CN111247702A - Socket for electric parts - Google Patents

Abstract

The invention provides a socket for electric parts, which can reduce the number of required parts and can realize cost reduction. The present invention is an electrical component socket (10) which electrically connects a 1 st electrical component (1) and a 2 nd electrical component (2), and which includes: a sheet member (40) composed of an insulator having an elastic force; a 1 st contact (50) having a 1 st contact portion (52) that contacts the 1 st electrical component (1) on the 1 st surface (41) side of the sheet member (40), and a 1 st insertion portion (51) that is inserted into the sheet member (40); and a 2 nd contact (60) having a 2 nd contact portion (62) that contacts the 2 nd electrical component (2) on the 2 nd surface (42) side of the sheet member (40) and a 2 nd insertion portion (61) that is inserted into the sheet member (40), wherein the sheet member (40) is deformed by pressing in a direction in which the 1 st contact portion (51) and the 2 nd contact portion (61) are brought close to each other in a state in which the 1 st insertion portion (51) and the 2 nd insertion portion (61) are in contact, and the 1 st insertion portion (51) and the 2 nd insertion portion (61) slide in an electrically connected state.

Description

Socket for electric parts

Technical Field

The present invention relates to a socket for electrical components electrically connected to electrical components such as a semiconductor device (hereinafter referred to as an "IC package").

Background

Conventionally, as such a socket for electric parts, an IC socket provided with a pin contact is known. The IC socket is disposed on a wiring board, and accommodates an IC package as an inspection target, and a terminal of the IC package and an electrode of the wiring board are electrically connected through a pin contact to perform a test such as a conduction test.

As for the pin contact of the IC socket, a structure is known in which a coil spring is provided between two contacts and the coil spring is biased in a direction to separate the two contacts from each other by a biasing force of the coil spring (for example, see patent document 1). The terminals of the IC package and the electrodes of the wiring board are configured to be electrically connected to each other at a predetermined contact pressure by pressing the two contacts against the urging force of the coil spring in a direction in which the two contacts are brought close to each other.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2011-158329

Disclosure of Invention

Problems to be solved by the invention

However, in the conventional IC socket as in patent document 1, further cost reduction is required.

Accordingly, an object of the present invention is to provide a socket for electric parts, which can simplify the structure and reduce the cost.

Means for solving the problems

In order to achieve the above object, there is provided an electrical component socket which is disposed between a 1 st electrical component and a 2 nd electrical component facing each other, and electrically connects the 1 st electrical component and the 2 nd electrical component, the electrical component socket comprising: a sheet member composed of an insulator having an elastic force; a 1 st contact having a 1 st contact portion arranged on a 1 st surface side of the 1 st electrical component side of the sheet member and contacting the 1 st electrical component, and a 1 st insertion portion continuous from the 1 st contact portion and inserted into the sheet member; and a 2 nd contact having a 2 nd contact portion arranged on a 2 nd surface side of the 2 nd electrical component side of the sheet member and contacting the 2 nd electrical component, and a 2 nd insertion portion continuous from the 2 nd contact portion and inserted into the sheet member, wherein the sheet member is deformed by being arranged in a state where the 1 st insertion portion and the 2 nd insertion portion are in contact with each other, and being pressed in a direction in which the 1 st contact portion and the 2 nd contact portion are brought close to each other, and the 1 st insertion portion and the 2 nd insertion portion slide in an electrically connected state.

In the electrical component socket of the present invention, the 1 st contact may have the 1 st contact portion abutting on the 1 st surface, and the sheet member may be elastically deformed by being pressed by the 1 st contact portion by the 1 st electrical component when the 1 st contact portion is pressed.

In the present invention, the electrical component socket may be configured such that the 1 st insertion portion is formed in a substantially rod shape, and the 2 nd insertion portion is formed in a substantially cylindrical shape and slides in a state where the 1 st insertion portion is inserted into the 2 nd insertion portion and contacts therewith.

In the present invention, the socket for electric parts may be configured such that the 1 st insertion portion and the 2 nd insertion portion are formed in a substantially rod shape and slide in a state where side surfaces of the 1 st insertion portion and the 2 nd insertion portion contact each other.

In the present invention, the sheet member may include two members, i.e., a 1 st sheet member and a 2 nd sheet member, and the 1 st contact and the 2 nd contact may be disposed on the 1 st sheet member and the 2 nd sheet member.

In the present invention, the sheet member may have a through hole that penetrates between a 1 st surface on the 1 st electrical component side and a 2 nd surface on the 2 nd electrical component side, the 1 st insertion portion and the 2 nd insertion portion may be inserted, at least one of the 1 st insertion portion and the 2 nd insertion portion may be provided with a protruding portion that protrudes in a direction intersecting the through hole, and the protruding portion may be pressed against the other contact by an elastic force of the sheet member that acts in the direction intersecting the through hole.

In the present invention, the 2 nd contact may have a 2 nd abutting portion abutting against a step provided in the through hole.

In the present invention, a cross-sectional shape of the 2 nd insertion portion intersecting the through hole may be formed in an arc-shaped sheet shape, and the 1 st insertion portion may be formed in a substantially rod shape and inserted into the 2 nd insertion portion in the arc-shaped sheet shape.

In the present invention, the 2 nd contact may include a pair of the 2 nd insertion portions extending along the through hole in a manner opposed to each other and a 2 nd coupling portion coupling the 2 nd insertion portions to each other, and the 1 st insertion portion of the 1 st contact may be inserted between the 2 nd insertion portions and held therebetween.

In the present invention, an edge portion of the sheet member may be fixed to a fixing plate that is harder than the sheet member.

In the present invention, the sheet member may have a thickness capable of accommodating the 1 st insertion portion and the 2 nd insertion portion and may be formed in a band shape, and both sides of the sheet member may be fixed to the fixing plate.

In the present invention, the strip-shaped sheet member in which the 1 st contact and the 2 nd contact are arranged substantially entirely may be formed in a substantially frame shape, and the fixing plate may have an outer portion arranged outside the sheet member and an inner portion arranged inside the sheet member.

In the present invention, the outer portion and the inner portion of the fixing plate may be coupled to each other by a coupling portion or may be independently separated from each other.

In the present invention, the sheet member may have an inner opening, and the fixing plate may be disposed at least in the inner opening.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the socket for an electrical component of the present invention, since the 1 st contact and the 2 nd contact are inserted from the surfaces of the sheet member made of the insulator having the elastic force, which face each other, so as to be brought into contact with each other, the 1 st contact and the 2 nd contact are pressed by the 1 st electrical component and the 2 nd electrical component to deform the sheet member, and the 1 st electrical component and the 2 nd electrical component can be electrically connected at a predetermined contact pressure by the elastic force. As a result, it is not necessary to separately provide a biasing member such as a coil spring, which has been conventionally required, and the number of parts can be reduced, and the cost of the socket for electric parts can be reduced.

According to the electrical component socket of the present invention, if the 1 st contact has the 1 st contact portion abutting against the 1 st surface, and the 1 st contact portion is pressed by the 1 st electrical component, and the sheet member is pressed by the 1 st contact portion and elastically deformed, for example, the 1 st contact portion can be brought into contact with the 1 st electrical component with a sufficient contact pressure by the reaction force of the sheet member, and it is not necessary to provide a separate urging member, and the structure can be simplified.

According to the electrical component socket of the present invention, for example, the 1 st insertion portion of the 1 st contact is configured to slide in a state of being inserted into and contacting with the 2 nd insertion portion of the 2 nd contact, and therefore, the 1 st contact portion of the 1 st contact and the 2 nd contact portion of the 2 nd contact can be arranged substantially coaxially, and as a result, the 1 st electrical component and the 2 nd electrical component can be arranged in substantially the same position as each other without shifting the 1 st electrical component and the 2 nd electrical component.

According to the electrical component socket of the present invention, for example, since the 1 st insertion portion of the 1 st contact and the 2 nd insertion portion of the 2 nd contact are both formed in a substantially rod shape and slide in a state in which the side surfaces of the first contact and the second contact are in contact with each other, the 1 st contact and the 2 nd contact can be formed in a more compact shape, and as a result, the manufacturing cost of the electrical component socket can be further reduced.

According to the electrical component socket of the present invention, for example, since the sheet member includes two members, i.e., the 1 st sheet member and the 2 nd sheet member, and the 1 st contact and the 2 nd contact are arranged on the 1 st sheet member and the 2 nd sheet member, the elastic force can be changed by the 1 st sheet member and the 2 nd sheet member, and as a result, the degree of freedom can be improved when obtaining the contact pressure with respect to the 1 st electrical component and the 2 nd electrical component.

According to the socket for an electrical component of the present invention, the sheet member has the through hole into which the 1 st insertion portion and the 2 nd insertion portion are inserted, and the protrusion provided in at least one of the contacts is pressed against the other contact by the elastic force of the sheet member. Therefore, the 1 st contact and the 2 nd contact can be reliably brought into contact in the through hole. This eliminates the need to provide a structure for bringing the 1 st contact and the 2 nd contact into contact with each other, simplifies the connection structure between the 1 st electrical component and the 2 nd electrical component, and reduces the cost.

According to the electrical component socket of the present invention, for example, if the 2 nd contact has the 2 nd abutting portion abutting against the step provided in the through hole, the 2 nd contact can be locked by the step of the sheet member, and the 2 nd contact can be stably press-contacted to the 2 nd electrical component.

According to the electrical component socket of the present invention, for example, if the cross-sectional shape intersecting the through hole is formed in the shape of an arc sheet, and the 1 st insertion portion is formed in the shape of a substantially rod and inserted into the inside of the 2 nd insertion portion in the shape of an arc sheet, the 1 st insertion portion of the 1 st contact can be reliably disposed inside the 2 nd insertion portion of the 2 nd contact in the through hole, and the 1 st contact and the 2 nd contact can be reliably brought into contact with each other.

According to the electrical component socket of the present invention, for example, if the 2 nd contact has the pair of 2 nd insertion portions extending along the through hole so as to face each other, and the 1 st insertion portion of the 1 st contact is inserted between the 2 nd insertion portions and sandwiched, the 1 st insertion portion of the 1 st contact can be brought into contact with the 2 nd insertion portion of the 2 nd contact more strongly in the through hole, and the 1 st contact and the 2 nd contact can be connected reliably.

According to the electric component socket of the present invention, for example, the edge portion of the sheet member is fixed to the fixing plate that is harder than the sheet member, and therefore, the edge portion of the sheet member having the elastic force can be firmly supported so as not to be displaced. Therefore, the fixing plate can suppress the strain and deformation of the sheet member, and the positional accuracy of the portion where the 1 st contact and the 2 nd contact are inserted into and disposed in the sheet member can be ensured. For example, even if the sheet member shrinks due to hardening or curing when the sheet member is molded, the positional accuracy of the edge portion of the sheet member fixed to the fixing plate can be ensured. As a result, the 1 st contact and the 2 nd contact can be arranged on the sheet member with high accuracy.

