CN111261653A - Micro light emitting diode, display panel and transfer method thereof - Google Patents
Micro light emitting diode, display panel and transfer method thereof Download PDFInfo
- Publication number
- CN111261653A CN111261653A CN201811455075.3A CN201811455075A CN111261653A CN 111261653 A CN111261653 A CN 111261653A CN 201811455075 A CN201811455075 A CN 201811455075A CN 111261653 A CN111261653 A CN 111261653A
- Authority
- CN
- China
- Prior art keywords
- electrode
- binding
- emitting diode
- micro light
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
Abstract
The application discloses a micro light-emitting diode, a display panel thereof and a transfer method thereof, wherein the micro light-emitting diode comprises a light-emitting surface and a back surface which are opposite, a first electrode plate, a second electrode plate and an assembling and binding plate are arranged on the back surface of the micro light-emitting diode, and a hydrophilic film layer or a hydrophobic film layer is formed on the surface of the assembling and binding plate. The micro light-emitting diode can transfer a large amount of liquid through the self-assembly technology, and transfer efficiency is greatly improved.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a micro light emitting diode, a display panel and a transfer method thereof.
Background
The display technology has been widely applied in daily life of people, and is gradually developed towards high efficiency, high brightness, Light and thin, and the like, compared with an Organic Light-Emitting Diode (OLED), a Micro-LED can integrate a high-density Light-Emitting Diode (LED) in a Micro size, has extremely high Light-Emitting efficiency and service life, and has obvious technical advantages.
However, there are still many problems in the actual panel manufacturing process, and how to realize the transfer of tens of millions of micro leds is one of the most critical problems at present.
Disclosure of Invention
The application provides a micro light-emitting diode, a display panel thereof and a transfer method thereof, which aim to solve the problem that the huge transfer of the micro light-emitting diode cannot be realized in the prior art.
In order to solve the technical problem, the application provides a miniature light emitting diode, including luminous surface and the back that carries on the back mutually, miniature light emitting diode back is provided with first electrode slice, second electrode slice and equipment and binds the piece, and wherein, the equipment is bound the piece surface and is formed with hydrophilic rete or hydrophobic rete.
In order to solve the above technical problem, the present application provides a micro light emitting diode display panel, which includes a driving substrate, and a plurality of micro light emitting diodes disposed on the driving substrate; the miniature light-emitting diode comprises a light-emitting surface and a back surface which are opposite, the back surface of the miniature light-emitting diode is connected with the driving substrate, and the back surface of the miniature light-emitting diode is provided with a first electrode plate, a second electrode plate and an assembling and binding plate; the surface of the driving substrate connected with the micro light-emitting diode is provided with a first electrode block, a second electrode block and an assembling and binding block; the first electrode plate is connected with the first electrode block, the second electrode plate is connected with the second electrode block, and the assembly binding piece is connected with the assembly binding block; wherein, hydrophilic film layers are formed on the two surfaces of the assembling and binding sheet and the assembling and binding block which are mutually connected; or a hydrophobic film layer is formed on one surface of the assembly binding sheet and the assembly binding block which are mutually connected, a hydrophilic film layer or a hydrophobic film layer is formed on the other surface of the assembly binding sheet and the assembly binding block, an adhesive is arranged between the assembly binding sheet and the assembly binding block, and the hydrophilcity and the hydrophobicity of the adhesive are the same as those of the film layer on the surface of the assembly binding block.
In order to solve the above technical problem, the present application provides a method for transferring a micro light emitting diode, which includes: providing a plurality of micro light-emitting diodes and a driving substrate; the miniature light-emitting diode comprises a light-emitting surface and a back surface which are opposite, and a first electrode plate, a second electrode plate and an assembling and binding plate are arranged on the back surface; the connecting surface of the driving substrate is provided with a first electrode block, a second electrode block and an assembling and binding block; carrying out hydrophilic treatment on the assembly binding sheet and the assembly binding block; placing a plurality of micro light-emitting diodes in the polar solution, wherein the back surfaces of the micro light-emitting diodes face to the surface of the polar solution; and separating the driving substrate inserted with the polar solution from the polar solution, so that the micro light-emitting diode is adhered on the driving substrate through the hydrophilic connection between the assembly binding sheet and the assembly binding block, and the connection surface of the driving substrate forms a right angle or an obtuse angle with the liquid level of the polar solution.
In order to solve the above technical problem, the present application provides a method for transferring a micro light emitting diode, which includes: providing a plurality of micro light-emitting diodes and a driving substrate; the miniature light-emitting diode comprises a light-emitting surface and a back surface which are opposite, and a first electrode plate, a second electrode plate and an assembling and binding plate are arranged on the back surface; the connecting surface of the driving substrate is provided with a first electrode block, a second electrode block and an assembling and binding block; performing hydrophobic treatment on one of the assembly binding sheet and the assembly binding block, and performing hydrophilic treatment or hydrophobic treatment on the other one; arranging an adhesive on the assembly binding block, wherein the hydrophily and hydrophobicity of the adhesive is the same as that of the assembly binding block; placing a plurality of micro light-emitting diodes in a solution, wherein the polarity of the solution corresponds to the hydrophilicity and hydrophobicity of the assembled binding sheet, so that the back surfaces of the micro light-emitting diodes face the liquid level of the solution; and moving the driving substrate inserted into the solution away from the solution, so that the assembly binding sheets on the micro light-emitting diodes are adhered to the driving substrate through the adhesive connection on the assembly binding blocks, and the connection surface of the driving substrate forms a right angle or an obtuse angle with the liquid level of the solution.
