CN111261556A - Receiving device and transfer method for micro light-emitting diode display - Google Patents
Receiving device and transfer method for micro light-emitting diode display Download PDFInfo
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- CN111261556A CN111261556A CN202010063180.3A CN202010063180A CN111261556A CN 111261556 A CN111261556 A CN 111261556A CN 202010063180 A CN202010063180 A CN 202010063180A CN 111261556 A CN111261556 A CN 111261556A
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- 238000012546 transfer Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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Abstract
The invention provides a receiving device for a micro light-emitting diode display, which comprises a bottom electrode, an insulating layer and an opening region, wherein a micro light-emitting diode is transferred to the opening region of the insulating layer through a transfer head; the opening area comprises an initial contraposition part, a guide part and a final staying part which are connected in sequence; the initial alignment part enables the micro light-emitting diode to be initially aligned in the opening region; the guide part enables the micro light-emitting diode to be kept in the opening hole area and to be changed in position; the final stopping part is to make the micro light emitting diode finally keep in the opening area and fixed in position. The receiving device and the transferring method for the micro light-emitting diode display can overcome the position deviation of the micro light-emitting diode in the processes of being absorbed and transferred to the receiving substrate, and realize the position unification on the large-area receiving substrate; the invention has the characteristics of simple structure and strong practicability.
Description
Technical Field
The invention relates to the technical field of miniature light-emitting diodes, in particular to a receiving device and a transfer method for a miniature light-emitting diode display.
Background
With the vigorous development of the display industry, Micro light emitting diodes (Micro LEDs) have been introduced as a new generation of display technology on the stage of the era, and compared with the existing technologies such as OLEDs and LCDs, the Micro LEDs have the characteristics of higher brightness, lower power consumption, better light emitting efficiency, longer service life and the like, but the existing Micro LED technology still has many problems to be solved, and both the process technology, the inspection standard and the production and manufacturing cost have great distance from mass production and commercial application, and the design and manufacturing of the Micro LED display back panel are one of the challenges, including transferring the Micro LEDs to the display back panel, then enabling the Micro LEDs to be tightly combined with the display back panel through various process flows, and then needing packaging and other process flows, thereby realizing the normal display of the Micro LED display back panel.
In the fabrication process of Micro LED display panels, bulk transfer is a critical step. Micro LEDs deviate from the preset position due to various reasons in the huge transfer process of the Micro LEDs, so that the post-processing is difficult to perform.
Disclosure of Invention
The invention aims to provide a receiving device and a transferring method for a micro light-emitting diode display, which overcome the position deviation of a micro light-emitting diode in the processes of being sucked and transferred to a receiving substrate.
The invention provides a receiving device for a micro light-emitting diode display, which comprises a bottom electrode, an insulating layer positioned on the bottom electrode and an opening region formed in the insulating layer, wherein a micro light-emitting diode is transferred to the opening region of the insulating layer through a transfer head; the opening area comprises an initial contraposition part, a guide part and a final staying part which are connected in sequence;
the initial alignment part enables the micro light-emitting diode to be initially aligned in the opening region, and the area of the initial alignment part is larger than that of the micro light-emitting diode to be transferred; the guide part enables the micro light-emitting diode to be kept in the opening hole area and to be changed in position; the final staying part is used for keeping the micro light-emitting diode in the opening area finally and fixing the position, and the size of the final staying part is the same as that of the micro light-emitting diode to be transferred.
Preferably, at least two strip-shaped guide patterns are arranged in the bottom electrode and positioned in the area of the opening, and the strip-shaped guide patterns are positioned among the initial alignment part, the guide part and the final staying part.
Preferably, one end of the strip-shaped guide pattern is located in the initial registration portion, and the other end of the strip-shaped guide pattern is located in the final stay portion.
Preferably, the distance between the micro light emitting diode positioned at the initial alignment part and the edge of the initial alignment part is not more than 10 um.
Preferably, the area of the guide portion is gradually reduced from the initial aligning portion to the final staying portion.
The invention also provides a transfer method for the micro light-emitting diode display, which comprises the following steps:
s1: the transfer head places the micro light-emitting diode in the initial alignment part of the receiving device and enables the lower surface of the micro light-emitting diode to be lower than the upper surface of the insulating layer;
s2: pressing down the transfer head, enabling the strip-shaped guide patterns to adsorb the micro light-emitting diodes so that the transfer head moves from the initial alignment part to the final stay part through the guide part, and enabling the micro light-emitting diodes to move synchronously;
s3: the micro light-emitting diode stays in the final staying part, and the lower surface of the micro light-emitting diode is electrically contacted with the bottom electrode;
s4: the transfer head is transferred away.
The receiving device and the transferring method for the micro light-emitting diode display can overcome the position deviation of the micro light-emitting diode in the processes of being absorbed and transferred to the receiving substrate, and realize the position unification on the large-area receiving substrate; the invention has the characteristics of simple structure and strong practicability.
Drawings
FIG. 1 is a top view of a receiving device for a micro LED display according to the present invention;
FIG. 2 is a cross-sectional view of a receiving device for the micro light emitting diode display shown in FIG. 1;
FIG. 3 is a schematic diagram of a receiver for a micro LED display shown in FIG. 1 with micro LEDs;
FIG. 4 is a process diagram of a transfer method for a micro LED display according to the present invention.
Detailed Description
The present invention is further illustrated by the following figures and specific examples, which are to be understood as illustrative only and not as limiting the scope of the invention, which is to be given the full breadth of the appended claims and any and all equivalent modifications thereof which may occur to those skilled in the art upon reading the present specification.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
The invention relates to a receiving device for a Micro light emitting diode display, as shown in fig. 1 to 3, the receiving device comprises a bottom electrode 1, an insulating layer 2 positioned on the bottom electrode 1 and an opening area 12 formed in the insulating layer, wherein a Micro light emitting diode (Micro LED)100 is transferred to the opening area 12 of the insulating layer 2 of the receiving device through a transfer head 200. The insulating layer 2 may be a single layer or multiple layers in an organic or inorganic insulating layer, and the open region 12 includes an initial aligning portion 10, a guide portion 20, and a final stopping portion 30, which are sequentially connected. Wherein the initial alignment portion 10 makes the Micro light emitting diode (Micro LED)100 initially aligned to the opening region 12, the area of the initial alignment portion 10 is larger than the area of the Micro LED 100 to be transferred, and the distance between the edge of the Micro LED 100 located at the initial alignment portion 10 and the edge of the initial alignment portion 10 is not more than 10 um; the guide portion 20 enables the micro light emitting diode 100 to be kept in the opening region 12 and to change the position, the guide portion 20 is used for connecting the initial aligning portion 10 and the final staying portion 30, and the area of the guide portion 20 is gradually reduced from the initial aligning portion 10 to the final staying portion 30; the final stay portion 30 is to keep the micro light emitting diodes 100 in the opening area 12 and fixed in position, and the size of the final stay portion 30 is the same as that of the micro light emitting diodes 100 to be transferred. At least two strip-shaped guide patterns 11 located in the opening region 12 are disposed in the bottom electrode 1, the strip-shaped guide patterns 11 are located between the initial alignment portion 10, the guide portion 20, and the final stop portion 30, one end of the strip-shaped guide pattern 11 is located in the initial alignment portion 10, the other end of the strip-shaped guide pattern 11 is located in the final stop portion 30, and the micro light emitting diode 100 is fixed from the initial alignment portion 10 to the final stop portion 30 by the strip-shaped guide pattern 11.
The invention also provides a transfer method for the micro light-emitting diode display, as shown in fig. 4, comprising the following steps:
s1: the transfer head 200 places the micro light emitting diodes 100 in the initial alignment portion 10 of the receiving device with the lower surfaces of the micro light emitting diodes 100 lower than the upper surface of the insulating layer 2;
s2: pressing down the transfer head 200, the strip-shaped guide pattern 11 adsorbs the micro light emitting diode 100 so that the transfer head 200 moves from the initial alignment part 10 to the final stay part 20 through the guide part 20, and the micro light emitting diode 100 moves synchronously;
s3: the micro light emitting diode 100 stays in the final stay portion 20, and the lower surface of the micro light emitting diode 100 is electrically contacted with the bottom electrode 1;
s4: the transfer head 200 is transferred away.
The receiving device and the transferring method for the micro light-emitting diode display can overcome the position deviation of the micro light-emitting diode in the processes of being absorbed and transferred to the receiving substrate, and realize the position unification on the large-area receiving substrate; the invention has the characteristics of simple structure and strong practicability.
Although the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the details of the foregoing embodiments, and various equivalent changes (such as number, shape, position, etc.) may be made to the technical solution of the present invention within the technical spirit of the present invention, and these equivalent changes are all within the protection scope of the present invention.
Claims (6)
1. A receiving device for a micro light emitting diode display, the receiving device comprising a bottom electrode, an insulating layer on the bottom electrode, and an open area formed in the insulating layer, a micro light emitting diode being transferred to the open area of the insulating layer by a transfer head; the device is characterized in that the opening area comprises an initial contraposition part, a guide part and a final staying part which are connected in sequence;
the initial alignment part enables the micro light-emitting diode to be initially aligned in the opening region, and the area of the initial alignment part is larger than that of the micro light-emitting diode to be transferred; the guide part enables the micro light-emitting diode to be kept in the opening hole area and to be changed in position; the final staying part is used for keeping the micro light-emitting diode in the opening area finally and fixing the position, and the size of the final staying part is the same as that of the micro light-emitting diode to be transferred.
2. The receiving device for a micro light-emitting diode display according to claim 1, wherein: at least two strip-shaped guide patterns are arranged in the bottom electrode and positioned in the area of the opening, and the strip-shaped guide patterns are positioned among the initial alignment part, the guide part and the final staying part.
3. The receiving device for a micro light-emitting diode display according to claim 2, wherein: one end of the strip-shaped guide pattern is positioned in the initial alignment part, and the other end of the strip-shaped guide pattern is positioned in the final stopping part.
4. The receiving device for a micro light-emitting diode display according to claim 1, wherein: the distance between the micro light-emitting diode positioned at the initial alignment part and the edge of the initial alignment part is not more than 10 um.
5. The receiving device for a micro light-emitting diode display according to claim 1, wherein: the area of the guide portion is gradually reduced from the initial aligning portion to the final staying portion.
6. A transfer method for a micro light emitting diode display is characterized by comprising the following steps:
s1: the transfer head places the micro light-emitting diode in the initial alignment part of the receiving device and enables the lower surface of the micro light-emitting diode to be lower than the upper surface of the insulating layer;
s2: pressing down the transfer head, enabling the strip-shaped guide patterns to adsorb the micro light-emitting diodes so that the transfer head moves from the initial alignment part to the final stay part through the guide part, and enabling the micro light-emitting diodes to move synchronously;
s3: the micro light-emitting diode stays in the final staying part, and the lower surface of the micro light-emitting diode is electrically contacted with the bottom electrode;
s4: the transfer head is transferred away.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010063180.3A CN111261556A (en) | 2020-01-20 | 2020-01-20 | Receiving device and transfer method for micro light-emitting diode display |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010063180.3A CN111261556A (en) | 2020-01-20 | 2020-01-20 | Receiving device and transfer method for micro light-emitting diode display |
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| CN111261556A true CN111261556A (en) | 2020-06-09 |
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| CN202010063180.3A Pending CN111261556A (en) | 2020-01-20 | 2020-01-20 | Receiving device and transfer method for micro light-emitting diode display |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070079571A1 (en) * | 2005-10-07 | 2007-04-12 | Schatz Kenneth D | Methods and apparatuses relating to block receptor configurations and block assembly processes |
| CN107123660A (en) * | 2017-05-27 | 2017-09-01 | 上海天马微电子有限公司 | Micro- light emitting diode growth substrates, display base plate and preparation method, display device |
| US20180138355A1 (en) * | 2011-12-27 | 2018-05-17 | Sharp Laboratories Of America, Inc. | Counterbore Pocket Structure for Fluidic Assembly |
| CN110690143A (en) * | 2019-09-19 | 2020-01-14 | 南京中电熊猫平板显示科技有限公司 | Micro Led huge transfer device and transfer method thereof |
-
2020
- 2020-01-20 CN CN202010063180.3A patent/CN111261556A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070079571A1 (en) * | 2005-10-07 | 2007-04-12 | Schatz Kenneth D | Methods and apparatuses relating to block receptor configurations and block assembly processes |
| US20180138355A1 (en) * | 2011-12-27 | 2018-05-17 | Sharp Laboratories Of America, Inc. | Counterbore Pocket Structure for Fluidic Assembly |
| CN107123660A (en) * | 2017-05-27 | 2017-09-01 | 上海天马微电子有限公司 | Micro- light emitting diode growth substrates, display base plate and preparation method, display device |
| CN110690143A (en) * | 2019-09-19 | 2020-01-14 | 南京中电熊猫平板显示科技有限公司 | Micro Led huge transfer device and transfer method thereof |
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Effective date of registration: 20200908 Address after: No.7 Tianyou Road, Qixia District, Nanjing City, Jiangsu Province Applicant after: NANJING CEC PANDA LCD TECHNOLOGY Co.,Ltd. Address before: Nanjing Crystal Valley Road in Qixia District of Nanjing City Tianyou 210033 Jiangsu province No. 7 Applicant before: NANJING CEC PANDA FPD TECHNOLOGY Co.,Ltd. Applicant before: NANJING CEC PANDA LCD TECHNOLOGY Co.,Ltd. Applicant before: NANJING HUADONG ELECTRONICS INFORMATION & TECHNOLOGY Co.,Ltd. |
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Application publication date: 20200609 |