CN111269637A - Grounding grid anticorrosive conductive coating and preparation method thereof - Google Patents
Grounding grid anticorrosive conductive coating and preparation method thereof Download PDFInfo
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- CN111269637A CN111269637A CN202010336187.8A CN202010336187A CN111269637A CN 111269637 A CN111269637 A CN 111269637A CN 202010336187 A CN202010336187 A CN 202010336187A CN 111269637 A CN111269637 A CN 111269637A
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- 238000000576 coating method Methods 0.000 title claims abstract description 37
- 239000011248 coating agent Substances 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 239000000843 powder Substances 0.000 claims abstract description 18
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910000897 Babbitt (metal) Inorganic materials 0.000 claims abstract description 10
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 28
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 239000002904 solvent Substances 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 14
- 239000002270 dispersing agent Substances 0.000 claims description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 8
- 239000000440 bentonite Substances 0.000 claims description 8
- 229910000278 bentonite Inorganic materials 0.000 claims description 8
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052681 coesite Inorganic materials 0.000 claims description 8
- 229910052906 cristobalite Inorganic materials 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052682 stishovite Inorganic materials 0.000 claims description 8
- 229910052905 tridymite Inorganic materials 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 6
- 238000000498 ball milling Methods 0.000 claims description 6
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 239000012745 toughening agent Substances 0.000 claims description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 5
- -1 phenolic amine Chemical class 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- CIRMGZKUSBCWRL-LHLOQNFPSA-N (e)-10-[2-(7-carboxyheptyl)-5,6-dihexylcyclohex-3-en-1-yl]dec-9-enoic acid Chemical compound CCCCCCC1C=CC(CCCCCCCC(O)=O)C(\C=C\CCCCCCCC(O)=O)C1CCCCCC CIRMGZKUSBCWRL-LHLOQNFPSA-N 0.000 claims description 3
- JOLVYUIAMRUBRK-UHFFFAOYSA-N 11',12',14',15'-Tetradehydro(Z,Z-)-3-(8-Pentadecenyl)phenol Natural products OC1=CC=CC(CCCCCCCC=CCC=CCC=C)=C1 JOLVYUIAMRUBRK-UHFFFAOYSA-N 0.000 claims description 3
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 claims description 3
- YLKVIMNNMLKUGJ-UHFFFAOYSA-N 3-Delta8-pentadecenylphenol Natural products CCCCCCC=CCCCCCCCC1=CC=CC(O)=C1 YLKVIMNNMLKUGJ-UHFFFAOYSA-N 0.000 claims description 3
- JOLVYUIAMRUBRK-UTOQUPLUSA-N Cardanol Chemical compound OC1=CC=CC(CCCCCCC\C=C/C\C=C/CC=C)=C1 JOLVYUIAMRUBRK-UTOQUPLUSA-N 0.000 claims description 3
- FAYVLNWNMNHXGA-UHFFFAOYSA-N Cardanoldiene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1 FAYVLNWNMNHXGA-UHFFFAOYSA-N 0.000 claims description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 3
- 150000001408 amides Chemical group 0.000 claims description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 3
- PTFIPECGHSYQNR-UHFFFAOYSA-N cardanol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 2
- 239000012046 mixed solvent Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 7
- 238000005260 corrosion Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 239000011231 conductive filler Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229910021389 graphene Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
- C09D5/10—Anti-corrosive paints containing metal dust
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
- C09D5/10—Anti-corrosive paints containing metal dust
- C09D5/106—Anti-corrosive paints containing metal dust containing Zn
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0893—Zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Paints Or Removers (AREA)
Abstract
The invention relates to an anticorrosion conductive coating for a grounding grid and a preparation method thereof. The zinc powder has the anticorrosion effect and the electric conduction effect of the sacrificial anode on the base material; the Babbitt metal powder has good electric conductivity and low melting point performance, and can be melted to tightly connect the coatings together without falling off when being impacted by large current. The invention has excellent adhesive force, flexibility and conductivity, especially keeps good corrosion resistance and conductivity after being impacted by large current, and is an excellent corrosion-resistant conductive coating for the grounding grid.
Description
Technical Field
The invention relates to an anticorrosive conductive coating for a grounding grid, in particular to an anticorrosive conductive coating for a grounding grid and a preparation method thereof, and belongs to the technical field of coatings.
Background
A large number of (extra) high-voltage transformer substations need to be built in the power industry of China, a large number of grounding grid equipment is needed to be matched with the transformer substations, grounding grid materials need to have good conductivity and corrosion resistance, and at present, the grounding materials at home and abroad comprise carbon steel, pure copper, galvanized steel, zinc-coated steel, copper-clad steel and conductive coating steel (such as ferrite coatings, carbon nanotube coatings and the like). The conductive substrate of the materials is still metal, so that the conductivity meets the current requirement, but on one hand, the outer layer of the materials is still metal and is still grounded, so that the materials cannot be influenced by electrochemical corrosion, and the application occasions are limited; the ferrite coating and the carbon nanotube coating grounding material are cracked quickly due to high temperature under short-circuit current, and cannot restore the original appearance, so that the requirements cannot be met at present.
Through patent search, the following results are found: patent CN201911102730.1 describes a grounding grid anticorrosive conductive coating using graphene and carbon nanotubes as conductive fillers and polyurethane modified epoxy resin as a film forming substance; in patent CN201910985325.2, graphene oxide, p-phenylenediamine and acidified multi-walled carbon nanotubes are used as conductive fillers, and epoxy resin is used as a film-forming substance to prepare a conductive coating; in patent CN201810381954.X, expanded graphite, ZAO slurry, carbon black N220 and the like are used as conductive fillers to prepare the geonet conductive coating. Although these conductive anticorrosive coatings have good performance, the problem of coating chapping caused by high temperature under short circuit current is not solved.
The invention takes zinc powder and low-melting-point Babbitt alloy powder as conductive fillers, takes epoxy resin with strong adhesive force as a film forming substance, and prepares the conductive anticorrosive paint after adding other additives. On one hand, the zinc powder has the anticorrosion effect and the conductive effect of a sacrificial anode on a grounding grid substrate, and has good anticorrosion performance before being impacted by large current; on the other hand, the babbit alloy powder has good conductivity and low melting point performance, once being impacted by large current, the babbit alloy powder can be melted when the temperature rises, and the coatings are tightly connected together, so that the coatings are not cracked and fall off, and meanwhile, a more excellent conductive path is formed, and the babbit alloy powder can bear multiple times of short circuit current impact. The corrosion resistance and the protection time of the coating are greatly enhanced.
Disclosure of Invention
The invention aims to provide an anticorrosive conductive coating for a grounding grid and a preparation method thereof.
In order to achieve the purpose, the invention adopts the technical scheme that: an anticorrosion conductive coating for a grounding grid is characterized by comprising the following components:
100 parts of epoxy resin;
30-110 parts of a curing agent;
50-200 parts of a solvent;
250 portions and 600 portions of zinc powder;
50-250 parts of Babbitt metal powder;
10-20 parts of a filler;
3-6 parts of a toughening agent;
5601-3 parts of silane coupling agent KH;
gas phase SiO22-4 parts;
4-8 parts of organic bentonite;
3-6 parts of a dispersing agent;
and 2-4 parts of a leveling agent.
The epoxy resin is bisphenol A E20, E44 and E51; bisphenol F type epoxy resin with epoxy value of 0.18-0.22, 0.42-0.48 and 0.55-0.62;
the curing agent is an amide curing agent, an aliphatic amine curing agent and a phenolic amine curing agent, and the amine value ranges from 180-400 mgKOH/g;
the solvent is a mixed solvent of xylene and n-butanol in a volume ratio of 7: 3;
moreover, the Babbitt alloy powder has a melting point of 100-300 ℃ and a particle size of 150-325 meshes;
the filler is one or a combination of more of titanium dioxide, lithopone, talcum powder and the like;
the toughening agent is one or a combination of more of dibutyl phthalate, dioctyl phthalate, epoxidized cardanol, polypropylene glycol diglycidyl ether, linoleic acid dimer diglycidyl ether and the like;
the dispersant is a polyurethane dispersant;
the leveling agent is a fluorocarbon leveling agent;
in addition, the preparation method of the anticorrosive conductive coating for the grounding grid comprises the following steps:
(1) dissolving 100 parts of epoxy resin into 50-200 parts of solvent, and adding 2-4 parts of gas-phase SiO24-8 parts of organic bentonite, and stirring for 10min at 3000 r/min; adding zinc powder of 250-600 parts, babbit powder of 50-250 parts, filler of 10-20 parts, toughening agent of 3-6 parts, silane coupling agent KH 5601-3 parts, dispersant of 3-6 parts and flatting agent of 2-4 parts, and ball milling for 1-3h in a ball mill to obtain component A;
(2) mixing 30-110 parts of curing agent and 30-50 parts of solvent, and uniformly stirring to obtain a component B;
(3) the component A and the component B are uniformly mixed according to the proportion and then coated.
The invention has the advantages that:
the paint prepared by using zinc powder and babbitt metal powder as conductive fillers and epoxy resin as a film forming substance has good corrosion resistance, adhesion, conductivity and performance of bearing multiple short circuit current impacts, the resistivity of the coating is less than 0.36 omega cm, the adhesion is level 1, the coating does not fall off after the short circuit current impacts, the adhesion is level 1, and the resistivity of the coating is less than 0.15 omega cm.
Detailed Description
The present invention will be further illustrated in detail with reference to the following examples, but the present invention is not limited to the following examples. Any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present disclosure, and all such changes or substitutions are included in the scope of the present disclosure.
Example 1:
(1) dissolving 100g of E44 epoxy resin in 50g of solvent, adding 2g of gas phase SiO24g of organic bentonite, and stirring for 10min at 3000 r/min; then adding 250g of zinc powder, 50g of babbit powder and titanium dioxide1g of powder, 3g of dibutyl phthalate, 3g of silane coupling agent KH 5601 g, 3g of dispersing agent and 2g of flatting agent, and performing ball milling in a ball mill for 1 hour to obtain a component A; (2) 100g of polyamide curing agent with the amine value of 180-220 mgKOH/g is mixed with 50g of solvent and stirred evenly to obtain a component B; (3) adding the component B into the component A, stirring uniformly and coating. The performance was tested after 7 days of room temperature cure.
Example 2:
(1) dissolving 100g of E20 epoxy resin in 200g of solvent, adding 4g of gas phase SiO28g of organic bentonite, and stirring for 10min at 3000 r/min; then adding 600g of zinc powder, 250g of babbitt metal powder, 20g of talcum powder, 6g of linoleic acid dimer diglycidyl ether, KH 5603 g of silane coupling agent, 6g of dispersing agent and 4g of flatting agent, and carrying out ball milling in a ball mill for 3 hours to obtain a component A; (2) mixing 30g of phenolic aldehyde amine curing agent with an amine value of 380-400 mgKOH/g with 30g of solvent, and uniformly stirring to obtain a component B; (3) adding the component B into the component A, stirring uniformly and coating. The performance was tested after 7 days of room temperature cure.
Example 3:
(1) dissolving 100g of bisphenol F type epoxy resin with an epoxy value of 0.18-0.22 in 100g of solvent, adding 3g of gas phase SiO26g of organic bentonite, and stirring for 10min at 3000 r/min; then adding 450g of zinc powder, 150g of babbitt metal powder, 15g of lithopone, 4g of polypropylene glycol diglycidyl ether, KH 5602 g of silane coupling agent, 4g of dispersing agent and 3g of flatting agent, and carrying out ball milling for 2h in a ball mill to obtain a component A; (2) mixing 40g of aliphatic amine curing agent with the amine value of 260-300 mg KOH/g and 40g of solvent, and uniformly stirring to obtain a component B; (3) adding the component B into the component A, stirring uniformly and coating. The performance was tested after 7 days of room temperature cure.
Example 4:
(1) dissolving 100g of bisphenol F type epoxy resin with an epoxy value of 0.55-0.62 in 100g of solvent, adding 3g of gas phase SiO26g of organic bentonite, and stirring for 10min at 3000 r/min; then adding 250g of zinc powder, 250g of babbitt metal powder, 5g of lithopone, 9g of titanium dioxide, 3g of dioctyl phthalate, 3g of epoxidized cardanol, KH 5602 g of silane coupling agent, 5g of dispersing agent and 3g of flatting agent, ball-milling for 2h in a ball mill,obtaining a component A; (2) 70g of amide curing agent with the amine value of 320-360mg KOH/g is mixed with 40g of solvent and stirred uniformly to obtain a component B; (3) adding the component B into the component A, stirring uniformly and coating. The performance was tested after 7 days of room temperature cure.
The performance of examples 1-4 was tested as follows:
| adhesion force | Flexibility | Resistivity of coating | Adhesion force after impact of power frequency heavy current (20 kA) | Coating resistivity after power frequency heavy current (20 kA) impact | |
| Example 1 | Level 1 | 1mm | 0.36Ω·cm | Level 1 | 0.15Ω·cm |
| Example 2 | Level 1 | 1mm | 0.023Ω·cm | Level 1 | 0.013Ω·cm |
| Example 3 | Level 1 | 1mm | 0.084Ω·cm | Level 1 | 0.034Ω·cm |
| Example 4 | Level 1 | 1mm | 0.13Ω·cm | Level 1 | 0.11Ω·cm |
Note: adhesion force: testing according to the national standard GB 9286-1998;
flexibility: testing according to the national standard GB 1731-1993;
coating resistivity: and testing by a four-probe resistance tester.
Claims (3)
1. The utility model provides a ground net anticorrosive conductive coating which characterized in that: the composition is prepared from the following raw materials in parts by weight: 100 parts of epoxy resin; 30-110 parts of a curing agent; 50-200 parts of a solvent; 250 portions and 600 portions of zinc powder; 50-250 parts of Babbitt metal powder; 10-20 parts of a filler; 3-6 parts of a toughening agent; 5601-3 parts of silane coupling agent KH; gas phase SiO22-4 parts; 4-8 parts of organic bentonite; 3-6 parts of a dispersing agent; and 2-4 parts of a leveling agent.
2. The grounding grid anticorrosive conductive coating as claimed in claim 1, wherein:
the epoxy resin is bisphenol A E20, E44 and E51; bisphenol F type epoxy resin with epoxy value of 0.18-0.22, 0.42-0.48 and 0.55-0.62;
the curing agent is an amide curing agent, an aliphatic amine curing agent and a phenolic amine curing agent, and the amine value ranges from 180-400 mgKOH/g;
the solvent is a mixed solvent of dimethylbenzene and n-butyl alcohol in a volume ratio of 7: 3;
the Babbitt alloy powder is alloy powder with the melting point of 100-300 ℃ and the particle size of 150-325 meshes;
the filler is one or a combination of more of titanium dioxide, lithopone, talcum powder and the like;
the toughening agent is one or a combination of more of dibutyl phthalate, dioctyl phthalate, epoxidized cardanol, polypropylene glycol diglycidyl ether, linoleic acid dimer diglycidyl ether and the like;
the dispersant is a polyurethane dispersant;
the leveling agent is a fluorocarbon leveling agent.
3. A preparation method of the grounding grid anticorrosion conductive coating according to claim 1, which is characterized by comprising the following steps:
(1) dissolving 100 parts of epoxy resin into 50-200 parts of solvent, and adding 2-4 parts of gas-phase SiO24-8 parts of organic bentonite, and stirring for 10min at 3000 r/min; adding zinc powder of 250-600 parts, babbit powder of 50-250 parts, filler of 10-20 parts, toughening agent of 3-6 parts, silane coupling agent KH 5601-3 parts, dispersant of 3-6 parts and flatting agent of 2-4 parts, and ball milling for 1-3h in a ball mill to obtain component A;
(2) mixing 30-110 parts of curing agent and 30-50 parts of solvent, and uniformly stirring to obtain a component B;
(3) the component A and the component B are uniformly mixed according to the proportion and then coated.
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| CN113201269A (en) * | 2021-04-13 | 2021-08-03 | 中铁第四勘察设计院集团有限公司 | Antifouling and anticorrosive profile steel cantilever positioning device of contact network and processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113201269A (en) * | 2021-04-13 | 2021-08-03 | 中铁第四勘察设计院集团有限公司 | Antifouling and anticorrosive profile steel cantilever positioning device of contact network and processing method |
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