CN111261685B - Display substrate, manufacturing method thereof and display device - Google Patents
Display substrate, manufacturing method thereof and display device Download PDFInfo
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- CN111261685B CN111261685B CN202010076171.8A CN202010076171A CN111261685B CN 111261685 B CN111261685 B CN 111261685B CN 202010076171 A CN202010076171 A CN 202010076171A CN 111261685 B CN111261685 B CN 111261685B
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- 239000000758 substrate Substances 0.000 title claims abstract description 125
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 56
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 33
- 230000001105 regulatory effect Effects 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 40
- 238000005538 encapsulation Methods 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 14
- 239000005022 packaging material Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 238000010023 transfer printing Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 18
- 239000002905 metal composite material Substances 0.000 abstract description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052760 oxygen Inorganic materials 0.000 abstract description 9
- 239000001301 oxygen Substances 0.000 abstract description 9
- 230000000903 blocking effect Effects 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 9
- 239000003566 sealing material Substances 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000000059 patterning Methods 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000002042 Silver nanowire Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/816—Multilayers, e.g. transparent multilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a display substrate, a manufacturing method thereof and a display device, relates to the technical field of display, and aims to solve the problems that when a metal composite electrode is used as a top electrode, the surface resistance of the top electrode is large, the display uniformity is poor, the display substrate is very sensitive to water, oxygen and the like, cannot be compatible with subsequent solution processes, the trial range of the metal composite electrode is limited and the like. The display substrate includes: the cathode comprises a substrate and a transparent cathode arranged on the substrate, wherein the transparent cathode comprises a transparent conductive metal oxide layer and a conductive stress regulating layer which are sequentially stacked along a direction away from the substrate. The display substrate provided by the invention is used for displaying pictures.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a manufacturing method thereof and a display device.
Background
Currently, transparent metal top electrodes used in Organic Light-Emitting Diode (OLED) display technologies mainly include magnesium-silver metal composite electrodes, which have a large area resistance when applied to a small-sized (e.g., less than 6.5 inch) display device, such as about 10 Ω/sq when the metal composite electrode has a thickness of 12nm, so that the metal composite electrode has a larger area resistance when applied to a large-sized display device, resulting in poor uniformity of display effects of the display device; meanwhile, the metal composite electrode is very sensitive to water, oxygen and the like, and cannot be compatible with subsequent solution processes, so that the trial range of the metal composite electrode is limited.
Disclosure of Invention
The invention aims to provide a display substrate, a manufacturing method thereof and a display device, which are used for solving the problems that when a metal composite electrode is used as a top electrode, the surface resistance of the top electrode is large, the display uniformity is poor, the display substrate is very sensitive to water, oxygen and the like, cannot be compatible with subsequent solution processes, the trial range of the metal composite electrode is limited and the like.
In order to achieve the above object, the present invention provides the following technical solutions:
a first aspect of the present invention provides a display substrate comprising: the cathode comprises a substrate and a transparent cathode arranged on the substrate, wherein the transparent cathode comprises a transparent conductive metal oxide layer and a conductive stress regulating layer which are sequentially stacked along a direction away from the substrate.
Optionally, the conductive stress adjustment layer is in a grid structure, and the opening area of the display substrate is located in an area defined by the grid structure; or, the conductive stress adjusting layer is of a whole layer structure.
Optionally, the transparent cathode includes a plurality of transparent conductive metal oxide layers and a plurality of conductive stress adjustment layers, the transparent conductive metal oxide layers and the conductive stress adjustment layers are alternately arranged, and a film layer closest to the substrate in the transparent cathode is the transparent conductive metal oxide layer.
Optionally, the transparent conductive metal oxide layer is made of an indium zinc oxide material or an indium tin oxide material; the conductive stress adjusting layer is made of nano silver wires or graphene.
Optionally, the display substrate further includes:
a driving circuit layer between the substrate and the transparent cathode;
an anode layer located between the driving circuit layer and the transparent cathode;
an organic light emitting material layer between the anode layer and the transparent cathode;
and the packaging layer is positioned on one side of the transparent cathode, which is opposite to the substrate.
Optionally, the encapsulation layer includes:
a first organic encapsulation material layer and a first inorganic encapsulation material layer which are sequentially stacked in a direction away from the substrate; or,
and the second inorganic packaging material layer, the first organic packaging material layer and the first inorganic packaging material layer are sequentially stacked along the direction far away from the substrate.
Based on the technical scheme of the display substrate, a second aspect of the invention provides a display device, which comprises the display substrate.
Based on the technical scheme of the display substrate, a third aspect of the present invention provides a manufacturing method of a display substrate, for manufacturing the display substrate, where the manufacturing method includes:
and forming a transparent cathode on the substrate, wherein the transparent cathode comprises a transparent conductive metal oxide layer and a conductive stress regulating layer which are sequentially stacked along the direction away from the substrate.
Optionally, the step of forming the conductive stress adjustment layer specifically includes:
and forming the conductive stress regulating layer by adopting a solution method.
Optionally, the step of forming the conductive stress adjustment layer specifically includes:
and forming the conductive stress adjusting layer by adopting a transfer printing process.
According to the technical scheme provided by the invention, the transparent cathode comprises the transparent conductive metal oxide layer and the conductive stress regulating layer which are sequentially laminated along the direction away from the substrate, so that the transparent cathode has the advantages of good transparency, optical uniformity, excellent conductivity, strong water blocking capability, excellent light transmittance, flexibility, bending resistance and the like; meanwhile, the transparent cathode comprises a transparent conductive metal oxide layer and a conductive stress regulating layer which are stacked, and the transparent conductive metal oxide layer and the conductive stress regulating layer are connected in parallel, so that the integral resistivity of the transparent cathode can be effectively reduced; therefore, the transparent cathode provided by the embodiment of the invention solves the problems that when a metal composite electrode is adopted as a top electrode (namely, the transparent cathode), the surface resistance of the top electrode is larger, the uniformity of the display effect is poor, the display substrate is very sensitive to water, oxygen and the like, cannot be compatible with the subsequent solution process, the trial range is limited and the like.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
fig. 1 is a schematic first cross-sectional view of a display substrate according to an embodiment of the present disclosure;
FIG. 2 is a top view of a conductive stress adjustment layer according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a second cross-section of a display substrate according to an embodiment of the present invention;
fig. 4 is a schematic third cross-sectional view of a display substrate according to an embodiment of the invention.
Reference numerals:
10-substrate, 20-transparent cathode,
201-a transparent conductive metal oxide layer, 202-a conductive stress adjustment layer,
30-a driving circuit layer, 40-an anode layer,
50-an organic light emitting material layer, 61-a first organic encapsulation material layer,
62-a first inorganic encapsulating material layer, 63-a second inorganic encapsulating material layer,
70-pixel defining layer, 80-opening area.
Detailed Description
In order to further explain the display substrate, the manufacturing method thereof and the display device provided by the embodiment of the invention, the following detailed description is given with reference to the accompanying drawings.
Referring to fig. 1, a display substrate provided in an embodiment of the invention includes: a substrate 10, and a transparent cathode 20 disposed on the substrate 10, the transparent cathode 20 including a transparent conductive metal oxide layer 201 and a conductive stress adjustment layer 202 sequentially stacked in a direction away from the substrate 10.
Specifically, the transparent conductive metal oxide layer 201 has better transparency and optical uniformity, is suitable for being used as a conductive film layer in a large-size display device, and the transparent conductive metal oxide layer 201 has stronger water blocking capability as an electrode per se, so that an organic film layer between the transparent conductive metal oxide layer 201 and the substrate 10 can be effectively protected, and the transparent conductive metal oxide layer 201 can be well compatible with a solution process at the rear section of a display substrate.
The specific materials of the conductive stress adjustment layer 202 are various, and the conductive stress adjustment layer 202 is an exemplary film layer made of nano silver wires (Ag-NWs), wherein the nano silver wires are one-dimensional silver metal materials with the length in micrometer scale and the diameter in nanometer scale, and the nano silver wires have excellent conductivity (about 90%) and excellent light transmittance and bending resistance besides silver; or the conductive stress adjustment layer 202 is a film layer made of graphene; but is not limited thereto. When the conductive stress adjustment layer 202 is made of the above material, the conductive stress adjustment layer 202 has good conductivity, water blocking capability, light transmittance, flexibility, flexure resistance and the like.
According to the specific structure of the display substrate, the transparent cathode 20 includes the transparent conductive metal oxide layer 201 and the conductive stress adjustment layer 202 sequentially stacked along the direction away from the substrate 10, so that the transparent cathode 20 has the advantages of good transparency and optical uniformity, good conductivity, strong water blocking capability, excellent light transmittance, flexibility, bending resistance and the like; meanwhile, the transparent cathode 20 comprises the transparent conductive metal oxide layer 201 and the conductive stress adjusting layer 202 which are stacked, which is equivalent to parallel connection of the transparent conductive metal oxide layer 201 and the conductive stress adjusting layer 202, so that the overall resistivity of the transparent cathode 20 can be effectively reduced; therefore, in the display substrate provided by the embodiment of the invention, the arranged transparent cathode 20 solves the problems that when a metal composite electrode is adopted as a top electrode (namely the transparent cathode 20), the surface resistance of the top electrode is larger, the uniformity of the display effect is poor, the display substrate is very sensitive to water, oxygen and the like, cannot be compatible with the subsequent solution process, the trial range is limited and the like.
As shown in fig. 1 and 2, in some embodiments, the conductive stress adjustment layer 202 has a grid structure, and the opening area 80 of the display substrate is located in an area defined by the grid structure; or, the conductive stress adjusting layer is of a whole layer structure.
Specifically, the specific structure of the conductive stress adjustment layer 202 is various, and illustratively, the conductive stress adjustment layer 202 is formed in a whole layer structure or a grid structure, and when the conductive stress adjustment layer 202 is formed in a whole layer structure, the conductive stress adjustment layer 202 covers the entire display area of the display substrate; when the conductive stress adjustment layer 202 is formed as a grid structure, the grid structure may include a grid structure body that is capable of defining a plurality of regions.
In more detail, the display substrate includes a display region and a non-display region located at a periphery of the display region, the display region includes an open region 80 and a non-open region, and the mesh structure body may be laid out at the non-open region of the display substrate when the mesh structure is laid out, such that the open region 80 of the display substrate is located within an area defined by the mesh structure.
It should be noted that, the area defined by the grid structure may correspond to the opening areas 80 of the display substrate one by one, and the opening areas 80 are located in the area defined by the grid structure one by one; alternatively, each region defined by the grid structure may accommodate a plurality of the open areas 80 simultaneously. In addition, the opening area 80 of the display substrate is generally defined by the pixel defining layer 70 of the display substrate, so the grid structure body can be fabricated on the surface of the pixel defining layer 70 facing away from the substrate 10, but is not limited thereto.
In the display substrate provided in the foregoing embodiment, the conductive stress adjustment layer 202 is configured to be in a grid structure, and the opening area 80 of the display substrate is located in an area defined by the grid structure, so that the conductive stress adjustment layer 202 does not block the opening area 80 of the display substrate in a direction perpendicular to the base 10, thereby effectively improving the light transmittance of the transparent cathode 20 and the display effect of the display substrate.
As shown in fig. 3 and 4, in some embodiments, the transparent cathode 20 includes a plurality of transparent conductive metal oxide layers 201 and a plurality of conductive stress adjustment layers 202, the transparent conductive metal oxide layers 201 and the conductive stress adjustment layers 202 are alternately disposed, and a layer of the transparent cathode 20 closest to the substrate 10 is the transparent conductive metal oxide layer 201.
Specifically, the transparent cathode 20 may include a transparent conductive metal oxide layer 201 and a conductive stress adjustment layer 202, in which case the transparent conductive metal oxide layer 201 is located between the substrate 10 and the conductive stress adjustment layer 202; alternatively, the transparent cathode 20 may include a plurality of transparent conductive metal oxide layers 201 and a plurality of conductive stress adjustment layers 202, in which case the transparent conductive metal oxide layers 201 and the conductive stress adjustment layers 202 are alternately disposed, and a layer closest to the substrate 10 in the transparent cathode 20 is the transparent conductive metal oxide layer 201, and a layer farthest from the substrate 10 in the transparent cathode 20 may be the conductive stress adjustment layer 202.
It should be noted that, since the process of fabricating the conductive stress adjustment layer 202 may also involve a solution process, the film layer closest to the substrate 10 in the transparent cathode 20 is the transparent conductive metal oxide layer 201, so that the damage of water and oxygen to the organic film layer formed in the display substrate during the process of fabricating the conductive stress adjustment layer 202 can be avoided.
In more detail, the transparent femaleThe electrode 20 may include a plurality of layers stacked in sequence in a direction away from the substrate 10, each of the plurality of layers including a transparent conductive metal oxide layer 201 and a conductive stress adjustment layer 202 (e.g., ag-NWs) stacked in a direction away from the substrate 10, and the transparent conductive metal oxide layer 201 is exemplified by Indium Zinc Oxide (IZO), and the transparent cathode 20 includes (IZO/Ag-NWs) n N represents n groups of film layers, and n can be any integer greater than or equal to 1.
The transparent cathode 20 includes the multilayer transparent conductive metal oxide layer 201 and the multilayer conductive stress adjustment layer 202, which is more beneficial to reducing the resistance of the transparent cathode 20 and improving the display uniformity of the display substrate.
The transparent conductive metal oxide layer 201 may be made of a wide variety of materials, and in some embodiments, the transparent conductive metal oxide layer 201 is made of an indium zinc oxide material or an indium tin oxide material.
As shown in fig. 3 and 4, in some embodiments, the display substrate further includes:
a driving circuit layer 30 between the substrate 10 and the transparent cathode 20;
an anode layer 40 located between the driving circuit layer 30 and the transparent cathode 20;
an organic light emitting material layer 50 between the anode layer 40 and the transparent cathode 20;
and an encapsulation layer positioned on the side of the transparent cathode 20 facing away from the substrate 10.
Specifically, the driving circuit layer 30 includes a plurality of pixel driving circuits, the anode layer 40 includes a plurality of anode patterns, the organic light emitting material layer 50 includes a plurality of organic light emitting material patterns, the pixel driving circuits, the anode patterns, and the organic light emitting material patterns are in one-to-one correspondence, the pixel driving circuits are coupled with the corresponding anode patterns for providing driving signals for the corresponding anode patterns, and the organic light emitting material patterns are for emitting light under the driving of the transparent cathode 20 and the corresponding anode patterns.
The light emitting color of the organic light emitting material pattern may be set according to actual needs, and the organic light emitting material pattern includes, but is not limited to, red organic light emitting material pattern, green organic light emitting material pattern, and blue organic light emitting material pattern.
The display substrate may further include an encapsulation layer on a side of the transparent cathode 20 facing away from the base 10, where the encapsulation layer is used to prevent water and oxygen from invading the display substrate, so as to protect the display substrate.
In some embodiments, the encapsulation layer comprises:
as shown in fig. 3, a first organic encapsulating material layer 61 and a first inorganic encapsulating material layer 62 are sequentially stacked in a direction away from the substrate 10; or,
as shown in fig. 4, a second inorganic sealing material layer 63, the first organic sealing material layer 61, and the first inorganic sealing material layer 62 are sequentially stacked in a direction away from the substrate 10.
Specifically, the specific structure of the encapsulation layer may be set according to actual needs, and, by way of example, a first organic encapsulation material layer 61 and a first inorganic encapsulation material layer 62, which are sequentially stacked in a direction away from the substrate 10, may be provided; alternatively, the second inorganic sealing material layer 63, the first organic sealing material layer 61, and the first inorganic sealing material layer 62 are sequentially stacked in a direction away from the substrate 10.
In fabricating the first inorganic sealing material layer 62 and the second inorganic sealing material layer 63, chemical Vapor Deposition (CVD) or Atomic Layer Deposition (ALD) may be specifically used. In fabricating the first organic encapsulation material layer 61, an inkjet printing method may be specifically used, but is not limited thereto.
Since the transparent conductive metal oxide layer 201 included in the transparent cathode 20 itself has good water blocking property, the second inorganic encapsulation material layer 63 may be selectively manufactured or omitted according to actual needs.
The embodiment of the invention also provides a display device, which comprises the display substrate provided by the embodiment.
In the display substrate provided in the above embodiment, the transparent cathode 20 includes the transparent conductive metal oxide layer 201 and the conductive stress adjustment layer 202 sequentially stacked along the direction away from the substrate 10, so that the transparent cathode 20 has the advantages of good transparency and optical uniformity, good conductivity, strong water blocking capability, excellent light transmittance, flexibility, and bending resistance; meanwhile, the transparent cathode 20 comprises the transparent conductive metal oxide layer 201 and the conductive stress adjusting layer 202 which are stacked, which is equivalent to parallel connection of the transparent conductive metal oxide layer 201 and the conductive stress adjusting layer 202, so that the overall resistivity of the transparent cathode 20 can be effectively reduced; therefore, in the display substrate provided in the above embodiment, the provided transparent cathode 20 overcomes the problems that when the metal composite electrode is adopted as the top electrode (i.e. the transparent cathode 20), the surface resistance of the top electrode is larger, the uniformity of the display effect is poor, the display substrate is very sensitive to water, oxygen and the like, cannot be compatible with the subsequent solution process, and the trial range is limited.
Therefore, the display device provided by the embodiment of the present invention has the above beneficial effects when the display substrate provided by the above embodiment is included, and will not be described herein.
Note that, the display device may be: television, display, digital photo frame, mobile phone, tablet computer, etc.
The embodiment of the invention also provides a manufacturing method of the display substrate, which is used for manufacturing the display substrate provided by the embodiment, and comprises the following steps:
a transparent cathode 20 is formed on a substrate 10, the transparent cathode 20 including a transparent conductive metal oxide layer 201 and a conductive stress adjustment layer 202 which are sequentially stacked in a direction away from the substrate 10.
Specifically, the manufacturing method of the display substrate may specifically include: a driving circuit layer 30 is firstly manufactured on the substrate 10, then a flat layer is manufactured on one side of the driving circuit layer 30 facing away from the substrate 10, then an anode layer 40 is manufactured on one side of the flat layer facing away from the substrate 10, and the anode layer 40 is formed onA pixel defining layer 70 is formed on the side facing away from the substrate 10, the pixel defining a plurality of opening regions 80, then an organic luminescent material pattern is formed by vapor deposition in each opening region 80 defined by the pixel defining layer 70, and then a Sputtering (SPUTTER) process is adopted to deposit and form the transparent conductive metal oxide layer 201, wherein the thickness of the transparent conductive metal oxide layer 201 can be equal to that of the pixel defining layer And selecting a range, and then manufacturing the silver nanowire layer on the side of the transparent conductive metal oxide layer 201, which is opposite to the substrate 10.
The transparent conductive metal oxide layer 201 has good transparency and optical uniformity, is suitable for being used as a conductive film layer in a large-size display device, has strong water blocking capability as an electrode, and can effectively protect an organic film layer between the transparent conductive metal oxide layer 201 and the substrate 10, so that the transparent conductive metal oxide layer 201 can be well compatible with a solution process of the rear section of a display substrate.
The specific materials of the conductive stress adjustment layer 202 are various, and the conductive stress adjustment layer 202 is an exemplary film layer made of nano silver wires (Ag-NWs), wherein the nano silver wires are one-dimensional silver metal materials with the length in micrometer scale and the diameter in nanometer scale, and the nano silver wires have excellent conductivity (about 90%) and excellent light transmittance and bending resistance besides silver; or the conductive stress adjustment layer 202 is a film layer made of graphene; but is not limited thereto. When the conductive stress adjustment layer 202 is made of the above material, the conductive stress adjustment layer 202 has good conductivity, water blocking capability, light transmittance, flexibility, flexure resistance and the like.
In the display substrate manufactured by adopting the manufacturing method provided by the embodiment of the invention, the transparent cathode 20 is provided with the transparent conductive metal oxide layer 201 and the conductive stress adjusting layer 202 which are sequentially laminated along the direction far away from the substrate 10, so that the transparent cathode 20 has the advantages of good transparency, optical uniformity, excellent conductivity, strong water blocking capability, excellent light transmittance, flexibility, bending resistance and the like; meanwhile, the transparent cathode 20 comprises the transparent conductive metal oxide layer 201 and the conductive stress adjusting layer 202 which are stacked, which is equivalent to parallel connection of the transparent conductive metal oxide layer 201 and the conductive stress adjusting layer 202, so that the overall resistivity of the transparent cathode 20 can be effectively reduced; therefore, in the display substrate manufactured by the manufacturing method provided by the embodiment of the invention, the arranged transparent cathode 20 solves the problems that when the metal composite electrode is adopted as the top electrode (namely the transparent cathode 20), the surface resistance of the top electrode is larger, the uniformity of the display effect is poor, the display substrate is very sensitive to water, oxygen and the like, cannot be compatible with the subsequent solution process, the trial range is limited and the like.
The steps of fabricating the conductive stress adjustment layer 202 are varied, and in some embodiments, the step of forming the conductive stress adjustment layer 202 specifically includes: the conductive stress adjustment layer 202 is formed using a solution process.
Specifically, a solution may be formed using a nano silver wire material, and then the conductive stress adjustment layer 202 may be formed on the side of the transparent conductive metal oxide layer 201 facing away from the substrate 10 using a solution method. The specific forming process can be a printing process or a coating process in combination with a curing process.
It should be noted that, depending on the specific structure of the conductive stress adjustment layer 202 to be formed, whether a patterning process is performed may be selected, if the conductive stress adjustment layer 202 is formed in a full-face structure, the patterning process is not required, and if the conductive stress adjustment layer 202 is formed in a patterned structure, the patterning process is required.
In some embodiments, the step of forming the conductive stress adjustment layer 202 specifically includes: the conductive stress adjustment layer 202 is formed using a transfer process.
