CN111276508B - Driving backboard, manufacturing method thereof and display panel - Google Patents
Driving backboard, manufacturing method thereof and display panel Download PDFInfo
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- CN111276508B CN111276508B CN202010066064.7A CN202010066064A CN111276508B CN 111276508 B CN111276508 B CN 111276508B CN 202010066064 A CN202010066064 A CN 202010066064A CN 111276508 B CN111276508 B CN 111276508B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 239000010410 layer Substances 0.000 claims description 109
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 238000002161 passivation Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 abstract description 25
- 230000000694 effects Effects 0.000 abstract description 16
- 238000010586 diagram Methods 0.000 description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- 239000010949 copper Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 11
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002346 layers by function Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
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- 230000002035 prolonged effect Effects 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- DTSBBUTWIOVIBV-UHFFFAOYSA-N molybdenum niobium Chemical compound [Nb].[Mo] DTSBBUTWIOVIBV-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- LYHKUHHKGREXNQ-UHFFFAOYSA-N [Mo].[Nb].[Co] Chemical compound [Mo].[Nb].[Co] LYHKUHHKGREXNQ-UHFFFAOYSA-N 0.000 description 1
- KIGWXGQMMKJTBW-UHFFFAOYSA-N [Mo].[Nb].[Ni] Chemical compound [Mo].[Nb].[Ni] KIGWXGQMMKJTBW-UHFFFAOYSA-N 0.000 description 1
- NNZSUKVNHWYBSF-UHFFFAOYSA-N [Nb].[Mo].[Mn] Chemical compound [Nb].[Mo].[Mn] NNZSUKVNHWYBSF-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- PCDGOLMIECCDAS-UHFFFAOYSA-N copper molybdenum niobium Chemical compound [Cu][Mo][Nb] PCDGOLMIECCDAS-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention provides a driving backboard, a manufacturing method thereof and a display panel, wherein the driving backboard comprises the following components: a substrate base plate; an electrode on the substrate base plate; the width of the routing wire along a first direction perpendicular to the extending direction is a first width, the width of the orthographic projection of the routing wire on the substrate base plate along the first direction is a second width, and the first width is larger than the second width. The method is used for improving the yield of the display panel while ensuring the driving effect of the Micro LED.
Description
Technical Field
The invention relates to the technical field of display, in particular to a driving back plate, a manufacturing method thereof and a display panel.
Background
The Micro Light-Emitting Diode (Micro LED) technology is a technology for realizing image display by using a high-density Micro LED array as a display pixel array, and similar to an Organic Light-Emitting Diode (OLED), the Micro LED also has self-luminescence, and compared with the OLED, the Micro LED has higher brightness, better Light-Emitting effect, and lower power consumption.
At present, in order to ensure the display quality of Micro LEDs, a large backlight driving current is often required to be provided. However, when the driving current is large, the driving trace generates heat seriously, and in this case, the relationship between the driving current and the driving trace heating needs to be balanced by adjusting the impedance of the driving trace. Under the condition that the material corresponding to the driving wire is fixed, the width of the driving wire is increased, or the thickness of the driving wire is increased, so that the impedance of the driving wire is reduced. However, the former is limited by the wiring density per unit area, and the width of the driving wiring is generally difficult to increase. The latter is limited by the manufacturing process of the existing magnetron sputtering (Sputter) device, because the thickness of the largest driving wire (such as a copper wire) of the existing Sputter device is less than 1 μm and the limit thickness of the existing Sputter device is not more than 3 μm on the premise of high-efficiency production, otherwise, the substrate is broken due to the overlarge stress of the metal film layer forming the driving wire. Therefore, when manufacturing thicker driving traces, the seed layer (such as copper seed layer) is usually manufactured by using a splitter device, and then the driving traces with high thickness are obtained by electroplating or chemical plating, however, when the thickness thereof exceeds 20 μm, the uniformity of the film layer will be deteriorated, and the time cost of the production will also be increased, thereby being not beneficial to mass production.
Therefore, it is very important to improve the yield of the display panel while ensuring the driving effect of the Micro LEDs.
Disclosure of Invention
The invention relates to a driving back plate, a manufacturing method thereof and a display panel, which are used for improving the yield of the display panel while ensuring the driving effect of Micro LEDs.
In a first aspect, an embodiment of the present invention provides a driving backplane, including:
a substrate base plate;
an electrode on the substrate base plate;
the width of the routing wire along a first direction perpendicular to the extending direction is a first width, the width of the orthographic projection of the routing wire on the substrate base plate along the first direction is a second width, and the first width is larger than the second width.
In a possible implementation manner, a cross-sectional shape of the trace along a first cross-section is at least one of a single triangle, a triangular sawtooth shape, a single rectangle, a rectangular sawtooth shape, and an arc shape, and the first cross-section is a plane passing through the trace and perpendicular to the extending direction.
In a possible implementation manner, a first functional film layer is disposed between the trace and the substrate, and orthogonal projections of the first functional film layer and the trace on the substrate are overlapped with each other.
In a possible implementation manner, a second functional film layer is disposed between the trace and the electrode, and the second functional film layer covers the trace.
In a possible implementation manner, a first adhesion layer is disposed between the trace and the first functional film layer.
In a possible implementation manner, a second adhesion layer is disposed between the trace and the second functional film layer.
In one possible implementation, a passivation layer is disposed on the electrode.
In one possible implementation manner, an inorganic insulating layer is arranged between the substrate base plate and the first functional film layer.
In a second aspect, an embodiment of the present invention provides a display panel, which includes the driving backplane as described above, and a light emitting diode chip electrically connected to any electrode of the driving backplane.
In a third aspect, an embodiment of the present invention provides a method for manufacturing a driving backplane, where the method includes:
forming a routing on the substrate base plate;
and forming an electrode electrically connected with the trace on the trace, wherein the width of the trace along a first direction perpendicular to the extending direction is a first width, the width of the orthographic projection of the trace on the substrate base plate along the first direction is a second width, and the first width is greater than the second width.
The invention has the following beneficial effects:
the embodiment of the invention provides a driving back plate, a manufacturing method thereof and a display panel, wherein the driving back plate comprises a substrate base plate, an electrode positioned on the substrate base plate and a wire positioned between the electrode and the substrate base plate and electrically connected with the electrode, wherein the first width of the wire along a first direction vertical to an extending direction is larger than the second width of an orthographic projection of the wire on the substrate base plate along the first direction, so that on the premise that the wire is the same as a wire material, has the same thickness and has the same extending length in the prior art, if the width of the wire in the prior art is the second width, the width of the wire in the unit area of the wire in the embodiment of the invention is larger than the width of the wire in the prior art, so that the impedance of the wire in the prior art is relatively reduced, and a larger driving current can be provided through the wire, so that the driving effect of the Micro LED wire is ensured.
In addition, on the premise that the wiring width is reduced, the wiring thickness can be relatively reduced, and therefore the yield of the display panel is improved.
Drawings
FIG. 1 is a schematic diagram of a copper trace in the related art;
FIG. 2 is a schematic view of a driving backplate according to the related art;
FIG. 3 is a schematic cross-sectional view taken along the direction AA' in FIG. 2;
fig. 4 is a schematic cross-sectional view of a driving backplate according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 9 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 10 is a schematic view of a structure of a driving backplate according to an embodiment of the present invention;
FIG. 11 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 12 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 13 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 14 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 15 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 16 is a schematic view of a structure of a driving backplate according to an embodiment of the present invention;
fig. 17 is a schematic structural diagram of a driving backplane according to an embodiment of the present disclosure;
fig. 18 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 19 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention;
fig. 20 is a flowchart of a method for manufacturing a driving backplate according to an embodiment of the present invention.
Detailed Description
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. And the embodiments and features of the embodiments may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
In the related art, in order to ensure the driving effect of the Micro LED, a driving wire is often required to provide a large driving current for the Micro LED chip, and the thickness of the driving wire can be estimated according to a specific value of the required driving current on the premise of selecting a driving wire material. When the material of the driving trace is copper, in combination with the schematic structural diagram of a copper trace shown in fig. 1, when the thickness of the copper trace is 8 μm, the resistance R =0.0027L/W of the copper trace, in fig. 1, L represents the extending length of the copper trace, W represents the width of the copper trace, and d represents the thickness of the copper trace. The inventor found in practical studies that, according to the design experience of Printed Circuit Board (PCB), 35 μm copper thickness and 0.15mm line widthCan carry a current of 0.2A. Under the temperature rise of 20 ℃, the copper thickness is 8 mu m, the copper wire with the length of 50 mu m can bear the current of 130mA, and the copper wire with the length of 100 mu m can bear the current of 210 mA. At 40 ℃ temperature rise, the copper wire with the thickness of 8 mu m can bear 170mA current by a 50 mu m wire, and 282mA current by a 100 mu m wire. Finally, the current carrying capability of the copper trace can be determined
The relation between the parameters related to the copper wiring is
Current carrying capability in desired copper wiring
Under the premise that the copper wire width W and the copper wire driving current I are known, the copper wire thickness can be estimated
At present, for example, a Micro LED backlight with a resolution of 75 inches and 4K is used, the minimum thickness of a copper wire required by the Micro LED backlight is 29.7 μm, so that on one hand, when a thicker copper wire is prepared, the uniformity of a corresponding film layer is deteriorated, and on the other hand, too much stress of the corresponding film layer causes substrate fragments.
Fig. 2 is a top view of one of the structures of a driving back plate 01 in the related art, and fig. 3 is a schematic cross-sectional view of one of the cross-sectional structures along the AA' direction of the position where the Micro LED chip 02 is located in fig. 2 in the related art, specifically, the driving back plate 01 includes a substrate 03, an electrode 04 disposed on the substrate 03, and a trace 05 disposed between the substrate 03 and the electrode 04, where the width of the trace 05 along a direction perpendicular to the extending direction is a. Therefore, the line width of the routing line 05 in unit area is limited, and the adjustment of the line width is difficult to consider the Micro LED driving effect and the yield of the display panel.
In view of this, an embodiment of the present invention provides a driving backplane, as shown in fig. 4, which is a schematic cross-sectional view of the driving backplane provided by the embodiment of the present invention along the AA' direction of the position of the Mircro LED chip 02 in fig. 2, and specifically, the driving backplane includes:
a base substrate 10;
in a specific implementation process, the substrate 10 may be a silicon-based substrate, and may also be a glass substrate, which is not limited herein.
An electrode 20 on the base substrate 10;
in a specific implementation, the electrode 20 may be an electrode 20 for electrical connection with an anode of a Micro LED chip. In addition, the specific shape of the electrode 20 can be designed according to the actual application requirement, and is not limited herein.
And the trace 30 is located between the electrode 20 and the substrate base plate 10 and electrically connected to the electrode 20, wherein a width of the trace 30 along a first direction perpendicular to the extending direction is a first width, a width of an orthographic projection of the trace 30 on the substrate base plate 10 along the first direction is a second width, and the first width is greater than the second width.
In the driving backplane shown in fig. 4, the direction indicated by the arrow X is a first direction perpendicular to the extending direction of the trace 30, and if the width of the trace 30 along the first direction perpendicular to the extending direction is b, the width of the orthographic projection of the trace 30 on the substrate 10 along the first direction is a, where b = b1+ b2+ b3, b > a, so that the trace width per unit area of the trace 30 shown in fig. 4 is greater than the trace width per unit area of the trace shown in fig. 3 on the premise that the trace materials shown in fig. 4 and fig. 3 are the same, the thicknesses are the same, and the extending lengths are the same, compared to the trace 30 shown in fig. 4, which can provide a larger driving current for Micro LED chips of the same model, thereby ensuring the driving effect of the Micro LED. In addition, if the driving currents provided by the trace 30 shown in fig. 4 and the trace shown in fig. 3 are the same and the resistance of the traces are the same, the thickness of the trace 30 can be correspondingly reduced when the line width of the trace 30 shown in fig. 4 is increased, so that the damage to the substrate due to the excessive stress of the film layer where the trace 30 is located is avoided, and the yield of the display panel is improved.
In addition, in the specific implementation process, the wire 30 and the electrode 20 are structures formed by metal film layers made of the same material, specifically, the material of the wire 30 and the electrode 20 may be copper (Cu), since the electrical conductivity of copper (Cu) is high, the current transmission capability is strong, and the manufacturing cost of copper (Cu) is low, when the wire 30 and the electrode 20 are manufactured by using copper (Cu), the good driving effect of the driving backboard is ensured, and meanwhile, the low-cost manufacturing of the driving backboard is considered.
In the embodiment of the present invention, the cross-sectional shape of the trace 30 along the first cross-section is at least one of a single triangle, a triangular sawtooth shape, a single rectangle, a rectangular sawtooth shape, and an arc shape, and the first cross-section is a plane passing through the trace 30 and perpendicular to the extending direction, so that the line width of the trace 30 in a unit area is increased, and the driving effect of the Micro LED is ensured. Fig. 5 is a schematic structural diagram illustrating a cross-sectional shape of the trace 30 along the first cross-section as a single triangle. Fig. 6 is a schematic structural diagram of the cross-sectional shape of the trace 30 along the first cross-section being a triangular sawtooth shape, wherein the electrode 20 may be electrically connected to the valley of the trace 30 shown in fig. 6, or may be electrically connected to the valley of the trace 30 shown in fig. 6, which is not limited herein. Fig. 7 is a schematic structural view showing that the trace 30 has a single rectangular shape along the first cross section. Fig. 8 is a schematic structural diagram of the trace 30 along the first cross section and having a shape of a rectangular sawtooth, wherein the electrode 20 may be electrically connected to the farthest position of the trace 30 away from the substrate 10 shown in fig. 8, or electrically connected to the nearest position of the trace 30 away from the substrate 10 shown in fig. 8, which is not limited herein. Fig. 9 is a schematic structural diagram of the trace 30 having an arc shape along the first cross section. In the embodiment of the present invention, the trace 30 may have other shapes besides the shape along the first cross section as shown in fig. 5 to 9, and fig. 4 is a schematic structural diagram that the shape along the first cross section of the trace is a trapezoid, which is not described herein again.
In a specific implementation process, the cross-sectional shape of the trace 30 may be a symmetrical structure such as those in fig. 4 to 9, or may be an asymmetrical structure, which is not limited herein, so as to implement a diversified design of the driving backplane.
In a specific implementation process, taking the trace 30 shown in fig. 5 as an example, on the premise that the width a is not changed, an included angle between two sides of the trace 30 and a plane where the substrate 10 is located can be adjusted, so as to change the width b, thereby adjusting the driving effect of driving the backplane. For example, if the shape along the first cross section is a regular triangle, under the condition of the same wire resistance as the wire shown in fig. 3, the thickness of the wire 30 shown in fig. 5 can be reduced by half compared with the thickness of the wire in fig. 3, so that the preparation of the seed layer at the previous stage can be improved, the manufacturing efficiency of the subsequent electroplating driving wire production process can be improved, in addition, after the wire thickness is reduced by half, the influence of the stress caused by the thicker wire on the substrate 10 can be relieved, and the problem of the substrate 10 that the substrate 10 is warped too much to cause fragments in the device can be avoided. Of course, the width of the trace 30 under different cross-sectional shapes can be designed according to the needs of practical application, and is not limited herein.
In the embodiment of the present invention, as shown in fig. 10, a schematic structural diagram of the driving backplane is shown, specifically, a first functional film 40 is disposed between the traces 30 and the substrate 10, and the orthographic projections of the traces 30 and the first functional film 40 on the substrate 10 are overlapped. In this way, by patterning the first functional film layer 40 and then forming the patterned trace 30 on the patterned first functional film layer 40, the size of the first width of the trace 30 along the first direction perpendicular to the extending direction is conveniently controlled, so that the size of the first width of the trace 30 along the first direction perpendicular to the extending direction can be increased according to application requirements, and further, by increasing the wiring density of the trace 30 at the first width, the driving current is increased.
In the embodiment of the present invention, as shown in fig. 11, a structural diagram of the driving back plate is shown, specifically, a second functional film layer 50 is disposed between the traces 30 and the electrodes 20, and the second functional film layer 50 covers the traces 30. In a specific implementation process, the second functional film layer 50 may be specifically the second functional film layer 50 disposed on the trace 30, and the second functional film layer 50 is planarized, so that the subsequent process of the film layer on the second functional film layer 50 is facilitated, and the structural stability of the driving backplane is ensured.
In an embodiment of the present invention, as shown in fig. 12, a schematic structural diagram of a driving backplane is shown, a first adhesion layer 60 is disposed between the trace 30 and the first functional film 40, where the first adhesion layer 60 may be a film formed of an alloy material such as molybdenum niobium nickel (monnbni), molybdenum niobium manganese (MoNbMn), or molybdenum niobium cobalt (MoNbCo), and the like, which is not limited herein. In the specific implementation process, the first adhesion layer 60 is arranged between the trace 30 and the first functional layer, so that the trace 30 and the first functional layer are adhered together, the structural stability between the trace 30 and the first functional layer is ensured, and the structural stability of the etching process of the trace 30 can be still ensured even if the copper (Cu) trace 30 is etched in the subsequent process.
In the embodiment of the present invention, as shown in fig. 13, a schematic structural diagram of the driving backplane is shown, a second adhesion layer 70 is disposed between the traces 30 and the second functional film 50, and the second adhesion layer 70 may be a film formed of an alloy material such as molybdenum niobium (MoNb), or molybdenum niobium copper (MoNbCu), and is not limited herein. In addition, in a specific implementation process, the first adhesive layer 60 and the second adhesive layer 70 may be the same material, or may be film layers made of different materials, which is not limited herein. In the specific implementation process, the second adhesion layer 70 is arranged between the wiring 30 and the second functional film layer 50, so that the wiring 30 and the second functional film layer 50 are adhered together, the structural stability of each other is ensured, in addition, the second functional film layer 50 is flattened, the preparation of the subsequent film layer on the second functional film is facilitated, and the structural stability of the driving back plate is ensured.
In the embodiment of the present invention, as shown in fig. 14, a schematic structural diagram of the driving backplate is shown, a passivation layer 80 is disposed on the electrode 20, and a material forming the passivation layer 80 includes at least one of silicon nitride (SiN) and silicon oxide (SiO), and of course, a person skilled in the art may select a material of the passivation layer 80 according to an actual application, which is not limited herein. In the specific implementation process, the passivation layer 80 is arranged on the electrode 20, so that the corrosion of external water and oxygen to the internal film layer of the driving backboard is avoided through the passivation layer 80, the driving effect of the driving backboard is ensured, and the service life of the driving backboard is prolonged. In addition, the parasitic capacitance between the electrodes 20 is reduced by adding the passivation layer 80 with a certain thickness, thereby ensuring the driving effect of the driving back plate.
In the embodiment of the present invention, as shown in fig. 15, which is a schematic structural diagram of a driving backplane, a reflective layer 90 is disposed on a passivation layer 80, where the reflective layer 90 may be a sandwich structure formed by ITO/Ag/ITO, and once the driving backplane emits light, the reflective layer 90 can improve the utilization rate of light of the driving backplane, so as to ensure the display quality of the driving backplane.
In the embodiment of the present invention, as shown in fig. 16, a schematic structural diagram of a driving backplane is shown, an inorganic insulating layer 100 is disposed between a substrate 10 and a first functional film 40, where the inorganic insulating layer 100 includes at least one of silicon nitride (SiN) and silicon oxide (SiO), and of course, a person skilled in the art may select a material of the inorganic insulating layer 100 according to practical applications, which is not limited herein. In the specific implementation process, the middle area of the substrate base plate 10 is easy to be sunken and warped all around due to the material of the wiring 30, the substrate base plate 10 can be sunken all around due to the material of the inorganic insulating layer 100, and the inorganic insulating layer 100 is arranged between the substrate base plate 10 and the first functional film layer 40, so that the application effect of the wiring 30 additionally arranged on the substrate base plate 10 is guaranteed to be offset, the stress is prevented from damaging the substrate base plate 10, and the service life of the driving backboard is prolonged.
In the embodiment of the present invention, as shown in fig. 17, a schematic structural diagram of the driving backplane is shown, another inorganic insulating layer 110 is disposed on the reflective layer 90, and the another inorganic insulating layer 110 includes at least one of silicon nitride (SiN) and silicon oxide (SiO), and of course, a person skilled in the art may select a material of the another inorganic insulating layer 100 according to practical applications, which is not limited herein. In the specific implementation process, the other insulating layer 110 is arranged on the reflecting layer 90, so that the corrosion of external water and oxygen to the internal film layer of the driving backboard is avoided through the other insulating layer 110, the driving effect of the driving backboard is ensured, and the service life of the driving backboard is prolonged.
Based on the same inventive concept, as shown in fig. 18 and fig. 19, fig. 18 is a schematic structural diagram of a display panel provided in an embodiment of the present invention, where the display panel includes the driving backplane 200 and the light emitting diode chip 300 electrically connected to any electrode of the driving backplane 200. In the embodiment of the present invention, when the driving backplate 200 is the structural schematic diagram shown in fig. 17, the sectional structural schematic diagram along the BB' direction is shown in fig. 19.
The principle of the display panel to solve the problem is similar to that of the driving back plate, so the implementation of the display device can refer to the implementation of the driving back plate, and repeated descriptions are omitted.
In the implementation process, the display panel can be used in any product or component with a display function, such as a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display panel are understood by those skilled in the art, and are not described herein again, nor should they be construed as limiting the present invention.
Based on the same inventive concept, as shown in fig. 20, an embodiment of the present invention further provides a method for manufacturing a driving backplane, including:
s101: forming a routing on the substrate base plate;
s102: and forming an electrode electrically connected with the trace on the trace, wherein the width of the trace along a first direction perpendicular to the extending direction is a first width, the width of the orthographic projection of the trace on the substrate base plate along the first direction is a second width, and the first width is greater than the second width.
In the specific implementation process, the specific implementation process from step S101 to step S102 is as follows:
firstly, the trace is formed on the substrate, in the specific implementation process, a whole metal film layer can be arranged on the substrate, and then the metal film layer is etched to form a patterned film layer as the trace. Then, an electrode electrically connected with the trace is formed on the trace, and the electrode can be connected with any pole of the light emitting diode chip. In a specific implementation process, the width of the trace along a first direction perpendicular to the extending direction is a first width, the width of the orthographic projection of the trace on the substrate along the first direction is a second width, and the first width is greater than the second width.
In the embodiment of the invention, before forming the trace on the substrate, after forming the inorganic insulating layer on the substrate, a whole layer of the first functional film layer is coated on the inorganic insulating layer, and then the first functional film layer is exposed and developed to form the patterned first functional film layer, and then a whole layer of the first adhesive layer is formed on the patterned first functional film layer, and then the first adhesive layer is exposed and developed to form the patterned first adhesive layer. After the patterned first adhesion layer is formed, a whole layer of routing lines is formed on the patterned first adhesion layer and is patterned.
In the embodiment of the invention, after the trace is formed on the substrate base plate, a whole layer of second adhesion layer is coated on the trace, and then the second adhesion layer is exposed and developed to form the patterned second adhesion layer. And then forming a second functional film layer on the patterned second adhesion layer, and then forming an electrode on the second functional film layer and electrically connecting the electrode with the trace through a via hole on the passivation layer.
In a specific implementation process, before forming a trace on a substrate, a whole layer of inorganic insulating layer is formed on the substrate, then patterning is performed on the inorganic insulating layer, then a whole layer of first functional film layer is coated on the patterned inorganic insulating layer, then patterning is performed on the first functional film layer, then a whole layer of first adhesive layer is formed on the patterned first functional film layer, then exposure and development are performed on the first adhesive layer to form a patterned first adhesive layer, and after the patterned first adhesive layer is formed, a whole layer of trace is formed on the patterned first adhesive layer and is patterned.
The embodiment of the invention provides a driving back plate, a manufacturing method thereof and a display panel, wherein the driving back plate comprises a substrate base plate, an electrode positioned on the substrate base plate and a wire positioned between the electrode and the substrate base plate and electrically connected with the electrode, wherein the first width of the wire along a first direction vertical to an extending direction is larger than the second width of an orthographic projection of the wire on the substrate base plate along the first direction, so that on the premise that the wire is the same as a wire material, has the same thickness and has the same extending length in the prior art, if the width of the wire in the prior art is the second width, the width of the wire in the unit area of the wire in the embodiment of the invention is larger than the width of the wire in the prior art, so that the impedance of the wire in the prior art is relatively reduced, and a larger driving current can be provided through the wire, so that the driving effect of the Micro LED wire is ensured.
In addition, on the premise that the wiring width is reduced, the wiring thickness can be relatively reduced, and therefore the yield of the display panel is improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (9)
1. A drive backplate, comprising:
a base substrate;
an electrode on the substrate base plate;
the routing wire is positioned between the electrode and the substrate base plate and is electrically connected with the electrode, wherein the width of the routing wire along a first direction vertical to the extension direction is a first width, the first width is the width of the outer surface of the routing wire along the cross section shape of a first cross section, and the first cross section is a plane which passes through the routing wire and is vertical to the extension direction; the width of the orthographic projection of the routing wire on the substrate base plate along the first direction is a second width, and the first width is greater than the second width;
the first functional film layer is arranged between the wiring and the substrate base plate, orthographic projections of the first functional film layer and the wiring on the substrate base plate are mutually overlapped, and the orthographic projection of the first functional film layer on the substrate base plate completely falls into the area range of the orthographic projection of the wiring on the substrate base plate.
2. The driving backplate of claim 1, wherein the cross-sectional shape of the traces along the first cross-section is at least one of a single triangle, a triangular zigzag, a single rectangle, a rectangular zigzag, and an arc.
3. The driving back plate of claim 1, wherein a second functional film layer is disposed between the traces and the electrodes, and the second functional film layer covers the traces.
4. The driving backplate of claim 1, wherein a first adhesive layer is disposed between the traces and the first functional film layer.
5. The driving back plate of claim 3, wherein a second adhesive layer is disposed between the traces and the second functional film layer.
6. The driving backplate of claim 1, wherein a passivation layer is disposed on the electrodes.
7. The driving back plate of claim 1, wherein an inorganic insulating layer is disposed between the substrate base plate and the first functional film layer.
8. A display panel comprising the driving backplane according to any one of claims 1 to 7, and a light emitting diode chip electrically connected to any one of the electrodes of the driving backplane.
9. A method of making a driving backplate according to any one of claims 1 to 7, comprising:
forming a patterned first functional film layer on a substrate base plate;
forming a routing on the first functional film layer;
forming an electrode electrically connected with the trace on the trace, wherein the width of the trace along a first direction perpendicular to an extending direction is a first width, the first width is the width of the outer surface of the trace along the cross-sectional shape of a first cross section, and the first cross section is a plane passing through the trace and perpendicular to the extending direction; the width of the orthographic projection of the routing line on the substrate base plate along the first direction is a second width, and the first width is larger than the second width.
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