The application discloses miniature emitting diode includes luminous surface and the back of the body of carrying on the back mutually, and its back is provided with first electrode slice, second electrode slice and equipment and binds the piece, and wherein, equipment is bound the piece surface and is formed with hydrophilic rete or hydrophobic rete. The back surface of the micro light-emitting diode has hydrophilicity or hydrophobicity, so the back surface of the micro light-emitting diode can be arranged in polar solution or non-polar solution towards the liquid level, and then the huge transfer of the micro light-emitting diode can be realized by utilizing the fluid self-assembly technology, thereby improving the manufacturing efficiency of the micro light-emitting diode display panel. Specifically in the micro light emitting diode transfer method disclosed in the application, the micro light emitting diode is tiled in the solution, then the driving substrate is pulled out from the solution, and the flow generated by the solution pushes the micro light emitting diode, so that the micro light emitting diode can be adhered to the driving substrate, and then the micro light emitting diode is transferred in high efficiency and in batch.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of a light emitting diode of the present application;
FIG. 2 is a schematic structural diagram of a micro light emitting diode display panel according to an embodiment of the present invention;
FIG. 3 is a schematic view of a driving substrate of the display panel shown in FIG. 2;
FIG. 4 is a schematic structural diagram of another embodiment of a micro light emitting diode display panel according to the present application;
FIG. 5 is a schematic flow chart diagram illustrating an embodiment of a micro LED transfer method according to the present application;
FIG. 6 is a schematic process flow diagram of an embodiment of the transfer method of FIG. 1;
FIG. 7 is a schematic view of another process of the embodiment of the transfer method of FIG. 1;
FIG. 8 is a schematic diagram of a process of self-aligning a micro LED and a driving substrate in the embodiment of the transfer method shown in FIG. 1;
FIG. 9 is a schematic flow chart illustrating another embodiment of a micro LED transfer method according to the present application;
FIG. 10 is a schematic structural diagram of a micro light emitting diode display device according to an embodiment of the present application.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present application, the following provides a micro light emitting diode, a display panel thereof, and a transfer method thereof with reference to the accompanying drawings and detailed description.
The micro light-emitting diode realizes self-luminescence of pixels in the display panel, one micro light-emitting diode is used as one pixel point, and the number of the pixel points is generally thousands of pixels in the current display panel, so that thousands of micro light-emitting diodes are correspondingly arranged on the display panel. Generally, a micro light emitting diode is first extended on a growth substrate and then transferred to a driving substrate to form a display panel.
Specifically, referring to fig. 1, fig. 1 is a schematic structural diagram of a micro light emitting diode according to an embodiment of the present application.
The micro light emitting diode 100 of the present embodiment includes a light emitting surface and a back surface 11 opposite to each other, and when the micro light emitting diode 100 is disposed on the driving substrate, the light emitting surface faces outward, i.e., the back surface 11 is connected to the driving substrate. The rear face 11 is provided with a first electrode sheet 111, a second electrode sheet 112 and an assembly binding sheet 113.
The first electrode sheet 111 and the second electrode sheet 112 are used for being connected to the positive electrode and the negative electrode of the driving back plate to achieve light emitting driving. The assembly binding sheet 113 is used to realize binding connection with the driving backplate, and a hydrophilic film layer or a hydrophobic film layer is formed on the surface thereof, so that it can be bound on the driving backplate by using a self-assembly technique of a fluid.
The fluid self-assembly technology that this application was used, make the contact surface of miniature emitting diode 100 and drive backplate all form hydrophilic rete specifically, or form hydrophobic rete and set up the adhesive, then lay miniature emitting diode at the solution liquid level, pull out from the solution to the drive backplate, the fluid effect makes the two be close to each other, then the two can realize bonding self-assembly through hydrophilicity or adhesive.
In order to form the hydrophilic film layer or the hydrophobic film layer on the assembly bonding sheet 113 when the micro light emitting diode 100 is manufactured, the micro light emitting diode 100 needs to be immersed in the SAM solution. Since the first and second electrode sheets 111 and 112 require the use of conductive metal, the first and second electrode sheets 111 and 112 using a metal material may also form a hydrophilic film layer or a hydrophobic film layer.
In addition, in order to ensure accurate alignment of the micro light emitting diode 100 on the driving substrate, the assembly bonding sheet 113 for bonding connection is rectangular, triangular, elliptical, rotationally symmetric or irregular; so as to ensure that the micro light emitting diode 100 can be bound on the driving substrate in a unique and correct position after the assembly binding sheet 113 is bound and aligned. To illustrate by way of a counter example, the assembling and bonding sheet 113 is not circular, and when the circular assembling and bonding sheet 113 is bonded and aligned, the micro light emitting diode 100 may be bonded on the driving substrate in various ways, and at this time, precise alignment cannot be achieved.
The assembly binding sheet 113 is preferably a 180-degree rotationally symmetric pattern, and can achieve more accurate alignment compared with other shapes, specifically, the assembly binding sheet with the same shape needs to be correspondingly arranged on the driving substrate to achieve accurate alignment, after the assembly binding sheet 113 is bound and connected to the driving substrate, due to the flexibility of fluid movement, the assembly binding sheet 113 generally cannot achieve completely accurate alignment, the driving substrate bound and connected with the micro light emitting diode 100 is allowed to stand for a period of time, and the assembly binding sheet 113 of the micro light emitting diode 100 can move under the capillary action of liquid between the two, so as to be completely matched with the corresponding assembly binding sheet on the driving substrate. And the adoption of the rotational symmetry shape can realize quick complete alignment. In the standing alignment process, the driving substrate bound and connected with the micro light emitting diode 100 can be heated to accelerate the alignment speed and improve the alignment precision.
When the assembly binding piece 113 is in a 180-degree rotational symmetry shape, if the micro light emitting diode 100 is symmetrically arranged as a whole, and if the first electrode sheet 111 and the second electrode sheet 112 are symmetrically arranged on two sides of the assembly binding piece 113, the micro light emitting diode is easily connected with the positive electrode and the negative electrode on the driving substrate in a reverse manner, so in this embodiment, the number of the first electrode sheets 111 is two, the number of the second electrode sheets 112 is one, and a hollow-out area 114 is formed at the rotational center of the assembly binding piece 113; the second electrode sheet 112 is located in the hollow-out region 114, and the two first electrode sheets 111 are located at two sides of the assembly binding sheet 113 respectively and are symmetrically arranged relative to the rotation center of the assembly binding sheet 113. Therefore, when the micro light emitting diode 100 is assembled and aligned, the first electrode sheet 111 and the second electrode sheet 112 can be ensured not to have the problem of positive and negative electrode alignment error.
The assembly bonding sheet 113 on the back surface 11 of the micro light emitting diode 100 of the present embodiment is provided with a hydrophilic film layer or a hydrophobic film layer, so that the assembly bonding sheet can be laid in a polar solution or a non-polar solution with the back surface facing to the liquid surface, and then can be transferred by using a fluid self-assembly technology.
The description of the micro light emitting diode 100 of the above embodiment relates to the binding relationship with the driving substrate, and for a clearer understanding of the present application, the following further describes the display panel provided with the micro light emitting diode 100. Referring to fig. 2-4, fig. 2 is a schematic structural diagram of an embodiment of a micro light emitting diode display panel of the present application, fig. 3 is a schematic structural diagram of a driving substrate in the display panel shown in fig. 2, and fig. 4 is a schematic structural diagram of another embodiment of the micro light emitting diode display panel of the present application.
The display panel 300 of the embodiment shown in fig. 2 includes a driving substrate 200 and a plurality of the above-mentioned micro light emitting diodes 100, wherein the plurality of micro light emitting diodes 100 are arranged on the driving substrate 200 in an array, and each micro light emitting diode 100 corresponds to a pixel point, so as to realize self-luminescence of the pixel point. The structure of the micro light emitting diode 100 is not described in detail.
The structure of the driving substrate 200 can be seen from fig. 3, and the surface 21 of the driving substrate connected to the micro light emitting diode 100 is provided with a first electrode block 211, a second electrode block 212 and an assembly binding block 213; the first electrode plate 111 is connected with the first electrode block 211, the second electrode plate 112 is connected with the second electrode block 212, and the assembly binding piece 113 is connected with the assembly binding block 213; wherein hydrophilic film layers are formed on both surfaces of the assembly binding sheet 113 and the assembly binding block 213, which are connected to each other.
In the display panel 400 of the embodiment shown in fig. 4, a hydrophobic film layer is formed on one surface where the assembly binding sheet 113 and the assembly binding block 213 are connected to each other, and a hydrophilic film layer or a hydrophobic film layer is formed on the other surface, and an adhesive 215 must be disposed between the assembly binding sheet 113 and the assembly binding block 213, and the hydrophilicity and hydrophobicity of the adhesive 215 are the same as those of the surface film layer of the assembly binding block 213.
The bonding connection between the micro light emitting diode 100 and the driving substrate 200 can be understood in conjunction with the micro light emitting diode transfer method. Specifically, referring to fig. 5, fig. 5 is a schematic flow chart of an embodiment of a micro light emitting diode transfer method according to the present application. The transfer method of the present embodiment includes the following steps.
S101: a plurality of micro light emitting diodes and a driving substrate are provided.
The transferring method of the present embodiment is used for transferring the micro light emitting diode 100 provided in the present step to the driving substrate 200, and for the structures of the two, please refer to fig. 1 and fig. 3.
The provided micro light emitting diode 100 includes opposing light emitting and back surfaces 11. When the micro light emitting diode 100 is disposed on the driving substrate 200, the light emitting surface thereof faces outward, i.e., the back surface 11 is connected to the driving substrate 200. A first electrode tab 111, a second electrode tab 112, and an assembly bonding tab 113 are provided on the rear surface 11 of the micro light emitting diode 100. The micro light emitting diode 100 may be epitaxially grown on a growth substrate and then peeled off from the growth substrate.
The side of the connection surface 21 of the driving substrate 200 provided to connect the micro light emitting diodes 100 is provided with a first electrode block 211, a second electrode block 212, and an assembly bonding block 213. The driving substrate 200 may be a TFT substrate or the like manufactured by a Mask process.
After the micro light emitting diode 100 is transferred to the driving substrate 200, the first electrode tab 111 is connected to the first electrode block 211, the second electrode tab 112 is connected to the second electrode block 212, and the assembly bonding tab 113 is connected to the assembly bonding block 213. The connection between the electrode plate and the electrode block is used for realizing the electric driving of the positive electrode and the negative electrode of the micro light-emitting diode and realizing the light emission of the micro light-emitting diode 100, the first electrode plate 111 can be a P-end contact, the second electrode plate 112 can be an N-end contact, the electrode block is arranged in a similar way, the words "block" and "sheet" are used here only for convenience of distinguishing, and the size or shape of each block is not limited. The connection between the assembly bonding sheet 113 and the assembly bonding block 213 is used to achieve the adhesion of the micro light emitting diode 100 to the driving substrate 200 in the subsequent step.
S102: and carrying out hydrophilic treatment on the assembly binding sheet of the micro light-emitting diode and the assembly binding block of the driving substrate.
The assembly binding piece 113 and the assembly binding block 213 are subjected to hydrophilic treatment in this embodiment, so that the assembly binding piece 113 and the assembly binding block 213 can be coupled to each other using hydrophilicity.
The hydrophilic treatment is performed on the assembly binding sheet 113 of the micro light emitting diode 100, in which the micro light emitting diode 100 is entirely soaked in a solution containing hydrophilic groups, and after a period of time, the hydrophilic groups can form a hydrophilic film layer arranged densely and orderly on the assembly binding sheet 113.
Since gold (Au) in the metal material reacts with hydrogen sulfide (-SH) group to obtain the best hydrophilicity, in this embodiment, the solution containing hydrophilic group is selected from the organic sulfide SAM (self assembled monolayer) solution, and the assembled binding sheet 113 is selected from gold, specifically, one end of the SAM molecule is the-SH group to bind with gold, and the other end is the hydrophilic group, i.e., the SAM molecules are densely arranged on the gold surface, i.e., a hydrophilic film layer is formed on the gold surface. Because the surface of the gold has no natural oxide film and has good stability, the formed hydrophilic film has good stability.
The time for forming the hydrophilic film is related to the concentration of the surface active material contained in the soaking solution and the size of the micro light emitting diode 100, and generally, the soaking time may be 5 to 30 hours, and the concentration of the soaking solution may be 10-3mol/L～10mol/L。
In addition, when the micro light emitting diode 100 is soaked, the first electrode sheet 111 and the second electrode sheet 112 made of metal materials can form hydrophilic films at the same time, and because the micro light emitting diode 100 is small in size, the hydrophilic films are formed on the first electrode sheet 111 and the second electrode sheet 112, so that the back surface of the micro light emitting diode 100 has more obvious hydrophilicity compared with the light emitting surface, and the micro light emitting diode 100 can be stably connected with the hydrophilicity of the back surface when placed in a solution and transferred onto the driving substrate 200. In order to simplify the process, the first electrode sheet 111, the second electrode sheet 112 and the assembly binding sheet 113 are made of the same metal material, such as gold, and the three can be molded at the same time.
Similarly, if the assembly bonding block 213 on the driving substrate 200 is subjected to hydrophilic treatment, the first electrode block 211 and the second electrode block 212 in the driving substrate 200 are also hydrophilic if the hydrophilic treatment method of the micro light emitting diode 100 is only adopted. In the subsequent step, when the assembly binding sheet 113 is bound on the driving substrate 200 under the hydrophilic action, it may be connected to the first electrode block 211 or the second electrode block 212, so to avoid this, it is necessary to perform hydrophobic treatment on the first electrode block 211 and the second electrode block 212 on the driving substrate 200 to make them non-hydrophilic so as to avoid interfering with the binding connection.
S103: a plurality of micro-leds are placed in a polar solution.
When the micro light emitting diode 100 is placed in a polar solution, the polar solution may be water, water oil, ethanol, glycerol, propylene glycol, etc. The back surface of the micro light emitting diode 100 is hydrophilic, so that the back surface of the micro light emitting diode 100 faces the surface of the polar solution under the action of the hydrophilic property, and the plurality of micro light emitting diodes 100 can be densely arranged on the surface of the polar solution.
S104: the driving substrate inserted into the polar solution is separated from the polar solution.
This step can be understood by combining fig. 6 and 7, where fig. 6 is a schematic process diagram of the embodiment of the transfer method shown in fig. 5, and fig. 7 is a schematic process diagram of the embodiment of the transfer method shown in fig. 5.
The driving substrate 200 is first inserted in the polar solution during the transfer, and its connection surface 21 forms a right angle as in fig. 6 or an obtuse angle as in fig. 7 with the liquid surface of the polar solution. With the right angle shown in fig. 6, from the production point of view, when the driving substrate 200 is pulled up, the pulling force of the solution on the micro light emitting diode 100 will be stronger, and the micro light emitting diode 100 can be more effectively brought close to the driving substrate 200. The obtuse angle in fig. 7 can ensure that the path of the micro light emitting diode 100 attached to the driving substrate 200 is more gentle, the micro light emitting diode 100 is more easily attached to the driving substrate 200, and the micro light emitting diode 100 is less prone to falling off after being attached to the driving substrate 200.
In order to ensure that the micro light emitting diode 100 can be close to the driving substrate 200, the micro light emitting diode 100 in the solution can be pushed by a pusher while being pulled, so that the micro light emitting diode 100 and the driving substrate are more easily adhered.
When the driving substrate 200 is pulled in the X direction to be separated from the polar solution, the assembly bonding pieces 113 of the micro light emitting diodes 100 in the solution adhere to the assembly bonding blocks 213 of the driving substrate 200 due to the surface tension of the solution, that is, the micro light emitting diodes 100 adhere to the driving substrate 200, and the micro light emitting diodes 100 are densely arranged in the polar solution, so that the adhesion of a plurality of micro light emitting diodes 100 can be realized by pulling at one time.
In order to achieve the stable binding of the micro light emitting diode 100 and the driving substrate 200 during the pulling process, an adhesive 215 is further provided on the surface of the assembly binding block 213, and as shown in fig. 7, after the assembly binding sheet 113 is bound to the assembly binding block 213 by the hydrophilic function, the assembly binding sheet is further firmly bound to the assembly binding block 213 by the adhesive 215. In this embodiment, the binder 214 is selected to be hydrophilic and insoluble in polar solution, and may be specifically a carbohydrate or the like.
In the above-mentioned pulling process, due to the instability of the solution flow, the micro light emitting diode 100 may only be adhered to the driving substrate 200, and the two may not be aligned accurately. Therefore, in the present embodiment, the assembly binding piece 113 and the assembly binding block 213 are designed to have a certain shape, and after the driving substrate 200 is pulled out, the two can be self-aligned by using the capillary action of the polar solution left by hydrophilicity between the two.
Specifically, the assembly binding piece 113 has a rotationally symmetrical shape, a rectangular shape, a triangular shape, an oval shape, an irregular shape, or the like, and the assembly binding block 213 has the same shape as the assembly binding piece 113. The shape arrangement can realize that the micro light emitting diode 100 is bound on the driving substrate 200 in a unique and correct position after the bonding and the alignment of the micro light emitting diode and the driving substrate. To illustrate by way of a counter example, the assembling and bonding sheet 113 is not circular, and when the circular assembling and bonding sheet 113 is bonded and aligned, the micro light emitting diode 100 may be bonded on the driving substrate 200 in various ways, and at this time, precise alignment cannot be achieved.
