CN111253885A - Adhesive composition, light guide film and solar cell module - Google Patents
Adhesive composition, light guide film and solar cell module Download PDFInfo
- Publication number
- CN111253885A CN111253885A CN201811455184.5A CN201811455184A CN111253885A CN 111253885 A CN111253885 A CN 111253885A CN 201811455184 A CN201811455184 A CN 201811455184A CN 111253885 A CN111253885 A CN 111253885A
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- Prior art keywords
- adhesive composition
- layer
- light directing
- adhesive
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 104
- 239000000203 mixture Substances 0.000 title claims abstract description 89
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- 239000003431 cross linking reagent Substances 0.000 claims abstract description 43
- 239000004823 Reactive adhesive Substances 0.000 claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims abstract description 20
- 239000011230 binding agent Substances 0.000 claims abstract description 19
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- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 8
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 8
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- CARSMBZECAABMO-UHFFFAOYSA-N 3-chloro-2,6-dimethylbenzoic acid Chemical compound CC1=CC=C(Cl)C(C)=C1C(O)=O CARSMBZECAABMO-UHFFFAOYSA-N 0.000 claims description 7
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- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 6
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- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 6
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 6
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- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 6
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- WRVWOBJLGCVCSC-UHFFFAOYSA-N tris(1,2,2,6,6-pentamethylpiperidin-3-yl) phosphite Chemical compound CC1(C)N(C)C(C)(C)CCC1OP(OC1C(N(C)C(C)(C)CC1)(C)C)OC1C(C)(C)N(C)C(C)(C)CC1 WRVWOBJLGCVCSC-UHFFFAOYSA-N 0.000 claims description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 3
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- 238000003851 corona treatment Methods 0.000 claims description 3
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- WCJLCOAEJIHPCW-UHFFFAOYSA-N octyl 2-hydroxybenzoate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1O WCJLCOAEJIHPCW-UHFFFAOYSA-N 0.000 claims description 3
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0053—Prismatic sheet or layer; Brightness enhancement element, sheet or layer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0055—Reflecting element, sheet or layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
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Abstract
The present invention provides an adhesive composition comprising a resin binder, a peroxide crosslinking agent, a non-peroxide crosslinking agent, a coupling agent, an ultraviolet absorber and an ultraviolet stabilizer, wherein the adhesive composition is exothermally reactive at a temperature above 95 ℃ and has an exotherm of 2-40J/g. The present invention also provides a light guiding film comprising a reactive adhesive layer comprising the adhesive composition. In addition, the invention also provides a solar cell module comprising the light guide film. When the adhesive composition according to the present invention is used as an adhesive layer for adhering a light guide film to a back sheet during the assembly of a solar cell module, it is possible to prevent the adhesive layer from swelling during high-temperature humid heat aging while maintaining high adhesiveness, and to greatly reduce the relative position drift of the light guide film during high-temperature lamination manufacturing.
Description
Technical Field
The invention relates to the technical field of photovoltaic cells, in particular to an adhesive composition, a light guide film comprising the adhesive composition and a solar cell module comprising the adhesive composition.
Background
With the increasing environmental problems, the development and application of clean energy is increasingly urgent. Solar energy has received increasing attention as a clean energy source. A solar cell is a device for generating electricity by using solar energy.
A solar cell commonly used at present includes a cell body encapsulated in an encapsulation cover sheet and an encapsulation back sheet. The light irradiates the light-facing surface of the battery body through the packaging cover plate, and the battery body converts the light energy in the light into electric energy. In order to improve the power generation efficiency of the solar cell module, a light guide film may be provided inside the solar cell module. When the solar module is used for generating electricity, light rays can irradiate on the optical structure of the light guide film after passing through the light transmission element. The optical structure of the light directing film can reflect incident light and change the direction of light propagation. Because the light is incident from top to bottom, the light guide film reflects the light upwards towards the light-transmitting element. When light reflected by the light guide film enters the light-transmitting element and is transmitted to the interface between the light-transmitting element and the air in the light-transmitting element, the light is reflected, the transmission direction of the light is changed again, the light finally irradiates the light-facing surface of the solar cell, and the solar cell generates electricity by utilizing the light, so that the electricity generation efficiency is improved. The light directing film is typically adhered by an adhesive layer on the backlight side surface of the solar cell or on the surface of the back sheet at the interior of the solar cell assembly. However, in an environment of high temperature and high humidity, the adhesive layer may gradually age over time, and a bulge may be generated between the light guide film and the package back sheet, thereby causing the light guide film to be damaged or to be peeled off from the adhesion surface.
Therefore, it is of great importance to develop an adhesive material for solar cell modules having good resistance to wet heat aging.
Disclosure of Invention
Starting from the technical problems set forth above, it is an object of the present invention to provide an adhesive material for solar cell modules having good resistance to wet heat aging, which has high adhesive force and does not generate a bulge in the adhesive layer under high-temperature wet heat aging conditions.
The present inventors have made intensive studies and completed the present invention.
According to one aspect of the present invention, there is provided an adhesive composition comprising a resin binder, a peroxide crosslinking agent, a non-peroxide crosslinking agent, a coupling agent, an ultraviolet absorber and an ultraviolet stabilizer, wherein the adhesive composition exothermically reacts at temperatures above 95 ℃ and has an exotherm of 2 to 40J/g.
According to certain preferred embodiments of the present invention, the adhesive composition comprises, based on the total weight of the adhesive composition:
90-98 wt% of said resinous binder;
0.4 to 1.4 weight percent of said peroxide crosslinking agent;
0.4 to 1.6 weight percent of the non-peroxide crosslinking agent;
0.5 to 1.5 weight percent of the coupling agent;
0.5 to 4 wt% of the ultraviolet absorber; and
0.2-2 wt% of the UV stabilizer.
According to certain preferred embodiments of the present invention, the resinous binder is selected from one or more of the group consisting of: ethylene-vinyl acetate (EVA) copolymer, polyolefin resin (PO), polypropylene oxide (PP), polyvinyl butyral (PVB), tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride (THV) copolymer, ethylene-tetrafluoroethylene (ETFE) copolymer, polyvinylidene fluoride (PVDF), Polyurethane (PU), polymethyl methacrylate (PMMA), and Polyimide (PI).
According to certain preferred embodiments of the present invention, the Melt Flow Index (MFI) of the resin base is in the range of 10 to 30.
According to certain preferred embodiments of the present invention, the resin binder is an ethylene-vinyl acetate (EVA) copolymer.
According to certain preferred embodiments of the present invention, in the ethylene-vinyl acetate (EVA) copolymer, the content of repeating units derived from vinyl acetate is from 24 to 30% by weight, based on the total weight of the ethylene-vinyl acetate copolymer.
According to certain preferred embodiments of the present invention, the content of repeating units derived from vinyl acetate in the ethylene-vinyl acetate (EVA) copolymer is from 26 to 28 wt.%, based on the total weight of the ethylene-vinyl acetate copolymer.
According to certain preferred embodiments of the present invention, the peroxide crosslinking agent is selected from one or more of the group consisting of: benzoyl Peroxide (BPO), dicumyl peroxide (DCP), tert-amyl peroxyacetate (TAPA), tert-butyl 2-ethylhexyl carbonate peroxide (TBEC) and tert-butyl peroxy-3, 5, 5-Trimethylhexanoate (TBPMH).
According to certain preferred embodiments of the present invention, the non-peroxide crosslinking agent is selected from one or more of the group consisting of: trimethylolpropane triacrylate (TMPTA) and triallyl isocyanurate (TAIC).
According to certain preferred embodiments of the present invention, the coupling agent is selected from one or more of a silane coupling agent and a phthalate ester coupling agent.
According to certain preferred embodiments of the present invention, the uv absorber is selected from one or more of the group consisting of: salicylate ultraviolet absorbers, benzophenone ultraviolet absorbers, benzotriazole ultraviolet absorbers, and triazine ultraviolet absorbers.
According to certain preferred embodiments of the present invention, the salicylate-based ultraviolet absorber is selected from one or more of methyl salicylate, ethyl salicylate, and octyl salicylate.
According to certain preferred embodiments of the present invention, the benzophenone-based ultraviolet absorber is selected from one or more of 2-hydroxy-4-methoxybenzophenone and 2-hydroxy-4-n-octoxybenzophenone.
According to certain preferred embodiments of the present invention, the benzotriazole-based ultraviolet absorber is selected from one or more of 2- (2 ' -hydroxy-3 ', 5 ' -di-tert-phenyl) -5-chlorobenzotriazole and 2- (2 ' -hydroxy-5 ' -methylphenyl) benzotriazole.
According to certain preferred embodiments of the present invention, the uv stabilizer is a hindered amine-based uv stabilizer.
According to certain preferred embodiments of the present invention, the hindered amine-based uv stabilizer is selected from one or more of the group consisting of: poly (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol) succinate, poly [ (6-morpholinyl-5-triazine-2, 4-diyl) (2,2,6, 6-tetramethylpiperidinyl) iminohexamethylene [ (2,2,6, 6-tetramethylpiperidinyl) -imino ] ], 4-benzoyloxy-2, 2,6, 6-tetramethylpiperidine and tris (1,2,2,6, 6-pentamethylpiperidinyl) phosphite.
According to another aspect of the present invention, there is provided a light guiding film comprising, in order, a light guiding layer, a substrate layer, and a reactive adhesive layer, wherein the reactive adhesive layer comprises the adhesive composition as described above.
According to certain preferred embodiments of the present invention, the substrate layer is physically surface treated.
According to certain preferred embodiments of the present invention, the physical surface treatment is a corona treatment or a plasma treatment.
According to certain preferred embodiments of the present invention, the thickness of the reactive adhesive layer is in the range of 10 to 100 μm.
According to certain preferred embodiments of the present invention, the light directing layer comprises an ordered arrangement of a plurality of microstructures extending from the base layer.
According to certain preferred embodiments of the present invention, the light guiding layer comprises a plurality of microstructures extending from the base layer in a disordered arrangement.
According to certain preferred embodiments of the present invention, the plurality of microstructures includes a side-by-side triangular prism array, and an orientation direction of the side-by-side triangular prism array is non-linearly oriented.
According to certain preferred embodiments of the present invention, the plurality of microstructures comprises an array of parallel triangular prisms, wherein one quadrilateral face of each triangular prism is in the same plane.
According to certain preferred embodiments of the present invention, the light directing film further comprises a primer layer between the reactive adhesive layer and the base layer.
According to certain preferred embodiments of the present invention, the primer coating is a polyester primer coating or a polyacrylate primer coating.
According to an aspect of the present invention, there is provided that the light directing film further comprises a light reflecting layer covering the plurality of microstructures and conforming to the plurality of microstructures.
According to still another aspect of the present invention, there is provided a solar cell module comprising a light-transmitting member, a front encapsulant layer, a plurality of solar cells spaced apart from each other, a rear encapsulant layer and a back sheet sequentially arranged in a thickness direction thereof, wherein the solar cell module further comprises a light guiding film as described above, the light guiding film being disposed between the rear encapsulant layer and the back sheet and adhered to a surface of the back sheet through the reactive adhesive layer.
According to certain preferred embodiments of the present invention, the side of the backsheet facing the solar cells comprises a non-hot melt adhesive material.
According to certain preferred embodiments of the present invention, the side of the backsheet facing the solar cells comprises a fluorine-containing non-hot melt adhesive material.
Compared with the prior art in the field, the invention has the advantages that:
1. the adhesive layer has high adhesion;
2. avoiding bulge between the light guide film and the packaging back plate in the high-temperature damp-heat aging process; and
3. the relative position drift of the light guide film in the high-temperature lamination preparation process is greatly reduced.
Drawings
FIG. 1 shows a cross-sectional view of a light directing film according to one embodiment of the present invention; and
FIG. 2 shows a perspective view of an array of parallel triangular prisms contained in a light directing film according to one embodiment of the present invention; and
fig. 3 shows a cross-sectional view of a solar cell module according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to specific embodiments. It will be appreciated that other embodiments are contemplated and may be made without departing from the scope or spirit of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense.
Unless otherwise indicated, all numbers expressing feature sizes, quantities, and physical and chemical characteristics used in the specification and claims are to be understood as being modified in all instances by the term "about". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the foregoing specification and attached claims are approximations that can be suitably varied by those skilled in the art in seeking to obtain the desired properties utilizing the teachings disclosed herein. The use of numerical ranges by endpoints includes all numbers within that range and any range within that range, for example, 1 to 5 includes 1, 1.1, 1.3, 1.5, 2, 2.75, 3, 3.80, 4, and 5, and the like.
In the process of assembling the solar cell module, the light guiding film is generally adhered on the backlight-side surface of the solar cell or the surface of the back sheet at the inside of the solar cell module by an adhesive layer. However, in an environment of high temperature and high humidity, the adhesive layer may gradually age over time, and a bulge may be generated between the light guide film and the package back sheet, thereby causing the light guide film to be damaged or to be peeled off from the adhesion surface.
According to one aspect of the present invention, there is provided an adhesive composition comprising a resin binder, a peroxide crosslinking agent, a non-peroxide crosslinking agent, a coupling agent, an ultraviolet absorber and an ultraviolet stabilizer, wherein the adhesive composition is exothermically reacted in a lamination process (generally, a lamination temperature is 140 ℃ or more) in a solar module production process and has 2 to 40J/g.
Without wishing to be bound by theory, it is believed that the reason for the generation of visually discernable bulges between the light directing film and the backsheet during the wet heat aging of the adhesive layer is that under aging conditions (e.g., 85 ℃/85% humidity), the resin in the adhesive glue softens and melts, resulting in a decrease in adhesion to the light directing film layer and the backsheet. At the same time, moisture from the environment and other small molecular gases in the assembly can accumulate at the weak points of adhesion and form bulges. The bulge may be formed anywhere within or near the light directing film, such as between the adhesive layer and the backsheet, or between the substrate layer and the adhesive layer, or between the light directing layer and the substrate layer. According to the technical idea of the invention, the specific components and the content thereof are specifically selected to enable the adhesive composition to perform an exothermic reaction in the lamination process in the solar module production process, so that the adhesive glue is further crosslinked to form a network, the bulk strength is enhanced, the bonding force is maintained and no weak point is formed.
According to the disclosure of the present application, unless otherwise specified, "exotherm" refers to the amount of heat released per gram of the adhesive composition at temperatures above 95 ℃ (units: J/g). The adhesive composition has an exotherm of 2 to 40J/g. When the exotherm is less than 2J/g, the exotherm during aging is too low to cause further crosslinking networking of the adhesive gum. On the other hand, when the heat release amount is more than 40J/g, since the adhesive layer system releases heat excessively, the system is crosslinked excessively, resulting in wrinkles of the light guiding film after lamination of the assembly and blisters after high-temperature moist heat aging.
Preferably, the adhesive composition comprises, based on the total weight of the adhesive composition:
90-98 wt% of said resinous binder;
0.4 to 1.4 weight percent of said peroxide crosslinking agent;
0.4 to 1.6 weight percent of the non-peroxide crosslinking agent;
0.5 to 1.5 weight percent of the coupling agent;
0.5 to 4 wt% of the ultraviolet absorber; and
0.2-2 wt% of the UV stabilizer.
According to the solution of the present application, the adhesive composition comprises a high content (90-98% by weight) of resinous binder as basic material. The resin binder is generally used in the form of pellets. There is no particular limitation on the specific type of the resinous binder, so long as the resinous binder is capable of continuing to network crosslink at an exotherm of 2 to 40J/g. Preferably, the resinous binder is selected from one or more of the group consisting of: ethylene-vinyl acetate (EVA) copolymer, polyolefin resin (PO), polypropylene oxide (PP), polyvinyl butyral (PVB), tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride (THV) copolymer, ethylene-tetrafluoroethylene (ETFE) copolymer, polyvinylidene fluoride (PVDF), Polyurethane (PU), polymethyl methacrylate (PMMA), Polyimide (PI), and the like. The adhesive composition comprises 90-98 wt% of the resin binder, based on the total weight of the adhesive composition. Commercially available products of the resin base that can be used in the present invention include: manufactured by DuPont corporation
The series of EVA resins (for example,
150、
250、
260、
PV 1300Z and
3135 SB); EVA resins produced by Hanwa Co (e.g., Nawa Co., Ltd.)PV280, PV282, E182 and E283F); EVA resins V5110J and 6110M manufactured by BASF corporation; polyolefin (POE) resins 8842 and 7256 manufactured by dow corporation; and Polyolefin (POE) resins tammer DF605, tammer DF640, tammer DF740, tammer DF7350, tammer DF8200, tammer DF840, and tammer DF7350, all manufactured by mitchel (mituchem) corporation.
The term "melt flow index" according to the present invention has the ordinary definition in the art for this term, unless otherwise specified. That is, the term "melt flow index" according to the present invention refers to the number of grams (unit: g) of polymer pellets that are melted into a polymer fluid at a temperature of 190 ℃ and a pressure of 2.16 kilograms and flow through a round tube having a diameter of 2.095 mm. The Melt Flow Index (MFI) of the polymer feedstock is a very important processing parameter characterizing the properties of the polymer, a higher Melt Flow Index (MFI) indicating a better flowability of the polymer and easier processing. However, during the course of the present investigation, it was found that for the present application, polymers with high melt flow indices are susceptible to drift after lamination at high temperatures. The adhesive composition according to the present invention is used to adhere a light guiding film on the backlight side surface of a solar cell or on the surface of an encapsulation backsheet at the inside of a solar cell module. Solar module includes the printing opacity component that sets gradually along its thickness direction, preceding packaging layer, a plurality of solar cell, back packaging layer and the encapsulation backplate of interval each other, a plurality of solar cell at interval each other form the array, the array include with a plurality of solar cell strings that are parallel to each other in the thickness direction vertically coplanar, every solar cell string comprises a plurality of tandem solar cell together, and every two are adjacent be formed with the cluster clearance between the solar cell string, every be formed with the piece clearance between the adjacent solar cell in the solar cell string. The light guide film according to the present invention functions to re-reflect light incident through the string gaps and/or the sheet gaps (2-4mm) onto the solar cell sheets so as to improve the power generation efficiency of the module. However, the drift of the film causes light loss and whitening of the assembly, resulting in poor appearance. Preferably, the Melt Flow Index (MFI) of the resin base is in the range of 10 to 30. According to the present invention, when the Melt Flow Index (MFI) of the resin base is less than 10, it is not easy to uniformly extrude the resulting adhesive composition to form a film adhesive layer. According to the present invention, when the Melt Flow Index (MFI) of the resin base is in the range of 10 to 30, the relative position drift of the light guiding film in the high temperature lamination preparation process can be effectively suppressed so that the drift degree is less than 0.5 mm. The "drift degree" according to the present invention refers to a value (unit: mm) of displacement of a light guiding film from an initial position after the light guiding film is adhered to a substrate by the adhesive composition and subjected to a high temperature lamination process.
In order to achieve the technical effect of the present invention, preferably, the resin binder is an ethylene-vinyl acetate (EVA) copolymer. Ethylene-vinyl acetate (EVA) copolymers are polymers of ethylene monomers copolymerized with vinyl acetate. Preferably, in the ethylene-vinyl acetate (EVA) copolymer, the content of repeating units derived from vinyl acetate (also referred to as "VA content" in the examples section of this application) is from 24 to 30 wt%, based on the total weight of the ethylene-vinyl acetate (EVA) copolymer. More preferably, in the ethylene-vinyl acetate (EVA) copolymer, the content of repeating units derived from vinyl acetate (also referred to as "VA content" in the examples section of this application) is from 26 to 28% by weight, based on the total weight of the ethylene-vinyl acetate copolymer (EVA). When the VA content is less than 24 wt%, the resulting adhesive composition is poor in adhesion to a substrate, and the resulting material is also poor in transparency after lamination, which is disadvantageous for the application of a double-sided two-glass assembly. On the other hand, when the VA content is more than 30 wt%, the adhesive film formed from the adhesive composition is too soft, thereby causing wrinkles of the adhesive film.
By adjusting the specific content of the repeating unit derived from vinyl acetate to be in the range of 24 to 30% by weight, it is possible to contribute to the improvement of the adhesive strength and the resistance to wet heat aging of the adhesive composition.
According to an aspect of the invention, the adhesive composition comprises a peroxide crosslinking agent to promote the crosslinking reaction thereof. Peroxide crosslinkers are very effective crosslinkers in the art, which generate alkyl radicals by pyrolysis, which generate polymer radicals by chain transfer, which crosslink by addition of polymer radicals to each other. There is no limitation on the specific kind of peroxide crosslinking agent that can be used in the present invention, and preferably, the peroxide crosslinking agent is selected from one or more of the group consisting of: benzoyl Peroxide (BPO), dicumyl peroxide (DCP), tert-amyl peroxyacetate (TAPA), tert-butyl 2-ethylhexyl peroxycarbonate (TBEC), and tert-butyl peroxy-3, 5, 5-Trimethylhexanoate (TBPMH), and the like. The addition of a peroxide crosslinking agent to the adhesive composition is effective to increase the degree of crosslinking of the product, thereby increasing the bulk strength and tack of the polymer. However, in the lamination process of the solar cell module, if the peroxide is added too much to be completely reacted, the peroxide is slowly decomposed during use to generate gas, which causes swelling in the adhesive layer. The adhesive composition comprises 0.4 to 1.4 wt% of the peroxide crosslinking agent, based on the total weight of the adhesive composition. Specific examples of peroxide crosslinking agents that can be used in the present invention include: t-butyl peroxy-2-ethylhexyl carbonate (TBEC) and t-butyl peroxy-3, 5, 5-Trimethylhexanoate (TBPMH) from Acoma.
According to the technical scheme of the invention, the peroxide crosslinking agent with lower concentration is adopted. In order to ensure that a high degree of crosslinking is likewise achieved at low peroxide crosslinker concentrations in order to achieve the desired bond strength and resistance to wet heat aging, the invention incorporates a non-peroxide crosslinker as an essential component. The non-peroxide crosslinking agent is a compound with a plurality of double bond functional groups, participates in crosslinking in reaction, and reduces low molecular weight products generated by coupling peroxide alkyl free radicals and polymer free radicals due to high reaction speed. There is no limitation on the specific kind of non-peroxide crosslinking agent that can be used in the present invention, and preferably, the non-peroxide crosslinking agent is selected from one or more of the group consisting of: trimethylolpropane triacrylate (TMPTA) and triallyl isocyanurate (TAIC). When the non-peroxide content is too high, the shrinkage rate of the adhesive film (i.e., the adhesive layer) becomes high, wrinkles are generated in a part of the area during the application process, and the wrinkles are also easy to bulge while the appearance of the assembly is not favorable. Preferably, the adhesive composition comprises 0.4 to 1.6 wt% of a non-peroxide crosslinking agent, based on the total weight of the adhesive composition. The non-peroxide crosslinking agent can be a single component or can be compounded by two or more components. Specific examples of non-peroxide crosslinking agents that may be used in the present invention include trimethylolpropane triacrylate (TMPTA) SR 351 and triallyl isocyanurate (TAIC), which are manufactured by sartomer corporation.
According to the technical scheme of the invention, the adhesive composition comprises a coupling agent. Preferably, the coupling agent is selected from one or more of silane coupling agents and phthalate ester coupling agents. Preferably, the adhesive composition comprises 0.5 to 1.5 wt% of the coupling agent, based on the total weight of the adhesive composition. Specific products of the coupling agent which can be used in the present invention include gamma- (methacryloyloxy) propyltrimethoxysilane having a product name of A174 manufactured by Meiji corporation and 3-aminopropyltriethoxysilane having a product name of A1100 manufactured by Meiji corporation.
According to an aspect of the present invention, the adhesive composition includes an ultraviolet absorber. Preferably, the uv absorber is selected from one or more of the group consisting of: salicylate ultraviolet absorbers, benzophenone ultraviolet absorbers, benzotriazole ultraviolet absorbers, triazine ultraviolet absorbers, and the like. The salicylate ultraviolet absorbent is one or more selected from methyl salicylate, ethyl salicylate and octyl salicylate. The benzophenone ultraviolet absorbent is selected from one or more of 2-hydroxy-4-methoxybenzophenone and 2-hydroxy-4-n-octoxybenzophenone. The benzotriazole ultraviolet absorbent is one or more selected from 2- (2 ' -hydroxy-3 ', 5 ' -di-tert-phenyl) -5-benzotriazole chloride and 2- (2 ' -hydroxy-5 ' -methylphenyl) benzotriazole. The adhesive composition comprises 0.5-4 wt.% of the adhesive composition based on the total weight of the adhesive compositionThe ultraviolet absorber. Specific products of the ultraviolet absorber that can be used in the present invention include: product name manufactured by basf corporation
81 of 2-hydroxy-4-n-octoxy benzophenone; and 2- (2 ' -hydroxy-3 ', 5 ' -di-tert-phenyl) -5-chlorobenzotriazole, product name UVP 327, manufactured by BASF corporation.
According to an aspect of the present invention, the adhesive composition includes an ultraviolet stabilizer. Preferably, the ultraviolet stabilizer is a hindered amine ultraviolet stabilizer. Preferably, the hindered amine-based uv stabilizer is selected from one or more of the group consisting of: poly (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol) succinate, poly [ (6-morpholinyl-5-triazine-2, 4-diyl) (2,2,6, 6-tetramethylpiperidyl) iminohexamethylene [ (2,2,6, 6-tetramethylpiperidyl) -imino ] ], 4-benzoyloxy-2, 2,6, 6-tetramethylpiperidine and tris (1,2,2,6, 6-pentamethylpiperidinyl) phosphite. The adhesive composition includes 0.2 to 2 wt% of the ultraviolet stabilizer, based on the total weight of the adhesive composition. Specific products of uv stabilizers that may be used in the present invention include: polysuccinic acid (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol) ester with the product name TINUVIN 622, manufactured by BASF corporation; poly [ (6-morpholinyl-5-triazine-2, 4-diyl) (2,2,6, 6-tetramethylpiperidinyl) iminohexamethylene [ (2,2,6, 6-tetramethylpiperidinyl) -imino ] (product name CYASORB UV3346, manufactured by cyanothece corporation); 4-benzoyloxy-2, 2,6, 6-tetramethylpiperidine, product name 744, manufactured by Guangdong light stabilizer manufacturing Co., Ltd; tris (1,2,2,6, 6-pentamethylpiperidinyl) phosphite having the product name GW540, produced by hubei giant-wining science and technology ltd; TINUVIN 770, TINUVIN783, TINUVIN P, TINUVIN 788 from Pasteur; and CYASORB UV1164, CYASORB UV 2126, CYASORB UV 3853, CYASORB THT, etc. of cyanothece.
There is no particular limitation on the method of preparing the adhesive composition according to the present invention. Typically, the adhesive composition can be prepared by means of simple mixing and stirring. Specifically, resin binder particles are mixed with a peroxide crosslinking agent, a non-peroxide crosslinking agent, a coupling agent, an ultraviolet absorber and an ultraviolet stabilizer, and optionally other components at a certain ratio with stirring at room temperature (10 ℃ to 30 ℃) to obtain an adhesive composition.
According to another aspect of the present invention, there is provided a light guiding film comprising, in order, a light guiding layer, a substrate layer, and a reactive adhesive layer, wherein the reactive adhesive layer comprises the adhesive composition as described above. In order to enhance the adhesion between the adhesive layer and the substrate layer to prevent delamination between the adhesive layer and the substrate layer, the substrate layer is preferably subjected to a physical surface treatment. The physical surface treatment is corona treatment or plasma treatment. In order to secure sufficient adhesiveness to adhere the light guide film on the backlight-side surface of the solar cell or the surface of the back sheet at the inside of the solar cell module, the thickness of the reactive adhesive layer is in the range of 10 to 100 μm, preferably 20 to 50 μm. Optionally, the light directing layer comprises an ordered arrangement of a plurality of microstructures extending from the base layer. Optionally, the light guiding layer comprises a plurality of microstructures extending from the base layer in a disordered arrangement. Optionally, the plurality of microstructures comprises a side-by-side triangular prism array, and the orientation direction of the side-by-side triangular prism array is non-linearly oriented. According to certain preferred embodiments of the present invention, the term "side-by-side triangular prism array" refers to an array comprising a plurality of triangular prisms arranged side-by-side with each other. According to certain preferred embodiments of the present invention, each of the three prisms of the side-by-side three-prism array is a three-prism having an apex angle of 120 degrees toward the solar cell and two base angles of 30 degrees each. Optionally, the plurality of microstructures comprises an array of parallel triangular prisms, wherein one quadrilateral face of each triangular prism lies in the same plane. Optionally, the peak of at least one triangular prism in the array of side-by-side triangular prisms facing the solar cell may be replaced by a rounded peak. Preferably, the rounded peak of at least one triangular prism in the array of side-by-side triangular prisms has a radius of curvature of 0.2 to 5 microns. Preferably, the light guiding film further includes a primer layer between the reactive adhesive layer and the base layer. The primer layer functions to enhance the adhesion between the adhesive layer and the substrate layer to prevent delamination between the adhesive layer and the substrate layer. In addition to this technical effect achieved by the primer layer, the substrate layer may be corona treated to enhance the adhesion between the adhesive layer and the substrate layer to prevent delamination between the substrate layer and the adhesive layer. Preferably, the primer layer is a polyester primer layer or a polyacrylate primer layer. The light directing film also includes a light reflecting layer covering the plurality of microstructures and conforming to the plurality of microstructures.
Specifically, fig. 1 shows a cross-sectional view of a light guiding film 1 according to one embodiment of the present invention. The light guiding film 1 comprises in this order a light guiding layer 2, a substrate layer 3 and a reactive adhesive layer 4, wherein the reactive adhesive layer 4 comprises an adhesive composition as described above. The thickness of the reactive adhesive layer 4 is in the range of 10 to 100 μm, preferably 20 to 50 μm. When the thickness of the reactive adhesive layer 4 is greater than 100 μm, the light guide film is easily subjected to relative positional shift during the high-temperature lamination manufacturing process. The light-guiding layer 2 comprises an ordered arrangement of a plurality of microstructures 5 protruding from the base layer 3. In one embodiment, the ordered array of microstructures 5 extending from the substrate layer comprises an array of parallel triangular prisms, wherein one quadrilateral face of each triangular prism lies in the same plane. Fig. 2 shows a perspective view of a parallel triangular prism array 6 included in a light guiding film 1 according to one embodiment of the present invention. As shown in fig. 2, the light guiding layer 4 comprises an array of parallel triangular prisms 6, wherein one quadrilateral face of each triangular prism 7 lies in the same plane 8. D is the orientation direction of the parallel triangular prism array 6. As shown in fig. 1, the light guiding film 1 further includes a primer layer 9 between the reactive adhesive layer 4 and the base layer 3. The primer layer 9 comprises a polyester primer layer or a polyacrylate primer layer. As shown in fig. 1, the light directing film 1 further includes a light reflecting layer 10, the light reflecting layer 10 covering the plurality of microstructures 5 and conforming to the plurality of microstructures 5.
According to still another aspect of the present invention, there is provided a solar cell module comprising a light-transmitting member, a front encapsulant layer, a plurality of solar cells spaced apart from each other, a rear encapsulant layer and a back sheet sequentially arranged in a thickness direction thereof, wherein the solar cell module further comprises a light guiding film as described above, the light guiding film being disposed between the rear encapsulant layer and the back sheet and adhered to a surface of the back sheet through the reactive adhesive layer.
Specifically, fig. 3 shows a cross-sectional view of a solar cell module 11 according to an embodiment of the present invention. The solar cell module 11 comprises a light-transmitting element 12, a front packaging layer 13, a plurality of solar cells 14 spaced from each other, a rear packaging layer 15 and a back sheet 16 which are sequentially arranged along the thickness direction T of the solar cell module, wherein the solar cell module 11 further comprises the light guiding film 1 as described above, the light guiding film 1 is arranged between the rear packaging layer 15 and the back sheet 16 and is adhered to the surface 17 of the back sheet 16 through the reactive adhesive layer 4.
In the present study, the inventors of the present invention found that when the inner layer (i.e., the side facing the solar cell) of the back sheet contains a non-hot-melt adhesive material or a fluorine-containing material (for example, a back sheet having a designation Kpf, which is commercially available from seiko corporation, or a back sheet having a designation TFB, which is manufactured by seiko corporation), the bulge is easily generated between the back sheet and the light guide film particularly under aging conditions. According to the technical scheme of the invention, after the light guide film and the fluorine-containing back plate are bonded by using the adhesive composition and subjected to aging conditions, no bulge is generated between the back plate and the light guide film.
The present invention will be described in more detail with reference to examples. It should be noted that the description and examples are intended to facilitate the understanding of the invention, and are not intended to limit the invention. The scope of the invention is to be determined by the claims appended hereto.
Examples
In the present invention, unless otherwise indicated, all reagents used were commercially available products and were used without further purification treatment. Further, "%" mentioned is "% by weight", and "parts" mentioned is "parts by weight".
Performance testing
Test pieces were prepared from the various adhesive compositions prepared in the examples and comparative examples by the glue lines and test piece preparation methods listed below.
Preparation of reactive adhesive film
The adhesive compositions prepared in examples and comparative examples were extruded at 80 to 100 ℃ onto the surface of a polyethylene terephthalate film having a thickness of 35 μm using a single screw extruder manufactured by Kingwell corporation to form a reactive adhesive film having a thickness of 25 μm.
Preparation of test assemblies
The light guide film with the reactive glue film was cut into a narrow strip 5mm wide and 25cm long. The strips were heat-applied at 100 ℃ and at a speed of 5-10 cm/sec to the inwardly facing surface of a backing sheet manufactured by the company Siwu under the designation Kpf. A light-transmitting element (glass of trade name XYG produced by the letter peeling company), 2-layer EVA encapsulating films (EVA encapsulating films of trade names 9100T and 9210B produced by 3M innovative limited) and the back sheet having the light guiding film with a reactive glue film prepared as above (the light guiding film side faces the EVA encapsulating film) were sequentially laminated to obtain a laminated body. The laminate was put into a laminator of model KRA-Y1322 manufactured by Sharp technologies of Qinhuangyo, and evacuated at a lamination temperature of 145 ℃ for 5 minutes, then pressed for 30 seconds and heated for 13 minutes to obtain a test assembly.
The reactive adhesive films and test components obtained as above were tested for their properties with respect to resistance to wet heat aging, heat release, adhesion, and degree of drift according to the specific methods listed below.
Resistance to wet and heat aging
The test assembly obtained as above was placed in a C1000 environmental test chamber manufactured by Envirotronics corporation, maintained at 85 ℃/85% humidity for 1000 hours, and then removed. The test assembly was visually inspected for blistering, foaming and delamination from the back and glass sides. If the phenomenon exists, the damp-heat aging resistance is considered to be poor; if the above phenomenon does not exist, the wet heat aging resistance is considered to be satisfactory (pass).
Heat release amount
The heat capacity and heat flow of the reactive adhesive films prepared in examples and comparative examples were directly measured in a temperature range of 20 to 220 c (temperature rising rate 10 c/min under nitrogen atmosphere) using a differential scanning calorimeter of model Q2000 manufactured by TA corporation. The exothermic amount (in J/g) and exothermic temperature (. degree. C.) were calculated from the obtained DSC curve.
Adhesive force
The laminated test piece was tested for the strength of the bond between the polymer adhesive and the back sheet (unit: N/cm) using an electronic universal testing machine model 5969 manufactured by Instron, in accordance with ASTM D1876. According to this test property, the higher the bond strength, the better, and the excellent properties when the bond strength is more than 40N/cm.
Degree of drift
The adhesive compositions prepared in examples and comparative examples were respectively extruded on a light guide film (T81 manufactured by 3M innovative company ltd) to obtain a light guide film having a reactive adhesive layer with a thickness of 25 μ M. The light directing film was cut into pieces 5mm wide and 25cm long. And thermally sticking the film block to the fabric surface of the solar glass with the type of XYG produced by the letter glass to obtain the solar glass with the light guide film. Then, the light guide film is drawn with a marker pen while being closely attached to the periphery thereof. Subsequently, a light-transmitting member (glass brand XYG manufactured by the letter glass company), a 2-layer EVA encapsulating film (EVA encapsulating films brand 9100T and 9210B manufactured by 3M innovative limited) and the solar glass having the light guide film prepared as above were sequentially laminated to obtain a laminate. The laminate was put into a laminator of model KRA-Y1322 manufactured by Sharp technologies of Qinhuangyo, and evacuated at a lamination temperature of 145 ℃ for 5 minutes, then pressed for 30 seconds and heated for 13 minutes to obtain a test assembly.
Then, the relative distance between the position of the light guide film on the test assembly after lamination and the profile of the original marker was measured and counted as a degree of drift (unit: mm). And when the drift degree is less than 0.5mm, the method meets the requirement.
The raw materials used in the examples according to the present invention and the comparative examples are shown in table 1 below. Unless otherwise indicated, the starting materials were used directly without further purification.
TABLE 1 list of raw materials used in examples and comparative examples
Example 1
The resin pellets EVA1, peroxide crosslinking agent 1, non-peroxide crosslinking agent 1, coupling agent 1, ultraviolet absorber 1 and ultraviolet stabilizer 2 were mixed and uniformly stirred at room temperature to obtain adhesive composition 1. According to the adhesive composition 1, as shown in table 1 below, based on the total weight of the adhesive composition 1, the resin pellet EVA1 was 95.2 wt%, the peroxide crosslinking agent 1 was 1.4 wt%, the non-peroxide crosslinking agent 1 was 0.4 wt%, the coupling agent 1 was 1 wt%, the ultraviolet absorber 1 was 1 wt%, and the ultraviolet stabilizer 2 was 1 wt%.
A reactive glue film 1 is prepared from the adhesive composition 1 according to the method of preparation of the polymer glue line as described above. The reactive glue film 1 was used to prepare a test assembly 1 according to the test assembly preparation method described above. The adhesive composition 1, the reactive adhesive film 1 and the test member 1 were tested for resistance to wet heat aging, heat release amount, adhesive force and drift degree according to the above-listed test methods for resistance to wet heat aging, heat release amount, adhesive force and drift degree, and the test results are shown in the following table 2.
Examples 2 to 9 and comparative examples 1 to 6
Examples 2 to 9 and comparative examples 1 to 6 were carried out according to the same method as in example 1 except that the kinds, the presence or absence and the contents of the respective components were changed as shown in table 2 to obtain respective adhesive compositions.
Each of the reactive adhesive films was prepared from the adhesive compositions obtained in examples 2 to 9 and comparative examples 1 to 6 according to the preparation method of the polymer subbing layer as described above. Each test assembly was prepared using each reactive adhesive film according to the test assembly preparation method described above. The respective adhesive compositions, the respective reactive adhesive films, and the respective test components were tested for resistance to wet heat aging, heat release, adhesion, and drift degree according to the above-listed test methods for resistance to wet heat aging, heat release, adhesion, and drift degree, and the test results are shown in tables 2 and 3 below.
Table 2 component proportions and performance test results for examples 1-9
TABLE 3 component proportions and Performance test results for comparative examples 1-6
As can be seen from the above tables 2 and 3, according to the embodiments of examples 1 to 9, when the adhesive composition is exothermically reacted at a temperature of 95 ℃ or more and has an exotherm of 2 to 40J/g, no swelling, foaming and delamination phenomena are found when observed by naked eyes from the back plate face and the glass face of the test member, and good resistance to wet heat aging can be achieved.
Example 1 was conducted under similar conditions as comparative example 1 except that no non-peroxide crosslinking agent was present in the adhesive composition of comparative example 1. As can be seen from tables 2 and 3 above, in the absence of a non-peroxide crosslinking agent, low molecular weight products resulting from the coupling of peroxide alkyl radicals and polymer radicals may be present in the adhesive composition system, resulting in a significant reduction in the bond strength of the polymer adhesive film, and swelling, foaming and delamination of the light directing film were found.
According to the embodiment of comparative example 2, no peroxide crosslinking agent and no peroxide crosslinking agent are present in the adhesive composition system, so no exothermic reaction occurs at temperatures above 95 ℃ and no heat is evolved, so that the adhesive glue does not undergo further crosslinking reaction, bulges and decreases in bond strength.
According to the embodiment of comparative example 3, too little (only 0.2 wt%) of the non-peroxide crosslinking agent is present in the adhesive composition system, resulting in an exotherm of only 1.8J/g. The adhesive paste is not sufficiently subjected to further crosslinking reaction, and a little swelling occurs and the adhesive strength is reduced.
According to the embodiment of comparative example 4, an excessive amount (1.8 wt%) of non-peroxide crosslinking agent is present in the adhesive composition system, resulting in an excessive exotherm (46J/g). The excessive heat release rate causes the shrinkage rate of the adhesive film to be high, partial area wrinkles are generated in the application process, and the wrinkles are also bulged at the parts which are not beneficial to the appearance of the assembly.
The adhesive composition system of comparative example 5 utilized a resin base EVA 2. As shown in table 1, the Melt Flow Index (MFI) of the resin base EVA2 was too large (40). The results show that despite the high bond strength, the light directing film on the test assembly exhibited very significant drift (drift greater than 1mm) and poor resistance to wet heat aging, resulting in blistering.
The adhesive composition system of comparative example 6 utilized a resin base EVA 3. As shown in table 1, the VA content of the resin base EVA3 was too small (only 20 wt%), the bond strength was reduced and bulging, foaming and delamination phenomena were found.
It will be apparent to those skilled in the art that various changes and modifications can be made in the present disclosure without departing from the spirit and scope of the disclosure. Thus, if such modifications and variations of the present disclosure fall within the scope of the claims of the present invention and their equivalents, the present disclosure is also intended to encompass such modifications and variations.
Claims (30)
1. An adhesive composition comprising a resin binder, a peroxide crosslinking agent, a non-peroxide crosslinking agent, a coupling agent, an ultraviolet absorber, and an ultraviolet stabilizer, wherein the adhesive composition exothermically reacts at temperatures above 95 ℃ and has an exotherm of 2-40J/g.
2. The adhesive composition of claim 1, comprising, based on the total weight of the adhesive composition:
90-98 wt% of said resinous binder;
0.4 to 1.4 weight percent of said peroxide crosslinking agent;
0.4 to 1.6 weight percent of the non-peroxide crosslinking agent;
0.5 to 1.5 weight percent of the coupling agent;
0.5 to 4 wt% of the ultraviolet absorber; and
0.2-2 wt% of the UV stabilizer.
3. The adhesive composition according to claim 1 or 2, wherein the resin binder is selected from one or more of the group consisting of: ethylene-vinyl acetate (EVA) copolymer, polyolefin resin (PO), polypropylene oxide (PP), polyvinyl butyral (PVB), tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride (THV) copolymer, ethylene-tetrafluoroethylene (ETFE) copolymer, polyvinylidene fluoride (PVDF), Polyurethane (PU), polymethyl methacrylate (PMMA), and Polyimide (PI).
4. The adhesive composition of claim 1 or 2, wherein the Melt Flow Index (MFI) of the resin base is in the range of 10-30.
5. The adhesive composition of claim 3, wherein the resin binder is an Ethylene Vinyl Acetate (EVA) copolymer.
6. The adhesive composition of claim 5, wherein the Ethylene Vinyl Acetate (EVA) copolymer has a content of repeating units derived from vinyl acetate of 24 to 30 wt%, based on the total weight of the Ethylene Vinyl Acetate (EVA) copolymer.
7. The adhesive composition of claim 5, wherein the Ethylene Vinyl Acetate (EVA) copolymer has a content of repeating units derived from vinyl acetate of 26 to 28 wt%, based on the total weight of the Ethylene Vinyl Acetate (EVA) copolymer.
8. The adhesive composition according to claim 1 or 2, wherein the peroxide crosslinking agent is selected from one or more of the group consisting of: benzoyl Peroxide (BPO), dicumyl peroxide (DCP), tert-amyl peroxyacetate (TAPA), tert-butyl 2-ethylhexyl carbonate peroxide (TBEC) and tert-butyl peroxy-3, 5, 5-Trimethylhexanoate (TBPMH).
9. The adhesive composition according to claim 1 or 2, wherein the non-peroxide crosslinking agent is selected from one or more of the group consisting of: trimethylolpropane triacrylate (TMPTA) and triallyl isocyanurate (TAIC).
10. The adhesive composition according to claim 1 or 2, wherein the coupling agent is selected from one or more of a silane coupling agent and a phthalate-based coupling agent.
11. The adhesive composition according to claim 1 or 2, wherein the ultraviolet absorber is selected from one or more of the group consisting of: salicylate ultraviolet absorbers, benzophenone ultraviolet absorbers, benzotriazole ultraviolet absorbers, and triazine ultraviolet absorbers.
12. The adhesive composition of claim 11 wherein the salicylate-based ultraviolet absorber is selected from one or more of methyl salicylate, ethyl salicylate, and octyl salicylate.
13. The adhesive composition of claim 11, wherein the benzophenone-based ultraviolet absorber is selected from one or more of 2-hydroxy-4-methoxybenzophenone and 2-hydroxy-4-n-octoxybenzophenone.
14. The adhesive composition according to claim 11, wherein the benzotriazole-based ultraviolet absorber is selected from one or more of 2- (2 ' -hydroxy-3 ', 5 ' -di-tert-phenyl) -5-chlorobenzotriazole and 2- (2 ' -hydroxy-5 ' -methylphenyl) benzotriazole.
15. The adhesive composition according to claim 1 or 2, wherein the ultraviolet stabilizer is a hindered amine-based ultraviolet stabilizer.
16. The adhesive composition of claim 15, wherein the hindered amine based uv stabilizer is selected from one or more of the group consisting of: poly (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol) succinate, poly [ (6-morpholinyl-5-triazine-2, 4-diyl) (2,2,6, 6-tetramethylpiperidinyl) iminohexamethylene [ (2,2,6, 6-tetramethylpiperidinyl) -imino ] ], 4-benzoyloxy-2, 2,6, 6-tetramethylpiperidine and tris (1,2,2,6, 6-pentamethylpiperidinyl) phosphite.
17. A light directing film comprising, in order, a light directing layer, a substrate layer, and a reactive adhesive layer, wherein the reactive adhesive layer comprises the adhesive composition of any one of claims 1-16.
18. The light directing film of claim 17, wherein the base layer has been physically surface treated.
19. The light directing film of claim 18, wherein the physical surface treatment is a corona treatment or a plasma treatment.
20. The light directing film of claim 17, wherein the reactive adhesive layer has a thickness in the range of 10-100 μ ι η.
21. The light directing film of claim 17, wherein the light directing layer comprises an ordered arrangement of a plurality of microstructures extending from the base layer.
22. The light directing film of claim 17, wherein the light directing layer comprises a disordered array of a plurality of microstructures extending from the base layer.
23. The light directing film of claim 21 or 22, wherein the plurality of microstructures comprises an array of side-by-side triangular prisms, and the orientation direction of the array of side-by-side triangular prisms is non-linearly oriented.
24. The light directing film of claim 21 or 22, wherein the plurality of microstructures comprises an array of parallel triangular prisms, wherein one quadrilateral face of each triangular prism is in the same plane.
25. The light directing film of claim 17, wherein the light directing film further comprises a primer layer between the reactive adhesive layer and the base layer.
26. The light directing film of claim 25, wherein the primer layer is a polyester primer layer or a polyacrylate primer layer.
27. The light directing film of claim 21 or 22, wherein the light directing film further comprises a light reflecting layer that covers and conforms to the plurality of microstructures.
28. A solar cell module comprising a light-transmitting element, a front encapsulant layer, a plurality of solar cells spaced from each other, a rear encapsulant layer and a back sheet arranged in this order along the thickness direction thereof, wherein the solar cell module further comprises a light guiding film according to any of claims 17-27, the light guiding film being arranged between the rear encapsulant layer and the back sheet and adhered to the surface of the back sheet by the reactive adhesive layer.
29. The solar cell assembly as claimed in claim 28 wherein the side of the backsheet facing the solar cells comprises a non-hot melt adhesive material.
30. The solar cell module of claim 28 wherein the side of the backsheet facing the solar cells comprises a fluorine-containing material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811455184.5A CN111253885A (en) | 2018-11-30 | 2018-11-30 | Adhesive composition, light guide film and solar cell module |
| PCT/IB2019/060126 WO2020109968A1 (en) | 2018-11-30 | 2019-11-25 | Adhesive composition, light redirecting film and solar cell module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811455184.5A CN111253885A (en) | 2018-11-30 | 2018-11-30 | Adhesive composition, light guide film and solar cell module |
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| CN111253885A true CN111253885A (en) | 2020-06-09 |
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| CN201811455184.5A Withdrawn CN111253885A (en) | 2018-11-30 | 2018-11-30 | Adhesive composition, light guide film and solar cell module |
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| WO (1) | WO2020109968A1 (en) |
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| CN114605813A (en) * | 2022-03-29 | 2022-06-10 | 广东汇齐新材料有限公司 | Ultraviolet light aging resistant TPU hot melt adhesive film and preparation method thereof |
| CN114806422A (en) * | 2022-03-31 | 2022-07-29 | 苏州中来光伏新材股份有限公司 | UV cut-off EPE photovoltaic adhesive film, preparation method thereof and photovoltaic module |
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| WO2023286859A1 (en) * | 2021-07-15 | 2023-01-19 | 大日本印刷株式会社 | Solar-cell-module sealant sheet, solar-cell-module sealant composition, and solar cell module |
| CN114591691B (en) * | 2022-01-21 | 2023-06-13 | 晶科能源(海宁)有限公司 | Packaging adhesive film for photovoltaic module, preparation method of packaging adhesive film and photovoltaic module |
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