According to the socket for an electrical component of the present invention, for example, the sheet member is formed in a band shape having a thickness capable of accommodating the 1 st insertion portion and the 2 nd insertion portion, and both sides of the sheet member are fixed to the fixing plate. As a result, the sheet member can be prevented from being strained to one side, and the positional accuracy of the arrangement portions of the 1 st contact and the 2 nd contact in the sheet member can be improved.

According to the electrical component socket of the present invention, for example, the strip-shaped sheet member in which the plurality of 1 st contacts and the plurality of 2 nd contacts are arranged substantially over the entire area is formed substantially in the shape of a frame, and the fixing plate has the outer portion arranged outside the sheet member and the inner portion arranged inside the sheet member. Therefore, the inner edge and the outer edge of the substantially frame-shaped sheet member can be firmly supported by the outer portion and the inner portion of the fixing plate so as not to be displaced, and when the sheet member contracts, tension can be applied uniformly from both the inner side and the outer side. As a result, the substantially frame-shaped sheet member can be prevented from contracting and straining to one of the outside and the inside, and the positional accuracy of the arrangement portions of the 1 st contact and the 2 nd contact in the substantially frame-shaped sheet member can be improved.

According to the socket for electric parts of the present invention, for example, if the outer portion and the inner portion of the fixing plate are connected to each other by the connecting portion, the relative positions of the outer portion and the inner portion can be reliably held by the connecting portion. Therefore, both sides of the inner edge and the outer edge of the substantially frame-shaped sheet member can be reliably fixed at predetermined positions, and the positional accuracy of the arrangement positions of the 1 st contact and the 2 nd contact in the substantially frame-shaped sheet member can be further improved.

Further, if the outer side portion and the inner side portion of the fixing plate are separated independently from each other, the tension of the resin sheet disposed between the outer side portion and the inner side portion can be uniformly dispersed over the substantially frame-shaped entire portion. Therefore, the tensions of the sheet member acting on the plurality of 1 st contacts and 2 nd contacts can be easily equalized to ensure the positional accuracy.

According to the socket for an electrical component of the present invention, for example, the sheet member has the inner opening, and the fixing plate is disposed in the inner opening, so that a large amount of the elastic material constituting the sheet member does not exist inside the sheet member, and tension due to contraction or the like at the time of molding the elastic material does not act. Even if the sheet member is provided with an inner opening, the inner edge portion can be firmly supported by the fixing plate so as not to be displaceable. Therefore, the sheet member can be reliably prevented from contracting inward and becoming strained, and the positional accuracy of the arrangement portions of the 1 st contact and the 2 nd contact in the sheet member can be ensured.

Drawings

Fig. 1 is a perspective view showing an IC socket according to embodiment 1 of the present invention.

Fig. 2 is a plan view showing the IC socket according to embodiment 1.

Fig. 3 is a front view showing an IC socket according to embodiment 1.

Fig. 4 is an enlarged sectional view of a portion a of fig. 3 of the IC socket according to embodiment 1.

Fig. 5 is an enlarged cross-sectional view showing a state before pressing the IC socket according to embodiment 1.

Fig. 6 is an enlarged cross-sectional view showing a state after the IC socket of embodiment 1 is pressed.

Fig. 7 is a perspective view showing the 1 st contact of the IC socket according to embodiment 1.

Fig. 8 is a perspective view showing the 2 nd contact of the IC socket according to embodiment 1.

Fig. 9 is a front view showing the 2 nd contact of the IC socket according to embodiment 1.

Fig. 10 is a right side view showing the 2 nd contact of the IC socket according to embodiment 1.

Fig. 11 is a left side view showing the 2 nd contact of the IC socket according to embodiment 1.

Fig. 12 is a B-B sectional view of fig. 11 of the 2 nd contact of the IC socket according to embodiment 1.

Fig. 13 is a bottom view showing the 2 nd contact of the IC socket according to embodiment 1.

Fig. 14 is an enlarged cross-sectional view showing a 1 st modification of the IC socket according to embodiment 1.

Fig. 15 is an enlarged cross-sectional view showing a 2 nd modification of the IC socket according to embodiment 1.

Fig. 16 is a front view showing a modification of the 2 nd contact of the IC socket according to embodiment 1.

Fig. 17 is a right side view showing a modification of the 2 nd contact of the IC socket according to embodiment 1.

Fig. 18 is a bottom view showing a modification of the 2 nd contact of the IC socket according to embodiment 1.

Fig. 19 is a development view of a modification of the 2 nd contact of the IC socket according to embodiment 1.

Fig. 20 is a view of the IC socket according to embodiment 1, showing a modification example of the 2 nd contact during bending.

Fig. 21 is an enlarged sectional perspective view showing an IC socket according to embodiment 2 of the present invention.

Fig. 22 is an enlarged sectional perspective view showing a state where a part of the 1 st contact and a part of the 2 nd contact are extracted from the sheet member of the IC socket according to embodiment 2.

Fig. 23 is an enlarged cross-sectional view schematically showing a state before pressing the IC socket according to embodiment 2.

Fig. 24 is an enlarged cross-sectional view schematically showing a state after the IC socket of embodiment 2 is pressed.

Fig. 25 is an enlarged cross-sectional view schematically showing a modification of the IC socket according to embodiment 2.

Fig. 26 is a perspective view showing an IC socket according to embodiment 3 of the present invention.

Fig. 27 is a front view showing an IC socket according to embodiment 3.

Fig. 28 is an enlarged sectional view of the portion C of fig. 27 of the IC socket according to embodiment 3.

Fig. 29 is a perspective view showing the 2 nd contact of the IC socket according to embodiment 3.

Fig. 30 is a front view showing a 2 nd contact of the IC socket according to embodiment 3.

Fig. 31 is a right side view showing the 2 nd contact of the IC socket according to embodiment 3.

Fig. 32 is a bottom view showing the 2 nd contact of the IC socket according to embodiment 3.

Fig. 33 is a development view showing the 2 nd contact of the IC socket according to embodiment 3.

Fig. 34 is an enlarged cross-sectional view schematically showing another example of the IC socket of the present invention.

Fig. 35 is an enlarged cross-sectional view schematically showing another example of the IC socket of the present invention.

Fig. 36 (a) is an enlarged plan view schematically showing still another example of the IC socket of the present invention, and fig. 36 (b) is an enlarged cross-sectional view schematically showing still another example of the IC socket of the present invention.

Fig. 37 is an enlarged schematic sectional view showing a contact state between the IC socket and the solder ball of fig. 36, where fig. 37 (a) is a view showing a state where the solder ball is in uniform contact with the 1 st contact, and fig. 37 (b) is a view showing a state where the solder ball is in non-uniform contact with the 1 st contact.

Fig. 38 is an enlarged sectional view of a portion a of fig. 3 of the IC socket according to embodiment 4.

Fig. 39 (a) is a perspective view showing a 1 st contact of the IC socket according to embodiment 4, fig. 39 (b) is a perspective view showing a 2 nd contact of the IC socket from the inside, and fig. 39 (c) is a perspective view showing the 2 nd contact of the IC socket from the outside.

Fig. 40 is a partially enlarged sectional view of the IC socket according to embodiment 4, in which fig. 40 (a) shows a state before use, and fig. 40 (b) shows a state in use.

Fig. 41 is a partially enlarged sectional view of an IC socket according to embodiment 5 of the present invention, with fig. 41 (a) showing a state before use and fig. 41 (b) showing a state in use.

Fig. 42 (a) is a perspective view showing a 1 st contact of an IC socket according to embodiment 6 of the present invention, and fig. 42 (b) is a perspective view showing a 2 nd contact of the IC socket.

Fig. 43 is a partially enlarged sectional view of an IC socket according to embodiment 6 of the present invention, in which fig. 43 (a) shows a state before use, and fig. 43 (b) shows a state in use.

Fig. 44 shows an IC socket according to embodiment 7 of the present invention, in which fig. 44 (a) is a plan view, fig. 44 (b) is a cross-sectional view, and fig. 44 (c) is a partially enlarged cross-sectional view.

Fig. 45 shows an IC socket according to a modification of embodiment 7 of the present invention, where fig. 45 (a) is a plan view and fig. 45 (b) is a cross-sectional view.

Fig. 46 shows an IC socket according to another modification of embodiment 7 of the present invention, in which fig. 46 (a) is a plan view and fig. 46 (b) is a D-D sectional view of fig. 46 (a).

Fig. 47 shows an IC socket according to embodiment 8 of the present invention, with fig. 47 (a) being a plan view and fig. 47 (b) being a cross-sectional view.

Fig. 48 shows an IC socket according to embodiment 9 of the present invention, with fig. 48 (a) being a plan view and fig. 48 (b) being a cross-sectional view.

Detailed Description

The following describes embodiments of the present invention.

[ embodiment 1 of the invention ]

Fig. 1 to 13 show embodiment 1 of the present invention.

As shown in fig. 5 and 6, an IC socket 10 as a "socket for electric components" according to the present embodiment is disposed on a wiring substrate 2 as a "2 nd electric component", has an IC package 1 as a "1 st electric component" stored on an upper surface thereof, and is configured to be in contact with and electrically connect solder balls 4 as "terminals" of the IC package 1 and electrodes (not shown) of the wiring substrate 2. The IC socket 10 is used in a test apparatus for a conduction test such as a burn-in test performed on the IC package 1, for example.

The IC package 1 according to the present embodiment is provided with a plurality of spherical solder balls 4 in a matrix shape in a predetermined range of the substantially square shape of the lower surface of the substantially square package body 3 (see fig. 5 and 6).

As shown in fig. 1 to 6, the IC socket 10 includes a frame member 20 having a frame plate shape disposed on the wiring substrate 2, and a socket main body 30 disposed in a central portion of the frame member 20 and connected to the frame member 20.

As shown in fig. 2 to 4, the socket body 30 is connected to the frame member 20 by 4 connection portions 31 extending laterally from the lower surface side. The socket body 30 is configured to house the IC package 1, and includes a sheet member 40 constituting the whole of the socket body 30, a plurality of substantially rod-shaped (substantially cylindrical in this case) 1 st contacts 50 arranged on the sheet member 40 from the upper surface 41 side, and a plurality of substantially cylindrical (substantially cylindrical in this case) 2 nd contacts 60 arranged on the sheet member 40 from the lower surface 42 side and configured to have a larger diameter than the 1 st contacts 50.

Further, in the sheet member 40, the 1 st contact 50 can be inserted into the corresponding 2 nd contact 60 and can slide in contact therewith, and according to such a configuration, the solder ball 4 of the IC package 1 and the electrode of the wiring substrate 2 can be electrically connected via the 1 st contact 50 and the 2 nd contact 60.

As shown in fig. 1 to 4, the sheet member 40 is substantially square in plan view and is made of an insulator having an elastic force. In the present embodiment, the sheet member 40 is made of a resin such as silicone rubber or fluororubber as an insulator having an elastic force and durability against an aging test in which the sheet member is heated to 150 ℃.

The sheet member 40 is provided with a through hole 43 penetrating from the upper surface 41 to the lower surface 42. A 1 st through hole 44 having a diameter allowing a 1 st contact 50 to be inserted with just sliding is provided in a range from the upper surface 41 to a position near the middle of the thickness of the sheet member 40, and a 2 nd through hole 45 having a diameter (larger than the 1 st through hole 44) allowing a 2 nd contact 60 to be inserted with just sliding is provided in a range from the lower surface 42 to a position near the middle of the thickness of the sheet member 40. That is, the through hole 43 has a two-stage structure having a 1 st through hole 44 provided from the upper surface 41 and a 2 nd through hole 45 provided below and communicating with the lower surface 42 and having a larger diameter than the 1 st through hole 44.

As shown in fig. 7, the 1 st contact 50 is a metal member having a substantially cylindrical shape, and includes a 1 st insertion portion 51 having a substantially cylindrical shape and a 1 st contact portion 52 provided at one end thereof and formed in a substantially plate shape (here, a substantially disc shape) having a larger diameter than the 1 st insertion portion 51. The other end of the 1 st insertion portion 51 opposite to the 1 st contact portion 52 has a widened portion 53 in which the 1 st insertion portion 51 bulges outward. In addition, a protrusion 55 having a predetermined shape is formed on the upper surface 54 of the 1 st contact portion 52. In the present embodiment, the plurality of substantially conical projections 55 are arranged so as to be spaced apart from each other by a predetermined interval by the planar shape of the upper surface portion 54. The projection 55 is in contact with the solder ball 4 of the IC socket 2.

As shown in fig. 8 to 13, the 2 nd contact 60 is a metal member having a substantially cylindrical shape, and is formed into a substantially cylindrical shape by bending and bending a plate-shaped member and bringing end portions 66 and 66 thereof into contact with each other. The cylindrical portion 61 of the 2 nd contact 60 is formed in such a size and shape that the hollow portion 63 formed therein can slide in contact with the 1 st insertion portion 51 of the 1 st contact 50.

Further, a 2 nd contact portion 62 for contacting with an electrode of the wiring substrate 2 is provided at an end portion of the 2 nd contact 60 on the lower surface 42 side of the sheet member 40. The 2 nd contact portion 62 of the present embodiment is formed by bending an end portion of the cylindrical portion 61, and is configured to have a predetermined elastic force.

Further, a protrusion 64 protruding inward of the hollow portion 63 is provided near an upper end of the cylindrical portion 61, and the hollow portion 63 at that position is formed to have a slightly smaller diameter by the protrusion 64. Specifically, the diameter of the hollow portion at this position is formed narrower than the widened portion 53 of the 1 st insertion portion 51 of the 1 st contact 50 by the projection portion 64, and the widened portion 53 is positioned below the projection portion 64 by inserting the 1 st insertion portion 51 into the hollow portion 63 and strongly pushing the widened portion 53 into the projection portion 64 to pass over the projection portion 64, so that the 1 st contact 50 and the 2 nd contact 60 are not easily separated.

Further, a slit 65 is formed from the uppermost portion to the lower surface side of the cylindrical portion 61 in the present embodiment, the diameter of the hollow portion 63 can be changed slightly by the slit 65, and when the widened portion 53 reaches the protrusion 64, the hollow portion 63 expands due to the presence of the slit 65, the protrusion 64 expands, the widened portion 53 passes over the protrusion 64, and then the widened portion 53 returns to the original diameter, so that the widened portion 53 is less likely to pass over the protrusion 64 in the reverse direction, and as a result, the 1 st contact 50 and the 2 nd contact 60 are less likely to come off.

Then, the 1 st insertion portion 51 of the 1 st contact 50 is inserted into each 1 st through hole 44 formed in the upper surface 41 of the sheet member 40, the cylindrical portion 61 of the 2 nd contact 60 is inserted into each 2 nd through hole 45 formed in the opposed lower surface 42 of the sheet member 40, the 1 st insertion portion 51 is inserted into the hollow portion 63 of the cylindrical portion 61 in a slidable state, the widened portion 53 passes over the projection portion 64, the 1 st contact 50 and the 2 nd contact 60 are engaged with each other, the 1 st contact portion 52 is exposed from the upper surface 41 of the sheet member 40 (in this case, the lower surface of the 1 st contact portion 52 having a large diameter is in contact with the upper surface 41 of the sheet member 40), the upper end of the cylindrical portion 61 is in contact with the step between the 1 st through hole 44 and the 2 nd through hole 45, and the 2 nd contact portion 62 is exposed from the lower surface 42 of the sheet member 40 (in this case, the state, the 2 nd contact portion 62 is in a predetermined amount of projection from the lower surface 42 of the, thus, the IC package 1 can be accommodated in the wiring board 2.

Next, the operation of the IC socket 10 having such a structure will be described.

First, as shown in fig. 5, the IC socket 10 is disposed so that the 2 nd contact portion 62 of the 2 nd contact 60 is in contact with the terminal of the wiring substrate 2. Next, the IC package 1 is housed in the upper surface 41 of the sheet member 40 of the IC socket 10 such that the solder ball 4 of the IC package 1 contacts the 1 st contact portion 52 of the 1 st contact 50.

When the IC package 1 is pressed downward by a robot or the like in this state, the 1 st contact portion 52 is pressed downward from the state of fig. 5 by the solder ball 4 of the IC package 1, and accordingly, the sheet member 40 having an elastic force is pressed by the lower surface of the 1 st contact portion 52, and as shown in fig. 6, the sheet member 40 is compressively deformed in a state of having a repulsive force to return to its original state. At the same time, the upper end of the cylindrical portion 61 of the 2 nd contact 60 inserted into the 2 nd through hole 45 is pressed downward by the end of the 1 st through hole 44 of the sheet member 40, and the 2 nd contact 60 is pressed downward.

As a result, a predetermined contact pressure between the 1 st contact portion 52 and the solder ball 4 of the IC package 1 is ensured by the upward repulsive force of the sheet member 40, and a predetermined contact pressure between the 2 nd contact portion 62 and the electrode of the wiring substrate 2 is ensured by the downward pressing of the end portion of the 1 st through hole 44 against the cylindrical portion 61 of the 2 nd contact 60. Further, the 1 st contact 50 and the 2 nd contact 60 are connected by the 1 st insertion portion 51 sliding in contact with the hollow portion 63. Then, a conduction test such as a burn-in test is performed. Note that, the description of detaching the IC package 1 and the wiring substrate 2 from the IC socket 10 after the test is omitted.

As shown in fig. 14, in the present embodiment, the entire side surface of the cylindrical portion 61 of the 2 nd contact 60 may be bonded with the adhesive S, and the lower surface of the 1 st contact portion 52 of the 1 st contact 50 and the 1 st insertion portion 51 may be bonded within a range from the position in contact with the 1 st contact portion 52 to a predetermined amount below (the 1 st insertion portion 51 may not be bonded entirely). With this configuration, the sheet member 40 and the 1 st and 2 nd contacts 50, 60 can be held in a stable state.

As shown in fig. 15, the 2 nd contact portion 62 of the 2 nd contact 60 may have a flange-like large diameter portion 62 a. With this configuration, as in the case where the 1 st contact portion 52 presses the upper surface 41 of the sheet member 40, the lower surface 42 of the sheet member 40 can be pressed by the 2 nd contact portion 62, and therefore, the sheet member 40 can be pressed by both the pressing forces, and the sheet member 40 can be more easily compressed and deformed.

The shape of the 2 nd contact 60 may be different from the above-described shape, as in the 2 nd contact 160 shown in fig. 16 to 20. As shown in fig. 19, the 2 nd contact 160 is configured such that, in the expanded view, half of the cylindrical portion 161 is formed substantially at the 2 nd contact portion 162. As shown in fig. 20, the respective halves of the cylindrical portion 161 are bent and the 2 nd contact portion 162 is bent so as to protrude substantially at the center, thereby forming the 2 nd contact 160 having a shape as shown in fig. 16 to 18. In this shape, the same operational effects as those of the 2 nd contact 60 described above can be obtained.

As described above, according to the IC socket 10 of the present embodiment, since the 1 st contact 50 and the 2 nd contact 60 are inserted from the surfaces 41 and 42 of the sheet member 40 made of an insulator having an elastic force so that the 1 st contact 50 and the 2 nd contact 60 are in contact with each other, the sheet member 40 can be deformed by pressing the 1 st contact 50 and the 2 nd contact 60 with the IC package 1 and the wiring substrate 2, and the IC package 1 and the wiring substrate 2 can be electrically connected with each other at a predetermined contact pressure by the elastic force. As a result, it is not necessary to separately provide a biasing member such as a coil spring, which has been conventionally required, and the number of parts can be reduced, thereby reducing the cost of the IC socket 10.

In the IC socket 10 according to the present embodiment, the 1 st contact 50 includes the 1 st contact portion 52 having a plate shape, and the 1 st contact portion 52 is pressed by the IC package 1 while being in contact with the 1 st surface 41, so that the sheet member 40 is deformed by the 1 st contact portion 52, and therefore, the sheet member 40 can be reliably pressed and deformed to exert the elastic force.

Further, according to the IC socket 10 of the present embodiment, since the 1 st insertion portion 51 of the 1 st contact 50 is configured to slide while being inserted into and in contact with the inside of the cylindrical portion 61 of the 2 nd contact 60, the 1 st contact portion 52 of the 1 st contact 50 and the 2 nd contact portion 62 of the 2 nd contact 60 can be arranged substantially coaxially, and as a result, the IC package 1 and the wiring board 2 can be arranged in substantially the same position as each other without displacing the IC package 1 and the wiring board 2.

[ embodiment 2 of the invention ]

Embodiment 2 of the present invention is shown in fig. 21 to 24. The embodiment of the present invention is the same as embodiment 1 except for the following description, and therefore, the description of other matters is omitted except for the differences from embodiment 1.

In the socket main body 230 of the IC socket 210, the 1 st contact 250 and the 2 nd contact 260 are different in shape. That is, both the 1 st contact 250 and the 2 nd contact 260 are formed of substantially rod-shaped members, the 1 st contact 250 is formed of a substantially rod-shaped 1 st insertion portion 251 and a 1 st contact portion 252 formed at one end thereof and having a diameter larger than that of the 1 st insertion portion 251, and the 2 nd contact 260 is formed of a substantially rod-shaped 2 nd insertion portion 261 having a diameter smaller than that of the 1 st insertion portion 251 and a 2 nd contact portion 262 formed at one end thereof and having a diameter larger than that of the 2 nd insertion portion 261. The widened portion 53 formed at the other end of the 1 st insertion portion 51 of the 1 st contact 50 in embodiment 1 is not formed in the 1 st contact 250 and the 2 nd contact 260 in this embodiment.

As shown in fig. 22, the through hole 243 of the sheet member 240 has a shape in which the large hole portion 244 and the small hole portion 245 are connected and communicated with each other laterally. The 1 st insertion portion 251 of the 1 st contact 250 is inserted from the upper surface 241 side to the large hole portion 244 of the through hole 243, and the 2 nd insertion portion 261 of the 2 nd contact 260 is inserted from the lower surface 242 side to the small hole portion 245 of the through hole 243, so that the side surfaces 256 and 266 are configured to contact and slide with each other.

According to such a configuration, the 1 st contact portion 252 of the 1 st contact 250 in the state shown in fig. 23 is pressed from the upper surface 241 side by the solder ball 4 of the IC package 1, and the 2 nd contact portion 262 of the 2 nd contact 260 is pressed from the lower surface 242 side by the electrode of the wiring substrate 2, so that the sheet member 240 is pressed as shown in fig. 24, and along with this, the 1 st insertion portion 251 and the 2 nd insertion portion 261 slide in a contact state and are compressively deformed.

The 1 st insertion portion 251 of the 1 st contact 250 and the 2 nd insertion portion 261 of the 2 nd contact 260 according to the present embodiment are formed in substantially cylindrical shapes, but are not limited thereto, and may be formed in other shapes such as a prism shape such as a quadrangular prism or a triangular prism, or a semi-cylindrical shape. In particular, it is preferable that the contact sliding portion of the 1 st contact 250 and the 2 nd contact 260 has a shape such as a planar shape or the like in which the area is increased because the electrical connection can be performed more favorably.

As shown in fig. 25, in the present embodiment, a sheet T1 (preferably, an insulating sheet having a higher rigidity than the sheet member 240) having a predetermined hardness and thickness may be provided on the lower surface of the 1 st contact portion 252 of the 1 st contact 250 (above the upper surface 241 of the sheet member 240), and a sheet T2 (preferably, an insulating sheet having a higher rigidity than the sheet member 240) having a predetermined hardness and thickness may be provided on the upper surface of the 2 nd contact portion 262 of the 2 nd contact 260 (below the lower surface 242 of the sheet member 240). With this configuration, the load of the pressing force of the 1 st contact portion 252 against the sheet member 240 and the pressing force of the 2 nd contact portion 262 against the sheet member 240 can be dispersed, and therefore, the sheet member 240 can be uniformly loaded as a whole.

As described above, according to the IC socket 210 of the present embodiment, since the 1 st contact 250 and the 2 nd contact 260 are inserted in contact from the surfaces 241 and 242 of the sheet member 240 made of an insulator having an elastic force, the sheet member 240 can be deformed by pressing the 1 st contact 250 and the 2 nd contact 260 with the IC package 1 and the wiring board 2, and the IC package 1 and the wiring board 2 can be electrically connected with each other at a predetermined contact pressure by the elastic force. As a result, it is not necessary to separately provide a biasing member such as a coil spring, which has been conventionally required, and the number of parts can be reduced, thereby reducing the cost of the IC socket 210.

In the IC socket 210 according to the present embodiment, the 1 st contact 250 includes the 1 st contact portion 252 having a plate shape, and the 1 st contact portion 252 is pressed by the IC package 1 while being in contact with the 1 st surface 241, so that the sheet member 240 is deformed by the 1 st contact portion 252, and therefore, the sheet member 240 can be reliably pressed and deformed to exert the elastic force.

Further, according to the IC socket 210 of the present embodiment, since the 1 st insertion portion 251 of the 1 st contact 250 and the 2 nd insertion portion 261 of the 2 nd contact 260 are both formed in a substantially rod shape and slide in a state where the side surfaces 256 and 266 thereof contact each other, the 1 st contact 250 and the 2 nd contact 260 can be formed in a more compact shape, and as a result, the manufacturing cost of the IC socket 210 can be further reduced.

[ embodiment 3 of the invention ]

Embodiment 3 of the present invention is shown in fig. 26 to 33. The embodiment of the present invention is the same as embodiment 1 except for the following description, and therefore, the description of other matters is omitted except for the differences from embodiment 1.

As shown in fig. 26 to 28, the IC socket 310 includes a frame member 320 having a frame plate shape disposed on the wiring substrate 2, and a socket main body 330 disposed in a central portion of the frame member 320 and connected to the frame member 320.

As shown in fig. 26 to 28, the socket main body 330 is connected to the frame member 320 by 4 connection portions 331 extending laterally from the lower surface side of the 1 st piece member 340a and the upper surface side of the 2 nd piece member 340b, which will be described later. The socket main body 330 is configured to house the IC package 1, and includes a sheet member 340 constituting the whole of the socket main body 330, a plurality of substantially rod-shaped (substantially cylindrical in this case) 1 st contacts 350 arranged on the sheet member 340 from the upper surface 341 side, and a plurality of substantially cylindrical (substantially cylindrical in this case) 2 nd contacts 360 arranged on the sheet member 340 from the lower surface 342 side and configured to have a larger diameter than the 1 st contacts 350.

Further, in the sheet member 340, the 1 st contact 350 can be inserted into the corresponding 2 nd contact 360 to be slidable in contact therewith, and thus the solder ball 4 of the IC package 1 and the electrode of the wiring board 2 can be electrically connected via the 1 st contact 350 and the 2 nd contact 360.

As shown in fig. 26 to 28, the sheet member 340 is substantially square in plan view, and two sheet members, i.e., a 1 st sheet member 340a and a 2 nd sheet member 340b having elastic force, are overlapped.

The 1 st piece member 340a has a 1 st through hole 344 penetrating downward from the upper surface 341 and having a diameter into which a 1 st contact 350 described later can be inserted to a proper extent of sliding.

Further, the 2 nd piece member 340b is provided with a 2 nd through hole 345 having a diameter (larger than the 1 st through hole 344) into which a 2 nd contact 360, which will be described later, can be inserted to a proper extent of sliding so as to penetrate upward from the lower surface 342.

That is, the 1 st and 2 nd sheet members 340a and 340b have a two-stage structure including a 1 st through hole 344 provided from the upper surface 341 and a 2 nd through hole 345 provided below the 1 st through hole and communicating with the lower surface 342, and having a diameter larger than that of the 1 st through hole 344. Further, the 1 st sheet member 340a and the 2 nd sheet member 340b may be made of different materials. For example, if the 1 st sheet member 340a is configured to be harder than the 2 nd sheet member 340b, the sheet member 340 has a larger repulsive force when compressed and deformed by pressing, and the contact pressure with the IC package 1 and the wiring substrate 2 can be increased.

As shown in fig. 29 to 33, the 2 nd contact 360 is a metal member having a substantially cylindrical shape, and is formed into a substantially cylindrical shape by bending and bending a plate-shaped member and bringing end portions 366 and 366 thereof into contact with each other. The cylindrical portion 361 of the 2 nd contact 360 is formed in such a size and shape that the hollow portion 363 formed therein can slide in contact with the 1 st contact portion 352 of the 1 st contact 350.

Further, a 2 nd contact portion 362 for contacting an electrode of the wiring substrate 2 is provided at an end portion of the 2 nd contact 360 on the lower surface 342 side of the sheet member 340. The 2 nd contact portion 362 of the present embodiment is formed by bending an end portion of the cylindrical portion 361, and is configured to have a predetermined elastic force.

Then, the 1 st insertion portion 351 of the 1 st contact 350 is inserted into each 1 st through hole 344 formed in the upper surface 341 of the sheet member 340, the cylindrical portion 361 of the 2 nd contact 360 is inserted into each 2 nd through hole 345 formed in the opposing lower surface 342 of the sheet member 340, the 1 st insertion portion 351 is inserted into the hollow portion 363 of the cylindrical portion 361 in a slidable state, the 1 st contact 350 and the 2 nd contact 360 are engaged with each other, and the 1 st contact portion 352 is exposed from the upper surface 341 of the sheet member 340 (in this case, the lower surface of the 1 st contact portion 352 having a large diameter is in contact with the upper surface 341 of the sheet member 340), the upper end of the cylindrical portion 361 abuts against the step between the 1 st through-hole 344 and the 2 nd through-hole 345, and the 2 nd contact portion 362 is exposed from the lower surface 342 of the sheet member 340 (here, the 2 nd contact portion 362 protrudes from the lower surface 342 of the sheet member 340 by a predetermined amount), and is disposed on the wiring substrate 2, and the IC package 1 can be accommodated therein.

In the present embodiment, as in fig. 14 of embodiment 1, the entire side surface of the cylindrical portion 361 of the 2 nd contact 360 may be bonded to the 2 nd sheet member 340b with an adhesive, and the lower surface of the 1 st contact portion 352 of the 1 st contact 350 and the 1 st insertion portion 351 may be bonded to the 1 st sheet member 340a with an adhesive in a range from the position in contact with the 1 st contact portion 352 to a predetermined amount below (the 1 st insertion portion 351 may not be bonded entirely). With this configuration, the blade member 340 and the 1 st and 2 nd contacts 350 and 360 can be held in a stable state.

As described above, according to the IC socket 310 of the present embodiment, the 1 st contact 350 and the 2 nd contact 360 are inserted from the surfaces 341 and 342 of the sheet member 340 made of an insulator having an elastic force so that the 1 st contact 350 and the 2 nd contact 360 are in contact with each other, and therefore, the sheet member 340 can be deformed by pressing the 1 st contact 350 and the 2 nd contact 360 with the IC package 1 and the wiring substrate 2, and the IC package 1 and the wiring substrate 2 can be electrically connected with each other at a predetermined contact pressure by the elastic force. As a result, it is not necessary to separately provide a biasing member such as a coil spring, which has been conventionally required, and the number of parts can be reduced, thereby reducing the cost of the IC socket 310.

In the IC socket 310 according to the present embodiment, the 1 st contact 350 includes the 1 st contact portion 352 having a plate shape, and the 1 st contact portion 352 is pressed by the IC package 1 while being in contact with the 1 st surface 341, so that the sheet member 340 is deformed by the 1 st contact portion 352, and therefore, the sheet member 340 can be reliably pressed and deformed to exert the elastic force.

Further, according to the IC socket 310 of the present embodiment, since the sheet member 340 is constituted by two members, i.e., the 1 st sheet member 340a and the 2 nd sheet member 340b, and the end portion of the 1 st sheet member 340a on the 2 nd sheet member 340b side is pressed against the end portion of the 2 nd insertion portion 361 exposed on the 1 st sheet member 340a side of the 2 nd sheet member 340b, the 1 st sheet member 340a can be more reliably deformed when the sheet member 340 is deformed, and as a result, the IC package 1 and the wiring substrate 2 can be electrically connected with a more reliable contact pressure by the elastic force of the 1 st sheet member 340 a.

The "socket for electric component" of the present invention is not limited to the structure described in each of embodiments 1 to 3, and can be applied to devices having other structures such as devices other than the IC socket.

The "socket for electric components" according to the present invention is not limited to the structure of each of embodiments 1 to 3 described above, and may be configured by another structure.

For example, as shown in fig. 34, the IC socket 410 may have a structure in which a conductive filler 460 as a 2 nd contact is fixed by a resin 446 in a through hole 443 provided in the sheet member 440, a 1 st insertion portion 451 of the 1 st contact 450 is inserted into the resin 446 from the upper surface 441 side, a 1 st contact portion 452 of the 1 st contact 450 is exposed, the 1 st insertion portion 451 and the conductive filler 460 are electrically connected, and a 2 nd contact portion 462 exposed to the lower surface 442 side by the 1 st contact portion 452 and the conductive filler 460 is brought into contact with the 1 st electrical part 1 and the 2 nd electrical part 2.

As shown in fig. 35, IC socket 510 may have a sheet member 540 composed of a 1 st sheet member 540a and a 2 nd sheet member 540b, in which the 1 st sheet member 540a has a 1 st through hole 544, the 2 nd sheet member 540b has a structure in which a conductive filler 560 as a 2 nd contact is fixed by a resin 546 in the 2 nd through hole 545, a 1 st insertion portion 551 of the 1 st contact 550 is inserted from the upper surface 541 side of the sheet member 540, a 1 st contact portion 552 of the 1 st contact 550 is exposed, the 1 st insertion portion 551 and the conductive filler 560 in the 2 nd sheet member 540b are electrically connected, and the 1 st electrical part 1 and the 2 nd electrical part 2 are brought into contact with each other by the 1 st contact portion 552 and a 2 nd contact portion 562 of the conductive filler 560 exposed to the lower surface 542 side.

As shown in fig. 36 and 37, the IC socket 610 may have a rod-shaped 2 nd contact 660 inserted from the lower surface 642 side of the sheet member 640 and a plurality of rod-shaped 1 st contacts 650 inserted from the upper surface 641 side of the sheet member 640, the 2 nd contact 660 and the 1 st contacts 650 being capable of sliding in contact with each other in the sheet member 640, a 1 st contact portion 652 at the tip end of the plurality of 1 st contacts 650 being exposed from the upper surface 641 side of the sheet member 640 and being in multi-point contact with the terminal 4 of the 1 st electrical component 1, and a 2 nd contact portion 662 at the tip end of the 2 nd contact 660 being exposed from the lower surface 642 side of the sheet member 640 and being in contact with the electrode of the 2 nd electrical component 2, so as to be in contact with the 1 st electrical component 1 and the 2 nd electrical component 2 by the 1 st contact portion 652 and the 2 nd contact portion 662.

With such a configuration of the IC socket 610, the plurality of 1 st contacts 650 can operate independently. Therefore, as shown in fig. 37 (a), when the terminal 4 of the 1 st electric part 1 is uniformly contacted with respect to the plurality of 1 st contacts 650 of the IC socket 610, the plurality of 1 st contacts 650 move up and down in a uniform state and are in multi-point contact with the terminal 4. On the other hand, as shown in fig. 37 (b), when the terminal 4 of the 1 st electrical component 1 is in contact with the plurality of 1 st contacts 650 of the IC socket 610 in an unevenly shifted state, the terminal 4 is in multi-point contact in such a state that the 1 st contact 650 is moved up and down in an unevenly shifted state in which a part of the 1 st contacts 650 are pressed more greatly and the pressing of the other 1 st contacts 650 is small. Thus, even if the terminal 4 of the 1 st electrical component 1 is deviated, the 1 st contact 650 can be in multi-point contact, and the electrical connection can be maintained.

The shape of the projection of the 1 st contact portion of the 1 st contact is not limited to the above shape, and may be an appropriate shape such as a so-called crown shape or a conical shape as a whole.

[ embodiment 4 of the invention ]

Embodiment 4 of the present invention is shown in fig. 38 to 40.

The IC socket 110, which is the "socket for electrical components" of the present embodiment, is configured to be arranged on the wiring substrate 2, which is the "2 nd electrical component", in the same manner as in embodiment 1 of the present invention, to accommodate the IC package 1, which is the "1 st electrical component", on the upper surface thereof, and to electrically connect the solder balls 4, which are the "terminals" of the IC package 1, to the electrodes 2a of the wiring substrate 2. The IC socket 110 is used in a test apparatus for a conduction test such as a burn-in test of the IC package 1.

The IC package 1 of the present embodiment is provided with a plurality of spherical solder balls 4 in a matrix shape in a predetermined range of a substantially square shape of the lower surface of a substantially square package body 3.

The IC socket 110 includes a frame member 120 disposed on the wiring substrate 2, and a socket main body 130 disposed in a central portion of the frame member 120 and connected to the frame member 120.

The socket body 130 is configured to be connected to the frame member 120 by 4 connection portions 131 extending laterally from the lower surface. The socket body 130 is configured to accommodate the IC package 1, and includes a sheet member 140 constituting the whole of the socket body 130, and a plurality of pin contacts 133 arranged in a matrix on the sheet member 140.

Each of the pin contacts 133 includes a plurality of substantially rod-shaped 1 st contacts 150 inserted into the through-hole 143 from the upper surface 141 and arranged on the sheet member 140, and a substantially semi-tubular 2 nd contact 160 inserted into the through-hole 143 from the lower surface 142 and arranged on the sheet member 140.

In the socket body 130, the 1 st contact 150 is configured to be slidable in contact with the 2 nd contact 160 disposed laterally within the through hole 143 of the sheet member 140, and the solder ball 4 of the IC package 1 and the electrode of the wiring board 2 are electrically connected via the 1 st contact 150 and the 2 nd contact 160.

The sheet member 140 has a substantially square shape in plan view. The sheet member 140 is made of an elastic body having elastic force, and is made of an insulator having durability against an aging test heated to 150 ℃, for example, a resin such as silicone rubber, fluororubber, or the like.

The sheet member 140 is provided with a through hole 143 that penetrates between the upper surface 141 and the lower surface 142. The 1 st through hole 144 having a diameter into which the 1 st contact 150 is slidably inserted is provided in a range from the upper surface 141 to a portion near the middle of the thickness of the sheet member 140, and the 2 nd through hole 145 having a diameter larger than that of the 1 st through hole 144 and into which the 2 nd contact 160 is slidably inserted is provided in a range from the lower surface 142 to a portion near the middle of the thickness of the sheet member 140.

The 1 st through hole 144 on the upper surface 141 side and the 2 nd through hole 145 on the lower surface 142 side have a step 146 on the inner wall and are coaxially and continuously provided, resulting in a two-stage structure.

As shown in fig. 39 (a), the 1 st contact 150 is a substantially cylindrical metal member, and includes: a 1 st insertion portion 151 having a substantially cylindrical shape; and a 1 st contact portion 152 provided at one end of the 1 st insertion portion 151, formed to have a larger diameter than the 1 st insertion portion 151 and the 1 st through hole 144, having a substantially disk shape, and capable of coming into contact with the upper surface 141 around the through hole 143.

In the upper surface portion 54 of the 1 st contact portion 152, a plurality of substantially conical protrusions 155 are provided at intervals from each other by the planar shape of the upper surface portion 54. The plurality of protrusions 155 are in contact with the solder balls 4 of the IC package 1.

The 1 st contact portion 152 is configured such that, when a force in the direction along the through hole 143 acts on the 1 st contact 150, the 1 st contact portion 152 presses and elastically deforms the sheet member 140.

The 1 st insertion portion 151 has a rod-shaped 1 st insertion portion 151 extending along the through hole 143 at an end opposite to the 1 st contact portion 152 and disposed at a side of the 2 nd contact 160. The 1 st insertion part 151 is in contact with an inner wall of the through-hole 143 and is slidable in a direction along the through-hole 143.

As shown in fig. 39 (b) and (c), the 2 nd contact 160 is a metal member formed in a substantially semi-tubular shape, and has a 2 nd insertion portion 161 inserted into the through hole 143 and disposed on the side of the 1 st contact 150, and a 2 nd contact portion 162 provided at one end thereof and contacting the wiring substrate 2.

The 2 nd insertion portion 161 has: a 2 nd insertion portion main body 161a having a circular-arc-like cross-sectional shape in a direction intersecting the through hole 143, the 2 nd insertion portion main body 161a extending smoothly and continuously along the through hole 143; and a protrusion 170 protruding in a direction intersecting the through hole 143 by partially deforming the 2 nd insertion portion 161 into a cut-out shape.

The shape of the projection 170 can be appropriately set, and in the present embodiment, the projection 170 is formed in a shape which is continuous from the 2 nd insertion portion main body 161a at the upper end side and which projects inward of the 2 nd insertion portion main body 161a in the shape of an arc piece on the side of the 2 nd contact portion 162 at the longitudinal direction intermediate position of the 2 nd insertion portion main body 161 a.

The 2 nd contact portion 163 that contacts the step 146 of the through hole 143 in the direction along the through hole 143 is provided at the upper end of the 2 nd insertion portion 161. The 2 nd contact portion 163 is configured to be supported in contact with the step 146 when a force in the direction along the through hole 143 acts on the 2 nd contact 160.

At the end portion of the 2 nd contact 160 on the lower surface 142 side of the sheet member 140, a 2 nd contact portion 162 for contacting the electrode 2a of the wiring substrate 2 is formed in a shape bent from the 2 nd insertion portion 161 with a width narrower than that of the 2 nd insertion portion 161.

As shown in fig. 40 (a), the IC socket 110 having such a configuration is used by inserting the 1 st contact 150 and the 2 nd contact 160 into each of the through holes 143 provided in a matrix between the upper surface 141 and the lower surface 142 of the through-sheet member 140.

First, the 2 nd contacts 160 are arranged in a state in which the arc-shaped 2 nd insertion portions 161 are inserted into the through holes 143 from the lower surface 142 side of the sheet member 140, the 2 nd contact portions 163 are brought into contact with the step 146 in the through holes 143, and the 2 nd contact portions 162 protrude from the lower surface 142 side.

Further, each of the 1 st contacts 150 is inserted from the upper surface 141 side of the sheet member 140 into the through hole 143 through the rod-shaped 1 st insertion portion 151 and into the arc-shaped 2 nd insertion portion main body 161a, so that the 1 st insertion portion 151 and the 2 nd insertion portion 161 are adjacent to each other in a direction intersecting the through hole 143, and the 1 st contact portion 152 is in contact with the upper surface 141 of the sheet member 140.

When the 1 st insertion portion 151 of the 1 st contact 150 is inserted into the 2 nd insertion portion body 161a of the 2 nd contact 160 having an arc-like shape, the rod-shaped 1 st insertion portion 151 of the 1 st contact 152 is adjacent to the projection 170 provided on the 2 nd insertion portion 161, and the 1 st insertion portion 151 of the 1 st contact 150 and the projection 170 of the 2 nd contact 160 are arranged in contact with each other in a direction intersecting the through hole 143.

At this time, the 1 st insertion portion 151 of the 1 st contact 150 and the 2 nd insertion portion body 161a of the 2 nd contact 160 are respectively in contact with the inner wall of the through hole 143 and arranged in a state of pressing the inner wall of the through hole 143 in the radial direction.

Therefore, the elastic force of the sheet member 140 is loaded to the 1 st and 2 nd inserting portions 151 and 161 in the direction crossing with respect to the through hole 143, and the 1 st and 2 nd inserting portions 151 and 170 of the 1 st and 2 nd contacts 150 and 160 are pressed by the elastic force of the sheet member 140.

As shown in fig. 40 (b), IC socket 110 is disposed on wiring board 2, and lower surface 142 of sheet member 140 is disposed at a predetermined position on wiring board 2. Thereby, the 2 nd contact portion 162 of the 2 nd contact 160 is brought into contact with and fixed to the electrode 2a of the wiring substrate 2. In this state, the test apparatus is used for a burn-in test or the like.

In the test, the IC package 1 is placed on the upper side of the socket 1 and placed at a predetermined position on the upper surface 141 of the socket body 130. Then, by pressing down the IC package 1, the solder ball 4 of the IC package 1 is pressed against the 1 st contact portion 152 of the 1 st contact 150.

When the 1 st contact 150 is lowered by pressing the IC package 1 downward, the 1 st insertion portion 151 of the 1 st contact 150 and the 2 nd introduction portion 61 of the 2 nd contact 160 are inserted into the through hole 143 and pressed in a direction intersecting the through hole 143 by the elastic force of the sheet member 140, and therefore, even if the 1 st contact 150 is pressed by the solder ball 4 and lowered, the state in which the projection portion 170 of the 1 st insertion portion 151 and the 2 nd insertion portion 161 are pressed and held can be maintained. Even in the state where the 1 st contact 150 is lowered to the lowermost position as in (b) of fig. 40, the projection 170 of the 1 st insertion portion 151 and the 2 nd insertion portion 161 are pressure-contacted by the elastic force of the sheet member 140.

Further, when the IC package 1 is pressed downward, the 1 st contact portion 152 presses and elastically deforms the position of the upper surface 141 of the sheet member 140 corresponding to each 1 st contact portion 152, so that a reaction force due to the elastic force of the sheet member 140 is obtained, and the 1 st contact portion 152 and the solder ball 4 can be pressed and connected with a sufficient contact pressure.

Further, since the 2 nd contact portion 163 of the 2 nd contact 160 abuts against and is supported by the step 146 of the through hole 143, a reaction force is obtained, and the 2 nd contact portion 162 of the 2 nd contact 160 and the electrode 2a of the wiring substrate 2 can be pressure-contacted.

As a result, the electrodes 2a of the wiring board 2 and the solder balls 4 of the IC package 1 can be reliably connected to each other via the 2 nd contact 160 and the 1 st contact 150, and can be used as a test apparatus by applying current.

According to the IC socket 110 of the present embodiment as described above, the sheet member 140 made of an insulator having an elastic force has the through hole 143, the 1 st contact 150 in contact with the IC package 1 and the 2 nd contact 160 in contact with the wiring board 2 are inserted into the through hole 143, and the projection 170 provided in the 1 st contact 150 is pressed against the 2 nd contact 160 by the elastic force of the sheet member 140. Therefore, the 1 st contact 150 and the 2 nd contact 160 can be reliably brought into contact within the through hole 143. This eliminates the need to provide a structure for pressing and contacting the 1 st contact 150 and the 2 nd contact 160, respectively, and simplifies the connection structure between the IC package 1 and the wiring board 2, thereby reducing the cost.

In the IC socket 110 of the present embodiment, the 1 st contact 150 has the 1 st contact portion 152 that abuts against the upper surface 141, and the sheet member 140 is pressed by the 1 st contact portion 152 and elastically deformed by the pressing of the 1 st contact portion 152 by the IC package 1, so that the 1 st contact portion 152 can be brought into contact with the IC package 1 with a sufficient contact pressure by the reaction force of the sheet member 140, and it is not necessary to provide a separate urging member, and the structure can be simplified.

In the IC socket 110 of the present embodiment, since the 2 nd contact 160 has the 2 nd abutting portion 163 abutting against the step 146 provided in the through hole 143, the 2 nd contact portion can be stably pressed against the electrode 2a of the wiring substrate 2 by the reaction force of the step 146 of the sheet member 140.

In the IC socket 110 of the present embodiment, since the 2 nd contact 160 has the 2 nd insertion portion 161 having an arc-shaped cross-sectional shape extending along the through hole 143 and intersecting the through hole 143, and the 1 st contact 150 has the rod-shaped 1 st insertion portion 151 extending along the through hole 143 and inserted into the arc-shaped 2 nd insertion portion 161, the 1 st insertion portion 151 of the 1 st contact 150 can be reliably disposed inside the 2 nd insertion portion 161 of the 2 nd contact 160 in the through hole 143, and the 1 st contact 150 and the 2 nd contact 160 can be reliably brought into contact with each other.

[ embodiment 5 of the invention ]

Fig. 41 (a) and (b) are partially enlarged sectional views of an IC socket according to embodiment 5 of the present invention. The IC socket 110 according to embodiment 5 is the same as that according to embodiment 4, except for the structure of the pin contacts 133.

As shown in fig. 41 (a), in the pin contact 133 of the present embodiment, the projection 170 is provided in the 1 st insertion portion 151 of the 1 st contact 150, and the projection 170 is not provided in the 2 nd insertion portion 161 of the 2 nd contact 160.

The protrusion 170 of the 1 st insertion portion 151 is formed in a minute block shape protruding in a direction intersecting the through hole 143 at the distal end side of the rod-shaped 1 st insertion portion 151. The 2 nd insertion portion 161 of the 2 nd contact 160 is provided so as to be smoothly continuous in the direction along the through hole 143 with an arc-like cross-sectional shape in the direction intersecting the through hole 143, like the 2 nd insertion portion main body 161a of embodiment 1.

In such an IC socket 110, the socket main body 130 is configured in a state where the 1 st contact 150 and the 2 nd contact 160 are inserted into the through hole 143 of the sheet member 140, and the projection 170 of the 1 st insertion portion 151 of the 1 st contact 150 and the 2 nd insertion portion 161 of the 2 nd contact 160 are pressed against each other from the wall portion of the through hole 143 by the elastic force of the sheet member 140.

When used as a test apparatus, as shown in fig. 41 (b), the sheet member 140 of the socket body 130 is disposed at a predetermined position on the wiring board 2, and the IC chip 10 is disposed on the upper side of the socket body 130 and pressed. Thus, as in embodiment 4, the contact portion 52 of the 1 st contact 150 and the 2 nd contact portion 162 of the 2 nd contact 160 are pressed against the electrode 2a of the wiring substrate 2 and the solder ball 4 of the IC package 1 in a state where the projection portion 170 of the 1 st contact 150 and the 2 nd insertion portion 161 of the 2 nd contact 160 are pressed against each other.

Therefore, the same operational effects as those of embodiment 4 can be obtained with the structure as that of embodiment 5 of the present invention.

[ embodiment 6 of the invention ]

Fig. 42 and 43 are partially enlarged sectional views of IC socket 110 according to embodiment 6 of the invention.

In this IC socket 110, the structure of the 2 nd contact 160 is different, and the structure is the same as that of embodiment 4 of the invention except that.

In the present embodiment, as shown in fig. 42 (a), the 1 st contact 150 has a pair of 2 nd insertion portions 161 extending along the through hole 143 so as to face each other, and a 2 nd coupling portion 165 coupling the 2 nd insertion portions 161 to each other at one end side of each of the 2 nd insertion portions 161, as shown in fig. 42 (b), similarly to embodiment 4 of the invention.

The pair of 2 nd insertion portions 161 are configured in the same manner as the 2 nd insertion portions 161 of the 2 nd contact 160 according to embodiment 4, and each of the pair of 2 nd insertion portions 161 has a substantially arc-shaped cross-sectional shape in a direction intersecting the through-hole 143. The 2 nd coupling portion 165 is formed by folding back in a substantially japanese kana コ shape in a cross section along the direction of the through hole 143, and is continuous with the 2 nd insertion portion 161 at both ends.

The folded portion of the 2 nd coupling portion 165 is a portion disposed so as to protrude from the lower surface 142 of the sheet member 140, and a contact convex portion 166 that comes into contact with the electrode 2a of the wiring substrate 2 is provided so as to protrude downward.

As shown in fig. 43 (a), in the IC socket 110 according to the present embodiment, the pair of 2 nd insertion portions 161 of the 2 nd contact 160 are inserted into the through hole 143 in a state where the 2 nd connecting portion 165 is folded back, and the tip of the 2 nd insertion portion 161 is brought into contact with the step 146 of the through hole 143.

Further, the rod-shaped 1 st insertion portion 151 of the 1 st contact 150 is inserted into the through hole 143 from the upper surface 141 side of the sheet member 140, the 1 st contact portion 152 is brought into contact with the upper surface 141, and the 1 st insertion portion 151 is inserted between the pair of 2 nd insertion portions 161 of the 2 nd contact 160, whereby the 1 st insertion portion 151 is sandwiched between the 2 nd insertion portions 161. Thereby forming the socket body 130.

As shown in fig. 43 (b), the test apparatus was used in the same manner as in embodiment 4 of the present invention. That is, the sheet member 140 of the socket body 130 is arranged at a predetermined position of the wiring board 2, and the IC chip 10 is pressed from above the socket body 130. Thus, the contact portion 52 of the 1 st contact 150 and the 2 nd contact portion 162 of the 2 nd contact 160 are pressed against the electrode 2a of the wiring substrate 2 and the solder ball 4 of the IC package 1 in a state where the projection portion 170 of the 1 st contact 150 and the 2 nd insertion portion 161 of the 2 nd contact 160 are pressed against each other.

The IC socket 110 according to embodiment 6 of the present invention can also provide the same operational advantages as the IC socket 110 according to embodiment 4 of the present invention described above.

In the IC socket 110 of the present embodiment, the 2 nd contact 160 has the pair of 2 nd insertion portions 161 extending along the through hole 143 so as to face each other, and the 1 st insertion portion 151 of the 1 st contact 150 is inserted between the 2 nd insertion portions 161 and sandwiched therebetween, so that the 1 st insertion portion 151 of the 1 st contact 150 and the 2 nd insertion portion 161 of the 2 nd contact 160 can be brought into stronger contact within the through hole 143. Therefore, the 1 st contact 150 and the 2 nd contact 160 can be connected more reliably.

Embodiments 4 to 6 can be modified as appropriate within the scope of the present invention.

For example, in the above embodiment, the protrusion 170 is provided in either the 1 st contact 150 or the 2 nd contact 160, but the protrusion 170 protruding in the direction intersecting the through hole 143 may be provided in each of the 1 st insertion portion 151 of the 1 st contact 150 and the 2 nd insertion portion 161 of the 2 nd contact 160.

In embodiments 4 and 6, the protrusion 170 is formed by providing a notch in the 2 nd insertion portion 161 of the 2 nd contact 160, and in embodiment 5, the protrusion 170 is formed in a minute block shape in the 1 st insertion portion 151 of the 1 st contact 150, but the shape and position of the protrusion 170 are not limited at all as long as the shape and position can be set appropriately as long as the 1 st contact 150 and the 2 nd contact 160 can be brought into contact with each other by the elastic force of the sheet member 140 in the through hole 143.

The shapes of the 1 st insertion portion 151 and the 1 st contact portion 152 of the 1 st contact 150 and the shapes of the 2 nd insertion portion 161 and the 2 nd contact portion 162 of the 2 nd contact 160 are not limited to those of embodiments 4 to 3, and may be formed in various shapes.

In addition, in the above embodiments 4 and 6, the protrusion 170 is provided in the 2 nd insertion portion 161 of the 2 nd contact 160 to be pressed against the 1 st contact 150, but the protrusion 170 may be provided in the 1 st contact 150 to be pressed against the 2 nd insertion portion 161 of the 2 nd contact 160, or the protrusion 170 may be provided in the positions different from each other in the longitudinal direction of the 1 st contact 150 and the 2 nd contact 160 to be pressed against the positions corresponding to the protrusions 170 of the 1 st contact 150 and the 2 nd contact 160, respectively.

Further, in embodiments 4 and 6 described above, the sheet member 140 is integrally formed of an elastic body throughout the entire portion from the upper surface 141 to the lower surface 142, but the sheet member 140 may be configured by laminating a plurality of sheet materials. For example, a sheet material in which a plurality of 1 st through holes 144 are provided to penetrate to a predetermined position and a sheet material in which a plurality of 2 nd through holes 145 are provided to penetrate to a predetermined position may be stacked to form the sheet member 140 so that the 1 st through holes 144 and the 2 nd through holes 145 communicate with each other in an axial direction in an adjacent manner to form the through holes 143.

In addition, in the case where a plurality of sheet materials are stacked to form the sheet member 140, if the layer in which the 1 st insertion portion 151 of the 1 st contact 150 and the 2 nd insertion portion 161 of the 2 nd contact 160 are arranged in a pressure-contact state, that is, the layer corresponding to the 2 nd through hole 145 is formed of an elastic body, the socket main body 130 can be configured even if the elasticity of the other layers is low.

[ embodiment 7 of the invention ]

Fig. 44 shows an IC socket according to embodiment 7 of the present invention, in which fig. 44 (a) is a plan view, fig. 44 (b) is a cross-sectional view, and fig. 44 (c) is a partially enlarged cross-sectional view.

The IC socket 710, which is the "socket for electrical components" of the present embodiment, is configured to be arranged on a wiring substrate, which is the "2 nd electrical component", in the same manner as embodiments 1 to 6 of the invention, to accommodate an IC package, which is the "1 st electrical component", on an upper surface thereof, and to electrically connect a solder ball, which is a "terminal" of the IC package, and an electrode of the wiring substrate, by means of the pin contact 733, which is provided in plurality. The IC socket 710 is used in a test apparatus for a conduction test such as a burn-in test of an IC package.

IC socket 710 includes frame member 720 disposed on the wiring board, and socket main body 730 disposed in the center of frame member 720 and fixed to frame member 720.

In embodiment 7, the IC socket 710 includes a sheet member 740 on which a plurality of pin contacts 733 are arranged, and a fixing plate 780 that fixes and supports an edge portion 747 of the sheet member 740, and the fixing plate 780 includes an outer portion 781 and an inner portion 782. Therefore, the frame member 720 is constituted by the outer side portion 781 of the fixing plate 780, and the socket main body 730 is constituted by the sheet member 740 and the inner side portion 782 of the fixing plate 780.

The pin contact 733 can be used as in embodiments 1 to 6. Each pin contact 733 has a 1 st contact 750 and a 2 nd contact 760, and a plurality of the pin contacts are arranged in a row in the sheet member 740 and arranged at predetermined positions, and the 1 st insertion portion 751 of the 1 st contact 750 and the 2 nd insertion portion 761 of the 2 nd contact 760 are pressed against each other by an elastic force of the sheet member 740.

The sheet member 740 is formed of an insulator having an elastic force, and is integrally formed with the fixing plate 780, as in embodiments 1 to 6. The sheet member 740 is made of a resin such as silicone rubber or fluororubber as an insulator having durability against an aging test by heating to 150 ℃.

The sheet member 740 is arranged corresponding to a portion of the socket main body 730 where the plurality of pin contacts 733 are arranged, and is formed in a substantially strip shape in a plan view. In the present embodiment, the substantially strip-shaped sheet member 740 is formed in a substantially frame shape in a plan view by being continuous in a curved shape.

The sheet member 740 is formed thicker than the fixing plate 780 and has a thickness capable of stably supporting the 1 st contact 750 and the 2 nd contact 760 of the pin contacts 733. Specifically, the sheet member 740 has a thickness capable of receiving the 1 st insertion portion 751 and the 2 nd insertion portion 761 of the pin contact 733.

At a predetermined position of a portion of the sheet member 740 where the plurality of pin contacts 733 are arranged, through holes 743 for arranging the pin contacts 733 are provided penetrating in the thickness direction with high positional accuracy. In the present embodiment, the strip-shaped sheet members 740 are arranged in a line over the entire range.

Although the 1 st contact 750 and the 2 nd contact 760 similar to those in embodiments 1 to 6 are disposed in each through hole 743, detailed illustration is omitted.

The fixing plate 780 is formed in a plate shape harder than the sheet member 740 and thinner than the sheet member 740. In the fixing plate 780 of the present embodiment, the outer portion 781 disposed on the outer side of the substantially frame-shaped sheet member 740 and the inner portion 782 disposed on the inner side of the sheet member 740 are provided separately and independently from each other.

The fixing plate 780 has a plan view shape corresponding to the shape of the IC socket 710, the outer portion 781 has a shape corresponding to the semiconductor substrate, and the inner portion 782 has a shape corresponding to the IC package.

The sheet member 740 is fixed to the fixing plate 780 by the edge portion 747, and both sides of the strip-shaped sheet member 740 are fixed to the fixing plate 780, preferably to the fixing plate 780 over the entire length, and particularly preferably to the fixing plate 780 over the entire circumference.

In the present embodiment, the outer edge portion 747 of the substantially frame-shaped sheet member 740 is fixed to the outer portion 781 of the fixing plate 780, the inner edge portion 747 of the sheet member 740 is fixed to the inner portion 782 of the fixing plate 780, and the outer portion 781 and the inner portion 782 of the fixing plate 780 are coupled to each other by the sheet member 740.

The method of fixing sheet member 740 to fixing plate 780 is not particularly limited, and fixing plate 780 may be provided with a plurality of fixing holes 783 penetrating in the thickness direction at a portion corresponding to edge portion 747 of sheet member 740, and sheet member 740 may be integrally formed into each fixing hole 783 with a resin material at the time of molding sheet member 740.

According to the IC socket 710 of embodiment 7 having the above-described configuration, since the edge portion 747 of the sheet member 740 is fixed to the fixing plate 780 which is harder than the sheet member 740, the edge portion 747 of the sheet member 740 having the elastic force can be firmly supported so as not to be displaced.

Therefore, the fixing plate 780 can suppress strain and deformation of the sheet member 740, and can ensure positional accuracy of the portion where the 1 st contact 750 and the 2 nd contact 760 are inserted into the sheet member 740.

In particular, when sheet member 740 shrinks due to hardening or curing during molding, positional accuracy of edge portion 747 of sheet member 740 can be ensured by preventing strain or deformation of sheet member 740 fixed to fixing plate 780. As a result, the positional accuracy of the plurality of through holes 743 provided in the sheet member 740 can be ensured, and the 1 st contact 750 and the 2 nd contact 760 can be arranged with high accuracy.

Further, according to the IC socket 710 of embodiment 7, the sheet member 740 is formed in a band shape having a thickness capable of accommodating the 1 st insertion portion and the 2 nd insertion portion, and both sides of the sheet member 740 are fixed to the fixing plate 780, so that both sides of the band-shaped sheet member 740 can be firmly supported so as not to be displaced, and when the sheet member 740 contracts, tension is applied equally from both sides.

Therefore, the sheet member 740 can be prevented from being deformed to one side, and the positional accuracy of the 1 st contact 750 and the 2 nd contact 760 stably arranged on the sheet member 740 can be improved.

Further, according to the IC socket 710 of embodiment 7, the strip-shaped sheet member 740 in which the plurality of 1 st contacts 750 and 2 nd contacts 760 are arranged substantially over the entire range is formed substantially in a frame shape, and the fixing plate 780 has the outer portion 781 arranged outside the sheet member 740 and the inner portion 782 arranged inside.

Therefore, the inner edge 747 and the outer edge 747 of the substantially frame-shaped sheet member 740 can be firmly supported by the outer portion 781 and the inner portion 782 of the fixing plate 780 so as not to be displaced, and tension can be applied to the sheet member 740 from both the inner side and the outer side in a balanced manner when the sheet member 740 contracts. As a result, the substantially frame-shaped sheet member 740 can be prevented from contracting and straining to one of the outside and the inside, and the positional accuracy of the arrangement portions of the 1 st contact 750 and the 2 nd contact 760 in the substantially frame-shaped sheet member 740 can be improved.

Further, according to the IC socket 710 of embodiment 7, the outer portion 781 and the inner portion 782 of the fixing plate 780 are separated independently from each other, and therefore, the tension of the sheet member 740 disposed between the outer portion 781 and the inner portion 782 can be uniformly distributed over the substantially frame shape. Therefore, the tension of the sheet member 740 acting on the plurality of 1 st contacts 750 and 2 nd contacts 760 can be easily equalized, and the positional accuracy can be ensured.

Further, according to the IC socket 710 of embodiment 7, since the sheet member 740 has the inner opening 749 and the fixing plate 780 is disposed in the inner opening 749, a large amount of the elastic material constituting the sheet member 740 does not exist inside the sheet member 740, and tension due to contraction or the like at the time of molding the elastic material does not act. Even if the sheet member 740 is provided with the inner opening 749, the inner edge portion 747 can be supported firmly so as not to be displaced by the fixing plate 780. Therefore, the sheet member 740 can be reliably prevented from contracting inward and becoming strained, and the positional accuracy of the arrangement portions of the 1 st contact 750 and the 2 nd contact 760 in the sheet member 740 can be ensured.

In embodiment 7, various modifications can be made.

For example, in embodiment 7, although an example in which 1 inner portion 782 of the fixing plate 780 is disposed has been described, as shown in fig. 45 (a) and (b), a plurality of inner portions 782 may be disposed apart from each other, the sheet member 740 may be disposed between the plurality of inner portions 782, and the 1 st contact 750 and the 2 nd contact 760 may be disposed between the plurality of inner portions 782.

This ensures the positional accuracy of the 1 st contact 750 and the 2 nd contact 760 arranged between the inner portions 782.

In embodiment 7, an example in which the outer portion 781 and the inner portion 782 are used as the fixing plate 780 has been described, but as shown in fig. 46 (a) and (b), the inner portion 782 of the fixing plate 780 may not be provided, and the inner opening 749 penetrating the sheet member 740 in the vertical direction may be provided.

In such a modification, since the edge portion 747 on the outer peripheral side of the sheet member 740 on which the plurality of pin contacts 733 are disposed is fixed to the fixing plate 780, the outer peripheral side of the sheet member 740 having elastic force can be supported so as not to be displaced.

Therefore, strain and deformation on the outer peripheral side of the sheet member 740 can be suppressed, and excessive deterioration in the positional accuracy of the arrangement portions of the 1 st contact 750 and the 2 nd contact 760 of the sheet member 740 can be prevented.

[ embodiment 8 of the invention ]

Fig. 47 shows an IC socket 710 according to embodiment 8 of the present invention, where fig. 47 (a) is a plan view and fig. 47 (b) is a sectional view.

In embodiment 8, the fixing plate 780 has a different shape in plan view, and accordingly, the sheet member 740 fixed to the fixing plate 780 has a different shape in plan view from the IC socket of embodiment 7.

In the fixing plate 780 of the present embodiment, the outer portion 781 and the inner portion 782 are coupled to each other by a coupling portion 784. The outer portion 781 is formed in a substantially rectangular frame shape, and the inner portion 782 is formed in a substantially rectangular plate shape, and the two portions are integrally coupled at symmetrical positions by a pair of coupling portions 784.

Therefore, the sheet member 740 is formed so as to correspond to an opening formed in the fixed plate 780 in a shape of substantially japanese kana コ in a plan view, and a plurality of pin contacts are arranged in each substantially japanese kana コ -shaped sheet member 740.

The other structure is the same as embodiment 7.

The IC socket 710 according to embodiment 8 can also provide the same operational advantages as those of embodiment 7.

Further, in the IC socket 710 according to embodiment 8, the outer portion 781 and the inner portion 782 of the fixing plate 780 are coupled to each other by the coupling portion 784, and therefore the relative positions of the outer portion 781 and the inner portion 782 can be reliably held by the coupling portion 784. Therefore, both sides of the inner edge 747 and the outer edge 747 of the substantially frame-shaped sheet member 740 can be reliably fixed at predetermined positions, and the positional accuracy of the arrangement portions of the 1 st contact 750 and the 2 nd contact 760 in the substantially frame-shaped sheet member 740 can be further improved.

[ embodiment 9 of the invention ]

Fig. 48 shows an IC socket 810 according to embodiment 9 of the present invention, where fig. 48 (a) is a plan view and fig. 48 (b) is a sectional view.

In the IC socket 810 according to embodiment 9, a thick and wide sheet member 840 is provided in a substantially frame shape around the outer periphery in a plan view, and an inner opening 849 is provided inside the sheet member 840.

The inner portion 882 of the fixing plate 880 is disposed in the inner opening 849, and the edge of the inner opening 849 of the sheet member 840 is fixed to the outer periphery of the inner portion 882 of the fixing plate 880.

In the sheet member 840, a plurality of through holes 843 are provided along the inner opening 849 near the inner opening 849, and a pin contact 733 is disposed in each through hole 843.

The sheet member 840 constitutes the frame member 820 of the IC socket 810 as a whole on the outer peripheral side of the portion where the pin contact 733 is arranged, and the socket main body 830 of the IC socket 810 is constituted by the portion of the sheet member 840 where the pin contact 733 is arranged and the inner portion 882 of the fixing plate 880 in the inner opening 849.

In the IC socket 810 according to embodiment 9, since the inner opening 849 of the sheet member 840 near the portion where the plurality of pin contacts 733 are arranged is fixed to the fixing plate 880 which is harder than the sheet member 840, the inner peripheral edge 847 of the sheet member 840 having elastic force can be firmly supported so as not to be displaced.

Therefore, the fixing plate 880 can suppress strain and deformation of the sheet member 840, and can prevent deterioration in the positional accuracy of the 1 st contact 750 and the 2 nd contact 760 in the vicinity of the inner opening 849 of the sheet member 840.

In addition, in embodiments 7 to 9, the modification can be made as appropriate within the scope of the present invention.

For example, in the above-described embodiment, the sheet member is formed in a substantially frame shape, but the shape of the sheet member 740 is not particularly limited, and may be, for example, a band-like shape extending substantially straight, or a plurality of band-like sheet members 740 and 840 extending substantially straight may be arranged. And may also be a curved shape or a polygonal shape.

Description of the reference numerals

1. An IC package (1 st electrical part); 2. a wiring substrate (2 nd electrical component); 4. solder balls (terminals); 10. 110, 210, 310, 410, 510, 610, 710, 810, IC socket (socket for electric parts); 30. 130, 230, 330, 730, 830, a socket body; 40. 140, 240, 340, 440, 540, 640, 740, 840, a sheet member; 41. 141, 241, 341, 441, 541, 641, an upper surface (1 st surface); 42. 142, 242, 342, 442, 542, 642, lower surface (side 2); 50. 150, 250, 350, 450, 550, 650, 750, contact No. 1; 51. 151, 251, 351, 451, 551, 651, 751, the 1 st insertion part; 52. 152, 252, 352, 452, 552, 652, 752, 1 st contact; 60. 160, 260, 360, 460, 560, 660, 760, contact No. 2; 61. 161, 261, 361, 461, 561, 661, 761, 2 nd insertion part; 62. 162, 262, 362, 462, 562, 662, 762, 2 nd contact; 140. 740, 840, sheet members; 143. 743, 843, a through hole; 170. a protrusion; 340a, 540a, 1 st piece member; 340b, 540b, the 2 nd sheet member; 780. 880, fixing plates; 781. an outer side portion; 782. 882, inner part.

Claims (14)

1. A socket for electrical components, which is arranged between a 1 st electrical component and a 2 nd electrical component facing each other, and electrically connects the 1 st electrical component and the 2 nd electrical component,

the socket for electric parts is characterized in that,

the socket for electric parts comprises:

a sheet member composed of an insulator having an elastic force;

a 1 st contact having a 1 st contact portion arranged on a 1 st surface side of the 1 st electrical component side of the sheet member and contacting the 1 st electrical component, and a 1 st insertion portion continuous from the 1 st contact portion and inserted into the sheet member; and

a 2 nd contact having a 2 nd contact portion that is in contact with the 2 nd electrical component on a 2 nd surface side of the 2 nd electrical component side of the sheet member and a 2 nd insertion portion that is continuous from the 2 nd contact portion and is inserted into the sheet member,

the socket for electric parts is configured such that the sheet member is deformed by being disposed in a state where the 1 st insertion portion and the 2 nd insertion portion are in contact with each other and being pressed in a direction in which the 1 st contact portion and the 2 nd contact portion are brought close to each other, and the 1 st insertion portion and the 2 nd insertion portion slide in an electrically connected state.

2. The socket for electric parts according to claim 1,

in the electrical component socket, the 1 st contact has the 1 st contact portion that contacts the 1 st surface, and the sheet member is pressed by the 1 st contact portion and elastically deformed by the 1 st contact portion when the 1 st contact portion is pressed by the 1 st electrical component.

3. The socket for electric parts according to claim 1 or 2,

the socket for electric parts is constituted so that,

the 1 st insertion portion is formed in a substantially rod shape,

the 2 nd insertion portion is formed in a substantially cylindrical shape,

the first insertion part 1 is inserted into the second insertion part 2 and slides in contact with the second insertion part.

4. The socket for electric parts according to claim 1 or 2,

the socket for electric parts is constituted so that,

the 1 st insertion portion and the 2 nd insertion portion are formed in a substantially rod shape,

sliding in a state where side surfaces of the 1 st insertion part and the 2 nd insertion part contact each other.

5. The socket for electric parts according to any one of claims 1 to 4,

the sheet member has two members of a 1 st sheet member and a 2 nd sheet member,

the 1 st piece member and the 2 nd piece member are provided with the 1 st contact and the 2 nd contact.

6. The socket for electric parts according to any one of claims 1 to 5,

the sheet member has a through hole that penetrates between a 1 st surface on the 1 st electrical component side and a 2 nd surface on the 2 nd electrical component side, and into which the 1 st insertion portion and the 2 nd insertion portion are inserted,

at least one of the 1 st insertion portion and the 2 nd insertion portion is provided with a protruding portion protruding in a direction intersecting with the through hole, and the protruding portion is crimped to the other contact by an elastic force of the sheet member acting in the direction intersecting with the through hole.

7. The socket for electric parts according to claim 6,

the 2 nd contact has a 2 nd abutting portion abutting against a step provided in the through hole.

8. The socket for electric parts according to claim 6 or 7,

the cross-sectional shape of the 2 nd insertion portion intersecting the through hole is formed in a circular-arc sheet shape,

the 1 st insertion portion is formed in a substantially rod shape and is inserted into the 2 nd insertion portion in a circular arc sheet shape.

9. The socket for electric parts according to any one of claims 6 to 8,

the 2 nd contact includes a pair of the 2 nd insertion portions extending along the through hole in a manner opposed to each other and a 2 nd coupling portion coupling the 2 nd insertion portions to each other, and the 1 st insertion portion of the 1 st contact is inserted between the 2 nd insertion portions and is sandwiched therebetween.

10. The socket for electric parts according to any one of claims 1 to 9,

the edge of the sheet member is fixed to a fixing plate harder than the sheet member.

11. The socket for electric parts according to claim 10,

the sheet member has a thickness capable of receiving the 1 st insertion portion and the 2 nd insertion portion and is formed in a band shape, and both sides of the sheet member are fixed to the fixing plate.

12. The socket for electric parts according to claim 10 or 11,

the strip-shaped sheet member having the 1 st contact and the 2 nd contact arranged therein is formed in a substantially frame shape, and the fixing plate has an outer portion arranged on an outer side of the sheet member and an inner portion arranged on an inner side of the sheet member.

13. The socket for electric parts according to claim 12,

the outer side portion and the inner side portion of the fixing plate are coupled to each other by a coupling portion or are independently separated from each other.

14. The socket for electric parts according to claim 10,

the sheet member has an inner opening, and the fixing plate is disposed at least at the edge of the inner opening.

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