CN111299731A - Processing method for forming microstructure on surface of workpiece and control system - Google Patents
Processing method for forming microstructure on surface of workpiece and control system Download PDFInfo
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- CN111299731A CN111299731A CN202010217579.2A CN202010217579A CN111299731A CN 111299731 A CN111299731 A CN 111299731A CN 202010217579 A CN202010217579 A CN 202010217579A CN 111299731 A CN111299731 A CN 111299731A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
- B23H3/04—Electrodes specially adapted therefor or their manufacture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
- B23H3/02—Electric circuits specially adapted therefor, e.g. power supply, control, preventing short circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
- B23H9/008—Surface roughening or texturing
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Abstract
The invention relates to a processing method for forming a microstructure on the surface of a workpiece, which comprises the following steps: s1, providing a micro rod with a small electrochemical resistance value on the surface, and forming a first microstructure with a large electrochemical resistance value on the surface of the micro rod at a high temperature to obtain a line electrode; and S2, providing the workpiece inserted into the electrolyte as an anode, driving the wire electrode to rotate and driving the wire electrode to rotate around the workpiece, and supplying power to the workpiece and the wire electrode to form a required microstructure on the surface of the workpiece according to the first microstructure on the wire electrode. The wire electrode of the first microstructure with a large electrochemical impedance value on the surface is used as a tool electrode, so that the flexible and controllable preparation of the microstructure array on the surface of the workpiece can be realized, particularly the processing of the microstructure array of a small-caliber rotary surface and a quasi-rotary surface can be realized, in addition, the wire electrode can be repeatedly used, and the processing method is suitable for any curved surface obtained by linear scanning.
Description
Technical Field
The invention relates to a processing method for forming a microstructure on the surface of a workpiece and a control system.
Background
The surface microtexture technology is to construct a series of microstructure arrays with certain shapes, sizes and arrangement modes on the surface of a material by utilizing a micro-machining method so as to improve/regulate the surface characteristics of the material. In recent years, with the development of micro-machining technology, surface micro-texture technology has been successfully applied in various fields such as bionics, tribology (friction reduction, tool wear reduction and adhesion reduction), microfluidics (micro-channel drag reduction) and biomedicine (implant biocompatibility improvement), and has achieved good effects.
At present, the processing technology of the surface microstructure array (microtexture) mainly comprises micro milling, laser processing, abrasive gas jet, electric spark processing, mask electrolytic processing and the like. However, the above methods have certain disadvantages, such as: the micro milling has processing stress and surface residual stress, and the texturing treatment of the surface of a material difficult to process is difficult to realize; the laser processing surface and the electric spark processing surface both have heat affected zones, and the surface roughness is poor; abrasive gas jets are only suitable for machining of brittle materials and the like.
Mask electrochemical machining (TMECM) is a special machining process for performing electrochemical machining after photoetching the surface of an anode, and the technology combines the high resolution of the photoetching technology and the high efficiency of electrochemical machining, and becomes one of the common methods for preparing the microstructure array on the surface of a metal material. In the process of the TMECM, the manufacturing of a mask plate is a very critical step, and at present, the manufacturing method of the mask mainly comprises a photo-lithography method, an electron beam direct writing method, a focused ion beam direct writing method and the like, but the methods all have the defects of high price, long manufacturing period, small mask plate area and the like. Furthermore, when the characteristic parameters of the desired array structure need to be changed, the mask plate must be reworked if the conventional TMECM process is used, which not only results in a waste of material, but also greatly prolongs the process cycle. In addition, the existing mask electrolytic machining technology is usually used for preparing a planar or large-caliber rotating surface microstructure array, and the processing of a small-caliber rotating and quasi-rotating thin-wall curved surface (such as an inner/outer rotating surface of a cardiovascular stent, a quasi-rotating profile surface of a micro gear, a cam and the like) microstructure array is difficult to realize.
Disclosure of Invention
The invention aims to provide a processing method for forming microstructures on the surface of a workpiece, so as to realize flexible and controllable preparation of a microstructure array on the surface of the workpiece, and particularly realize high-quality flexible processing of a small-caliber rotary surface, a quasi-rotary surface and a trans-scale microstructure array on a rotary inner surface.
