CN111257856B - Scanning mirror monitoring system and method - Google Patents
Scanning mirror monitoring system and method Download PDFInfo
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- CN111257856B CN111257856B CN202010108623.6A CN202010108623A CN111257856B CN 111257856 B CN111257856 B CN 111257856B CN 202010108623 A CN202010108623 A CN 202010108623A CN 111257856 B CN111257856 B CN 111257856B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/497—Means for monitoring or calibrating
- G01S7/4972—Alignment of sensor
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
Abstract
The invention discloses a scanning mirror monitoring system, which comprises a controller and a scanning device, wherein the controller comprises a processor and a control circuit; the scanning device comprises a transmitter/receiver and a scanning component; the scanning component comprises a bracket, a scanning mirror, a capacitor, a first lead and a monitoring circuit; the scanning mirror is arranged on the universal frame to perform two-dimensional deflection; the capacitor comprises at least one electrode arranged on the bracket, the scanning mirror and the universal frame; the monitoring circuit is used for monitoring the signal change of the capacitor and sending the monitoring signal to the control circuit; the control circuit receives the monitoring signal and judges the structural integrity and the working state of the scanning assembly so as to modulate the working state of the transmitter/receiver and the scanning assembly. By monitoring the scanning device in real time, the scanning device can stop working when the scanning system is abnormal or damaged, thereby effectively ensuring the safety of human eyes and avoiding accidents.
Description
Technical Field
The invention relates to the technical field of laser scanning, in particular to a scanning mirror monitoring system and a method.
Background
The MEMS device can be used in the field of rapid optical scanning, and has wide application in the fields of projection display, bar code scanning, laser printers, medical imaging, optical communication and the like. In recent years, due to the application of MEMS micro-vibration mirrors, the laser radar is helped to get rid of heavy mechanical motion devices such as motors and multi-prisms, and particularly, the size of the laser radar is greatly reduced due to the use of the MEMS micro-vibration mirrors with millimeter-scale sizes. The MEMS micro-galvanometer has obvious advantages in view of aesthetic degree, vehicle-mounted integration degree and cost.
However, in the use process of the MEMS micro-vibrating mirror, when the MEMS micro-vibrating mirror has a mechanical failure, a breakage failure, or the like, the MEMS micro-vibrating mirror stops working, the scanning range is lost, and further, the light beam emitted by the laser is continuously focused on one point, the laser power is intensively incident to the human eye, which causes the increase of the optical power received by the human eye per unit area, and the optical power per unit area is rapidly increased, which may cause the damage to the human eye, and even cause blindness for a serious person. In addition, when the MEMS micro-oscillating mirror fails, the scanning range is lost, which also causes signal loss of the system.
Therefore, the safety protection of human eyes is particularly important in the use of the MEMS micro-vibrating mirror. How to realize effectively the real-time anomaly monitoring to the scanning mirror, close the laser instrument in the twinkling of an eye that the scanning mirror stops, effectively guarantee people's eye safety, avoid the emergence of accident, this is the problem that needs solve urgently.
The above background disclosure is only for the purpose of assisting understanding of the inventive concept and technical solutions of the present invention, and does not necessarily belong to the prior art of the present patent application, and should not be used for evaluating the novelty and inventive step of the present application in the case that there is no clear evidence that the above content is disclosed at the filing date of the present patent application.
Disclosure of Invention
It is an object of the present invention to provide a scanning mirror monitoring system and method to solve at least one of the above-mentioned problems.
In order to achieve the above purpose, the technical solution of the embodiment of the present invention is realized as follows:
a scanning mirror monitoring system comprises a controller and a scanning device, wherein the controller comprises a processor and a control circuit; the scanning device comprises a transmitter/receiver and a scanning component; the scanning assembly comprises a bracket, a scanning mirror, a capacitor, a first lead and a monitoring circuit, wherein the scanning mirror is arranged on the bracket; the scanning mirror is arranged on the gimbal to perform two-dimensional deflection; the capacitor comprises at least one electrode arranged on the bracket, the scanning mirror and the universal frame; the first lead is wound on the boundary of the scanning mirror and is used for connecting an electrode on the scanning mirror; the monitoring circuit is used for monitoring the signal change of the capacitor and sending a monitoring signal to the control circuit; the control circuit receives the monitoring signal and judges the structural integrity and the working state of the scanning assembly so as to modulate the working state of the transmitter/receiver and the scanning assembly.
In some embodiments, the capacitors include a first capacitor, a second capacitor, a third capacitor, and a fourth capacitor; wherein a first electrode on the mount and a second electrode on the gimbal define the first capacitor; a third electrode on the gimbal and a fourth electrode on the scan mirror define the second capacitor; the fifth electrode on the scan mirror and the sixth electrode on the gimbal define the third capacitor; and the seventh electrode on the gimbal and the eighth electrode on the mount define the fourth capacitor.
In some embodiments, the scanning assembly further comprises a first hinge, a second hinge, a third hinge, and a fourth hinge; wherein the scanning mirror is hinged with the gimbal through the first hinge and the fourth hinge, so that the scanning mirror can oscillate and deflect along the direction of the connecting line of the first hinge and the fourth hinge; the universal frame is hinged with the support through the second hinge and the third hinge, so that the universal frame can oscillate and deflect along the direction of the connecting line of the second hinge and the third hinge.
In some embodiments, the scan assembly further comprises a continuous modulation signal unit for outputting a high frequency voltage signal and a low frequency voltage signal; the bracket is provided with a first welding spot, a second welding spot, a third welding spot and a fourth welding spot; one end of the first welding spot is connected with the modulation signal unit, and the other end of the first welding spot is connected with the first electrode; one end of the second welding spot is connected with the modulation signal unit, and the other end of the second welding spot is connected with the third electrode; one end of the third welding spot is connected with the monitoring circuit, and the other end of the third welding spot is connected with the sixth electrode; one end of the fourth welding spot is connected with the monitoring circuit, and the other end of the fourth welding spot is connected with the eighth electrode.
In some embodiments, the first wire is wound around a boundary of the scan mirror and passes through the scan mirror such that the fourth electrode is connected to the fifth electrode.
In some embodiments, the scanning assembly further comprises a second wire wound around a boundary of the gimbal and passing through the fourth hinge and the first hinge such that the second electrode is connected to the seventh electrode.
In some embodiments, the high-frequency voltage signal output by the modulation signal unit is used for monitoring the structural integrity and the working state of the scanning device when the scanning mirror is in polarization oscillation along the connection direction of the first hinge and the fourth hinge; and the low-frequency voltage signal output by the modulation signal unit is used for monitoring the working state of the scanning device when the universal frame deflects and oscillates along the connection direction of the second hinge and the third hinge.
The other technical scheme of the embodiment of the invention is as follows:
a method of monitoring a scanning mirror, comprising the steps of:
step S1: controlling the transmitter/receiver to transmit light pulses to the scanning assembly and receiving light information fed back after the light pulses projected outwards by the scanning assembly are reflected; the scanning component comprises a scanning mirror, and the scanning mirror is controlled to perform two-dimensional deflection oscillation so as to project light pulses outwards;
step S2: the control monitoring circuit monitors the signal change of the scanning mirror during deflection oscillation and sends a monitoring signal to the control circuit; the scanning assembly further comprises a support, a universal frame, a capacitor and a monitoring circuit, wherein the capacitor comprises at least one electrode arranged on the support, the scanning mirror and the universal frame; monitoring voltage changes of a capacitor formed by at least one electrode on the bracket, the universal frame and the scanning mirror through a monitoring circuit, and sending a monitoring signal to a control circuit;
step S3: the control circuit receives the monitoring signal and determines the structural integrity and operating state of the scanning assembly, thereby modulating the operating state of the transmitter/receiver and the scanning assembly.
In some embodiments, in step S2, the monitoring circuit monitors a voltage change of a capacitor formed by at least one electrode on the scan assembly support, the gimbal, and the scan mirror, the capacitor conducts a voltage signal under a normal operation condition of the scan mirror, and the monitoring circuit monitors a periodic discrete signal; when the scanning mirror, the universal frame or the hinge are damaged or work abnormally, the monitoring signal of the monitoring circuit is abnormal or cannot be monitored.
In some embodiments, the scan assembly further comprises a continuous modulation signal unit for outputting a high frequency voltage signal and a low frequency voltage signal.
The technical scheme of the invention has the beneficial effects that:
the invention has important significance in monitoring the structural integrity of the scanning mirror, the universal frame and the hinge and the working state of the two-dimensional oscillation deflection of the scanning mirror at the same time by monitoring the appearance and the functional integrity of the scanning device in real time, and can stop the working of the scanning system when the scanning system is abnormal or damaged, thereby effectively ensuring the safety of human eyes and avoiding accidents.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a scanning mirror monitoring system according to one embodiment of the present invention.
FIG. 2 is a schematic diagram of a scanning assembly of a scanning mirror monitoring system in accordance with one embodiment of the present invention.
FIG. 3 is another angular illustration of a scanning assembly of the scanning mirror monitoring system according to one embodiment of the present invention.
FIG. 4 is a flowchart illustration of a scanning mirror monitoring method according to one embodiment of the invention.
FIG. 5a is a graphical representation of a monitoring signal monitored by a scanning mirror monitoring method in accordance with one embodiment of the present invention.
FIG. 5b is another illustration of a monitoring signal monitored by a scanning mirror monitoring method according to an embodiment of the invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the embodiments of the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. The connection may be for fixation or for circuit connection.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the embodiments of the present invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be in any way limiting of the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
FIG. 1 is a schematic diagram of a scanning mirror monitoring system according to an embodiment of the present invention, wherein the monitoring system 300 includes a controller 301 and a scanning device 302. The controller 301 includes a processor 304 and a control circuit 305; scanning device 302 includes a transmitter/receiver 306 and a scanning component; the scanning assembly includes the scanning mirror 102 and a monitoring circuit 308. The processor 304 includes one or more processing units for sending command control outputs to the control circuit 305, the control circuit 305 receiving the signals from the monitoring circuit 308 and providing control outputs in accordance with the commands of the processor 304, which control outputs may be, as desired, for controlling the scanning frequency, phase and amplitude of the scanning mirror 102, and for controlling the amplitude and repetition rate at which the transmitter/receiver 306 sends pulses of light; the emitter/receiver 306 sends the light pulse to the scanning mirror 102 in the scanning assembly and receives the light information fed back after being projected outward by the scanning mirror 102, and the scanning mirror 102 is used for projecting the received light pulse outward quickly and uniformly; the monitoring circuit 308 is used to monitor the structural integrity and operational status of the scan mirror 102 and to send monitoring signals to the control circuit 306.
Referring to fig. 2, the scanning assembly includes a carriage 101, a scanning mirror 102 mounted on the carriage 101, a capacitor, a first wire 103, and a monitoring circuit 104. Wherein, the support 101 is formed by a semiconductor substrate, the support 101 comprises a gimbal 105; the scan mirror 102 is mounted on a gimbal 105 for two-dimensional deflection; the capacitor comprises at least one electrode arranged on the support 101, the scanning mirror 102 and the gimbal 105; the first lead 103 is wound on the boundary of the scanning mirror 102 and is used for connecting electrodes on the scanning mirror 102; the monitoring circuit 104 is used to monitor the change in the signal of the capacitor as the scan mirror 102 deflects.
In some embodiments, the scanning assembly further comprises a first hinge 106, a second hinge 107, a third hinge 108, and a fourth hinge 109. The scanning mirror 102 is hinged to the gimbal 105 through a first hinge 106 and a fourth hinge 109, so that the scanning mirror 102 oscillates and deflects at a high speed along a connecting direction of the first hinge 106 and the fourth hinge 109, thereby realizing two-dimensional oscillating and deflecting of the scanning device 100, and reflecting and projecting a laser beam to any spatial position within a certain range; the gimbal 105 is hinged to the support 101 by a second hinge 107 and a third hinge 108, so that the gimbal 105 can rapidly oscillate and deflect along a direction of a line connecting the second hinge 107 and the third hinge 108.
In some embodiments, the capacitors include a first capacitor 110, a second capacitor 111, a third capacitor 112, and a fourth capacitor 113. The first electrode 114 on the support 101 and the second electrode 115 on the gimbal 105 define a first capacitor 110; a third electrode 116 on the gimbal 105 and a fourth electrode 117 on the scan mirror 102 define a second capacitor 111; a fifth electrode 118 on the scan mirror 102 and a sixth electrode 119 on the gimbal 105 define a third capacitor 112; and the seventh electrode 120 on the gimbal 105 and the eighth electrode 121 on the support 101 define a fourth capacitor 113. It should be noted that, in the embodiment of the present invention, the capacitor may be a MEMS capacitor, and may also be another type of capacitor, which is not limited herein.
In some embodiments, the capacitance value of the capacitor defined by each of the aforementioned pairs of electrodes varies according to the gap between the electrodes and as a function of the tilt angle of the gimbal 105 and scan mirror 102. The support 101 defines a plane in which the gimbal 105 and the scan mirror 102 have equilibrium positions, the gimbal 105, the first electrode 114, and the eighth electrode 121 being coplanar when the gimbal 105 is in the equilibrium position; and when the scan mirror 102 is in the equilibrium position, the scan mirror 102, the third electrode 116, and the sixth electrode 119 are coplanar.
In some embodiments, the scanning assembly further comprises a continuous modulation signal unit 126 for outputting a high frequency voltage signal and a low frequency voltage signal; four welding points are arranged on the bracket 101, which are a first welding point 122, a second welding point 123, a third welding point 124 and a fourth welding point 125. One end of the first welding point 122 is connected with the modulating signal unit 126 through a wire, and the other end is connected with the first electrode 114 on the bracket 101; one end of the second welding point 123 is connected with the modulation signal 126 through a wire, and the other end is connected with the third electrode 116 through the third hinge 108; one end of the third welding point 124 is connected with the monitoring circuit 104 through a wire, and the other end is connected with the sixth electrode 119 through a second hinge 107; one end of the fourth pad 125 is connected to the monitoring circuit 104 through a wire, and the other end is connected to the eighth electrode 121 through a wire.
In some embodiments, the fourth electrode 117 on the scan mirror 102 is connected to the fifth electrode 118 via the first wire 103, and the first wire 103 is wound around the boundary of the scan mirror 102 and passes through the scan mirror 102 such that the fourth electrode 117 is connected to the fifth electrode 118 to monitor the structural integrity of the scan mirror 102. Referring to fig. 3, the second electrode 115 on the gimbal 105 is connected to the seventh electrode 120 through a second wire 201, and the second wire 201 is wound around the perimeter of the gimbal 105 and passes through the fourth hinge 109 and the first hinge 106 such that the second electrode 115 is connected to the seventh electrode 120 for monitoring the structural integrity of the gimbal 105, the first hinge 106, and the fourth hinge 109.
In some embodiments, the high frequency voltage signal output by the modulation signal elastic element 126 is used to monitor the structural integrity and operating status of the scanning device during high speed polarization oscillation of the scanning mirror 102 along the continuous direction of the first hinge 106 and the fourth hinge 109; while the low frequency voltage signal is used to monitor the operation of the scanning device during rapid yaw oscillations of the gimbal 105 in the continuous direction along the second hinge 107 and the third hinge 108. It should be noted that the output of the modulation signal unit 126 is not limited to a voltage signal, and may also be a monitoring signal such as a current signal, and the present disclosure is not limited herein.
In some embodiments, the modulation signal unit 126 sends a high frequency voltage signal to the second pad 123, the high frequency voltage signal reaches the support 101 through the second pad 123, the gimbal 101 is connected to the gimbal 105 through the third hinge 108, when the scan mirror 102 is in the equilibrium position, the third electrode 116 on the gimbal 105 and the second capacitor 111 formed by the fourth electrode 117 on the scan mirror 102 conduct the high frequency voltage signal, meanwhile, the fourth electrode 117 on the scan mirror 102 is connected to the fifth electrode 118 on the scan mirror 102 through the first wire 103, the fifth electrode 118 on the scan mirror 102 and the third capacitor 112 formed by the sixth electrode 119 on the gimbal 105 also conduct the high frequency voltage signal, and finally the high frequency voltage signal reaches the monitoring circuit 104 after passing through the second hinge 107 and the third pad 124 on the support 101, as the scan mirror 102 oscillates around the central axis where the first hinge 106 and the fourth hinge 109 are located and the discontinuity of the high frequency voltage signal continues to conduct, the signal monitored by the monitoring circuit 104 is a discrete signal with many discontinuities monitored within 1 second, as shown in fig. 5 (a).
In some embodiments, the modulation signal unit 126 sends a low frequency voltage signal to the first pad 122, the low frequency voltage signal reaches the support 101 through the first pad 122, when the gimbal 105 is in the equilibrium position, the first electrode 114 on the support 101 and the first capacitor 110 formed by the second electrode 115 on the gimbal 105 conduct the low frequency voltage signal, at the same time, the second electrode 115 on the gimbal 105 transmits the low frequency voltage signal to the seventh electrode 120 through the second wire 201, the seventh electrode 120 on the gimbal 105 and the fourth capacitor 113 formed by the eighth electrode 121 on the support 101 conduct the low frequency voltage signal, the low frequency voltage signal reaches the monitoring circuit 104 through the fourth pad, and as the gimbal 105 oscillates and deflects around the central axis of the second hinge 107 and the third hinge 108 and the low frequency voltage signal is continuously conducted, the signal monitored by the monitoring circuit 104 is as shown in fig. 5(b), at 2X 10-4A number of discrete signals are monitored at intervals in seconds.
It will be appreciated that the controller 301 will typically also include auxiliary circuitry, such as a power supply 303 and other components as are known in the art, and that for the sake of conceptual clarity, although the functional elements of the controller 301 are shown as separate blocks in fig. 1, some or all of these elements may be combined in a single integrated circuit, and are not particularly limited in embodiments of the present invention, in any way without departing from the spirit of the present invention.
FIG. 4 is a flowchart illustration of a scanning mirror monitoring method according to another embodiment of the present invention. The monitoring method comprises the following steps:
step S1: controlling the transmitter/receiver to transmit light pulses to the scanning assembly and receiving light information fed back after the light pulses projected outwards by the scanning assembly are reflected;
the scanning component comprises a scanning mirror, and the scanning mirror is controlled to perform two-dimensional deflection oscillation so as to project light pulses outwards; the scanning component also comprises a modulation signal unit which sends a continuous modulation signal along with the deflection oscillation of the scanning mirror;
step S2: the control monitoring circuit monitors the signal change of the scanning mirror during deflection oscillation and sends a monitoring signal to the control circuit;
the scanning assembly comprises a capacitor, the capacitor comprises at least one electrode arranged on a scanning assembly support, a scanning mirror and a gimbal, and a monitoring circuit monitors the voltage change of the capacitor formed by the support, the gimbal and the at least one electrode on the scanning mirror so as to send a monitoring signal to a control circuit;
step S3: the control circuit receives the monitoring signal and determines the structural integrity and operating state of the scanning assembly, thereby modulating the operating state of the transmitter/receiver and the scanning assembly.
More specifically, in step S1, the transmitter/receiver sends a light pulse to the scan mirror under the control of the controller, and the scan mirror projects the light pulse rapidly and uniformly outward through oscillating deflection, so as to realize two-dimensional scanning, so as to project the light pulse to an arbitrary spatial position in a certain range in a reflection manner; in the oscillating and deflecting process of the scanning mirror, the modulating signal unit sends a continuous modulating signal to the scanning assembly, the scanning assembly receives the continuous modulating signal, the control circuit sends a starting command to the monitoring circuit, and the monitoring circuit starts to monitor the structural integrity and the working state of the scanning assembly.
In step S2, the monitoring circuit monitors a voltage change of a capacitor formed by at least one electrode on the scanning assembly bracket, the gimbal and the scanning mirror, and when the scanning mirror works normally, and all the electrodes are in a common plane, the capacitor conducts a voltage signal, and the monitoring circuit monitors a periodic discrete signal; when the scanning mirror, the universal frame or the hinge are damaged or work abnormally, the monitoring signal of the monitoring circuit is abnormal or cannot be monitored.
In step S3, the control circuit receives the monitoring signal, determines the operating status of the scanning assembly according to the received monitoring signal, and modulates the operating status of the transmitter/receiver and the scanning assembly.
In step S3, the control circuit may modulate the transmission and reception frequencies of the transmitter/receiver according to the received monitoring signal.
The invention monitors the characteristics of the modulation signal in the device with low delay through a simple monitoring circuit, monitors the appearance and the functional integrity of the scanning device in real time, has important significance on monitoring the structural integrity of the scanning mirror, the universal frame and the hinge and the working state of the two-dimensional oscillation deflection of the scanning mirror at the same time, and can stop the working, initiate the inspection and the correction when the scanning system is abnormal or damaged.
It is to be understood that the foregoing is a more detailed description of the invention, and that specific embodiments are not to be considered as limiting the invention. It will be apparent to those skilled in the art that various substitutions and modifications can be made to the described embodiments without departing from the spirit of the invention, and these substitutions and modifications should be considered to fall within the scope of the invention. In the description herein, references to the description of the term "one embodiment," "some embodiments," "preferred embodiments," "an example," "a specific example," or "some examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention.
In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent. Although embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the scope of the invention as defined by the appended claims.
Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. One of ordinary skill in the art will readily appreciate that the above-disclosed, presently existing or later to be developed, processes, machines, manufacture, compositions of matter, means, methods, or steps, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.
Claims (8)
1. A scanning mirror monitoring system, includes controller and scanning device, its characterized in that: the controller comprises a processor and a control circuit; the scanning device comprises a transmitter/receiver and a scanning component; the scanning assembly comprises a bracket, a scanning mirror, a capacitor, a first lead and a monitoring circuit, wherein the scanning mirror, the capacitor, the first lead and the monitoring circuit are arranged on the bracket; the scanning mirror is arranged on the gimbal to perform two-dimensional deflection; the capacitor comprises at least one electrode arranged on the bracket, the scanning mirror and the universal frame; the first lead is wound on the boundary of the scanning mirror and is used for connecting an electrode on the scanning mirror; the monitoring circuit monitors voltage change of a capacitor formed by at least one electrode on the scanning component support, the universal frame and the scanning mirror, the capacitor conducts voltage signals under the normal working condition of the scanning mirror, the monitoring circuit monitors periodic discrete signals, when the scanning mirror, the universal frame or the hinge are damaged or work abnormally, the monitoring signals of the monitoring circuit are abnormal or cannot monitor the signals, and the monitoring circuit sends the monitoring signals to the control circuit; the control circuit receives the monitoring signal, judges the structural integrity and the working state of the scanning assembly, modulates the working state of the transmitter/receiver and the scanning assembly, and stops working when the scanning system is abnormal or damaged.
2. The scanning mirror monitoring system of claim 1, wherein: the capacitors include a first capacitor, a second capacitor, a third capacitor, and a fourth capacitor; wherein a first electrode on the mount and a second electrode on the gimbal define the first capacitor; a third electrode on the gimbal and a fourth electrode on the scan mirror define the second capacitor; the fifth electrode on the scan mirror and the sixth electrode on the gimbal define the third capacitor; and the seventh electrode on the gimbal and the eighth electrode on the mount define the fourth capacitor.
3. A scanning mirror monitoring system as claimed in claim 2, wherein: the scanning assembly further comprises a first hinge, a second hinge, a third hinge and a fourth hinge; wherein the scanning mirror is hinged with the gimbal through the first hinge and the fourth hinge, so that the scanning mirror can oscillate and deflect along the direction of the connecting line of the first hinge and the fourth hinge; the universal frame is hinged with the support through the second hinge and the third hinge, so that the universal frame can oscillate and deflect along the direction of the connecting line of the second hinge and the third hinge.
4. A scanning mirror monitoring system as claimed in claim 3, wherein: a first welding point, a second welding point, a third welding point and a fourth welding point are arranged on the bracket; one end of the first welding spot is connected with the modulation signal unit, and the other end of the first welding spot is connected with the first electrode; one end of the second welding spot is connected with the modulation signal unit, and the other end of the second welding spot is connected with the third electrode; one end of the third welding spot is connected with the monitoring circuit, and the other end of the third welding spot is connected with the sixth electrode; one end of the fourth welding spot is connected with the monitoring circuit, and the other end of the fourth welding spot is connected with the eighth electrode.
5. A scanning mirror monitoring system as claimed in claim 3, wherein: the first lead is wound on the boundary of the scanning mirror and penetrates through the scanning mirror to enable the fourth electrode to be connected with the fifth electrode.
6. A scanning mirror monitoring system as claimed in claim 3, wherein: the scanning assembly further comprises a second wire wound on the boundary of the gimbal and passing through the fourth hinge and the first hinge so that the second electrode is connected with the seventh electrode.
7. The scanning mirror monitoring system of claim 4, wherein: the high-frequency voltage signal output by the modulation signal unit is used for monitoring the structural integrity and the working state of the scanning device when the scanning mirror is subjected to polarization oscillation along the connection direction of the first hinge and the fourth hinge; and the low-frequency voltage signal output by the modulation signal unit is used for monitoring the working state of the scanning device when the universal frame deflects and oscillates along the connection direction of the second hinge and the third hinge.
8. A method for monitoring a scanning mirror, comprising the steps of: step S1: controlling the transmitter/receiver to transmit light pulses to the scanning assembly and receiving light information fed back after the light pulses projected outwards by the scanning assembly are reflected; the scanning assembly comprises a scanning mirror, a continuous modulation signal unit and a control unit, wherein the scanning mirror is controlled to perform two-dimensional deflection oscillation so as to project light pulses outwards; step S2: the control monitoring circuit monitors the signal change of the scanning mirror during deflection oscillation and sends a monitoring signal to the control circuit; the scanning assembly further comprises a support, a universal frame, a capacitor and a monitoring circuit, wherein the capacitor comprises at least one electrode arranged on the support, the scanning mirror and the universal frame; the voltage change of a capacitor formed by at least one electrode on the bracket, the universal frame and the scanning mirror is monitored through a monitoring circuit, under the normal working condition of the scanning mirror, the capacitor conducts a voltage signal, and the monitoring circuit monitors a periodic discrete signal; when the scanning mirror, the universal frame or the hinge is damaged or works abnormally, the monitoring signal of the monitoring circuit is abnormal or cannot be monitored, and the monitoring circuit sends the monitoring signal to the control circuit; step S3: the control circuit receives the monitoring signal, judges the structural integrity and the working state of the scanning assembly, thereby modulating the working state of the transmitter/receiver and the scanning assembly and stopping the operation of the scanning assembly when the scanning system is abnormal or damaged.
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| CN114859328B (en) * | 2022-04-21 | 2023-05-05 | 北京一径科技有限公司 | Method and device for detecting stop swing of MEMS scanning mirror and laser radar |
| CN114910888B (en) * | 2022-04-21 | 2023-04-07 | 北京一径科技有限公司 | Scanner anomaly detection method and apparatus, laser radar, and storage medium |
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