CN111269666B - Preparation method of infrared laser protective film - Google Patents
Preparation method of infrared laser protective film Download PDFInfo
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- CN111269666B CN111269666B CN202010058237.0A CN202010058237A CN111269666B CN 111269666 B CN111269666 B CN 111269666B CN 202010058237 A CN202010058237 A CN 202010058237A CN 111269666 B CN111269666 B CN 111269666B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K3/2279—Oxides; Hydroxides of metals of antimony
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2431/00—Presence of polyvinyl acetate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Abstract
The invention discloses a preparation method of an infrared laser protective film, which comprises the following steps: (1) coating an adhesive on the substrate layer to form an adhesive layer; (2) firstly, the mass ratio is 1: 1: 1, uniformly mixing antimony oxide, indium oxide and a carbon nanotube, dispersing the mixture into a polyethylene terephthalate material to obtain a master batch, and extruding the master batch onto an adhesive layer through an extruder with a grating type die head to form an infrared laser grating processing layer with grating intervals; (3) arranging a protective layer on the infrared laser grating processing layer; (4) and coating an adhesive on the protective layer to form an installation adhesive layer, and then adhering a stripping layer on the installation adhesive layer to obtain the infrared laser protective film. The preparation method is simple, and the prepared product can effectively prevent information leakage.
Description
Technical Field
The invention relates to the technical field of information safety, in particular to a preparation method of an infrared laser protective film.
Background
With the development of laser technology, infrared laser eavesdropping becomes one of important leakage sources of information leakage, and the acquisition of infrared laser eavesdropping information is a relatively novel field, so that the protection means is relatively less.
At present, in order to effectively prevent information leakage, people eavesdrop on infrared laser, the following two eavesdrop prevention technologies are provided:
1. an optical interference technology, such as a laser monitoring and detecting device in the prior art with publication number CN204287480U, has a technical scheme as follows: the monitoring device comprises an illuminating assembly used for illuminating a target area and an imaging assembly used for collecting image information of the target area, wherein the imaging assembly is connected with a video processing assembly, and the video processing assembly stores and processes the image information input by the imaging assembly so as to realize detection of the monitoring device. The technology can realize the protection of information. However, in practical application, ambient light, the complexity of the environment, the intensity of the laser reflected by the equipment, the signal-to-noise ratio of the receiving system and the like all affect the detection structure, and meanwhile, the method has timeliness, and a suspicious target can be found only when the eavesdropping equipment is aiming at work. Therefore, there is a risk of false alarm and false alarm.
2. The technology of vibration interference is that the vibration interference technology,
for example, the prior art with publication number CN104125033A discloses a laser eavesdropping prevention jammer with a self-charging function, which comprises a main body, a fixing part arranged at the bottom of the main body, a solar charging part arranged on the surface layer of the main body, and a control chip arranged in the main body; the fixing part is used for fixing the laser eavesdropping interference preventing device, and the solar charging part can convert solar energy into electric energy to provide the electric energy for the laser eavesdropping interference device. This technique involves cutting a vibration disruptor into the glass to affect eavesdropping of the laser signal. However, the diffuse reflection laser eavesdropping is irrelevant to the vibration of the glass, so that the working significance of the glass is lost, and the information leakage cannot be effectively prevented.
Therefore, as the importance of information security is increased, it is more and more important to develop new information leakage prevention technologies.
Disclosure of Invention
The invention aims to overcome the problems in the prior art and provides a preparation method of an infrared laser protective film, which is simple and can effectively prevent information leakage.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a preparation method of an infrared laser protective film is characterized by comprising the following steps:
(1) coating an adhesive on the substrate layer to form an adhesive layer;
(2) firstly, the mass ratio is 1: 1: 1, uniformly mixing antimony oxide, indium oxide and a carbon nanotube, dispersing the mixture into a polyethylene terephthalate material to obtain a master batch, and extruding the master batch onto an adhesive layer through an extruder with a grating type die head to form an infrared laser grating processing layer with grating intervals;
(3) the protective layer is arranged on the infrared laser grating treatment layer and is prepared by firstly preparing propylene glycol methyl ether acetate, dimethylbenzene and n-butyl alcohol according to the weight ratio of 8: 1: 1 as coating liquid to carry out tape casting film formation after being uniformly mixed according to the mass ratio, and then heating to volatilize xylene and n-butanol so as to form a propylene glycol monomethyl ether acetate protective layer;
(4) and coating an adhesive on the protective layer to form an installation adhesive layer, and then adhering a stripping layer on the installation adhesive layer to obtain the infrared laser protective film.
The particle diameter of the antimony oxide is 10-100 nm, the particle diameter of the indium oxide is 10-100 nm, and the particle diameter of the carbon nano-tube is 10-100 nm.
The mass ratio of the mixture to the polyethylene terephthalate material is 5: 1.
and before the master batch enters the extruder, heating and melting the master batch, extruding the master batch from a grating type die head through a filter, and solidifying the master batch to obtain the infrared laser grating processing layer with the grating interval.
The thickness of the infrared laser grating processing layer is 10-70 μm, and the interval between every two gratings is 5-30 μm.
The substrate layer is a low-density polyethylene film, and the thickness of the substrate layer is 10-70 mu m.
The adhesive layer and the mounting adhesive layer are both polyvinyl acetate adhesive, and the thickness of the mounting adhesive layer is 5-20 mu m.
The thickness of the protective layer is 10-70 μm, and the protective layer exceeds the periphery of the grating by 10-30 μm.
The peeling layer is made of polycarbonate resin, and the thickness of the peeling layer is 15-25 mu m.
The thickness of the infrared laser protective film is 150-250 mu m.
The invention has the advantages that:
1. the protective film prepared by the invention comprises a substrate layer, an adhesive layer, an infrared laser grating treatment layer, a protective layer, a mounting adhesive layer and a stripping layer, and the layered structures are mainly prepared by bonding and fixing, so that the whole preparation method is simple and reliable, and the preparation of the protective film can be rapidly completed in batches. The infrared laser grating processing layer can be stably fixed on the substrate layer through the adhesive layer. The protective layer is coated on the infrared laser grating processing layer, so that the protective layer can fill the area between the gratings, and the stability of the infrared laser grating processing layer is improved; correspondingly, not only can provide the protection to the infrared laser grating processing layer through the protective layer, can also fix the infrared laser grating processing layer on the stratum basale steadily. The protective film can be quickly mounted on the substrate through the mounting adhesive layer and the stripping layer. Can effectively prevent through infrared laser grating processing layer that information from revealing, specifically, the component that plays a role in the infrared laser grating processing layer is mainly for the mass ratio is 1: 1: the antimony oxide, the indium oxide and the carbon nano-tube of the light-emitting diode device 1 can respectively absorb lasers in three different wave bands, wherein the indium oxide can effectively absorb the lasers in the 900-1600 nm wave band, the antimony oxide can effectively absorb the lasers in the 1600-2000 nm wave band, the carbon nano-tube has the function of absorbing the lights with different wavelengths, and in addition, the depth of the color of a protective film can be adjusted, so that the infrared lasers can be effectively absorbed by matching the three specific components according to a specific proportion, and the purpose of preventing information leakage is achieved. Further, the principle of preventing information leakage is as follows: when infrared laser irradiates the protective film, the infrared laser grating processing layer can absorb part of the infrared laser, and the other part of the laser penetrates through the grating formed by the infrared laser grating processing layer to form a diffraction effect, so that the light spot of the laser is rapidly enlarged before the laser irradiates an object, the intensity of the returned infrared laser signal is reduced in a multiplied mode, and the purpose of preventing information leakage is achieved. Meanwhile, the protective film can be prevented from being damaged due to high energy, and the laser damage threshold of the protective film is also improved. And the polyethylene glycol terephthalate material enables the infrared laser grating processing layer to have good mechanical properties, and is beneficial to improving the shock resistance and the bending property of the infrared laser grating processing layer. In summary, the invention has the advantages of simple and reliable preparation method, convenient installation and the like, and the prepared protective film can effectively cut off the infrared laser, thereby effectively shielding the invading near-infrared laser and achieving the purpose of effectively preventing leakage.
2. The particle diameter of antimony oxide is 10-100 nm, the particle diameter of indium oxide is 10-100 nm, and the particle diameter of carbon nanotube is 10-100 nm. The three components respectively adopt specific particle diameters, so that high transmittance is guaranteed, the realization is relatively easy, and meanwhile, light of different wave bands can be effectively absorbed.
3. The mass ratio of the mixture to the polyethylene terephthalate material in the invention is 5: 1, the specific proportion is favorable for forming three nano materials of antimony oxide, indium oxide and carbon nanotubes into a laminated structure on the substrate layer.
4. Before entering the extruder, the master batch is heated and melted, then extruded from the grating type die head through the filter, and solidified to obtain the infrared laser grating processing layer with the grating interval. By adopting the process, the infrared laser grating processing layer with uniform grating intervals can be obtained, and the product quality protection effect can be improved.
5. The thickness of the infrared laser grating processing layer is set to be 10-70 μm, and the interval between every two gratings is set to be 5-30 μm. Adopt this specific setting, guaranteed better transmittance on the one hand, another convenience can not lead to the processing degree of difficulty to promote.
6. The invention adopts the low-density polyethylene film with the thickness of 10-70 mu m as the substrate layer, and the low-density polyethylene film has better chemical stability, heat sealing property, water resistance, moisture resistance and high and low temperature resistance in a wider temperature range, so the performance requirement of the infrared laser grating treatment layer on the substrate can be met.
7. The adhesive layer and the mounting adhesive layer adopt polyvinyl acetate adhesive, and the thickness of the mounting adhesive layer is 5-20 mu m. The advantages are that the layered structures can be stably fixed together, and the whole protective film can be stably fixed on the substrate when in use.
8. The thickness of the protective layer is 10-70 μm, and the protective layer exceeds the periphery of the grating by 10-30 μm. The advantage of this particular arrangement is that better protection of the ir laser grating treatment layer can be provided.
9. The invention adopts polycarbonate resin to make a stripping layer, and the thickness of the stripping layer is set to be 15-25 μm. Has the advantage of easy stripping.
10. The thickness of the infrared laser protective film is 150-250 μm, and the thickness of the whole protective film is thin, so that the sight line is not influenced, information leakage can be effectively prevented, and the infrared laser protective film has the advantage of low production cost.
Drawings
FIG. 1 is a schematic structural view of an infrared laser protective film according to the present invention;
FIG. 2 is a schematic structural view of the infrared laser protective film window of the present invention during operation;
FIG. 3 is a schematic structural view of an infrared laser protective film according to the present invention under irradiation of infrared laser;
FIG. 4 is a schematic diagram showing the size of diffraction spots formed by the infrared laser protective film during infrared laser irradiation according to the present invention;
labeled as: 1. the device comprises a base layer, 2, an adhesive layer, 3, an infrared laser grating processing layer, 4, a protective layer, 5, a mounting adhesive layer, 6 and a stripping layer.
Detailed Description
Example 1
The embodiment discloses a preparation method of an infrared laser protective film, which comprises the following steps:
(1) an adhesive is applied to the base layer 1 to form an adhesive layer 2.
(2) Firstly, the mass ratio is 1: 1: 1, dispersing the mixture into a polyethylene terephthalate material to obtain a master batch, and extruding the master batch onto an adhesive layer 2 through an extruder with a grating type die head to form an infrared laser grating processing layer 3 with grating intervals. Specifically, the master batch is heated and melted before entering the extruder, and then is extruded from the grating type die head through the filter, and the infrared laser grating processing layer 3 with the grating interval is obtained after solidification.
(3) And arranging a protective layer 4 on the infrared laser grating processing layer 3, wherein the protective layer 4 is prepared by propylene glycol methyl ether acetate, dimethylbenzene and n-butyl alcohol according to the weight ratio of 8: 1: 1 as coating liquid to form a film by tape casting.
(4) The infrared laser protective film shown in fig. 1 is obtained by coating an adhesive on the protective layer 4 to form a mounting adhesive layer 5, and then adhering a peeling layer 6 on the mounting adhesive layer 5.
In this embodiment, the type of the adhesive in the step (1) is not particularly limited, and the ir laser grating treatment layer 3 and the substrate layer 1 may be firmly adhered to each other so that they do not fall off. The type of the binder in step (4) is not particularly limited, and the protective layer 4 and the release layer 6 may be firmly adhered to each other so that they do not fall off. The material of the release layer 6 is not particularly limited, and a material having excellent mechanical properties known to those skilled in the art may be used.
In this embodiment, the grating-type die is a conventional die, and the specific structure thereof is similar to the structure of the protective layer 4 shown in fig. 1.
Example 2
The embodiment discloses a preparation method of an infrared laser protective film, which comprises the following steps:
(1) a low-density polyethylene film is used as a substrate layer 1, and an adhesive is coated on the substrate layer 1 to form an adhesive layer 2. The thickness of the base layer 1 is 10 to 70 μm, and the thickness of the base layer 1 is preferably 40 to 50 μm. The adhesive used for the adhesive layer 2 is preferably polyvinyl acetate adhesive.
(2) Firstly, the mass ratio is 1: 1: 1, dispersing the mixture into a polyethylene terephthalate material to obtain a master batch, and extruding the master batch onto an adhesive layer 2 through an extruder with a grating type die head to form an infrared laser grating processing layer 3 with grating intervals. Specifically, the master batch is heated and melted before entering the extruder, and then is extruded from the grating type die head through the filter, and the infrared laser grating processing layer 3 with the grating interval is obtained after solidification.
In the step, the particle diameter of the antimony oxide is 10-100 nm, the particle diameter of the indium oxide is 10-100 nm, and the particle diameter of the carbon nanotube is 10-100 nm. Specifically, it is preferable that the particle diameters of antimony oxide, indium oxide and carbon nanotubes are all 45 to 55 nm. The mass ratio of the mixture to the polyethylene terephthalate material is 5: 1.
in this step, the thickness of the infrared laser grating processing layer 3 is 10 to 70 μm, and the interval between each two gratings is 5 to 30 μm. Specifically, the thickness of the infrared laser grating treatment layer 3 is preferably 40 to 50 μm, and the interval between each grating is preferably 10 μm. As shown in fig. 1, the interval of the oblique stripes between two vertical blank strip portions in the ir laser grating processing layer 3 is the grating interval.
(3) A protective layer 4 is arranged on the infrared laser grating processing layer 3, and the protective layer 4 is prepared by firstly mixing propylene glycol methyl ether acetate, dimethylbenzene and n-butyl alcohol according to the weight ratio of 8: 1: 1 as coating liquid to carry out tape casting film formation, and heating to volatilize xylene and n-butanol so as to form a propylene glycol monomethyl ether acetate protective layer 4.
In this step, the thickness of the protective layer 4 is 10-70 μm, and the protective layer 4 exceeds the top end of the grating by 10-30 μm. Preferably, the thickness of the protective layer 4 is 30-40 μm and the protective layer 4 extends 10-20 μm beyond the grating tip.
(4) Firstly, coating an adhesive on the protective layer 4 to form an installation adhesive layer 5, wherein the adhesive adopted by the installation adhesive layer 5 is preferably a polyvinyl acetate adhesive, and the thickness of the installation adhesive layer 5 is 5-20 mu m; after the installation adhesive layer 5 is coated, a stripping layer 6 made of polycarbonate resin is bonded on the installation adhesive layer 5, and the thickness of the stripping layer 6 is 15-25 mu m; after the bonding is completed, the infrared laser protective film shown in figure 1 is obtained.
In this embodiment, the thickness of the infrared laser protection film is 150 to 250 μm, and preferably 180 to 220 μm.
The specific implementation principle of this embodiment is as follows:
as shown in fig. 2, the pellicle is adhered to the glass via the adhesive layer, when the infrared laser beam is irradiated to the glass window, a part of the infrared laser beam (the part of the infrared laser beam is about 50% if it is direct, and may be more if it is oblique) is absorbed by the ir laser grating processing layer 3 in the pellicle, and the other part of the infrared laser beam is transmitted through the grating in the ir laser grating processing layer 3, so as to form a diffraction effect, and the light spot of the infrared laser beam is rapidly enlarged before it is irradiated to the object, thereby the intensity of the infrared laser beam returned to the detector is reduced by several times. As shown in fig. 3, when the eavesdropping laser beam is a monochromatic parallel beam, the eavesdropping laser beam diffracts to generate an interference result. After the coherent waves meet at a certain place in space, the coherent waves interfere with each other due to different phases, and physical phenomena of mutual reinforcement or mutual weakening are caused. The result of the diffraction is a pattern of alternating light and dark diffraction patterns, representing the direction (angle) and intensity of the diffraction, as shown in fig. 4.
According to the Fresnel diffraction formula, the central bright line width Δ x0Comprises the following steps:
where f is the distance from the fringes to the screen and λ is the wavelength.
Since the distance from the object to the glass is common during eavesdroppingMore than 2 meters, infrared wavelength is assumed to be 1um, and the width of the grating is 10um, so that the width delta x of the central bright fringe light spot can be obtained0Approximately 0.4 meters.
Meanwhile, for infrared laser eavesdropping, the size relationship of speckles has the following formula:
in the formula, b is the average size of speckles, d is the size of laser beam spots, lambda is the laser wavelength, and z is the detection distance. According to the design of an optical system for detecting voice information by optical heterodyne, laser reaches the surface of an object to be detected through a transmitting-receiving integrated optical antenna and then is scattered through the surface of the object. The relationship between the light intensity I of the returned detection information system and the system structure parameter is as follows:
in the formula, D is the diameter of the receiving lens, k is a constant, I0 is the emergent light intensity of laser irradiated on an object, D is the spot size of scattered laser, and R is the working distance.
When the scattering laser spot is larger, the received light intensity signal is smaller, when the protective film is not used, the laser spot is about 1mm, and after the protective film is used, the size of the laser spot is 0.4 m, and the energy difference is hundreds of times. Meanwhile, when the laser needs to pass through the protective film, the protective film can absorb the laser, and if the absorption rate is considered to be 90%, the whole eavesdropping acting distance is reduced by 3-4 orders of magnitude, so that the information leakage probability is greatly reduced.
Example 3
The present embodiment verifies the technical solutions described in embodiments 1 and 2, and specifically includes the following steps:
the method comprises the steps of actually eavesdropping the indoor area without the protective film and the indoor area with the protective film disclosed in embodiment 1 or embodiment 2 by using infrared laser, wherein the emitted infrared laser has the intensity of 10mw, a lens with the diameter of 100mm is adopted at the position of 100m for receiving, the intensity of return light is 1nw when the protective film is not pasted, voice information of object vibration caused by speaking can be clearly restored, the return light is 10pw at the distance of 1m after the protective film is pasted, and sound information cannot be restored due to too weak signals. Therefore, the information leakage prevention effect is very good, and the information leakage can be effectively prevented.
While the invention has been described with reference to specific embodiments, any feature disclosed in this specification may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise; all of the disclosed features, or all of the method or process steps, may be combined in any combination, except mutually exclusive features and/or steps.
Claims (10)
1. A preparation method of an infrared laser protective film is characterized by comprising the following steps:
(1) coating an adhesive on the substrate layer (1) to form an adhesive layer (2);
(2) firstly, the mass ratio is 1: 1: 1, uniformly mixing antimony oxide, indium oxide and carbon nanotubes, dispersing the mixture into a polyethylene terephthalate material to obtain a master batch, and extruding the master batch onto an adhesive layer (2) through an extruder with a grating type die head to form an infrared laser grating processing layer (3) with grating intervals;
(3) set up protective layer (4) on infrared laser grating processing layer (3), protective layer (4) are earlier by propylene glycol methyl ether acetate, xylol and n-butanol according to 8: 1: 1 as coating liquid to carry out tape casting film formation after being uniformly mixed according to the mass ratio, and then heating to volatilize xylene and n-butanol so as to form a propylene glycol monomethyl ether acetate protective layer (4);
(4) and coating an adhesive on the protective layer (4) to form an installation adhesive layer (5), and then adhering a stripping layer (6) on the installation adhesive layer (5) to obtain the infrared laser protective film.
2. The method for preparing an infrared laser protective film according to claim 1, wherein the method comprises the following steps: the particle diameter of the antimony oxide is 10-100 nm, the particle diameter of the indium oxide is 10-100 nm, and the particle diameter of the carbon nano-tube is 10-100 nm.
3. The method for preparing an infrared laser protective film according to claim 1, wherein the method comprises the following steps: the mass ratio of the mixture to the polyethylene terephthalate material is 5: 1.
4. the method for preparing an infrared laser protective film according to claim 1, wherein the method comprises the following steps: and before the master batch enters the extruder, heating and melting the master batch, extruding the master batch from a grating type die head through a filter, and solidifying the master batch to obtain the infrared laser grating processing layer (3) with grating intervals.
5. The method for preparing an infrared laser protective film according to claim 1, wherein the method comprises the following steps: the thickness of the infrared laser grating processing layer (3) is 10-70 μm, and the interval between every two gratings is 5-30 μm.
6. The method for preparing an infrared laser protective film according to claim 1, wherein the method comprises the following steps: the substrate layer (1) is a low-density polyethylene film, and the thickness of the substrate layer (1) is 10-70 mu m.
7. The method for preparing an infrared laser protective film according to claim 1, wherein the method comprises the following steps: the adhesive layer (2) and the mounting adhesive layer (5) are both polyvinyl acetate adhesive, and the thickness of the mounting adhesive layer (5) is 5-20 mu m.
8. The method for preparing an infrared laser protective film according to claim 1, wherein the method comprises the following steps: the thickness of the protective layer (4) is 10-70 μm, and the protective layer (4) exceeds the periphery of the grating by 10-30 μm.
9. The method for preparing an infrared laser protective film according to claim 1, wherein the method comprises the following steps: the peeling layer (6) is made of polycarbonate resin, and the thickness of the peeling layer (6) is 15-25 mu m.
10. The method for producing an infrared laser protective film according to any one of claims 1 to 9, wherein: the thickness of the infrared laser protective film is 150-250 mu m.
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