CN111258138A

CN111258138A - Liquid crystal module, preparation method thereof, liquid crystal display panel and spliced display panel

Info

Publication number: CN111258138A
Application number: CN202010100016.5A
Authority: CN
Inventors: 臧远生; 陈俊生; 李慧子; 王春
Original assignee: BOE Technology Group Co Ltd; Hefei BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Hefei BOE Optoelectronics Technology Co Ltd
Priority date: 2020-02-18
Filing date: 2020-02-18
Publication date: 2020-06-09

Abstract

The application provides a liquid crystal module, a preparation method thereof, a liquid crystal display panel and a splicing display panel, wherein the liquid crystal module comprises a color film substrate and an array substrate which are arranged oppositely, and the array substrate comprises: a flexible transparent substrate and a switching device layer stacked; the flexible transparent substrate comprises a device bearing area bearing the switching device layer and a circuit binding area used for connecting an external control circuit; the circuit binding region is in a bending state, one end of the circuit binding region is connected with the device bearing region, and the other end of the circuit binding region is located on one side, away from the switch device layer, of the device bearing region. Adopt flexible transparent basement as the substrate on switching device layer in this application to the preparation is used for connecting the circuit binding region of external control circuit, makes the circuit binding region can buckle, and the circuit binding region's after buckling free end is located one side that the device of flexible transparent basement bore the weight of the regional switch device layer of keeping away from, thereby dwindles the encapsulation frame, has promoted whole liquid crystal display panel's screen and has accounted for the ratio.

Description

Liquid crystal module, preparation method thereof, liquid crystal display panel and spliced display panel

Technical Field

The application relates to the technical field of liquid crystal display, in particular to a liquid crystal module, a preparation method of the liquid crystal module, a liquid crystal display panel and a splicing display panel.

Background

Thin Film Transistor Liquid crystal displays (TFT-LCDs) have the advantages of small size, low power consumption, no radiation, and the like, and have been rapidly developed in recent years, and have become the mainstream of displays in the market. With the continuous development of LCDs, narrow-bezel and full-screen displays are becoming the mainstream of the market.

In the conventional LCD display panel, because the lower frame of the display panel must leave a placement area for a panel driving chip in addition to a normal driving circuit, as shown in fig. 1 and 2, the lower frame is generally larger than the other three-sided frames, which is also a reason why the lower frame of a mobile phone product is larger than the other three-sided frames. Therefore, the peripheral frame of the existing LCD display panel is difficult to further reduce after the frame is reduced to a certain degree due to the limitation of the frame sealing glue and the peripheral driving circuit, and the requirement of continuously increasing screen occupation ratio of a display product is difficult to meet.

Disclosure of Invention

The liquid crystal module, the preparation method thereof, the liquid crystal display panel and the splicing display panel are provided for overcoming the defects of the existing mode, and the liquid crystal module, the preparation method, the liquid crystal display panel and the splicing display panel are used for solving the problem that the screen occupation ratio of the existing liquid crystal display panel is small.

In a first aspect, an embodiment of the present application provides a liquid crystal module, including a color film substrate and an array substrate that are arranged in a box-to-box manner, where a liquid crystal layer is filled between the color film substrate and the array substrate, and the array substrate includes: a flexible transparent substrate and a switching device layer stacked; the flexible transparent substrate comprises a device bearing area for bearing the switching device layer and a circuit binding area for connecting an external control circuit; the circuit binding region is in a bent state, one end of the circuit binding region is connected with the device bearing region, and the other end of the circuit binding region is located on one side, far away from the switch device layer, of the device bearing region.

In one possible implementation, the flexible transparent substrate further includes: a first scanning driving area, a second scanning driving area and a circuit binding opposite side area which are connected with the device bearing area; the first scanning driving area and the second scanning driving area are respectively positioned at the first opposite sides of the device bearing area; the circuit binding region and the circuit binding opposite side region are respectively positioned at the second opposite side of the device bearing region; the first scanning driving area, the second scanning driving area and the circuit binding opposite side area are all in a bent state, and free ends of the first scanning driving area, the second scanning driving area and the circuit binding opposite side area are all located on one side, away from the switching device layer, of the device bearing area.

In one possible implementation, the flexible transparent substrate includes at least a transparent polyimide film or a transparent cyclic olefin polymer film.

In one possible implementation manner, the liquid crystal module further includes: the upper polarizer is attached to one side, away from the array substrate, of the color film substrate, and the lower polarizer is connected with one side, away from the switch device layer, of the device bearing area.

In one possible implementation manner, the lower polarizer is attached to one side of the device bearing area, which is far away from the switching device layer; the hardness of the lower polarizer is at least 6H.

In a possible implementation manner, the array substrate further includes an array side glass substrate, and the array side glass substrate is attached to one side of the device bearing area, which is far away from the color film substrate; the lower polarizer is attached to one side, away from the flexible transparent substrate, of the array side glass substrate.

In one possible implementation manner, the liquid crystal module further includes: a backlight assembly including a back plate and a light source surrounded by the back plate; the backlight source assembly is located on one side, far away from the switching device layer, of the flexible transparent substrate, and the first scanning driving area, the second scanning driving area, the circuit binding area and the circuit binding opposite side area are located on one side, far away from the light source, of the backboard after being bent.

In a second aspect, an embodiment of the present application provides a liquid crystal display panel, which includes an encapsulation frame and the liquid crystal module according to the first aspect of the embodiment of the present application, where the encapsulation frame is connected to a side of the color film substrate away from the flexible transparent substrate.

In a third aspect, an embodiment of the present application provides a tiled display panel, including at least two liquid crystal modules according to the first aspect of the embodiment of the present application, and a package frame corresponding to each liquid crystal module; each packaging frame is bent with a first scanning driving area, a second scanning driving area, a circuit binding area and a circuit binding opposite side area of the corresponding liquid crystal module in an adaptive manner; and all the liquid crystal modules are assembled according to a preset rule to form a whole liquid crystal display panel.

In one possible implementation, the backlight assembly of each liquid crystal module comprises an integral backlight.

In a fourth aspect, an embodiment of the present application provides a method for manufacturing a liquid crystal module, including:

arranging a flexible transparent substrate on the array side glass substrate to form a composite glass substrate;

preparing a switching device layer on one side of the device bearing area of the flexible transparent substrate, which is far away from the array side glass substrate;

the color film substrate and the composite glass substrate are oppositely arranged and cut to form a liquid crystal module unit;

removing the color film substrate and the array side glass substrate in the circuit binding area of the flexible transparent substrate;

and after the circuit binding region is pasted with an external control circuit, bending the circuit binding region to one side of the device bearing region of the flexible transparent substrate, which is far away from the switch device layer.

In a possible implementation manner, after the color film substrate and the composite glass substrate are boxed and cut to form a liquid crystal module unit, and before the circuit binding region is attached to an external control circuit, the method further includes: removing the color film substrate and the array side glass substrate which are positioned in the first scanning driving area, the second scanning driving area and the circuit binding opposite side area;

and after the circuit binding region is attached to an external control circuit, the method further comprises the following steps: and bending the first scanning driving area, the second scanning driving area and the circuit binding opposite side area to one side of the device bearing area far away from the switching device layer.

In a fifth aspect, an embodiment of the present application provides another method for manufacturing a liquid crystal module, including: arranging a flexible transparent substrate on the array side glass substrate to form a composite glass substrate;

removing the whole array side glass substrate and the color film substrate positioned in the circuit binding area of the flexible transparent substrate;

attaching a polaroid with a preset hardness requirement to one side of the device bearing area of the flexible transparent substrate, which is far away from the color film substrate;

In a possible implementation manner, after the color film substrate and the composite glass substrate are boxed and cut to form a liquid crystal module unit, and before a polarizer with a preset hardness requirement is attached to one side of a device bearing area of the flexible transparent substrate, which is far away from the color film substrate, the method further includes: removing the color film substrate and the array side glass substrate which are positioned in the first scanning driving area, the second scanning driving area and the circuit binding opposite side area;

The technical scheme provided by the embodiment of the application has the following beneficial technical effects:

the liquid crystal module that this application embodiment provided adopts flexible transparent basement as the substrate on switching device layer to reserve the circuit that is used for connecting external control circuit and bind the region, make the circuit bind the region and can buckle, and the circuit after buckling binds one side that the regional device bearing area of free end position in flexible transparent basement kept away from the switching device layer, thereby reduce the frame of DP side, promoted whole liquid crystal display panel's screen and account for the ratio.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a DP side of a liquid crystal module in the prior art;

FIG. 2 is a schematic diagram of a GOA side of a liquid crystal module in the prior art;

fig. 3 is a schematic structural diagram of a DP side of a liquid crystal film group provided in an embodiment of the present application;

fig. 4 is a schematic structural diagram of a GOA side of a liquid crystal film group according to an embodiment of the present disclosure;

fig. 5 is a top view of a flexible transparent substrate of a liquid crystal film module provided in an embodiment of the present disclosure;

fig. 6 is a schematic diagram of a structure of a DP side of a liquid crystal film group according to another embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of a GOA side of a liquid crystal film module according to another embodiment of the present disclosure;

fig. 8 is a schematic view of an internal structure of a tiled display panel according to an embodiment of the present application;

FIG. 9 is a front view of a tiled display panel provided by an embodiment of the present application;

fig. 10 is a schematic bending view of a single package frame and a liquid crystal module in a tiled display panel according to an embodiment of the present disclosure;

fig. 11 is a flowchart of a method for manufacturing a liquid crystal film module according to an embodiment of the present disclosure;

fig. 12 is a flowchart of a method for manufacturing a liquid crystal film assembly according to another embodiment of the present disclosure.

Wherein:

1-liquid crystal film group;

100-an array substrate;

110-a flexible transparent substrate; 111-a device bearing region; 112-circuit binding area; 113-circuit binding opposite side area; 114 — a first scan drive region; 115-a second scan drive region;

120-switching device layer; 130-array side glass substrate;

200-a color film substrate; 210-color film side glass substrate; 220-color film device layer;

300-a liquid crystal layer;

400-a display driver;

500-a flexible circuit board;

600-sealing the frame glue;

700-a backlight assembly;

800-upper polarizer;

900-lower polarizer;

2-packaging the frame.

Detailed Description

Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.

The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.

Referring to fig. 3 to 5, an embodiment of the present application provides a liquid crystal module, which includes a color film substrate 200 and an array substrate 100 that are arranged in a box-to-box manner, and a liquid crystal layer 300 is filled between the color film substrate 200 and the array substrate 100.

