of 0.03 omega.m, starts to rapidly rise at 135 ℃, has a resistivity of 13.22 omega.m at 140 ℃ which is 440 times of the normal temperature resistivity, and shows good PTC performance.

Claims (6)

1. A method for directly manufacturing an organic polymer PTC thermosensitive device through 3D printing is characterized by comprising the following steps:
(1) preparation of raw materials: weighing powder of the conductive filler and the polymer matrix material in a certain ratio, placing the powder in a drying oven, removing water, and blending to obtain raw material powder; the polymer matrix material is a crystalline polymer composite material; the filling amount of the conductive filler is 5-60%;
(2) preparation of the 3D printing material: adding the raw material powder obtained in the step (1) into a single-screw or double-screw extruder, carrying out melt blending to prepare the FDM type 3D printing organic PTC consumable material, and setting the temperature: 160-230 ℃, screw rotation speed: 1-60 r/min, cooling water temperature: 20-60 ℃, traction speed: 10-200 cm/min, wire drawing speed: 10-200 cm/min to obtain a conductive 3D printing wire with the diameter of 1.75mm or 3.0 mm;
adopting the same method to prepare the polymer matrix material into common 3D printing silk with the diameter of 1.75mm or 3.0mm for later use;
(3) organic PTC structural design: designing a PTC structure according to the use requirement, wherein the PTC structure comprises a PTC and a peripheral insulating protective layer, and repeatedly arranging to form a whole PTC processing diagram; exporting the slice file to a 3D printer after setting parameters;
(4) 3D printing of organic PTC: filling the common 3D printing consumable material prepared in the step (2) into a No. 1 spray head of an FDM type printer, and allowing a high polymer material of a substrate different from the conductive 3D printing material to be used as an insulation protective layer of PTC; the method comprises the following steps of (1) loading a conductive 3D printing wire into a No. 2 nozzle of a printer, adjusting parameters of the 3D printer, and then starting to manufacture the full-page organic PTC, wherein the printing temperature is set to be 180-250 ℃;
(5) organic PTC device fabrication: placing the printed full-page organic PTC between two layers of copper foils, and carrying out hot pressing treatment, wherein the pressure is set to be 0.1-5.0 MPa, and the temperature is set to be 80-150 ℃; cutting the whole organic PTC after hot pressing to obtain a batch of organic PTC devices;
(6) by repeating the steps (4) and (5), continuous production of the organic PTC device can be realized.
2. The method for directly manufacturing an organic polymer PTC thermosensitive device according to claim 1, wherein the conductive filler powder is mixed in an amount of 5-60% and the polymer matrix material is mixed in an amount of 40-95%.
3. The method for directly manufacturing the organic polymer PTC thermosensitive device through 3D printing according to claim 1, wherein in the step (1), the powder is placed in a drying oven and dried for 24 hours at 60-100 ℃.
4. The method for directly manufacturing the organic polymer PTC thermosensitive device through 3D printing according to claim 1, wherein in the blending in the step (1), the powder is placed into a high-speed mixer for pre-mixing, and the blending is performed for 3-10 min.
5. The method for directly manufacturing an organic polymer PTC thermosensitive device according to claim 1, wherein the polymer matrix material is one or a mixture of two or more of polyethylene, polypropylene, nylon, polyethylene terephthalate and poly-ether-ketone.
6. The method for directly manufacturing an organic polymer PTC thermosensitive device according to claim 1, wherein the conductive filler is one or a mixture of more than two of carbon nanotube, graphite, graphene, expanded graphite, carbon black and microcrystalline graphite.
CN202010265938.1A 2020-04-07 2020-04-07 Method for directly manufacturing organic polymer PTC thermosensitive device through 3D printing Active CN111319256B (en)

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CN101560325B (en) * 2009-05-26 2012-03-28 上海科特高分子材料有限公司 High-temperature resistant PTC electroconductive composition, high-temperature resistant PTC device containing composition and manufacturing method thereof
US10129976B2 (en) * 2015-04-21 2018-11-13 Northrop Grumman Systems Corporation High performance, ultra low loss, ultra lightweight, multi-layered rigid circuit boards
WO2017207514A1 (en) * 2016-06-02 2017-12-07 Philips Lighting Holding B.V. Filaments for fused deposition modeling including an electronic component
CN106380805A (en) * 2016-09-26 2017-02-08 桂林理工大学 Preparation method of PBS/PLA (Poly Butylenes Succinate/Poly Lactic Acid) conductive 3D (three-dimensional) printing supplies
CN110171129A (en) * 2019-05-30 2019-08-27 上海应用技术大学 A kind of preparation method of layered polymer base composite thermoelectric material
CN110322988B (en) * 2019-06-24 2020-11-03 义乌市中科院兰州化物所功能材料中心 High-temperature-resistant enameled wire prepared through 3D printing and preparation method
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