CN111312790B - Display panel, manufacturing method and flexible display device - Google Patents
Display panel, manufacturing method and flexible display device Download PDFInfo
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- CN111312790B CN111312790B CN202010131353.0A CN202010131353A CN111312790B CN 111312790 B CN111312790 B CN 111312790B CN 202010131353 A CN202010131353 A CN 202010131353A CN 111312790 B CN111312790 B CN 111312790B
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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Abstract
The invention provides a display panel, a manufacturing method and a flexible display device, which comprise a substrate, an array layer, a pixel definition layer, support columns and first grooves, wherein the projection of the support columns on the substrate is positioned in the projection of the first grooves on the substrate, and the first grooves penetrate through at least one inorganic layer in the array layer. Therefore, the first groove penetrating through at least one inorganic layer is formed in the array layer, so that the first groove breaks the inorganic layer located on the outer side of the first groove and the inorganic layer located on the inner side of the first groove, and the projection of the support column on the substrate is located in the projection of the first groove on the substrate, so that when the inorganic layer in the array layer below the support column is cracked, the crack cannot extend to the inorganic layer on the outer side of the first groove due to the blocking of the first groove, and further the phenomenon that cracks are generated around pixels when the display screen is impacted by large external force is avoided, and the yield of the display screen is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method and a flexible display device.
Background
In general, in order to detect the smash resistance of a display screen, a ball drop test is required for the display screen. However, when some display screens are subjected to ball drop test, cracks can appear around the pixels, so that normal display of the pixels is affected, and the yield of the display screens is reduced.
Therefore, how to provide a display panel capable of avoiding the generation of cracks around the pixels and improving the yield of the display panel is a great technical problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present invention provides a display panel, which can avoid the display screen from generating cracks around the pixels when the display screen is impacted by a large external force.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a display panel, comprising: the pixel array comprises a substrate, an array layer, a pixel definition layer, support columns and first trenches. The array layer is positioned on one side surface of the substrate and comprises at least one inorganic layer. The pixel defining layer is positioned on the surface of the array layer far away from the substrate and comprises a plurality of pixel areas and a plurality of pixel interval areas, wherein two adjacent pixel areas are separated from each other through the pixel interval area positioned between the two pixel areas, and the support columns are arranged on the pixel interval areas. The array layer is provided with a first groove penetrating at least one inorganic layer, and the projection of the support column on the substrate is positioned in the projection of the first groove on the substrate.
A flexible display device includes the display panel described above.
A manufacturing method of a display panel is applied to the display panel, and comprises the following steps:
providing a substrate;
forming an array layer comprising at least one inorganic layer on one side surface of a substrate, and forming a first groove penetrating at least one inorganic layer on the array layer;
forming a pixel defining layer including at least a plurality of pixel regions and a plurality of pixel interval regions on a surface of the array layer away from the substrate, wherein adjacent two pixel regions are spaced apart from each other by the pixel interval region therebetween;
the projections formed on the substrate over a portion of the pixel spacing area are located at support posts within the projections of the first trenches on the substrate.
Compared with the prior art, the technical scheme provided by the invention has the following advantages:
the invention provides a display panel, a manufacturing method and a flexible display device, which comprise a substrate, an array layer, a pixel definition layer, a support column and a first groove, wherein the array layer is positioned on one side surface of the substrate and comprises at least one inorganic layer, the pixel definition layer is positioned on the surface of the array layer far away from the substrate and comprises a plurality of pixel areas and a plurality of pixel interval areas, the support column is arranged on the pixel interval areas, the first groove penetrates through at least one inorganic layer, two adjacent pixel areas are separated from each other through the pixel interval area positioned between the two adjacent pixel areas, and the projection of the support column on the substrate is positioned in the projection of the first groove on the substrate. Therefore, the first groove penetrating through at least one inorganic layer is formed in the array layer, so that the first groove breaks the inorganic layer located on the outer side of the first groove and the inorganic layer located on the inner side of the first groove, and the projection of the support column on the substrate is located in the projection of the first groove on the substrate, so that when the inorganic layer in the array layer below the support column is cracked, the crack cannot extend to the inorganic layer on the outer side of the first groove due to the blocking of the first groove, and further the phenomenon that cracks are generated around pixels when the display screen is impacted by large external force is avoided, and the yield of the display screen is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic top view of a conventional display panel;
FIG. 2 is a schematic cross-sectional view of a conventional flexible display panel;
fig. 3 is a perspective view of a display panel according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of the display panel shown in FIG. 3 along the cutting line AA';
FIG. 5 is an enlarged view of a portion of FIG. 4;
fig. 6 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;
fig. 7 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;
fig. 8 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;
fig. 9 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;
fig. 10 is a top view of a support pillar and a first trench in a display panel according to an embodiment of the invention;
FIG. 11 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;
fig. 12 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;
fig. 13 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;
fig. 14 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;
fig. 15 is a schematic structural diagram of a flexible display device according to an embodiment of the present invention;
fig. 16 is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the invention.
Detailed Description
The flexible display panel is a great development trend of the display panel by virtue of the characteristics of being bendable, curled, convenient to carry after being folded and the like. In general, a protective layer of a flexible display panel is a thin film encapsulation layer including an organic layer and an inorganic film layer or an organic film layer stacked on the organic layer, wherein the inorganic film layer may prevent permeation, isolate air and moisture, but is generally formed of alternating inorganic film layers and organic film layers due to non-uniformity of properties of the inorganic film layer, so that the organic film layer stabilizes the inorganic film layer.
As in the background art, in order to detect the anti-smash capability of the display screen, a ball drop test needs to be performed on the display screen. Compared with a rigid glass protection layer, the thin film packaging layer of the flexible display panel reduces the anti-smashing capability of the display panel for ball drop test, for example, as shown in fig. 1 and 2, fig. 1 is a top view of the flexible display panel after ball drop test, and fig. 2 is a schematic cross-sectional structure of the flexible display panel, and when ball drop test is performed on some flexible display panels, cracks 12 can appear around pixels 11 to affect normal display of the pixels, thereby reducing the yield of the display panels.
Based on this, the present invention provides a display panel including: the substrate, the array layer, the pixel defining layer, the support columns and the first trenches are used for overcoming the problems in the prior art. The array layer is positioned on one side surface of the substrate and comprises at least one inorganic layer. The pixel defining layer is positioned on the surface of the array layer far away from the substrate and comprises a plurality of pixel areas and a plurality of pixel interval areas, wherein two adjacent pixel areas are separated from each other through the pixel interval area positioned between the two pixel areas, and the support columns are arranged on the pixel interval areas. The array layer is provided with a first groove penetrating at least one inorganic layer, and the projection of the support column on the substrate is positioned in the projection of the first groove on the substrate.
The invention also provides a flexible display device comprising the display panel.
The invention also provides a manufacturing method of the display panel, which is applied to the display panel and comprises the following steps:
providing a substrate;
forming an array layer comprising at least one inorganic layer on one side surface of a substrate, and forming a first groove penetrating at least one inorganic layer on the array layer;
forming a pixel defining layer including at least a plurality of pixel regions and a plurality of pixel interval regions on a surface of the array layer away from the substrate, wherein adjacent two pixel regions are spaced apart from each other by the pixel interval region therebetween;
the projections formed on the substrate over a portion of the pixel spacing area are located at support posts within the projections of the first trenches on the substrate.
The invention provides a display panel, a manufacturing method and a flexible display device, which comprise a substrate, an array layer, a pixel definition layer, a support column and a first groove, wherein the array layer is positioned on one side surface of the substrate and comprises at least one inorganic layer, the pixel definition layer is positioned on the surface of the array layer far away from the substrate and comprises a plurality of pixel areas and a plurality of pixel interval areas, the support column is arranged on the pixel interval areas, the first groove penetrates through at least one inorganic layer, two adjacent pixel areas are separated from each other through the pixel interval area positioned between the two adjacent pixel areas, and the projection of the support column on the substrate is positioned in the projection of the first groove on the substrate. Therefore, the first groove penetrating through at least one inorganic layer is formed in the array layer, so that the first groove breaks the inorganic layer located on the outer side of the first groove and the inorganic layer located on the inner side of the first groove, and the projection of the support column on the substrate is located in the projection of the first groove on the substrate, so that when the inorganic layer in the array layer below the support column is cracked, the crack cannot extend to the inorganic layer on the outer side of the first groove due to the blocking of the first groove, and further the phenomenon that cracks are generated around pixels when the display screen is impacted by large external force is avoided, and the yield of the display screen is improved.
The foregoing is a core idea of the present invention, and in order that the above-mentioned objects, features and advantages of the present invention can be more clearly understood, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 3, 4 and 5, an embodiment of the present invention provides a display panel, in which fig. 3 is a perspective view of the display panel provided by the embodiment of the present invention, fig. 4 is a schematic cross-sectional structure of the display panel shown in fig. 3 along a cutting line AA', and fig. 5 is a partially enlarged view of fig. 4. Specifically, the display panel includes: a substrate 31, an array layer 32, a pixel defining layer 33, support columns 34, and first trenches 35.
The substrate 31 is a flexible substrate having characteristics of being stretchable, foldable, bendable, or crimpable, and is formed of a flexible insulating material, specifically, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), or the like.
The array layer 32 is disposed on one side surface of the substrate 31, and in this embodiment, the array layer 32 includes at least a plurality of thin film transistors 321, a plurality of gate lines, and a plurality of data lines. The thin film transistor 321 includes an active layer 321a, a gate electrode 321b, a source electrode 321c, a drain electrode 321d, a gate insulating layer 321e disposed between the active layer 321a and the gate electrode 321b, and an interlayer insulating layer 321f disposed between the gate electrode 321b and the source electrode 321c and the drain electrode 321 d. The source 321c and the drain 321d are located in the same layer, i.e., a source-drain layer. Since the gate insulating layer 321e and the interlayer insulating layer 321f are both inorganic insulating layers formed of silicon nitride, silicon oxide, or the like, the array layer 32 includes at least one inorganic layer 322 in this embodiment.
The present embodiment further provides a pixel defining layer 33 on a surface of the array layer 32 away from the substrate 31, that is, the display panel provided in the present embodiment includes the array layer 32 and the pixel defining layer 33 sequentially disposed on the substrate 31. The pixel defining layer 33 includes a plurality of pixel regions 331 and a plurality of pixel interval regions 332, wherein adjacent two pixel regions 331 are spaced apart from each other by the pixel interval regions 332. And the pixel area 331 is used for providing a light emitting device 331a, one side of the light emitting device 331a is connected with the pixel electrode 331b, the other side is connected with the common electrode 331c, and when the pixel electrode and the common electrode are electrified, the light emitting device emits light. In this embodiment, the positional relationship between the pixel electrode and the common electrode is not limited, for example, the common electrode may be located above the pixel electrode or between the pixel electrode and the thin film transistor, and for convenience of illustration, fig. 5 illustrates that the common electrode layer is located above the pixel electrode.
Specifically, in this embodiment, each light emitting device corresponds to one thin film transistor, and the pixel electrode is connected to the drain electrode of the thin film transistor, and when the gate line transmits a scan signal to the driving circuit and the data line transmits a data signal to the driving circuit, the driving circuit supplies current to the light emitting device through the turned-on thin film transistor and the pixel electrode, so that the light emitting device emits light, and a picture is displayed.
In addition, in the display panel provided in this embodiment, the supporting columns 34 are further disposed on the pixel interval region 332, so that a certain interval is formed between the pixel defining layer 33 and the thin film packaging layer, which is convenient for mixing light of the light emitting devices. It should be noted that, in the present embodiment, the specific hierarchical structure of the thin film encapsulation layer is not limited, for example, the thin film encapsulation layer may include two inorganic layers and one organic layer, but is not limited thereto, and in other embodiments, the thin film encapsulation layer may include multiple inorganic layers and multiple organic layers.
It should be noted that, in the display panel provided in this embodiment, the array layer is provided with the first trench penetrating through at least one inorganic layer, and the projection of the support column on the substrate is located inside the projection of the first trench on the substrate. Because the anti-smash ability of inorganic layer is lower for can appear the crack when the inorganic layer that is located around the support column below receives the stress, among the prior art, this crack can extend along inorganic layer, and in this scheme, because first slot breaks inorganic layer part, has cut off the extension route of crack, makes the crack can not continue to extend to the outside inorganic layer of first slot.
As described above, the array layer provided in this embodiment includes at least one inorganic layer, so in this embodiment, the first trench may have multiple manners of penetrating through the at least one inorganic layer. Specifically, taking an example in which the array layer includes two inorganic layers, as shown in fig. 6, the first trench 61 may penetrate only one inorganic layer, such as the interlayer insulating layer 321f, or, as shown in fig. 7, the first trench 71 may penetrate both inorganic layers, such as the gate insulating layer 321e and the interlayer insulating layer 321f.
Whether the first groove penetrates through a plurality of inorganic layers, the first groove can divide the original inorganic layers into inorganic layers positioned in the first groove and inorganic layers positioned outside the first groove, and the inorganic layers in the first groove are disconnected from the inorganic layers outside the first groove due to the existence of the first groove, so that even if the inorganic layers in the first groove generate cracks, the extending direction of the cracks can be stopped in the first groove, namely, the cracks in the first groove cannot diffuse to the inorganic layers outside the first groove. Similarly, after the inorganic layer outside the first groove generates cracks, the cracks are also stopped at the first groove due to the existence of the first groove and cannot diffuse to the inorganic layer positioned in the first groove, so that the first groove plays a role in separating the inorganic layer, and the separated two inorganic layers are not connected.
In addition, as the inventor finds out in the process of researching the scheme, the crack generated by the ball falling test is related to the setting position of the supporting column, specifically: the chance of cracking around the support posts is higher than the chance of cracking around other components (e.g., pixels, traces, etc.). Thus, in the present embodiment, the opening position of the first trench is set around the position of the support post, for example, the projection of the support post on the substrate is located within the projection of the first trench on the substrate.
The projection of the support post on the substrate is located in the projection of the first trench on the substrate, and various specific implementations may be presented, for example, in a first mode, as shown in fig. 8, the projection of the first trench on the substrate covers the projection of the support post on the substrate. In a second mode, as shown in fig. 9, the projection of the first groove on the substrate is annular, and the projection of the support column on the substrate is located in the annular inner ring and does not intersect with the inner ring.
It is not difficult to find out in conjunction with fig. 8 that when the projection of the first groove on the substrate covers the projection of the support column on the substrate, the first groove divides the original inorganic layer into the first groove and the inorganic layer located outside the first groove, at this time, when an external force acts on the support column, because the first groove is of a hollow structure, no crack is generated in the first groove, and the stress is blocked in the first groove, so that the inorganic layer located outside the first groove does not crack extension.
In the manner of fig. 9, the inorganic layer is divided into the inorganic layer located in the first trench and the inorganic layer located outside the first trench by the first trench, so that the crack is not extended into the inorganic layer located at the other side of the first trench no matter the inorganic layer in the first trench or the inorganic layer located outside the first trench generates the crack, and further the extension and expansion of the crack are effectively prevented.
It should be noted that, in this embodiment, the projection of the first trench on the substrate may also have other shapes, such as a square, a circle, a triangle, etc. As shown in fig. 10, the shape of the projection of the first trench 105 on the substrate may also be the same as the shape of the projection of the support column 104 on the substrate. In addition, in this embodiment, the first trench may be a discontinuous trench structure, or may be a continuous trench structure.
In this embodiment, the first trench is a hollow structure, and is not filled therein. In other embodiments, as shown in fig. 11, the first trench may be further filled with an organic film 111, so that the original inorganic layer is divided into an inorganic layer 112a located in the first trench, the organic film 111, and an inorganic layer 112b located outside the first trench by the first trench, and the anti-cracking capability of the inorganic layer is improved by the organic film. The material of the inorganic layer may be silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, or the like, and the material of the organic layer may be acryl, polyimide (PI), polyester, or the like. In this embodiment, after the first trench is etched, the organic film 111 may be filled by a separate process, or the first trench may be filled when the planarization layer is formed while the array layer is etching the transistor, that is, the preparation process of the array layer is multiplexed, without adding an additional filling process.
Illustratively, the display panel provided in this embodiment takes fig. 12 as an example, where an array layer is disposed on a substrate, a planarization layer 121 is disposed on the array layer, and a pixel defining layer is disposed on the planarization layer, and the first trench penetrating through a part of the inorganic layer in the array layer is covered by the planarization layer, so that the compressive capacity of the first trench is further enhanced due to the fact that the first trench is filled with the planarization layer.
On the basis of the above embodiment, as shown in fig. 13, in the display panel provided in this embodiment, the first trench penetrates through the entire array layer. Since the array layer includes at least one inorganic layer, the present embodiment extends through the entire array layer 32, and can prevent cracks from extending on other inorganic layers in the array layer, such as a buffer layer, a passivation layer, a gate insulating layer, an interlayer insulating layer, and the like, while preventing cracks from extending on the inorganic layers in the array layer. The buffer layer and the passivation layer may be organic layers, and in this embodiment, the buffer layer and the passivation layer are inorganic layers.
Specifically, the first trench in this embodiment penetrates from the lower portion of the pixel defining layer to the substrate, so that the first trench can block all inorganic layers and all organic layers in the array layer, and it is further ensured that the inorganic layers in the array layer are disconnected from each other on the basis that the first trench penetrates part of the inorganic layers. Based on the method, when the inorganic layer below the supporting column generates cracks during ball falling test, the cracks cannot extend to the inorganic layer outside the grooves due to the blocking of the first grooves, and further the phenomenon that cracks are generated around the pixels when the display screen is impacted by large external force is avoided.
Further, as shown in fig. 14, in the display panel provided by the embodiment of the invention, the array layer may be further provided with at least one second trench 141 surrounding the first trench, and just as the first trench can divide the inorganic layer into the inorganic layer located in the first trench and the inorganic layer located outside the first trench, the second trench can divide the inorganic layer continuously, and divide the inorganic layer located outside the first trench into the inorganic layer located outside the second trench and the inorganic layer located inside the second trench and located outside the first trench, so that the inorganic layer located inside the first trench, the inorganic layer located outside the first trench and located inside the second trench, and the inorganic layer located outside the second trench are separated from each other, even if one of the inorganic layers generates a crack, the crack can only extend in the inorganic layer located inside the first trench or the second trench, and the crack is separated by the first trench or the second trench, thereby avoiding the problem that the pixel of the display panel extends due to the crack.
Also, in this embodiment, the second trench may extend through the array layer, or may extend through a portion of the inorganic layer in the array layer, and may have a continuous structure or may be discontinuous, which is convenient for simplifying the process. However, the arrangement of the first trench and the second trench in this embodiment is not limited thereto, for example, when the first trench penetrates through the whole array layer, the second trench only penetrates through a part of the organic layer of the array layer, and when the first trench is a continuous trench structure, the second trench is arranged to be a discontinuous trench structure, i.e. the first trench and the second trench can be arranged according to practical design requirements. In any arrangement mode, the addition of the second grooves can further separate other inorganic layers on the basis that the inorganic layers are separated by the first grooves, so that crack extension between the separated inorganic layers is avoided.
On the basis of the above embodiments, the embodiment of the present invention further provides a flexible display device, as shown in fig. 15, including any one of the display panels described above. The flexible display device includes, but is not limited to, a mobile phone, a tablet computer, a digital camera and the like. The working principle of the flexible display device is the same as that of the display panel, and the first groove penetrating through at least one inorganic layer is arranged on the array layer, so that the first groove separates the inorganic layer positioned on the outer side of the first groove from the inorganic layer positioned on the inner side of the first groove, and when the inorganic layer positioned in the array layer below the support column generates cracks due to the blocking of the first groove, the cracks cannot extend to the inorganic layer on the outer side of the first groove or when the inorganic layer positioned outside the first groove generates cracks, the cracks cannot extend to the inorganic layer in the first groove due to the blocking of the first groove, and further the phenomenon that cracks are generated around pixels when the display screen is impacted by large external force is avoided, and the yield of the display screen is improved.
The embodiment of the invention also provides a manufacturing method of the display panel, as shown in fig. 16, fig. 16 is a flowchart of the manufacturing method of the display panel provided by the embodiment of the invention, and the manufacturing method of the display panel comprises the following steps:
s161, providing a substrate;
in this embodiment, the substrate is a flexible substrate, which can be bent, and the flexible substrate may be formed of a flexible insulating material such as Polyimide (PI), polycarbonate (PC), or polyethylene terephthalate (PET).
S162, forming an array layer comprising at least one inorganic layer on one side surface of the substrate, and forming a first groove penetrating through the at least one inorganic layer on the array layer;
in this embodiment, the array layer includes at least a plurality of thin film transistors, a plurality of gate lines, and a plurality of data lines. Taking a thin film transistor as an example of a top gate structure, the manufacturing process of the array layer is described continuously:
an active layer, a gate electrode, a source electrode, a drain electrode, a gate insulating layer disposed between the active layer and the gate electrode, and an interlayer insulating layer disposed between the gate electrode and the source electrode and the drain electrode are sequentially formed on a substrate. Wherein the source and drain are located in the same layer. The gate insulating layer and the interlayer insulating layer are both inorganic layers.
After the array layer is manufactured, a first groove penetrating through at least one inorganic layer is formed in the array layer, and it should be noted that in this embodiment, after the array layer is manufactured, the first groove may be etched separately for the array layer, or the first groove may be etched by using the same process when the source electrode and the drain electrode of the array layer are etched.
The depth of the first trench penetrating through the array layer in this embodiment may be determined according to practical requirements, for example, the first trench penetrates through all inorganic layers in the array layer, or the first trench penetrates through all levels in the array layer, including inorganic layers and organic layers, or the first trench penetrates through only one inorganic layer in the array layer.
S163, forming a pixel definition layer on the surface of the array layer far away from the substrate;
in this embodiment, the pixel defining layer includes at least a plurality of pixel regions and a plurality of pixel interval regions, and adjacent two pixel regions are spaced apart from each other by the pixel interval regions. The pixel area is used for arranging a light-emitting device, one side of the light-emitting device is connected with the pixel electrode, the other side of the light-emitting device is connected with the common electrode, and when the voltage is applied to the pixel electrode and the common electrode, the light-emitting device emits light. In this embodiment, the positional relationship between the pixel electrode and the common electrode is not limited, and for example, the common electrode may be located above the pixel electrode or between the pixel electrode and the thin film transistor, or the common electrode layer may be located above the pixel electrode.
S164, forming support columns on part of the pixel interval regions, wherein the projection of the support columns on the substrate is positioned in the projection of the first grooves on the substrate.
After the pixel defining layer is formed, support posts are disposed on the pixel spacing areas so that the support posts can support the thin film encapsulation layer thereon. The inventor considers that the inorganic layer around the support column is easy to crack, so in this embodiment, the projection of the support column on the substrate is located inside the projection of the first trench on the substrate, so that even if the inorganic layer around the lower portion of the support column is stressed, the crack will occur, and the first trench breaks the inorganic layer partially, so that the extending path of the crack is blocked, and the crack will not extend to the inorganic layer outside the first trench.
In addition, the manufacturing method is adopted, the first groove is not filled, and in order to further strengthen the smash resistance of the display panel, the invention further provides the manufacturing method of the display panel, and when the first groove is formed in the array layer, the organic film is filled in the first groove.
The filling of the organic film can adopt a single process to fill the organic film material, and the process of manufacturing the planarization layer on the array layer can be multiplexed, so that the filling of the organic film is completed in one process.
On the basis of the above embodiment, the present embodiment further provides a method for manufacturing a display panel, where after the first trench is manufactured by the above method, at least one second trench surrounding the first trench is formed on the array layer.
The first groove and the second groove can be manufactured in the same working procedure, or the second groove can be etched after the first groove is manufactured. It is worth integrating that the first slot can isolate the extending direction of the crack, after the second slot is added, the extending of the crack can be further avoided, and the phenomenon of the crack of the pixel is avoided.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A display panel, comprising:
a substrate;
the array layer is positioned on one side surface of the substrate and comprises a thin film transistor, the thin film transistor comprises an inorganic layer, an active layer, a grid electrode, a source electrode and a drain electrode, the inorganic layer comprises a grid electrode insulating layer arranged between the active layer and the grid electrode, and the array layer further comprises an interlayer insulating layer arranged between the source electrode and the grid electrode;
a pixel defining layer located on a surface of the array layer away from the substrate, and including a plurality of pixel regions and a plurality of pixel interval regions, wherein two adjacent pixel regions are spaced apart from each other by the pixel interval regions;
support columns located on the pixel interval regions;
the array layer is provided with a first groove, the first groove penetrates through at least one inorganic layer, and the inorganic layer is disconnected at the first groove; the first trench penetrates through an interlayer insulating layer in the inorganic layer or penetrates through a gate insulating layer and an interlayer insulating layer in the inorganic layer;
the projection of the support column on the substrate is positioned in the projection of the first groove on the substrate;
the array layer is also provided with at least one second groove, and the second groove is arranged around the first groove; the first groove penetrates through the whole array layer, and the second groove only penetrates through part of the organic layer of the array layer.
2. The display panel of claim 1, further comprising:
and an organic film disposed within the first trench.
3. The display panel of claim 2, further comprising:
a planarization layer, which is positioned on the surface of the array layer away from the substrate and covers the array layer and the first groove;
correspondingly, the pixel definition layer is positioned on the surface of the planarization layer away from the array layer.
4. The display panel of claim 1, wherein a projection of the first trench onto the substrate covers a projection of the support post onto the substrate.
5. The display panel of claim 1, wherein the projection of the first groove onto the substrate is annular, and the projection of the support post onto the substrate is located within and does not intersect the annular inner ring.
6. The display panel of claim 1, wherein the second trench extends through the array layer.
7. A flexible display device comprising the display panel according to any one of claims 1 to 6.
8. A method for manufacturing a display panel, which is applied to the display panel of any one of claims 1 to 6, comprising:
providing a substrate;
forming an array layer on one side surface of the substrate, wherein the array layer comprises at least one inorganic layer, and a first groove is formed in the array layer and penetrates through at least one inorganic layer;
forming a pixel definition layer on the surface of the array layer far away from the substrate, wherein the pixel definition layer at least comprises a plurality of pixel areas and a plurality of pixel interval areas, and two adjacent pixel areas are separated from each other through the pixel interval areas;
forming support columns on part of the pixel interval regions, wherein the projection of the support columns on the substrate is positioned in the projection of the first grooves on the substrate;
further comprises: at least one second groove surrounding the first groove is formed on the array layer; the first groove penetrates through the whole array layer, and the second groove only penetrates through part of the organic layer of the array layer.
9. The method of claim 8, wherein the first trench is filled with an organic film when the first trench is opened in the array layer.
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