CN111307666A - Solder paste viscosity testing method and solder paste viscosity testing device - Google Patents
Solder paste viscosity testing method and solder paste viscosity testing device Download PDFInfo
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- CN111307666A CN111307666A CN202010197812.5A CN202010197812A CN111307666A CN 111307666 A CN111307666 A CN 111307666A CN 202010197812 A CN202010197812 A CN 202010197812A CN 111307666 A CN111307666 A CN 111307666A
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Abstract
The application provides a solder paste viscosity testing method which comprises the steps of providing a first testing probe and solder paste with a first packaging specification; providing a second test probe and solder paste of a second packaging specification; directly carrying out viscosity test on the solder paste with the first packaging specification by using the first test probe and outputting a first test result; and directly carrying out viscosity test on the solder paste with the second packaging specification by using the second test probe and outputting a second test result. According to the tin paste viscosity testing method provided by the embodiment of the application, the viscosity of the tin paste of the first package specification is directly tested through the first testing probe, the viscosity of the tin paste of the second package specification is directly tested through the second testing probe, and the tin paste viscosity test can be completed without transferring out the tin paste from the package. The problem of tin cream waste caused by the fact that the tin cream needs to be transferred when viscosity testing is carried out due to different tin cream packaging specifications can be reduced.
Description
Technical Field
The application relates to the technical field of viscosity testing, in particular to a solder paste viscosity testing method and a solder paste viscosity testing device.
Background
The viscosity of solder paste is a main characteristic index of the quality of solder paste, and is also an important factor affecting printing performance. The tin paste with too high viscosity is not easy to penetrate through a leak hole of the template, and the printed pattern is incomplete; if the viscosity is too low, the solder paste is liable to fall off during printing. Although the solder paste on the market is identified, the quality of the solder paste is deteriorated along with transportation and long-term storage. The SMT plant samples the viscosity after each batch of solder paste is received.
In the related art, when the viscosity of the solder paste is tested, the solder paste needs to be poured into an empty pot for testing, and the solder paste is poured back for storage or use after the test is finished, so that the problems of solder paste waste and low testing efficiency exist. In addition, the empty can for testing the solder paste is not easy to clean, the test result is influenced, and if the empty can for testing is frequently replaced, the resource waste is caused.
Disclosure of Invention
The technical problem to be solved by the application is to provide a solder paste viscosity testing method and a solder paste viscosity testing device, and the defects that the solder paste viscosity testing efficiency is low and resources are wasted are solved.
The embodiment of the application provides a solder paste viscosity testing method, which comprises the steps of providing a first testing probe and solder paste with a first packaging specification; providing a second test probe and solder paste of a second packaging specification; directly carrying out viscosity test on the solder paste with the first packaging specification by using the first test probe and outputting a first test result; directly carrying out viscosity test on the solder paste with the second packaging specification by using the second test probe and outputting a second test result; and fitting the first test result with the viscosity curve of the first test probe to obtain the viscosity of the solder paste of the first package specification, and fitting the second test result with the viscosity curve of the second test probe to obtain the viscosity of the solder paste of the second package specification.
The embodiment of the application also provides a solder paste viscosity testing device, which comprises a shell and a mounting seat, wherein the mounting seat is arranged in the inner space of the shell and is used for mounting a testing probe; the test probe is detachably connected with the mounting seat to realize the solder paste viscosity test method in the embodiment.
According to the tin paste viscosity testing method provided by the embodiment of the application, the viscosity of the tin paste of the first package specification is directly tested through the first testing probe, the viscosity of the tin paste of the second package specification is directly tested through the second testing probe, and the tin paste viscosity test can be completed without transferring out the tin paste from the package. The problem of tin cream waste caused by the fact that the tin cream needs to be transferred when viscosity testing is carried out due to different tin cream packaging specifications can be reduced. In addition, the solder paste testing method provided by the embodiment of the application does not need to transfer the solder paste into the universal container for solder paste viscosity testing, avoids container waste caused by frequent container replacement, and saves testing cost.
The solder paste viscosity testing device provided by the embodiment of the application, through the testing probe which can be detachably connected, different testing probes are corresponding to solder pastes of different packaging specifications, and the problems of solder paste waste and low efficiency caused by a conventional solder paste viscosity testing mode are avoided. Meanwhile, cross contamination caused by the fact that the same test probe tests the solder pastes with different packaging specifications can be avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for measuring viscosity of solder paste in some embodiments of the present application;
FIG. 2 is a schematic flow chart of a method for measuring viscosity of solder paste according to another embodiment of the present disclosure;
FIG. 3 is a schematic flow chart illustrating the process of determining whether a test probe meets requirements in other embodiments of the present application;
FIG. 4 is a schematic flow chart of a method for measuring viscosity of solder paste according to further embodiments of the present disclosure;
FIG. 5 is a schematic flow chart of a method for measuring viscosity of solder paste according to further embodiments of the present disclosure;
FIG. 6 is a schematic structural diagram of a solder paste viscosity testing apparatus according to another embodiment of the present disclosure;
FIG. 7 is a schematic diagram of the operation of a solder paste viscosity testing apparatus according to another embodiment of the present disclosure.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
It should be noted that, a general solder paste viscosity test procedure is as follows: opening the tin cream viscosity tester, installing a test probe, pouring the tube-packed tin cream into a tin cream bottle, placing the tin cream bottle into the tester for testing, outputting a test result, cleaning the test head, pouring the tin cream in the tin cream bottle into an original package, cleaning and recovering the test head.
Applicants have found in their research that the above-described solder paste viscosity test method is generally applicable only to certain types of packaged solder pastes. For example, a solder paste viscosity tester is suitable for canned solder paste, when the canned solder paste needs to be measured, the canned solder paste needs to be poured into an empty pot first, and then the canned solder paste is poured back again after the viscosity is measured and is stored or used, so that the problems of solder paste waste and low test efficiency exist. In addition, the empty can for testing needs to be cleaned, otherwise, the test result is influenced, the tin paste to be tested is polluted, and the empty can needs to be replaced regularly to avoid poor cleaning effect, so that resource waste is caused.
Based on the problems, the applicant further researches and discovers that if the viscosity test of the solder paste can be completed without transferring the solder paste, the problems of waste of the solder paste and low test efficiency can be avoided, and the solder paste to be tested can not be polluted and resources can not be wasted.
In view of the above, some embodiments of the present application provide a method for testing viscosity of solder paste, and in particular, please refer to fig. 1, fig. 1 is a schematic flow chart of the method for testing viscosity of solder paste in some embodiments of the present application, the method generally includes the following steps:
s101, providing a first test probe and solder paste with a first packaging specification. Specifically, a first test probe is used to test the viscosity of solder paste for a first package size, and the operating principle thereof generally comprises: a motor for driving the rotor to rotate, the motor driving a rotor to rotate continuously in the fluid through a calibrated spring, the torsional degree of the spring, i.e. the torque, measured by the rotary torque sensor is proportional to the resistance of the rotor immersed in the solder paste test liquid due to viscous drag. The torque is also in direct proportion to the viscosity of the solder paste test liquid, and the viscosity of the solder paste can be measured through signals transmitted by different torques.
It will be appreciated that a single test probe is limited by the range of rotation of the rotor and the spring torque and is generally only capable of viscosity testing solder paste test fluids in the same environment. For example, solder paste test liquids of different packaging specifications are respectively poured into containers of the same specification, and the amount of the solder paste test liquids is substantially consistent, so that a single test probe can be used for viscosity test of the solder pastes of different packaging specifications. Obviously, the technical problem exists in the testing mode. Based on this, in order to adapt to the tin cream of different packing specifications, adopt the test probe that suits with tin cream packing specification, the tin cream need not pour into general container, and the test probe can directly carry out viscosity test to the tin cream of packing specification that suits with it.
Further, for solder pastes of different packaging specifications, in step S101, a solder paste of one packaging specification, that is, a solder paste of a first packaging specification, is provided, and the first test probe is adapted to the solder paste of the first packaging specification, so that the first test probe can directly perform viscosity test on the solder paste of the first packaging specification.