In this embodiment, a 180-degree rotationally symmetric pattern is preferred, and the 180-degree rotationally symmetric pattern can achieve more accurate and faster self-rotation alignment between the assembly binding sheet 113 and the assembly binding block 213 than other shapes. Specifically, after the assembly binding piece 113 is bound and connected to the driving substrate 200 by the hydrophilic action, due to the uncertainty of the fluid motion, the assembly binding piece 113 and the assembly binding block 213 generally cannot realize completely accurate alignment, and the driving substrate 200 bound and connected to the micro light emitting diode 100 by the hydrophilic action is allowed to stand for a period of time, so that the assembly binding piece 113 and the assembly binding block 213 can move under the capillary action of the liquid therebetween, thereby realizing rapid self-rotation alignment. In the process of standing alignment, the driving substrate 200 bound and connected with the micro light emitting diode 100 can be heated to accelerate the alignment speed and improve the alignment precision.
In this embodiment, the micro light emitting diode 100 is square, and the assembly bonding piece 113 disposed on the back surface 11 is 180 degree rotationally symmetrical, and is located at the center of the square back surface 11, i.e. rotatedCenter of rotation O1Coinciding with the center O of the square back surface, the micro light emitting diode 100 is a symmetrical structure as a whole. In order to ensure the positive and negative electrodes of the micro light emitting diode 100 are correctly connected when the micro light emitting diode is connected to the driving back plate 200, the first electrode sheet 111 and the second electrode sheet 112 cannot be symmetrical to each other, i.e. both of them adopt a self-symmetrical structure.
Specifically, in the present embodiment, two first electrode plates 111 are provided, which are respectively located at two sides of the assembly binding plate 113 and have a relative rotation center O1Are symmetrically arranged. And the second electrode plate 112 is provided with one at a rotation center O of the assembly binding plate 1131A first hollow-out region 114 is formed, and the second electrode sheet 112 is disposed in the first hollow-out region 114.
Correspondingly, the same arrangement is also provided on the driving substrate 200, that is, the assembly bonding sheet 213 is a rotationally symmetrical pattern, and two first electrode blocks 211 are provided, respectively located at two sides of the assembly bonding sheet 213 and opposite to the rotation center O2Are symmetrically arranged. And the second electrode block 212 is provided with one at the rotation center O of the assembly binding block 2132A second hollow-out region 214 is formed, and the second electrode block 212 is disposed in the second hollow-out region 214.
After the micro light emitting diode 100 is bound on the driving substrate 200, the first hollow-out region 114 is involuted with the second hollow-out region 214, the two first electrode sheets 111 are correspondingly connected with the two first electrode blocks 211 one by one, and the second electrode sheets 112 are correspondingly connected with the second electrode blocks 212, so that the alignment of the positive electrode and the negative electrode is ensured.
After step S104, step S105 is performed.
S105: and standing, heating, curing and binding the driving substrate connected with the micro light-emitting diode.
The driving substrate 200 after the step S104 is left standing for a period of time until the moisture is evaporated, and in this process, the first assembly binding sheet 113 and the second assembly binding sheet 213 are further precisely aligned by the capillary action of water, so as to finally achieve precise alignment of the micro light emitting diode and the driving substrate. Referring to fig. 8, fig. 8 is a schematic diagram illustrating a self-alignment process of the micro light emitting diode and the driving substrate in the embodiment of the transfer method shown in fig. 5.
In addition, in this step S105, heating makes the electrode sheet and the electrode block to be firmly connected. For the first electrode block 211, it includes the first conductive layer and the first welding layer, the first welding layer can realize the stable connection of the first electrode sheet 111 and the first electrode block 211 in the heating and curing process of step S105, the first welding layer adopts low melting point metal, and in the heating and curing process, the low melting point metal melts to realize welding. Similarly, the second electrode block 212 also includes a second conductive layer and a second solder layer. The conductive layer may be gold, and the soldering layer may be low-melting point metal such as indium.
In the embodiment of the transferring method shown in fig. 5, the micro light emitting diode 100 is subjected to hydrophilic treatment so that it can be tiled in a polar solution, and the driving substrate 200 is also subjected to hydrophilic treatment correspondingly, so that when the driving substrate 200 is pulled out from the solution, the micro light emitting diode 100 can be adhered to the driving substrate 200 by hydrophilic action, and then the micro light emitting diode 100 is transferred.
Based on the design idea of the transfer method, the application further proposes other schemes, such as
The first scheme is as follows: carrying out hydrophilic treatment on the micro light-emitting diode 100 to enable the micro light-emitting diode to be flatly laid in a polar solution; however, the driving substrate 200 is subjected to a hydrophobic process, and a hydrophobic adhesive is disposed on the driving substrate 200, so that the micro light emitting diode 100 is adhered to the driving substrate 200 by the adhesive.
Scheme II: carrying out hydrophobic treatment on the micro light-emitting diode 100 to enable the micro light-emitting diode to be flatly laid in a nonpolar solution; the driving substrate 200 is subjected to hydrophilic treatment, and a hydrophilic adhesive is provided, so that the micro light emitting diode 100 is adhered to the driving substrate 200 by the adhesive.
The third scheme is as follows: carrying out hydrophobic treatment on the micro light-emitting diode 100 to enable the micro light-emitting diode to be flatly laid in a nonpolar solution; the driving substrate 200 is subjected to a hydrophobic process, and a hydrophobic adhesive is provided such that the micro light emitting diode 100 is adhered to the driving substrate 200 by the adhesive.
Specifically, please refer to fig. 9 for the transfer method of the above three other schemes, and fig. 9 is a schematic flow chart of another embodiment of the transfer method for micro light emitting diodes according to the present application. The present embodiment includes the following steps.
S201: a plurality of micro light emitting diodes and a driving substrate are provided.
The micro light emitting diode 100 and the driving substrate 200 provided in this step are similar to those provided in step S101 of the embodiment shown in fig. 1, and detailed description is omitted.
S202: one of the assembly binding sheet and the assembly binding block is subjected to a hydrophobic treatment, and the other is subjected to a hydrophilic treatment or a hydrophobic treatment.
The hydrophilic treatment is similar to step S102 in the embodiment shown in fig. 1, and details are not repeated. The hydrophobic treatment can also be carried out by soaking with a SAM solution containing hydrophobic groups to form a hydrophobic membrane layer.
S203: an adhesive is disposed on the assembled binding blocks.
In this embodiment, since the hydrophobic arrangement is performed on the assembly bonding sheet 113 or the assembly bonding block 213, when the driving substrate is pulled out in the subsequent step, the bonding between the two is achieved by using an adhesive, and since no solution remains between the two, the self-alignment cannot be achieved by using the capillary action of the solution, the liquid or semi-liquid adhesive used in this embodiment may be further used to achieve the self-alignment.
In order to enable the adhesive in a liquid or semi-liquid state to be adhered to the driving substrate 200 when the driving substrate 200 is inserted into the solution, the hydrophilic and hydrophobic properties of the adhesive provided on the assembly binding blocks 213 are the same as those of the assembly binding blocks 213. Specifically, the hydrophilic binder may be acrylic resin, epoxy resin, or the like, and the hydrophobic binder may be phenoxyethyl acrylate, isobornyl acrylate, or the like.
S204: placing the plurality of micro light emitting diodes in a solution.
In the present embodiment, the micro light emitting diode 100 is suitable for both hydrophilic and hydrophobic properties, and only needs to be matched with a polar or non-polar solution, so that the micro light emitting diode 100 can be laid with the back surface facing the surface of the solution. Namely, the polarity of the solution corresponds to the hydrophilicity and hydrophobicity of the assembled binding sheet 113, the assembled binding sheet 113 is hydrophilic, and the solution is polar solution; the assembly binding sheet 113 is hydrophobic and the solution is a non-polar solution.
S205: the driving substrate inserted into the solution is removed from the solution.
The process of this step S205 is similar to step S104 of the embodiment shown in fig. 1. After this step, the micro light emitting diode 100 in this embodiment is adhered to the driving substrate 200 by the adhesive connection between the assembly bonding sheet 113 and the assembly bonding block 213.
In order to ensure that the micro light emitting diode 100 can be accurately and firmly adhered to the driving substrate 200 in this process, the related structural design of the micro light emitting diode 100 and the driving substrate 200 in the embodiment shown in fig. 1 is also used in this embodiment. Details are not repeated.
Also, in this embodiment, after step S205, step S206 may be further performed: and standing, heating, curing and binding the driving substrate connected with the micro light-emitting diode. Similar to step S105 in the embodiment shown in fig. 1, detailed description is omitted.
In summary, in the embodiment of the transfer method shown in fig. 1 and the embodiment of the transfer method shown in fig. 2, the micro light emitting diode 100 is subjected to hydrophilic treatment or hydrophobic treatment, so that it can be laid in a polar solution or a non-polar solution; then, the driving substrate 200 is subjected to hydrophilic treatment or an adhesive is provided so that when the driving substrate 200 is pulled out of the solution, the micro light emitting diode 100 can be adhered to the driving substrate 200 by the hydrophilic action or the adhesive, and then the micro light emitting diode 100 is transferred.
The display panel of the above embodiment can be manufactured by a huge amount of micro light emitting diodes, so that the manufacturing efficiency is high, and the production cost is low.
The display panel can be applied to a display device, and in this embodiment, a display device is provided, please refer to fig. 10, and fig. 10 is a schematic structural diagram of an embodiment of a micro light emitting diode display device according to the present application.
The display device 500 of the present embodiment includes a display panel 51, and the display panel 51 is similar to the display panels 300 and 400, and detailed description thereof is omitted. The display device 500 may be an electronic device capable of displaying, such as a mobile phone, a computer, a tablet, a television, and the like.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. The miniature light-emitting diode is characterized by comprising a light-emitting surface and a back surface which are opposite, wherein the back surface of the miniature light-emitting diode is provided with a first electrode plate, a second electrode plate and an assembling and binding plate, and a hydrophilic film layer or a hydrophobic film layer is formed on the surface of the assembling and binding plate.
2. The micro light-emitting diode of claim 1, wherein the assembled bonding sheets are in a rotationally symmetric pattern; preferably, the assembled binding pieces are in a 180 degree rotationally symmetric pattern.
3. The micro light-emitting diode of claim 2, wherein the number of the first electrode pads is two, the number of the second electrode pads is one, and a hollow area is formed at a rotation center of the assembly binding sheet;
the second electrode plate is positioned in the hollow area and is rotationally symmetrical with the rotation center of the assembling binding plate; the two first electrode plates are respectively positioned on two sides of the assembling binding sheet and are symmetrically arranged relative to the rotation center of the assembling binding sheet.
