CN111258385A - Memory module with screen and mainboard module - Google Patents
Memory module with screen and mainboard module Download PDFInfo
- Publication number
- CN111258385A CN111258385A CN201811464819.8A CN201811464819A CN111258385A CN 111258385 A CN111258385 A CN 111258385A CN 201811464819 A CN201811464819 A CN 201811464819A CN 111258385 A CN111258385 A CN 111258385A
- Authority
- CN
- China
- Prior art keywords
- memory
- screen
- module
- power conversion
- conversion module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a memory module with a screen, which comprises a memory substrate, a power conversion module, a screen control module and the screen. The memory substrate includes a plurality of memory devices and a connection interface. The power conversion module is disposed on the memory substrate and electrically connected to the connection interface. The screen control module is arranged on the memory substrate and is electrically connected with the connecting interface and the power supply conversion module. The screen is arranged on the memory substrate, and is electrically connected with the power conversion module and the screen control module so as to receive the voltage output by the power conversion module and the display signal output by the screen control module. The invention further provides a memory module of the motherboard module with a screen.
Description
Technical Field
The present invention relates to a memory module and a motherboard module, and more particularly, to a memory module and a motherboard module with a screen.
Background
In recent years, with the development of technology, desktop computers have become popular. At present, if a user wants to provide more visual effects, some of the motherboards are provided with light emitting devices (such as LEDs), and additional slots are provided to insert the light emitting devices into the slots, so that the light emitting devices directly receive the voltage output from the motherboards.
However, the light emitting device can not provide more functions for users except the effect of light conversion.
Disclosure of Invention
The invention provides a memory module with a screen, which does not occupy a power supply slot on a mainboard and can display text information and images.
The invention provides a mainboard module which comprises the memory module with the screen.
The memory module with the screen comprises a memory substrate, a power conversion module, a screen control module and the screen. The memory substrate includes a plurality of memory devices and a connection interface. The power conversion module is disposed on the memory substrate and electrically connected to the connection interface. The screen control module is arranged on the memory substrate and is electrically connected with the connecting interface and the power supply conversion module. The screen is arranged on the memory substrate, and is electrically connected with the power conversion module and the screen control module so as to receive the voltage output by the power conversion module and the display signal output by the screen control module.
In an embodiment of the invention, the power conversion module and the screen control module are electrically connected to a plurality of pins of the connection interface of the memory substrate.
In an embodiment of the invention, the memory substrate further includes a standard height area and an expansion area, the expansion area is disposed beside the standard height area and is far away from the connection interface, the plurality of memory devices are disposed in the standard height area, and the power conversion module and the screen control module are disposed on the expansion area.
In an embodiment of the invention, the display device further includes a heat sink disposed on the memory substrate and thermally coupled to the plurality of memory devices, the heat sink having a surface, the screen disposed on the surface and thermally coupled to the surface.
In an embodiment of the invention, the display further includes a flexible flat cable respectively connected to the screen and the memory substrate, and the screen is electrically connected to the power conversion module and the screen control module through the flexible flat cable.
The mainboard module comprises a mainboard, a memory module with a screen, a power supply conversion module and a screen control module. The motherboard includes a memory slot. The memory module with the screen is detachably inserted in the memory slot. The memory module with a screen includes a memory substrate and a screen. The memory substrate comprises a plurality of memory elements and connecting interfaces, and the connecting interfaces are detachably inserted into corresponding memory slots. The screen is disposed on the memory substrate. The power conversion module is disposed on the memory substrate and electrically connected to the connection interface, or disposed on the motherboard and electrically connected to the memory socket. The screen control module is arranged on the memory substrate and electrically connected to the connection interface and the power conversion module, or arranged on the mainboard and electrically connected to the memory slot and the power conversion module. When the memory module with the screen is inserted into the memory slot, the screen is electrically connected to the power conversion module and the screen control module to receive the voltage output by the power conversion module and the display signal output by the screen control module.
In an embodiment of the invention, the power conversion module and the screen control module are electrically connected to a plurality of pins of the connection interface of the memory substrate.
In an embodiment of the invention, the memory substrate is configured with a corresponding power conversion module and a corresponding screen control module, the memory substrate further includes a standard height area and an expansion area, the expansion area is configured beside the standard height area and is far away from the connection interface, in each memory substrate, the plurality of memory devices are configured in the standard height area, and the power conversion module and the screen control module are configured on the expansion area.
In an embodiment of the invention, the memory module with a screen further includes a heat dissipation cover disposed on the memory substrate and thermally coupled to the plurality of memory devices, the heat dissipation cover includes a surface, and the screen is disposed on the surface and thermally coupled to the heat dissipation cover.
In an embodiment of the invention, the memory module with the screen further includes a flexible flat cable fixed on the memory substrate, and the screen is electrically connected to the power conversion module and the screen control module by the flexible flat cable.
In an embodiment of the invention, the memory modules with screens include the memory modules with screens, and when the memory modules with screens are inserted into the memory slots, the screens of the memory modules with screens are spliced together to form a combined screen.
Based on the above, the screen of the memory module with a screen of the invention is electrically connected to the power conversion module and the screen control module, and the power conversion module and the screen control module are electrically connected to the connection interface. When the memory module with the screen is inserted into the memory slot, the power conversion module and the screen control module receive signals from the mainboard through the memory slot, the power conversion module converts the voltage from the memory slot into the voltage required by the screen, and the screen control module processes the signals from the memory slot to control the picture displayed by the screen. Therefore, the screen of the memory module with the screen of the invention shares the memory slot on the mainboard with the memory substrate, so the mainboard does not need to have extra slots for supplying power and signals, and the space on the mainboard is saved. In addition, the screen of the memory module with the screen can display text information and images, thereby providing more information and visual effects for users. In addition, in an embodiment, the power conversion module and the screen control module are also selectively disposed on the motherboard and electrically connected to the memory socket, so that the screen of the memory module with the screen can still obtain the required voltage and control signal through the memory socket.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
FIG. 1A is a schematic front view of a memory module with a screen according to an embodiment of the invention.
FIG. 1B is a perspective view of the memory module with a screen of FIG. 1A.
FIG. 2 is a schematic diagram of the memory module with a screen of FIG. 1A being inserted into a motherboard.
FIG. 3 is a schematic diagram of a plurality of memory modules with screens of FIG. 1A being inserted into a motherboard.
FIG. 4 is a schematic front view of a memory module with a screen according to another embodiment of the invention.
FIG. 5A is a schematic front view of a memory module with a screen according to another embodiment of the invention.
FIG. 5B is a perspective view of a memory module with a screen according to FIG. 5A.
FIG. 6 is a schematic perspective view of a memory module with a screen according to another embodiment of the invention.
FIG. 7 is a schematic front view of a memory module with a screen according to another embodiment of the invention.
Fig. 8 is a schematic diagram of a motherboard module according to another embodiment of the invention.
Wherein, the reference numbers:
10. 10C: motherboard module
11. 11C: main machine board
11 a: memory socket
100. 100A, 100B, 100C: memory module with screen
110. 110A, 110B, 110C: memory substrate
111: memory device
112: connection interface
120. 120C: power supply conversion module
130. 130C: screen control module
140: screen
150: flexible flat cable
160: heat radiation cover
A1: standard height zone
A2: expansion area
B: clamp
R, L: side surface
S: combined screen
Detailed Description
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
FIG. 1A is a diagram of a memory module with a screen according to an embodiment of the invention. FIG. 1B is a perspective view of the memory module with a screen of FIG. 1A. Referring to fig. 1A to 1B, a memory module 100 with a screen includes a memory substrate 110, a power conversion module 120, a screen control module 130 and a screen 140, wherein the memory substrate 110 includes a plurality of memory devices 111 and a connection interface 112. Here, the connection interface 112 is, for example, a gold finger connection interface, but not limited thereto.
In the embodiment, the power conversion module 120 is disposed on the memory substrate 110 and electrically connected (shown by a dotted line) to the connection interface 112. The screen control module 130 is disposed on the memory substrate 110 and electrically connected to the connection interface 112 and the power conversion module 120. The screen 140 is disposed on the memory substrate 110, and the screen 140 is electrically connected to the power conversion module 120 and the screen control module 130 to receive the voltage output by the power conversion module 120 and the display signal output by the screen control module 130.
Referring to fig. 1B, in the present embodiment, the power conversion module 120 and the screen control module 130 are disposed on a side surface R of the memory substrate 110 that is the same as the memory elements 111, but not limited thereto, as long as the elements on the memory substrate 110 do not interfere with each other, the power conversion module 120 and the screen control module 130 may be disposed on the other side surface L of the memory substrate 110, or the power conversion module 120 and the screen control module 130 may be separately disposed on two side surfaces R, L on the memory substrate 110.
In detail, the power conversion module 120 includes an integrated circuit, a passive device, a boost circuit, a buck circuit, or a combination thereof (not shown), and the power conversion module 120 converts an initial voltage from the connection interface 112 into a converted voltage, which is provided to the screen 140 and the screen control module 130, wherein the initial voltage is, for example, 0.6 volts, 1.2 volts, or 2.5 volts, and the converted voltage is, for example, 3.3 volts or a total voltage of the screen 140 and other integrated circuits.
The reason why the memory module 100 having a screen is provided with the power conversion module 120 is that the initial voltage from the connection interface 112 can be used only by the memory substrate 110 and cannot be directly supplied to the screen 140. Generally, if an additional socket is required to provide power to the external screen to provide a suitable voltage to the external screen, the motherboard to which the memory module 100 with a screen of the present embodiment is applied does not need to additionally provide an electrical socket dedicated to the screen 140, and the memory module 100 with a screen of the present embodiment can directly convert the initial voltage into a suitable voltage by the power conversion module 120 to be used by the screen 140 and the screen control module 130, so as to save the space configuration on the motherboard.
In this embodiment, the screen control module 130 includes an integrated circuit, a passive component, a boost circuit, a buck circuit, or a combination thereof (not shown), and the screen control module 130 receives the voltage provided by the power conversion module 120 and is electrically connected to a Data line (SDA) and a Clock line (SCL) of the connection interface 112 to obtain the signal from the motherboard. The motherboard can operate the display signal provided by the screen control module 130 to the screen 140 through software or an application program, for example, the display information and the display graphics are switched by the software or the application program, so as to provide more functionality and entertainment for the user.
It should be noted that, in general, a pin (pin) on the connection interface 112 of the golden finger structure of the memory substrate 110 is left with an empty pin (i.e., an undefined pin). In the present embodiment, the power conversion module 120 and the screen control module 130 are electrically connected to the memory slot on the motherboard by using the pin of the connecting interface 112 with a golden finger structure. Here, the empty pin is, for example, the pin number 47, 49, 54, 56, 93, 192, 194, 196, 197, 199, 201, 230, 234, 235 or 237 on the connection interface 112 of the gold finger structure. In this way, the memory substrate 110 of the memory module 100 with the screen can still use the original pins to transmit the memory signals, and the signal transmission of the power conversion module 120 and the screen control module 130 does not affect the transmission of the original memory signals.
In addition, in the embodiment, the memory module 100 with a screen is selected from a memory substrate 110 of a general industrial Grade (Industry Grade), the height of the memory module is, for example, between 1.1 inches and 1.2 inches, and the memory devices 111 are disposed on the memory substrate 110 closer to the connection interface 112 than the power conversion module 120 and the screen control module 130. That is, the memory devices 111 are moved down to a position close to the connection interface 112, and the power conversion module 120 and the screen control module 130 are disposed above the memory devices 111 and close to the screen 140. Of course, the configurations of the memory device 111, the power conversion module 120 and the screen control module 130 are not limited thereto, as long as the devices on the memory substrate 110 do not interfere with each other, and the configurations of the memory device 111, the power conversion module 120 and the screen control module 130 can be adjusted according to the manufacturing process requirements.
In addition, the memory module 100 with a screen further includes a flexible flat cable 150, and the flexible flat cable 150 is fixed to the memory substrate 110 by, for example, a fastening, embedding, or bonding, which is not limited thereto. The flexible flat cable 150 is electrically connected to the screen 140 and the memory substrate 110 through the wires not exposed inside the flexible flat cable 150, and the screen 140 can be electrically connected to the power conversion module 120 and the screen control module 130 through the flexible flat cable 150. In other embodiments, the screen 140 may also be directly electrically connected to the power conversion module 120 and the screen control module 130 without the flexible flat cable 150, and the manner of electrically connecting the screen 140 to the power conversion module 120 and the screen control module 130 is not limited thereto.
FIG. 2 is a schematic diagram of the memory module with a screen of FIG. 1A being inserted into a motherboard. Referring to fig. 2, the motherboard module 10 includes a motherboard 11 and a memory module 100 having a screen. The motherboard 11 includes a memory slot 11a, and the connection interface 112 of the memory module 100 with a screen is detachably inserted in the memory slot 11a, it should be noted that fig. 2 only schematically illustrates four memory slots 11a, and actually, the number of the memory slots 11a may also be two or eight, and is not limited thereto.
In the embodiment, when the memory module 100 with a screen is inserted into the memory slot 11a, the power conversion module 120 and the screen control module 130 receive signals from the motherboard 11 through the memory slot 11a, the power conversion module 120 converts the voltage from the memory slot 11a into a voltage required by the screen 140, and the screen control module 130 processes the signals from the memory slot 11a to control the image displayed by the screen 140. Therefore, the screen 140 can display text information or images, such as the operating frequency or the operating temperature of a Central Processing Unit (CPU), so as to provide more functionality for the user.
FIG. 3 is a schematic diagram of a plurality of memory modules with screens of FIG. 1A being inserted into a motherboard. Referring to fig. 3, when a plurality of (for example, four) memory modules 100 with screens are inserted into the memory slots 11a, the four screens 140 of the four memory modules 100 with screens are spliced together to form a combined screen S, and the combined screen S can display large-area text information or images.
Other examples will be listed below for illustration. It should be noted that the following embodiments follow the reference numerals and parts of the contents of the foregoing embodiments, wherein the same reference numerals are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
FIG. 4 is a schematic front view of a memory module with a screen according to another embodiment of the invention. Referring to fig. 4, fig. 4 is slightly different from the memory module with a screen of fig. 1A to 1B in the height of the memory substrate, in the embodiment, the memory substrate 110A is formed after the memory substrate 110 is raised, and the memory module with a screen 100A has a wider space, so that the elements on the memory substrate 110A can be arranged on the memory substrate 110A with less limitation of space.
Specifically, the memory substrate 110A further includes a standard height area a1 and an expansion area a2, the expansion area a2 is disposed beside the standard height area a1 and away from the connection interface 112, the sum of the heights of the standard height area a1 and the expansion area a2 is greater than 1.2 inches, the memory devices 111 are disposed in the standard height area a1, and the power conversion module 120 and the screen control module 130 are disposed in the expansion area a2, although the configurations of the memory devices 111, the power conversion module 120 and the screen control module 130 are not limited thereto, as long as the devices on the memory substrate 110A do not interfere with each other, and the memory devices are within the protection scope of the present invention.
FIG. 5A is a schematic front view of a memory module with a screen according to another embodiment of the invention. FIG. 5B is a perspective view of a memory module with a screen according to FIG. 5A. Referring to fig. 5A and 5B, the memory module with a screen 100B further includes a heat dissipation cover 160 compared to the memory modules with screens 100 and 100A, in this embodiment, the memory module with a screen 100B clamps the heat dissipation cover 160 on the memory substrate 110B by using the clip B, but not limited thereto, in other embodiments, the memory module with a screen 100B may also fix the heat dissipation cover 160 on the memory substrate 110B by using an adhesive manner without using the clip B. The heat sink cover 160 is disposed on the memory substrate 110B and thermally coupled to the memory devices 111. it should be noted that the memory devices 111 are covered by the heat sink cover 160, and thus the memory devices 111 cannot be seen in fig. 5A and 5B.
As shown in fig. 5A, the heat sink 160 has a surface S, the screen 140 is disposed on the surface S, and the screen 140 is thermally coupled to the surface S. That is, the heat dissipation cover 160 has the function of simultaneously helping the heat dissipation of the memory devices 111 and the screen 140. In this embodiment, the surface S is, for example, a top surface of the heat dissipation cover 160, but not limited thereto, and in other embodiments, the surface S may also be a side surface of the heat dissipation cover 160.
Fig. 6 is a schematic perspective view of a memory module with a screen according to another embodiment of the present invention, referring to fig. 6, in this embodiment, a surface S is a side surface of a heat dissipation cover 160, and the screen 140 is disposed on the surface S of the heat dissipation cover 160.
It should be noted that the memory module with a screen in fig. 5A, 5B or 6 may also include a flexible flat cable 150, in this embodiment, the flexible flat cable 150 may also be fixed on the heat dissipation cover 160 in a manner such as, but not limited to, engaging, embedding or bonding, and the manner of fixing the flexible flat cable 150 on the memory substrate is within the scope of the present invention to be protected.
FIG. 7 is a schematic front view of a memory module with a screen according to another embodiment of the invention. Fig. 8 is a schematic diagram of a motherboard module according to another embodiment of the invention. Referring to fig. 7 and 8, the main difference between the motherboard module 10C and the motherboard module 10 is that the power conversion module 120C and the screen control module 130C are both disposed on the motherboard 11C.
In this embodiment, a memory module 100C having a screen can be inserted into one of the memory slots 11 a. The power conversion module 120C is disposed on the motherboard 11C and electrically connected to the memory socket 11 a. The screen control module 130C is disposed on the motherboard 11C and electrically connected to the memory slot 11a and the power conversion module 120C.
In this embodiment, the power conversion module 120C converts the initial voltage from the line of the host board 11C into a conversion voltage required by the screen 140, and the conversion voltage is supplied to the screen 140 through one of the pins on the connection interface 112. That is, in the embodiment, the voltage of the empty pin is the voltage required by the screen 140, and compared to the implementation mode of the motherboard module 10 in which the power conversion module 120C and the screen control module 130C are disposed on the memory substrate 110C, the advantage of the embodiment is that the memory manufacturer does not need to change the design of the memory substrate 110C significantly, and only needs to dispose the screen 140 on the memory substrate 110C.
Fig. 8 only schematically illustrates four memory slots 11a, four power conversion modules 120C and four screen control modules 130C, and actually, the number of the memory slots 11a may be two or eight, but not limited thereto, and the number of the power conversion modules 120C and the screen control modules 130C is configured according to the number of the corresponding memory modules 100C with screens.
When a plurality of (for example, four) memory modules 100C with screens are inserted into the memory slots 11a, the four screens 140 of the four memory modules 100C with screens are spliced together to form a combined screen S as shown in fig. 3, and the combined screen S can display text information or images.
In summary, the screen of the memory module with a screen of the present invention is electrically connected to the power conversion module and the screen control module, and the power conversion module and the screen control module are electrically connected to the connection interface. When the memory module with the screen is inserted into the memory slot, the power conversion module and the screen control module receive signals from the mainboard through the memory slot, the power conversion module converts the voltage from the memory slot into the voltage required by the screen, and the screen control module processes the signals from the memory slot to control the picture displayed by the screen. Therefore, the screen of the memory module with the screen of the invention shares the memory slot on the mainboard with the memory substrate, so the mainboard does not need to have extra slots for supplying power and signals, and the space on the mainboard is saved. In addition, the screen of the memory module with the screen can display text information and images, thereby providing more information and visual effects for users. In addition, in an embodiment, the power conversion module and the screen control module are also selectively disposed on the motherboard and electrically connected to the memory socket, so that the screen of the memory module with the screen can still obtain the required voltage and control signal through the memory socket. In addition, the user can operate the screen control module by software or application programs so as to provide more diversified functionalities for the user. Therefore, the memory module with the screen can provide more information and entertainment for users without increasing the burden of the space allocation of the mainboard.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (11)
1. A memory module having a screen, comprising:
a memory substrate including a plurality of memory devices and a connection interface;
a power conversion module disposed on the memory substrate and electrically connected to the connection interface;
a screen control module, configured on the memory substrate and electrically connected to the connection interface and the power conversion module; and
and the screen is arranged on the memory substrate and is electrically connected with the power supply conversion module and the screen control module so as to receive the voltage output by the power supply conversion module and the display signal output by the screen control module.
2. The memory module with a screen of claim 1, wherein the power conversion module and the screen control module are electrically connected to the plurality of pins of the connection interface of the memory substrate.
3. The memory module of claim 1, wherein the memory substrate further comprises a standard height area and an expansion area, the expansion area is disposed beside the standard height area and away from the connection interface, the memory devices are disposed in the standard height area, and the power conversion module and the screen control module are disposed on the expansion area.
4. The memory module with screen of claim 1, further comprising:
a heat sink disposed on the memory substrate and thermally coupled to the memory devices, the heat sink having a surface, the screen disposed on the surface and thermally coupled to the surface.
5. The memory module with screen of claim 1, further comprising:
the flexible flat cable is respectively connected with the screen and the memory substrate, and the screen is electrically connected with the power conversion module and the screen control module through the flexible flat cable.
6. A motherboard module, comprising:
a motherboard including a plurality of memory slots;
at least one memory module with a screen, which is detachably inserted into at least one of the memory slots, comprises:
at least one memory substrate, each memory substrate including a plurality of memory devices and a connection interface detachably inserted into the corresponding memory slot; and
at least one screen disposed on the at least one memory substrate;
at least one power conversion module, which is disposed on the at least one memory substrate and electrically connected to the connection interface, or disposed on the motherboard and electrically connected to at least one of the memory slots; and
at least one screen control module disposed on the at least one memory substrate and electrically connected to the connection interface and the at least one power conversion module, or disposed on the motherboard and electrically connected to at least one of the memory slots and the at least one power conversion module, wherein the screen control module is disposed on the at least one memory substrate and electrically connected to the connection interface and the at least one power conversion module
When the at least one memory module with the screen is inserted into at least one of the memory slots, the at least one screen is electrically connected to the at least one power conversion module and the at least one screen control module to receive the voltage output by the at least one power conversion module and the display signal output by the at least one screen control module.
7. The motherboard module as recited in claim 6 wherein the at least one power conversion module and the at least one screen control module are electrically connected to the plurality of pins of the connection interface of the at least one memory substrate.
8. The motherboard module as recited in claim 6 wherein each of the memory substrates is configured with a corresponding power conversion module and a corresponding screen control module, each of the memory substrates further comprises a standard height area and an expansion area, the expansion area is configured beside the standard height area and is far away from the connection interface, in each of the memory substrates, the memory elements are configured in the standard height area, and the power conversion module and the screen control module are configured on the expansion area.
9. The motherboard module as recited in claim 6 wherein the at least one memory module with a screen further comprises:
at least one heat dissipation cover disposed on the at least one memory substrate and thermally coupled to the memory devices, wherein the at least one heat dissipation cover includes at least one surface, and the at least one screen is disposed on the at least one surface and thermally coupled to the at least one heat dissipation cover.
10. The motherboard module as recited in claim 6 wherein the at least one memory module with a screen further comprises:
at least one flexible flat cable fixed on the at least one memory substrate, wherein the at least one screen is electrically connected with the at least one power conversion module and the at least one screen control module through the at least one flexible flat cable.
11. The motherboard module as recited in claim 6 wherein the at least one memory module with a screen comprises a plurality of memory modules with screens, and when the memory modules with screens are inserted into the memory slots, the screens of the memory modules with screens are spliced together to form a combined screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811464819.8A CN111258385B (en) | 2018-12-03 | 2018-12-03 | Memory module with screen and mainboard module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811464819.8A CN111258385B (en) | 2018-12-03 | 2018-12-03 | Memory module with screen and mainboard module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111258385A true CN111258385A (en) | 2020-06-09 |
| CN111258385B CN111258385B (en) | 2023-03-17 |
Family
ID=70946931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811464819.8A Active CN111258385B (en) | 2018-12-03 | 2018-12-03 | Memory module with screen and mainboard module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111258385B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894057A (en) * | 2009-05-18 | 2010-11-24 | 鸿富锦精密工业（深圳）有限公司 | Main board diagnostic card |
| CN102270164A (en) * | 2010-06-01 | 2011-12-07 | 鸿富锦精密工业（深圳）有限公司 | Fault diagnosis card of computer main board |
| CN202331310U (en) * | 2011-11-07 | 2012-07-11 | 浪潮电子信息产业股份有限公司 | Multifunctional memory installing device |
| CN103793303A (en) * | 2012-11-01 | 2014-05-14 | 谢强 | Memory module test card based on computer mainboard |
| CN104597978A (en) * | 2015-01-22 | 2015-05-06 | 宇帷国际股份有限公司 | Electronic device and circuit module thereof |
| CN205230594U (en) * | 2015-12-01 | 2016-05-11 | 宇帷国际股份有限公司 | Dynamic random access memory body |
| US20170339465A1 (en) * | 2016-05-18 | 2017-11-23 | copper studios, inc. | Viewing habit influenced clip and sequence selection in an individualized video delivery system |
| CN107454703A (en) * | 2016-05-30 | 2017-12-08 | 宇瞻科技股份有限公司 | Light-emitting device and its control method |
-
2018
- 2018-12-03 CN CN201811464819.8A patent/CN111258385B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894057A (en) * | 2009-05-18 | 2010-11-24 | 鸿富锦精密工业（深圳）有限公司 | Main board diagnostic card |
| CN102270164A (en) * | 2010-06-01 | 2011-12-07 | 鸿富锦精密工业（深圳）有限公司 | Fault diagnosis card of computer main board |
| CN202331310U (en) * | 2011-11-07 | 2012-07-11 | 浪潮电子信息产业股份有限公司 | Multifunctional memory installing device |
| CN103793303A (en) * | 2012-11-01 | 2014-05-14 | 谢强 | Memory module test card based on computer mainboard |
| CN104597978A (en) * | 2015-01-22 | 2015-05-06 | 宇帷国际股份有限公司 | Electronic device and circuit module thereof |
| CN205230594U (en) * | 2015-12-01 | 2016-05-11 | 宇帷国际股份有限公司 | Dynamic random access memory body |
| US20170339465A1 (en) * | 2016-05-18 | 2017-11-23 | copper studios, inc. | Viewing habit influenced clip and sequence selection in an individualized video delivery system |
| CN107454703A (en) * | 2016-05-30 | 2017-12-08 | 宇瞻科技股份有限公司 | Light-emitting device and its control method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111258385B (en) | 2023-03-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6731515B2 (en) | Riser assembly and method for coupling peripheral cards to a motherboard | |
| US6672896B1 (en) | Built-in KVM switch | |
| EP1134669B1 (en) | Incremental bus structure for modular electronic equipment | |
| US7362589B2 (en) | Circuit board adapted to couple to different types of add-in cards | |
| US9069929B2 (en) | Arbitrating usage of serial port in node card of scalable and modular servers | |
| KR20040070073A (en) | An improved usb memory storage apparatus | |
| US20190204882A1 (en) | Computer System And Its Power Adapter Having Input / Output Connection Interfaces | |
| US7354275B2 (en) | Graphics card connector module, and motherboard device having the same | |
| TWI391058B (en) | Mainboard and portable electronic device using the same | |
| US20100265644A1 (en) | Interface card socket and circuit board module having the same | |
| US20120194983A1 (en) | External device | |
| TWI654521B (en) | Lighting fake card module | |
| CN111258385B (en) | Memory module with screen and mainboard module | |
| US20100220449A1 (en) | Circuit board module and i/o port collection board thereof | |
| US20080301346A1 (en) | Mother board module and personal computer host using the same | |
| EP3663892B1 (en) | Memory module with screen and motherboard module | |
| TWM568993U (en) | Function module board | |
| KR100499585B1 (en) | Union type main board | |
| US20030016488A1 (en) | Multi-function portdock | |
| TWI823458B (en) | Electronic device | |
| TWI687796B (en) | Portable electronic apparatus with a main body module and related expansion module | |
| JPH01283939A (en) | Semiconductor chip and substrate and electronic apparatus constituted with these parts | |
| US20060291180A1 (en) | PCI mezzanine card | |
| RU157111U1 (en) | UNIFIED ELECTRONIC MODULE OF INFORMATION-COMPUTING SYSTEMS | |
| US20110235258A1 (en) | Notebook computer and motherboard module thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |