CN111276618A - Organic functional layer, method for preparing organic functional layer and display panel - Google Patents
Organic functional layer, method for preparing organic functional layer and display panel Download PDFInfo
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- CN111276618A CN111276618A CN201811477110.1A CN201811477110A CN111276618A CN 111276618 A CN111276618 A CN 111276618A CN 201811477110 A CN201811477110 A CN 201811477110A CN 111276618 A CN111276618 A CN 111276618A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
Abstract
The invention relates to an organic functional layer, a method for preparing the organic functional layer and a display panel. The preparation method comprises the following steps: providing a substrate comprising a first electrode layer and a pixel defining layer; forming a first organic material layer on the pixel defining layer, and forming a sacrificial layer on the first organic material layer; coating a photoresist layer on the surface of the sacrificial layer, and patterning the photoresist layer through exposure and development processes; and bombarding the exposed sacrificial layer after patterning by adopting plasma to remove the sacrificial layer and the photoresist remained on the sacrificial layer, thereby exposing the first organic material layer. The method not only protects the organic material layer during plasma bombardment, but also can completely remove the photoresist residue in the photoetching process.
Description
Technical Field
The invention relates to the technical field of display, in particular to an organic functional layer, a method for preparing the organic functional layer and a display panel.
Background
An Organic Light-Emitting Diode (OLED) is also called an Organic electroluminescent display or an Organic Light-Emitting semiconductor. The OLED display has been widely used in various industries due to its characteristics of lightness, thinness, power saving, and wide temperature range. Photolithography is one of the major processes in the production of planar transistors and integrated circuits. Is a process technique for opening holes in a mask on the surface of a semiconductor wafer to allow localized diffusion of impurities.
In the related art, in the process of preparing the high-pixel-density OLED panel by using the photolithography process, in order to sufficiently remove the photoresist remaining on the surface of the previous organic functional layer, the plasma bombardment treatment is generally performed on the surface of the previous organic functional layer before the subsequent evaporation of the organic functional layer. However, the material treated by plasma bombardment needs to have certain plasma bombardment resistance, and the following problems occur in operation: if the plasma energy operating window is small, the plasma energy is too small, the photoresist residue cannot be completely removed, and if the plasma energy operating window is large, the plasma energy is too large, so that the OLED organic functional layer is easily damaged when the photoresist residue is removed; moreover, the exposure time of the organic functional layer of the OLED is too long in the plasma bombardment treatment process, so that the interface is not fresh, which is mainly characterized in that the surface free energy is reduced, and the transmission of current carriers at the interface is influenced. Therefore, there is a need to provide a new technical solution to improve one or more of the problems in the above solutions.
It is noted that this section is intended to provide a background or context to the embodiments of the invention that are recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.
Disclosure of Invention
An object of the present invention is to provide an organic functional layer, a method of manufacturing the same, and a display panel, which overcome one or more of the problems due to the limitations and disadvantages of the related art, at least to some extent.
According to a first aspect of embodiments of the present invention, there is provided a method of fabricating an organic functional layer, the method including:
providing a substrate, wherein the substrate comprises a first electrode layer and a pixel defining layer;
forming a first organic material layer for preparing an organic functional layer on the pixel defining layer, and forming a sacrificial layer on the first organic material layer;
coating a photoresist layer on the surface of the sacrificial layer, and patterning the photoresist layer through exposure and development processes;
bombarding the exposed sacrificial layer after patterning by adopting plasma to remove the sacrificial layer and the photoresist remained on the sacrificial layer so as to expose the first organic material layer;
in the embodiment of the invention, a second organic material layer for preparing an organic functional layer is evaporated on the exposed organic material layer.
In the embodiment of the invention, the thickness of the sacrificial layer is 1 nm-1000 nm.
In an embodiment of the invention, the sacrificial layer is formed on the first organic material layer by an evaporation process.
In the embodiment of the invention, the energy of plasma in the plasma bombardment is related to the material of the sacrificial layer and the preset physical parameters.
In an embodiment of the invention, the sacrificial layer and the first organic material layer are made of the same material; or, the sacrificial layer and the first organic material layer are made of different materials.
In the embodiment of the invention, when the materials are the same, the temperature of the substrate in the evaporation deposition process is different when the sacrificial layer and the first organic material layer are evaporated.
In the embodiment of the invention, when the materials are different, the deposition rate and the temperature in the evaporation deposition process are different when the sacrificial layer and the first organic material layer are evaporated.
According to a second aspect of embodiments of the present invention, there is provided an organic functional layer, which is prepared by the method for preparing an organic functional layer according to any one of the above embodiments.
According to a third aspect of embodiments of the present invention, there is provided a display panel comprising the organic functional layer of the above embodiments.
The technical scheme provided by the embodiment of the invention at least comprises the following beneficial effects:
in one embodiment of the invention, a sacrificial layer is formed on an organic material layer for preparing an organic functional layer of the OLED, and when plasma bombardment is performed after photoetching and developing processes, the sacrificial layer can be completely removed to expose an interface of the organic material layer, and meanwhile, residual photoresist on the sacrificial layer can be taken away. The method protects the organic material layer under plasma bombardment, can thoroughly remove the photoresist, and can improve the surface free energy of the organic material layer compared with the related technology, thereby being beneficial to the transmission of current carriers at the interface.
Drawings
Fig. 1 shows a flow chart of a method of preparing an organic functional layer according to an embodiment of the present invention;
fig. 2A-2G show schematic diagrams of processes for preparing organic functional layers according to embodiments of the present invention.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Furthermore, the drawings are merely schematic illustrations of the invention and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted. Some of the block diagrams shown in the figures are functional entities and do not necessarily correspond to physically or logically separate entities.
An embodiment of the present invention provides a method for preparing an organic functional layer, which may include the following steps, as shown in fig. 1:
step S101: providing a substrate, wherein the substrate comprises a first electrode layer and a pixel defining layer;
step S102: forming a first organic material layer for preparing an organic functional layer on the pixel defining layer, and forming a sacrificial layer on the first organic material layer;
step S103: coating a photoresist layer on the surface of the sacrificial layer, and patterning the photoresist layer through exposure and development processes;
step S104: bombarding the exposed sacrificial layer after patterning by adopting plasma to remove the sacrificial layer and the photoresist remained on the sacrificial layer so as to expose the first organic material layer;
in the related art, in the process of preparing the high-pixel-density OLED panel by using the photolithography process, in order to sufficiently remove the photoresist remaining on the surface of the organic functional layer, plasma bombardment treatment is generally performed on the surface of the organic functional layer before the subsequent evaporation of the organic functional layer. However, the material treated by plasma bombardment needs to have certain plasma bombardment resistance, and the following problems occur in operation: if the plasma energy operating window is small, the plasma energy is too small, the photoresist residue cannot be completely removed, and if the plasma energy operating window is large, the plasma energy is too large, so that the OLED organic functional layer is easily damaged when the photoresist residue is removed; moreover, the exposure time of the organic functional layer of the OLED is too long in the plasma bombardment treatment process, so that the interface is not fresh, which is mainly characterized in that the surface free energy is reduced, and the transmission of current carriers at the interface is influenced. In this embodiment, a sacrificial layer is disposed on the organic material layer, and when plasma bombardment is performed after development of the photolithography process, the sacrificial layer is completely removed to leak a "fresh" interface of the organic material layer, and meanwhile, residual photoresist on the sacrificial layer can be taken away. The method protects the organic material layer under plasma bombardment, can thoroughly remove the photoresist, and simultaneously has short exposure time in the plasma bombardment treatment process due to the existence of the sacrificial layer, so that the surface free energy of the organic material layer is improved, the transmission of current carriers at the interface is facilitated, and the performance of the organic functional layer is improved.
Specifically, as shown in fig. 2A to 2G, the method may specifically include the following steps a to d:
a) a substrate 1 is provided, the substrate 1 comprising a first electrode layer 2 and a pixel defining layer 3.
For example, the substrate 1 may be a glass substrate, the first electrode layer 2 may be an anode or a cathode, and reference may be made to the prior art for the substrate 1, the first electrode layer 2 and the pixel defining layer 3, which is not described herein again.
b) A first organic material layer 4 for preparing an organic functional layer is formed on the pixel defining layer 3, and a sacrificial layer 5 is formed on the first organic material layer.
Specifically, the organic functional layer may include at least one or a combination of plural kinds of organic light emitting layers, hole injection layers, hole transport layers, electron injection layers, and the like. The first organic material layer 4 in this embodiment may be a hole transport layer, but is not limited thereto.
The first organic material layer 4 may be formed on the pixel defining layer 3 by, for example, a physical vapor deposition process such as a vacuum evaporation process.
In the embodiment of the present invention, the sacrificial layer 5 may be formed on the first organic material layer 4 by a vacuum evaporation process, such as vacuum evaporation. The specific vacuum evaporation process can refer to the prior art, and is not described herein again.
In the embodiment of the present invention, the thickness of the sacrificial layer 5 is 1nm to 1000nm, such as 100nm, 200nm, 300nm, 600nm, 800nm, 900nm, etc., but is not limited thereto. The sacrificial layer with the thickness within the range can not only prevent the organic material layer 4 from being damaged in the plasma bombardment process, but also ensure that the sacrificial layer 5 can be completely removed in the plasma bombardment process.
c) And coating a photoresist layer 6 on the surface of the sacrificial layer 5, and patterning the photoresist layer 6 through exposure and development processes.
Specifically, the sacrificial layer 5 may be uniformly coated with a photoresist layer 6, and the photoresist may be divided into a positive photoresist and a negative photoresist, and may be coated by a spin coating method or a static spraying method, for example. After the coating is completed, the photoresist layer 6 is exposed by using a mask plate, and the exposure method includes contact exposure, proximity exposure, projection exposure, and the like. The exposed photoresist layer 6 is then developed to obtain a photoresist pattern, although not limited thereto.
d) And bombarding the exposed sacrificial layer 5 after patterning by adopting plasma to remove the sacrificial layer 5 and the photoresist remained on the sacrificial layer, thereby exposing the first organic material layer 4.
Illustratively, in an embodiment of the present invention, the energy of the plasma during the plasma bombardment is related to the material of the sacrificial layer 5 and the preset physical parameters, which may be, but not limited to, the thickness and area of the sacrificial layer. The plasma energy is set according to the material of the sacrificial layer 5 and the preset physical parameters, so that the sacrificial layer 5 can be effectively removed as far as possible during plasma bombardment without causing damage to the first organic material layer 4.
Further, optionally, in the embodiment of the present invention, the sacrificial layer 5 and the first organic material layer 4 are made of the same material; alternatively, the sacrificial layer 5 and the first organic material layer 4 are different materials. On the one hand, the use of the same material for the sacrificial layer 5 and the organic material layer 4 can reduce the number of chambers used for device fabrication, since different materials are used, and additional process chambers are required for preparing the sacrificial layer. On the other hand, since the sacrificial layer 5 is to be removed, when the organic material layer 4 has a high value, a different material having a low value may be used to form the sacrificial layer 5, thereby reducing the material cost.
Specifically, in an embodiment of the present invention, when the material is the same, when the sacrificial layer 5 and the first organic material layer 4 are evaporated, the temperature of the substrate during the evaporation deposition process is different, and the diffusion rate of the organic molecules is different due to the different temperature, so that the sacrificial layer 5 with loose organic molecule deposition and the first organic material layer 4 with density relative to the sacrificial layer can be obtained, when the plasma bombardment process is performed, the loose sacrificial layer 5 is easily removed, and the first organic material layer 4 with density can be completely retained and cannot be damaged by plasma energy. For example, the substrate may be cooled by water cooling during the deposition of the first organic material layer 4 deposited first; when the sacrificial layer 5 is evaporated, the substrate temperature is lowered by switching a cooling method with a better cooling effect, for example, a liquid nitrogen cooling method, the temperature is low, so that the diffusion mobility of the organic molecules deposited on the substrate is low, and the deposited organic molecules become loose, but not limited thereto.
In another embodiment of the present invention, when the material is different, the deposition rate and temperature during the evaporation deposition process are different, i.e. the deposition process parameters are different when evaporating the sacrificial layer 5 and the first organic material layer 4. Due to different materials, the microstructure of organic molecules is different, and the deposition rate is different; the deposition rates of the organic molecules vary with the temperature, and the organic molecules can be deposited to form a loose sacrificial layer 5 and a dense first organic material layer 4 relative to the sacrificial layer 5 by controlling the process parameters. For example, the material of the sacrificial layer 5 may be selected according to the deposition rate of organic molecules during evaporation of the material, or the diffusion mobility of organic molecules of the material may be controlled according to a change in temperature during deposition, thereby forming the desired sacrificial layer 5, but the invention is not limited thereto. In this embodiment, the sacrificial layer 5 with loose organic molecule deposition and the first organic material layer 4 with density relative to the sacrificial layer are obtained by controlling the deposition process parameters. Thus, when the plasma bombardment process is performed, the loose sacrificial layer 5 is easily removed, and the relatively dense first organic material layer 4 can be completely remained and not damaged by the plasma energy.
According to a second aspect of embodiments of the present invention, there is provided an organic functional layer, which is prepared by the method for preparing an organic functional layer according to any one of the above embodiments. The organic functional layer may include at least one or a combination of organic light emitting layer, hole injection layer, hole transport layer, electron injection layer, and the like. For example, in the organic functional layer, an anode, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and a cathode are sequentially stacked. For example, the organic functional layer may be provided with an electron blocking layer and a hole blocking layer, but is not limited thereto. For the method for preparing the organic functional layer, reference may be made to the description in the foregoing embodiments, and further description is omitted here.
According to a third aspect of embodiments of the present invention, there is provided a display panel comprising the organic functional layer of the above embodiments. The display panel may include, but is not limited to, an AMOLED display panel, a PMOLED display panel, or a flexible display panel.
In the above embodiment of the present invention, the sacrificial layer is disposed on the organic material layer, and when the plasma bombardment is performed after the photolithography process is developed, the sacrificial layer is completely removed to leak the interface of the "fresh" organic material layer, and simultaneously, the residual photoresist on the sacrificial layer can be taken away. The method not only protects the organic material layer under the plasma bombardment, but also can thoroughly remove the photoresist, and improves the performance of the organic functional layer.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
Claims (10)
1. A method of making an organic functional layer, the method comprising:
providing a substrate, wherein the substrate comprises a first electrode layer and a pixel defining layer;
forming a first organic material layer for preparing an organic functional layer on the pixel defining layer, and forming a sacrificial layer on the first organic material layer;
coating a photoresist layer on the surface of the sacrificial layer, and patterning the photoresist layer through exposure and development processes;
and bombarding the exposed sacrificial layer after patterning by adopting plasma to remove the sacrificial layer and the photoresist remained on the sacrificial layer, thereby exposing the first organic material layer.
2. The method according to claim 1, wherein a second organic material layer for preparing an organic functional layer is vapor-deposited on the exposed first organic material layer.
3. The method of claim 1, wherein the sacrificial layer has a thickness of 1nm to 1000 nm.
4. The method of claim 1, wherein the sacrificial layer is formed on the first organic material layer by an evaporation process.
5. The method of claim 1, wherein the energy of the plasma during the plasma bombardment is related to the material of the sacrificial layer and a predetermined physical parameter.
6. The method according to any one of claims 1 to 5, wherein the sacrificial layer and the first organic material layer are made of the same material; or, the sacrificial layer and the first organic material layer are made of different materials.
7. The method of claim 6, wherein the sacrificial layer and the first organic material layer are deposited at the same material and the substrate temperature during deposition is different.
8. The method of claim 6, wherein when the sacrificial layer and the first organic material layer are deposited with different materials, the deposition rate and temperature during deposition are different.
9. An organic functional layer produced by the method for producing an organic functional layer according to any one of claims 1 to 8.
10. A display panel comprising the organic functional layer according to claim 9.
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