CN111307049A - Measuring structure and measuring equipment for thickness of copper foil of circuit board - Google Patents

Measuring structure and measuring equipment for thickness of copper foil of circuit board Download PDF

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Publication number
CN111307049A
CN111307049A CN202010275442.2A CN202010275442A CN111307049A CN 111307049 A CN111307049 A CN 111307049A CN 202010275442 A CN202010275442 A CN 202010275442A CN 111307049 A CN111307049 A CN 111307049A
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CN
China
Prior art keywords
measuring
circuit board
drive module
assembled
plate
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Pending
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CN202010275442.2A
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Chinese (zh)
Inventor
陈法军
揭平良
龙际良
李荣峰
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Shenzhen Miracle Creation Technology Co ltd
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Shenzhen Miracle Creation Technology Co ltd
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Application filed by Shenzhen Miracle Creation Technology Co ltd filed Critical Shenzhen Miracle Creation Technology Co ltd
Priority to CN202010275442.2A priority Critical patent/CN111307049A/en
Publication of CN111307049A publication Critical patent/CN111307049A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)

Abstract

A measuring structure for the thickness of a copper foil of a circuit board relates to the technical field of circuit board detection. It comprises a frame; the transmission assembly is assembled on the rack; the back measuring assembly and the front measuring assembly are assembled on the rack and correspond to the transmission assembly; the backside measurement assembly includes: several X's assembled at the bottom of the frameLower partA direction driving module; is slidably mounted on XLower partY to the drive moduleLower partTo a drive module assembled at YLower partTo Z of the drive moduleLower partTo the drive module, and assembled at ZLower partA lower measuring probe towards the drive module; the front side measuring assembly includes: several X's mounted on the top of the frameOn the upper partA direction driving module; is slidably mounted on XOn the upper partY to the drive moduleOn the upper partTo a drive module assembled at YOn the upper partTo Z of the drive moduleOn the upper partTo the drive module, and assembled at ZOn the upper partAn upper measuring probe to the drive module; and the upper measuring probes and the lower measuring probes are electrically connected with an independent copper thickness measuring controller. By adopting the technical scheme, the method has the advantages of improving the measurementAccuracy and measurement efficiency.

Description

Measuring structure and measuring equipment for thickness of copper foil of circuit board
Technical Field
The invention relates to the technical field of circuit board detection, in particular to a structure and equipment for measuring the thickness of a copper foil of a circuit board.
Background
Along with the continuous improvement of the level of electronic manufacturing industry, especially the coming of the 5G era, the requirement on the signal integrity of the circuit board is higher and higher, correspondingly, higher requirements are also put forward on the processing and manufacturing level of the circuit board, the accuracy of the thickness of the copper foil of the circuit board in the processing process directly determines the quality of the circuit board, and in order to ensure the production efficiency of the circuit board processing process, the copper foil thickness measuring equipment needs to improve the measuring speed in addition to ensuring the measuring precision and stability.
The copper foil thickness measuring device of the circuit board on the market at present determines a test area (the front and back surfaces of the measurement area are uniformly distributed) on the surface of the circuit board by a software end through a Gerber or CCD positioning mode, transmits the circuit board to be measured to a specified position by adopting a belt or roller mode, presses down the surface of the contact circuit board by a single or a plurality of measuring probes on the front and back surfaces simultaneously by using a cylinder, a copper foil thickness measuring controller acquires the thickness of the copper foil through the measuring probe, the software end is communicated with the copper thickness measuring controller, and judges whether the copper foil meets the production requirement or not according to the acquired measured thickness of the copper foil.
The method is characterized in that the thickness of the copper foil is measured after the process sections of external drawing, electroplating, microetching, etching and the like in the production process of the circuit board, areas which are not suitable for measurement, such as through holes, blind holes, circuits and the like, need to be measured on the circuit board need to be avoided, areas which need to be measured are different due to the existence of the blind holes or the circuits on the front side and the back side of the circuit board, and therefore a front side probe and a back side probe need to move independently to accurately and effectively measure the measurement areas of the front side and the back side.
Because the currently adopted copper foil thickness measurement controller and the probes are mainly made by foreign brands, the measurement principle is based on micro-resistance or eddy current mode, when one controller controls a plurality of probes to be used simultaneously, the plurality of probes must be triggered sequentially, for example, one controller controls the use of 6 probes, then 6 probes must contact with the tested copper foil area simultaneously, then the No. 1 probe firstly obtains the measurement data, then the No. 2 and No. 3 … … 6 probes sequentially obtain the measurement data, if the No. 1 probe does not obtain the measurement data, the latter probes cannot obtain the measurement data, the existing copper thickness measurement equipment solutions in the market at present are all that one controller controls the use of 2-6 probes, and according to the above mentioned equipment mechanism solutions, the existing technical solutions must have the problem that data cannot be measured or invalid data can be measured, especially for circuit boards with blind holes and circuitry. Therefore, there is a need for improvement of the structure and apparatus for measuring the thickness of the copper foil of the circuit board to solve the above-mentioned technical problems.
Disclosure of Invention
The first purpose of the present invention is to provide a measuring structure for the thickness of a circuit board copper foil, which can increase the area of a measuring area, improve the accuracy of measuring data, shorten the measuring time, effectively improve the measuring efficiency and the production capacity, and achieve the purpose of actually monitoring the production quality.
In order to achieve the purpose, the invention adopts the technical scheme that: a measuring structure of a copper foil thickness of a circuit board comprises: a frame; the transmission assembly is assembled on the rack and used for bearing and conveying the circuit board; the back surface measuring component is assembled on the rack, corresponds to the transmission component and is used for measuring the thickness of the copper foil on the back surface of the circuit board; the front surface measuring component is used for measuring the thickness of the copper foil on the front surface of the circuit board; the backside measurement assembly includes: a plurality of X assembled at the bottom of the frameLower partA direction driving module; is slidably fitted to the XLower partTo Y on the drive moduleLower partTo a drive module assembled to the YLower partTo Z on the drive moduleLower partTo the drive module, and is assembled to the ZLower partA lower measuring probe on the drive module; the front side measuring assembly includes: a plurality of X assembled on the top of the frameOn the upper partDirection driveA movable module; is slidably fitted to the XOn the upper partTo Y on the drive moduleOn the upper partTo a drive module assembled to the YOn the upper partTo Z on the drive moduleOn the upper partTo the drive module, and is assembled to the ZOn the upper partAn upper measuring probe on the driving module; and the upper measuring probes and the lower measuring probes are electrically connected with an independent copper thickness measuring controller.
In a further aspect of the invention, the backside measurement assembly further comprises: a plurality of x assembled on the top of the frameOn the upper partA direction driving module; is slidably fitted to the xOn the upper partTo y on the drive moduleOn the upper partTo a drive module assembled to the yOn the upper partTo z on the drive moduleOn the upper partTo the drive module, and is assembled to the zOn the upper partAn upper pressure plate which is arranged on the driving module and used for being matched with the lower measuring probe for measurement; the front side measuring assembly further comprises: a plurality of x assembled at the bottom of the frameLower partA direction driving module; is slidably fitted to the xLower partTo y on the drive moduleLower partTo a drive module assembled to the yLower partTo z on the drive moduleLower partTo the drive module, and is assembled to the zLower partAnd the lower pressing plate is arranged on the driving module and used for being matched with the upper measuring probe for measurement.
According to a further arrangement of the present invention, the frame is provided with a device for supplying the xLower partTo the driving module, XLower partThe first mounting plate and the second mounting plate are mounted on the driving module; the rack is also provided with a mounting rack, and the mounting rack is provided with a power supply for the XOn the upper partTo the drive module, xOn the upper partThe third mounting plate and the fourth mounting plate are mounted on the driving module; said xLower partTo the driving module, the XLower partTo the driving module, the XOn the upper partTo the drive module and the xOn the upper partThe same to drive module structure, all include: a first driving motor mounted on the first mounting plate or the second mounting plate or the third mounting plate or the fourth mounting plate; the first screw rod is assembled at the output end of the first driving motor; the first nut seat is assembled on the first screw rod in a threaded mode; said yLower partTo the driving module, the YLower partTo the driving module, the YOn the upper partTo the drive module and the yOn the upper partThe same to drive module structure, all include: the vertical plate is arranged on the first nut seat; the second driving motor is arranged at one end of the vertical plate, and the main belt pulley is arranged at one end of an output shaft of the second driving motor; the driven belt pulley is arranged at the other end of the vertical plate; a belt mounted on the primary pulley and the secondary pulley; and a locking toothed plate assembled on the belt; a second sliding rail is further arranged on the vertical plate, and a second sliding block connected to the locking toothed plate is slidably mounted on the second sliding rail; z isLower partTo the driving module, ZLower partTo the driving module, ZOn the upper partTo the drive module and the zOn the upper partThe same to drive module structure, all include: a third driving cylinder arranged on the sliding block towards one side of the circuit board; and the mounting part is assembled at the driving end of the third driving air cylinder and used for mounting the lower pressure plate or the lower measuring probe or the upper pressure plate.
In a further aspect of the invention, the transfer assembly comprises: the wide plates are slidably assembled on two sides of the rack and used for limiting the circuit board, and each wide plate comprises a front side measuring station and a back side measuring station; the rotating motor is assembled on the rack and respectively drives the front measuring station and the back measuring station to transmit; the driving wheel is arranged on the inner side of the wide plate and is respectively matched with the rotating shaft of the rotating motor on the front measuring station and the back measuring station; the driven wheel is arranged on the inner side of the wide plate and respectively corresponds to the front measuring station and the back measuring station; the synchronous belts are assembled on the driving wheel and the driven wheel; the rack is also provided with an adjusting motor, and the output end of the adjusting motor is provided with an adjusting screw rod; and the wide plate is provided with a bearing seat for the rotating shaft to penetrate through and an adjusting nut seat for the adjusting screw rod to be assembled in a threaded manner.
The invention is further provided with a limit cylinder respectively arranged at the tail ends of the wide plate corresponding to the front side measuring station and the back side measuring station, and the output end of the limit cylinder is provided with a limit block for limiting the circuit board; a measuring sensor is arranged on the limiting block; the wide plate is close stopper one side is installed proximity sensor, works as proximity sensor detects the approach signal of circuit board, controller control spacing cylinder drive the stopper is spacing to the circuit board.
According to the invention, the wear-resistant strips for bearing the circuit board are arranged below the wide plate corresponding to the synchronous belt; and the wide plate is provided with a plurality of spring press wheels at intervals along the transmission direction, and the spring press wheels are used for limiting the surface of the circuit board.
The second purpose of the present invention is to provide a device for measuring the thickness of a copper foil of a circuit board, which solves the problem of low test efficiency of the device for measuring the thickness of copper foil in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: a measuring device for the thickness of a copper foil of a circuit board comprises: the structure for measuring the thickness of the copper foil of the circuit board; the feeding assembly and the output assembly are assembled on the rack, arranged at two ends of the transmission assembly and used for feeding and discharging the circuit board respectively; the CCD positioning adjusting component is arranged on the rack and is respectively used for shooting and positioning the circuit board on the front measuring station and the back measuring station; and the controller is electrically connected with the measuring structure of the copper foil thickness of the circuit board, the feeding assembly, the output assembly and the CCD positioning and adjusting assembly.
According to a further arrangement of the present invention, the feeding assembly and the output assembly have the same structure, and both comprise: bearing plates mounted on two sides of the frame; a roller mounted between the bearing plates; the first stepping motor is assembled on one side of the bearing plate and used for driving the roller to rotate; a second guide rail is arranged below the roller, and two second sliding blocks are assembled on the second guide rail in a sliding manner; the second sliding block is provided with a material beating claw, the end part of which penetrates through the gap of the roller and is used for performing centering limit on two sides of the circuit board; a second stepping motor is further mounted on the bearing plate; one end of the output shaft of the second stepping motor is provided with a second bidirectional screw rod which is rotatably assembled on the bearing plate; and a second nut seat which is used for the threaded assembly of the second bidirectional screw rod and is used for driving the two sides of the material beating claw to limit the circuit board is arranged on the second sliding block.
In a further aspect of the present invention, the CCD positioning adjustment assembly comprises: the third stepping motor is arranged on the mounting rack; the third bidirectional screw rod is arranged at one end of an output shaft of the third stepping motor; a third nut seat which is assembled on the third bidirectional screw rod in a threaded manner; the third guide rail is arranged on the mounting rack along the direction of the third bidirectional screw rod; a third sliding block which is assembled on the third guide rail in a sliding manner and is used for installing the third nut seat; the camera mounting plate is detachably mounted on one side of the third nut seat; and a photographing lens assembled on the camera mounting plate.
After the technical scheme is adopted, the invention has the beneficial effects that:
1. in the invention, the front side and the back side of the circuit board are independently measured by arranging the front side measuring assembly and the back side measuring assembly, and the upper measuring probe and the lower measuring probe can be respectively driven to move to a test area for detection according to the actual conditions of the front side and the back side of the circuit board, so that the area of the measurement area is increased, and the measurement efficiency is improved; when the circuit board is measured, the upper and lower measuring probes can be independently driven from the X-axis direction, the Y-axis direction and the Z-axis direction, so that the upper and lower measuring probes can be respectively moved to the designated positions to simultaneously measure the thickness of the copper foil, and the copper thickness measurement controller can simultaneously acquire the detection data of the upper measuring probe or the lower measuring probe, thereby shortening the measuring time and effectively improving the measuring efficiency and the production capacity. Meanwhile, the accuracy of the measured data is greatly improved, the production quality of front-end production equipment can be accurately evaluated, and the purpose of truly monitoring the production quality is achieved.
2. In the invention, the circuit board to be measured can be centered and positioned by the material-shooting claw during feeding and discharging, and the distance between the wide plates and the distance between the CCD positioning and adjusting components can be adjusted according to the actual specification of the circuit board to be measured during transmission, so that the measuring equipment can be suitable for circuit boards with various specifications and has strong applicability. Adopt hold-in range and the mode of spring pinch roller common transmission, can play stable clamping action to the circuit board that awaits measuring, effectively prevent the circuit board because cardboard that warpage scheduling problem arouses, phenomenon such as board fall, improve equipment's performance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of an apparatus for measuring the thickness of a copper foil of a circuit board according to the present embodiment;
FIG. 2 is a schematic structural diagram of a structure for measuring the thickness of a copper foil of a circuit board in the present embodiment;
FIG. 3 is a schematic view of a partial structure of an apparatus for measuring the thickness of a copper foil of a circuit board according to the present embodiment;
FIG. 4 is a partial structural view of a structure for measuring the thickness of a copper foil of a circuit board according to the present embodiment;
FIG. 5 is another partial structural view of a structure for measuring the thickness of a copper foil of a circuit board according to the present embodiment;
FIG. 6 is a schematic view of a further partial structure of a structure for measuring the thickness of a copper foil of a circuit board according to this embodiment;
FIG. 7 is a schematic view of a further partial structure of a structure for measuring the thickness of a copper foil of a circuit board according to this embodiment;
fig. 8 is a schematic view of another partial structure of the structure for measuring the thickness of the copper foil of the circuit board in the present embodiment.
Description of reference numerals: 1. a frame; 2. a transmission assembly; 3. a backside measurement assembly; 4. a front side measurement assembly; 31. xLower partA direction driving module; 32. y isLower partA direction driving module; 33. zLower partA direction driving module; 34. a lower measurement probe; 44. an upper measurement probe; 38. an upper pressure plate; 48. a lower pressing plate; 01. first, theA mounting plate; 02. a second mounting plate; 03. a mounting frame; 04. a third mounting plate; 05. a fourth mounting plate; 51. a first drive motor; 52. a first lead screw; 53. a first nut seat; 54. a first slide rail; 61. a vertical plate; 62. a second drive motor; 63. a primary pulley; 64. a secondary pulley; 65. a belt; 66. locking the toothed plate; 67. a second slide rail; 68. a second slider; 71. a third driving cylinder; 72. a mounting member; 21. a wide plate; 210. a front measurement station; 211. a back side measurement station; 22. rotating the motor; 23. a driving wheel; 24. a driven wheel; 25. a synchronous belt; 26. adjusting the motor; 27. adjusting the screw rod; 28. a bearing seat; 29. adjusting the nut seat; 212. a limiting cylinder; 213. a limiting block; 214. a proximity sensor; 215. wear resistant strips; 216. a spring pinch roller; 7. a feed assembly; 8. an output component; 9. a CCD positioning and adjusting component; 71. a bearing plate; 72. a roller; 73. a first stepper motor; 74. a second guide rail; 75. a second slider; 76. a material beating claw; 77. a second stepping motor; 78. a second bidirectional screw rod; 79. a second nut seat; 91. a third step motor; 92. a third bidirectional screw rod; 93. a third nut seat; 94. a third guide rail; 95. a third slider; 96. a camera mounting plate; 97. and (5) taking a lens.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment as necessary without making a contribution thereto after reading the present specification, but all are protected by patent laws within the scope of the claims of the present invention.
The present embodiment relates to a measuring structure of a copper foil thickness of a circuit board, as shown in fig. 2 to 7, including: a frame 1; the transmission component 2 is assembled on the frame 1 and used for carrying and conveying the circuit board; a back surface measuring component 3 which is assembled on the frame 1 and corresponds to the transmission component 2 and is used for measuring the thickness of the copper foil on the back surface of the circuit board; and a front surface measuring component 4 for measuring the thickness of the copper foil on the front surface of the circuit board; the backside measurement assembly 3 includes: is assembled atSeveral X's at the bottom of the frame 1Lower partTo the driving module 31; is slidably mounted on XLower partTo Y on the drive module 31Lower partTo the drive module 32, mounted in YLower partTo Z on the drive module 32Lower partTo the drive module 33, and to ZLower partTo the lower measurement probe 34 on the drive module 33; the front face measuring unit 4 includes: several X's mounted on the top of the frame 1On the upper partA direction driving module; is slidably mounted on XOn the upper partTo Y on the drive moduleOn the upper partTo a drive module assembled at YOn the upper partTo Z on the drive moduleOn the upper partTo the drive module, and assembled at ZOn the upper partTo the upper measurement probe 44 on the drive module; a number of upper measurement probes 44 and lower measurement probes 34 are electrically connected to a separate copper thickness measurement controller. On one hand, the front measuring component 4 and the back measuring component 3 can independently measure the front side and the back side of the circuit board, so that the area of a measuring area is increased, on the other hand, the plurality of upper measuring probes 44 or the lower measuring probes 34 can independently move to a specified area to detect the thickness of the copper foil, and the independent copper thickness measuring controller can simultaneously acquire corresponding measuring data, so that the accuracy of the measuring data is improved, the measuring time is shortened, and the measuring efficiency and the production capacity are effectively improved.
As shown in fig. 3 and 4, in order to further ensure the stability of the circuit board during measurement, the measurement accuracy is improved. The backside measurement assembly 3 further includes: several x mounted on the top of the frame 1On the upper partA direction driving module; is slidably mounted on the xOn the upper partTo y on the drive moduleOn the upper partTo the drive module, assembled at yOn the upper partTo z on the drive moduleOn the upper partTo the drive module, and is assembled to zOn the upper partAn upper pressure plate 38 which is arranged on the driving module and used for being matched with the lower measuring probe 34 for measurement; the front face measuring assembly 4 further includes: several x assembled at the bottom of the frame 1Lower partA direction driving module; is slidably mounted on the xLower partTo y on the drive moduleLower partTo the drive module, assembled at yLower partTo z on the drive moduleLower partTo the drive module, and is assembled to zLower partAnd a lower pressing plate 48 on the driving module and used for cooperating with the upper measuring probe 44 for measurement. In measuring the thickness of the copper foil, the lower measuring probe 34 and the upper pressThe movement tracks of the plate 38, the upper measuring probe 44 and the lower pressing plate 48 are in one-to-one correspondence, and are used for positioning one side of the circuit board and preventing the circuit board from bending and deforming in the measuring process.
As shown in FIG. 2, the frame 1 is provided with a supply xLower partTo the driving module, XLower partA first mounting plate 01 and a second mounting plate 02 mounted to the driving module 31; the rack 1 is also provided with a mounting rack 03, and the mounting rack 03 is provided with a X supplyOn the upper partTo the driving module, xOn the upper partA third mounting plate 04 and a fourth mounting plate 05 which are mounted to the driving module; x is the number ofLower partTo the driving module, XLower partTo the driving module 31, XOn the upper partTo the driving module and xOn the upper partThe direction driving module has the same structure with XLower partAs shown in fig. 6, the driving module 31 includes: a first driving motor 51 mounted on the first mounting plate 01 or the second mounting plate 02 or the third mounting plate 04 or the fourth mounting plate 05; a first lead screw 52 mounted on an output end of the first driving motor 51; and a first nut seat 53 screw-fitted on the first lead screw 52.
yLower partTo the driving module, YLower partTo the driving module 32, YOn the upper partTo the driving module and yOn the upper partThe direction driving module has the same structure with XLower partAs shown in fig. 6, the driving module 31 includes: a vertical plate 61 mounted on the first nut seat 53; a second driving motor 62 arranged at one end of the vertical plate 61, and a main belt 65 wheel 63 arranged at one end of an output shaft of the second driving motor 62; a slave belt 65 pulley 64 provided at the other end of the vertical plate 61; a belt 65 mounted on the master 65 pulley 63 and the slave 65 pulley 64; and a locking toothed plate 66 fitted on the belt 65; the vertical plate 61 is further provided with a second slide rail 67, and a second slide block 68 connected to the locking toothed plate 66 is slidably mounted on the slide rail.
zLower partTo the driving module, ZLower partTo the driving module 33, ZOn the upper partTo the driving module and zOn the upper partThe direction driving module has the same structure with XLower partAs shown in fig. 6, the driving module 31 includes: a third driving cylinder 71 mounted on the slider toward the circuit board; and a lower pressure plate 48 or a lower measuring probe provided with a driving end of a third driving cylinder 71A mounting 72 to which the head 34 or the upper measurement probe 44 or the upper platen 38 is mounted. Taking the back surface measuring assembly 3 as an example, as shown in fig. 6, during measurement, the controller controls the first driving motor 51 to drive the first lead screw 52 to rotate, wherein the second mounting plate 02 is further provided with a first slide rail 54 for the vertical plate 61 to slide, so as to drive the first nut seat 53 to slide along the first slide rail 54, thereby implementing the x-axis movement; the second driving motor 62 drives the locking toothed plate 66 to move through the belt 65, so that the sliding block is driven to slide along the sliding rail, and the movement of the y axis is realized; finally, the lower measuring probe 34 and the upper pressing plate 38 are driven by the third driving cylinder 71 to move towards one side of the circuit board, so that z-axis movement is achieved, the lower pressing plate 48 and the lower measuring probe 34 can move independently, the device can be well suitable for the circuit board with blind holes and circuits, a plurality of lower measuring probes 34 and upper measuring probes 44 can move and measure simultaneously, and the measuring efficiency of the thickness of the copper foil is effectively improved.
As shown in fig. 3 and 7, the transfer assembly 2 includes: the wide plates 21 are slidably assembled on two sides of the rack 1 and used for limiting the circuit board, and each wide plate 21 comprises a front measuring station 210 and a back measuring station 211; a rotating motor 22 which is assembled on the frame 1 and respectively drives the front measuring station 210 and the back measuring station 211 to transmit; a driving wheel 23 arranged on the inner side of the wide plate 21 and respectively matched with the rotating shaft of the rotating motor 22 on the front measuring station 210 and the back measuring station 211; a driven wheel 24 provided on the inner side of the wide plate 21 and corresponding to the front surface measuring station 210 and the back surface measuring station 211, respectively; and the synchronous belt 25 is assembled on the driving wheel 23 and the driven wheel 24, the bearing seat 28 for the rotating shaft to penetrate is installed on the wide plate 21, and the two driven wheels 24 are close to each other so as to keep the gap between the front measuring station 210 and the back measuring station 211 to the minimum, thereby effectively preventing the phenomena of board clamping, board falling and the like caused by the problems of warping and the like of the circuit board and improving the service performance of the equipment.
As shown in fig. 7, wear-resistant strips 215 for supporting the circuit board are arranged below the wide plate 21 corresponding to the synchronous belt 25, a plurality of spring press wheels 216 for limiting the surface of the circuit board are arranged at intervals on the wide plate 21 along the transmission direction, the wear-resistant strips 215 support the synchronous belt 25 and the circuit board, limiting cylinders 212 are respectively arranged at the ends of the wide plate 21 corresponding to the front measurement station 210 and the back measurement station 211, and limiting blocks 213 for limiting the circuit board are assembled at the output ends of the limiting cylinders 212; a measurement sensor (not shown) is provided on the stopper 213; the wide plate 21 is provided with an approach sensor 214 near the limit block 213, and when the approach sensor 214 detects an approach signal of the circuit board, the limit cylinder 212 is controlled by the controller to drive the limit block 213 to limit the circuit board.
When the circuit board transmission device is used, the two sides of the circuit board are clamped between the spring pinch roller 216 and the synchronous belt 25, the circuit board is driven to transmit through the synchronous belt 25, when the circuit board is transmitted to the position of the proximity sensor 214, the proximity sensor 214 sends a proximity signal to the controller, the controller controls the rotating motor 22 to stop working, and the limiting cylinder 212 is controlled to drive the limiting block 213 to limit the circuit board. When the limiting block 213 completes limiting the circuit board, the measurement sensor detects the position information of the circuit board, and at this time, the front measurement assembly 4 or the back measurement assembly 3 is controlled to measure the circuit board.
In this embodiment, as shown in fig. 7, the frame 1 is further provided with an adjusting motor 26, and an output end of the adjusting motor 26 is equipped with an adjusting screw 27; the wide plate 21 is provided with an adjusting nut seat 29 for the threaded assembly of the adjusting screw 27. The adjusting screw 27 is a bidirectional screw, the adjusting motor 26 and the adjusting screw 27 are disposed at the middle position of the wide plate 21, and the rotating motor 22 and the rotating shaft are disposed at the two ends of the wide plate 21. Therefore, when the measuring structure is used, the distance between the wide plates 21 on the two sides can be adjusted through the adjusting motor 26 according to the specification of the circuit board, and the rotating shaft also plays a role in guiding and limiting the wide plates 21, so that the wide plates 21 can be stably and smoothly adjusted in distance, and the measuring structure is favorably improved in applicability.
Based on the above structure for measuring the thickness of the copper foil of the circuit board, this embodiment further relates to a device for measuring the thickness of the copper foil of the circuit board, as shown in fig. 1 to 8, which includes: the structure for measuring the thickness of the copper foil of the circuit board as referred to above; the feeding assembly 7 and the output assembly 8 are assembled on the frame 1, arranged at two ends of the transmission assembly 2 and used for feeding and discharging the circuit board respectively; the CCD positioning adjusting component 9 is arranged on the frame 1 and is respectively used for shooting and positioning the circuit board on the front measuring station 210 and the back measuring station 211; and the controller is electrically connected with the measuring structure of the copper foil thickness of the circuit board, the feeding component 7, the output component 8 and the CCD positioning and adjusting component 9.
In this embodiment, the feeding assembly 7 and the output assembly 8 have the same structure, and as shown in fig. 8, taking the feeding assembly 7 as an example, the feeding assembly includes: bearing plates 71 mounted on both sides of the frame 1; a roller 72 installed between the bearing plates 71; and a first stepping motor 73 mounted on one side of the bearing plate 71 for driving the roller 72 to rotate; a second guide rail 74 is arranged below the roller 72, and two second sliding blocks 75 are slidably assembled on the second guide rail 74; the second sliding block 75 is provided with a material beating claw 76, the end part of which penetrates through the gap of the roller 72 and is used for performing centering limit on two sides of the circuit board; the material beating claw 76 is provided with a folded plate sensor for detecting the width specification of the circuit board to be detected. A second stepping motor 77 is further mounted on the bearing plate 71; one end of the output shaft of the second stepping motor 77 is provided with a second bidirectional screw rod 78 which is rotatably assembled on the bearing plate 71; and a second nut seat 79 for the threaded assembly of a second bidirectional screw rod 78 and for driving the two-side material-shooting claws 76 to limit the circuit board is arranged on the second sliding block 75.
As shown in fig. 5, the CCD positioning adjustment assembly 9 includes: a third stepping motor 91 provided on the mounting bracket 03; a third bidirectional screw 92 provided at one end of an output shaft of the third stepping motor 91; a third nut seat 93 screw-fitted on the third bidirectional screw 92; a third guide rail 94 arranged on the mounting bracket 03 along the direction of the third bidirectional screw 92; a third slide block 95 slidably fitted on the third guide rail 94 and to which the third nut holder 93 is attached; a camera mounting plate 96 detachably mounted on one side of the third nut holder 93; and a photographing lens mounted on the camera mounting plate 96.
Referring to fig. 1-8, a circuit board to be tested enters the feeding assembly 7 in the embodiment through a front-end production device, the second stepping motor 77 drives the material-shooting claw 76 to move along the middle of the second bidirectional screw rod 78, so as to center and position the circuit board to be tested, the transmission assembly 2 adjusts the distance between the wide plates 21 according to the size of the circuit board to be tested, after the adjustment is completed, the circuit board to be tested enters the front measuring station 210 of the transmission assembly 2, the circuit board is driven to transmit through the synchronous belt 25, when the circuit board moves to the proximity sensor 214, the controller controls the rotating motor 22 to stop working, the limiting cylinder 212 drives the limiting block 213 to limit the circuit board, so that the circuit board moves to a first designated position to be tested, and when the measuring sensor detects the position information of the circuit board, the controller controls the CCD positioning, and a software part of the controller positions the central positions of 3-9 effective test areas on the front surface of the circuit board according to Gerber documents of the circuit board to be tested and sends the position information to an independent copper thickness measurement controller, the independent copper thickness measurement controller drives an upper measurement probe 44 and a lower pressing plate 48 to move to specified positions simultaneously, then a third driving cylinder 71 controls the upper measurement probe 44 and the lower pressing plate 48 to move to the surface of the circuit board to be tested for thickness measurement, so that the independent copper thickness measurement controller can simultaneously acquire copper thickness measurement data of the current position of the front surface of the circuit board and upload the copper thickness measurement data to the software part, the software part judges whether the copper thickness measurement data are OK or not according to the acquired copper thickness measurement data, the circuit board to be tested continues to enter a back surface measurement station 211 and is driven by a synchronous belt 25 for transmission, when the circuit board moves to a proximity sensor 214, the controller controls a rotating motor 22 to stop working, The limiting cylinder 212 drives the limiting block 213 to limit the circuit board, so that the circuit board moves to a second specified position to be measured, when the measuring sensor detects the position information of the circuit board, the controller controls the CCD positioning and adjusting assembly 9 to position the Mark point of the circuit board to be measured, the software part of the controller positions the central positions of 3-9 effective test areas on the back surface of the circuit board according to the Gerber document of the circuit board to be measured, and sends the position information to the independent copper thickness measuring controller, the independent copper thickness measuring controller drives the lower measuring probe 34 and the upper pressing plate 38 to move to specified positions simultaneously, and then the third driving cylinder 71 controls the lower measuring probe 34 and the upper pressing plate 38 to move to the surface of the circuit board to be measured to measure the thickness, so that the independent copper thickness measuring controller can simultaneously obtain the copper thickness measuring data of the current position on the back surface of the circuit board, and uploading the data to a software part, judging whether the data is OK or not by the software part according to the obtained copper thickness measurement data, and transmitting the tested circuit board to equipment of the next station by an output assembly 8 if the data is OK. And if the data is NG, stopping the alarm and performing manual intervention.
In the above working procedure, when the circuit board to be tested reaches the back side measuring station 211 and performs the back side measurement, the next circuit board to be tested reaches the front side measuring station 210 and performs the front side measurement, so as to achieve the purpose of parallel testing and further improve the measuring speed. According to common customer requirements, a circuit board to be measured needs to measure 9 points on a single surface, and 18 points on two surfaces are calculated, in the embodiment, 3 measuring probes 44 and 3 measuring probes 34 are arranged on one measuring device, each probe measures 3 times on the single surface, each measuring time is fixed time for 3 seconds, existing measuring devices need to measure a board at least 9 times, the worst case is 18 times, the time needed to measure is at least 27 s-54 s, the time needed to measure a board is 10 s-15 s after verification, and the testing efficiency and the productivity are improved by at least 3-4 times.
The working principle of the invention is roughly as follows: the front and back sides of the circuit board are independently measured by arranging the front measuring component 4 and the back measuring component 3, and the upper and lower measuring probes 34 can be respectively driven to move to a test area for detection according to the actual conditions of the front and back sides of the circuit board, so that the area of the measurement area is increased, and the measurement efficiency is improved; when the circuit board is measured, the upper and lower measuring probes 34 can be independently driven from the three directions of the X axis, the Y axis and the Z axis, so that the upper and lower measuring probes 34 can be respectively moved to the designated positions to measure the thickness of the copper foil, and the copper thickness measurement controller can simultaneously acquire the detection data of the upper and lower measuring probes 44 and 34, thereby shortening the measuring time and effectively improving the measuring efficiency and the production capacity. Meanwhile, the accuracy of the measured data is greatly improved, the production quality of front-end production equipment can be accurately evaluated, and the purpose of truly monitoring the production quality is achieved. And the accessible is clapped the material and is grabbed and fix a position the circuit board that awaits measuring between two parties during business turn over material, can adjust the interval of wide board 21 and the interval of CCD location adjusting part 9 according to the circuit board specification that awaits measuring actually during the transmission for this measuring equipment can be applicable to the circuit board of multiple different specifications, has stronger suitability. Adopt hold-in range 25 and the mode of spring pinch roller 216 common transmission, can play stable clamping effect to the circuit board that awaits measuring, effectively prevent the circuit board because cardboard that warpage scheduling problem arouses, phenomenon such as board fall, improve equipment's performance.
The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent substitutions made by those skilled in the art to the technical solutions of the present invention should be covered by the claims of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims (9)

1. A measuring structure of circuit board copper foil thickness, its characterized in that includes: a frame (1);
the transmission assembly (2) is assembled on the rack (1) and is used for carrying and conveying the circuit board;
a back surface measuring component (3) which is assembled on the frame (1) and corresponds to the transmission component (2) and is used for measuring the thickness of the copper foil on the back surface of the circuit board; and a front surface measuring component (4) for measuring the thickness of the copper foil on the front surface of the circuit board;
the backside measurement assembly (3) comprises: a plurality of X assembled at the bottom of the frame (1)Lower partA drive module (31); is slidably fitted to the XLower partTo Y on the drive module (31)Lower partTo a drive module (32) mounted on said YLower partTo Z on the drive module (32)Lower partTo a drive module (33), and to the ZLower partA lower measuring probe (34) on the drive module (33);
the frontal measuring assembly (4) comprises: a plurality of X assembled on the top of the frame (1)On the upper partA direction driving module; is slidably fitted to the XOn the upper partTo Y on the drive moduleOn the upper partTo a drive module assembled to the YOn the upper partTo Z on the drive moduleOn the upper partTo the drive module, and is assembled to the ZOn the upper partAn upper measuring probe (44) on the drive module;
and a plurality of upper measuring probes (44) and lower measuring probes (34) are electrically connected with an independent copper thickness measuring controller.
2. A measuring structure of a copper foil thickness of a circuit board according to claim 1, wherein said back surface measuring unit (3) further comprises: a plurality of x assembled on the top of the frame (1)On the upper partA direction driving module; is slidably fitted to the xOn the upper partTo y on the drive moduleOn the upper partTo a drive module assembled to the yOn the upper partTo z on the drive moduleOn the upper partTo the drive module, and is assembled to the zOn the upper partAn upper pressure plate (38) which is arranged on the driving module and used for being matched with the lower measuring probe (34) for measurement;
the frontal measuring assembly (4) further comprises: a plurality of x assembled at the bottom of the frame (1)Lower partA direction driving module; is slidably fitted to the xLower partTo y on the drive moduleLower partTo a drive module assembled to the yLower partTo z on the drive moduleLower partTo the drive module, and is assembled to the zLower partAnd a lower pressure plate (48) on the driving module and used for cooperating with the upper measuring probe (44) to measure.
3. The measuring structure of the copper foil thickness of the circuit board according to claim 2, wherein the machine frame (1) is provided with a device for supplying xLower partTo the driving module, XLower partA first mounting plate (01) and a second mounting plate (02) mounted to the drive module (31); the X-ray detector is characterized in that a mounting rack (03) is further arranged on the rack (1), and the mounting rack (03) is provided with a power supply for the X-ray detectorOn the upper partTo the drive module, xOn the upper partA third mounting plate (04) and a fourth mounting plate (05) which are mounted to the drive module;
said xLower partTo the driving module, the XLower partTo a drive module (31), the XOn the upper partTo the drive module and the xOn the upper partThe same to drive module structure, all include: a first drive motor (51) mounted on the first mounting plate (01) or the second mounting plate (02) or the third mounting plate (04) or the fourth mounting plate (05); a first screw rod (52) assembled at the output end of the first driving motor (51); and a first nut seat (53) screw-fitted on the first lead screw (52);
said yLower partTo the driving module, the YLower partTo a drive module (32), YOn the upper partTo the drive module and the yOn the upper partThe same to drive module structure, all include: a vertical plate (61) mounted on the first nut seat (53); the second driving motor (62) is arranged at one end of the vertical plate (61), and the main belt (65) wheel (63) is arranged at one end of an output shaft of the second driving motor (62); a slave belt (65) wheel (64) arranged at the other end of the vertical plate (61); a belt (65) fitted on the primary pulley (63) of belts (65) and on the secondary pulley (64) of belts (65); and a locking toothed plate (66) assembled on the belt (65); a second sliding rail (67) is further arranged on the vertical plate (61), and a second sliding block (68) connected to the locking toothed plate (66) is slidably mounted on the second sliding rail (67);
z isLower partTo the driving module, ZLower partTo a drive module (33), ZOn the upper partTo the drive module and the zOn the upper partThe same to drive module structure, all include: a third driving cylinder (71) mounted on the slider toward the circuit board; and a mounting piece (72) which is assembled with the driving end of the third driving air cylinder (71) and is used for mounting the lower pressure plate (48) or the lower measuring probe (34) or the upper measuring probe (44) or the upper pressure plate (38).
4. A measuring structure of a copper foil thickness of a circuit board according to claim 1, wherein said transmission member (2) comprises: the wide plates (21) are assembled on two sides of the rack (1) in a sliding mode and used for limiting the circuit board, and each wide plate (21) comprises a front measuring station (210) and a back measuring station (211);
the rotating motor (22) is assembled on the frame (1) and respectively drives the front measuring station (210) and the back measuring station (211) to transmit;
the driving wheel (23) is arranged on the inner side of the wide plate (21) and is respectively matched with the rotating shaft of the rotating motor (22) on the front measuring station (210) and the back measuring station (211);
the driven wheel (24) is arranged on the inner side of the wide plate (21) and corresponds to the front measuring station (210) and the back measuring station (211) respectively; and a timing belt (25) fitted to the driving pulley (23) and the driven pulley (24);
the rack (1) is also provided with an adjusting motor (26), and an output end of the adjusting motor (26) is provided with an adjusting screw rod (27);
and a bearing seat (28) for the rotating shaft to penetrate through and an adjusting nut seat (29) for the adjusting screw rod (27) to be assembled in a threaded manner are arranged on the wide plate (21).
5. The measuring structure of the thickness of the copper foil of the circuit board as claimed in claim 4, wherein the end of the wide plate (21) corresponding to the front measuring station (210) and the back measuring station (211) is respectively provided with a limiting cylinder (212), the output end of the limiting cylinder (212) is provided with a limiting block (213) for limiting the circuit board, and the limiting block (213) is provided with a measuring sensor;
the wide plate (21) is close stopper (213) one side installs proximity sensor (214), and when proximity sensor (214) detected the signal that is close of circuit board, controller control spacing cylinder (212) drive stopper (213) are spacing to the circuit board.
6. The structure for measuring the thickness of the copper foil of the circuit board as claimed in claim 4, wherein a wear-resistant strip (215) for bearing the circuit board is arranged below the wide plate (21) corresponding to the synchronous belt (25);
the wide board (21) is provided with a plurality of spring pressing wheels (216) at intervals along the transmission direction, and the spring pressing wheels are used for limiting the surface of the circuit board.
7. The utility model provides a measuring equipment of circuit board copper foil thickness which characterized in that includes: a measuring structure of the thickness of copper foil of a wiring board according to any one of claims 1 to 6;
the feeding assembly (7) and the output assembly (8) are assembled on the rack (1), arranged at two ends of the transmission assembly (2) and used for feeding and discharging the circuit board respectively;
the CCD positioning adjusting component (9) is arranged on the rack (1) and is respectively used for shooting and positioning the circuit board on the front measuring station (210) and the back measuring station (211); and the number of the first and second groups,
and the controller is electrically connected with the measuring structure of the copper foil thickness of the circuit board, the feeding assembly (7), the output assembly (8) and the CCD positioning and adjusting assembly (9).
8. The apparatus for measuring the copper foil thickness of the circuit board as claimed in claim 7, wherein the feeding assembly (7) and the output assembly (8) are identical in structure and each comprises: bearing plates (71) mounted on two sides of the frame (1); a roller (72) mounted between the bearing plates (71); and a first stepping motor (73) which is assembled on one side of the bearing plate (71) and is used for driving the roller (72) to rotate;
a second guide rail (74) is arranged below the roller (72), and two second sliding blocks (75) are assembled on the second guide rail (74) in a sliding manner; the second sliding block (75) is provided with a material beating claw (76) the end part of which penetrates through the gap of the roller (72) and is used for carrying out centering limit on the circuit board;
a second stepping motor (77) is also arranged on the bearing plate (71); one end of an output shaft of the second stepping motor (77) is provided with a second bidirectional screw rod (78) which is rotatably assembled on the bearing plate (71); and a second nut seat (79) which is used for the threaded assembly of the second bidirectional screw rod (78) and is used for driving the material-shooting claws (76) at two sides to limit the circuit board is arranged on the second sliding block (75).
9. The apparatus for measuring the copper foil thickness of a circuit board according to claim 7, wherein the CCD positioning adjustment assembly (9) comprises: a third stepping motor (91) arranged on the mounting frame (03);
a third bidirectional screw rod (92) arranged at one end of an output shaft of the third stepping motor (91);
a third nut seat (93) which is assembled on the third bidirectional screw rod (92) in a threaded manner;
a third guide rail (94) arranged on the mounting rack (03) along the direction of the third bidirectional screw rod (92);
a third slide block (95) slidably fitted to the third guide rail (94) and to which the third nut holder (93) is attached;
a camera mounting plate (96) detachably mounted on one side of the third nut holder (93); and the number of the first and second groups,
and a photographing lens mounted on the camera mounting plate (96).
CN202010275442.2A 2020-04-09 2020-04-09 Measuring structure and measuring equipment for thickness of copper foil of circuit board Pending CN111307049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010275442.2A CN111307049A (en) 2020-04-09 2020-04-09 Measuring structure and measuring equipment for thickness of copper foil of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010275442.2A CN111307049A (en) 2020-04-09 2020-04-09 Measuring structure and measuring equipment for thickness of copper foil of circuit board

Publications (1)

Publication Number Publication Date
CN111307049A true CN111307049A (en) 2020-06-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010275442.2A Pending CN111307049A (en) 2020-04-09 2020-04-09 Measuring structure and measuring equipment for thickness of copper foil of circuit board

Country Status (1)

Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111812104A (en) * 2020-08-28 2020-10-23 菲迪斯智能装备(广东)有限公司 Two-sided detection machine of 3D copper foil board
CN113295123A (en) * 2021-05-18 2021-08-24 英拓自动化机械(深圳)有限公司 Thickness measuring equipment for PCB (printed circuit board)
CN113405466A (en) * 2021-06-17 2021-09-17 东莞市冠佳电子设备有限公司 Automatic measuring equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111812104A (en) * 2020-08-28 2020-10-23 菲迪斯智能装备(广东)有限公司 Two-sided detection machine of 3D copper foil board
CN113295123A (en) * 2021-05-18 2021-08-24 英拓自动化机械(深圳)有限公司 Thickness measuring equipment for PCB (printed circuit board)
CN113295123B (en) * 2021-05-18 2022-11-18 英拓自动化机械(深圳)有限公司 Thickness measuring equipment for PCB (printed circuit board)
CN113405466A (en) * 2021-06-17 2021-09-17 东莞市冠佳电子设备有限公司 Automatic measuring equipment

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