Specifically, the conductive stress adjustment layer 202 may be printed on another carrier plate and then cured, and then the conductive stress adjustment layer 202 formed on the carrier plate is transferred to the side of the transparent conductive metal oxide layer 201 facing away from the substrate 10.
In this specification, all embodiments are described in a progressive manner, and identical and similar parts of the embodiments are all referred to each other, and each embodiment is mainly described in a different way from other embodiments. In particular, for the method embodiments, since they are substantially similar to the product embodiments, the description is relatively simple, and reference is made to the section of the product embodiments for relevant points.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected," "coupled," or "connected," and the like, are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A display substrate, comprising: a substrate, and a transparent cathode disposed on the substrate, the transparent cathode including a transparent conductive metal oxide layer and a conductive stress adjustment layer sequentially stacked in a direction away from the substrate; the transparent conductive metal oxide layer is suitable for large-size display devices and can be well compatible with solution processes at the rear section of a display substrate;
the transparent conductive metal oxide layer is made of an indium zinc oxide material or an indium tin oxide material;
the conductive stress regulating layer is made of nano silver wires or graphene;
wherein the conductive stress adjusting layer is formed by a solution method; and the conductive stress adjusting layer is formed by one-time process; the conductive stress adjusting layer is in a grid structure, and the opening area of the display substrate is located in an area defined by the grid structure.
2. The display substrate of claim 1, wherein the conductive stress adjustment layer is a monolithic structure.
3. The display substrate according to claim 1, wherein the transparent cathode includes a plurality of transparent conductive metal oxide layers and a plurality of conductive stress adjustment layers, the transparent conductive metal oxide layers and the conductive stress adjustment layers are alternately arranged, and a film layer closest to the base in the transparent cathode is the transparent conductive metal oxide layer.
4. The display substrate of claim 1, wherein the display substrate further comprises:
a driving circuit layer between the substrate and the transparent cathode;
an anode layer located between the driving circuit layer and the transparent cathode;
an organic light emitting material layer between the anode layer and the transparent cathode;
and the packaging layer is positioned on one side of the transparent cathode, which is opposite to the substrate.
5. The display substrate of claim 4, wherein the encapsulation layer comprises:
a first organic encapsulation material layer and a first inorganic encapsulation material layer which are sequentially stacked in a direction away from the substrate; or,
and the second inorganic packaging material layer, the first organic packaging material layer and the first inorganic packaging material layer are sequentially stacked along the direction far away from the substrate.
6. A display device comprising the display substrate according to any one of claims 1 to 5.
7. A method for manufacturing a display substrate according to any one of claims 1 to 5, the method comprising:
and forming a transparent cathode on the substrate, wherein the transparent cathode comprises a transparent conductive metal oxide layer and a conductive stress regulating layer which are sequentially stacked along the direction away from the substrate.
8. The method of manufacturing a display substrate according to claim 7, wherein the step of forming the conductive stress adjustment layer specifically comprises:
and forming the conductive stress regulating layer by adopting a solution method.
9. The method of manufacturing a display substrate according to claim 7, wherein the step of forming the conductive stress adjustment layer specifically comprises:
and forming the conductive stress adjusting layer by adopting a transfer printing process.
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| CN107611164A (en) * | 2017-09-25 | 2018-01-19 | 京东方科技集团股份有限公司 | A kind of oled panel and preparation method thereof |
| CN107808896A (en) * | 2017-10-27 | 2018-03-16 | 上海天马微电子有限公司 | Display panel, manufacturing method of display panel and display device |
| CN108417609A (en) * | 2018-04-10 | 2018-08-17 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof and display device |
| CN110416269A (en) * | 2019-07-29 | 2019-11-05 | 云谷（固安）科技有限公司 | A kind of production method of display panel and display panel |
| CN110416431A (en) * | 2019-07-26 | 2019-11-05 | 云谷（固安）科技有限公司 | A kind of display panel and display device |
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| CN107611164A (en) * | 2017-09-25 | 2018-01-19 | 京东方科技集团股份有限公司 | A kind of oled panel and preparation method thereof |
| CN107808896A (en) * | 2017-10-27 | 2018-03-16 | 上海天马微电子有限公司 | Display panel, manufacturing method of display panel and display device |
| CN108417609A (en) * | 2018-04-10 | 2018-08-17 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof and display device |
| CN110416431A (en) * | 2019-07-26 | 2019-11-05 | 云谷（固安）科技有限公司 | A kind of display panel and display device |
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