CN104597978A - Electronic device and circuit module thereof - Google Patents
Electronic device and circuit module thereof Download PDFInfo
- Publication number
- CN104597978A CN104597978A CN201510032275.8A CN201510032275A CN104597978A CN 104597978 A CN104597978 A CN 104597978A CN 201510032275 A CN201510032275 A CN 201510032275A CN 104597978 A CN104597978 A CN 104597978A
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- Prior art keywords
- circuit
- circuit module
- circuit board
- substrate
- electrically connected
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention relates to an electronic device and a circuit module thereof. The circuit module is electrically connected with a circuit substrate unit, the circuit substrate unit comprises a power output end, the circuit module comprises a substrate, a step-up circuit and a plasmatron, the substrate is provided with at least one through hole, and the substrate is used for connection with the circuit substrate unit in a direction opposite to the thickness side; the step-up circuit, which is arranged on the substrate, comprises at least one conductive circuit and a plurality of electronic elements electrically connected with the conductive circuit, the conductive circuit comprises a power input end capable of electrically connecting with the power output end and two power output ends, and the electronic elements are inserted in the through holes; the two opposite ends of the plasmatron are provided with electrodes which are electrically connected with the power output ends. The electronic device comprises the circuit module and the circuit substrate unit electrically connected with the circuit module, and the circuit substrate unit is connected with the substrate of the circuit module in a direction opposite to the thickness side. When plugged in a mainboard, the electronic device does not easily occupies a space, so that more electronic devices can be plugged in the mainboard.
Description
Technical field
The present invention is about a kind of electronic installation and circuit module thereof.
Background technology
The circuit module of general electronic installation comprises a circuit substrate, plural electronic component and a Port, some electronic components are directly welded on circuit substrate, Port and circuit substrate are electrically connected and can be connected to computer motherboard, thus, when circuit module is connected on motherboard, the power supply road module that can transmit motherboard uses.Namely circuit module disclosed by TaiWan, China patent M456042 belongs to this type of.
But the electronic component of this type of circuit module is directly sticky to be located on circuit substrate, and wherein some electronic component thickness is comparatively large unavoidably, when it is located on substrate, circuit module will be caused blocked up; In addition, the spacing distance of the slot of each motherboard has specific standard, therefore the electronic installation plugged must meet its thickness limits, if circuit module is covered other shells in addition, when again circuit module being plugged in motherboard, extremely will take up space, cause part slot to leave unused.Therefore, be necessary to provide a kind of novelty and there is electronic installation and the circuit module thereof of progressive, to solve the problem.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of electronic installation and circuit module thereof, the substrate of this circuit module has at least one perforation, at least one electronic component is arranged in this perforation, thus, integral thickness can be reduced, and when making it be inserted in motherboard, more not easily take up space, and make more electronic installation be inserted in motherboard.
For reaching above-mentioned purpose, the present invention by the following technical solutions:
A kind of circuit module, this circuit module is for being electrically connected with a circuit board device, and this circuit board device comprises a power output end portion, and this circuit module comprises a substrate, a booster circuit and a piasmatron; This substrate has at least one perforation, and this substrate is for engaging with the direction of thickness side subtend with this circuit board device; This substrate is located at by this booster circuit, and this booster circuit comprises the electronic component that at least one conducting wire and plural number and this at least one conducting wire are electrically connected, this at least one conducting wire comprises the power input portion supplying to be electrically connected with this power output end portion and two power output ends, and this electronic component at least one is arranged in this perforation; The opposite end of this piasmatron has two electrodes be electrically connected with this two power output end.
Further,
Each electrode comprises one, and to be positioned at described piasmatron inner and be the electrode cap cylinder of hollow, and two electrode cap cylinders are arranged in coaxial.
Described power input portion supplies to be electrically connected with the memory body being provided with described power output end portion, display card, networking card or printed circuit board (PCB).
Described plural electronic component comprises plural passive device and at least one transformer, be electrically connected the low pressure booster circuit that formation one is electrically connected described power input portion between this plural passive device, this at least one transformer formation one is electrically connected at the high voltage step-up circuit between this low pressure booster circuit and described two power output ends.
Described plural electronic component also comprises a processing unit, and this processing unit comprises the frequency changer circuit of an electric connection described power input portion and described low pressure booster circuit.
For reaching above-mentioned purpose, the present invention also provides a kind of electronic installation, comprise a foregoing circuit module, also comprise a circuit board device be electrically connected with this circuit module, this circuit board device engages with the direction of thickness side subtend with the substrate of this circuit module.
Further,
Described circuit board device also comprises one for the electrical insert row with the electrical grafting of electrical slot of computer motherboard, and this electrical insert row is located at the side of described circuit board device relative to described circuit module.
At least one bridgeware is also connected with between described circuit board device and the substrate of circuit module, the thickness side that described circuit board device engages with the substrate of circuit module crossed over by each bridgeware, and the two ends of each bridgeware are fixed in the substrate of described circuit board device and circuit module respectively.
Electronic installation also comprises two heat radiator, and this two heat radiator covers the relative both sides in described electronic installation respectively.
Electronic installation also comprises at least one shells, and this shells is halved together in the side of described electronic installation abreast with a wherein heat radiator.
The invention has the advantages that:
Circuit module of the present invention has at least one perforation, and at least one electronic component is arranged in this perforation, can reduce integral thickness, and when making it be inserted in motherboard, more not easily takes up space, and more electronic installation can be made can be inserted on motherboard.
Accompanying drawing explanation
Fig. 1 is the electronic installation stereographic map of a preferred embodiment of the present invention.
Fig. 2 is the electronic installation exploded view of a preferred embodiment of the present invention.
Fig. 3 is circuit module and the circuit board device constitutional diagram of a preferred embodiment of the present invention.
Fig. 4 is the circuit module structural relation calcspar of a preferred embodiment of the present invention.
Fig. 5 is the electronic installation partial enlarged drawing of a preferred embodiment of the present invention.
Embodiment
Below only with embodiment, the embodiment that the present invention is possible is described, so and be not used to limit the present invention institute for the category protected, states in advance.
Please refer to Fig. 1 to 4, it shows a preferred embodiment of the present invention, circuit module 1 of the present invention is for being electrically connected with a circuit board device 40, and this circuit board device 40 comprises a power output end portion 200, and circuit module 1 comprises substrate 10, booster circuit 20 and a piasmatron 30.Furtherly, the low-tension supply that circuit board device inputs can be converted to High Level AC Voltage or high-voltage pulse type direct current by booster circuit 20, uses, and make piasmatron 30 produce a plurality of lightning shape light to supply piasmatron 30.
Substrate 10 has at least one perforation 100, and electronic component wears wherein; Substrate 10 is for engaging with the direction of thickness side subtend with circuit board device 40.In the present embodiment, substrate 10 has plural perforation 100, can be arranged in each perforation 100 for each electronic component; Will be understood that also can only have a perforation and have plural electronic component to wear wherein; Also or, substrate only has a perforation, and the electronic component comparatively taken up space plugs wherein.
Substrate 10 is located at by booster circuit 20, and booster circuit 20 comprises the electronic component 202 that at least one conducting wire and plural number and at least one conducting wire are electrically connected, at least one conducting wire comprises the power input portion 201 supplying to be electrically connected with power output end portion 200 and two power output ends 23, and at least one electronic component 202 is arranged in perforation 100.More particularly, conducting wire is embedded in substrate 10, and in the present embodiment, substrate 10 and conducting wire form a printed circuit board (PCB); Certain conducting wire can also other forms be located on substrate.Furtherly, the low-voltage DC inputted by power input portion 201 can be converted to High Level AC Voltage by booster circuit 20, and supplies piasmatron 30 via two power output ends 23 and use; Will be understood that, low-voltage DC also can be converted to high-voltage pulse type direct current by booster circuit 20.In the present embodiment, power input portion 201, for being electrically connected with the memory body (circuit board device 40) being provided with power output end portion 200, does not take up space after memory body (circuit board device 40) can be made to engage with circuit module 1; Certain power input portion also can supply to be electrically connected with the display card being provided with power output end portion, networking card or printed circuit board (PCB).
More particularly, plural number electronic component 202 comprises plural passive device 210 and at least one transformer 220, be electrically connected the low pressure booster circuit 21 that formation one is electrically connected power input portion 201 between plural number passive device 210, the direct current that circuit board device 40 provides can be converted to alternating current or pulse DC electricity.At least one transformer 220 forms one and is electrically connected at high voltage step-up circuit 22 between low pressure booster circuit 21 and two power output ends 23, low-tension supply can be converted to high-voltage power supply, use to supply piasmatron 30.
In more detail, plural number electronic component 202 also comprises a processing unit 24, this processing unit 24 comprises the frequency changer circuit 240 of an electric connection power input portion 201 and low pressure booster circuit 21, the Power convert can by frequency changer circuit 240 with first frequency is a power supply with second frequency, furtherly, by the switching of frequency, piasmatron 30 can be made to produce the light of different disturbance effect.
The opposite end of piasmatron 30 has the electrode 31 that two and two power output ends 23 are electrically connected.In more detail, there is in piasmatron 30 inert gas of low pressure, and be coated with fluorescent material in the inwall of piasmatron 30, when passing to high-tension electricity, inert gas can be made to dissociate and produce fulgurans light.More particularly, each electrode 31 comprises one, and to be positioned at piasmatron 30 inner and be the electrode cap cylinder 310 of hollow, two electrode cap cylinders 310 are all arranged in coaxial, light can be penetrated along electrode cap cylinder 310 periphery, and make light comparatively disperse (as shown in Figure 5), compared to the concentrated light that traditional filament electrode produces, have more aesthetic property.
The present invention also provides a kind of electronic installation 2, comprise a foregoing circuit module 1, also comprise a circuit board device 40 be electrically connected with circuit module 1, circuit board device 40 engages with the direction of thickness side subtend with the substrate 10 of circuit module 1, in the present embodiment, circuit board device 40 is memory body, and certain circuit board device also can be display card, networking card or printed circuit board (PCB); The substrate of certain circuit module and circuit board device also can be formed in one.
Circuit board device 40 also comprises one for the electrical insert row 41 with the electrical grafting of an electrical slot of a computer motherboard, electrical insert row 41 is located at the side of circuit board device 40 relative to circuit module 1, will be understood that, electrical insert row 41 can be and meets peripheral component connection interface (Peripheral ComponentInterconnect, PCI), quick peripheral component connection interface (Peripheral Component InterconnectExpress, or the insert row of other connecting interface specification PCI-E), data transmission is carried out to be made circuit board device 40 and computer motherboard by electrical insert row 41.
At least one bridgeware 42 is also connected with between the substrate 10 of circuit board device 40 and circuit module 1, the thickness side that circuit board device 40 engages with the substrate 10 of circuit module 1 crossed over by each bridgeware 42, the two ends of each bridgeware 42 are also fixed in the substrate 10 of circuit board device 40 and circuit module 1 respectively, will be understood that, the parts of these bridgewares 42 can be used as the power delivery of circuit board device 40 to the conducting wire of circuit module 1.
Electronic installation 2 also comprises two heat radiator 3, this two heat radiator 3 covers the relative both sides in electronic installation 2 respectively, furtherly, two heat radiator 3 cover the one side in circuit board device 40 respectively, the heat energy produced when circuit board device 40 can be made to operate sheds, and prevents electronic installation 2 from causing because of overheated heat to be worked as or damaging; Will be understood that, also can not be provided with heat radiator.Electronic installation 2 also comprises at least one shells 4, shells 4 in the side of electronic installation 2 with a wherein heat radiator 3 in being halved together abreast, in the present embodiment, electronic installation 2 comprises two shells 4, can, by wherein coated with circuit board device 40 for most circuit module 1, it be made not to be subject to external factor and to damage by two shells 4 and two heat radiator 3.Will be understood that, shells can be heat radiation material, and makes shells have radiating effect; In other embodiments, heat radiator and shells also can be integrated component, have decoration, protection and radiating effect simultaneously.
To sum up, circuit module of the present invention has at least one perforation, and at least one electronic component is arranged in this perforation, thus, can integral thickness be reduced, and when making it be inserted in motherboard, more not easily take up space, and more electronic installation can be made can be inserted on motherboard.
In sum, in overall construction design of the present invention, practicality and benefit, really be to meet in industry needed for development completely, and disclosed architecture invention is also have unprecedented innovative structure, so its there is " novelty " should without doubt, the present invention can have more the enhancement of effect compared with known structure again, therefore also has " progressive ".
Claims (10)
1. circuit module, for being electrically connected with a circuit board device, this circuit board device comprises a power output end portion, it is characterized in that, this circuit module comprises:
One substrate, has at least one perforation, and this substrate is for engaging with the direction of thickness side subtend with this circuit board device;
One booster circuit, be located at this substrate, comprise the electronic component that at least one conducting wire and plural number and this at least one conducting wire are electrically connected, this at least one conducting wire comprises the power input portion supplying to be electrically connected with this power output end portion and two power output ends, and this electronic component at least one is arranged in this perforation;
One piasmatron, its opposite end has two electrodes be electrically connected with this two power output end.
2. circuit module as claimed in claim 1, is characterized in that, each electrode comprises one, and to be positioned at described piasmatron inner and be the electrode cap cylinder of hollow, and two electrode cap cylinders are arranged in coaxial.
3. circuit module as claimed in claim 1, is characterized in that, described power input portion supplies to be electrically connected with the memory body being provided with described power output end portion, display card, networking card or printed circuit board (PCB).
4. circuit module as claimed in claim 1, it is characterized in that, described plural electronic component comprises plural passive device and at least one transformer, be electrically connected the low pressure booster circuit that formation one is electrically connected described power input portion between this plural passive device, this at least one transformer formation one is electrically connected at the high voltage step-up circuit between this low pressure booster circuit and described two power output ends.
5. circuit module as claimed in claim 4, it is characterized in that, described plural electronic component also comprises a processing unit, and this processing unit comprises the frequency changer circuit of an electric connection described power input portion and described low pressure booster circuit.
6. an electronic installation, comprise just like the circuit module in claim 1 to 5 described in any one, it is characterized in that, also comprise a circuit board device be electrically connected with this circuit module, this circuit board device engages with the direction of thickness side subtend with the substrate of this circuit module.
7. electronic installation as claimed in claim 6, it is characterized in that, described circuit board device also comprises one for the electrical insert row with the electrical grafting of electrical slot of computer motherboard, and this electrical insert row is located at the side of described circuit board device relative to described circuit module.
8. electronic installation as claimed in claim 6, it is characterized in that, at least one bridgeware is also connected with between described circuit board device and the substrate of circuit module, the thickness side that described circuit board device engages with the substrate of circuit module crossed over by each bridgeware, and the two ends of each bridgeware are fixed in the substrate of described circuit board device and circuit module respectively.
9. electronic installation as claimed in claim 6, it is characterized in that, also comprise two heat radiator, this two heat radiator covers the relative both sides in described electronic installation respectively.
10. electronic installation as claimed in claim 9, is characterized in that, also comprise at least one shells, and this shells is halved together in the side of described electronic installation abreast with a wherein heat radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510032275.8A CN104597978B (en) | 2015-01-22 | 2015-01-22 | Electronic device and its circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510032275.8A CN104597978B (en) | 2015-01-22 | 2015-01-22 | Electronic device and its circuit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104597978A true CN104597978A (en) | 2015-05-06 |
| CN104597978B CN104597978B (en) | 2018-10-02 |
Family
ID=53123826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510032275.8A Expired - Fee Related CN104597978B (en) | 2015-01-22 | 2015-01-22 | Electronic device and its circuit module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104597978B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981298A (en) * | 2016-01-15 | 2017-07-25 | 全何科技股份有限公司 | Memory module and its manufacture method |
| CN111258385A (en) * | 2018-12-03 | 2020-06-09 | 技嘉科技股份有限公司 | Memory module with screen and mainboard module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100177472A1 (en) * | 2009-01-15 | 2010-07-15 | Chang Hsiu-Cheng | Power supply of personal computers equipped with a modular conversion circuit |
| US20100254097A1 (en) * | 2009-04-06 | 2010-10-07 | Shao-Feng Lu | Output architecture of power supply |
| CN202854799U (en) * | 2012-09-07 | 2013-04-03 | 宇帷国际股份有限公司 | Dynamic random access memory body |
| CN203134376U (en) * | 2013-02-07 | 2013-08-14 | 宇帷国际股份有限公司 | Dynamic random access memory |
| CN103929895A (en) * | 2013-01-15 | 2014-07-16 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board with embedded element and manufacturing method of circuit board with embedded element and packaging structure of circuit board with embedded element |
-
2015
- 2015-01-22 CN CN201510032275.8A patent/CN104597978B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100177472A1 (en) * | 2009-01-15 | 2010-07-15 | Chang Hsiu-Cheng | Power supply of personal computers equipped with a modular conversion circuit |
| US20100254097A1 (en) * | 2009-04-06 | 2010-10-07 | Shao-Feng Lu | Output architecture of power supply |
| CN202854799U (en) * | 2012-09-07 | 2013-04-03 | 宇帷国际股份有限公司 | Dynamic random access memory body |
| CN103929895A (en) * | 2013-01-15 | 2014-07-16 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board with embedded element and manufacturing method of circuit board with embedded element and packaging structure of circuit board with embedded element |
| CN203134376U (en) * | 2013-02-07 | 2013-08-14 | 宇帷国际股份有限公司 | Dynamic random access memory |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981298A (en) * | 2016-01-15 | 2017-07-25 | 全何科技股份有限公司 | Memory module and its manufacture method |
| CN111258385A (en) * | 2018-12-03 | 2020-06-09 | 技嘉科技股份有限公司 | Memory module with screen and mainboard module |
| CN111258385B (en) * | 2018-12-03 | 2023-03-17 | 技嘉科技股份有限公司 | Memory module with screen and mainboard module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104597978B (en) | 2018-10-02 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20170413 Address after: Hongkong Chinese 95 how Ming Street, Kwun Tong Kowloon Sata center 10 building K room Applicant after: Letter Technology Co., Ltd. Address before: Taichung City, Taiwan, China Applicant before: AVEXIR TECHNOLOGIES CORP. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181002 Termination date: 20210122 |
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| CF01 | Termination of patent right due to non-payment of annual fee |