CN111281312A - Capsule endoscope - Google Patents

Capsule endoscope Download PDF

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Publication number
CN111281312A
CN111281312A CN202010145836.6A CN202010145836A CN111281312A CN 111281312 A CN111281312 A CN 111281312A CN 202010145836 A CN202010145836 A CN 202010145836A CN 111281312 A CN111281312 A CN 111281312A
Authority
CN
China
Prior art keywords
module
chip
image sensing
circuit board
image data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010145836.6A
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Chinese (zh)
Inventor
邬墨家
陈容睿
王春
曹幸静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Jinshan Medical Technology Research Institute Co Ltd
Original Assignee
Chongqing Jinshan Medical Technology Research Institute Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Chongqing Jinshan Medical Technology Research Institute Co Ltd filed Critical Chongqing Jinshan Medical Technology Research Institute Co Ltd
Priority to CN202010145836.6A priority Critical patent/CN111281312A/en
Publication of CN111281312A publication Critical patent/CN111281312A/en
Pending legal-status Critical Current

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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/041Capsule endoscopes for imaging
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00002Operational features of endoscopes
    • A61B1/00004Operational features of endoscopes characterised by electronic signal processing
    • A61B1/00009Operational features of endoscopes characterised by electronic signal processing of image signals during a use of endoscope
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00002Operational features of endoscopes
    • A61B1/00011Operational features of endoscopes characterised by signal transmission
    • A61B1/00016Operational features of endoscopes characterised by signal transmission using wireless means
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064Constructional details of the endoscope body
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00131Accessories for endoscopes
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00163Optical arrangements
    • A61B1/00195Optical arrangements with eyepieces
    • A61B1/00197Optical arrangements with eyepieces characterised by multiple eyepieces

Abstract

The invention relates to a capsule endoscope, which comprises a shell, a battery, a circuit board, a chip, an antenna and a camera. Wherein the shell is provided with a transparent end, and other devices are fixed in the shell. The battery supplies power to the chip through the circuit board, and an image sensing module and a radio frequency module are integrated in the chip. The antenna is fixed on the inner wall of the shell and is electrically connected with the radio frequency module. The camera is arranged between the transparent end and the chip and is opposite to the image sensing module. And the image sensing module acquires the image data outside the transparent end through the camera, transmits the image data to the radio frequency module and transmits the image data to the outside through the antenna. Because the image sensing module and the radio frequency module are integrated in the chip at the same time, the capsule endoscope only needs one circuit board to carry one chip, thereby realizing the functions of acquiring images and transmitting image data and improving the integration level of the capsule endoscope.

Description

Capsule endoscope
Technical Field
The invention relates to the field of capsule endoscopes, in particular to a chip integrated capsule endoscope.
Background
The capsule shell is put into to current capsule scope usually with PCB board and the battery that pastes the circuit, and wherein the PCB board is mostly the printed circuit board of rigid-flexible combination, generally includes two rigid PCB boards and a flexible PCB board at least. The two rigid PCB boards are respectively used for bearing different functional devices, and the flexible PCB board is used for realizing data signal transmission between the two PCB boards.
The main functional devices in the capsule endoscope comprise an image sensor and a wireless transmission chip, and the image sensor and the wireless transmission chip are usually two independent chips, so that the image sensor and the wireless transmission chip are required to be respectively arranged on two rigid PCB boards. Due to the superposition of the thickness of the rigid PCB and the thickness of the functional device, the structure of the two rigid PCBs causes the bad results that the integration degree of the capsule endoscope is not high and the whole appearance is correspondingly elongated.
Disclosure of Invention
The invention provides an integrated capsule endoscope, which specifically comprises the following technical scheme:
the utility model provides a capsule endoscope, is including offering the casing of transparent end, and be fixed in the casing:
a battery;
the circuit board is fixedly connected to one side, close to the transparent end, of the battery;
the chip is fixed on one side of the circuit board, which is far away from the battery, the chip is conducted with the battery through the circuit board, and an image sensing module and a radio frequency module which are electrically connected with each other are integrated in the chip;
the antenna is fixed on the inner wall of the shell and is electrically connected with the radio frequency module;
the camera is arranged between the transparent end and the chip and is over against the image sensing module;
the image sensing module collects image data outside the transparent end through the camera and transmits the image data to the radio frequency module, and the radio frequency module sends the image data to the outside through the antenna.
The image sensing module and the radio frequency module are stacked and integrated in the chip through a packaging process, and the radio frequency module is located between the image sensing module and the circuit board.
The image sensing module and the radio frequency module are integrated in the chip through a packaging process plane.
The image sensing module and the radio frequency module have a first transmission rate α therebetween, the radio frequency module and the antenna have a second transmission rate β therebetween, and the condition between the first transmission rate α and the second transmission rate β is that 1.2 × α is not more than β.
The chip is further integrated with a storage module, the storage module is connected between the image sensing module and the radio frequency module, and the storage module is used for storing image data sent by the image sensing module and sending the image data to the radio frequency module.
The chip is further integrated with a checking module, the checking module is connected between the image sensing module and the radio frequency module, and the checking module is used for checking the image data sent by the image sensing module and controlling the radio frequency module to send the image data to the outside through the antenna after the image data passes the checking.
The antenna comprises a radiation part and a connecting part, the radiation part is a flexible PCB attached to the inner wall of the shell, and the connecting part is connected between the radiation part and the circuit board so as to realize the electric connection of the antenna and the radio frequency module.
The camera is a binocular camera and comprises a first eyepiece and a second eyepiece which are arranged side by side, the image sensing module comprises a first image sensing module and a second image sensing module which are arranged side by side, the first eyepiece is right opposite to the first image sensing module, and the second eyepiece is right opposite to the second image sensing module.
The radio frequency module is arranged between the first image sensing module and the second image sensing module.
Wherein, the casing still include with transparent end looks opposition's second end, the second end also is transparent, the second end with still be equipped with between the battery:
the second circuit board is fixed on one side of the battery, which is far away from the circuit board;
the image sensing chip is fixed on one side of the second circuit board, which is far away from the battery;
the second camera is arranged between the second end and the image sensing chip and is over against the image sensing chip;
a flexible flat cable connected between the circuit board and the second circuit board, the image sensing chip
The second circuit board is fixedly connected with the battery, the image sensing chip collects image data outside the second end through the second camera and transmits the image data to the radio frequency module through the flexible flat cable, and the radio frequency module is also used for transmitting the image data collected by the image sensing chip to the outside through the antenna.
The capsule endoscope of the invention supplies power to the chip fixed on the circuit board through the battery. And an image sensing module and a radio frequency module which are electrically connected with each other are integrated in the chip. The radio frequency module is used for being connected with the antenna and realizing signal transmission; the camera is arranged between the transparent end and the chip and is arranged right opposite to the image sensing module, so that the image sensor can acquire image data outside the transparent end. Due to the integrated design of the chip, the capsule endoscope only adopts the structure of one circuit board and one chip, namely, the functions of image acquisition and data transmission are compatible. Compared with the existing capsule endoscope, the capsule endoscope has the advantages of smaller overall dimension and higher integration level.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below.
FIG. 1 is a schematic view of an endoscopic capsule of the present invention;
FIG. 2 is a schematic view of a chip in a capsule endoscope according to the present invention;
FIG. 3 is a schematic view of another embodiment of an endoscopic capsule of the present invention;
FIG. 4 is a schematic view of another embodiment of an endoscopic capsule of the present invention;
FIG. 5 is a block diagram of another embodiment of a chip in a capsule endoscope according to the present invention;
FIG. 6 is a schematic view of another embodiment of an endoscopic capsule of the present invention;
FIG. 7 is a schematic view of another embodiment of a chip in a capsule endoscope according to the present invention;
figure 8 is a schematic view of another embodiment of an endoscopic capsule of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a capsule endoscope 100 of the present invention includes a sealed housing 10. The housing 10 comprises a first end 101 and a second end 102 along its own length, wherein the first end 101 is a transparent end. The battery 20, the circuit board 30, the chip 40, the antenna 50, and the camera 60 are also fixedly disposed in the housing 10. The battery 20 is used for providing electric energy for electronic devices in the capsule endoscope 100, the circuit board 30 is a rigid circuit board and is fixedly connected with the battery 20, and the battery 20 is electrically connected. And the circuit board 30 is disposed on a side of the battery 20 near the transparent first end 101. Or as the circuit board 30 is secured between the battery 20 and the first end 101. The chip 40 is fixed on the circuit board 30, and the circuit board 30 is used for carrying the chip 40. And the chip 40 is fixed on the circuit board 30 at a side far from the battery 20, the chip 40 is closer to the first end 101 than the circuit board 30. The chip 40 is electrically connected to the battery 20 through the circuit board 30, that is, the battery 20 supplies power to the chip 40 through the circuit board 30 to support the operation of the chip 40.
As shown in fig. 1, the circuit board 30 includes an elastic sheet 31, the elastic sheet 31 extends toward one end of the battery 20 away from the circuit board 30 and is overlapped with one end of the battery 20 away from the circuit board 30, so that the positive and negative electrodes of the circuit board 30 and the battery 20 are conducted. Further, the elastic sheet 31 is formed with an accommodating space for positioning the battery 20 in the housing 10.
An image sensing module 41 and a radio frequency module 42 are integrated in the chip 40, and the image sensing module 41 and the radio frequency module 42 are electrically connected with each other in the chip 40 to realize data intercommunication. Further, the rf module 42 is electrically connected to the antenna 50 through the circuit board 30. The antenna 50 is fixed at the inner wall 11 of the housing 10, and the antenna 50 is used for transmitting the radio frequency signal to the outside of the housing 10 according to the control of the radio frequency module 42. The camera 60 is disposed between the transparent first end 101 and the chip 40, and the camera 60 is disposed opposite to the image sensing module 41.
The image sensing module 41 is usually implemented by CMOS, and the image sensing module 41 can be fixed in the housing 10 by being fixedly connected to the circuit board 30. The camera 60 is close to the transparent first end 101 and is disposed opposite to the image sensing module 41, so that the image sensing module 41 can capture images outside the transparent first end 101 through the camera 60. The image sensing module 41 can also process the collected image into image data and transmit the image data directly to the radio frequency module 42. The rf module 42 converts the image data into rf signals after receiving the image data, and transmits the rf signals with the image data to the outside through the antenna 50, so as to achieve the effect of transmitting the image data collected by the capsule endoscope 100 to the outside.
In the capsule endoscope 100 of the present invention, the image sensing module 41 and the rf module 42 are integrated in the chip 40 at the same time, so that only one rigid circuit board 30 and one chip 40 are required in the capsule endoscope 100 of the present invention, and the actions of capturing an image and transmitting the captured image to the outside in the form of an rf signal can be simultaneously completed. Compared with the prior art in which the image sensing module 41 and the rf module 42 are separately packaged, and two rigid PCBs are used to respectively support two chips, the capsule endoscope 100 of the present invention saves the thickness of one rigid PCB and one chip, saves the internal space of the capsule endoscope 100, can correspondingly reduce the overall size of the capsule endoscope 100, and improves the integration of the capsule endoscope 100.
The conventional System In Package (SIP) technology can effectively integrate the image sensing module 41 and the rf module 42 into the chip 40. The process using the system-in-package technology can integrate the image sensing module 41 and the rf module 42 into the chip 40 in a stacked manner as shown in fig. 1. And in order to make the camera 60 face the image sensing module 41, the image sensing module 41 may also be controlled to be located above the rf module 42 in the process of laminating and integrating the image sensing module 41 and the rf module 42, or the rf module 42 may be described as being integrated between the image sensing module 41 and the circuit board 30. The image sensor 41 can thus be closer to the camera head 60 than the rf module 42 and cooperate with the camera head 60 to capture images outside the transparent first end 101.
