CN111293236B - OLED screen punching method - Google Patents

OLED screen punching method Download PDF

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Publication number
CN111293236B
CN111293236B CN202010107996.1A CN202010107996A CN111293236B CN 111293236 B CN111293236 B CN 111293236B CN 202010107996 A CN202010107996 A CN 202010107996A CN 111293236 B CN111293236 B CN 111293236B
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layer
oled
light
light absorption
punching
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CN202010107996.1A
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CN111293236A (en
Inventor
张振华
王本莲
唐国强
孙阔
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application discloses an OLED screen punching method, which comprises the following steps: forming a back plate layer, and forming a light absorption layer on the back plate layer, wherein the light absorption layer is specifically arranged in a perforation area; forming an OLED layer on the back plate layer, wherein the OLED layer is arranged to cover the light absorption layer; illuminating the OLED layer until the OLED layer arranged above the light absorption layer is evaporated; and cutting and drilling holes in the punching area. According to the technical scheme that this application embodiment provided, through setting up the light-absorbing layer in the position of punching, get rid of the screen and punch the regional OLED layer material of area through illumination, punch the area around by the light-absorbing layer cover for punch the area and pass through light-absorbing layer separation water oxygen infiltration route, oxygen or moisture can not get into or stretch through the OLED layer, the condition that components and parts became invalid can not appear, and this scheme easy operation that punches, the cost is lower.

Description

OLED screen punching method
Technical Field
The invention relates to the field of display, in particular to an OLED screen punching method.
Background
In recent two years, the heat is developed through the comprehensive screen, the higher screen occupation ratio is pursued, the problem of arrangement of the front-mounted camera is required to be solved, the special-shaped screen of the bang is utilized in the solution, the forehead is removed, the camera is hidden, and the beauty tip which is popular in summer is designed from the earliest time. Nowadays, the appearance of design is hidden to fingerprint technique and earphone under the screen, lets comprehensive screen technique mature day by day, and the water droplet screen is produced by year, therefore hides the camera and becomes last difficult problem.
The mainstream scheme of camera under the screen is for digging the hole in the display function district for place the camera, however when the function district sets up the trompil, because of lamination such as organic luminescent layer is whole face tiling, fine patterning is difficult to, so these layers can become the introducing path of oxygen or moisture or the propagation path of tiny crack after punching, lead to the components and parts to become invalid, therefore need the scheme to solve. A common solution is laser burn removal, however this solution requires elaborate laser system equipment and a large investment.
Disclosure of Invention
In view of the above-mentioned drawbacks or deficiencies in the prior art, it is desirable to provide a method for perforating an OLED screen.
In one aspect, an OLED screen punching method is provided, including the steps of:
forming a back plate layer, and forming a light absorption layer on the back plate layer, wherein the light absorption layer is specifically arranged in a perforation area;
forming an OLED layer on the back plate layer, wherein the OLED layer is arranged to cover the light absorption layer;
illuminating the OLED layer until the OLED layer arranged above the light absorption layer is evaporated;
and cutting and drilling are carried out in the punching area.
According to the technical scheme that this application embodiment provided, through setting up the light-absorbing layer in the position of punching, get rid of the screen through illumination and punch regional OLED layer material, punch regional surrounding by the light-absorbing layer cover for punch the region and pass through light-absorbing layer separation water oxygen infiltration route, oxygen or moisture can not get into or stretch through OLED layer, the condition that components and parts became invalid can not appear, and this scheme easy operation that punches, the cost is lower.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a flow chart of a method for perforating an OLED screen in an embodiment;
FIG. 2 is a schematic view of an embodiment of a structure for providing a light absorbing layer;
FIG. 3 is a schematic diagram of the structure of FIG. 2 after perforation;
FIG. 4 is a schematic view of another embodiment of a structure for providing a light absorbing layer;
FIG. 5 is a top view of FIG. 4 with a light absorbing layer disposed thereon;
FIG. 6 is a schematic view of the structure of FIG. 4 after perforation;
FIG. 7 is a schematic view of an embodiment of a cover layer disposed on a light absorbing layer;
FIG. 8 is a schematic view of a structure in which a cover layer is provided on a light absorbing layer in another embodiment.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1, the present embodiment provides a method for punching an OLED screen, including the steps of:
forming a back plate layer 1, and forming a light absorption layer 2 on the back plate layer 1, wherein the light absorption layer 2 is specifically arranged in a perforation area 21;
forming an OLED layer 3 on the back plate layer 1, wherein the OLED layer 3 is arranged to cover the light absorbing layer 2;
illuminating the OLED layer 3 until the OLED layer 3 arranged above the light absorbing layer 2 is evaporated;
the cutting and drilling are performed in the punching area 21.
Form light-absorbing layer 2 on backplate layer 1 in this embodiment, then set up OLED layer 3 on light-absorbing layer 2, through illumination OLED layer 3, light-absorbing layer 2 absorbs light energy and converts the heat into and makes the evaporation of the OLED layer material on the corresponding light-absorbing layer, it is specific with this light-absorbing layer setting in the region that punches, in the step of punching afterwards, get rid of the material of the position of punching, the light-absorbing layer of setting can obstruct water oxygen infiltration route, guarantee that water oxygen can not permeate into along OLED layer etc. for the reliability of OLED screen has obtained the assurance.
In this embodiment, a back plate layer 1 is first formed on a PI (Polyimide Film) layer 4, a light absorption layer 2 is then formed on the back plate layer 1, the light absorption layer is arranged 2 in a punching area 21, an OLED layer is then formed on the back plate layer, the OLED layer includes an anode layer, an organic material layer and a cathode layer, the anode layer is arranged on the back plate layer through a magnetron sputtering process, the anode layer in the punching area is removed in an etching process, and therefore the punching area is not covered by the anode layer, and then a conventional organic material layer and a cathode layer evaporation process are performed to form an OLED layer 3, and then the OLED layer material on the light absorption layer is evaporated through illumination, namely, corresponding organic material and cathode layer material are evaporated, then an encapsulation process is performed, an encapsulation layer is formed on the OLED layer, and finally the punching process is performed, and cutting and drilling are performed in the punching area.
Further, the light absorbing layer 2 covers the perforated area 21 completely, and the range of the light absorbing layer 2 is larger than the perforated area 21.
As shown in fig. 2 and 3, the light absorbing layer in this embodiment covers the entire perforated area, and is further disposed beyond the perforated area, the entire perforated area is covered, and when the perforation step is performed, the film layers stacked at the corresponding positions are removed to form the structure shown in fig. 3, the light absorbing layer in the perforated area is also removed, and the remaining light absorbing layer forms a barrier between the holes and the OLED layer, and also blocks the path of water and oxygen permeation.
Further, the light absorbing layer 2 is of an annular structure, and the light absorbing layer 2 is arranged at the periphery of the perforated area 21.
As shown in fig. 4, 5 and 6, the light absorption layer of another embodiment mode is provided, the light absorption layer is set to be of an annular structure, so that the light absorption layer does not need to be cut in the subsequent punching step, the punching step is easier, the light absorption layer is arranged on the periphery of a punching area, the OLED layer material above the annular area is removed under the illumination condition, the light absorption layer is used for realizing the separation between the punching area and the OLED layer, and the penetration of water and oxygen can be effectively prevented.
Further, before the "forming an OLED layer on the back plate layer", the method further includes the steps of: a cover layer 5 is disposed on the light absorbing layer 2, and the cover layer 5 is disposed to extend to the back sheet layer 1.
As shown in fig. 7 and 8, in this embodiment, a covering layer is further added on the light absorbing layer, and the covering layer covers the light absorbing layer to further block a water and oxygen permeation path between the perforated area and the OLED layer, so that the reliability of the final screen is ensured; wherein the overburden need cover light-absorbing layer upper surface and extend to light-absorbing layer side from this light-absorbing layer upper surface, until the backplate layer, further keep apart through the overburden between light-absorbing layer side and the OLED layer, guarantee the effect of water oxygen separation.
Further, the covering layer 2 covers the whole upper surface of the light absorbing layer 5. As shown in fig. 7, in this embodiment, the covering layer is completely covered on the upper surface of the light-absorbing layer, and then the covering layer in the perforated area is cut and removed in the following perforation step, or when the light-absorbing layer is in a ring-shaped structure, the covering layer completely covers the ring-shaped light-absorbing layer, so that the water and oxygen paths between the perforated area and the layers such as the OLED layer in the active area are completely blocked, and the blocking effect is ensured.
Further, the covering layer 2 covers the edge position of the upper surface of the light absorption layer 5. As shown in fig. 8, in this embodiment, the covering layer partially covers the upper surface of the light absorbing layer, and the perforated area is not covered, so that a layer of material is cut less in the subsequent perforating step, the perforation is more convenient, and the material of the covering layer is saved while the water and oxygen blocking effect is not affected.
The covering layer arranged on the light absorption layer in the embodiment can be completely deposited and covered on the light absorption layer and is formed at one time; or partially covering the light absorbing layer with a cover layer to form a structure as shown in fig. 8, wherein the cover layer covering the upper surface of the light absorbing layer covers the position of the light absorbing layer near the edge, and exposes the middle part of the light absorbing layer, i.e. the punching position, and the cover layer does not need to be cut in the punching step, so that the punching step is easier; or the light absorption layer is arranged in an annular structure, and the covering layer is covered on the annular light absorption layer.
Further, the material of the covering layer 5 is silicon oxide or silicon nitride.
In the embodiment, the covering layer is prepared by adopting silicon oxide or silicon nitride, and the perforated area and the OLED layer are further blocked by the covering layer, so that water and oxygen are prevented from entering the screen, and the reliability of the screen is ensured.
Further, the light absorption layer 2 is made of tungsten, molybdenum, nickel, chromium, titanium, tungsten alloy, molybdenum alloy, nickel alloy, chromium alloy, titanium alloy or a-Si.
In this embodiment, a metal with high light absorption rate is used as the light absorption layer, such as tungsten or molybdenum or nickel or chromium or titanium or corresponding alloys, or a-Si (amorphous silicon) which absorbs infrared light or other laser light is used as the light absorption layer, and during the process of punching the OLED screen, the light absorption layer is irradiated by an illumination system under certain conditions, such as 20% oxygen concentration and-60 ℃ or less dew point temperature environment, and the OLED layer material absorbs heat and evaporates.
Further, the "illuminating the OLED layer" specifically employs infrared light or laser light to illuminate the OLED layer. In this embodiment, different light is selected according to different light absorption layer materials to irradiate the OLED layer, for example, when the light absorption layer material is selected to be a-Si, infrared light is used for irradiation, and when the light absorption layer material is selected to be other metal, laser light can be used for irradiation, so that the evaporation efficiency of the corresponding OLED layer is improved.
Further, before the step of cutting and drilling in the drilling area, the method further comprises the following steps: an encapsulation layer is formed over the OLED layer.
In the embodiment, the light absorbing layer is arranged at the punching position, wherein the light absorbing layer and the back plate layer are formed at the same time, then a conventional OLED layer evaporation process is carried out to form an OLED layer, the OLED layer on the light absorbing layer is removed through illumination, the water and oxygen permeation paths are formed, then a packaging process is carried out, and a conventional packaging layer is formed on the OLED layer; and after the packaging layer is formed, a punching process is carried out, so that no influence is caused on other areas of the whole screen.
Through setting up the light-absorbing layer in the position of punching in this application, get rid of the screen through illumination and punch regional OLED layer material for punch and keep apart by the light-absorbing layer between regional and the OLED layer, separation water oxygen infiltration route, oxygen or moisture can not get into or stretch through the OLED layer, the condition that components and parts became invalid can not appear, and this scheme easy operation that punches, the cost is lower.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (8)

1. An OLED screen punching method is characterized by comprising the following steps:
forming a back plate layer, forming a light absorption layer on the back plate layer, wherein the light absorption layer is specifically arranged in a perforated area, arranging a covering layer on the light absorption layer, the covering layer extends to the back plate layer, the covering layer covers the upper surface of the light absorption layer and extends from the upper surface of the light absorption layer to the side surface of the light absorption layer until reaching the back plate layer, and the covering layer is made of silicon oxide or silicon nitride;
forming an OLED layer on the back plate layer, wherein the OLED layer is arranged to cover the light absorbing layer and the covering layer;
illuminating the OLED layer until the OLED layer arranged above the light absorption layer is evaporated;
and cutting and drilling holes in the punching area.
2. The OLED screen punching method according to claim 1, wherein the light absorbing layer covers the punching area entirely, and the light absorbing layer has a larger range than the punching area.
3. The OLED screen perforating method as recited in claim 1, wherein the light absorbing layer is of an annular configuration, the light absorbing layer being disposed peripherally to the perforation area.
4. The OLED screen perforating method as claimed in any of claims 1 to 3, characterized in that the covering layer covers the entire upper surface of the light-absorbing layer.
5. The OLED screen perforating method as claimed in any of claims 1 to 3, characterized in that the cover layer covers the edge positions of the upper surface of the light-absorbing layer.
6. The OLED screen punching method according to any one of claims 1 to 3, wherein the light absorbing layer is made of tungsten or molybdenum or nickel or chromium or titanium or tungsten alloy or molybdenum alloy or nickel alloy or chromium alloy or titanium alloy or a-Si.
7. The OLED screen punching method according to any one of claims 1 to 3, wherein "illuminating the OLED layer" specifically employs infrared light or laser light to illuminate the OLED layer.
8. The OLED screen punching method according to any one of claims 1 to 3, wherein the step of cutting and drilling in the punching area is preceded by the steps of: an encapsulation layer is formed over the OLED layer.
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