CN111278214B

CN111278214B - Paster structure convenient for chip component to be mounted on circuit board

Info

Publication number: CN111278214B
Application number: CN202010099790.9A
Authority: CN
Inventors: 温清; 张磊
Original assignee: Huilang Yancheng Electronic Technology Co ltd
Current assignee: Huilang Yancheng Electronic Technology Co ltd
Priority date: 2020-02-18
Filing date: 2020-02-18
Publication date: 2022-12-20
Anticipated expiration: 2040-02-18
Also published as: CN111278214A

Abstract

The invention discloses a patch structure convenient for mounting a chip component to a circuit board, which relates to the technical field of component mounting and comprises a substrate and a component, wherein a socket is arranged in the middle of a mounting area arranged on the surface of the substrate, a pair of fasteners are arranged on the lower surface of a positioning plug arranged on the lower surface of the component, and the fasteners are inserted into jacks arranged along the socket. According to the invention, a pair of fasteners arranged at the bottom of the component are inserted into the insertion holes formed in the socket, and the hook ends arranged at the lower ends of the two fasteners are clamped in the clamping grooves, so that the component is quickly clamped and fixed; follow encapsulating mouthful department and upwards carry out the encapsulating for the viscose is irritated and is full of whole glue storage chamber, because glue storage chamber is the back taper form, enables the viscose and the more areas of component lower surface contact, strengthens fixedly to components and parts, avoids components and parts to produce not hard up.

Description

Paster structure convenient for chip component to be mounted on circuit board

Technical Field

The invention relates to the technical field of component installation, in particular to a patch structure convenient for installing a chip component to a circuit board.

Background

The tradition is at the in-process of installing chip components and parts on the PCB board, presses the installing zone of components and parts on the PCB board through manual, makes the pin of components and parts and the pad on the PCB board counterpoint laminating, holds again and inhales welder and carries out welded fastening with pin and pad. The tradition is carrying out the in-process of paster, and is comparatively troublesome with fixed to the location of components and parts, and easy welding pin takes place the skew with the pad in-process moreover, leads to counterpointing inaccurate, and during current paster in addition, especially integrated chip need heating device when disassembling, for example high temperature air gun directly touches the pin, consequently burns out the chip inner part main part of chip pin side easily, and traditional chip holding structure can compress the available wiring space that occupies chip coverage area by a wide margin.

Disclosure of Invention

The invention aims to provide a patch structure convenient for mounting a chip component to a circuit board, which can realize safe disassembly of the component through a glue pouring base internally provided with a micro metal column and a heat conduction support ring and four metal contacts on the lower surface of the component, and can also greatly reduce the difficulty of wiring so as to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: a chip structure convenient for mounting a chip component to a circuit board comprises a substrate and the component, wherein a mounting area is arranged on the surface of the substrate, a bonding pad is arranged on the surface of the mounting area, pins corresponding to the bonding pad are arranged on the side edge of the component, the pins are bent to be Z-shaped, the lower ends of the pins are attached to the opposite bonding pads, a socket is arranged in the middle of the mounting area, jacks are formed in the upper surface of the socket, a positioning notch is formed in the upper port of each jack formed in the socket, a positioning plug is fittingly inserted into the positioning notch, an elastic detachable positioning plug is arranged in the middle of the lower surface of the component, a pair of fastening nails are arranged on the lower surface of the positioning plug, and the fastening nails are inserted into the jacks formed in the socket;

the surface of the mounting area is provided with four glue filling seats which are respectively close to bonding pads on two sides, the upper end of each glue filling seat is integrally formed with a heat conduction support ring, the heat conduction support ring is arranged on the lower surface of the heat conduction support ring which is tightly attached to a component, a glue filling channel is formed in the glue filling seat, the upper port of the glue filling channel is an inverted-cone-shaped glue storage cavity, the lower port of the glue filling channel is a tapered-hole-shaped glue filling port, a miniature metal column penetrating through the upper surface and the lower surface of a substrate is arranged on the central axis of the glue filling channel, one end, close to a pin of the component, of the miniature metal column is detachably connected to one of external metal contacts or is suspended, one end, far away from the pin of the miniature metal column, of the miniature metal column is connected to the target position of the back wiring of the substrate, one or all of the four metal contacts are respectively connected to corresponding pins through internal connecting lines of the component or external metal lines, the four external metal contacts are arranged on the lower surface of the component, and the four external metal contacts are arranged corresponding to the four glue filling seats.

The lower ends of the fastening nails are provided with hook ends, the lower end parts of the jacks formed in the socket are connected with two sides to be provided with clamping grooves, and the hook ends arranged at the lower ends of the two fastening nails are clamped in the clamping grooves.

A1-2 mm distance is reserved between the lower surface of the component and the upper surface of the substrate, and a heat dissipation channel is reserved between the component and the substrate.

The mounting region surface is provided with a pair of assistance-localization real-time shell fragment, and the lateral wall setting of components and parts is hugged closely to the assistance-localization real-time shell fragment, and the leading-in tip that the upper end of assistance-localization real-time shell fragment expanded for the outside.

The invention has the technical effects and advantages that:

1. according to the invention, the safe disassembly of the component is realized through the built-in micro metal column, the glue pouring base of the heat conduction support ring and the four metal contacts on the lower surface of the component, and the difficulty degree of wiring can be greatly reduced.

2. According to the invention, a pair of fasteners arranged at the bottom of the component are inserted into the insertion holes formed in the socket, and the hook ends arranged at the lower ends of the two fasteners are clamped in the clamping grooves, so that the component is quickly clamped and fixed;

3. according to the invention, glue is poured upwards along the glue pouring port, so that the whole glue storage cavity is filled with the viscose glue, and the viscose glue can be in contact with the lower surface of the component in more areas due to the inverted cone-shaped glue storage cavity, so that the component is reinforced and fixed, and the component is prevented from loosening.

Drawings

FIG. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic structural diagram of a component in the present invention.

Fig. 3 is a cross-sectional view of the front of the patch of the present invention.

Fig. 4 is a cross-sectional view of the patch of the present invention shown behind.

Figure 5 is a side view of the structure of the present invention.

In the figure: 1. a substrate; 2. a component; 3. a mounting area; 4. a bonding pad; 5. a pin; 6. a socket; 61. a positioning notch; 62. a card slot; 7. positioning the plug; 8. fastening; 81. hooking ends; 9. pouring a glue base; 91. a heat conducting support ring; 92. a glue storage cavity; 93. pouring a glue opening; 10. an external metal contact; 11. auxiliary positioning elastic sheets; 111. a lead-in end; 12. and a heat dissipation channel.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

The invention provides a patch structure convenient for mounting a chip component to a circuit board as shown in figures 1-5, which comprises a substrate 1 and a component 2, wherein a mounting area 3 is arranged on the surface of the substrate 1, a bonding pad 4 is arranged on the surface of the mounting area 3, pins 5 corresponding to the bonding pad 4 are arranged on the side edge of the component 2, the pins 5 are bent into a Z shape, the lower ends of the pins 5 are attached to the opposite bonding pads 4, a socket 6 is arranged in the middle of the mounting area 3, a jack is arranged along the upper surface of the socket 6, a positioning notch 61 is arranged at the upper port of the jack arranged on the socket 6, a positioning plug 7 is fittingly inserted in the positioning notch 61, an elastic detachable positioning plug 7 is arranged in the middle of the lower surface of the component 2, a pair of fastening nails 8 are arranged on the lower surface of the positioning plug 7, and the fastening nails 8 are inserted in the jacks arranged along the socket 6;

the surface of installing zone 3 is provided with four encapsulating seats 9 that are close to both sides pad 4 respectively, the upper end integrated into one piece of encapsulating seat 9 has heat conduction support ring 91, and the lower surface setting of hugging closely components and parts 2 of heat conduction support ring 91, encapsulating seat 9 is inside to have seted up the encapsulating passageway, and the last port of encapsulating passageway is the glue storage chamber 92 of back taper, and the lower port of encapsulating passageway is the encapsulating mouth 93 of taper hole form, is provided with the miniature metal post that runs through the upper and lower surface of base plate 1 on this encapsulating passageway central axis, and the one end that is close to and has the pin of components and parts 2 of this miniature metal post can be dismantled and be connected to one of them outside metal contact or unsettled, and the one end of keeping away from of having the pin of components and parts 2 of miniature metal post is connected to base plate 1 back wiring target location, wherein certain or all of four metal contacts are connected to corresponding pin 5 through components and parts 2 internal connection lines or outside metal wire respectively, the lower surface of components and parts 2 is provided with four outside metal contacts 10, and four outside metal contacts 10 and four corresponding settings of encapsulating seats 9.

The lower end of each of the fastening nails 8 is provided with a hook end 81, the lower end of each of the jacks formed in the socket 6 is connected with the two sides to form a clamping groove 62, and the hook ends 81 formed at the lower ends of the two fastening nails 8 are clamped in the clamping grooves 62.

A1-2 mm distance is reserved between the lower surface of the component 2 and the upper surface of the substrate 1, and a heat dissipation channel 12 is reserved between the component 2 and the substrate 1.

The surface of the mounting area 3 is provided with a pair of auxiliary positioning elastic sheets 11, the auxiliary positioning elastic sheets 11 are tightly attached to the side walls of the components 2, and the upper ends of the auxiliary positioning elastic sheets 11 are guiding end parts 111 which are outwards unfolded.

Referring to fig. 2, fig. 3 and fig. 4, a socket 6 is disposed in the middle of the mounting area 3, a jack is provided along the upper surface of the socket 6, a positioning plug 7 is disposed in the middle of the lower surface of the component 2, a pair of fastening nails 8 are disposed on the lower surface of the positioning plug 7, the fastening nails 8 are inserted into the jacks provided by the socket 6, a positioning notch 61 is provided in the upper port of the jack provided by the socket 6, the positioning plug 7 is fittingly inserted into the positioning notch 61, the component 2 is mounted and positioned, a hook end 81 is disposed at the lower end of the fastening nail 8, a clamping groove 62 is provided on both sides of the lower end of the jack provided by the socket 6, and the hook ends 81 disposed at the lower ends of the two fastening nails 8 are clamped in the clamping groove 62, so as to quickly clamp and fix the component 2.

Referring to fig. 1, 2 and 4, four glue filling seats 9 are arranged on the surface of the mounting area 3, a heat-conducting support ring 91 is integrally formed at the upper end of each glue filling seat 9, the heat-conducting support ring 91 is arranged to be closely attached to the lower surface of the component 2, a 1-2mm distance is left between the lower surface of the component 2 and the upper surface of the substrate 1, a heat dissipation channel 12 is arranged between the component 2 and the substrate 1 for heat dissipation and ventilation at the bottom of the component 2, a glue filling channel is arranged inside each glue filling seat 9, an upper port of each glue filling channel is a glue storage cavity 92, a lower port of each glue filling channel is a tapered glue filling port 93, and glue filling is performed upwards along the glue filling port 93, make the viscose glue irritate and be full of whole glue storage cavity 92, because glue storage cavity 92 is the back taper, it contacts more areas with 2 lower surfaces of components and parts to enable the viscose glue, the lower surface of components and parts 2 is provided with four outside metal contact 10, and four outside metal contact 10 and four glue filling seat 9 corresponding settings, 3 surfaces in installing zone are provided with a pair of assistance-localization real-time shell fragment 11, the lateral wall setting of components and parts 2 is hugged closely to assistance-localization real-time shell fragment 11, insert the effect that plays assistance-localization real-time before the card is established with components and parts 2, the leading-in tip 111 of the upper end of assistance-localization real-time shell fragment 11 for expanding to the outside, make things convenient for 2 cards of components and parts to go into between two assistance-localization real-time shell fragments 11.

When the invention is used for mounting the component 2, a pair of fastening nails 8 arranged at the bottom of the component 2 are inserted into jacks arranged on a socket 6, hook ends 81 arranged at the lower ends of the two fastening nails 8 are clamped in clamping grooves 62, the component 2 is quickly clamped and fixed, pins 5 arranged on the component 2 are attached to corresponding bonding pads 4 on a mounting area 3 and are welded and fixed by tin welding guns, glue is poured upwards along glue pouring openings 93, so that the whole glue storage cavity 92 is filled with the viscose glue, the glue storage cavity 92 is in an inverted cone shape, the viscose glue can be contacted with more areas of the lower surface of the component 2 to strengthen and fix the component 2, the component 2 is prevented from loosening, in addition, the lower port of the glue pouring channel is a cone-shaped glue pouring opening 93, a miniature metal column penetrating through the upper surface and the lower surface of a substrate 1 is arranged on a central axis of the glue pouring channel, one end of the miniature metal column close to the pins of the component 2 is pressed to be connected to nearby external metal contacts, one end of the substrate 1, one end of the miniature metal column is connected to four metal pins of the substrate 1, and the four metal columns are connected to corresponding external metal contacts of four metal wiring lines, or corresponding to four metal contacts arranged on the corresponding external metal channels 10 of the PCB 2, and the four metal columns are arranged on the external metal contact points of the PCB 2, and the PCB 2, so that the four metal contact points are easily connected to the four metal contact points of the corresponding to the external metal channels, and the four metal channels, the external metal contacts, the four metal channels are arranged on the PCB 2, useless metal contact also can select unsettled setting, the predesigned connection of metal contact and pin can be through built-in when the chip goes out of the factory and makes or connect through outside metal line, consequently can be great reduce the difficult degree of wiring, this encapsulating seat of built-in miniature metal post and heat conduction support ring has still realized the safe dismantlement of components and parts except above-mentioned effect in addition, when components and parts need maintenance or change, then at first place the PCB plate body upside down, be about to have one side of components and parts pin and put in the below, and place the lower extreme of four miniature metal posts through square aluminum plate, then utilize the air gun to heat this aluminum plate, the aluminum plate after the heating passes through miniature metal post transmission heat, the colloid that pours in this process is heated and is melted, and the heat conduction support ring on the encapsulating seat 9 that miniature metal main part is located is heated in step by step and is melted the soldering tin on the pad nearby gradually, will collude end 81 and stir in reverse this moment, then components and parts 2 can be direct, this in-process air gun does not have direct contact pin and keep away from the components and parts main part, consequently can realize the safe dismantlement of components and parts.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a paster structure convenient to chip components and parts installation to circuit board, includes base plate (1) and components and parts (2), its characterized in that: the surface of the substrate (1) is provided with a mounting area (3), the surface of the mounting area (3) is provided with a bonding pad (4), the side edge of the component (2) is provided with a pin (5) corresponding to the bonding pad (4), the pin (5) is bent into a Z shape, the lower end of the pin (5) is attached to the opposite bonding pad (4), the middle part of the mounting area (3) is provided with a socket (6), and a jack is arranged along the upper surface of the socket (6); a positioning notch (61) is formed in an upper end opening of the jack formed in the socket (6), a positioning plug (7) is fittingly inserted into the positioning notch (61), an elastic detachable positioning plug (7) is arranged in the middle of the lower surface of the component (2), a pair of fastening nails (8) are arranged on the lower surface of the positioning plug (7), and the fastening nails (8) are inserted into the jack formed in the socket (6);

the surface of installing zone (3) is provided with four encapsulating seats (9) that are close to both sides pad (4) respectively, the upper end integrated into one piece of encapsulating seat (9) has heat conduction support ring (91), and the lower surface setting of hugging closely components and parts (2) of heat conduction support ring (91), encapsulating seat (9) inside has been seted up the encapsulating passageway, and the last port of encapsulating passageway is the storage of back taper and glues chamber (92), and the lower port of encapsulating passageway is the encapsulating mouth (93) of taper hole form, is provided with the miniature metal post that runs through base plate (1) upper and lower surface on this encapsulating passageway central axis, and the one end that is close to and has components and parts (2) pin can be dismantled and be connected to one of them outside metal contact or unsettled, and the one end that has components and parts (2) pin far away of miniature metal post is connected to base plate (1) back wiring target location, and wherein certain or all of four metal contacts are connected to corresponding pin (5) through components and parts (2) inside line or outside metal wire respectively, the lower surface of components and parts (2) is provided with four outside metal contacts (10), and four outside encapsulating seats (9) set up correspondingly.

2. A patch structure for facilitating mounting of a chip component to a circuit board according to claim 1, wherein:

the lower end of each fastening nail (8) is provided with a hook end (81), the lower end of each jack formed in the socket (6) is connected with the two sides to form clamping grooves (62), and the hook ends (81) formed at the lower ends of the two fastening nails (8) are clamped in the clamping grooves (62).

3. A patch structure for facilitating mounting of a chip component to a circuit board according to claim 1, wherein:

a1-2 mm distance is reserved between the lower surface of the component (2) and the upper surface of the substrate (1), and a heat dissipation channel (12) is reserved between the component (2) and the substrate (1).

4. A patch structure for facilitating mounting of a chip component to a circuit board according to claim 1, wherein:

the surface of the mounting area (3) is provided with a pair of auxiliary positioning elastic sheets (11), the auxiliary positioning elastic sheets (11) are arranged close to the side wall of the component (2), and the upper ends of the auxiliary positioning elastic sheets (11) are guiding end parts (111) which are unfolded outwards.