CN111315130A - Installation structure of micro resistor on surface of computer host controller - Google Patents
Installation structure of micro resistor on surface of computer host controller Download PDFInfo
- Publication number
- CN111315130A CN111315130A CN202010055977.9A CN202010055977A CN111315130A CN 111315130 A CN111315130 A CN 111315130A CN 202010055977 A CN202010055977 A CN 202010055977A CN 111315130 A CN111315130 A CN 111315130A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- inner cavity
- pressing plate
- conductive
- installation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009434 installation Methods 0.000 title claims abstract description 34
- 230000003139 buffering effect Effects 0.000 claims abstract description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 230000037431 insertion Effects 0.000 claims abstract 3
- 238000003780 insertion Methods 0.000 claims abstract 3
- 238000003825 pressing Methods 0.000 claims description 32
- 238000005476 soldering Methods 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 14
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000035939 shock Effects 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
Abstract
The invention relates to the technical field of resistance installation of a computer circuit board, in particular to a micro resistor installation structure on the surface of a computer main controller, which comprises a circuit board, wherein the circuit board consists of a main substrate, an upper insulating layer and a tin welding layer, a pair of insertion holes which are bilaterally symmetrical are formed in the upper end of the circuit board, a pair of conductive supports which are mutually symmetrical are arranged on the lower end surface of an installation frame, and an installation inner cavity is formed in the inner cavity of the installation frame, and the micro resistor installation structure has the following beneficial: according to the invention, the mounting frame is added, and the mounting electric connection with the circuit board is realized by utilizing the larger mounting frame and the thicker conductive support, so that the breakage of a thinner lead wire is avoided, the mounting stability is greatly improved, and the influence of heat and vibration on the connection position is reduced; through set up folding buffering lead wire and rubber buffer pole in upper end hookup location, realize the buffering to the micro resistor mounted position, reduce vibrations to circuit connection's influence, improve connection shock resistance and stability that the circuit is right.
Description
Technical Field
The invention relates to the technical field of resistor installation of computer circuit boards, in particular to a micro resistor installation structure on the surface of a computer main machine controller.
Background
A plurality of micro resistors are required to be installed on a surface circuit board of a computer controller, and the traditional micro resistor is generally provided with two mutually symmetrical lead wires to realize tin soldering connection with the circuit board.
However, for the controller circuit board of industrial or large computer, the micro resistor has more defects:
1. the lead of the micro resistor is small in size, the leads of the positive electrode and the negative electrode are relatively thin, and the connecting position is fixed through tin soldering, so that the connecting position of the lead is broken due to vibration in the vibration operation process of the machine, and the operation of a control circuit is further influenced;
2. because the power of the large computer circuit board is high, the heat generated by the current is high, and the circuit board is easy to melt at the soldering position, so that the micro resistor and the circuit board fall off to cause circuit failure.
Therefore, the mounting structure of the micro resistor on the surface of the computer host controller is provided to solve the problems of vibration and soldering melting of the micro resistor.
Disclosure of Invention
The present invention is directed to a mounting structure of micro resistors on the surface of a computer host controller, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a micro resistor mounting structure on the surface of a computer host controller comprises a circuit board, wherein the circuit board consists of a main substrate, an upper insulating layer and a tin welding layer, a pair of bilaterally symmetrical jacks are formed in the upper end of the circuit board, a mounting frame is arranged at the upper end of the upper insulating layer, a pair of mutually symmetrical conductive supports are arranged on the lower end face of the mounting frame, a mounting inner cavity is formed in the inner cavity of the mounting frame, the lower end face of the mounting frame is tightly attached to the upper end face of the upper insulating layer, a fixed block is fixedly welded on the left side of the inner cavity of the mounting inner cavity, a buffer block is fixedly welded in the middle of the inner cavity of the mounting inner cavity, a conductive sliding chute is formed in the lower end face of the right side of the mounting inner cavity, micro resistors are transversely mounted in a groove in the upper end of the fixed block, a, a lower pressing plate is slidably mounted at the upper end of the conductive sliding chute, and an upper pressing plate is arranged at the upper end of the lower pressing plate;
both sides distribute around the micro resistance and install anodal lead wire and negative pole lead wire, anodal lead wire and negative pole lead wire's interlude outer wall sets up to the folding buffering lead wire of mutual bending folding, and anodal lead wire and negative pole lead wire's right side tip are installed between holding down plate and top board, the outer wall at the stand is fixed in folding buffering lead wire winding, be provided with a plurality of horizontal parallel arrangement's of linear distribution rubber buffer pole between the right side of holding down plate and the right side inner wall of installation inner chamber, rubber buffer pole's both ends distribute to be fixed at the right-hand member face of holding down plate and the right side inner wall of installation inner chamber, and rubber buffer pole's centre is provided with the spring.
Preferably, the upper insulating layer is located on an upper end face of the circuit board, the tin solder layer is located on a lower end face of the circuit board, and the main substrate is located on an inner layer of the circuit board.
Preferably, the conductive support is inserted into an inner cavity of the jack, the lower end of the conductive support is fixedly welded on the lower end face of the tin welding layer through a tin welding block, and the jack penetrates through the upper end face and the lower end face of the circuit board.
Preferably, the front side and the rear side of the upper end of the conductive chute are respectively connected with the positive conductive column and the negative conductive column, the lower end of the conductive chute is respectively connected with the left side and the right side of the conductive bracket, and an insulating plate is fixedly bonded between the front side and the rear side of the conductive chute.
Preferably, the lower end of the lower pressing plate is provided with a conductive sliding block, the conductive sliding block is slidably mounted on a conductive sliding groove, and the right side of the conductive sliding groove extends to the lower end of the inner wall of the right side of the mounting inner cavity.
Preferably, a pair of lower clamping grooves and an upper clamping groove which are symmetrical front and back are respectively arranged between the lower pressing plate and the upper pressing plate, and the right side end parts of the anode lead and the cathode lead are clamped and installed in a through hole formed by the lower clamping groove and the upper clamping groove.
Preferably, a screw hole is formed in the middle of the upper end of the upper pressing plate, the screw hole vertically extends to an inner cavity of the upper end of the lower pressing plate, and a locking screw is mounted in the screw hole through internal threads.
Preferably, a buffering inner cavity is formed in the middle of the rubber buffering rod, four rubber connecting strips distributed in a circumferential array mode are arranged in the middle of the rubber buffering rod, and a spring is vertically installed in the inner cavity of the buffering inner cavity.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the mounting frame is added, and the mounting electric connection with the circuit board is realized by utilizing the larger mounting frame and the thicker conductive support, so that the breakage of a thinner lead wire is avoided, the mounting stability is greatly improved, and the influence of heat and vibration on the connection position is reduced;
2. according to the invention, the folding buffer lead and the rubber buffer rod are arranged at the upper end connecting position, so that the mounting position of the miniature resistor is buffered, the influence of vibration on circuit connection is reduced, and the connection shock resistance and stability of the circuit pair are improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of the structure at A in FIG. 1;
FIG. 3 is a schematic view of the connection structure of the upper and lower pressing plates according to the present invention;
FIG. 4 is a schematic diagram of a micro resistor structure according to the present invention;
FIG. 5 is a top view of a baffle of the present invention;
FIG. 6 is a perspective view of the rubber buffer rod of the present invention.
In the figure: 1. a circuit board; 2. an upper insulating layer; 3. a main substrate; 4. a tin solder layer; 5. a jack; 6. a conductive support; 7. installing a frame; 8. installing an inner cavity; 9. a fixed block; 10. a micro resistor; 11. a positive electrode lead; 12. a buffer block; 13. a lower pressing plate; 14. a rubber buffer rod; 15. a conductive chute; 16. a conductive slider; 17. a solder bump; 18. locking the screw; 19. an upper pressure plate; 20. a buffer cavity; 21. a spring; 22. a positive conductive post; 23. a column; 24. folding the buffer lead; 25. a negative electrode lead; 26. fixing the inner cavity; 27. a lower clamping groove; 28. an upper clamping groove; 29. an insulating plate; 30. a negative conductive post; 31. and a rubber connecting strip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 6, the present invention provides a technical solution:
a miniature resistor mounting structure on the surface of a computer host controller comprises a circuit board 1, wherein the circuit board 1 is composed of a main substrate 3, an upper insulating layer 2 and a soldering layer 4, the upper insulating layer 2 is positioned on the upper end face of the circuit board 1, the soldering layer 4 is positioned on the lower end face of the circuit board 1, and the main substrate 3 is positioned on the inner layer of the circuit board 1.
