CN111315190B

CN111315190B - Electronic device

Info

Publication number: CN111315190B
Application number: CN202010128037.8A
Authority: CN
Inventors: 李奎
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-02-28
Filing date: 2020-02-28
Publication date: 2022-02-01
Anticipated expiration: 2040-02-28
Also published as: CN111315190A

Abstract

The invention discloses electronic equipment which comprises a shell and a heat dissipation assembly, wherein the heat dissipation assembly comprises an accommodating part and a heat absorption part, the accommodating part is connected with the shell, the accommodating part is provided with an accommodating cavity, the heat absorption part is arranged in the accommodating cavity, and the heat absorption part comprises a solid-liquid phase change material. The technical scheme can solve the problem that heat generated by the operation of the conventional electronic equipment is accumulated in the electronic equipment and is easy to generate adverse effect on the performance of the electronic equipment.

Description

Electronic device

Technical Field

The invention relates to the technical field of communication equipment, in particular to electronic equipment.

Background

With the progress of the technology, the functions of mobile electronic equipment such as a mobile phone or a tablet personal computer are gradually improved, and the performance is gradually improved. Generally, the electronic device generates a certain amount of heat during processing or data transmission, and the heat accumulated in the electronic device may adversely affect the operation performance of the electronic device.

Disclosure of Invention

The invention discloses electronic equipment, which aims to solve the problem that heat generated by the operation of the conventional electronic equipment is accumulated in the electronic equipment and is easy to generate adverse effect on the performance of the electronic equipment.

In order to solve the problems, the invention adopts the following technical scheme:

an electronic device comprises a shell and a heat dissipation assembly, wherein the heat dissipation assembly comprises an accommodating portion and a heat absorption portion, the accommodating portion is connected with the shell, the accommodating portion is provided with an accommodating cavity, the heat absorption portion is arranged in the accommodating cavity, and the heat absorption portion comprises a solid-liquid phase change material.

The technical scheme adopted by the invention can achieve the following beneficial effects:

in the electronic equipment disclosed by the invention, the accommodating part of the heat dissipation assembly is connected with the shell, and the accommodating cavity of the accommodating part is internally provided with the heat absorption part which comprises the solid-liquid phase change material. The electronic equipment can generate certain heat during working, and the solid-liquid phase change material in the heat absorption part can absorb certain heat in the process of converting from a solid state to a liquid state, so that the aim of reducing the temperature in the electronic equipment is fulfilled, and the heat is prevented from accumulating in the electronic equipment to generate adverse effects on the working performance of the electronic equipment. In addition, in the working process of the electronic equipment, the liquid solid-liquid phase-change material can also transmit the heat of the liquid solid-liquid phase-change material to the outside of the electronic equipment, when the heat exceeds a critical value, the solid-liquid phase-change material is converted back to a solid state, and in the subsequent working process of the electronic equipment, the solid-liquid phase-change material can still absorb the heat generated by the electronic equipment, so that the circulation is carried out, the internal temperature of the electronic equipment can be always kept at a lower level, and the heat dissipation efficiency of the electronic equipment is improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic diagram of a partial structure of an electronic device according to an embodiment of the disclosure;

FIG. 2 is an enlarged view of a portion of the disclosed electronic device;

fig. 3 is a schematic view of a partial structure of an electronic device according to an embodiment of the disclosure in another direction;

FIG. 4 is an enlarged view of a portion of the structure shown in FIG. 3;

fig. 5 is a schematic structural diagram of a sealing body in an electronic device according to an embodiment of the disclosure.

Description of reference numerals:

100-shell body,

200-a heat dissipation assembly, 210-a containing body, 220-sealant, 230-a packaging cover body, 240-a heat absorption part, 250-a first gas spacing section, 260-a second gas spacing section and 270-a spring sheet.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

As shown in fig. 1 to 5, an embodiment of the invention discloses an electronic device, which includes a housing 100 and a heat dissipation assembly 200.

The heat dissipation assembly 200 includes an accommodating portion and a heat absorption portion 240, the accommodating portion is connected to the housing 100, the accommodating portion has an accommodating cavity, the heat absorption portion 240 is disposed in the accommodating cavity, and the heat absorption portion 240 includes a solid-liquid phase change material.

Specifically, the housing 100 may be formed of metal or plastic. The accommodating portion may be fixed to an outer surface of the housing 100 by bonding or clamping, the accommodating portion may be made of a material having high heat conduction efficiency, such as metal, and the shape and size of the accommodating portion may be determined according to an actual structure of the housing 100. Alternatively, the receiving portion may be provided inside the housing 100.

Alternatively, the overall structure of the receiving portion may be relatively flat to ensure that the thickness of the electronic device is relatively small. The heat absorbing part 240 includes a solid-liquid phase change material, and may specifically include at least one of a hydrated salt, a molten salt, paraffin, fatty acids, and a polyol. In the process of processing the heat dissipation assembly 200, the solid heat absorbing portion 240 may be wrapped with an accommodating portion to form the whole heat dissipation assembly; alternatively, the receiving portion may be formed by separate molding.

After the electronic device adopts the above structure, the solid-liquid phase change material in the heat absorption portion 240 absorbs heat to change from a solid state to a liquid state, so as to achieve the purpose of reducing the temperature inside the electronic device, and prevent the heat from accumulating inside the electronic device to adversely affect the working performance of the electronic device. In addition, in the working process of the electronic equipment, the liquid solid-liquid phase-change material can conduct the heat of the liquid solid-liquid phase-change material to the outside of the electronic equipment, when the critical value is reached, the solid-liquid phase-change material is converted back to the solid state, the solid-liquid phase-change material can still absorb the heat generated in the subsequent working process of the electronic equipment, and the circulation can keep the internal temperature of the electronic equipment at a lower level and improve the heat dissipation efficiency of the electronic equipment.

Alternatively, the heat absorbing part 240 may be formed of a solid-liquid phase change material, and the heat absorbing part 240 in such a structure can absorb more heat when being changed into liquid without changing the volume, thereby further improving the heat dissipation efficiency of the electronic device.

Further, the volume of the accommodating chamber may be made larger than the volume of the heat absorbing part 240; the receiving chamber has a first end and a second end, and the heat sink portion 240 may be disposed between the first end and the second end, and a first gas compartment 250 may be disposed between the first end and the heat sink portion 240 and a second gas compartment 260 may be disposed between the second end and the heat sink portion 240. If the solid-liquid phase change material used in the heat absorbing unit 240 has different volumes in the solid and liquid states, the volume of the heat absorbing unit 240 is the larger volume of the solid heat absorbing unit 240 and the liquid heat absorbing unit 240.

After the technical scheme is adopted, the liquid heat absorption part 240 can move in the accommodating cavity under the action of force. In detail, during the operation of the electronic device, a certain amount of heat may be generated by components of the electronic device, such as a battery, and after the heat is transmitted to the casing 100 and the heat dissipation assembly 200, the heat absorption portion 240 may be transformed from a solid state to a liquid state. Meanwhile, since the expansion phenomenon occurs due to the heat absorption of the gas, the temperature of the electronic device may be lowered during the heat absorption expansion of the gas in the first and

second gas compartments

250 and 260.

In addition, under the condition that the expansion amplitude of the gas in the first gas compartment 250 is different from that of the gas in the second gas compartment 260, the pressing force applied to the two ends of the heat absorbing part 240 is also different, and if the pressure of the gas in the first gas compartment 250 is greater than that of the gas in the second gas compartment 260, the liquid heat absorbing part 240 moves towards the direction close to the second end under the pushing action of the gas. Obviously, in the process that the heat absorbing part 240 moves in the accommodating cavity, a part of heat energy inside the electronic device may be converted into kinetic energy, which may further reduce the temperature of the electronic device and improve the heat dissipation efficiency of the electronic device.

Further, in the process that the liquid heat absorbing part 240 moves towards the direction close to the second end, the gas in the second gas compartment 260 is compressed, the pressure of the gas in the first gas compartment 250 gradually decreases, and when the pressure of the second gas compartment 260 increases to a certain value, the gas in the first gas compartment 250 cannot continuously push the liquid heat absorbing part 240 to move towards the direction close to the second end, and the heat absorbing part 240 stops moving.

Further, as the process of heat dissipation of the gas in the first and

second gas compartments

250 and 260 out of the electronic device proceeds, the temperature and pressure of the gas in the first and

second gas compartments

250 and 260 decrease. However, since the degree of compression of the gas in the second gas compartment 260 is greater than that of the gas in the first gas compartment 250, the liquid heat absorbing part 240 changes the moving direction and moves away from the second end under the action of the gas in the second gas compartment 260, and as the heat absorbing part 240 continues to move, the heat energy of the electronic device is further converted into kinetic energy, the temperature of the electronic device is further reduced, and the heat dissipation efficiency is further improved.

In the operation process of the electronic device, the process of converting the heat absorbing part 240 between the solid state and the liquid state and the process of reciprocating the heat absorbing part 240 in the liquid state in the accommodating cavity are continuously performed, so that the heat inside the electronic device can be rapidly dissipated to the outside of the housing 100, the heat dissipating assembly 200 and the electronic device, thereby ensuring that the temperature of the electronic device can be at a relatively low level.

Alternatively, the first and

second gas spacers

250, 260 may have different volumes during the fabrication of the heat sink assembly 200. In this case, after the electronic device generates heat during operation, the first and

second gas compartments

250 and 260 absorb different amounts of heat and thus expand differently, so that the heat absorbing part 240 can move closer to the side with smaller pressure when the two ends of the liquid heat absorbing part 240 are subjected to different pressing forces.

Alternatively, even in the case that the volumes of the first gas spacer 250 and the second gas spacer 260 are the same, the relative positions of the first gas spacer 250 and the second gas spacer 260 are different from the housing 100, so that the heat absorbed by the gases in the first gas spacer 250 and the second gas spacer 260 is approximately different during the operation of the electronic device, which may cause the gases in the first gas spacer 250 and the second gas spacer 260 to expand to different degrees, thereby driving the heat absorbing part 240 to move in the accommodating cavity.

Further, the accommodating cavity can be bent. By making the receiving chamber a bent structure, at least the amount of the heat absorbing part 240 located at the bent region of the receiving chamber can be increased. Moreover, when the volume of the accommodating cavity is larger than the volume of the heat absorbing part 240, the bent accommodating cavity can increase the moving difficulty of the liquid heat absorbing part 240 to a certain extent, so that in the process that the heat absorbing part 240 moves towards the direction close to or away from the first end, the heat absorbing part 240 can absorb more heat from the inside of the electronic device, and the heat dissipation efficiency of the electronic device can be further improved.

Meanwhile, in the process that the heat absorbing part 240 moves in the accommodating cavity, part of heat can be transferred to the housing 100 through the accommodating part, and the contact area between the accommodating part arranged in a bent manner and the housing 100 is relatively large, which can improve the efficiency of heat transfer from the heat absorbing part 240 to the housing 100.

Further, the accommodating cavity may include at least one first bending section and at least one second bending section, the first bending section and the second bending section are alternately connected, the first bending section extends along a first direction, and the second bending section extends along a second direction.

After the electronic device adopts the above structure, the shape of the accommodating portion is relatively regular, and the overall arrangement of the accommodating portion on the housing 100 is more balanced, which makes the heat dissipation efficiency of each area in the electronic device relatively balanced. In addition, under the condition that the accommodating cavity comprises a plurality of first bending sections and a plurality of second bending sections, the overall size of the accommodating cavity can be further improved, the volume of the accommodating cavity is improved, and under the action of more heat absorbing parts 240, the heat dissipation assembly 200 can absorb more heat inside the electronic device, so that the heat dissipation efficiency of the electronic device is further improved. It should be noted that, the first direction and the second direction may be an included angle selected according to actual requirements, and are not limited herein.

Optionally, first bending section and second bending section can be mutually perpendicular to further increase and hold the volume in chamber, and under the condition that first bending section and second bending section are a plurality of, first bending section and second bending section are connected in turn, and can make first bending section and second bending section be covered with whole casing 100 as far as possible, thereby make the radiating efficiency in each region on the electronic equipment all can obtain promoting to a certain extent.

In addition, under the condition that the first bending section and the second bending section are perpendicular to each other and the volume of the accommodating cavity is larger than the volume of the heat absorbing part 240, the situation that the heat absorbing part 240 cannot move relative to the accommodating part due to the fact that the heat absorbing part 240 is too difficult to move in the accommodating cavity can be prevented, and under the condition that the first bending section and the second bending section are perpendicular to each other, the situation that the heat absorbing part 240 moves in the accommodating cavity under the action of gas can be guaranteed, and more heat inside the electronic equipment can be absorbed.

Optionally, the number of the heat dissipation assemblies 200 may be multiple, the first end and the second end of each heat dissipation assembly 200 are disposed opposite to each other along the width direction of the casing 100, and the multiple heat dissipation assemblies 200 are arranged at intervals along the length direction of the casing 100. In this case, the size of each heat dissipation assembly 200 can be reduced, so that the heat absorption portion 240 in each heat dissipation assembly 200 is more easily liquefied, the heat absorption portion 240 can move in the accommodating cavity more quickly, and the heat dissipation efficiency of the electronic device is improved; moreover, by increasing the number of the heat dissipation assemblies 200, it is also ensured that the heat dissipation efficiency of each area on the electronic device is relatively high. The width direction of the housing may be the direction Y in fig. 1, and the length direction of the housing may be the direction X in fig. 1.

Further, the accommodating part may include an accommodating body 210 and an encapsulating cover 230, the accommodating body 210 has an accommodating groove, the encapsulating cover 230 covers the accommodating groove to form an accommodating cavity, the processing difficulty of the accommodating part formed by separate bodies is relatively low, and the assembling work of the heat absorbing part 240 and the accommodating part is facilitated. In the process of forming the heat dissipation assembly 200, the accommodating body 210 may be formed in advance, then the heat absorbing part 240 is disposed in the accommodating groove, and the package cover 230 may be fixedly connected to the accommodating body 210 by using a hot melting method, etc. to form a sealed accommodating cavity.

Further, the accommodating body 210 may include a bottom wall and two side walls, wherein the bottom wall is connected to the same side of the two side walls, and the encapsulation cover 230 covers the other side of the two side walls, so as to further increase the volume of the accommodating cavity and reduce the processing difficulty of the accommodating portion to a certain extent. Optionally, the side walls and the bottom wall may be formed in an integrated manner, and the package cover 230 may be adhered to one side of the two side walls away from the bottom wall by the sealant 220, which may ensure that the accommodating cavity has high sealing performance.

Alternatively, the thickness direction of the bottom wall may be the same as the thickness direction of the housing 100, which may ensure a large contact area between the heat dissipation assembly 200 and the housing 100 and facilitate assembly of the heat dissipation assembly 200 and the housing 100, and optionally, the bottom wall of the accommodating portion may be fixed on the outer surface of the housing 100 by adhesion of a heat conductive adhesive or the like.

In order to improve the reliability of the connection relationship between the heat dissipation assembly 200 and the housing 100, the heat dissipation assembly 200 may be optionally disposed in the housing 100, which may also improve the heat absorption capability of the heat dissipation assembly 200 to some extent, so that the heat inside the electronic device may be more quickly and thoroughly transmitted to the heat dissipation assembly 200 and the outside of the electronic device.

Specifically, during the processing of the electronic device, the accommodating body 210 may be formed first, the accommodating body 210 has an accommodating groove, the heat absorbing portion 240 may be placed in the accommodating groove from an opening of the accommodating groove, and the heat absorbing portion 240 may be located between two ends of the accommodating groove; then, the package cover 230 may be attached to the receiving body 210 by the sealant 220 to seal the heat sink 240 in the receiving cavity of the receiving portion. Moreover, a plurality of heat dissipation assemblies 200 may be provided, the housing 100 may be formed by nano injection molding or the like, and the plurality of heat dissipation assemblies 200 may be molded in the housing 100.

As is known, an electronic device generally includes a main board, a display module, a camera, and other components, and optionally, the receiving portion may be a pressure strain structure, and the receiving portion is communicatively connected to the main board. In the case where the electronic apparatus adopts the above-described structure, the user and the electronic apparatus are allowed to interact by pressing the accommodating portion.