4. The micro light-emitting diode display panel is characterized by comprising a driving substrate and a plurality of micro light-emitting diodes arranged on the driving substrate;
the miniature light-emitting diode comprises a light-emitting surface and a back surface which are opposite, the back surface of the miniature light-emitting diode is connected with the driving substrate, and the back surface of the miniature light-emitting diode is provided with a first electrode plate, a second electrode plate and an assembling and binding plate;
a first electrode block, a second electrode block and an assembling and binding block are arranged on the surface of the driving substrate, which is connected with the micro light-emitting diode;
the first electrode plate is connected with the first electrode block, the second electrode plate is connected with the second electrode block, and the assembling binding piece is connected with the assembling binding block;
wherein, hydrophilic film layers are formed on the two surfaces of the assembly binding sheet and the assembly binding block which are mutually connected; or the equipment bind the piece with a surface that the piece interconnect was bound in the equipment is formed with hydrophobic membrane layer, and another surface is formed with hydrophilic membrane layer or hydrophobic membrane layer, the equipment bind the piece with be provided with the adhesive between the equipment binding piece, the hydrophilicity and hydrophobicity of adhesive with the hydrophilicity and hydrophobicity that the piece surface membrane layer was bound in the equipment is the same.
5. The display panel according to claim 4, wherein the assembly bonding block and the assembly bonding sheet have the same shape and are in a rotationally symmetric pattern; preferably a 180 degree rotationally symmetric pattern.
6. The display panel according to claim 5, wherein the number of the first electrode sheets is two, the number of the second electrode sheets is one, and a first hollow-out region is formed at a rotation center of the assembly binding sheet; the second electrode plate is positioned in the first hollow-out area; the two first electrode plates are respectively positioned on two sides of the assembling binding sheet and are symmetrically arranged relative to the rotating center of the assembling binding sheet;
the number of the first electrode blocks is two, the number of the second electrode blocks is one, and a second hollow-out area is formed at the rotating center of the assembling and binding block; the two first electrode blocks are respectively positioned on two sides of the assembling and binding block and are symmetrically arranged relative to the rotating center of the assembling and binding block;
the first hollow areas and the second hollow areas are arranged in an involutory mode, the second electrode plates are connected with the second electrode blocks, and the first electrode plates are connected with the first electrode blocks in a one-to-one corresponding mode.
7. The display panel according to claim 4, further comprising, when hydrophilic film layers are formed on both surfaces of the assembly binding sheet and the assembly binding block, which are connected to each other:
an adhesive is also arranged between the assembly binding sheet and the assembly binding block.
8. The display panel according to claim 4, wherein the first electrode block includes a first conductive layer and a first solder layer, and the first electrode block is connected to the first electrode sheet through the first solder layer;
the second electrode block comprises a second conducting layer and a second welding layer, and the second electrode block is connected with the second electrode plate through the second welding layer.
9. A transfer method of a micro light emitting diode is characterized by comprising the following steps:
providing a plurality of micro light-emitting diodes and a driving substrate; the miniature light-emitting diode comprises a light-emitting surface and a back surface which are opposite, and a first electrode plate, a second electrode plate and an assembling and binding plate are arranged on the back surface; the connecting surface of the driving substrate is provided with a first electrode block, a second electrode block and an assembling and binding block;
carrying out hydrophilic treatment on the assembly binding piece and the assembly binding block;
placing the plurality of micro light-emitting diodes in a polar solution, wherein the back surfaces of the micro light-emitting diodes face to the surface of the polar solution;
and moving the driving substrate inserted with the polar solution away from the polar solution, so that the micro light emitting diode is adhered to the driving substrate through the hydrophilic connection between the assembly binding sheet and the assembly binding block, and the connection surface of the driving substrate forms a right angle or an obtuse angle with the liquid level of the polar solution.
10. A transfer method of a micro light emitting diode is characterized by comprising the following steps:
providing a plurality of micro light-emitting diodes and a driving substrate; the miniature light-emitting diode comprises a light-emitting surface and a back surface which are opposite, and a first electrode plate, a second electrode plate and an assembling and binding plate are arranged on the back surface; the connecting surface of the driving substrate is provided with a first electrode block, a second electrode block and an assembling and binding block;
performing a hydrophobic treatment on one of the assembly binding sheet and the assembly binding block, and performing a hydrophilic treatment or a hydrophobic treatment on the other;
arranging an adhesive on the assembly binding block, wherein the hydrophily and hydrophobicity of the adhesive is the same as that of the assembly binding block;
placing the plurality of micro light-emitting diodes in a solution, the polarity of the solution corresponding to the hydrophilicity and hydrophobicity of the assembled binding sheet, such that the back surfaces of the micro light-emitting diodes face the liquid level of the solution;
and moving the driving substrate inserted into the solution away from the solution, so that the assembly binding sheets on the micro light-emitting diodes are adhered to the driving substrate through the adhesive connection on the assembly binding blocks, and the connection surface of the driving substrate forms a right angle or an obtuse angle with the liquid level of the solution.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811455075.3A CN111261653B (en) | 2018-11-30 | 2018-11-30 | Micro light emitting diode, display panel and transfer method thereof |
| PCT/CN2019/086256 WO2020107811A1 (en) | 2018-11-30 | 2019-05-09 | Micro light-emitting diode, display panel and transferring method therefor |
| KR1020217019453A KR102551062B1 (en) | 2018-11-30 | 2019-05-09 | Micro light emitting diode, display panel and transfer method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811455075.3A CN111261653B (en) | 2018-11-30 | 2018-11-30 | Micro light emitting diode, display panel and transfer method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111261653A true CN111261653A (en) | 2020-06-09 |
| CN111261653B CN111261653B (en) | 2023-08-01 |
Family
ID=70854706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811455075.3A Active CN111261653B (en) | 2018-11-30 | 2018-11-30 | Micro light emitting diode, display panel and transfer method thereof |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102551062B1 (en) |
| CN (1) | CN111261653B (en) |
| WO (1) | WO2020107811A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112993136A (en) * | 2020-08-05 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Light emitting diode chip, display back plate and display back plate assembling method |
| WO2021212540A1 (en) * | 2020-04-20 | 2021-10-28 | 武汉华星光电技术有限公司 | Defective pixel repair method for micro-led chip |
| WO2022151886A1 (en) * | 2021-01-15 | 2022-07-21 | 华为技术有限公司 | Chip transfer method, wafer, and transfer head for grabbing chip |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023171833A1 (en) * | 2022-03-10 | 2023-09-14 | 엘지전자 주식회사 | Display apparatus comprising semiconductor light-emitting elements, and method for producing same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200633084A (en) * | 2005-03-11 | 2006-09-16 | Univ Nat Taiwan | Method for self-assembling microstructure |
| TW201014784A (en) * | 2008-10-09 | 2010-04-16 | Nat Univ Tsing Hua | Microparts and apparatus for self-assembly and alignment of microparts thereof |
| CN103594461A (en) * | 2010-09-01 | 2014-02-19 | 无限科技全球公司 | Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same |
| CN107924033A (en) * | 2015-08-11 | 2018-04-17 | 甲骨文国际公司 | The vertically aligned multi-chip module of self assembly |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100873765B1 (en) * | 2005-09-29 | 2008-12-15 | 파나소닉 주식회사 | Mounting Method and Mounting Device for Electronic Circuit Components |
| CN103582962B (en) * | 2010-09-01 | 2017-03-22 | 无限科技全球公司 | Device for emitting light or generating power |
| JP2018041876A (en) * | 2016-09-08 | 2018-03-15 | スタンレー電気株式会社 | Light emitting device manufacturing method and light emitting device |
| CN107170771B (en) * | 2017-05-23 | 2019-12-24 | 深圳市华星光电技术有限公司 | Packaging structure and packaging method of micro light-emitting diode array substrate |
| CN107170772A (en) * | 2017-05-23 | 2017-09-15 | 深圳市华星光电技术有限公司 | The encapsulating structure of micro- LED array substrate |
-
2018
- 2018-11-30 CN CN201811455075.3A patent/CN111261653B/en active Active
-
2019
- 2019-05-09 WO PCT/CN2019/086256 patent/WO2020107811A1/en active Application Filing
- 2019-05-09 KR KR1020217019453A patent/KR102551062B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200633084A (en) * | 2005-03-11 | 2006-09-16 | Univ Nat Taiwan | Method for self-assembling microstructure |
| TW201014784A (en) * | 2008-10-09 | 2010-04-16 | Nat Univ Tsing Hua | Microparts and apparatus for self-assembly and alignment of microparts thereof |
| CN103594461A (en) * | 2010-09-01 | 2014-02-19 | 无限科技全球公司 | Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same |
| CN107924033A (en) * | 2015-08-11 | 2018-04-17 | 甲骨文国际公司 | The vertically aligned multi-chip module of self assembly |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021212540A1 (en) * | 2020-04-20 | 2021-10-28 | 武汉华星光电技术有限公司 | Defective pixel repair method for micro-led chip |
| US11887899B2 (en) | 2020-04-20 | 2024-01-30 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Repairing method for micro-LED chip defective pixels |
| CN112993136A (en) * | 2020-08-05 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Light emitting diode chip, display back plate and display back plate assembling method |
| WO2022151886A1 (en) * | 2021-01-15 | 2022-07-21 | 华为技术有限公司 | Chip transfer method, wafer, and transfer head for grabbing chip |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020107811A1 (en) | 2020-06-04 |
| KR102551062B1 (en) | 2023-07-05 |
| KR20210088002A (en) | 2021-07-13 |
| CN111261653B (en) | 2023-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111261653A (en) | Micro light emitting diode, display panel and transfer method thereof | |
| CN108493154B (en) | Manufacturing method of Micro LED display panel and Micro LED display panel | |
| KR101261638B1 (en) | vertical interconnect for organic electronic devices | |
| WO2020215856A1 (en) | Chip transfer method, display apparatus, chip and target substrate | |
| US20130092426A1 (en) | Anisotropic conductive film and fabrication method thereof | |
| CN111199907A (en) | Transfer method and transfer apparatus for micro-light emitting device | |
| CN108389785B (en) | Transfer printing substrate, display panel and manufacturing method of display panel | |
| CN109411525A (en) | Flexible display panels and preparation method thereof | |
| US11552058B2 (en) | Method of transferring micro light emitting diodes and display panel | |
| CN109637966A (en) | A kind of transfer method of Micro-LED | |
| CN103904096B (en) | Double-sided OLED display panel and manufacture method | |
| CN111199908A (en) | Transfer method and transfer apparatus for micro-light emitting device | |
| CN112802789B (en) | Transfer method of micro-element | |
| CN108878478A (en) | Flexible display apparatus and its manufacturing method | |
| CN110416242A (en) | Display panel and its manufacturing method | |
| TWI792145B (en) | transfer substrate | |
| CN108767127A (en) | A kind of production method of display panel, display panel and display device | |
| CN110289234B (en) | Mass transfer method for light emitting unit, array substrate and display device | |
| US10971542B2 (en) | Method of forming a semiconductor device | |
| CN112424958B (en) | Method and system for transferring large quantity of micro light-emitting diode | |
| US20230028998A1 (en) | Element transferring method and electronic panel manufacturing method using the same | |
| KR102659865B1 (en) | Display module, method of manufacturing display module | |
| US8247908B2 (en) | Circuit substrate and method for utilizing packaging of the circuit substrate | |
| CN114141804A (en) | Light emitting diode transfer method, light emitting substrate and display panel | |
| CN112310115B (en) | Driving backboard, display panel and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20201217 Address after: No.146 Tianying Road, Chengdu hi tech Zone, Chengdu, Sichuan Province Applicant after: Chengdu CHENXIAN photoelectric Co.,Ltd. Address before: No. 188, CHENFENG Road, Kunshan high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Applicant before: Kunshan New Flat Panel Display Technology Center Co.,Ltd. Applicant before: KunShan Go-Visionox Opto-Electronics Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |