CN111246685A - High-precision processing method for PCB copper-sinking hole - Google Patents
High-precision processing method for PCB copper-sinking hole Download PDFInfo
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- CN111246685A CN111246685A CN202010015035.8A CN202010015035A CN111246685A CN 111246685 A CN111246685 A CN 111246685A CN 202010015035 A CN202010015035 A CN 202010015035A CN 111246685 A CN111246685 A CN 111246685A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
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Abstract
The application discloses a high-precision processing method of a PCB copper-sinking hole, which comprises the following steps: s1, clamping the limiting plate set by a manipulator and assembling and clamping the limiting plate set on a computer gong equipment workbench; s2, clamping the processing reference plate by a manipulator and putting the processing reference plate down on the limiting plate group; s3, scanning the processing reference plate by adopting a visual sensor arranged on a processing main shaft on computer gong equipment, and carrying out position adjustment and clamping operation on the processing reference plate by matching a position adjusting mechanism and a clamping fixture; s4, recognizing the routing position on the processing reference plate through a visual sensor, and routing through a routing knife; s5, after the milling of the milling hole is finished, detecting and judging the processing size of the milling hole by using a detection probe arranged on computer milling equipment; s6, when the machining quality of the routing holes is judged to be qualified, the machining reference plate is unloaded, then the PCB to be machined is clamped and is placed on the limiting plate group, and then S3 and S4 are repeated; and S7, after the routing on the PCB is finished, the PCB can be detached and placed to a designated place.
Description
[ technical field ] A method for producing a semiconductor device
The application relates to the technical field of PCBs, in particular to a high-precision machining method for a PCB copper deposition hole.
[ background of the invention ]
PCBs, also known as printed circuit boards, are providers of electrical connections for electronic components, and are classified into single-sided boards, double-sided boards, four-layered boards, six-layered boards, and other multi-layered circuit boards according to the number of layers of the circuit boards, and they can be further subdivided into whole-board PCBs, jointed PCBs, and the like.
However, in the existing practical production process, the copper deposition holes processed on the PCB are often prone to unqualified processing quality, such as: the size exceeds the tolerance range, the shape is abnormal, and the like, therefore, the technical personnel in the field need to develop a high-precision processing method of the PCB copper-sinking hole.
[ summary of the invention ]
The application aims to solve the technical problem of the prior art and provides a high-precision processing method for a PCB copper sinking hole.
In order to solve the technical problem, the method is realized by the following technical scheme:
the high-precision processing method of the PCB copper-sinking hole comprises the following operation steps:
s1, clamping the limit plate group by using a manipulator, and assembling and clamping the clamped limit plate group on a workbench of a computer gong device;
s2, clamping the processing reference plate by the manipulator and putting the clamped processing reference plate down on the limiting plate group;
s3, scanning the processing reference plate by adopting a visual sensor arranged on a processing main shaft on computer gong equipment, and carrying out position adjustment and clamping operation on the processing reference plate by matching a position adjusting mechanism and a clamping fixture;
s4, recognizing the routing position of the processing reference plate by adopting a visual sensor arranged on a processing main shaft on computer routing equipment, and routing the processing reference plate by a routing cutter clamped on the processing main shaft;
s5, after the milling of the milling hole on the processing reference plate is finished, detecting by using a detection probe arranged on a computer milling device to judge the processing size of the milling hole;
s6, when the machining quality of the routing holes is judged to be qualified, the machining reference plate is unloaded through the manipulator, then the to-be-machined PCB is clamped through the manipulator, the clamped to-be-machined PCB is placed on the limiting plate group, and then S3 and S4 are repeated;
and S7, after the routing holes on the processed PCB are processed, the PCB can be unloaded from the computer routing equipment through the manipulator, and the unloaded processed PCB is placed to a designated place.
According to the high-precision processing method for the copper sinking hole of the PCB, in S4, the routing knife includes a first routing knife and a second routing knife, and the diameter of the second routing knife is larger than that of the first routing knife;
then in S4, the step of routing the machining reference plate by the routing tool clamped on the machining spindle includes:
s4-1, driving the first gong cutter to move downwards through the processing main shaft, wherein the cutting rotating speed is 1000-2000 r/min, and the cutting feed amount is 0.3-0.5 mm;
and S4-2, driving the second gong cutter to move downwards through the processing main shaft, wherein the cutting speed is 2000-4000 r/min, and the cutting feed amount is 0.01-0.1 mm.
In the method for processing the copper countersunk holes of the PCB in the above manner, before operation S4-1 and before operation S4-2, the cutting lubricant is sprayed on the first gong cutter surface and the second gong cutter surface, respectively.
In the method for processing a PCB countersunk hole with high precision as described above, in S6, when the processing size of the routing hole is determined to be out of the tolerance range of the size but the processing shape is matched, it is detected whether the outer diameter size of the routing cutter is acceptable, and if the outer diameter size of the routing cutter is not acceptable, the routing cutter with the acceptable outer diameter size is replaced.
In the method for processing the PCB countersunk hole with high precision as described above, in S6, when the processing size of the routing hole is determined to be out of the dimensional tolerance range and the processing shape is abnormal, the routing hole needs to be directly replaced with a qualified routing knife.
In S3, if the vision sensor scans that the processing reference plate is accurately located on the position limiting plate group, the processing reference plate may be clamped on the position limiting plate group by the clamping fixture; if the vision sensor scans and learns that the machining reference plate exceeds the upper limit position of the limit plate group after being lowered, the position of the machining reference plate can be adjusted through the adjusting mechanism, so that the machining reference plate is located at the accurate position on the limit plate group.
According to the high-precision processing method of the PCB copper-sinking hole, the vision sensor is a CCD sensor.
Compared with the prior art, the application has the following advantages:
this application PCB heavy copper hole's high-precision processing method is through right the trial processing of processing reference plate distinguishes computer gong equipment with position adjustment mechanism reaches the cooperation processing condition of pressing from both sides tight anchor clamps, then works as processing goes out on the reference plate processing when the gong hole is qualified, then can continue to process and treat processing PCB to not only can improve greatly and treat processing PCB is last the processing quality in gong hole, and still can avoid because computer gong equipment or position adjustment mechanism or it has the machining error and influences follow-up processing that will process to press from both sides tight anchor clamps the processing quality of treating processing PCB.
[ description of the drawings ]
FIG. 1 is a schematic step diagram of a high-precision processing method for a copper-sinking hole of a PCB according to the present application.
[ detailed description ] embodiments
The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments.
As shown in fig. 1, the high-precision processing method of the PCB copper-sinking hole is characterized by comprising the following operation steps:
s1, clamping the limit plate group by using a manipulator, and assembling and clamping the clamped limit plate group on a workbench of a computer gong device;
s2, clamping the processing reference plate by the manipulator and putting the clamped processing reference plate down on the limiting plate group;
s3, scanning the processing reference plate by adopting a visual sensor arranged on a processing main shaft on computer gong equipment, and carrying out position adjustment and clamping operation on the processing reference plate by matching a position adjusting mechanism and a clamping fixture;
s4, recognizing the routing position of the processing reference plate by adopting a visual sensor arranged on a processing main shaft on computer routing equipment, and routing the processing reference plate by a routing cutter clamped on the processing main shaft;
s5, after the milling of the milling hole on the processing reference plate is finished, detecting by using a detection probe arranged on a computer milling device to judge the processing size of the milling hole;
s6, when the machining quality of the routing holes is judged to be qualified, the machining reference plate is unloaded through the manipulator, then the to-be-machined PCB is clamped through the manipulator, the clamped to-be-machined PCB is placed on the limiting plate group, and then S3 and S4 are repeated;
and S7, after the routing holes on the processed PCB are processed, the PCB can be unloaded from the computer routing equipment through the manipulator, and the unloaded processed PCB is placed to a designated place.
This application PCB heavy copper hole's high-precision processing method is through right the trial processing of processing reference plate distinguishes computer gong equipment with position adjustment mechanism reaches the cooperation processing condition of pressing from both sides tight anchor clamps, then works as processing goes out on the reference plate processing when the gong hole is qualified, then can continue to process and treat processing PCB to not only can improve greatly and treat processing PCB is last the processing quality in gong hole, and still can avoid because computer gong equipment or position adjustment mechanism or it has the machining error and influences follow-up processing that will process to press from both sides tight anchor clamps the processing quality of treating processing PCB.
Further, in S3, if the vision sensor scans that the machining reference plate is accurately located on the position limiting plate group, the machining reference plate may be clamped on the position limiting plate group by the clamping fixture; if the vision sensor scans and learns that the machining reference plate exceeds the upper limit position of the limit plate group after being lowered, the position of the machining reference plate can be adjusted through the adjusting mechanism, so that the machining reference plate is located at the accurate position on the limit plate group. Its advantage lies in realizing the position adjustment before the processing gong hole, then can reach further improvement the accuracy of gong hole processing position still does benefit to the realization simultaneously the gong sword carries out the purpose of fixed point processing.
Further, in S4, the gong knife includes a first gong knife and a second gong knife, and the diameter of the second gong knife is greater than that of the first gong knife;
then in S4, the step of routing the machining reference plate by the routing tool clamped on the machining spindle includes:
s4-1, driving the first gong cutter to move downwards through the processing main shaft, wherein the cutting rotating speed is 1000-2000 r/min, and the cutting feed amount is 0.3-0.5 mm;
and S4-2, driving the second gong cutter to move downwards through the processing main shaft, wherein the cutting speed is 2000-4000 r/min, and the cutting feed amount is 0.01-0.1 mm. The processing quality of the processed routing holes can be avoided being determined by primary processing, and the routing holes processed by secondary processing have outstanding processing effects on processing precision and processing shape.
Further, before operation S4-1 and before operation S4-2, the first gong-cutter surface and the second gong-cutter surface are sprayed with cutting lubricant, respectively. The milling cutter has the advantages that the first milling cutter and the second milling cutter have good cutting effect, and the aim of smooth cutting can be fulfilled.
Further, in S6, when the machining size of the routing hole is determined to be out of the tolerance range and the machining shape is matched, it is detected whether the routing cutter outer diameter size is acceptable, and if the routing cutter outer diameter size is not acceptable, the routing cutter having the acceptable outer diameter size is replaced. The method has the advantage that the machined routing holes can be further guaranteed to have excellent machining quality.
Further, in S6, when the machined size of the routing hole is determined to be out of the dimensional tolerance range and the machined shape is abnormal, the routing hole needs to be directly replaced with a qualified routing knife. The method has the advantage that the machined routing holes can be further guaranteed to have excellent machining quality.
Furthermore, the vision sensor is preferably a CCD sensor, and the vision sensor has the advantages that the CCD sensor has high sensitivity and high resolution, and is favorable for high-precision snapshot of the concrete positions of the gong holes on the PCB to be processed.
As described above, the embodiments of the present application have been described in detail, but the present application is not limited to the above embodiments. Even if various changes are made in the present application, the protection scope of the present application is still included.
Claims (7)
- The high-precision processing method of the PCB copper-sinking hole is characterized by comprising the following operation steps:s1, clamping the limit plate group by using a manipulator, and assembling and clamping the clamped limit plate group on a workbench of a computer gong device;s2, clamping the processing reference plate by the manipulator and putting the clamped processing reference plate down on the limiting plate group;s3, scanning the processing reference plate by adopting a visual sensor arranged on a processing main shaft on computer gong equipment, and carrying out position adjustment and clamping operation on the processing reference plate by matching a position adjusting mechanism and a clamping fixture;s4, recognizing the routing position of the processing reference plate by adopting a visual sensor arranged on a processing main shaft on computer routing equipment, and routing the processing reference plate by a routing cutter clamped on the processing main shaft;s5, after the milling of the milling hole on the processing reference plate is finished, detecting by using a detection probe arranged on a computer milling device to judge the processing size of the milling hole;s6, when the machining quality of the routing holes is judged to be qualified, the machining reference plate is unloaded through the manipulator, then the to-be-machined PCB is clamped through the manipulator, the clamped to-be-machined PCB is placed on the limiting plate group, and then S3 and S4 are repeated;and S7, after the routing holes on the processed PCB are processed, the PCB can be unloaded from the computer routing equipment through the manipulator, and the unloaded processed PCB is placed to a designated place.
- 2. The high-precision machining method for the PCB copper sinking hole as claimed in claim 1, wherein: in S4, the gong knife includes a first gong knife and a second gong knife, and the diameter of the second gong knife is larger than that of the first gong knife;then in S4, the step of routing the machining reference plate by the routing tool clamped on the machining spindle includes:s4-1, driving the first gong cutter to move downwards through the processing main shaft, wherein the cutting rotating speed is 1000-2000 r/min, and the cutting feed amount is 0.3-0.5 mm;and S4-2, driving the second gong cutter to move downwards through the processing main shaft, wherein the cutting speed is 2000-4000 r/min, and the cutting feed amount is 0.01-0.1 mm.
- 3. The high-precision machining method for the PCB copper sinking hole as claimed in claim 2, wherein: before operation S4-1 and before operation S4-2, the first gong-cutter surface and the second gong-cutter surface are sprayed with cutting lubricant, respectively.
- 4. The high-precision machining method for the PCB copper sinking hole as claimed in claim 1, wherein: in S6, when the machining size of the routing hole is determined to be out of tolerance but the machining shape is matched, it is detected whether the routing cutter outer diameter size is qualified, and if the routing cutter outer diameter size is not qualified, the routing cutter with the qualified outer diameter size is replaced.
- 5. The high-precision machining method for the PCB copper sinking hole as claimed in claim 4, wherein the method comprises the following steps: in S6, when the machined size of the routing hole is determined to be out of the dimensional tolerance range and the machined shape is abnormal, the routing hole needs to be directly replaced with a qualified routing knife.
- 6. The high-precision machining method for the PCB copper sinking hole as claimed in claim 1, wherein: in S3, if the vision sensor scans that the machining reference plate is accurately located on the limiting plate group, the machining reference plate may be clamped on the limiting plate group by the clamping fixture; if the vision sensor scans and learns that the machining reference plate exceeds the upper limit position of the limit plate group after being lowered, the position of the machining reference plate can be adjusted through the adjusting mechanism, so that the machining reference plate is located at the accurate position on the limit plate group.
- 7. The high-precision machining method for the PCB copper sinking hole as claimed in claim 1, wherein: the vision sensor is a CCD sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010015035.8A CN111246685A (en) | 2020-01-07 | 2020-01-07 | High-precision processing method for PCB copper-sinking hole |
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| CN202010015035.8A CN111246685A (en) | 2020-01-07 | 2020-01-07 | High-precision processing method for PCB copper-sinking hole |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528111A (en) * | 2011-09-23 | 2012-07-04 | 深圳市迅捷兴电路技术有限公司 | Process method for mechanical blind hole deep drilling control |
| CN106332456A (en) * | 2016-08-31 | 2017-01-11 | 奥士康精密电路（惠州）有限公司 | Method for improving groove-making burrs before copper plating |
| CN107072049A (en) * | 2017-03-28 | 2017-08-18 | 江门市高智电子科技有限公司 | Gong groove technique for BT plates |
| CN108174516A (en) * | 2017-12-26 | 2018-06-15 | 大连崇达电路有限公司 | A kind of processing method of PCB circuit board pore-forming positioning plate |
-
2020
- 2020-01-07 CN CN202010015035.8A patent/CN111246685A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528111A (en) * | 2011-09-23 | 2012-07-04 | 深圳市迅捷兴电路技术有限公司 | Process method for mechanical blind hole deep drilling control |
| CN106332456A (en) * | 2016-08-31 | 2017-01-11 | 奥士康精密电路（惠州）有限公司 | Method for improving groove-making burrs before copper plating |
| CN107072049A (en) * | 2017-03-28 | 2017-08-18 | 江门市高智电子科技有限公司 | Gong groove technique for BT plates |
| CN108174516A (en) * | 2017-12-26 | 2018-06-15 | 大连崇达电路有限公司 | A kind of processing method of PCB circuit board pore-forming positioning plate |
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