A pair of jack 5 of bilateral symmetry is seted up to circuit board 1's upper end, the upper end of upper insulation layer 2 is provided with installing frame 7, the lower terminal surface of installing frame 7 is provided with a pair of electrically conductive support 6 of mutual symmetry, electrically conductive support 6 pegs graft at the inner chamber of jack 5, the lower extreme of electrically conductive support 6 passes through the lower terminal surface of tin welding piece 17 fixed welding at tin solder layer 4, jack 5 runs through circuit board 1's upper and lower terminal surface, utilize jack 5 and electrically conductive support 6's cooperation, realize the electric connection between installing frame 7 and circuit board 1.
The inner chamber of installing frame 7 is provided with installation inner chamber 8, and the lower terminal surface of installing frame 7 closely laminates the up end at last insulating layer 2, and the fixed welding in the inner chamber left side of installation inner chamber 8 has fixed block 9, transversely installs micro resistor 10 in the upper end recess of fixed block 9, utilizes fixed block 9 to realize micro resistor 10's installation.
The front side and the rear side of the micro resistor 10 are respectively provided with a positive lead 11 and a negative lead 25, and the outer walls of the middle sections of the positive lead 11 and the negative lead 25 are provided with folding buffer leads 24 which are bent and folded mutually.
Fixed welding has buffer block 12 in the middle of the inner chamber of installation inner chamber 8, both sides are provided with a pair of fixed inner chamber 26 of mutual symmetry around buffer block 12, a plurality of stands 23 of crisscross vertical distribution around fixed inner chamber 26's upper end is provided with, folding buffering lead 24 winding is fixed at the outer wall of stand 23, utilize folding buffering lead 24 to make the lead wire crooked folding each other, and then at the vibrations in-process, utilize opening of crooked folding position to close rocking of buffering micro resistor 10 mounted position.
Conductive sliding groove 15 has been seted up to the right side lower extreme face of installation inner chamber 8, and conductive sliding groove 15's upper end slidable mounting has holding down plate 13, and holding down plate 13's lower extreme is provided with electrically conductive slider 16, and electrically conductive slider 16 slidable mounting is on electrically conductive sliding groove 15, and electrically conductive sliding groove 15's right side extends to the right side inner wall lower extreme of installation inner chamber 8, utilizes the cooperation of electrically conductive slider 16 and electrically conductive sliding groove 15, realizes holding down plate 13's slidable mounting.
An upper pressing plate 19 is arranged at the upper end of the lower pressing plate 13, a pair of lower clamping grooves 27 and an upper clamping groove 28 which are symmetrical front and back are respectively arranged between the lower pressing plate 13 and the upper pressing plate 19, a screw hole is formed in the middle of the upper end of the upper pressing plate 19, the screw hole vertically extends to an inner cavity of the upper end of the lower pressing plate 13, a locking screw 18 is installed in the screw hole in a threaded mode, and the locking screw 18 is used for achieving fixed extrusion connection between the lower pressing plate 13 and the upper pressing plate 19.
The right side end parts of the anode lead 11 and the cathode lead 25 are clamped and installed in a through hole formed by the lower clamping groove 27 and the upper clamping groove 28, the right side end parts of the anode lead 11 and the cathode lead 25 are installed between the lower pressing plate 13 and the upper pressing plate 19, and then the anode and the cathode of the micro resistor 10 are electrically and fixedly connected.
The front side and the rear side of the upper end of the conductive sliding chute 15 are respectively connected with the positive conductive column 22 and the negative conductive column 30, the lower end of the conductive sliding chute 15 is respectively connected with the left side and the right side of the conductive support 6, the insulating plate 29 is fixedly bonded between the front side and the rear side of the conductive sliding chute 15, the connection between the micro resistor 10 and the conductive support 6 is realized by utilizing the positive conductive column 22 and the negative conductive column 30, and then the micro resistor 10 is connected into the control circuit.
A plurality of rubber buffer rods 14 which are linearly distributed and transversely arranged in parallel are arranged between the right side of the lower pressing plate 13 and the right side inner wall of the installation inner cavity 8, and two ends of each rubber buffer rod 14 are fixedly distributed on the right end surface of the lower pressing plate 13 and the right side inner wall of the installation inner cavity 8.
The centre of rubber buffer pole 14 is provided with spring 21, buffering inner chamber 20 has been seted up in the centre of rubber buffer pole 14, and the interlude of rubber buffer pole 14 is provided with four rubber connecting strips 31 that the circumference array distributes, the vertical spring 21 of installing of the inner chamber of buffering inner chamber 20, through set up spring 21 in buffering inner chamber 20, and then when the machine shakes or rocks, the ascending buffering of direction about realizing, reduce the tensile strength between micro resistor 10 and the clamp plate hookup location, improve hookup location's stability.
The working principle is as follows: at first, the electric connection between the installation frame 7 and the circuit board 1 is realized by the matching of the jack 5 and the conductive support 6, the installation electric connection with the circuit board 1 is realized by the large installation frame 7 and the thick conductive support 6, and further, the breakage of thin leads is avoided, the installation stability is greatly improved, and the influence of heat and vibration on the connection position is reduced.
Utilize fixed block 9 to realize the installation of micro resistor 10, utilize folding buffering lead wire 24 to make the lead wire crooked folding each other, and then in vibrations process, utilize opening and shutting of crooked folding position to cushion rocking of micro resistor 10 mounted position, utilize the cooperation of electrically conductive slider 16 and electrically conductive spout 15, realize the slidable mounting of holding down plate 13, utilize locking screw 18 to realize the fixed extrusion between holding down plate 13 and the top board 19 and be connected, utilize anodal to lead electrical pillar 22 and negative pole to lead electrical pillar 30 and realize being connected between micro resistor 10 and electrically conductive support 6, and then insert control circuit with micro resistor 10, through set up spring 21 in buffering inner chamber 20, and then when the machine shakes or rocks, realize the ascending buffering in left and right sides direction, reduce the tensile strength between micro resistor 10 and the clamp plate hookup location, improve hookup location's stability.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A computer host controller surface micro resistor mounting structure comprises a circuit board (1), and is characterized in that: the circuit board (1) is composed of a main substrate (3), an upper insulating layer (2) and a tin soldering layer (4), a pair of jacks (5) which are bilaterally symmetrical are formed in the upper end of the circuit board (1), an installation frame (7) is arranged at the upper end of the upper insulating layer (2), a pair of conductive brackets (6) which are mutually symmetrical are arranged on the lower end face of the installation frame (7), an installation inner cavity (8) is formed in the inner cavity of the installation frame (7), the lower end face of the installation frame (7) is tightly attached to the upper end face of the upper insulating layer (2), a fixed block (9) is fixedly welded on the left side of the inner cavity of the installation inner cavity (8), a buffer block (12) is fixedly welded in the middle of the inner cavity of the installation inner cavity (8), a conductive sliding chute (15) is formed in the lower end face of the right side of the, a pair of mutually symmetrical fixed inner cavities (26) are arranged on the front side and the rear side of the buffer block (12), a plurality of upright posts (23) which are vertically distributed in a staggered manner are arranged at the upper end of each fixed inner cavity (26), a lower pressing plate (13) is slidably mounted at the upper end of the conductive sliding chute (15), and an upper pressing plate (19) is arranged at the upper end of the lower pressing plate (13);
the front side and the rear side of the micro resistor (10) are provided with an anode lead (11) and a cathode lead (25) in a distributed manner, the outer walls of the middle sections of the positive electrode lead (11) and the negative electrode lead (25) are provided with folding buffer leads (24) which are mutually bent and folded, the right side end parts of the positive electrode lead (11) and the negative electrode lead (25) are arranged between the lower pressing plate (13) and the upper pressing plate (19), the folding buffer lead (24) is wound and fixed on the outer wall of the upright post (23), a plurality of rubber buffer rods (14) which are linearly distributed and arranged transversely in parallel are arranged between the right side of the lower pressure plate (13) and the right side inner wall of the mounting inner cavity (8), the two ends of the rubber buffer rod (14) are fixed on the right end face of the lower pressing plate (13) and the inner wall of the right side of the installation inner cavity (8) in a distributed mode, and a spring (21) is arranged in the middle of the rubber buffer rod (14).
2. The mounting structure of micro resistors on the surface of a computer host controller according to claim 1, wherein: the upper insulating layer (2) is located on the upper end face of the circuit board (1), the tin welding layer (4) is located on the lower end face of the circuit board (1), and the main substrate (3) is located on the inner layer of the circuit board (1).
3. The mounting structure of micro resistors on the surface of a computer host controller according to claim 1, wherein: the conductive support (6) is inserted into an inner cavity of the insertion hole (5), the lower end of the conductive support (6) is fixedly welded on the lower end face of the tin welding layer (4) through a tin welding block (17), and the insertion hole (5) penetrates through the upper end face and the lower end face of the circuit board (1).
4. The mounting structure of micro resistors on the surface of a computer host controller according to claim 1, wherein: the front side and the rear side of the upper end of the conductive sliding chute (15) are respectively connected with the positive conductive column (22) and the negative conductive column (30), the lower end of the conductive sliding chute (15) is respectively connected with the left side and the right side of the conductive bracket (6), and an insulating plate (29) is fixedly bonded between the front side and the rear side of the conductive sliding chute (15).
5. The mounting structure of micro resistors on the surface of a computer host controller according to claim 1, wherein: the lower extreme of holding down plate (13) is provided with electrically conductive slider (16), electrically conductive slider (16) slidable mounting is on electrically conductive spout (15), the right side of electrically conductive spout (15) extends to the right side inner wall lower extreme of installation inner chamber (8).
6. The mounting structure of micro resistors on the surface of a computer host controller according to claim 1, wherein: a pair of lower clamping grooves (27) and an upper clamping groove (28) which are symmetrical front and back are respectively arranged between the lower pressing plate (13) and the upper pressing plate (19), and the right end parts of the anode lead (11) and the cathode lead (25) are clamped and installed in through holes formed by the lower clamping grooves (27) and the upper clamping grooves (28).
7. The mounting structure of micro resistors on the surface of a computer host controller according to claim 1, wherein: the middle of the upper end of the upper pressing plate (19) is provided with a screw hole, the screw hole vertically extends to an inner cavity at the upper end of the lower pressing plate (13), and a locking screw (18) is mounted in the screw hole in a threaded mode.
8. The mounting structure of micro resistors on the surface of a computer host controller according to claim 1, wherein: buffering inner chamber (20) have been seted up in the centre of rubber buffer pole (14), and the interlude of rubber buffer pole (14) is provided with four rubber connecting strips (31) that the circumference array distributes, the vertical spring (21) of installing of inner chamber of buffering inner chamber (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010055977.9A CN111315130B (en) | 2020-01-18 | 2020-01-18 | Installation structure of micro resistor on surface of computer host controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010055977.9A CN111315130B (en) | 2020-01-18 | 2020-01-18 | Installation structure of micro resistor on surface of computer host controller |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111315130A true CN111315130A (en) | 2020-06-19 |
| CN111315130B CN111315130B (en) | 2021-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010055977.9A Expired - Fee Related CN111315130B (en) | 2020-01-18 | 2020-01-18 | Installation structure of micro resistor on surface of computer host controller |
Country Status (1)
| Country | Link |
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| CN (1) | CN111315130B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111930198A (en) * | 2020-08-18 | 2020-11-13 | 日照职业技术学院 | Computer power supply installation groove with adjustable space |
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| CN104144568A (en) * | 2014-08-04 | 2014-11-12 | 中国北方发动机研究所(天津) | Vibration-resistant fixing device for small-mass element on circuit board and fixing method of vibration-resistant fixing device for small-mass element on circuit board |
| CN108942737A (en) * | 2018-07-27 | 2018-12-07 | 广东宽普科技股份有限公司 | A kind of accurate device mends processing method and its special fastening fixture |
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2020
- 2020-01-18 CN CN202010055977.9A patent/CN111315130B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3810716A1 (en) * | 1988-03-30 | 1989-11-02 | Loewe Opta Gmbh | Holder for flat components |
| CN101231984A (en) * | 2007-01-23 | 2008-07-30 | 南茂科技股份有限公司 | Semiconductor packaging supported films and packaging construction for preventing rupture of pin buckle position |
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| JP2012134225A (en) * | 2010-12-20 | 2012-07-12 | Panasonic Corp | Substrate attaching structure |
| CN102098870A (en) * | 2011-03-10 | 2011-06-15 | 沈李豪 | Composite printed circuit board (PCB) and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111930198A (en) * | 2020-08-18 | 2020-11-13 | 日照职业技术学院 | Computer power supply installation groove with adjustable space |
| CN111930198B (en) * | 2020-08-18 | 2022-07-29 | 日照职业技术学院 | Computer power supply installation groove with adjustable space |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111315130B (en) | 2021-06-18 |
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