The containing part is in communication connection with the mainboard, can respond to different pressure values, and transmits to mainboard department, in electronic equipment's design and production process, can define the different condition of forced induction. For example, in the case of pressure changes, the volume, brightness, contrast, and grayscale of the electronic device may be adjusted; alternatively, the focal length of the electronic device and the like can be controlled by changing the magnitude of the pressure acting on the accommodating portion during the shooting of the image or video by the electronic device.

In the case that the heat dissipating module 200 is provided in plurality and the heat dissipating modules 200 are sequentially arranged, the user may control a plurality of functions of the electronic device by sliding a finger on the housing 100. For example, in the action process that a finger presses the casing 100 and slides from one side of the casing 100 to the other side, parameters such as volume, brightness, contrast and gray scale of the electronic device can be controlled; or may also control parameters such as focus.

Specifically, the accommodating portion may include an accommodating body 210 and a package cover 230, the accommodating body 210 may be of a pressure strain structure, and in the process of assembling the housing 100 and the heat dissipation assembly 200, the bottom wall of the accommodating body 210 may be directed toward the outer surface of the housing 100, so as to ensure that the accommodating body can more sensitively sense the pressing strength and the pressing position of the user acting on the outer surface of the housing 100. The accommodating body 210 can be connected with the main board through the elastic sheet 270, so that the received pressure and the pressed position are transmitted to the main board, and the main board can perform corresponding operation according to the received pressure information. In the case that there are a plurality of heat dissipation assemblies 200, the accommodating bodies 210 of the plurality of heat dissipation assemblies 200 may be connected to the motherboard by the elastic pieces 270.

The electronic equipment disclosed by the embodiment of the invention can be a smart phone, a tablet computer, an electronic book reader or wearable equipment. Of course, the electronic device may also be other devices, and the embodiment of the present invention is not limited thereto.

In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. An electronic device, comprising a housing (100) and a heat dissipation assembly (200), wherein the heat dissipation assembly (200) comprises a containing part and a heat absorption part (240), the containing part is connected with the housing (100), the containing part is provided with a containing cavity, the heat absorption part (240) is arranged in the containing cavity, the heat absorption part (240) comprises a solid-liquid phase change material, and the containing cavity has a volume larger than that of the heat absorption part (240); the accommodating cavity is provided with a first end and a second end, the heat absorbing part (240) is arranged between the first end and the second end, a first gas spacing section (250) is arranged between the first end and the heat absorbing part (240), a second gas spacing section (260) is arranged between the second end and the heat absorbing part (240), and the gas in the first gas spacing section (250) and the second gas spacing section (260) absorbs heat to expand and pushes the heat absorbing part (240) to move along the accommodating cavity.

2. The electronic device of claim 1, wherein the receiving cavity is disposed in a bent manner.

3. The electronic device of claim 1, wherein the receiving cavity comprises at least one first bending section and at least one second bending section, the first bending section and the second bending section are alternately connected, the first bending section extends along a first direction, and the second bending section extends along a second direction.

4. The electronic device of claim 3, wherein the first bend segment and the second bend segment are perpendicular to each other.

5. The electronic device according to claim 1, wherein the number of the heat dissipation assemblies (200) is plural, the first end and the second end of each heat dissipation assembly (200) are arranged opposite to each other along the width direction of the housing (100), and the plural heat dissipation assemblies (200) are arranged at intervals along the length direction of the housing (100).

6. The electronic device of claim 1, wherein the accommodating portion comprises an accommodating body (210) and a package cover (230), the accommodating body (210) has a receiving groove, and the package cover (230) covers the receiving groove to form the accommodating cavity.

7. The electronic device according to claim 6, wherein the receiving body (210) comprises a bottom wall and two side walls, the bottom wall is connected to the same side of the two side walls, and the package cover (230) covers the other side of the two side walls.

8. The electronic device according to claim 7, wherein a thickness direction of the bottom wall is the same as a thickness direction of the housing (100).

9. The electronic device according to claim 1, wherein the electronic device comprises a main board, the accommodating portion is a pressure strain structure, and the accommodating portion is in communication connection with the main board.