In order to achieve the purpose, the invention provides the following technical scheme: a machining method of forming a microstructure on a surface of a workpiece, the method comprising:
s1, providing a fine rod with a small electrochemical resistance value on the surface, and forming a first microstructure with a large electrochemical resistance value on the surface of the fine rod at a high temperature to obtain a line electrode;
and S2, providing the workpiece inserted into the electrolyte as an anode, driving the wire electrode to rotate and drive the wire electrode to rotate around the workpiece, and supplying power to the workpiece and the wire electrode to form a required microstructure on the surface of the workpiece according to the first microstructure on the wire electrode.
Further, the first microstructure is obtained by one of laser processing, electron beam processing, chemistry, and laser processing.
Further, in S2, an ultra-short pulse power supply is used for supplying power.
Furthermore, the duration of the ultrashort pulse can be 50-500 ns, and the pulse period is 0.1-1 MHz.
Further, the micro-rods are metal rods.
Furthermore, the diameter of the metal rod is 0.1-3.0 mm.
Further, the first microstructure is one of a trench type, a quasi-trench type, and a lattice type.
Further, the surface of the workpiece is one of a rotary inner surface, a rotary outer surface, a quasi-rotary inner rotary surface, a quasi-rotary outer rotary surface, a plane and a quasi-plane.
Further, before the fine rod is subjected to high-temperature treatment, the method further comprises cleaning and drying the fine rod.
The invention also provides a control system for forming the microstructure on the surface of the workpiece, which is used for processing the workpiece which is arranged in the electrolyte and serves as an anode by adopting a processing method for forming the microstructure on the surface of the workpiece, and the control system comprises a wire electrode arranged in the electrolyte and a power supply device which is respectively electrically connected with the wire electrode and the workpiece, wherein the power supply device, the wire electrode and the workpiece form a loop, the wire electrode is a cathode, and the workpiece is an anode.
The invention has the beneficial effects that: the machining method for forming the microstructure on the surface of the workpiece provided by the invention uses the wire electrode of the first microstructure with a larger electrochemical impedance value on the surface as a tool electrode, realizes the selective electrochemical corrosion of the surface of the workpiece by cooperatively controlling the rotation and the rotation around the workpiece of the wire electrode and utilizing the transient effect of the electric double layer charging on the surface of the wire electrode and combining the difference of the electrochemical impedance in the local micro-area of the wire electrode, so as to realize the flexible and controllable preparation of the microstructure array on the surface of the workpiece, in particular to realize the machining of the microstructure array on the small-caliber rotary surface and the quasi-rotary surface.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
FIG. 1 is a flowchart of a process of forming a microstructure on a surface of a workpiece according to a first embodiment of the present invention;
fig. 2 is an enlarged view of an area a in fig. 1, in which a and b are structural schematic diagrams of a first pattern and a second pattern of two kinds of line electrodes;
FIG. 3 is an enlarged view of region B of FIG. 1, wherein c and d are schematic structural views of two workpieces having microstructures, and c is obtained on a basis and d is obtained on B basis;
FIG. 4 is a schematic view of the wire electrode of FIG. 1 rotating and spinning about a workpiece;
fig. 5 is a schematic structural diagram of forming a microstructure on the surface of the workpiece based on a wire electrode in fig. 1, wherein t1 and t2 are machining areas of the workpiece at two different moments;
FIG. 6 is a graph of the potential waveform of FIG. 1, wherein 13 is a pulse voltage waveform; 12 is the potential waveform of the region corresponding to the first pattern; 11 is the potential waveform of the region corresponding to the first pattern; u is the set pulse voltage;
is a steady state potential;
is the electrochemical decomposition potential of the anode workpiece material; t is tonIs the pulse duration; t is toffIs the pulse off time;
FIG. 7 is a schematic view of the wire electrode and workpiece configuration of FIG. 1, wherein the workpiece is a typical curved surface scanned by a straight line along a generatrix, and e and f are two different views.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to fig. 1 to 3, the present invention provides a control system for forming a microstructure on a surface of a workpiece 5, which is used for processing the workpiece 5 disposed in an electrolyte as an anode by using a processing method for forming the microstructure on the surface of the workpiece 5, and the control system includes a wire electrode 2 disposed in the electrolyte and a power supply device 6 electrically connected to the wire electrode 2 and the workpiece 5, respectively, where the power supply device 6, the wire electrode 2 and the workpiece 5 form a loop, and in the loop, the power supply device 6 is an ultra-short pulse power supply 6, the ultra-short pulse duration may be 50 to 500ns, the pulse period is 0.1 to 1MHz, and the specific duration and the pulse period are selected according to the actual situation, and are not particularly limited herein. Wherein the wire electrode 2 is a cathode and the workpiece 5 is an anode. The wire electrode 2 is obtained by performing high-temperature treatment on a fine rod 1, wherein the fine rod 1 is a metal rod 1, the diameter of the metal rod 1 is 0.1-3.0 mm, and specifically, which metal is used, the specific diameter of the metal rod 1 is not specifically limited, and can be determined according to actual conditions. The electrochemical impedance value of the surface of the micro-rod 1 is small, the electrochemical impedance value at this time is the inherent electrochemical impedance value of the metal surface of the micro-rod 1, the first microstructure 4 with a large electrochemical impedance value is obtained after high-temperature treatment, the region of the first microstructure 4 can be equivalent to an insulator under the action of an ultrashort pulse, namely, the surface of the wire electrode 2 is divided into two parts, namely, a first pattern 3 and a second pattern 4, the first pattern 3 is the original surface of the micro-rod 1 which is not subjected to high-temperature treatment and has a small electrochemical impedance value, the second pattern 4 is the first microstructure 4 of the micro-rod 1 which is subjected to high-temperature treatment, the first microstructure 4 can be obtained through laser processing and electron beam processing, and the first microstructure 4 can also be obtained through other modes without specific limitation.
The control system is used for realizing a processing method for forming a microstructure on the surface of the workpiece 5, and the method comprises the following steps:
s1, providing the micro-rod 1 with a small electrochemical resistance value on the surface, and forming a first microstructure 4 with a large electrochemical resistance value on the surface of the micro-rod 1 at a high temperature to obtain a wire electrode 2;
s2, providing the workpiece 5 inserted into the electrolyte as an anode, driving the wire electrode 2 to rotate and driving the wire electrode 2 to rotate around the workpiece 5, and supplying power to the workpiece 5 and the wire electrode 2 to form a desired microstructure on the surface of the workpiece 5 according to the first microstructure 4 on the wire electrode 2.
In the present invention, the first microstructure 4 of the line electrode 2 is one of a trench type, a quasi-trench type, and a lattice type, and as a matter of course, the first microstructure 4 may be of another type, which is not particularly limited herein. The wire electrode 2 with the first microstructure 4 on the surface can be reused for many times, so that the waste of materials is reduced, and the processing period is greatly shortened.
Indeed, before the high-temperature treatment of the fine rod 1, the processing method further comprises cleaning and drying the fine rod 1, specifically, ultrasonic decontamination is sequentially carried out on the fine rod 1 by acetone, alcohol and deionized water respectively, and the fine rod is dried in a vacuum drying oven. And carrying out ultrasonic cleaning on the obtained wire electrode 2 with the first microstructure 4 on the surface for subsequent electrolytic machining.
Referring to fig. 4, in the preparation of the microstructure on the surface of the workpiece 5, i.e., in the electrolytic machining process, the wire electrode 2 is not only rotated about its own axis but also simultaneously follows a translation path 9 having the same cross-sectional shape as the anode workpiece 5, thereby machining a desired microstructure on the entire surface of the workpiece 5. By co-operating control of the angular rotation omega of the wire electrode 2rAnd a translational velocity v along the surface of the workpiece 5pAnd flexible preparation of microstructures with different sizes can be realized.
Referring to fig. 5 and 6, under the action of the ultra-short pulse, the surface of the wire electrode 2 generates an electric double layer charging/discharging transient effect, and the electric double layer time constant formed on the surface of the region corresponding to the second pattern 4 is large due to the large electrochemical impedance, so that the electric double layer charging potential is large during the pulse duration
Cannot reach the electrochemical decomposition potential of the workpiece 5
Therefore, during the rotation of the wire electrode 2, the material on the surface of the anode workpiece 5 and in the micro-area corresponding to the second pattern 4 will not be electrochemically dissolved (referred to as an insoluble area 8); and the area corresponding to the first pattern 3 partThe resulting electric double layer has a small charge/discharge time constant for the pulse duration (t)on) The electric potential of the electric double layer can exceed the electrochemical decomposition potential of the anode workpiece 5
Therefore, during the rotation of the wire electrode 2, the material on the surface of the anode workpiece 5 and in the micro-area corresponding to the first pattern 3 will be electrochemically dissolved and removed (referred to as a dissolution area 7), thereby obtaining the workpiece 5 with microstructure.
Referring to fig. 7, the processing method of the present invention is suitable for any curved surface whose shape is obtained by scanning a bus line as a straight line, and the surface of the workpiece 5 is one of a rotary inner surface, a rotary outer surface, a quasi-rotary inner rotary surface, a quasi-rotary outer rotary surface, a plane, and a quasi-plane, and may be other surfaces, which is not limited herein.
In the invention, the electrolytic machining mainly comprises the following steps: firstly, a prepared wire electrode 2 with a first microstructure 4 on the surface is arranged on a wire electrode 2 clamp in a micro-electrochemical machining platform, and the axis of the wire electrode is accurately adjusted to be parallel to the surface of an anode workpiece 5, so as to ensure the distances between the wire electrode 2 and the workpiece 5 at each position along the axis direction of the wire electrode 2, namely the machining gaps 10 are the same; then, according to the characteristic dimension of the microstructure to be machined and the surface shape of the workpiece 5, the electrochemical machining parameters including the voltage, the pulse frequency, the pulse duration, and the rotation angular velocity ω of the wire electrode 2 are setr A translation path 9 and a translation speed v of the wire electrode 2pStarting to perform electrolytic machining according to the parameters, and transferring the first microstructures 4 on the surface of the wire electrode 2 to the surface of the anode workpiece 5 according to a certain proportion after the machining is finished; and finally, after the electrolytic machining is finished, carrying out ultrasonic cleaning on the workpiece 5 to remove impurities such as electrolyte and the like remained on the surface, and finishing the whole machining process.
With regard to the processing method for forming the microstructure on the surface of the workpiece 5, the following description is made with reference to fig. 1 by way of specific example:
example one
Step one, a tungsten rod 1 with the diameter of 1.0mm is adopted and sequentially subjected to ultrasonic cleaning in acetone, alcohol and deionized water for 5 minutes respectively to remove oil stains and other dust impurities on the surface of the tungsten rod. Then, the plate was baked in a vacuum oven at 100 ℃ for 10min to ensure that the surface was relatively dry.
And secondly, processing the tungsten rod 1 by adopting a laser scanning processing method to form a first microstructure 4 on the surface of the tungsten rod to obtain a wire electrode 2, referring to fig. 2, wherein the area corresponding to the second pattern 4 is a laser processing area, and the first pattern 3 is an original surface of the tungsten rod, namely a non-laser processing area. The laser processing area will form a large amount of oxide, the electrochemical impedance is large, and under the effect of the ultrashort pulse, the laser processing area can be equivalent to an insulator, and the specific shape of the first microstructure 4 and the layout on the tungsten rod 1 are determined according to the actual needs, and are not particularly limited herein.
And step three, respectively and sequentially ultrasonically cleaning the wire electrode 2 with the first microstructure 4 on the surface prepared in the step two in acetone, alcohol and deionized water for 5 minutes, and then drying the wire electrode 2 by using natural wind, thus finishing the preparation of the wire electrode 2.
And step four, mounting the prepared wire electrode 2 on a wire electrode clamp in a micro-electrochemical machining platform, and fixing the anode workpiece 5 to be machined on the anode clamp, wherein the anode workpiece is a 316L stainless steel pipe with the outer diameter of 5.0mm and the wall thickness of 0.5 mm. The axis of the wire electrode 2 is accurately adjusted to be parallel to the surface of the anode workpiece 5, so that the machining gaps 10 at all positions along the axis of the wire electrode 2 are the same in the machining process, a dry-method tool setting is performed by adopting an ammeter, the machining gap 10 is set to be 0.003mm, admittedly, the numerical value of the machining gap 10 can be other, and the range of the machining gap 10 is 0.001mm-0.005mm, so that the numerical value of the machining gap 10 can be determined according to the actual situation, and the method is not limited herein.
Step five, setting the frequency of the ultrashort pulse power supply 6 to be 1MHz and the duration time t of the ultrashort pulseon200ns, the rotation angular velocity ω of the wire electrode 2r0.1rad/s, the translation path 9 is arranged as a circle concentric with the 316L stainless steel pipe, the radius of the circle is the sum of the diameter of the wire electrode 2, the diameter of the workpiece 5 and the machining gap, i.e., 2.5mm +0.003mm +0.5mm, the translation speed vp0.01mm/s, after the electrolytic machining is finished,the surface of the anode workpiece 5 is formed with a desired microstructure, as can be seen in fig. 3. Wherein the rotational angular velocity ω of the wire electrode 2rAnd translational velocity vpThe specific value of (a) is set according to actual needs, and is not particularly limited herein.
And sixthly, ultrasonically cleaning the anode workpiece 5 with the microstructure in acetone, alcohol and deionized water for 5 minutes respectively, and finishing the processing.
Example two
Step one, the diameter of the tungsten rod 1 is 0.5mm, and the cleaning and drying method is the same as that of the embodiment one, which is not described herein.
Step two, soaking the tungsten rod 1 in fluorosilane solution with certain concentration for surface fluorination treatment at the temperature of 60 ℃ for 0.5 hour; taking out the tungsten rod 1, baking the tungsten rod 1 in a vacuum drying oven at 120 ℃ for 1.0 hour, naturally cooling the tungsten rod in an air environment, and forming a molecular film with the thickness of hundreds of nanometers on the surface of the tungsten rod 1 after the process, wherein the molecular film has larger electrochemical impedance and can be equivalent to an insulator under the action of ultrashort pulses. Processing the tungsten rod 1 by a laser scanning processing method to form a first microstructure 4 on the surface of the tungsten rod to obtain a wire electrode 2, as shown in fig. 2, wherein the first microstructure 4, i.e., a region corresponding to the second pattern 4, is a molecular film reserved region, i.e., a non-laser-processed region, and has a large electrochemical impedance, the first pattern 3 is an original surface of the tungsten rod 1, i.e., a laser-processed region, the molecular film is removed, the original surface of the tungsten rod 1 is exposed, and the electrochemical impedance of the region is small. The shape of the first microstructure 4 and the layout on the tungsten rod 1 are determined according to actual needs, and are not particularly limited.
And step three, cleaning the wire electrode 2, wherein the cleaning method is the same as that of the first embodiment, and is not described herein again.
Step four, this step of this embodiment is basically the same as the step of the first embodiment, and the difference is: the workpiece 5 is a titanium alloy tube with an outer diameter of 3.0mm and a wall thickness of 0.2mm, and the machining gap 10 is 0.002 mm.
Step five, the step of the embodiment is basically the same as the step of the embodiment one, but notThe same points are as follows: pulse duration t of pulse power supply 6onSet to 100ns, the rotation angular velocity ω of the wire electrode 2rSet to 0.2rad/s, the translation path 9 is set to a circle concentric with the titanium alloy tube, the radius of the circle is 1.5mm +0.002mm +0.25mm, the translation speed v ispIs 0.005 mm/s.
And sixthly, ultrasonically cleaning the anode workpiece 5 in acetone, alcohol and deionized water for 5 minutes respectively, and finishing the whole processing technological process.
In summary, the machining method for forming a microstructure on a workpiece surface provided by the present invention uses a wire electrode having a first microstructure with a large electrochemical impedance value on the surface as a tool electrode, and realizes selective electrochemical corrosion on the workpiece surface by cooperatively controlling the rotation of the wire electrode and the rotation around the workpiece, utilizing the transient effect of the electric double layer charging on the surface of the wire electrode, and combining the difference of electrochemical impedance in a local micro-area of the wire electrode, so as to realize flexible and controllable preparation of a microstructure array on the workpiece surface, particularly realize the machining of a microstructure array on a small-caliber revolving surface and a quasi-revolving surface.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A machining method for forming a microstructure on a surface of a workpiece, the method comprising:
s1, providing a fine rod with a small electrochemical resistance value on the surface, and forming a first microstructure with a large electrochemical resistance value on the surface of the fine rod at a high temperature to obtain a line electrode;
and S2, providing the workpiece inserted into the electrolyte as an anode, driving the wire electrode to rotate and drive the wire electrode to rotate around the workpiece, and supplying power to the workpiece and the wire electrode to form a required microstructure on the surface of the workpiece according to the first microstructure on the wire electrode.
2. The machining method for forming a microstructure on a surface of a workpiece according to claim 1, wherein the first microstructure is obtained by one of laser machining, electron beam machining, chemical machining, and laser machining.
3. The machining method for forming the microstructure on the surface of the workpiece according to claim 1, wherein in S2, an ultrashort pulse power supply is used for supplying power.
4. The machining method for forming the microstructure on the surface of the workpiece according to claim 3, wherein the ultrashort pulse duration is 50 to 500ns and the pulse period is 0.1 to 1 MHz.
5. The machining method for forming a microstructure on a surface of a workpiece according to claim 1, wherein the fine rod is a metal rod.
6. The machining method for forming a microstructure on a surface of a workpiece according to claim 5, wherein the diameter of the metal rod is 0.1 to 3.0 mm.
7. The machining method of claim 1, wherein the first microstructure is one of a trench type, a quasi-trench type, and a lattice type.
8. The machining method for forming a microstructure on a surface of a workpiece according to claim 1, wherein the surface of the workpiece is one of an inner surface of revolution, an outer surface of revolution, an inner surface of quasi-revolution, an outer surface of quasi-revolution, a plane, and a quasi-plane.
9. The machining method for forming a microstructure on a surface of a workpiece according to claim 1, wherein before the fine rod is subjected to the high-temperature treatment, the method further comprises washing and drying the fine rod.
10. A control system for realizing the formation of the microstructure on the surface of the workpiece, which is characterized in that the machining method for forming the microstructure on the surface of the workpiece according to any one of claims 1 to 9 is adopted, so as to machine the workpiece which is arranged in the electrolyte and is used as an anode, the control system comprises a wire electrode which is arranged in the electrolyte and a power supply device which is electrically connected with the wire electrode and the workpiece respectively, and the power supply device forms a loop with the wire electrode and the workpiece, wherein the wire electrode is a cathode, and the workpiece is an anode.
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| WO2021189876A1 (en) * | 2020-03-25 | 2021-09-30 | 苏州大学 | Machining method for forming microstructure on surface of workpiece and control system |
| CN113500261A (en) * | 2021-06-11 | 2021-10-15 | 邯郸钢铁集团有限责任公司 | Method for quickly setting roller texturing parameters |
| WO2022104757A1 (en) * | 2020-11-17 | 2022-05-27 | 苏州大学 | Preparation method for cross-size micro-nano structure array |
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| WO2021189876A1 (en) * | 2020-03-25 | 2021-09-30 | 苏州大学 | Machining method for forming microstructure on surface of workpiece and control system |
| WO2022104757A1 (en) * | 2020-11-17 | 2022-05-27 | 苏州大学 | Preparation method for cross-size micro-nano structure array |
| US20220339725A1 (en) * | 2020-11-17 | 2022-10-27 | Soochow University | A method for preparing a cross-size micro-nano structure array |
| US11992889B2 (en) * | 2020-11-17 | 2024-05-28 | Soochow University | Method for preparing a cross-size micro-nano structure array |
| CN113500261A (en) * | 2021-06-11 | 2021-10-15 | 邯郸钢铁集团有限责任公司 | Method for quickly setting roller texturing parameters |
| CN113500261B (en) * | 2021-06-11 | 2022-06-28 | 邯郸钢铁集团有限责任公司 | Method for quickly setting roller texturing parameters |
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| CN111299731B (en) | 2021-09-24 |
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