Specifically, the solder paste of the first package size may be, for example, a tin paste of a can package, a tin paste of a tube package, or a solder paste of another package size. It should be understood that first test probe and the tin cream looks adaptation of first packing specification, first test probe can directly stretch into the tin cream that has first packing specification promptly and carry out the viscosity test, need not to pour the tin cream in the packing into general container in, can make things convenient for the test of tin cream viscosity like this, and can not cause the waste of tin cream.
And S102, providing a second test probe and solder paste with a second packaging specification. Specifically, the second test probe is used for testing the viscosity of the solder paste of the second package specification, and the working principle of the second test probe substantially comprises the following steps: a motor for driving the rotor to rotate, the motor driving a rotor to rotate continuously in the fluid through a calibrated spring, the torsional degree of the spring, i.e. the torque, measured by the rotary torque sensor is proportional to the resistance of the rotor immersed in the solder paste test liquid due to viscous drag. The torque is also in direct proportion to the viscosity of the solder paste test liquid, and the viscosity of the solder paste can be measured through signals transmitted by different torques.
Further, for the solder pastes of different packaging specifications, in step S102, one of the packaging specifications, i.e., the second packaging specification, of the solder paste is provided, and the second test probe is adapted to the second packaging specification of the solder paste, so that the second test probe can directly perform viscosity test on the second packaging specification of the solder paste.
Specifically, the solder paste of the second package format may be, for example, a tin paste of a can package, a tin paste of a tube package, or a solder paste of another package format. It should be understood that the second test probe and the tin cream looks adaptation of second packing specification, the second test probe can directly stretch into the tin cream that has the second packing specification promptly and carry out the viscosity test, need not to pour the tin cream in the packing into general container in, can make things convenient for the test of tin cream viscosity like this, and can not cause the waste of tin cream.
The first packaging specification and the second packaging specification may be the same packaging specification or different packaging specifications. For example, the first package format is a tube-in-tube package and the second package format is a can-in-package; or the first package specification and the second package specification are both can-packs.
When the first package specification is the tube package, the second package specification is the canning packing, and first test probe can directly stretch into in the tin cream of tube package and carry out the viscosity test, and the second test probe can directly stretch into in the tin cream of canning packing and carry out the viscosity test. When both the first package format and the second package format are canned packages, it will be appreciated that the first test probe and the second test probe are substantially identical and each can be extended into the solder paste of the first package format and the second package format for viscosity testing. At this time, the first test probe can be used for viscosity test of the first batch of solder paste, and the second test probe can be used for viscosity test of the second batch of solder paste, so that the influence of viscosity difference among different batches on the accuracy of the test result can be avoided.
It can be understood that the viscosity of the solder paste is a main characteristic index of the quality of the solder paste and is also an important factor influencing the printing performance, the solder paste with too high viscosity is not easy to penetrate through a leak hole of a template, and the printed pattern is incomplete; if the viscosity is too low, the solder paste is liable to fall off during printing. The quality of the solder paste may deteriorate with transportation and long-term storage, and different batches of solder paste of the same packaging specification may have different viscosities. The common test probe is used for testing different batches of solder pastes, and the probe needs to be cleaned frequently so as to avoid mutual pollution of the different batches of solder pastes.
Further, the solder paste of the first package specification and the solder paste of the second package specification may be solder pastes of the same viscosity or solder pastes of different viscosities. The different packaging specifications do not mean different viscosity of the solder paste, and the solder paste with the same viscosity can be packaged by being divided into different packaging specifications under the limitation of different transportation modes and different storage scene conditions.
It is to be understood that the terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature.
S103, directly carrying out viscosity test on the solder paste with the first packaging specification by using the first test probe and outputting a first test result.
Specifically, the package is opened for the solder paste of the first package specification, so that the rotor capable of accommodating the first test probe can extend into the package of the solder paste, the first test probe moves in the solder paste of the first package specification to perform viscosity test, and a first test result is output through the sensing device.
Further, the movable range of the first test probe is adjusted, so that the rotor of the first test probe can be immersed in the solder paste to move up and down between areas with the depth of 0.3 cm-2.8 cm. It should be noted that the distance between the rotor of the first test probe and the bottom of the solder paste package is typically not less than 1 cm. The motor drives the first test probe to start viscosity test and output a first test result.
And S104, directly carrying out viscosity test on the solder paste with the second packaging specification by using a second test probe and outputting a second test result.
Specifically, the package is opened for the solder paste of the second package specification, so that the rotor capable of accommodating the second test probe can extend into the package of the solder paste, the second test probe moves in the solder paste of the second package specification to perform the viscosity test, and the second test result is output through the sensing device.
Further, the movable range of the second test probe is adjusted, so that the rotor of the second test probe can be immersed in the solder paste to move up and down between the areas with the depth of 0.3 cm-2.8 cm. It should be noted that the distance between the rotor of the second test probe and the bottom of the solder paste package is typically not less than 1 cm. And the motor drives the second test probe to start viscosity test and output a second test result.
It should be noted that, in the process of performing the viscosity test, the resistance formed by the viscous drag of the rotor by the solder paste generally changes in a curve, so the viscosity test process generally lasts for a period of time, and when the resistance formed by the viscous drag of the rotor by the solder paste exhibits a stable value or changes regularly, the viscosity test is completed and the test result is output.
In one aspect, the viscosity change during the test can be continuously recorded, and the test time can be set for a plurality of cycles, for example, one cycle for one up and down movement of the test probe. Taking the maximum and minimum viscosity values measured in the previous two periods, and respectively recording the maximum and minimum viscosity values as N1 and N2; the maximum and minimum viscosity values measured two cycles later were recorded as N3 and N4, respectively. And calculating the viscosity values Y1 and Y2 of the solder paste according to the formula of Y1 ═ N1+ N2)/2, and Y2 ═ N3+ N4)/2. If the Y1 is less than or equal to (1+ 10%) Y2, the final viscosity of the solder paste is recorded as Y2; if Y1 > (1+ 10%) Y2, the result is regarded as invalid, and the test is carried out again after the solder paste is stable in standing, and the result is judged according to the mode.
On the other hand, the test result may be output when the test result is stable for a certain period of time and no longer varies during the continuous viscosity test.
In the embodiment of the application, the viscosity of the solder paste of the first package specification can be obtained by fitting the first test result and the viscosity curve of the first test probe, and the viscosity of the solder paste of the second package specification can be obtained by fitting the second test result and the viscosity curve of the second test probe.
The tin cream viscosity test method provided by the embodiment of the application directly carries out viscosity test to the tin cream of first package specification through first test probe, and the second test probe directly carries out viscosity test to the tin cream of second package specification, can realize need not to follow the packing adversion and shift out the tin cream and can accomplish the tin cream viscosity test, can reduce because of the tin cream package specification is different, need shift the extravagant problem of tin cream that the tin cream caused when carrying out the viscosity test. In addition, the solder paste testing method provided by the embodiment of the application does not need to transfer the solder paste into the universal container for solder paste viscosity testing, avoids container waste caused by frequent container replacement, and saves testing cost.
It can be understood that the solder paste viscosity testing device can record and call a plurality of viscosity curves for different testing probes, and different testing probes need to be checked before use, so that the accuracy of a testing result is guaranteed.
Referring to fig. 2, fig. 2 is a schematic flow chart of a solder paste viscosity testing method according to another embodiment of the present application, the solder paste viscosity testing method generally includes the following steps:
s201, verifying the first test probe and the second test probe, and recording a viscosity curve of the first test probe and a viscosity curve of the second test probe.
Specifically, viscosity curves of the first test probe and the second test probe are obtained through verification, and the viscosity curves obtained through verification are recorded and stored. When carrying out solder paste viscosity test, need not to check-up temporarily to promote solder paste viscosity efficiency of software testing, it is extravagant to reduce the solder paste.
Further, verifying the first test probe and the second test probe generally includes the following steps: providing standard liquid, directly performing viscosity test on the standard liquid by using a first test probe and a second test probe respectively, outputting a test result, comparing the test result with the viscosity of the standard liquid, and judging whether the first test probe and the second test probe respectively meet the requirements.
It will be appreciated that the standard fluid may be a universal solder paste standard test fluid for use in verifying the test probe prior to a solder paste viscosity test to determine whether the test probe meets the requirements. When the test result of the test probe meets the requirement, the solder paste viscosity test can be performed, i.e. the steps S202 to S205 are performed.
S202, providing a first test probe and solder paste with a first packaging specification. Step S202 is substantially the same as step S101, and the description of the embodiment of the present application is not repeated.
And S203, providing a second test probe and solder paste with a second packaging specification. Step S203 is substantially the same as step S102, and the description of the embodiment of the present application is not repeated.
S204, directly carrying out viscosity test on the solder paste with the first packaging specification by using the first test probe and outputting a first test result. Step S204 is substantially the same as step S103, and the description of the embodiment of the present application is not repeated.
S205, directly carrying out viscosity test on the solder paste with the second packaging specification by using a second test probe and outputting a second test result. Step S205 is substantially the same as step S104, and the description of the embodiment of the present application is not repeated.
In other embodiments of the present application, the first test probe enters the calibration mode when the test results of the first test probe are unsatisfactory. In other words, determining whether the first test probe and the second test probe respectively meet the requirements includes: when the test result of the second test probe meets the requirement, the viscosity test of the solder paste can be carried out; and when the test result of the first test probe does not meet the requirement, the first test probe enters a calibration mode.
Specifically, referring to fig. 3, fig. 3 is a schematic flow chart illustrating the process of determining whether the test probe meets the requirements in other embodiments of the present application, which substantially includes the following steps:
s301, judging whether the first test probe and the second test probe respectively meet the requirements. Specifically, a first test probe and a second test probe are used for respectively testing the viscosity of the standard liquid, the test result is compared with the calibrated viscosity of the standard liquid, and whether the first test probe and the second test probe respectively meet the requirements or not is judged according to the calibrated viscosity tolerance range.
S302, if the test result of the second test probe meets the requirement, the step S304 is executed. Specifically, the test result of the second test probe meets the requirement, namely the test result of the second test probe for testing the standard liquid and the tolerance of the calibrated viscosity of the standard liquid are in the calibrated viscosity tolerance range.
S303, if the test result of the first test probe does not meet the requirement, the first test probe enters the calibration mode, i.e., the step S305 is performed. Specifically, the test result of the first test probe is not satisfactory, that is, the test result of the first test probe for testing the standard solution and the calibrated viscosity of the standard solution have a tolerance exceeding the calibrated viscosity tolerance range.
And S304, carrying out solder paste viscosity test by using a second test probe. In particular, reference may be made to the method described in the preceding embodiments.
And S305, the first test probe enters a calibration mode.
Specifically, the first test probe entering the calibration mode includes: and inputting the calibrated viscosity of the standard liquid, directly carrying out viscosity test on the standard liquid by using the first test probe, obtaining a viscosity calibration curve of the first test probe, and updating to the viscosity curve of the first test probe. And after the updating is finished, verifying the first test probe again so that the test result of the first test probe meets the requirement. Subsequently, the process proceeds to step S306.
And S306, performing a solder paste viscosity test by using the first test probe. In particular, reference may be made to the method described in the preceding embodiments.
It should be noted that, when the solder paste viscosity testing device is abundant, a testing probe for different packaging specifications can be installed on each solder paste viscosity testing device. However, when the number of the solder paste viscosity testing devices is limited, one solder paste viscosity testing device needs to test the solder paste with different packaging specifications, and the testing probe needs to be replaced.
Further, referring to fig. 4, fig. 4 is a schematic flow chart of a solder paste viscosity testing method according to another embodiment of the present application, the solder paste viscosity testing method generally including the following steps:
s401, providing a first test probe and solder paste with a first packaging specification. This step is substantially the same as step S101, and the description of the embodiment of the present application is not repeated.
And S402, providing a second test probe and solder paste with a second packaging specification. This step is substantially the same as step S102, and the description of the embodiment of the present application is not repeated.
And S403, directly carrying out viscosity test on the solder paste with the first packaging specification by using the first test probe and outputting a first test result. This step is substantially the same as step S103, and the description of the embodiment of the present application is not repeated.
And S404, replacing the first test probe with a second test probe. Specifically, the test probe of the solder paste viscosity testing device which can realize the solder paste viscosity testing method in the embodiment of the application can be replaced. For example, the test probe is detachably connected with the mounting seat of the solder paste viscosity test device, and solder paste viscosity tests can be directly performed on solder pastes with different packaging specifications conveniently by replacing the test probe. Furthermore, the detachable connection of the test probe and the mounting seat comprises detachable connection modes such as threaded connection, screw connection, pin connection, sleeve connection and the like.
S405, directly carrying out viscosity test on the solder paste with the second packaging specification by using a second test probe and outputting a second test result. This step is substantially the same as step S104, and the description of the embodiment of the present application is not repeated.
According to the solder paste viscosity testing method provided by the embodiment of the application, the test probe is replaced, so that the solder paste viscosity testing can be conveniently carried out on the solder pastes of different packaging specifications directly, the solder paste does not need to be transferred out from the package, the testing efficiency is improved, and the problem of solder paste waste is avoided.
In still other embodiments of the present application, a solder paste viscosity test method may further include: a third test probe is provided. The third test probe can directly test the viscosity of the solder paste of the first package specification and the solder paste of the second package specification respectively.
Specifically, referring to fig. 5, fig. 5 is a schematic flow chart of a solder paste viscosity testing method according to another embodiment of the present application, the solder paste viscosity testing method generally includes the following steps:
and S501, providing a third test probe. The third test probe can directly test the viscosity of the solder paste of the first package specification and the solder paste of the second package specification respectively. It will be appreciated that the third test probe can perform viscosity tests for solder pastes of different packaging specifications.
And S502, providing the solder paste of the first packaging specification and the solder paste of the second packaging specification.
S503, directly carrying out viscosity test on the solder paste with the first packaging specification by using a third test probe and outputting a first test result. This step is substantially the same as step S103, and description of the embodiments of the present application is not repeated
And S504, directly carrying out viscosity test on the solder paste with the second packaging specification by using a third test probe and outputting a second test result. This step is substantially the same as step S104, and the description of the embodiment of the present application is not repeated.
It should be noted that, when the solder paste of the first package specification is tested, the third test probe can be cleaned to avoid cross contamination of the solder paste between different package specifications.
Further, in order to cooperate with the above method for testing viscosity of solder paste, another embodiment of the present application further provides a device for testing viscosity of solder paste.
Specifically, referring to fig. 6, fig. 6 is a schematic structural diagram of a solder paste viscosity testing apparatus 100 according to another embodiment of the present disclosure, where the solder paste viscosity testing apparatus 100 generally includes a housing 10 and a mounting base 20. The mounting seat 20 is disposed in the inner space 101 of the housing 10, and the mounting seat 20 is used for mounting the test probe 21. The test probe 21 is detachably connected to the mounting base 20 to implement the solder paste viscosity test method in the foregoing embodiment.
In the embodiment of the present application, the detachable connection of the test probe 21 and the mounting base 20 includes: threaded connection, screw connection, pin connection, ferrule connection and the like. Of course, in other embodiments, the test probe 21 and the mounting base 20 may be detachably connected by other methods, such as spline connection, snap connection, etc.
Further, the solder paste viscosity testing apparatus 100 provided in the embodiment of the present application further includes a display 11 and an operation panel 12 disposed outside the housing 10, a stage 13 disposed inside the housing 10, and a clamping mechanism 14. The test probe 21 is disposed below the stage 13 and is movable up and down with respect to the stage 13. A clamping mechanism 14 is fixedly arranged on the inner side wall of the shell 10 and close to the object stage 13, and the clamping mechanism 14 is used for clamping and fixing the solder paste 15 with the first packaging specification or the second packaging specification.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present application are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
Specifically, the working principle of the solder paste viscosity testing apparatus 100 provided by the embodiment of the present application substantially includes: solder paste having the first package specification is prevented from being placed on the stage 13, and is clamped and fixed by the clamping mechanism 14. The test probe 21 is then extended down into the solder paste for viscosity testing, and after testing is complete, the test probe 21 is moved up away from the solder paste, and the solder paste is then removed from the clamping 14 mechanism and stored or used.
Further, referring to fig. 7, fig. 7 is a schematic view illustrating an operation principle of the solder paste viscosity testing apparatus 100 according to another embodiment of the present disclosure, and the testing probe 21 is further provided with a sensor 211, where the sensor 211 is used for transmitting a testing signal f generated by the testing probe 21 during testing. For example, the test probe 21 generates a rotation torque in a proportional relationship with the viscosity of the solder paste during the test, and the sensor 211 transmits a test signal f as a rotation torque signal. Further, the solder paste viscosity testing apparatus 100 provided by the embodiment of the present application further includes a processor 30, and the processor 30 is electrically connected to the sensor 211, the display 11, and the operation panel 12, respectively. Still further, the processor 30 is configured to receive the test signal f transmitted by the sensor 211, and perform corresponding processing, so as to be displayed on the display 11. The tester can perform corresponding test operations through the operation panel 12 according to the display data on the display 11.
The solder paste viscosity testing device provided by the embodiment of the application, through the testing probe which can be detachably connected, different testing probes are corresponding to solder pastes of different packaging specifications, and the problems of solder paste waste and low efficiency caused by a conventional solder paste viscosity testing mode are avoided. Meanwhile, cross contamination caused by the fact that the same test probe tests the solder pastes with different packaging specifications can be avoided.
It is noted that the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A solder paste viscosity testing method is characterized by comprising the following steps:
providing a first test probe and solder paste of a first packaging specification;
providing a second test probe and solder paste of a second packaging specification;
directly carrying out viscosity test on the solder paste with the first packaging specification by using the first test probe and outputting a first test result;
directly carrying out viscosity test on the solder paste with the second packaging specification by using the second test probe and outputting a second test result;
and fitting the first test result with the viscosity curve of the first test probe to obtain the viscosity of the solder paste of the first package specification, and fitting the second test result with the viscosity curve of the second test probe to obtain the viscosity of the solder paste of the second package specification.
2. The solder paste viscosity testing method of claim 1, wherein providing the first test probe and the second test probe further comprises:
and verifying the first test probe and the second test probe, and recording a viscosity curve of the first test probe and a viscosity curve of the second test probe.
3. The solder paste viscosity testing method of claim 2, wherein the verifying the first test probe and the second test probe comprises:
providing standard liquid, directly performing viscosity test on the standard liquid by using the first test probe and the second test probe respectively, outputting a test result, comparing the test result with the viscosity of the standard liquid, and judging whether the first test probe and the second test probe respectively meet the requirements.
4. The solder paste viscosity testing method of claim 3, wherein the determining whether the first testing probe and the second testing probe respectively meet the requirements comprises:
and when the test result of the first test probe does not meet the requirement, the first test probe enters a calibration mode.
5. The solder paste viscosity test method of claim 4, wherein entering the calibration mode by the first test probe comprises:
and inputting the calibrated viscosity of the standard solution, directly carrying out viscosity test on the standard solution by using the first test probe, obtaining a viscosity calibration curve of the first test probe, and updating to the viscosity curve of the first test probe.
6. The method of claim 1, wherein the first package size and the second package size are the same viscosity or different viscosity.
7. The method of claim 1, wherein the performing viscosity testing of the second package specification solder paste directly using the second test probe and outputting the second test result comprises:
and replacing the first test probe with the second test probe.
8. The solder paste viscosity test method of claim 1, further comprising: and providing a third test probe, wherein the third test probe directly tests the viscosity of the solder paste of the first package specification and the viscosity of the solder paste of the second package specification respectively.
9. The solder paste viscosity testing device is characterized by comprising a shell and a mounting seat, wherein the mounting seat is arranged in the inner space of the shell and is used for mounting a testing probe; the test probe is detachably connected with the mounting seat to realize the solder paste viscosity test method of any one of claims 1-8.
10. The solder paste viscosity testing apparatus of claim 9, wherein the removably coupling of the test probe to the mounting block comprises: threaded connection, screw connection, pin connection, and ferrule connection.
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| CN202010197812.5A CN111307666A (en) | 2020-03-19 | 2020-03-19 | Solder paste viscosity testing method and solder paste viscosity testing device |
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