The array substrate 100 specifically includes: a laminated flexible transparent substrate 110 and a switching device layer 120; the flexible transparent substrate 110 includes a device bearing region 111 bearing the switching device layer 120, and a circuit bonding region 112 for connecting to an external control circuit. The circuit bonding region 112 is in a bent state, one end of the circuit bonding region 112 is connected to the device carrying region 111, and the other end of the circuit bonding region 112 is located on a side of the device carrying region 111 of the flexible transparent substrate 110 away from the switching device layer 120.

First, each area of the liquid crystal module is defined (the definition is also applicable to fig. 1 and fig. 2 in the background art), and the method specifically includes: a display Area (corresponding to the device bearing Area 111 of the flexible transparent substrate 110), i.e., an AA (Active Area) Area in the figure; the display panel is provided with Gate Driver On Array (GOA) units (not shown in the figure) On the left and right sides, and the side outside the display panel, where the circuit bonding pads are provided, is called the DP side (Data Pad, Data bonding side) of the liquid crystal film group and corresponds to the coverage area of the lower frame; the side opposite to the DP side is the DPO side (Data PadOpposition, Data binding opposite side) of the liquid crystal module and corresponds to the covering area of the upper frame; the two sides where the GOA unit is located are the GOA sides of the array substrate 100.

In this embodiment, the flexible transparent substrate 110 is used as a substrate of the switching device layer 120, and the circuit binding region 112 for connecting an external control circuit is reserved, so that the circuit binding region 112 can be bent, and the free end of the bent circuit binding region 112 is located on one side, away from the switching device layer 120, of the device bearing region 111 of the flexible transparent substrate 110, so that the side frame of the DP is reduced, and the screen occupation ratio of the whole liquid crystal display panel is improved.

Specifically, in the present embodiment, the flexible transparent substrate 110 of the array substrate 100 is used as a substrate, so as to ensure that the light emitted from the backlight source of the liquid crystal module is bent on the premise of transmitting through the substrate. The switching device layer 120 is prepared in the device bearing region 111 of the flexible transparent substrate 110, the switching device layer 120 includes each film layer having a thin film transistor device, and for the specific structure of the switching device layer 120, reference may be made to the existing liquid crystal module structure, which is not described in detail herein. A liquid crystal layer 300 is filled between the color film substrate 200 and the array substrate 100, and can be sealed by using a frame sealing adhesive 600 to prevent liquid crystal from leaking; the color filter substrate 200 includes a color filter side glass substrate 210 and a color filter device layer 220 formed on the color filter side glass substrate 210.

When the switching device layer 120 is prepared, a circuit binding region 112 is formed on the surface of the flexible transparent substrate 110 close to the switching device layer 120, and the circuit binding region 112 is positioned on the DP side of the liquid crystal module; the circuit bonding regions 112 serve as ties for circuit connections to the thin film transistor devices in the switching device layer 120 on the one hand and to external control circuitry on the other hand. Alternatively, the external control Circuit includes a Flexible Circuit board 500 (FPC), a control Circuit board, a display driver 400(Drive IC), and the like, and the control Circuit board is electrically connected to the Circuit bonding region 112 through the Flexible Circuit board 500.

In this embodiment, after the display driver 400 and the flexible circuit board 500 connected with the control circuit board are bound (Bonding) in the circuit binding region 112, the circuit binding region 112 of the flexible transparent substrate 110 is bent by using the bendability and flexibility of the flexible transparent substrate 110. One end of the circuit bonding region 112 in the bent state may be integrally connected to the device carrying region 111, and the other end (free end) of the circuit bonding region 112 is located at a side of the device carrying region 111 away from the switching device layer 120, so that the flexible circuit board 500 and the display driver 400 attached to the circuit bonding region 112 are hidden under the device carrying region 111 (the position relationship shown in fig. 3).

Note that, in fig. 3 and 4, the array-side glass substrate 130 at the bottom of the device carrying region 111 is retained, and the lower polarizer attached to the array-side glass substrate 130 is not shown.

It will be understood by those skilled in the art that the connection between one end of the circuit bonding region 112 in the bent state and the device carrying region 111 can also be achieved by other means such as adhesion or welding.

Alternatively, the bending shape of the circuit bonding region 112 may be an L shape, a U shape, or a bending shape, and it is sufficient to reduce the frame of the circuit bonding side, which is not limited herein.

In one embodiment of the present application, with continued reference to fig. 3-5, the flexible transparent substrate 110 includes, in addition to circuit bonding: a first scan driving area 114, a second scan driving area 115, and a circuit binding opposite side area 113. The first scan driving area 114 and the second scan driving area 115 are respectively located at first opposite sides of the device carrying area 111; the circuit bonding area 112 and the circuit bonding opposite side area 113 are located on second opposite sides of the device carrying area 111, respectively.

The first scan driving region 114, the second scan driving region 115, and the circuit binding opposite-side region 113 are all in a bent state, one end of the first scan driving region 114, the second scan driving region 115, and the circuit binding opposite-side region 113 is connected to the device carrying region 111, and the other end (free end) of the first scan driving region 114, the second scan driving region 115, and the circuit binding opposite-side region 113 is located on a side of the device carrying region 111 away from the switching device layer 120.

