CN111309195B - Touch module, manufacturing method thereof and touch display device - Google Patents

Touch module, manufacturing method thereof and touch display device Download PDF

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Publication number
CN111309195B
CN111309195B CN202010106833.1A CN202010106833A CN111309195B CN 111309195 B CN111309195 B CN 111309195B CN 202010106833 A CN202010106833 A CN 202010106833A CN 111309195 B CN111309195 B CN 111309195B
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China
Prior art keywords
layer
insulating layer
groove
touch
forming
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CN111309195A (en
Inventor
闫鑫坤
樊浩原
朴叙俊
徐海峰
张则瑞
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BOE Technology Group Co Ltd
Mianyang BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Mianyang BOE Optoelectronics Technology Co Ltd
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Priority to CN202010106833.1A priority Critical patent/CN111309195B/en
Publication of CN111309195A publication Critical patent/CN111309195A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

A touch module, a manufacturing method thereof and a touch display device are provided, wherein the touch module comprises: first insulating layer, second insulating layer, electrically conductive net check layer and bridging layer, electrically conductive net check layer includes: the first touch electrodes and the second touch electrodes are arranged in a crossed and insulated mode; each first touch electrode is a strip electrode, and each second touch electrode comprises: the plurality of independent sub-electrodes are connected with adjacent sub-electrodes included in the same second touch electrode through a bridging layer; the first insulating layer is provided with a first groove, and the bridging layer is positioned in the first groove; the second insulating layer is arranged on one side of the first insulating layer, which is close to the bridge layer, and is provided with a second groove, and the conductive grid layer is positioned in the second groove. The technical scheme that this application provided sets up bridging layer and electrically conductive net layer in the recess of insulating layer for electrically conductive net layer can not take place to fracture when the touch module is buckling, has improved the bending performance of touch screen.

Description

Touch module, manufacturing method thereof and touch display device
Technical Field
The disclosure relates to the field of touch technology, and in particular, to a touch module, a manufacturing method thereof, and a touch display device.
Background
Along with the rapid development of display technology, touch screens are increasingly widely applied, and touch screens can be roughly divided into four types of resistive type, capacitive type, infrared type and acoustic wave type according to different sensing modes. The current market using amount of capacitance is the largest, and other technologies are difficult to catch up in a short period, so that the capacitance type touch screen has become the mainstream in the touch screen market and the trend of future development. The touch screen is provided with a touch electrode.
The inventor researches that the touch electrode in the touch screen in the related technology is broken in the bending process, so that the bending performance of the touch screen is poor.
Disclosure of Invention
The application provides a touch module, a manufacturing method thereof and a touch display device, and bending performance of a touch screen can be improved.
In a first aspect, the present application provides a touch module, including: first insulating layer, second insulating layer, electrically conductive net layer and bridging layer, electrically conductive net layer includes: the first touch electrodes and the second touch electrodes are arranged in a crossed and insulated mode; each first touch electrode is a strip electrode, and each second touch electrode comprises: the plurality of independent sub-electrodes are connected with adjacent sub-electrodes included in the same second touch electrode through a bridging layer;
the first insulating layer is provided with a first groove, and the bridging layer is positioned in the first groove; the second insulating layer is arranged on one side of the first insulating layer, which is close to the bridging layer, and is provided with a second groove, and the conductive grid layer is positioned in the second groove.
In one possible implementation, the second groove includes: the touch control device comprises a plurality of first sub-grooves and a plurality of second sub-grooves, wherein the first sub-grooves are in one-to-one correspondence with the first touch control electrodes, the first touch control electrodes are positioned in the corresponding first sub-grooves, the second sub-grooves are in one-to-one correspondence with the second touch control electrodes, and the second touch control electrodes are positioned in the corresponding second sub-grooves;
the second insulating layer is also provided with a via hole, and the sub-electrode in the second touch electrode is connected with the bridging layer through the via hole.
In one possible implementation, the thickness of the first sub-groove is less than or equal to the thickness of the second insulating layer, and the thickness of the second sub-groove is less than the thickness of the second insulating layer.
In one possible implementation manner, the orthographic projection of the first sub-groove on the first insulating layer overlaps with the orthographic projection of the first groove on the first insulating layer, and the orthographic projection of the second sub-groove on the first insulating layer overlaps with the orthographic projection of the first groove on the first insulating layer.
In one possible implementation, the first insulating layer and the second insulating layer are organic layers.
In one possible implementation manner, the first touch electrode and the second touch electrode are metal electrodes, and the bridging layer is made of metal.
In one possible implementation manner, the touch module further includes: a protective layer;
the protective layer is positioned on one side of the conductive grid layer away from the second insulating layer and is used for protecting the conductive grid layer.
In a second aspect, the present application further provides a method for manufacturing a touch module, which is used for manufacturing the touch module, and the method includes:
forming a first insulating layer provided with a first groove;
forming a bridging layer in the first groove of the first insulating layer;
forming a second insulating layer provided with a second groove on one side of the first insulating layer, which is close to the bridging layer;
and forming a conductive grid layer connected with the bridging layer in the second groove of the second insulating layer.
In one possible implementation manner, the forming the first insulating layer provided with the first groove includes:
forming a first organic thin film;
processing the first organic film through a photoetching process to form a first insulating layer provided with a first groove;
the forming of the second insulating layer with the second groove on the side of the first insulating layer, which is close to the bridging layer, includes:
forming a second organic film on one side of the first insulating layer, which is close to the bridging layer;
and processing the second organic film through a photoetching process to form a second insulating layer provided with a second groove.
In one possible implementation manner, the forming a bridging layer in the first groove of the first insulating layer includes:
forming a first metal film on the first insulating layer;
processing the first metal film through a patterning process to form a bridging layer;
the forming the conductive mesh layer in the second groove of the second insulating layer includes:
forming a second metal film on the second insulating layer;
and processing the second metal film through a patterning process to form the conductive grid layer.
In one possible implementation manner, the processing the second organic thin film through a photolithography process to form the second insulating layer with the second groove includes:
processing the second organic film by adopting the first mask plate through a photoetching process, and forming a second groove on the second organic film;
and processing the second organic film with the second groove by adopting a second mask plate through a photoetching process to form a via hole.
In one possible implementation manner, after the forming the conductive grid layer in the second groove of the second insulating layer, the method further includes:
forming a protective film on the conductive grid layer;
processing the protective film through a photoetching process to form an original protective layer;
and baking the original protective layer to form the protective layer.
In a third aspect, the present application further provides a touch display device, including: the touch module is provided.
The application provides a touch module, a manufacturing method thereof and a touch display device, wherein the touch module comprises: first insulating layer, second insulating layer, electrically conductive net check layer and bridging layer, electrically conductive net check layer includes: the first touch electrodes and the second touch electrodes are arranged in a crossed and insulated mode; each first touch electrode is a strip electrode, and each second touch electrode comprises: the plurality of independent sub-electrodes are connected with adjacent sub-electrodes included in the same second touch electrode through a bridging layer; the first insulating layer is provided with a first groove, and the bridging layer is positioned in the first groove; the second insulating layer is arranged on one side of the first insulating layer, which is close to the bridge layer, and is provided with a second groove, and the conductive grid layer is positioned in the second groove. The technical scheme that this application provided sets up bridging layer and electrically conductive net layer in the recess of insulating layer, can release in situ and interlaminar stress for electrically conductive net layer can not take place to fracture when the touch module is buckling, has improved the bending property of touch screen.
Drawings
The accompanying drawings are included to provide an understanding of the technical aspects of the present application, and are incorporated in and constitute a part of this specification, illustrate the technical aspects of the present application and together with the examples of the present application, and not constitute a limitation of the technical aspects of the present application.
Fig. 1 is a top view of a touch module provided in an embodiment of the present application;
FIG. 2A is a cross-sectional view taken along line A-A of FIG. 1;
FIG. 2B is a cross-sectional view taken along the direction B-B of FIG. 1;
FIG. 2C is a cross-sectional view of FIG. 1 taken along the direction C-C;
FIG. 2D is a cross-sectional view of FIG. 1 taken along the direction D-D;
FIG. 3 is a top view of a second insulating layer provided by an exemplary embodiment;
FIG. 4A is a first cross-sectional view of a touch module according to an exemplary embodiment;
FIG. 4B is a second cross-sectional view of a touch module according to an exemplary embodiment;
FIG. 4C is a third cross-sectional view of a touch module according to an exemplary embodiment;
FIG. 4D is a fourth cross-sectional view of a touch module according to an exemplary embodiment;
fig. 5 is a flowchart of a method for manufacturing a touch module according to an embodiment of the present disclosure;
FIG. 6A is a schematic diagram illustrating a method for manufacturing a touch module according to an exemplary embodiment;
FIG. 6B is a schematic diagram illustrating a method for manufacturing a touch module according to an exemplary embodiment;
fig. 6C is a schematic diagram of a manufacturing method of a touch module according to an exemplary embodiment.
Detailed Description
The present application describes a number of embodiments, but the description is illustrative and not limiting and it will be apparent to those of ordinary skill in the art that many more embodiments and implementations are possible within the scope of the embodiments described herein. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are possible. Any feature or element of any embodiment may be used in combination with or in place of any other feature or element of any other embodiment unless specifically limited.
The present application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements of the present disclosure may also be combined with any conventional features or elements to form a unique claim as defined by the claims. Any feature or element of any embodiment may also be combined with features or elements from other claims to form another unique claim as defined in the claims. Thus, it should be understood that any of the features shown and/or discussed in this application may be implemented alone or in any suitable combination. Accordingly, the embodiments are not to be restricted except in light of the attached claims and their equivalents. Further, various modifications and changes may be made within the scope of the appended claims.
Furthermore, in describing representative embodiments, the specification may have presented the method and/or process as a particular sequence of steps. However, to the extent that the method or process does not depend on the particular order of steps herein, the method or process should not be limited to the particular order of steps. Other sequences of steps are possible as will be appreciated by those of ordinary skill in the art. Accordingly, the particular order of the steps set forth in the specification should not be construed as limitations on the claims. Furthermore, the claims directed to the method and/or process should not be limited to the performance of their steps in the order written, and one skilled in the art can readily appreciate that the sequences may be varied and still remain within the spirit and scope of the embodiments of the present application.
Unless otherwise defined, technical or scientific terms used in the disclosure of the embodiments of the present application should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present application belongs. The terms "first," "second," and the like, as used in embodiments of the present application, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to denote relative positional relationships, which may also change accordingly when the absolute position of the object being described changes.
Fig. 1 is a top view of a touch module provided in an embodiment of the present application, fig. 2A is a cross-sectional view along A-A direction of fig. 1, fig. 2B is a cross-sectional view along B-B direction of fig. 1, fig. 2C is a cross-sectional view along C-C direction of fig. 1, and fig. 2D is a cross-sectional view along D-D direction of fig. 1. As shown in fig. 1 and 2, the touch module provided in the embodiment of the present application includes: a first insulating layer 10, a second insulating layer 20, a bridging layer 30 and a conductive mesh layer 40.
The first insulating layer 10 is provided with a first groove V1, and the bridging layer 30 is positioned in the first groove V1; the second insulating layer 10 is disposed on a side of the first insulating layer 10 near the bridge layer 30, and a second groove V2 is formed, and the conductive grid layer 40 is connected in the second groove V2.
As shown in fig. 1, in one exemplary embodiment, the conductive mesh layer 40 includes: a plurality of first touch electrodes 41 and a plurality of second touch electrodes 42 disposed to cross and insulate.
Each of the first touch electrodes 41 is a strip electrode, and each of the second touch electrodes 42 includes: the plurality of independent sub-electrodes 420, adjacent sub-electrodes included in the same second touch electrode are connected through the bridging layer 30.
In an exemplary embodiment, the first touch electrode may be a driving electrode, the second touch electrode may be a sensing electrode, or the first touch electrode may be a sensing electrode, and the second touch electrode is a driving electrode.
The touch module provided in the embodiment of the application includes: first insulating layer, second insulating layer, electrically conductive net check layer and bridging layer, electrically conductive net check layer includes: the first touch electrodes and the second touch electrodes are arranged in a crossed and insulated mode; each first touch electrode is a strip electrode, and each second touch electrode comprises: the plurality of independent sub-electrodes are connected with adjacent sub-electrodes included in the same second touch electrode through a bridging layer; the first insulating layer is provided with a first groove, and the bridging layer is positioned in the first groove; the second insulating layer is arranged on one side of the first insulating layer, which is close to the bridge layer, and is provided with a second groove, and the conductive grid layer is positioned in the second groove. The technical scheme that this application provided sets up bridging layer and electrically conductive net layer in the recess of insulating layer, can release in situ and interlaminar stress for electrically conductive net layer can not take place to fracture when the touch module is buckling, has improved the bending property of touch screen.
Fig. 3 is a top view of a second insulating layer provided in an exemplary embodiment, and as shown in fig. 2A, 2B, and 3, a second groove V2 in the second insulating layer 20 includes: the touch panel comprises a plurality of first sub-grooves V21 and a plurality of second sub-grooves V22, wherein the first sub-grooves V21 are in one-to-one correspondence with the first touch electrodes, the first touch electrodes are positioned in the corresponding first sub-grooves, the second sub-grooves V22 are in one-to-one correspondence with the second touch electrodes, and the second touch electrodes are positioned in the corresponding second sub-grooves.
As shown in fig. 2A, the second insulating layer 20 is further provided with a via hole, and the sub-electrodes in the second touch electrode 42 are connected to the bridge layer 30 through the via hole.
In an exemplary embodiment, the depth D1 of the first sub-groove V21 is less than or equal to the thickness H of the second insulating layer 20, and fig. 2B illustrates an example in which the depth of the first sub-groove V21 is equal to the thickness of the second insulating layer.
In one exemplary embodiment, the depth D2 of the second sub-groove V22 is less than the thickness H of the second insulating layer 20.
In one exemplary embodiment, the orthographic projection of the first sub-groove on the first insulating layer overlaps with the orthographic projection of the first groove on the first insulating layer, and the orthographic projection of the second sub-groove on the first insulating layer overlaps with the orthographic projection of the first groove on the first insulating layer.
In an exemplary embodiment, the first insulating layer and the second insulating layer are organic layers, and the organic layers are made of materials including: negative photoresist.
According to the touch module, the first insulating layer and the second insulating layer are organic layers, the adhesive force between the first insulating layer and the second insulating layer is enhanced, the processes of deposition, etching, stripping and the like can be reduced, the manufacturing process of the touch module is simplified, and the technical problems that the gradient angle is difficult to adjust, the etching uniformity is poor and the film layer is easy to break can be avoided.
In one possible implementation manner, the first touch electrode and the second touch electrode are metal electrodes, and the bridging layer is made of metal, where the first touch electrode, the second touch electrode and the bridging layer may be a single-layer metal structure or may be a multi-layer metal structure. When in a single layer metal structure, the metal may be aluminum, silver, or the like. When the touch screen is of a multilayer metal structure, the first touch electrode, the second touch electrode and the bridging layer respectively comprise: the first metal layer, the second metal layer and the third metal layer are stacked, wherein the manufacturing material of the first metal layer and the third metal layer can be titanium, and the manufacturing material of the second metal layer can be aluminum.
Because the metal material has better ductility, be difficult for the fracture, therefore this application adopts metal material preparation conductive grid layer and bridging layer, can improve touch module's flexible performance for touch module is more suitable for flexible display device.
Fig. 4A is a first cross-sectional view of a touch module provided by an exemplary embodiment, fig. 4B is a second cross-sectional view of a touch module provided by an exemplary embodiment, fig. 4C is a third cross-sectional view of a touch module provided by an exemplary embodiment, fig. 4D is a fourth cross-sectional view of a touch module provided by an exemplary embodiment, and as shown in fig. 4, the touch module provided by an exemplary embodiment further includes: and a protective layer 50.
The protective layer 50 is located on a side of the conductive mesh layer 40 away from the second insulating layer 20, for protecting the conductive mesh layer 40.
In an exemplary embodiment, the protective layer is made of an organic material, which may be a negative photoresist to isolate water and oxygen.
Fig. 5 is a flowchart of a method for manufacturing a touch module according to an embodiment of the present application. As shown in fig. 5, the method for manufacturing a touch module provided in the embodiment of the present application is used for manufacturing a touch module, and specifically includes the following steps:
step S1, forming a first insulating layer provided with a first groove.
And S2, forming a bridging layer in the first groove of the first insulating layer.
And S3, forming a second insulating layer provided with a second groove on one side of the first insulating layer close to the bridge layer.
And S4, forming a conductive grid layer connected with the bridging layer in the second groove of the second insulating layer.
The manufacturing method of the touch module provided by the embodiment of the present application is used for manufacturing the touch module provided by the foregoing embodiment, and the implementation principle and the implementation effect are similar and are not repeated here.
For convenience of description, the photolithography process in the embodiment of the present application includes: an exposure and development process, a patterning process comprising: photoresist coating, exposure, development, etching and stripping processes.
In an exemplary embodiment, step S1 includes: forming a first organic thin film; and processing the first organic film through a photoetching process to form a first insulating layer provided with a first groove.
Forming the first organic thin film includes: the first organic film is coated.
In an exemplary embodiment, step S2 includes: forming a first metal film on the first insulating layer; and processing the first metal film through a patterning process to form a bridging layer.
Forming a first metal film on the first insulating layer includes: a first metal film is deposited on the first insulating layer.
In an exemplary embodiment, step S3 includes: forming a second organic film on one side of the first insulating layer, which is close to the bridging layer; and processing the second organic film through a photoetching process to form a second insulating layer provided with a second groove.
Forming the second organic thin film on a side of the first insulating layer near the bridging layer includes: and coating a second organic film on one side of the first insulating layer, which is close to the bridging layer.
Processing the second organic film through a photolithography process, forming a second insulating layer provided with a second groove includes: processing the second organic film by adopting the first mask plate through a photoetching process, and forming a second groove on the second organic film; and processing the second organic film with the second groove by adopting a second mask plate through a photoetching process to form a via hole.
In an exemplary embodiment, step S4 includes: forming a second metal film on the second insulating layer; and processing the second metal film through a patterning process to form the conductive grid layer.
The method for manufacturing a touch module provided in an exemplary embodiment further includes, after step S4: forming a protective film on the conductive grid layer; processing the protective film through a photoetching process to form an original protective layer; and baking the original protective layer to form the protective layer.
The method for manufacturing the touch module is further described below with reference to fig. 6A to 6C.
Step 100, a first organic film is coated, and the first organic film is processed by a photolithography process to form a first insulating layer 10 with a first groove V1, as shown in fig. 6A.
Step 200, depositing a first metal film on the first insulating layer 10, and processing the first metal film through a patterning process to form a bridge layer 30, as shown in fig. 6B.
In step 300, a second organic film is coated on a side of the first insulating layer 10 near the bridge layer 30, and the second organic film is processed by photolithography to form a second insulating layer 20 with a second groove V2 and a via hole, as shown in fig. 6C.
Step 400, depositing a second metal film on the second insulating layer 20, and processing the second metal film through a patterning process to form the conductive grid layer 40, as shown in fig. 2A.
Step 500, forming a protective film on the conductive mesh layer 40; processing the protective film through a photoetching process to form an original protective layer; the original protective layer is baked to form the protective layer 50 as shown in fig. 4A.
The embodiment of the application also provides a touch display device, which comprises: and a touch control module.
The touch display device further includes: the display panel and the touch control module are positioned on one side of the display panel.
The touch module is the touch module provided in the foregoing embodiment, and the implementation principle and the implementation effect are similar, and are not described herein again.
In an exemplary embodiment, the touch module may be located at the light emitting side of the display panel, or may be located at the light entering side of the display panel.
In an exemplary embodiment, the display panel may be a display panel applied to a liquid crystal display device, a display panel applied to an organic light emitting diode display device, or a display panel applied to other types of display devices.
The drawings in the embodiments of the present application relate only to the structures to which the embodiments of the present application relate, and reference may be made to the general design for other structures.
In the drawings used to describe embodiments of the present application, the thickness and size of layers or microstructures are exaggerated for clarity. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
Although the embodiments disclosed in the present application are described above, the embodiments are only used for facilitating understanding of the present application, and are not intended to limit the present application. Any person skilled in the art to which this application pertains will be able to make any modifications and variations in form and detail of implementation without departing from the spirit and scope of the disclosure, but the scope of the application is still subject to the scope of the claims appended hereto.

Claims (13)

1. The utility model provides a touch module which characterized in that includes: first insulating layer, second insulating layer, electrically conductive net layer and bridging layer, electrically conductive net layer includes: the first touch electrodes and the second touch electrodes are arranged in a crossed and insulated mode; each first touch electrode is a strip electrode, and each second touch electrode comprises: the plurality of independent sub-electrodes are connected with adjacent sub-electrodes included in the same second touch electrode through a bridging layer;
the first insulating layer is provided with a first groove, and the bridging layer is positioned in the first groove; the second insulating layer is arranged on one side of the first insulating layer, which is close to the bridging layer, and is provided with a second groove, and the conductive grid layer is positioned in the second groove.
2. The touch module of claim 1, wherein the second recess comprises: the touch control device comprises a plurality of first sub-grooves and a plurality of second sub-grooves, wherein the first sub-grooves are in one-to-one correspondence with the first touch control electrodes, the first touch control electrodes are positioned in the corresponding first sub-grooves, the second sub-grooves are in one-to-one correspondence with the second touch control electrodes, and the second touch control electrodes are positioned in the corresponding second sub-grooves;
the second insulating layer is also provided with a via hole, and the sub-electrode in the second touch electrode is connected with the bridging layer through the via hole.
3. The touch module of claim 2, wherein the first sub-groove has a thickness less than or equal to a thickness of the second insulating layer, and the second sub-groove has a thickness less than the thickness of the second insulating layer.
4. The touch module of claim 2, wherein the orthographic projection of the first sub-groove on the first insulating layer overlaps the orthographic projection of the first groove on the first insulating layer, and wherein the orthographic projection of the second sub-groove on the first insulating layer overlaps the orthographic projection of the first groove on the first insulating layer.
5. The touch module of claim 1, wherein the first insulating layer and the second insulating layer are organic layers.
6. The touch module of claim 1, wherein the first touch electrode and the second touch electrode are metal electrodes, and the bridging layer is made of metal.
7. The touch module of claim 1, further comprising: a protective layer;
the protective layer is positioned on one side of the conductive grid layer away from the second insulating layer and is used for protecting the conductive grid layer.
8. A method for manufacturing a touch module according to any one of claims 1 to 7, the method comprising:
forming a first insulating layer provided with a first groove;
forming a bridging layer in the first groove of the first insulating layer;
forming a second insulating layer provided with a second groove on one side of the first insulating layer close to the bridge layer;
and forming a conductive grid layer connected with the bridging layer in the second groove of the second insulating layer.
9. The method of claim 8, wherein forming the first insulating layer with the first recess comprises:
forming a first organic thin film;
processing the first organic film through a photoetching process to form a first insulating layer provided with a first groove;
the forming of the second insulating layer with the second groove on the side of the first insulating layer, which is close to the bridging layer, includes:
forming a second organic film on one side of the first insulating layer, which is close to the bridging layer;
and processing the second organic film through a photoetching process to form a second insulating layer provided with a second groove.
10. The method of claim 8, wherein forming a bridging layer within the first recess of the first insulating layer comprises:
forming a first metal film on the first insulating layer;
processing the first metal film through a patterning process to form a bridging layer;
the forming the conductive mesh layer in the second groove of the second insulating layer includes:
forming a second metal film on the second insulating layer;
and processing the second metal film through a patterning process to form the conductive grid layer.
11. The method of claim 9, wherein processing the second organic thin film by a photolithography process to form a second insulating layer provided with a second groove comprises:
processing the second organic film by adopting the first mask plate through a photoetching process, and forming a second groove on the second organic film;
and processing the second organic film with the second groove by adopting a second mask plate through a photoetching process to form a via hole.
12. The method of claim 8, wherein after forming the conductive mesh layer within the second recess of the second insulating layer, the method further comprises:
forming a protective film on the conductive grid layer;
processing the protective film through a photoetching process to form an original protective layer;
and baking the original protective layer to form the protective layer.
13. A touch display device, comprising: the touch module of any one of claims 1 to 7.
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