In another embodiment, referring to fig. 2, the image sensing module 41 and the rf module 42 can be integrated on the same plane and packaged in the chip 40 by a process of system-in-package technology. It can be appreciated that the integration of the image sensing module 41 and the rf module 42 on the same plane in the embodiment of fig. 2 can further reduce the thickness of the chip 40 and reduce the length of the capsule endoscope 100, compared to the embodiment of fig. 2 in which the stacked package is adopted.
It should be noted that the housing 10 of the capsule endoscope 100 is generally of an axisymmetric configuration. As shown in fig. 1, the optical axis 63 of the camera 60 is also generally aligned with the axis 12 of the housing 10 in the direction of elongation. Accordingly, for the chip 40 fixed on the circuit board 30, it is necessary to dispose the image sensor 41 at the geometric center of the chip 40 as shown in fig. 2. Since the image sensor 41 and the rf module 42 are integrated on the same plane, the rf module 42 needs to occupy a part of the area of the plane, and therefore the image sensor 41 may be offset with respect to the axis 12. At this time, the chip 40 may be biased to ensure that the geometric center of the image sensor 41 coincides with the axis 12, so as to achieve the purpose that the camera 60 is disposed opposite to the image sensor 41. Or in other embodiments, the camera 60 is offset corresponding to the image sensor 41, and the purpose that the camera 60 is disposed opposite to the image sensor 41 can also be achieved.
The camera 60 corresponds to the offset of the image sensor 41, and as shown in fig. 3, the circuit board 30 is fixed in the housing 10 perpendicular to the axis 12, and the image sensor 41 is offset on the circuit board 30 relative to the axis 12. The optical axis 63 of the camera 60 is parallel to the axis 12 of the housing 10 and translates relative to the axis 12 to correspond to the offset of the image sensor 41.
Referring to fig. 4, in another embodiment, due to the limitation of the outer diameter of the camera 60, the optical axis 63 thereof has a limited translation distance with respect to the axis 12 of the housing 10, so that when the offset displacement of the image sensor 41 is relatively large, the optical axis 63 of the camera 60 can be rotated to realize the arrangement of the camera 60 facing the image sensor 41. In the present embodiment, in order to ensure effective reception of the light collected by the camera 60 by the image sensor 41, the circuit board 30 may be correspondingly rotated, so that the image sensor 41 is also rotated relative to the axis 12, so as to achieve the effect that the image sensor 41 receives the light collected by the camera 60 in a direction perpendicular to the optical axis 63.
Referring to fig. 5, a memory module 43 is integrated into the chip 40. The storage module 43 is connected between the image sensing module 41 and the radio frequency module 42, and is used for buffering the image data transmitted by the radio frequency module 42 by the image sensing module 41. Specifically, in view of the bandwidth of the image sensing module 41 for transmitting the image data to the rf module 42 and the bandwidth difference of the rf module 42 transmitting the rf signal with the image data to the outside through the antenna 50, the rf module 42 may not be able to transmit the image data received in real time to the outside through the antenna 50. Therefore, the storage module 43 for buffering the image data is disposed between the image sensing module 41 and the radio frequency module 42, the image data transmitted from the image sensing module 41 can be buffered by the storage module 43, then the image data is transmitted to the radio frequency module 42 through the storage module 43, and the image data is transmitted to the outside through the antenna 50 by the radio frequency module 42.
In one embodiment, a verification module 44 is also integrated within the chip 40. The verification module 44 is also connected between the image sensing module 41 and the rf module 42, and the verification module 44 is configured to verify whether the image data sent by the image sensing module 41 is complete, and control the rf module 42 to send the image data to the outside through the antenna 50 after confirming that the image data is complete. The Check of the image data by the Check module 44 may be performed by using a Cyclic Redundancy Check (CRC). The cyclic redundancy check mode has the characteristics of short time, high speed, quick error correction and the like, and can improve the transmission efficiency of image data.
On the other hand, the verification module 44 may also be used to monitor the transmission of image data. That is, in the process of transmitting the image data to the rf module 42, the image sensing module 41 does not need to transmit the data to the rf module 42 after the verification module 44 completes and passes the verification of the image data, but transmits the image data to the rf module 42 in real time. The checking module 44 monitors the image data in real time during the transmission process of the image data, and when the checking module 44 determines that the image data does not pass the checking, the checking module interrupts the transmission action of the current image data in time, and controls the radio frequency module 42 to stop sending the radio frequency signal of the current image data. After the image sensing module 41 corrects the image data and passes the verification of the verification module 44, the image data transmission operation is continued, so as to further improve the image data transmission efficiency.
It is understood that the storage module 43 and/or the verification module 44 can also be integrated on the image sensing module 41 or the rf module 42, so that the image sensing module 41 or the rf module 42 has a data caching and/or data verification function, thereby further improving the integration level of the capsule endoscope 100 of the present invention.
In one embodiment, the chip 40 may further omit the storage module 43 by matching the bandwidth of the image data transmitted from the image sensing module 41 to the rf module 42 with the bandwidth of the rf signal with the image data transmitted from the rf module 42 to the outside through the antenna 50, and in particular, a first transmission rate α is defined between the image sensing module 41 and the rf module 42, the first transmission rate α has a value of "Mb/s", a second transmission rate β is defined between the rf module 42 and the antenna 50, and the second transmission rate β has a value of "MHz/s", so that the condition between the first transmission rate α and the second transmission rate β is satisfied, where 1.2 × α Mb/s is less than or equal to β MHz/s.
For example, when the first transmission rate α between the image sensing module 41 and the rf module 42 is 2Mb/s, the second transmission rate β between the rf module 42 and the antenna 50 needs to be set to be greater than or equal to 2.4MHz/s, so as to ensure that the speed of transmitting the rf signal with image data to the outside through the antenna 50 by the rf module 42 is greater than the speed of transmitting the image data toward the rf module 42 by the image sensing module 41, and the rf module 42 can transmit the received image signal to the outside through the antenna 50 in real time.
In one embodiment, the antenna 50 includes a radiation portion 51 and a connection portion 52, the radiation portion 51 is used for sending out radio frequency signals, and the connection portion 52 is connected between the radiation portion 51 and the circuit board 30 and is used for communicating the radiation portion 51 to the circuit board 30 to receive the radio frequency signals sent by the radio frequency module 42. In one embodiment, the radiating portion 51 is provided as a flexible PCB board attached at the inner wall 11 of the housing 10. The radiation part 51 implemented by the flexible PCB does not occupy the inner space of the housing 10, and the volume of the capsule endoscope 100 can be further reduced.
In one embodiment, the circuit board 30 is further provided with a magnetic switch 70, and the magnetic switch 70 is connected between the battery 20 and the chip 40 and is used for controlling on/off between the battery 20 and the chip 40. Since the capsule endoscope 100 does not need to work during the production, transportation and storage processes, in order to maintain the power of the battery 20, the magnetic switch 70 can be matched with the magnetic member on the packaging box (not shown) to break the electrical conduction between the battery 20 and the chip 40, so as to save the power of the battery 20. When the capsule endoscope 100 is taken out of the packaging box, the cooperation between the magnetic switch 70 and the magnetic member is interrupted, and at this time, the battery 20 and the chip 40 are switched to a conduction state, thereby starting the normal operation of the capsule endoscope 100.
Referring to fig. 6, the camera 60 may also be configured as a binocular camera. The binocular camera can acquire 3D images of the target and obtain more detailed target image information. The binocular camera 60 includes a first eyepiece 61 and a second eyepiece 62, and the first eyepiece 61 and the second eyepiece 62 are arranged side by side on a plane perpendicular to the axis 12. The image sensing module 41 also includes a first image sensing module 411 and a second image sensing module 412 disposed side by side on the circuit board 30, wherein the first eyepiece 61 is disposed opposite to the first image sensing module 411, and the second eyepiece 62 is disposed opposite to the second image sensing module 412. It will be appreciated that the first image sensing module 411 is configured to capture image data through the first eyepiece 61 and the second image sensing module 412 is configured to capture image data through the second eyepiece 62.
Further, the first image sensing module 411 and the second image sensing module 412 both transmit the acquired image data to the rf module 42, and the rf module 42 transmits both sets of image data to the outside through the antenna 50. When the first image sensing module 411 and the second image sensing module 412 send image data to the rf module 42, the image data may be sent to the rf module 42 at the same time, or sent to the storage module 43 at the same time, and then the rf module 42 sequentially transmits the two sets of image data to the outside through the antenna 50. The first image sensing module 41 and the second image sensing module 42 may also send image data to the rf module 42 or the storage module 43 in advance, and the rf module 42 sequentially transmits two sets of image data to the outside through the antenna 50.
In the embodiment of fig. 6, the image sensing module 41 and the rf module 42 are integrated in a chip 40 in a stacked manner. The first image sensing module 411 and the second image sensing module 412 are arranged side by side, and the rf module 42 is located between the image sensing module 41 and the circuit board 30.
Referring to fig. 7, the rf module 42 and the image sensing module 41 are integrated on the same plane. At this time, the rf module 42 is disposed between the first image sensing module 41 and the second image sensing module 42. Due to the arrangement, the integration level inside the chip 40 can be improved, the transmission distance from the first image sensing module 411 to the radio frequency module 42 and the transmission distance from the second image sensing module 412 to the radio frequency module 42 are the same and the shortest, the rapid transmission of the image data is facilitated, and the transmission efficiency of the image data in the chip 40 is improved.
Referring to fig. 8, in another embodiment, in the embodiment of fig. 8, the housing 10 further includes a second end 102 opposite the transparent first end 101. Like the transparent first end 101, the second end 102 is also transparent. The battery 20 is fixedly disposed between the first end 101 and the second end 102. Further, a second circuit board 302, an image sensing chip 402, a second camera 602 and a flexible flat cable 80 are fixed between the battery 20 and the second end 102. The second circuit board 302 is fixed on a side of the battery 20 away from the circuit board 30, and the second circuit board 20 can also be electrically connected with the elastic sheet 31 or the flexible flat cable 80. The flexible flat cable 80 is connected between the circuit board 30 and the second circuit board 302. The image sensor chip 402 is fixed on a side of the second circuit board 302 away from the battery 20, the second camera 602 is disposed between the second end 102 and the image sensor chip 402, and the second camera 602 is disposed opposite to the image sensor chip 402.
The second camera 602 is disposed opposite to the image sensing chip 402, so that the image sensing chip 402 can capture an image outside the transparent second end 102 through the second camera 602 and convert the image into image data. Further, the image sensing chip 402 sequentially transmits the image data to the rf module 42 through the second circuit board 302, the flexible flat cable 80 and the circuit board 30, and the rf module 42 can simultaneously process two sets of image data transmitted from the image sensing module 41 and the image sensing chip 402, and transmit the two sets of image data to the outside through the antenna 50. Alternatively, when one of the image sensing module 41 and the image sensing chip 402 operates alone, the rf module 42 is configured to implement the transmission operation of the image data transmitted from the image sensing module 41 or the image sensing chip 402 operating alone. The processing of the two sets of image data by the rf module 42 can be seen in the related description of the embodiment of fig. 6.
The introduction of the second camera 602 can supplement the shooting angle of the camera 60, so that the capsule endoscope 100 of the present invention can acquire images at both ends along its length direction to obtain more target information. Since the rf module 42 is already integrated in the chip 40, the image sensing chip 402 cooperating with the second camera 602 can only set the image sensing function, and does not need to perform the operation of transmitting the rf signal. The image sensing chip 402 transmits the acquired image data to the rf module 42 of the chip 40 through the flexible flat cable 80 with smaller volume, and completes the function of sending the image data through the rf module 42. Because the radio frequency module 42 is integrated in the chip 40, the capsule endoscope 100 in this embodiment transmits two sets of image data through the radio frequency module 42 on the premise of realizing front and rear end image acquisition, which also improves the integration level of the capsule endoscope 100 and reduces the volume of the capsule endoscope 100.
The above-described embodiments do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the above-described embodiments should be included in the protection scope of the technical solution.

Claims (10)

1. The capsule endoscope is characterized by comprising a shell with a transparent end, and a fixing part fixed in the shell:
a battery;
the circuit board is fixedly connected to one side, close to the transparent end, of the battery;
the chip is fixed on one side of the circuit board, which is far away from the battery, the chip is conducted with the battery through the circuit board, and an image sensing module and a radio frequency module which are electrically connected with each other are integrated in the chip;
the antenna is fixed on the inner wall of the shell and is electrically connected with the radio frequency module;
the camera is arranged between the transparent end and the chip and is over against the image sensing module;
the image sensing module collects image data outside the transparent end through the camera and transmits the image data to the radio frequency module, and the radio frequency module sends the image data to the outside through the antenna.
2. The endoscopy of claim 1, wherein the image sensor module and the rf module are stacked and integrated within the chip via a packaging process, and the rf module is located between the image sensor module and the circuit board.
3. An endoscope according to claim 1, wherein said image sensing module and said rf module are integrated within said chip by a packaging process plane.
4. The capsule endoscope according to any one of claims 1-3, wherein the image sensing module and the RF module have a first transmission rate α therebetween, the RF module and the antenna have a second transmission rate β therebetween, and the condition between the first transmission rate α and the second transmission rate β is 1.2 x α ≦ β.
5. An endoscope according to claim 4, wherein a memory module is further integrated in said chip, said memory module is connected between said image sensing module and said RF module, said memory module is used for storing image data sent from said image sensing module and sending said image data to said RF module.
6. An endoscope according to claim 4, wherein a verification module is further integrated in said chip, said verification module is connected between said image sensing module and said RF module, said verification module is configured to verify said image data sent from said image sensing module, and control said RF module to send said image data to the outside via said antenna after said image data passes verification.
7. The capsule endoscope of claim 4, wherein the antenna comprises a radiation portion and a connection portion, the radiation portion is a flexible PCB attached to the inner wall of the housing, and the connection portion is connected between the radiation portion and the circuit board to electrically connect the antenna and the RF module.
8. The endoscopy of claim 4, wherein the camera is a binocular camera, and comprises a first eyepiece and a second eyepiece arranged side by side, the image sensor module comprises a first image sensor module and a second image sensor module arranged side by side, the first eyepiece is arranged opposite to the first image sensor module, and the second eyepiece is arranged opposite to the second image sensor module.
9. The capsule endoscope of claim 8, wherein the rf module is disposed between the first image sensing module and the second image sensing module.
10. An endoscopy capsule according to claim 4, wherein the housing further comprises a second end opposite to the transparent end, the second end being transparent, and further comprising:
the second circuit board is fixed on one side of the battery, which is far away from the circuit board;
the image sensing chip is fixed on one side of the second circuit board, which is far away from the battery;
the second camera is arranged between the second end and the image sensing chip and is over against the image sensing chip;
a flexible flat cable connected between the circuit board and the second circuit board, the image sensing chip
The second circuit board is fixedly connected with the battery, the image sensing chip collects image data outside the second end through the second camera and transmits the image data to the radio frequency module through the flexible flat cable, and the radio frequency module is also used for transmitting the image data collected by the image sensing chip to the outside through the antenna.
CN202010145836.6A 2020-02-28 2020-02-28 Capsule endoscope Pending CN111281312A (en)

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US20080249360A1 (en) * 2004-02-28 2008-10-09 Chongqing Jinshan Science & Technology (Group) Co. Medical Wireless Capsule-Type Endoscope System
CN1561902A (en) * 2004-04-14 2005-01-12 重庆大学 Digital radio transmission endoscope system of double picture sonsor
CN2726521Y (en) * 2004-04-14 2005-09-21 重庆大学 Digital wireless transmission endoscope with double image sensors
CN1946333A (en) * 2004-04-26 2007-04-11 奥林巴斯株式会社 Endoscope
TWM263908U (en) * 2004-10-21 2005-05-11 Chipmos Technologies Inc Capsule endoscopes with multi-chip module configuration
EP1868280A2 (en) * 2006-06-13 2007-12-19 Olympus Corporation Wireless power feeding system and capsule endoscope system applied with the same
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Application publication date: 20200616