In this embodiment, the first scan driving region 114, the second scan driving region 115, the circuit bonding region 112, and the circuit bonding opposite-side region 113 connected to the device carrying region 111 are all bent, and the free ends of the bent first scan driving region 114, the bent second scan driving region 115, the circuit bonding region 112, and the circuit bonding opposite-side region 113 are all located on one side of the device carrying region 111 away from the switch device layer 120, so as to further reduce the side frame of the liquid crystal module, thereby facilitating the implementation of a full-screen design.

It should be noted that, in this embodiment, the device carrying area 111 can be regarded as a regular film structure having four sides, and the first scan driving area 114, the second scan driving area 115, the circuit bonding area 112 and the circuit bonding opposite side area 113 are distributed on the four sides of the device carrying area 111, and are integrally formed into a whole flexible transparent substrate 110. The first scan driving area 114 and the second scan driving area 115 correspond to two GOA sides of the liquid crystal film group, the first scan driving area 114 is on the left side in the drawing, and the second scan driving area 115 is on the right side; the circuit binding opposite side region 113 corresponds to the DPO side of the liquid crystal film group.

Because the first scanning driving area 114, the second scanning driving area 115, the circuit binding area 112 and the circuit binding opposite side area 113 are all in a bent state, and all the areas are positioned below the device bearing area 111 in the figure after being bent, four side frames of the whole liquid crystal module can be narrowed, and the design requirements of the whole screen are further met.

It should be noted that the first scan driving region 114 and the second scan driving region 115 are used to connect to a row driving circuit (gate circuit), respectively, and the circuit binding opposite side region 113 is used to connect to a data line driving circuit.

On the basis of the above embodiments, the flexible transparent substrate 110 may optionally include at least a transparent polyimide (CPI) film or a transparent Cyclic Olefin Polymer (COP) film.

The CPI has characteristics of flexibility resistance, high transparency, low dielectric constant, easiness in realizing fine pattern circuit processing, and the like, the COP is also an acrylic material with high transparency and low birefringence, both of which can be used as substrate materials of the switching device layer 120, and the region outside the device bearing region 111 can be bent, thereby realizing a narrow frame effect of the display panel. It should be noted that the material of the flexible transparent substrate 110 may include other materials with high transparency and flexibility resistance besides the two materials in the embodiment, which are not listed here.

Based on the content of the foregoing embodiments, referring to fig. 6 and fig. 7, the liquid crystal module provided in this embodiment further includes, in addition to the color film substrate 200 and the array substrate 100 formed in a box-to-box manner: the upper polarizer 800 and the lower polarizer 900 are attached to one side of the color film substrate 200 away from the array substrate 100, and the lower polarizer is connected to one side of the device bearing area 111 away from the switch device layer 120.

In this embodiment, in order to facilitate control of the light-emitting uniformity of the liquid crystal module, an upper polarizer 800 and a lower polarizer 900 are respectively mounted on the outermost sides of the color film substrate 200 and the array substrate 100 formed in a box-to-box manner. Specifically, the upper polarizer 800 is specifically attached to the color filter side glass substrate 210, and the lower polarizer 900 may be directly or indirectly connected to the flexible transparent substrate 110 according to the strength requirement of the array substrate 100. It should be noted that fig. 6 and fig. 7 are schematic structural diagrams illustrating that the lower polarizer 900 is directly connected to the flexible transparent substrate 110, and the structure that the lower polarizer 900 is indirectly connected to the flexible transparent substrate 110 can be referred to as a conventional liquid crystal module structure.

Optionally, with continued reference to fig. 6 and 7, the lower polarizer 900 is attached to a side of the device bearing region 111 away from the switching device layer 120; the lower polarizer 900 has a hardness of at least 6H (HB, brinell hardness).

In this embodiment, the array-side glass substrate 130 is entirely replaced by the flexible transparent substrate 110, so that the lower polarizer 900 is directly attached to the bottom of the device-bearing area 111 in the flexible transparent substrate 110, thereby reducing the thickness of the entire liquid crystal module, but considering the strength of the entire array substrate, the strength of the lower polarizer 900 needs to be enhanced. The hardness of the lower polarizer 900 in this embodiment is at least 6H to compensate for the strength of the flexible transparent substrate 110.

Alternatively, the hardness of the lower polarizer 900 in this embodiment may be 6H or 9H.

In an embodiment of the present application, in order to enhance the strength of the array substrate 100, the array-side glass substrate 130 at the bottom of the flexible transparent substrate 110 may be reserved, and the array-side glass substrate 130 may be the existing glass substrate of the array substrate 100, specifically, the device carrying region 111 installed in the flexible transparent substrate 110 is on the side away from the switching device layer 120. The lower polarizer 900 is attached to a side of the array-side glass substrate 130 away from the flexible transparent substrate 110, that is, a layer of array-side glass substrate 130 is arranged between the lower polarizer 900 and the flexible transparent substrate 110, so that the structural strength of the array substrate 100 is further enhanced.

It should be noted that the array side glass substrate 130 is only located in the device carrying region 111, and thus does not affect the bending of the first scan driving region 114, the second scan driving region 115, the circuit bonding region 112, and the circuit bonding opposite side region 113.

Based on the content of the foregoing embodiments, the liquid crystal module provided in this embodiment, in addition to the color filter substrate 200 and the array substrate 100 formed in a box pair in the foregoing embodiments, further includes: the backlight assembly 700 includes a back panel and a light source, the back panel includes a bottom panel and a side panel, the side panel forms an accommodating cavity on the upper surface of the bottom panel, the light source is surrounded by the accommodating cavity, and it is ensured that light of the light source is emitted to a liquid crystal cell composed of the color film substrate 200 and the array substrate 100 as completely as possible.

The backlight assembly 700 is located on a side of the flexible transparent substrate 110 away from the switching device layer 120, and the first scan driving area 114, the second scan driving area 115, the circuit bonding area 112, and the circuit bonding opposite-side area 113 are located on a side of the side plate of the back plate away from the light source after being bent.

In this embodiment, the first scanning driving area 114, the second scanning driving area 115, the circuit binding area 112, and the circuit binding opposite area 113 are all located on one side of the back plate away from the light source after being bent, that is, outside the area surrounded by the back plate of the backlight source, so as to prevent each bent area from affecting the light of the backlight source, thereby ensuring the light emitting effect.

It should be noted that, the specific installation position and parameters of the backlight assembly 700 in this embodiment may refer to the existing liquid crystal module, and are not described in detail here.

Alternatively, the backlight assembly 700 in the present embodiment may adopt a cob (chip On board) or Mini LED (Light Emitting Diode) backlight.

Based on the same inventive concept, an embodiment of the present application further provides a liquid crystal display panel, which includes a package frame and the liquid crystal module in the foregoing embodiments, where the package frame is connected to a side of the color film substrate 200 away from the flexible transparent substrate 110. Optionally, the encapsulation frame is connected with the periphery of the color film side glass substrate 210 of the color film substrate 200 in a matching manner, wherein the encapsulation frame is fixedly mounted on the color film side glass substrate 210 through frame sealing glue.

The liquid crystal display panel provided by the embodiment includes the liquid crystal modules in the above embodiments, the liquid crystal module adopts the flexible transparent substrate 110 as the substrate of the switching device layer 120, each circuit connection region outside the device bearing region 111 of the flexible transparent substrate 110 can be bent, and the bent circuit connection region is located on one side of the device bearing region 111 of the flexible transparent substrate 110, which is far away from the switching device layer 120, so that the packaging frame of the display panel is reduced, and the screen occupation ratio of the whole liquid crystal display panel is improved.

Based on the same inventive concept, as shown in fig. 8 and 9, an embodiment of the present application further provides a tiled display panel, which includes at least two liquid crystal modules 1 in the above embodiments, and a package frame 2 corresponding to each liquid crystal module 1. Each of the package frames 2 is adapted to bend with the corresponding first scan driving region 114, second scan driving region 115, circuit bonding region 112 and circuit bonding opposite side region 113 of the liquid crystal module 1. And all the liquid crystal modules 1 are assembled according to a preset rule to form a whole assembled liquid crystal display panel.

In this embodiment, each liquid crystal module 1 for splicing all adopts the flexible transparent substrate 110 as the substrate of the switching device layer 120, and each circuit connection area outside the device bearing area 111 of the flexible transparent substrate 110 can be bent, so that the encapsulation frame 2 corresponding to each liquid crystal module 1 is bent adaptively, thereby reducing the panel sealing area, ensuring that the frame at the splicing part is reduced compared with the original design, and improving the visual effect.

Specifically, the tiled display panel is generally formed by splicing an even number of liquid crystal modules 1 according to a certain preset rule, for example: and (4) grid-shaped. The liquid crystal module is the liquid crystal module 1 including the flexible transparent substrate 110 in the above embodiments, so that a narrow bezel effect can be achieved. Because the corresponding packaging frame 2 can exist between the adjacent liquid crystal modules 1, the packaging frame 2 is reduced, the image display effect of each liquid crystal module 1 can be weakened, and the visual perception is improved.

It should be noted that the adaptive bending of the package frame 2 is specifically represented as: as shown in fig. 10, taking the DP side and the DPO side of the array substrate 100 as an example, when the circuit bonding region 112 on the side located at the DP is bent in a predetermined manner, the package frame 2 corresponding to the DP side may be bent in the same manner or a similar bending manner; similarly, when the circuit bonding opposite-side region 113 on the DPO side is bent in a predetermined manner, the package frame 2 corresponding to the DPO side may be bent in the same manner or a similar bending manner, so as to reduce the actual frame width, i.e., the width of the Panel Sealing Area (Panel Sealing Area).

On the basis of the above embodiments, optionally, the backlight assembly 700 of each liquid crystal module includes an integrated backlight.

In this embodiment, in order to enhance the display effect of the assembled display panel and improve the assembly efficiency, the backlight source assembly 700 of each liquid crystal module in the above embodiments adopts an integral backlight source, which can provide backlight for the whole assembled display panel, so as to achieve fast assembly, and the light source uniformity is good, which is beneficial to further improving the display effect of the assembled display panel.

Optionally, the integral backlight source in this embodiment may be a direct-type LED backlight source, which may improve the display effect of the large-size assembled display panel.

Based on the same inventive concept, as shown in fig. 11, an embodiment of the present application provides a method for manufacturing a liquid crystal module, which can be used to manufacture the liquid crystal module in the above embodiments, including:

s01, the flexible transparent substrate 110 is disposed on the array side glass substrate 130 to form a composite glass substrate.

S02, the switching device layer 120 is prepared on the side of the device bearing region 111 of the flexible transparent substrate 110 away from the array-side glass substrate 130.

And S03, the color film substrate 200 and the composite glass substrate are oppositely clamped and cut to form the liquid crystal module unit.

