CN111272771A - High-resolution particle detection device - Google Patents

High-resolution particle detection device Download PDF

Info

Publication number
CN111272771A
CN111272771A CN202010150475.4A CN202010150475A CN111272771A CN 111272771 A CN111272771 A CN 111272771A CN 202010150475 A CN202010150475 A CN 202010150475A CN 111272771 A CN111272771 A CN 111272771A
Authority
CN
China
Prior art keywords
illumination
imaging
detection
wafer
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010150475.4A
Other languages
Chinese (zh)
Other versions
CN111272771B (en
Inventor
罗先刚
赵承伟
王长涛
刘利芹
罗云飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Optics and Electronics of CAS
Original Assignee
Institute of Optics and Electronics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Optics and Electronics of CAS filed Critical Institute of Optics and Electronics of CAS
Priority to CN202010150475.4A priority Critical patent/CN111272771B/en
Publication of CN111272771A publication Critical patent/CN111272771A/en
Application granted granted Critical
Publication of CN111272771B publication Critical patent/CN111272771B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/94Investigating contamination, e.g. dust
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8822Dark field detection
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A50/00TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
    • Y02A50/20Air quality improvement or preservation, e.g. vehicle emission control or emission reduction by using catalytic converters

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention discloses a high-resolution particle detection device, and belongs to the technical field of innovation of particle detection. The device comprises an isolation cover for isolating disturbance and pollution of personnel, air and the like; the bracket is used for supporting and positioning and connecting all the subsystems; the workpiece platform system is used for bearing a test sample wafer, adjusting the sample wafer to be coaxial with the imaging system, positioning a detection area and carrying out large-area detection stepping splicing; the imaging system is used for switching the objective lens, automatically focusing and detecting imaging; an illumination system for particle detection illumination; the control system is used for controlling the precise positioning of the workpiece table system, the switching of the objective lens and the automatic focusing and the image acquisition and processing. The device is based on the dark field imaging principle, and images through collecting the scattered light of particles, and then realizes the ability of obtaining the size and the distribution information of the particles on the sample wafer.

Description

High-resolution particle detection device
Technical Field
The invention belongs to the technical field of particle detection, and particularly relates to a high-resolution particle detection device.
Background
In the field of near-field lithography, the degree of cleaning of the surface of a sample wafer is one of the important factors affecting the lithography quality, and how to effectively detect the contamination particles on the sample wafer is always a research hotspot in the field of near-field lithography. The cleanliness detection is used as a judging means of the cleaning process, so that a technician can determine whether the current cleaning process can meet the photoetching requirement, and the cleaning process is timely improved to improve the cleanliness of the sample wafer. The optical detection method based on dark field imaging is convenient for realizing online particle detection, meanwhile, compared with bright field imaging, dark field imaging inhibits the influence of background light, and has higher signal-to-noise ratio and image contrast, so that the method is more suitable for observing the particle boundary and outline.
The invention relates to a high-resolution particle detection device, which realizes high-resolution detection on the particle pollution condition on the surface of a sample wafer based on the dark field imaging principle.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the device is based on a dark field imaging theory, and realizes high-resolution detection on the particle pollution condition on the surface of a sample wafer under the condition of not contacting the sample wafer to be tested.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a high resolution particle detection device comprises an isolation hood for isolating disturbance and pollution such as personnel, air and the like; the bracket is used for supporting and positioning and connecting all the subsystems; the workpiece platform system is used for bearing a test sample wafer, adjusting the sample wafer to be coaxial with the imaging system, positioning a detection area and carrying out large-area detection stepping splicing; the imaging system is used for switching the objective lens, automatically focusing and detecting imaging; an illumination system for particle detection illumination; the control system is used for controlling the precise positioning of the workpiece table system, the switching of the objective lens and the automatic focusing and the image acquisition and processing.
The workpiece platform system comprises a six-axis adjusting platform, a wafer bearing platform and a test sample wafer, wherein the test sample wafer is placed on the wafer bearing platform, and the wafer bearing platform is fixed on the six-axis adjusting platform. The six-axis adjusting platform needs to meet the requirements of adjusting the position and the posture of the test sample wafer, so that the requirements of detecting imaging and splicing and detecting the whole wafer are met. Wherein the wafer bearing platform is required to be compatible with the installation of different test sample wafers.
The imaging system comprises an imaging lens frame, an automatic focusing module, an objective lens switching module, an imaging objective lens and a CCD (charge coupled device), wherein the CCD is installed at the upper end of the imaging lens frame, the automatic focusing module is installed at the lower end of the imaging lens frame, the objective lens switching module is installed on the automatic focusing module, and the imaging objective lens is installed on the objective lens switching module. The automatic focusing module can quickly focus sample wafers with different thicknesses or surface shapes; the objective lens switching module can realize the quick switching among various objective lenses, and further meets the requirements of detection resolution and field of view. Each part of the imaging system needs to be precisely installed so as to ensure the coaxiality of the light path.
The illumination system comprises an illumination X/Y axis displacement table, an illumination Z/RX/RY axis displacement table, an illumination lens cone adjusting cylinder, an illumination lens cone, an illumination lens group, a laser and an optical fiber head, wherein the illumination Z/RX/RY axis displacement table is installed on the illumination X/Y axis displacement table, the illumination lens cone adjusting cylinder is installed on the illumination Z/RX/RY axis displacement table, the illumination lens cone is installed on the illumination lens cone adjusting cylinder, the illumination lens group is installed on the illumination lens cone, the optical fiber head is installed on the illumination lens cone, and the laser is connected with the optical fiber head through an optical fiber. The optical fiber head has the functions of beam expanding, collimation and the like; the X/Y axis displacement table and the illumination Z/RX/RY axis displacement table can adjust the angle and the position of illumination; the lighting lens barrel adjusting cylinder can adjust the focus of the lighting lens group.
The principle of the invention is as follows:
1. the device is based on the principle of dark field imaging, and realizes high-resolution detection on the particle pollution condition on the surface of the sample wafer.
2. The illumination light source of the device is subjected to beam expanding, collimating, reconcentration and other processing, and meanwhile, the illumination angle and the defocusing distance can be adjusted through the designed adjusting mechanism, so that the requirements on illumination area, uniformity, intensity and the like are met.
3. The automatic focusing module integrated by the device can quickly focus sample wafers with different thicknesses or surface shapes; the integrated objective lens switching module can realize the quick switching among various objective lenses, and further meets the requirements of detection resolution and field of view.
4. The workpiece platform system of the device can be compatible with the installation of different test sample wafers, and the position and the posture of the test sample wafer can be adjusted through the six-axis precision adjusting platform, so that the requirements of detection imaging and large-area splicing detection are met.
The invention has the beneficial effects that:
1. the device is based on a dark field imaging principle method, combines a high-power objective lens, automatic focusing and a high-resolution large-field CCD (charge coupled device), realizes detection of particle pollution on the surface of a sample wafer, and has resolution superior to 100 nm.
2. The illumination light source is integrated on the optical fiber head through processing such as beam expanding, collimating, reconcentrating and the like, and can adjust the illumination area, uniformity, intensity and the like. The optical fiber head is provided with an adjusting mechanism which can adjust the illumination angle and the defocusing distance.
3. The device can be used for quickly focusing sample wafers with different thicknesses or surface shapes and fluctuations through the integrated automatic focusing module, and can realize quick switching among various objective lenses through the integrated objective lens switching module, so that the requirements for detecting resolution and view fields are met.
4. The device is good in compatibility of the test sample wafer, and meanwhile, the position and the posture of the test sample wafer can be adjusted through the six-axis precise adjusting platform, so that the requirements for detection imaging and large-area splicing detection are met.
Drawings
FIG. 1 is an overall view of a high resolution particle detector according to the present invention;
FIG. 2 is a schematic diagram of a stage system of the high resolution particle detector of the present invention;
FIG. 3 is a block diagram of an imaging system of a high resolution particle detector of the present invention;
FIG. 4 is a diagram of an illumination system of a high resolution particle detector of the present invention;
FIG. 5 is a graph showing the detection results of a high-resolution particle detection apparatus according to the present invention, wherein FIG. 5(a) is the detection result of 100nm standard particles, and FIG. 5(b) is the detection result of 400nm standard particles;
reference numerals:
1 is a cage;
2 is a scaffold;
3 is a workpiece stage system;
3-1 is a six-axis adjusting platform;
3-2 is a wafer bearing platform;
3-3 is a test sample;
4 is an imaging system;
4-1 is an imaging frame;
4-2 is an autofocus module;
4-3 is an objective lens switching module;
4-4 is an imaging objective lens;
4-5 are CCD;
5 is a lighting system;
5-1 is an illumination X/Y axis displacement table;
5-2 is an illumination Z/RX/RY axis displacement stage;
5-3 is a lighting lens cone adjusting cylinder;
5-4 is an illumination lens barrel;
5-5 is an illumination lens group;
5-6 are lasers;
5-7 are optical fiber heads;
and 6 is a control system.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, a high-resolution particle detecting apparatus includes a shielding case 1 for shielding disturbance and contamination such as people and air; a bracket 2 for supporting and positioning and connecting the subsystems; the workpiece table system 3 is used for bearing a test sample wafer, adjusting the sample wafer to be coaxial with the imaging system, positioning a detection area and carrying out large-area detection stepping splicing; an imaging system 4 for objective switching, automatic focusing, detection imaging; an illumination system 5 for a particle detection illumination source; and the control system 6 is used for controlling the precise positioning of the workpiece table system, the switching of the objective lens, the automatic focusing and the image acquisition and processing. The isolation cover 1 isolates disturbance and pollution of personnel, air and the like, and ensures the cleanliness of a detection environment; the support 2 supports and positions and connects the subsystems, so that the stability of the whole device is ensured; the workpiece platform system 3 bears a test sample wafer on one hand, and positions a detection area by adjusting the sample wafer to be coaxial with the imaging system on the other hand, so that large-area stepping splicing detection is realized. The imaging system 4 ensures the fast switching of the imaging objective lens, realizes automatic focusing and displays the light scattering imaging image on the CCD; the lighting system 5 can adjust the lighting angle and position, and ensure the requirements of lighting area, uniformity, intensity and the like; the control system 6 ensures the precise positioning of the workpiece stage system, realizes the functions of objective lens switching and automatic focusing, and can collect and process images.
Referring to fig. 1, 2, 3 and 4, the basic flow of the sample particle detection is as follows: fixing a sample wafer 3-3 to be measured on the wafer bearing table 3-2, and adjusting the position and the posture of the sample wafer to be measured through the six-axis adjusting platform 3-1 so that the sample wafer to be measured and the imaging system 4 are in the same optical axis. And controlling the automatic focusing module 4-2 to realize automatic focusing, adjusting the illumination Z/RX/RY axis displacement table 5-2 to enable the illumination light source to irradiate on an automatic focusing focus, adjusting the illumination lens barrel adjusting cylinder 5-3 to enable the illumination light source to focus on the sample wafer to be detected, and observing the particle pollution condition of the sample wafer through the CCD 4-5. The sample wafer can be subjected to large-area stepping splicing detection by moving the six-axis adjusting platform 3-1.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto. Any person skilled in the art can appreciate that modifications and substitutions are included within the scope of the invention disclosed. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (1)

1. A high-resolution particle detection device is characterized in that: the device includes: an isolation cover (1) for isolating disturbance and pollution of personnel, air and the like; a bracket (2) for supporting and positioning the connected subsystems; the workpiece platform system (3) is used for bearing a test sample wafer, adjusting the sample wafer to be coaxial with the imaging system, positioning a detection area and carrying out large-area detection stepping splicing; an imaging system (4) for objective switching, auto focusing, detection imaging; an illumination system (5) for particle detection illumination; a control system (6) for controlling the precise positioning of the workpiece stage system, the switching of the objective lens and the automatic focusing, and the image acquisition and processing; wherein:
the workpiece platform system (3) comprises a six-axis adjusting platform (3-1), a wafer bearing platform (3-2) and a test sample wafer (3-3), wherein the test sample wafer (3-3) is placed on the wafer bearing platform (3-2), and the wafer bearing platform (3-2) is fixed on the six-axis adjusting platform (3-1). The six-axis adjusting platform (3-1) needs to meet the requirements of adjusting the position and the posture of the test sample wafer (3-3) so as to meet the requirements of detecting imaging and splicing and detecting the whole wafer, wherein the wafer bearing platform (3-2) needs to be compatible with the installation of different test sample wafers (3-3);
the imaging system (4) comprises an imaging lens frame (4-1), an automatic focusing module (4-2), an objective lens switching module (4-3), an imaging objective lens (4-4) and a CCD (4-5), wherein the CCD (4-5) is installed at the upper end of the imaging lens frame (4-1), the automatic focusing module (4-2) is installed at the lower end of the imaging lens frame (4-1), the objective lens switching module (4-3) is installed on the automatic focusing module (4-2), and the imaging objective lens (4-4) is installed on the objective lens switching module (4-3), wherein the automatic focusing module (4-2) can rapidly focus sample wafers with different thicknesses or surface undulations; the objective switching module (4-3) can realize the rapid switching among various objectives so as to meet the requirements of detection resolution and field of view, and each part of the imaging system (4) needs to be precisely installed to ensure the coaxiality of light paths;
the illumination system (5) comprises an illumination X/Y axis displacement table (5-1), an illumination Z/RX/RY axis displacement table (5-2), an illumination lens barrel adjusting cylinder (5-3), an illumination lens barrel (5-4), an illumination lens group (5-5), a laser (5-6) and a fiber head (5-7), wherein the illumination Z/RX/RY axis displacement table (5-2) is installed on the illumination X/Y axis displacement table (5-1), the illumination lens barrel adjusting cylinder (5-3) is installed on the illumination Z/RX/RY axis displacement table (5-2), the illumination lens barrel (5-4) is installed on the illumination lens barrel adjusting cylinder (5-3), and the illumination lens group (5-5) is installed on the illumination lens barrel (5-4), the optical fiber head (5-7) is arranged on the lighting lens barrel (5-4), the laser (5-6) is connected with the optical fiber head (5-7) through an optical fiber, wherein the optical fiber head (5-7) has the functions of beam expanding, collimation and the like; the X/Y axis displacement table (5-1) and the illumination Z/RX/RY axis displacement table (5-2) can adjust the angle and the position of illumination; the lighting lens cone adjusting cylinder (5-3) can adjust the focus of the lighting lens group (5-5).
CN202010150475.4A 2020-03-03 2020-03-03 High-resolution particle detection device Active CN111272771B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010150475.4A CN111272771B (en) 2020-03-03 2020-03-03 High-resolution particle detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010150475.4A CN111272771B (en) 2020-03-03 2020-03-03 High-resolution particle detection device

Publications (2)

Publication Number Publication Date
CN111272771A true CN111272771A (en) 2020-06-12
CN111272771B CN111272771B (en) 2023-03-31

Family

ID=70997515

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010150475.4A Active CN111272771B (en) 2020-03-03 2020-03-03 High-resolution particle detection device

Country Status (1)

Country Link
CN (1) CN111272771B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1628153A2 (en) * 2004-08-20 2006-02-22 Nikon Corporation Automatic focus detection device and microscope system having the same
CN102636496A (en) * 2012-04-24 2012-08-15 浙江大学 Defect width calibration standardizing system and method in optical surface defect dark field detection
CA2775506A1 (en) * 2011-04-29 2012-10-29 ProteinSimple Method and particle analyzer for determining a broad particle size distribution
CN105928949A (en) * 2016-04-18 2016-09-07 中国科学院自动化研究所 Device and method for online monitoring particles on surface of optical elements
CN106547173A (en) * 2016-12-08 2017-03-29 中国科学院光电技术研究所 It is a kind of based on chirp grating gap detection with control super resolution lithography device
CN106707484A (en) * 2016-12-16 2017-05-24 上海理工大学 Super-resolution optical microscopic imaging method based on particle scattered light near-field lighting
CN108089409A (en) * 2017-12-15 2018-05-29 中国科学院光电技术研究所 A kind of large area super resolution lithography device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1628153A2 (en) * 2004-08-20 2006-02-22 Nikon Corporation Automatic focus detection device and microscope system having the same
CA2775506A1 (en) * 2011-04-29 2012-10-29 ProteinSimple Method and particle analyzer for determining a broad particle size distribution
CN102636496A (en) * 2012-04-24 2012-08-15 浙江大学 Defect width calibration standardizing system and method in optical surface defect dark field detection
CN105928949A (en) * 2016-04-18 2016-09-07 中国科学院自动化研究所 Device and method for online monitoring particles on surface of optical elements
CN106547173A (en) * 2016-12-08 2017-03-29 中国科学院光电技术研究所 It is a kind of based on chirp grating gap detection with control super resolution lithography device
CN106707484A (en) * 2016-12-16 2017-05-24 上海理工大学 Super-resolution optical microscopic imaging method based on particle scattered light near-field lighting
CN108089409A (en) * 2017-12-15 2018-05-29 中国科学院光电技术研究所 A kind of large area super resolution lithography device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
尹朝阳等: "大口径反射镜表面颗粒污染物暗场检测算法研究", 《光学学报》 *

Also Published As

Publication number Publication date
CN111272771B (en) 2023-03-31

Similar Documents

Publication Publication Date Title
CN110006905B (en) Large-caliber ultra-clean smooth surface defect detection device combined with linear area array camera
US7982950B2 (en) Measuring system for structures on a substrate for semiconductor manufacture
JP2008529065A (en) Tracking autofocus system
CN108717062A (en) A kind of the details in a play not acted out on stage, but told through dialogues defect detecting device and its measurement method of heavy caliber ultra-precision surface
US11959821B2 (en) Comprehensive test platform for fluorescence microscope objective lenses
KR19990064058A (en) 3D defect localization method in transparent structure.
KR20070039604A (en) Large substrate flat panel inspection system
CN106772923B (en) Automatic focusing method and system based on inclined slit
CN209992407U (en) Large-caliber ultra-clean smooth surface defect detection device combined with linear array camera
KR20050107502A (en) Microscope and sample observing method
CN110018153B (en) Full-automatic scanning, positioning and quantitative analysis system for global components of large-scale samples
JPH0365623A (en) Method and apparatus for measuring distribution of illuminance on entrance pupil
CN105203503A (en) Surface detection method for super-smooth optical substrate for high-power laser thin film element
KR100532238B1 (en) Thin film inspection method, apparatus and inspection system used therein
JP2016189335A (en) Specimen observation method and device
CN102169076B (en) Device and method for detecting rich-Te phase in telluride semiconductor crystal
CN111272771B (en) High-resolution particle detection device
CN108152294A (en) A kind of ultra-smooth eyeglass flaw inspection devices and methods therefor
WO2024051008A1 (en) System and method for ultrafast and large-size scanning
CN115527881A (en) Wafer-level bonding quality detection device
KR102672568B1 (en) Mask posture monitoring method, device, and mask particle size detection equipment
CN113484326A (en) Integrated laser damage surface observation system
JP2004535601A (en) Configuration of microscope objective lens
CN210401255U (en) Machine vision high-resolution coaxial light illumination inspection device
CN220542806U (en) Wafer integrated detection device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant