CN111304601A

CN111304601A - Evaporation apparatus and method

Info

Publication number: CN111304601A
Application number: CN201911276192.8A
Authority: CN
Inventors: 乌维·魏纳; 米夏埃尔·霍夫曼; 安德烈亚斯·穆勒
Original assignee: Von Ardenne GmbH
Current assignee: Von Ardenne GmbH
Priority date: 2018-12-12
Filing date: 2019-12-12
Publication date: 2020-06-19
Anticipated expiration: 2039-12-12
Also published as: CN111304601B; DE102018131905A1; DE102018131905B4

Abstract

According to various embodiments, an evaporation apparatus (300 to 800) may have: a vapor deposition region (224 r); a holder (302) for holding the evaporant at a distance from the evaporation region (224 r); a displacement device (304) designed to displace the holder (302) with respect to the evaporation zone (224 r); a control device, which is designed to actuate the displacement device (304) on the basis of a parameter, wherein the parameter represents the distance of the evaporation object from the evaporation zone (224 r).

Description

Evaporation apparatus and method

Technical Field

The present invention relates to an evaporation apparatus and a method.

Background

High power electron beams (e.g., having a power of a few kilowatts) are typically used in vacuum processing facilities to heat the substrate or workpiece, melt the material, or vaporize the coating material.

For example, the material (e.g. copper) can be heated by means of an electron beam in such a way that it first liquefies and then evaporates in a targeted manner. The resulting vapor is ultimately deposited as a coating on the substrate. The storage of the material takes place in a crucible. After the consumption of the material, the crucible must be refilled periodically accordingly.

Typically, the crucible is refilled by introducing additional evaporant into the crucible. The refilling of the crucible can be carried out, for example, under vacuum by continuously feeding a rod-shaped evaporant into the crucible from below. However, in the case of high evaporant consumption, refilling under vacuum is not usual because the amount of evaporant reserved under vacuum is limited. Therefore, in this case, the crucible is generally taken out of the vacuum and refilled in the atmosphere.

In the latter case, the material reserve in the evaporation crucible is consumed during the evaporation process until the evaporation crucible has to be refilled.

It has been recognized according to various embodiments that: this process affects the coating of the substrate. Obviously, the consumption of evaporant causes the bath level (i.e. the surface of the evaporant, which here transitions to the gas phase) in the evaporation crucible to fall. This increases the distance of the evaporated material from the substrate to be coated and thus also the route which the evaporated evaporant has to take in order to reach the substrate. The larger the course, the less vapor reaches the substrate, apparently because the ideal point vapor source emits directionally-dependently like a lambertian radiator.

To counteract this effect, it is generally necessary either to refill under vacuum or to remove the crucible from vacuum as frequently as possible. In this respect it has been recognized that: refilling of the crucible obviously requires a considerable amount of time, since the crucible is cooled under vacuum and can then be removed from the vacuum. As a result, the throughput of the process plant is reduced, costs are increased, and higher manpower and work costs are required. According to various embodiments, an evaporation device and a method are provided that significantly reduce the frequency of interruptions that may be required for refill of the evaporate.

Disclosure of Invention

According to different embodiments, variations in process conditions during evaporation can be counteracted by tracking the evaporant together with the crucible accordingly. Obviously, according to different embodiments, the evaporation crucible is lifted (i.e. displaced against the force of gravity) as the evaporation process progresses, and thus moves in the direction of the substrate. This may be done, for example, such that the spacing between the substrate and the bath level remains substantially constant over time.

The evaporation apparatus and method provided according to various embodiments may be used, for example, in a vacuum coating installation in which material is evaporated from a crucible.

According to a different embodiment, the evaporation device has: a vapor deposition region (also referred to as a cladding region); a holder for holding the evaporant at a distance from the evaporation zone; a displacement device configured to displace the support relative to the evaporation zone; a control device, which is configured to actuate the displacement device on the basis of a parameter, wherein the parameter represents a distance of the evaporation object from the evaporation zone.

Drawings

The figures show:

figures 1 and 11 show schematic side or cross-sectional views, respectively, of a crucible apparatus according to different embodiments;

figures 2, 9 and 10 show schematic side or cross-sectional views of a vacuum device according to various embodiments;

figures 3, 4, 5, 6, 7 and 8 show schematic side or cross-sectional views, respectively, of an evaporation device according to different embodiments;

fig. 12 shows a schematic flow diagram of a method according to various embodiments.

Detailed Description

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as "upper," "lower," "front," "rear," etc., is used with reference to the orientation of the figure(s) being described. Because components of the embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It is to be understood that features of the various exemplary embodiments described herein may be combined with each other as long as they are not specifically stated otherwise. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

Within the scope of this specification, the terms "connected," "coupled," and "coupled" are used to describe direct and indirect connections (e.g., ohmic and/or conductive, e.g., conductive, connections), direct or indirect connections, and direct or indirect couplings. In the figures, identical or similar elements are provided with the same reference numerals, where appropriate.

The terms "coupled" or "coupling" may, according to various embodiments, be understood in the sense of, for example, direct or indirect (e.g., mechanical, hydrostatic, thermal, and/or electrical) connection and/or interaction. For example, multiple elements may be coupled to one another along a chain of interactions along which interactions (e.g., signals) may be transmitted. For example, two elements coupled to each other may exchange interactions with each other, such as mechanical, hydrostatic, thermal and/or electrical interactions. According to various embodiments, "coupled" may be understood in the sense of mechanically (e.g., physically or physically) coupled, e.g., by direct physical contact. The coupling may be designed to transmit mechanical interaction (e.g., force, torque, etc.).

Control may be understood as intentionally affecting the system. Here, the state of the system may be changed according to a preset. Regulation can be understood as control, in which the change in state of the system caused by the disturbance is additionally counteracted. Obviously, the control device can have a control route oriented forward and thus obviously implement a flow control which converts the input quantity into the output quantity. However, the control circuit may also be part of a control loop, so that the regulation is carried out. In contrast to purely positive control, regulation has a continuous influence of the output quantity on the input quantity, which is caused (fed back) by the regulating circuit. In other words, an adjustment device may be used instead of or in addition to a control device, or an adjustment may be made in addition to or in alternative to a control. In the case of regulation, the actual value of the regulating variable (determined, for example, on the basis of the measured values) is compared with the pilot value (set value or preset value) and the regulating variable can be influenced accordingly by means of the manipulated variable (by means of the actuator) in such a way that a small deviation of the corresponding actual value of the regulating variable from the pilot value is obtained as far as possible.

According to various embodiments, the evaporation crucible (also referred to as melting crucible or simply crucible) can be arranged in a permanently water-cooled and gas-tightly closable enclosure (also referred to as crucible housing). The enclosure may have a cover that opens and closes automatically.

For example, according to various embodiments, copper may be evaporated. For this purpose, the copper would need to be heated in an evaporation crucible to a temperature of about 1400 ℃ or more. The evaporation crucible can, for example, have graphite or be formed therefrom.

According to various embodiments, the evaporant may also have a material other than copper. In general, the evaporant can have or be formed from copper (Cu), silver (Ag), tin (Sn), indium (In) and/or gold (Au), for example. For example, such evaporant may have or be formed from other noble metal compounds and alloys of, for example, copper (Cu), silver (Ag), tin (Sn), indium (In) and/or gold (Au). In principle, however, other types of evaporants, for example metals, can also be evaporated.

According to different embodiments, the supply provided can be used, which usually also has other types of crucibles and/or other types of evaporants, such as oxide evaporants, graphite evaporants, or evaporants of other chemical compounds.

In the context of the present description, a metal (also referred to as metallic material) may have (or be formed by) at least one metallic element (i.e. one or more metallic elements), for example at least one element from the following group of elements: copper (Cu), iron (Fe), titanium (Ti), nickel (Ni), silver (Ag), chromium (Cr), platinum (Pt), gold (Au), magnesium (Mg), aluminum (Al), zirconium (Zr), tantalum (Ta), molybdenum (Mo), tungsten (W), vanadium (V), barium (Ba), indium (In), calcium (Ca), hafnium (Hf), samarium (Sm), silver (Ag) and/or lithium (Li). Furthermore, the metal can have or be formed from a metal compound (e.g., intermetallic compound or alloy), for example a compound composed of at least two metal elements (e.g., metal elements out of the element group), such as bronze or brass, or for example a compound composed of at least one metal element (e.g., metal elements out of the element group) and at least one non-metal element (e.g., carbon), such as steel.

According to various embodiments, the substrate may have or be formed from at least one of the following: ceramics, glass, semiconductors (e.g., amorphous, polycrystalline, or monocrystalline semiconductors such as silicon), metals (e.g., aluminum, copper, iron, steel, platinum, gold, etc.), polymers (e.g., plastics), and/or mixtures of different materials, such as composite materials (e.g., carbon fiber reinforced carbon or carbon fiber reinforced plastics). The substrate may be provided as a sheet or tape (e.g. a film) or as a sheet or tape. For example, the substrate can have or be formed from a plastic film, a semiconductor film, a metal film and/or a glass film, and optionally be coated or coated. Alternatively or additionally, the substrate may, for example, have fibers, for example glass fibers, carbon fibers, metal fibers and/or plastic fibers, for example in the form of a woven, net, woven, knitted fabric, or as a felt or fleece.

According to various embodiments, the material (e.g. copper) can be heated by means of an electron beam, so that it is first liquefied and then evaporated in a targeted manner. The generated vapor may eventually be deposited as a coating on the substrate. Obviously, the reserve of material to be evaporated (also referred to as evaporant) can be carried out in a melting crucible (also referred to as evaporation crucible).

Fig. 1 illustrates a schematic side or cross-sectional view of a crucible apparatus 100 according to various embodiments.

The crucible apparatus 100 may have a crucible 104. The crucible 104 can have or be formed from at least one (i.e., one or more) container 104b (also referred to as an evaporant container).

The crucible apparatus 100 can optionally have a housing 102, for example, of multiple pieces. The housing 102 may, for example, be designed in an overpressure-stable manner and/or be gas-permeable, for example, even if the housing is spliced and/or closed. The multi-piece housing 102 facilitates access to the housing interior space 102 i.

The multi-piece housing 102 can have a housing well 102w (also referred to as a crucible carrying well) and a separate (e.g., removable) housing cover 102d (also referred to as a cover bezel). The housing cover 102d can be embodied, for example, in a frame-like manner and/or be penetrated by the opening 102o (also referred to as vapor outlet opening 102 o). The housing cover 102d may be placed over the housing well 102 w. The housing well 102w can be open in the direction of the housing cover 102d and provides a housing interior 102 i. The vapor exit opening 102o may partially expose the housing interior space 102 i.

The crucible 104, for example, each evaporant container 104b, may have a recess 104t (also referred to as a crucible pot) in which an evaporant 106 is disposed. Evaporant 106 can generally be the following materials: the material may be melted and/or sublimated and/or converted to the gaseous phase under the action of heat. For example, the recess 104t may be disposed below the vapor exit opening 102 o.