S04, removing the color film substrate 200 and the array side glass substrate 130 in the circuit bonding region 112 of the flexible transparent substrate 110.

S05, the circuit bonding region 112 is attached to an external control circuit and then bent to a side of the device supporting region 111 of the flexible transparent substrate 110 away from the switching device layer 120.

In this embodiment, the switching device layer 120 is prepared in the device bearing area 111 of the flexible transparent substrate 110, and the circuit binding area 112 of the flexible transparent substrate 110 is bent at a side of the device bearing area 111 away from the switching device layer 120, so as to reduce the frame at the DP side and improve the screen occupation ratio of the whole liquid crystal display panel; and the array side glass substrate 130 of the device carrying region 111 is reserved, which is beneficial to improving the structural strength of the whole array substrate 100.

Specifically, in S01, in order to facilitate the preparation of the switching device layer 120 on the flexible transparent substrate 110, it is first necessary to prepare the flexible transparent substrate 110 on the upper surface of the array-side glass substrate 130 through a coating or pressing process with the array-side glass substrate 130 as an auxiliary substrate, thereby forming a composite glass substrate having the flexible transparent substrate 110 and the array-side glass substrate 130 stacked one on top of the other.

In S02, for the composite glass substrate, the switching device layer 120 may be prepared on the side of the device bearing region 111 of the flexible transparent substrate 110 away from the array-side glass substrate 130, while the circuit bonding pads are formed on the circuit bonding region 112 of the flexible transparent substrate 110.

In S03, PI (polyimide) is coated on the color filter substrate 200 on which the color filter device layers 220 such as the black matrix, the color resist, the protective layer, and the spacer pillar have been prepared, and the composite glass substrate after the above steps, followed by curing and rubbing with PI, followed by dropping liquid crystal. And (3) carrying out box-aligning treatment on the composite glass substrate and the color film substrate 200, and cutting to form an independent liquid crystal module unit.

In S04, in this embodiment, a portion of the array side glass substrate 130 is remained, and only the color filter substrate 200 (all the film layers) and the array side glass substrate 130 located in the circuit bonding region 112 of the flexible transparent substrate 110 are removed, so that the circuit bonding region 112 is exposed outside the array side glass substrate 130 and the color filter substrate 200. The specific manner of removing the color filter substrate 200 and the array side glass substrate 130 may be Laser Lift Off (LLO) technology, and the glass substrate in the preset area can be accurately removed.

In S05, an external control circuit is attached to the circuit bonding region 112, and the free end of the circuit bonding region 112 is bent to the side of the device carrying region 111 of the flexible transparent substrate 110 away from the switching device layer 120, so as to reduce the package bezel 2 on the DP side. It should be noted that the process further includes the conventional manufacturing processes of attaching the upper and lower polarizers and assembling the backlight assembly 700, which refer to the conventional manufacturing process of the liquid crystal module and are not described in detail herein.

On the basis of the above embodiment, in order to further increase the screen occupation ratio, after S03 and before S05, the method further includes: the color filter substrate 200 and the array side glass substrate 130 in the first scan driving region 114, the second scan driving region 115 and the circuit bonding opposite side region 113 are removed.

In this embodiment, while the color filter substrate 200 and the array-side glass substrate 130 in the circuit bonding region 112 of the flexible transparent substrate 110 are removed by using a laser lift-off technique, the color filter substrate 200 and the array-side glass substrate 130 in the first scan driving region 114, the second scan driving region 115 and the circuit bonding opposite-side region 113 are removed, and finally only the color filter substrate 200 and the array-side glass substrate 130 in the device bearing region 111 are retained, so that the first scan driving region 114, the second scan driving region 115, the circuit bonding region 112 and the circuit bonding opposite-side region 113 are exposed from the array-side glass substrate 130 and the color filter substrate 200.

Correspondingly, in S05, after the external control circuit is attached to the circuit bonding area 112, the method further includes: the first scan driving region 114, the second scan driving region 115, and the circuit bonding opposite-side region 113 are bent to a side of the device carrying region 111 away from the switching device layer 120.

In this embodiment, when the circuit bonding region 112 is subsequently bent, the first scan driving region 114, the second scan driving region 115, and the circuit bonding opposite-side region 113 are also bent, so that the free ends of the bent side edge regions are located on the side of the device carrying region 111 away from the switch device layer 120.

In the method for manufacturing a liquid crystal module provided by this embodiment, the first scan driving region 114, the second scan driving region 115, the circuit bonding region 112, and the circuit bonding opposite-side region 113 connected to the device supporting region 111 can be bent, and the free ends of the bent first scan driving region 114, the bent second scan driving region 115, the circuit bonding region 112, and the circuit bonding opposite-side region 113 are all located on the side of the device supporting region 111 away from the switch device layer 120, so as to further reduce the side frame of the liquid crystal module, thereby facilitating the implementation of a full-screen design.

Based on the same inventive concept, as shown in fig. 12, an embodiment of the present application provides another method for manufacturing a liquid crystal module, which can be used to manufacture the liquid crystal module in the above embodiments, including:

s11, the flexible transparent substrate 110 is disposed on the array side glass substrate 130 to form a composite glass substrate.

S12, the switching device layer 120 is prepared on the side of the device bearing region 111 of the flexible transparent substrate 110 away from the array-side glass substrate 130.

And S13, the color film substrate 200 and the composite glass substrate are oppositely clamped and cut to form the liquid crystal module unit.

S14, the entire array-side glass substrate 130 and the color filter substrate 200 located in the circuit bonding region 112 of the flexible transparent substrate 110 are removed.

S15, attaching a polarizer with a predetermined hardness requirement to a side of the device carrying area 111 of the flexible transparent substrate 110 away from the color film substrate 200.

S16, the circuit bonding region 112 is attached to an external control circuit and then bent to a side of the device supporting region 111 of the flexible transparent substrate 110 away from the switching device layer 120.

In this embodiment, the switching device layer 120 is prepared in the device bearing area 111 of the flexible transparent substrate 110, and the circuit binding area 112 of the flexible transparent substrate 110 is bent at a side of the device bearing area 111 away from the switching device layer 120, so as to reduce the frame at the DP side and improve the screen occupation ratio of the whole liquid crystal display panel; moreover, the flexible transparent substrate 110 completely replaces the array side glass substrate 130, and the lower polarizer with the preset hardness requirement is adopted for reinforcement, so that the thickness of the whole liquid crystal module can be reduced.

Specifically, the specific contents of S11 to S13 are the same as those of S01 to S03 in the above embodiment, and S16 is the same as that of S05 in the above embodiment, and detailed description thereof is omitted here.

In S14, the array side glass substrate 130 on the side of the flexible transparent substrate 110 away from the switching device is completely removed, and the color filter substrate 200 in the circuit bonding region 112 is removed at the same time.

Therefore, in S15, a polarizer with a certain hardness needs to be attached to the bottom of the flexible transparent substrate 110, that is, a polarizer with a preset hardness requirement is attached to a side of the device bearing area 111 of the flexible transparent substrate 110 away from the color film substrate 200, where the polarizer is a lower polarizer, and the upper polarizer is mounted according to the attachment position of the conventional liquid crystal module, and the hardness is not too high. The predetermined hardness requirement in the lower polarizer in this embodiment is at least 6H.

On the basis of the above embodiment, in order to further increase the screen occupation ratio, after S13 and before S15, the method further includes: the color filter substrate 200 and the array side glass substrate 130 in the first scan driving region 114, the second scan driving region 115 and the circuit bonding opposite side region 113 are removed.

In S16, after the step of attaching the circuit bonding area 112 to the external control circuit, the method further includes: the first scan driving region 114, the second scan driving region 115, and the circuit bonding opposite-side region 113 are bent to a side of the device carrying region 111 away from the switching device layer 120.

The embodiments of the application have at least the following technical effects:

1. the flexible transparent substrate is used as the substrate of the switch device layer, the circuit binding region used for being connected with an external control circuit is reserved, the circuit binding region can be bent, the free end of the bent circuit binding region is located on one side, away from the switch device layer, of the device bearing region of the flexible transparent substrate, the frame on the DP side is reduced, and the screen occupation ratio of the whole liquid crystal display panel is improved.

2. The first scanning driving area, the second scanning driving area, the circuit binding area and the circuit binding opposite side area which are connected with the device bearing area are all in a bending state, and the free ends of the bent first scanning driving area, the bent second scanning driving area, the circuit binding area and the circuit binding opposite side area are all located on one side, far away from the switch device layer, of the device bearing area, so that the side frame of the liquid crystal module is further reduced, and the design of a comprehensive screen is facilitated.

3. The array side glass substrate is completely replaced by the flexible transparent substrate, so that the lower polarizer is directly attached to the bottom of the device bearing area in the flexible transparent substrate, the thickness of the whole liquid crystal module can be reduced, the lower polarizer adopts hardness required by preset hardness, and the strength of the flexible transparent substrate can be ensured.

4. The first scanning driving area, the second scanning driving area, the circuit binding area and the circuit binding opposite side area are all located on one side, away from the light source, of the back plate after being bent, namely located outside an area surrounded by the back plate of the backlight source, and therefore the light of the backlight source is prevented from being influenced by the bent areas, and the light emitting effect is guaranteed.

5. A substrate that is used for each LCD module of concatenation all adopts flexible transparent basement as the switching element layer, and each circuit connection region homoenergetic outside the device bearing area of flexible transparent basement is buckled for the encapsulation frame adaptability corresponding to each LCD module is buckled, thereby reduces the panel sealing area, guarantees that concatenation department frame reduces than former design, promotes visual effect.

6. The backlight source component of each liquid crystal module in the spliced display panel adopts an integral backlight source, the integral backlight source can provide backlight for the whole spliced display panel, the rapid assembly is realized, the consistency of the light source is better, and the display effect of the spliced display panel is favorably improved.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.

Claims

1. A liquid crystal film group (1) comprises a color film substrate (200) and an array substrate (100) which are arranged in a box-to-box mode, wherein a liquid crystal layer (300) is filled between the color film substrate (200) and the array substrate (100), and the array substrate (100) is characterized by comprising: a laminated flexible transparent substrate (110) and a switching device layer (120);

the flexible transparent substrate (110) comprises a device bearing region (111) bearing the switching device layer (120) and a circuit binding region (112) used for connecting an external control circuit;

the circuit binding region (112) is in a bent state, one end of the circuit binding region (112) is connected with the device bearing region (111), and the other end of the circuit binding region is located on one side, away from the switch device layer (120), of the device bearing region (111).

2. A liquid crystal film stack (1) according to claim 1, wherein said flexible transparent substrate (110) further comprises: a first scan driving region (114), a second scan driving region (115), and a circuit bonding opposite side region (113) connected to the device carrying region (111);

the first scanning driving area (114) and the second scanning driving area (115) are respectively positioned at first opposite sides of the device bearing area (111); the circuit bonding region (112) and the circuit bonding opposite side region (113) are respectively positioned at second opposite sides of the device bearing region (111);

the first scanning driving area (114), the second scanning driving area (115) and the circuit binding opposite side area (113) are all in a bent state, and free ends of the first scanning driving area (114), the second scanning driving area (115) and the circuit binding opposite side area (113) are all located on one side, away from the switching device layer (120), of the device bearing area (111).

3. A liquid crystal film stack (1) according to claim 2, characterized in that the flexible transparent substrate (110) comprises at least a transparent polyimide film or a transparent cyclic olefin polymer film.

4. The liquid crystal film group (1) according to claim 2, wherein the liquid crystal film group (1) further comprises: the array substrate comprises an upper polarizer (800) and a lower polarizer (900), wherein the upper polarizer (800) is attached to one side, away from the array substrate (100), of the color film substrate (200), and the lower polarizer (900) is connected with one side, away from the switch device layer (120), of the device bearing area (111).

5. The liquid crystal film group (1) according to claim 4, wherein the lower polarizer (900) is attached to a side of the device carrying area (111) away from the switching device layer (120); the hardness of the lower polarizer is at least 6H.

6. The liquid crystal film group (1) according to claim 4, wherein the array substrate (100) further comprises an array-side glass substrate (130), and the array-side glass substrate (130) is attached to a side of the device carrying region (111) away from the color filter substrate (200); the lower polarizer (900) is attached to one side of the array side glass substrate (130) far away from the flexible transparent substrate (110).

7. The liquid crystal film group (1) according to claim 2, wherein the liquid crystal film group (1) further comprises: a backlight assembly (700), the backlight assembly (700) comprising a back plate and a light source surrounded by the back plate;

the backlight source assembly (700) is located on one side of the flexible transparent substrate (110) far away from the switching device layer (120), and the first scanning driving area (114), the second scanning driving area (115), the circuit binding area (112) and the circuit binding opposite side area (113) are located on one side of the backboard far away from the light source after being bent.

8. The liquid crystal display panel is characterized by comprising an encapsulation frame (2) and the liquid crystal film group (1) as claimed in any one of claims 1 to 7, wherein the encapsulation frame (2) is connected with one side of the color film substrate (200) far away from the flexible transparent substrate (110).

9. A tiled display panel comprising at least two liquid crystal film stacks (1) according to any of claims 2 to 7, and a package frame (2) corresponding to each of the liquid crystal film stacks (1);

each packaging frame (2) and a first scanning driving area (114), a second scanning driving area (115), a circuit binding area (112) and a circuit binding opposite side area (113) of the corresponding liquid crystal film group (1) are bent in a self-adapting mode;

and all the liquid crystal film groups (1) are assembled according to a preset rule to form a whole spliced display panel.

10. The tiled display panel according to claim 9 wherein the backlight assembly (700) of each liquid crystal film group (1) comprises an integral backlight.

11. A method for producing a liquid crystal film group (1), comprising:

arranging a flexible transparent substrate (110) on an array side glass substrate (130) to form a composite glass substrate;

preparing a switching device layer (120) on a side of the device carrying area (111) of the flexible transparent substrate (110) away from the array-side glass substrate (130);

the color film substrate (200) and the composite glass substrate are boxed and cut to form a liquid crystal film group (1) unit;

removing the color film substrate (200) and the array side glass substrate (130) in the circuit binding region (112) of the flexible transparent substrate (110);

and after being attached with an external control circuit, the circuit binding region (112) is bent to one side, away from the switching device layer (120), of the device bearing region (111) of the flexible transparent substrate (110).

12. The method for manufacturing a liquid crystal film group (1) according to claim 11, wherein after the color film substrate (200) and the composite glass substrate are assembled and cut to form a liquid crystal film group (1) unit, and before the circuit bonding region (112) is attached to an external control circuit, the method further comprises:

removing the color film substrate (200) and the array side glass substrate (130) which are positioned in the first scanning driving area (114), the second scanning driving area (115) and the circuit binding opposite side area (113);

and after the circuit binding region (112) is attached to an external control circuit, the method further comprises the following steps:

and bending the first scanning driving area (114), the second scanning driving area (115) and the circuit binding opposite side area (113) to the side of the device bearing area (111) far away from the switching device layer (120).

13. A method for producing a liquid crystal film group (1), comprising:

removing the whole array side glass substrate (130) and the color film substrate (200) located in the circuit binding region (112) of the flexible transparent substrate (110);

attaching a polarizer with preset hardness requirements to one side, away from the color film substrate (200), of the device bearing area (111) of the flexible transparent substrate (110);

and after being attached with an external control circuit, the circuit binding region (112) is bent to one side, away from the switch device layer (120), of the device bearing region (111) of the flexible transparent substrate (110).

14. The method for manufacturing the liquid crystal film group (1) according to claim 13, wherein after the color film substrate (200) and the composite glass substrate are assembled and cut to form a liquid crystal film group (1) unit, and before a polarizer having a preset hardness requirement is attached to one side of the device bearing region (111) of the flexible transparent substrate (110) away from the color film substrate (200), the method further comprises: