CN111246655A - Point contact type heat insulation PCB - Google Patents
Point contact type heat insulation PCB Download PDFInfo
- Publication number
- CN111246655A CN111246655A CN202010014463.9A CN202010014463A CN111246655A CN 111246655 A CN111246655 A CN 111246655A CN 202010014463 A CN202010014463 A CN 202010014463A CN 111246655 A CN111246655 A CN 111246655A
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- China
- Prior art keywords
- pcb
- pcb board
- point
- bellied
- board body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a PCB board technical field especially relates to point-contact thermal-insulated PCB board, including the PCB board body, evenly be equipped with a plurality of downward bellied projections around the PCB board body, the decurrent cross sectional area of projection reduces gradually, the middle part of the PCB board body is equipped with downward bellied mount pad, the bellied height of projection is higher than the bellied height of mount pad, the mount pad sets up the mounting through-hole that link up from top to bottom. According to the point-contact heat-insulation PCB, due to the height difference between the convex column and the mounting top seat, the middle part of the PCB is slightly concave when the PCB is locked, and the pre-tightening effect is achieved under the elastic action of the PCB; in addition, the area of the downward section of the convex column is gradually reduced, so that the contact area of the heat conducting surface is greatly reduced on the premise of ensuring the supporting strength, the heat conducting speed is reduced, and the heat insulation effect is enhanced.
Description
[ technical field ] A method for producing a semiconductor device
The application relates to the technical field of PCB boards, in particular to a point-contact type heat-insulation PCB board.
[ background of the invention ]
If the PCB works for a long time in the environment with higher temperature, not only the work efficiency of the electric element can not be guaranteed, the service life of the circuit and the electric element can be greatly buckled, especially the PCB on household appliances such as a disinfection cabinet, an oven and a range hood, because a heat source with large heat productivity exists during working, a certain isolation measure needs to be taken, the current measure is to isolate the PCB from the installation part of the household appliance by adding a metal plate heat insulation plate and using a plurality of plastic binding posts, the installation holes on the PCB and the installation holes on the installation part of the household appliance are respectively connected with the two ends of the plastic binding posts during assembly, the operation is complex and the heat insulation effect is not good.
[ summary of the invention ]
The purpose of the application is to provide a point-contact type heat-insulation PCB, and the point-contact type heat-insulation PCB provided by the embodiment of the application has the advantages that due to the height difference between the convex column and the mounting top seat, the middle part of the PCB is slightly concave when the PCB is locked, and the PCB plays a pre-tightening effect under the elastic action of the PCB; in addition, the area of the downward section of the convex column is gradually reduced, so that the contact area of the heat conducting surface is greatly reduced on the premise of ensuring the supporting strength, the heat conducting speed is reduced, and the heat insulation effect is enhanced.
The application is realized by the following technical scheme:
point-contact thermal-insulated PCB board, including the PCB board body, evenly be equipped with a plurality of downward bellied projections around the PCB board body, the decurrent cross sectional area of projection reduces gradually, the middle part of PCB board body is equipped with downward bellied installation footstock, the bellied height of projection is higher than the bellied height of installation footstock, the installation through-hole that link up about the installation footstock was seted up.
According to the point contact type heat insulation PCB, the convex column is 1-3 mm higher than the convex height of the mounting top seat.
According to the point contact type heat insulation PCB, the lower end of the convex column is in an inverted cone shape.
The point contact type heat insulation PCB is characterized in that the PCB body is rectangular, and four convex columns are arranged at four corners of the PCB body respectively.
According to the point contact type heat insulation PCB, the mounting top seat is cylindrical.
According to the point contact type heat insulation PCB, the lower end of the mounting top seat is chamfered, so that the annular cross-sectional area of the mounting top seat is gradually reduced downwards.
According to the point contact type heat insulation PCB, the convex column and the mounting top seat are made of thermosetting plastics.
Compared with the prior art, the method has the following advantages:
according to the point-contact heat-insulation PCB provided by the embodiment of the application, due to the height difference between the convex column and the mounting top seat, the middle part of the PCB is slightly concave when the PCB is locked, and the pre-tightening effect is achieved under the elastic action of the PCB; in addition, the area of the downward section of the convex column is gradually reduced, so that the contact area of the heat conducting surface is greatly reduced on the premise of ensuring the supporting strength, the heat conducting speed is reduced, and the heat insulation effect is enhanced.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 and 2 are schematic structural diagrams of an embodiment of the present application at two different angles.
[ detailed description ] embodiments
In order to make the technical problems, technical solutions and advantageous effects solved by the present application more clear and obvious, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
As shown in fig. 1 and fig. 2, this application embodiment provides a point-contact thermal-insulated PCB, including PCB body 1, evenly be equipped with a plurality of downward bellied projections 2 around PCB body 1, the decurrent cross sectional area of projection 2 reduces gradually, the middle part of PCB body 1 is equipped with downward bellied mount pad 3, 2 bellied highly are higher than the bellied height of mount pad 3, mount pad 3 sets up the mounting through-hole 31 that link up from top to bottom. Specifically, the convex column 2 and the mounting top seat 3 are made of thermosetting plastics.
When the PCB is installed, the lower surface of the PCB faces the installation surface, so that the convex column 2 is propped against the installation surface downwards, then the fastener penetrates through the installation through hole 31 to fix the PCB on the installation hole of the installation surface, wherein the convex height of the convex column 2 is higher than that of the installation top seat 3, the middle part of the PCB is slightly concave when the PCB is locked, and the pre-tightening effect is achieved under the elastic action of the PCB. In addition, the downward cross-sectional area of the convex column 2 is gradually reduced, the contact area of the heat conducting surface is greatly reduced on the premise of ensuring the supporting strength, the heat conducting speed is reduced, and the heat insulation effect is enhanced.