The transformation of the evaporant into the vapor phase may also be referred to as thermal evaporation. Thermal evaporation can have a transition from a liquid phase to a gas phase, as well as a direct transition from a solid phase to a gas phase (also known as sublimation). The (vaporized) evaporant that is converted to the vapor phase may be emitted into the housing 102 toward the vapor exit opening and then emitted outward from the housing 102 through the vapor exit opening 102o, e.g., toward the evaporation region.

The crucible 104 may be at least partially (i.e., some or all of the constituent parts of the crucible) made of, i.e., have or be formed of, a high temperature resistant material. For example, at least one evaporant container 104b may have or be formed from a high temperature resistant material.

The following materials may be understood as refractory materials: the material has a decomposition temperature (e.g., melting temperature and/or sublimation temperature) greater than about 2500 ℃, such as greater than about 2750 ℃, for example greater than about 3000 ℃, under vacuum (e.g., with the exclusion of oxygen). The refractory material may, for example, have carbon or be formed from carbon, for example in the form of a carbon modification, such as graphite, or in the form of a carbide. Alternatively, the refractory material may have fibers. For example, the refractory material can have or be formed from a fiber composite, wherein the fiber composite can have carbon, for example.

For example, the refractory material may have or be formed from carbon fiber reinforced carbon (CFC). For example, carbon fiber reinforced carbon may enable low cost manufacturing. For example, carbon fiber reinforced carbon may be inexpensively processed and/or have a relatively high flexural strength.

Alternatively, other crucible types may be used, such as water-cooled copper crucibles and/or crucibles without a housing 102.

The crucible apparatus 100 optionally may have a crucible holding structure 108 that holds the crucible 104 within the housing 102.

Optionally, the housing 102 may have a radiation shield 102 s. For example, the radiation shield 102s may prevent heat transfer from the crucible 104 through the housing 102. The crucible apparatus 100 may optionally have a gas supply structure 110. The gas supply structure 110 may have one or more gas exit openings (e.g., in the form of a gas distributor), e.g., directed toward the crucible 104.

The crucible apparatus 100 can optionally have a lid closure 112. The lid closure 112 can be designed to close or at least cover the vapor exit opening 102o when evaporation should not take place.

The power introduced into the evaporant 106 by means of the electron beam can heat the evaporant 106 and finally convert into the vapor phase (also referred to as evaporation of the evaporant 106). The evaporated evaporant 106 may emerge from the vapor exit opening 102o and collect at (that is, form a layer on) a substrate (not shown).

Optionally, the housing 102, e.g., the housing basin 102w and/or the housing cover 102d may be water cooled or water cooled. Alternatively or additionally, the lid closure 112 may be water-cooled or water-cooled.

Fig. 2 illustrates a schematic side or cross-sectional view of a vacuum apparatus 200 having, for example, a crucible apparatus 100 (e.g., an evaporation crucible 104), according to various embodiments.

According to various embodiments, the vacuum device 200 may have: a vacuum chamber 224 (also referred to as a vacuum processing chamber or an evaporation chamber) in which an evaporation region 224r is provided, wherein the evaporation region 224r may have, for example, at least one vacuum section. The vacuum chamber 224 may also have at least one (i.e., exactly one or more)

striking region

224a, 224 b.

The vacuum apparatus 200 may also have at least one (i.e. exactly one or more) electron beam gun 122, for example having an electron beam source 112q and a steering system 142a for steering the electron beam 23 into at least one

impact region

224a, 224 b. The electron beam source 112q may have an electron source (e.g., a cathode, such as a hot cathode) and a beam shaping element (e.g., an anode).

The steering sequence may obviously represent a sequence of desired impact points and/or a desired trajectory (also referred to as desired steering trajectory) to which the electron beam 23 is directed (i.e. should be moved by means of the electron beam 23), the or each steering sequence may define a trajectory 155 which is closed itself or a sequence of desired impact points 155 along a trajectory 155 which is closed itself, which desired impact points should be irradiated (so-called impact map 155). more generally, the impact map 155 is described by a steering map (also referred to as steering pattern), which steering may be directed, for example, to a steering angle (α) (also referred to as electron beam steering sequence), for example, a plurality of times in sequence according to the same steering sequence_x(t)，α_y(t)) in which the electron beam 23 is steered by said steering angle from its rest position.

The or each crucible 104 may, for example, be provided in a housing 102 which is provided in a vacuum chamber 224.

In the evaporation region 224r, a workpiece 202 to be coated, for example a plate-shaped or strip-shaped substrate 202, can be arranged and/or transported.

The target material, i.e. the material to be evaporated (evaporant), can for example have a metal or metal compound (e.g. an alloy), an oxide, graphite, an organic material, a plastic or a ceramic. The spacing of the electron beam source 112q from the evaporant and/or the housing 102 may be, for example, in the range of about 0.3m to about 5m, such as in the range of about 1m to about 2 m. Alternatively or additionally, the target material may be provided in a vacuum, for example during its irradiation and/or evaporation. The electron beam source 112q may provide an electron beam of several kW (kilowatts) of power, for example, having a radiant power in the range of about 1kW to about 1 MW.

One or more electron beam guns 122 may be powered by the energy supply 120. For example, the energy supply 120 may provide an acceleration voltage and/or a cathode current of the electron beam gun 122. The acceleration voltage may be provided by means of a transformer of the energy supply 120.

According to various embodiments, the chamber housing 224, for example the or each vacuum chamber 224 provided therein, may be designed such that a pressure in the range of about 10mbar to about 1mbar (in other words, a rough vacuum) may be provided therein, or a lower pressure, for example about 1mbar to about 10mbar may be provided therein^-3A pressure in the mbar range (in other words, a high vacuum), or a lower pressure, for example about 10^-3mbar to about 10^-7A pressure in the mbar range (in other words, a high vacuum), or a pressure providing less than, for example, a pressure less than a high vacuum, for example less than about 10^-7A pressure of mbar. For this purpose, the chamber housing 224 can be designed to be stable so that it withstands the action of the air pressure in the pumped-out state.

The substrate 202 may be fixedly disposed in the evaporation region 224 r. Alternatively, the substrate 202 may be conveyed along the conveying path 111p in the evaporation region 224r, for example, by means of a conveying device. The transport apparatus may have, for example, a plurality of transport rollers 282 that contact the substrate.

Fig. 3 illustrates a schematic side or cross-sectional view of an evaporation apparatus 300 according to various embodiments.

The evaporation apparatus 300 can have a holder 302 for holding the evaporant at a distance from the evaporation zone 224r, for example at a distance 301 from the transport path 111p, along which the substrate 202 is transported through the evaporation zone 224 r.

The evaporation device 300 may also have a displacement device 304 which is designed to displace 801 the holder 302 relative to the evaporation zone 224r, for example towards and/or away from it. The direction of displacement may for example be parallel to the direction of gravity.

The evaporation apparatus 300 may also have a control device 306, which is designed to operate the displacement device 304 (e.g. its drive device). The manipulation may have: a displacement 801 of the gantry 302 (also referred to as a gantry displacement 801) is caused by the displacement device 304.

According to various embodiments, the manipulation can be carried out on the basis of a parameter which represents the distance 301 of the evaporation object from the evaporation zone.

For example, the displacement device 304 may have a drive device and an actuator that converts a force provided by the drive device 504 into a displacement motion (e.g., a linear motion). The actuators may be based on different types of mechanisms, which are described in more detail below.

For example, the displacement device 304 of the evaporation apparatus 300 may have a traction mechanism or at least one traction mechanism coupled with the bracket 302.

In the following, for ease of understanding, reference is made to a displacement device 304 designed to generate a reciprocating force. More generally, the displacement device 304 may have a reciprocating device that transmits a reciprocating force to the carriage 302 (e.g., from below the carriage 302). Similarly, the description may also apply to a displacement device 304 designed to produce tractive effort. In other words, the displacement device 304 may have a traction device that transfers traction onto the carriage 302 (e.g., from above the carriage 302) instead of or in addition to a reciprocating device. The reciprocating and/or tractive forces may be oriented opposite to gravity, for example.

Alternatively, the evaporator arrangement 300 can have a sensor 432 which is designed to detect a parameter, i.e. an operating point parameter. The operating point parameter may be a parameter of an operating point at which evaporation of the evaporant is performed. In general, the operating point parameter (also referred to as a state parameter) can be a physical quantity which can be detected by means of the sensor 432 and which has, for example, a value (e.g., a scalar quantity).

The type of sensor can be adapted to the conditions and to the operating point parameters to be detected. For example, the sensor 432 may have or be formed by an optical sensor 432, a distance sensor 432, and/or a weight sensor 432 (e.g., a weighing cell).

The operating point parameter (e.g., a measured value thereof) detected by the sensor 432 may represent, for example, a weight, such as a weight of the evaporant. Depending on how the sensors are arranged, the operating point parameters may also include at least one constant weight (e.g., the weight of the cradle 302 and/or the housing 102). If at least one constant weight is known, the weight of the evaporant in the evaporating crucible 104 can be determined from the operating point parameters detected by the sensors.

The amount of evaporant in the evaporating crucible 104 can be determined based on operating point parameters (e.g., weight) and from this the relative position of the bath level in space can be determined. The bath level may represent the following surface of the evaporant: on which the evaporant is irradiated and/or converted into the gas phase by means of an electron beam. The relative position of the bath level in space and the distance of the evaporation object from the evaporation zone 224r can be unambiguously mapped to one another, i.e. they represent one another.

In other words, based on the operating point parameters detected by the sensors, the relative position of the bath level in space and/or its spacing from the evaporation zone 224r can be inferred. In other words, the detected operating point parameter (e.g., weight) and the distance of the evaporation object from the evaporation region 224r can be univocally mapped to each other.

The control device may be designed to control and/or regulate the displacement of the holder 302 on the basis of the found position of the bath level in space, i.e. its actual value. Alternatively or additionally, another parameter can also be used as an actual value for the control and/or regulation, which represents the amount of evaporant in the evaporation crucible 104. This makes use of the fact that: the quantity of evaporant (e.g. its volume and/or its weight) and the determined position of the bath level in space can be unambiguously mapped onto each other (i.e. they represent each other).

In a similar manner, another type of operating point parameter detected by the sensor 432, for example an optically detected operating point parameter, which represents the amount of evaporant, may also be used. For example, the evaporation crucible 104 may have an optical marking that is partially covered by the evaporant. It is then possible, for example, to determine optically which part of the marking is covered and/or uncovered and to determine the position of the bath level in space on the basis thereof.

Alternatively or additionally, the sensor 432 can have a distance sensor, which is arranged above the evaporation crucible 104. Thus, for example, the sensor can determine the position of the bath level in space directly as a measured value or at least its distance from the bath level.

The control device 306 may optionally determine a deviation of the position of the bath level (or a parameter representative thereof) from a reference position and/or determine whether the deviation exceeds a threshold. If the threshold is exceeded, the control device 306 may cause displacement of the mount 302. This prevents, for example, the introduction of wobbling of the carrier, in contrast to a continuously operating control loop. The threshold may be another threshold representing the maximum distance of the bath liquid level from the vapor deposition region 224 r.

In an alternative embodiment, the control device 306 may also determine an actual value representing the amount of evaporation on the basis of the duration (as actual value). The duration can be, for example, the duration of the evaporation process and/or the coating process, or the duration of the evaporant having been irradiated as a whole, etc. To this end, the control device 306 may calculate, for example, the amount of material evaporated based on the duration and the evaporation rate. Alternatively or in addition to the evaporation rate, another operating point parameter which is representative of the evaporation rate can also be used, for example the temperature of the evaporant, the electron beam power or the like. The operating point parameter may be detected, for example, by means of a sensor 432, for example, by means of a rate sensor 432, a temperature sensor 432, and/or a power sensor 432. Alternatively, the operating point parameters can be stored in the control device 306, for example as constant calibration constants which are determined at regular intervals and/or manually with the aid of a calibration cycle. It is also possible to read a database in which the operating point parameters are stored in tabular manner in relation to one or more actual values.

The amplitude of the rack displacement 801 (e.g., its stroke) can be, for example, less than the depth of the crucible pot and/or in the range of about 5cm to about 10 cm. The depth of the crucible pot can be, for example, greater than 10cm, for example about 10cm (centimeters). This prevents the evaporant from being completely consumed. If the amplitude of the rack displacement 801 is exhausted, the evaporation crucible 104 can be removed from the vacuum and refilled.

Fig. 4 illustrates a schematic side or cross-sectional view of an evaporation device 400, such as evaporation device 300, according to various embodiments.

The evaporation apparatus 400 may also have a crucible apparatus 100 (e.g., evaporation crucible 104) that may be placed on the rack 302. The holder 302 may, for example, have a support surface 302f on which the crucible apparatus 100 can be placed.

If the evaporation crucible 104 is removed from the vacuum chamber 244, the rack 302 may remain in the vacuum chamber 244.

The control device 306 may be designed to displace the crucible arrangement 100 (e.g. the evaporation crucible 104) by means of the displacement device 304 (e.g. its drive device).

Fig. 5 illustrates a schematic side or cross-sectional view of an evaporation device 500 according to various embodiments. The vaporizing device 500 may be designed like the

vaporizing device

300 or 400, with the difference that the displacement apparatus 304 has a reciprocating piston mechanism or at least one or more than one (e.g. four) working cylinders 502 (e.g. pneumatic or hydraulic cylinders).

The or each working cylinder 502 may be part of a reciprocating piston mechanism operated by means of the control device 306. The reciprocating piston mechanism may, for example, implement fluid force transmission (e.g., pneumatically or hydraulically). To this end, the reciprocating piston mechanism may, for example, have a drive device 504 (e.g., a pump, etc.) designed to place the fluid under pressure. The direction of reciprocation of the reciprocating piston mechanism may be parallel to gravity, for example. This enables direct force transmission.

Fig. 6 illustrates a schematic side or cross-sectional view of an evaporation device 600 according to various embodiments. The vaporizing device 600 may be designed as one of the vaporizing devices 300 to 500, with the difference that the displacement apparatus 304 has one or more shearing mechanisms 602, for example shearing reciprocating mechanisms 602, or one or more shearing actuators.

The displacement device 304 may have, for example, a drive device 504 (e.g., an electric motor and/or a working cylinder 502) which is actuated by means of the control device 306. The drive apparatus 504 may be designed to operate the shearing mechanism 602. The displacement device 304 may have, for example, a spindle drive that provides force transmission from the electric motor to the shear mechanism 602. Alternatively or in addition to the spindle drive, a working cylinder (e.g. a pneumatic or hydraulic cylinder) may also be used.

Fig. 7 illustrates a schematic side or cross-sectional view of an evaporation device 700 according to various embodiments. The vaporizing device 700 may be designed as one of the vaporizing devices 300 to 600, with the difference that the displacement apparatus 304 has a spindle reciprocating mechanism 702 or at least one or more spindle drives.

The spindle drive can be part of a spindle reciprocating mechanism which also has a drive device 504 (for example an electric motor) which is actuated by means of the control device 306. The drive apparatus 504 may be designed to operate the spindle reciprocating mechanism 702, i.e., to transfer force thereto. The displacement device 304 may have, for example, a spindle drive which provides a force transmission from the drive device 504 to the support 302.

Fig. 8 illustrates a schematic side or cross-sectional view of an evaporation device 800 according to various embodiments. The evaporation device 800 may be designed as one of the evaporation devices 300 to 700 and may also have a support structure 812.

Support structure 812 may be fixedly disposed relative to evaporation region 224r and/or relative to vacuum chamber 224. For example, the support structure 812 may be supported on a chamber bottom of the vacuum chamber 224.

The support structure 812 may provide a parking surface 812f on which the crucible apparatus 100 or at least the evaporation crucible 104 may be parked. This can be achieved: the crucible arrangement 100 or at least the evaporation crucible 104 can be parked on a stationary parking surface 812f, which increases the reliability of arranging the evaporation crucibles 104 in the same position. Alternatively or additionally, the displacement apparatus 304 may be more easily replaced and/or maintained.

The carriage displacement 801 may be via a support structure 812 (e.g., a parking surface 812f thereof). In other words, the displacement device 304 may be designed such that the bracket 302 may be placed in the first position and the second position. In the first position, the bearing surface 302f of the stand 302 can be disposed above the parking surface 812f of the support structure 812 (in the vertical direction 105). In the second position, the bearing surface 302f of the stand 302 can be disposed below the parking surface 812f of the support structure 812 (in the vertical direction 105). The spacing of the first and second positions may correspond to the magnitude of the stent displacement 801.

This is achieved: the evaporation crucible 104 arranged on the support structure or the crucible arrangement 100 arranged on the support structure can be received by the support structure 812 by means of the holder 302 and/or can be placed on the support structure 812.

Thereby, for example, it is possible to realize: the crucible 104 can be removed from the vacuum chamber in a horizontal direction without mechanically loading the displacement device 304 with a lateral force.

Fig. 9 illustrates a schematic side or cross-sectional view of a vacuum apparatus 900, for example, having a crucible apparatus 100 (e.g., an evaporation crucible 104), according to various embodiments.

The vacuum device 900 can have an evaporation device 802, which can be designed as one of the evaporation devices 300 to 800. The displacement device 304 (or at least its drive) may be arranged within the vacuum chamber 224, for example between the holder 302 and the chamber bottom of the vacuum chamber 224. The displacement device 304 may be supported, for example, on a chamber bottom of the vacuum chamber 224.

In a similar configuration, the displacement apparatus may be disposed partially within the vacuum chamber 224 and partially outside the vacuum chamber 224. Alternatively, one or more components of the displacement device (e.g., at least the drive device) disposed within the vacuum chamber 224 may be vacuum-tightly enclosed. This simplifies the construction of the vacuum chamber 224.

Fig. 10 illustrates a schematic side or cross-sectional view of a vacuum apparatus 1000 according to various embodiments, for example with a crucible apparatus 100 and/or an evaporation crucible 104.

The vacuum apparatus 1000 may be designed like the vacuum apparatus 900 with the difference that the displacement device 304 (or at least its drive device) is arranged outside the vacuum chamber 224 and the holder 302 is arranged inside the vacuum chamber 224.

To this end, the vacuum chamber may have a vacuum-tight feedthrough 806 that couples the displacement apparatus 304 with the carriage 302. The lead 806 may have, for example, a pull lead and/or a turn lead, for example, of different lead types, for example, a bellows-type lead. The lead-through 806 may, for example, have or be formed by one or more bellows.

The threading portion 806 realizes: there is no need to expensively package the components of the displacement apparatus 304. Alternatively, those components of the displacement apparatus 304 that do not require packaging (also referred to as vacuum compatible components) may be disposed within the vacuum chamber 224.

Fig. 11 illustrates a schematic side or cross-sectional view of a crucible apparatus 1100 according to various embodiments. The crucible apparatus 1100 may be designed as the crucible apparatus 100 and may also have a bottom plate 704.

The bottom plate 704 may have a bearing surface 704a on which the evaporation crucible 104 or, alternatively, the housing 102, may rest. The parking face 812f of the support structure 812 may have one or more guide systems (e.g., having one or more guide profiles) that provide a displacement path for the chassis 704 (e.g., along the horizontal direction 101, 103), e.g., out of the vacuum chamber 224. The chassis 704 may have a chassis, by means of which a plurality of rolling bodies 704w are rotatably mounted.

If the crucible 104 (e.g. crucible arrangement) is displaced by means of the cradle displacement 801, the bottom plate 704 can remain stationary on the support structure 812. This reduces the weight to be lifted. To this end, the chassis 704 may have an opening through which the bracket 302 may pass.

For example, the guide system may have or be formed by one or more guide rails or one or more other guide elements (e.g. profile rail guides).

FIG. 12 illustrates a schematic flow diagram of a method 1200 according to various embodiments.

The method 1200 may have: in 1201, the evaporant is thermally evaporated from the evaporation crucible into an evaporation zone; at 1205, detecting a parameter representing a distance of the evaporation object from the evaporation area; and in 1207, the evaporation crucible is displaced relative to the evaporation region based on the parameters (also referred to as "rack displacement").

The method may optionally have at 1203: the substrate is transported in the evaporation zone, for example by means of a transport device.

In general, the parameter representing the distance of the evaporation material from the evaporation region can represent the positional relationship of the evaporation material (e.g., bath level) and the evaporation region to each other. The position of the evaporation zone may be defined by a transport path (or transport device), for example. Obviously, the spacing of the evaporation from the evaporation zone represents: how far the evaporant is from the substrate to be coated as it is conveyed along the conveying path and/or by means of the conveying device.

If the substrate is transported by means of a transport device, the parameter can represent the distance of the evaporation object from the transport device (e.g. its transport rollers).

The method may optionally have: the substrate is coated with the evaporated evaporant in the evaporation zone.

The displacement of the evaporation crucible can take place, for example, upwards (i.e. in the direction opposite to the force of gravity) and/or towards the conveying device. Alternatively or additionally, the displacement of the evaporation crucible can be carried out toward the evaporation region, for example a substrate arranged therein.

The method may optionally have: the distance between the evaporation material and the evaporation region is determined based on the parameters. The method may optionally have: the deviation (for example, the parameters and/or the distance of the evaporation object from the evaporation area) from the reference parameters is determined.

The method may optionally have: if the deviation exceeds a threshold, the evaporant is displaced.

Furthermore, an exemplary vacuum device according to various embodiments, such as vacuum device 1000, may be designed as follows.

The evaporation crucible 104 (also referred to as melting crucible) can be arranged in a permanently water-cooled and gas-tightly closable enclosure 102 (also referred to as housing 102). The enclosure 102 may have a cover 112 that automatically opens and closes. The entire unit consisting of the enclosure 102 and the evaporation crucible 104 (also referred to as a crucible assembly) can be placed on a lifting device 304 which enables tracking of the crucible position as a function of the evaporated material consumed.

For example, the evaporant may have or be formed of copper. The evaporant may be evaporated by means of an electron beam 23. The crucible arrangement formed by the melting crucible 102 and the enclosure 104 is in the operating position on a lifting device 304 in the vacuum chamber 224. The lift 304 may have four or more spindle reciprocators that are vacuum-tightly coupled via respective spring bellows 806.

In order to be able to detect the consumption of the evaporation material in real time, one or more weighing cells 432 may be provided between the respective lifting column 806 and the support point of the crucible apparatus. The one or more weighing cells 432 may be connected to the facility control device 306 (not shown). Depending on the consumption, the crucible 104 can be raised during the operation of the installation with defined, for example discontinuous steps, such that the spacing of the bath level from the coating plane 111p of the substrate 202 remains substantially constant (i.e. within the spacing of the discontinuous steps). Alternatively or additionally, the consumption of the evaporation material can likewise be calculated from the respective current evaporation rate and the calculated value can be used to check the value output by the weighing cell.

According to various embodiments it can be ensured that the selected process conditions remain substantially constant even in the case of a correspondingly high evaporant consumption. The value of the material consumption can be output directly from the weighing cell and/or can be determined computationally, for example, in parallel therewith from the current evaporation rate.

The following describes different examples relating to the above description and shown in the drawings.

Example 1 is an evaporation apparatus 300 to 800 having: an evaporation region 224 r; a holder 302 for supporting the evaporant at a distance from the evaporation region 224 r; a displacement device 304 designed to displace the holder 302 with respect to the evaporation zone 224 r; a control device 306, which is designed to actuate the displacement device 304 on the basis of a (for example detected and/or ascertained) parameter, wherein the parameter represents the distance of the evaporation material from the evaporation zone 224 r.

Example 2 is the evaporation apparatus 300 to 800 according to example 1, further having: an electron beam gun 122 for emitting an electron beam 23 towards the support 302.

Example 3 is the evaporation apparatus 300 to 800 according to example 1 or 2, wherein the displacement device 304 has one or more reciprocating cylinders 502.

Example 4 is the evaporation apparatus 300 to 800 according to one of examples 1 to 3, wherein the displacement device 304 has one or more shearing reciprocating actuators 602.

Example 5 is the evaporation apparatus 300 to 800 according to one of examples 1 to 4, wherein the displacement device 304 has one or more spindle drives 502.

Example 6 is the evaporation apparatus 300 to 800 according to one of examples 1 to 5, wherein the displacement device 304 is vacuum-tightly encapsulated.

Example 7 is the evaporation apparatus 300 to 800 according to one of examples 1 to 6, further having: a support structure, which is arranged in a stationary manner relative to the evaporation zone 224r, wherein the holder 302 is displaced past the support structure such that an evaporation crucible placed on the support structure can be received by the support structure and/or parked on the support structure by means of the holder 302, wherein the evaporation crucible is separated from the holder 302, for example, when the evaporation crucible is parked on the support structure, and the evaporation crucible is contacted by the holder 302 when the evaporation crucible is received by the support structure.

Example 8 is the evaporation apparatus 300 to 800 according to example 7, wherein the support structure has one or more guide rails for supporting a bottom plate for evaporating the crucible.

Example 9 is the evaporation apparatus 300 to 800 according to one of examples 1 to 8, further having: a sensor is designed to sense a parameter.

Example 10 is the evaporation apparatus 300 to 800 according to example 9, wherein the sensor is an optical sensor or a weight sensor (e.g., a weighing cell).

Example 11 is the evaporation apparatus 300 to 800 according to one of examples 1 to 10, wherein the control device 306 is designed to control and/or regulate the displacement based on a parameter.

Example 12 is the evaporation apparatus 300 to 800 according to one of examples 1 to 11, wherein the control device 306 is designed to displace the holder 302 when the parameter or the quantity derived therefrom meets a criterion, wherein the criterion represents a maximum spacing.

Example 13 is the evaporation apparatus 300 to 800 according to one of examples 1 to 12, wherein the control device 306 is designed to find the parameter based on a stored physical quantity (e.g. electron beam power and/or evaporation rate) and an amount of time, wherein the physical quantity represents a rate for performing evaporation of the evaporant, and wherein the amount of time represents a duration for which evaporation of the evaporant is performed.

Example 14 is the evaporation apparatus 300 to 800 according to example 13, wherein the physical quantity is an electron beam power.

Example 15 is an evaporation apparatus 300 to 800 according to one of examples 1 to 14, wherein the parameter is a physical parameter of the evaporant, such as its relative position in space and/or its weight.

Example 16 is the evaporation apparatus 300 to 800 according to one of examples 1 to 15, wherein the parameter is the weight of the evaporant.

Example 17 is the evaporation apparatus 300 to 800 according to one of examples 1 to 16, wherein the parameter is the spatial position of the evaporant surface.

Example 18 is the evaporation apparatus 300 to 800 according to one of examples 1 to 17, wherein the parameter represents a proportion of the evaporation crucible exposed by the evaporant, for example, wherein the parameter represents a degree of progress of the evaporation crucible being exposed at the time of evaporation of the evaporant.

Example 19 is the evaporation apparatus 300 to 800 according to one of examples 1 to 18, wherein the parameter represents an optical pattern, which is at least partially covered by the evaporant and/or is exposed upon evaporation of the evaporant.

Example 20 is the evaporation apparatus 300 to 800 according to one of examples 1 to 19, wherein the parameter represents the rate and/or spatial distribution of the coating in the evaporation zone.

Example 21 is the evaporation apparatus 300 to 800 according to one of examples 1 to 20, wherein the parameter represents a time-dependent evaporation rate.

Example 22 is the evaporation apparatus 300 to 800 according to one of examples 1 to 21, further having: a transport device for transporting the substrate in the evaporation region 224r, which provides a transport path through the evaporation region 224r, for example.

Example 23 is a

vacuum apparatus

200, 900, 1000 having: the evaporation apparatus 300 to 800 according to one of examples 1 to 22; and a vacuum chamber in which the vapor deposition region 224r is provided.

Example 24 is the

vacuum apparatus

200, 900, 1000 according to example 23, wherein the displacement device 304 is disposed outside the vacuum chamber; and/or wherein the support 302 is disposed within a vacuum chamber.

Example 25 is the

vacuum apparatus

200, 900, 1000 according to example 24, wherein the vacuum chamber has a vacuum-sealed feedthrough by which the displacement device 304 is coupled with the mount 302.

Example 26 is the

vacuum apparatus

200, 900, 1000 according to example 25, wherein the lead-through has a bellows (e.g., a spring bellows or a rubber bellows); and/or wherein the lead-through has a disc-like lead-through.

Example 27 is a

vacuum apparatus

200, 900, 1000 having: a vacuum chamber having an evaporation region 224 r; a holder 302 provided in the vacuum chamber for supporting the evaporation crucible at a certain distance from the evaporation region 224 r; a reciprocating device designed to displace the holder 302 in a vertical direction towards or away from the evaporation zone 224 r; and optionally a control device 306 according to one of examples 1 to 26.

Example 28 is a method 1200 having: thermally evaporating the evaporant from the evaporation crucible into the evaporation region 224 r; detecting a parameter representing a distance of the evaporation object from the evaporation area 224 r; shifting the evaporation crucible relative to the evaporation region 224r based on the parameter; wherein the method 1200 is optionally further designed to perform a displacement of the evaporation crucible according to one of examples 1 to 27; the method optionally further has: the holder is displaced past a support structure which is arranged in a stationary manner relative to the evaporation region, so that the evaporation crucible which is placed on the support structure is received by the support structure by means of the holder and/or the evaporation crucible rests on the support structure, wherein the evaporation crucible is separated from the holder 302, for example, when the evaporation crucible is resting on the support structure, and the evaporation crucible is contacted by the holder 302 when the evaporation crucible is received by the support structure.

Claims

1. An evaporation apparatus (300 to 800) having:

a vapor deposition region (224 r);

a holder (302) for holding the evaporant at a distance from the evaporation region (224 r);

a displacement device (304) designed to displace the holder (302) with respect to the evaporation zone (224 r);

a control device (306) which is designed to actuate the displacement device (304) on the basis of a parameter, wherein the parameter represents the distance of the evaporation object from the evaporation zone (224 r);

a support structure, which is arranged in a stationary manner relative to the evaporation region (224r), wherein the displacement of the holder (302) takes place via the support structure such that an evaporation crucible can be received by the support structure and/or parked on the support structure by means of the holder (302).

2. The evaporation apparatus (300 to 800) of claim 1, further having: an electron beam gun for emitting an electron beam towards the support (302).

3. The evaporation apparatus (300-800) according to claim 1 or 2, wherein the displacement device (304) has one or more reciprocating cylinder mechanisms.

4. The evaporation apparatus (300 to 800) according to claim 1 or 2, wherein the displacement device (304) has one or more spindle drives.

5. The evaporation apparatus (300 to 800) according to claim 1 or 2, further having: a weight sensor and/or a distance sensor designed to detect said parameter.

6. Evaporation apparatus (300 to 800) according to claim 1 or 2, wherein the control device (306) is designed to displace the holder (302) when the parameter meets a criterion, wherein the criterion represents a maximum spacing.

7. The evaporation apparatus (300 to 800) according to claim 1 or 2, wherein the control device (306) is designed to find the parameter based on a stored physical quantity and an amount of time, wherein the physical quantity represents a rate at which evaporation of the evaporant is carried out, and wherein the amount of time represents a duration for which evaporation of the evaporant is carried out.

8. The evaporation apparatus (300 to 800) according to claim 1 or 2, wherein the parameter represents an optical pattern which is exposed when the evaporant evaporates.

9. A vacuum apparatus (200, 900, 1000) having:

an evaporation device as claimed in claim 1 or 2, and

and a vacuum chamber in which the vapor deposition region (224r) is provided.

10. The vacuum apparatus (200, 900, 1000) of claim 9, wherein said displacement device (304) is disposed outside said vacuum chamber; and/or wherein the support (302) is disposed within the vacuum chamber.

11. A vacuum apparatus (200, 900, 1000) having:

a vacuum chamber having a deposition region (224 r);

a holder (302) arranged in the vacuum chamber for supporting an evaporation crucible at a distance from the evaporation region (224 r);

a reciprocating device designed to displace the support (302) in a vertical direction towards or away from the evaporation zone (224 r);

a support structure, which is arranged in a stationary manner relative to the evaporation region (224r), wherein the holder (302) is displaced past the support structure such that an evaporation crucible can be received by the support structure and/or parked on the support structure by means of the holder (302).

12. A method (1200) having:

displacing a holder (302) past a support structure, which is arranged in a stationary manner relative to an evaporation zone (224r), such that an evaporation crucible arranged on the support structure can be received by the support structure by means of the holder (302) and/or parked on the support structure;

thermally evaporating evaporant from the evaporation crucible into the evaporation region (224 r);

detecting a parameter representative of a spacing of the evaporation object from the evaporation region (224 r);

-displacing the evaporation crucible relative to the evaporation area (224r) based on the parameter.