Correspondingly, the convex column 2 is 1-3 mm higher than the convex height of the mounting top seat 3. So that the PCB provides proper pre-tightening force when being fixed.
For convenience of processing, the lower end of the convex column 2 is in an inverted cone shape. The PCB body 1 is rectangular plate-shaped, and the four convex columns 2 are arranged at four corners of the PCB body 1 respectively. The mounting footstock 3 is cylindrical.
Further, the lower end of the mounting top seat 3 is chamfered so that the annular cross-sectional area of the mounting top seat 3 becomes smaller downward. The heat conduction speed can be further reduced, and the heat insulation effect is enhanced.
In summary, the present application has, but is not limited to, the following beneficial effects:
according to the point-contact heat-insulation PCB provided by the embodiment of the application, due to the height difference between the convex column 2 and the mounting top seat 3, the middle part of the PCB is slightly concave when the PCB is locked, and the pre-tightening effect is achieved under the elastic action of the PCB; in addition, the downward cross-sectional area of the convex column 2 is gradually reduced, so that the contact area of the heat conducting surface is greatly reduced on the premise of ensuring the supporting strength, the heat conducting speed is reduced, and the heat insulation effect is enhanced.
It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present application. Furthermore, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing is illustrative of one or more embodiments provided in connection with the detailed description and is not intended to limit the disclosure to the particular forms disclosed. Similar or identical methods, structures, etc. as used herein, or several technical inferences or substitutions made on the concept of the present application should be considered as the scope of the present application.
Claims (7)
1. Point-contact thermal-insulated PCB board, including PCB board body (1), its characterized in that, evenly be equipped with a plurality of bellied projections (2) downwards around PCB board body (1), the decurrent cross sectional area of projection (2) reduces gradually, the middle part of PCB board body (1) is equipped with bellied installation footstock (3) downwards, the bellied height in projection (2) is higher than the bellied height in installation footstock (3), the installation through-hole (31) that link up about seting up is seted up in installation footstock (3).
2. The point-contact type heat insulation PCB board of claim 1, wherein the convex column (2) is 1-3 mm higher than the height of the convex of the mounting top seat (3).
3. The point-contact type thermal insulation PCB board as claimed in claim 1, wherein the lower end of the convex column (2) is in an inverted cone shape.
4. The point-contact type heat insulation PCB board of claim 1, wherein the PCB board body (1) is rectangular plate-shaped, and four convex columns (2) are arranged at four corners of the PCB board body (1).
5. A point-contact thermal insulating PCB board according to claim 1, wherein the top mount (3) is cylindrical.
6. The point-contact type thermal insulation PCB of claim 1, wherein the lower end of the top mount (3) is chamfered such that the annular cross-sectional area of the top mount (3) is tapered downward.
7. A point-contact thermal insulating PCB according to any of claims 1 to 6, characterized in that the stud (2) and the mounting boss (3) are of thermosetting plastic.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010014463.9A CN111246655B (en) | 2020-01-07 | 2020-01-07 | Point contact type heat insulation PCB |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010014463.9A CN111246655B (en) | 2020-01-07 | 2020-01-07 | Point contact type heat insulation PCB |
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CN111246655A true CN111246655A (en) | 2020-06-05 |
CN111246655B CN111246655B (en) | 2021-01-26 |
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CN202010014463.9A Active CN111246655B (en) | 2020-01-07 | 2020-01-07 | Point contact type heat insulation PCB |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2693618B2 (en) * | 1990-03-29 | 1997-12-24 | 東芝エー・ブイ・イー株式会社 | Electronic circuit board |
US20010053068A1 (en) * | 2000-03-16 | 2001-12-20 | Toshihiro Murayama | Electronic circuit device |
CN200941722Y (en) * | 2006-07-20 | 2007-08-29 | 东莞莫仕连接器有限公司 | Radiator with positioner |
US20080123312A1 (en) * | 2006-11-29 | 2008-05-29 | Sun-Wen Cyrus Cheng | Multiple-board power converter |
CN102271467A (en) * | 2010-06-02 | 2011-12-07 | 文科泰克控股公司 | Electrical power module and method for connecting an electrical power module to a printed circuit board and a heat sink |
CN110326370A (en) * | 2016-11-25 | 2019-10-11 | 川崎重工业株式会社 | Electric product |
-
2020
- 2020-01-07 CN CN202010014463.9A patent/CN111246655B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2693618B2 (en) * | 1990-03-29 | 1997-12-24 | 東芝エー・ブイ・イー株式会社 | Electronic circuit board |
US20010053068A1 (en) * | 2000-03-16 | 2001-12-20 | Toshihiro Murayama | Electronic circuit device |
CN200941722Y (en) * | 2006-07-20 | 2007-08-29 | 东莞莫仕连接器有限公司 | Radiator with positioner |
US20080123312A1 (en) * | 2006-11-29 | 2008-05-29 | Sun-Wen Cyrus Cheng | Multiple-board power converter |
CN102271467A (en) * | 2010-06-02 | 2011-12-07 | 文科泰克控股公司 | Electrical power module and method for connecting an electrical power module to a printed circuit board and a heat sink |
CN110326370A (en) * | 2016-11-25 | 2019-10-11 | 川崎重工业株式会社 | Electric product |
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CN111246655B (en) | 2021-01-26 |
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