CN111244732A - Liquid/gas cooling thin-chip laser, gain module and wave front distortion self-compensation method - Google Patents
Liquid/gas cooling thin-chip laser, gain module and wave front distortion self-compensation method Download PDFInfo
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- CN111244732A CN111244732A CN202010086220.6A CN202010086220A CN111244732A CN 111244732 A CN111244732 A CN 111244732A CN 202010086220 A CN202010086220 A CN 202010086220A CN 111244732 A CN111244732 A CN 111244732A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0404—Air- or gas cooling, e.g. by dry nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
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Abstract
The invention discloses a liquid/gas cooling thin-chip laser, a gain module and a wavefront distortion self-compensation method. The gain module directly cools the gain medium by adopting a method that the cooling medium with higher uniformity flows through a flow channel formed between the gain media along the width direction of the flow channel, wherein the cooling medium is a liquid cooling medium and/or a gas cooling medium; the thermo-optic coefficient of the cooling medium is opposite in polarity to the thermo-optic coefficient of the gain medium. On the basis, the relation between the thickness of the solid and the thickness of the cooling flow channel is reasonably designed. Corresponding flow field homogenizing devices are arranged in front of and behind the gain area and used for improving the uniformity of a cooling flow field and reducing high-order phase difference caused by uneven flow velocity of liquid; the wavefront distortion components of crystals and liquid in the laser gain module can be consistent and the amplitudes are opposite under any flow speed and heat generation conditions, so that the self-compensation of the wavefront distortion is realized, and the generation of the wavefront distortion of the gain module is reduced from the source.
Description
Technical Field
The invention relates to the field of lasers, in particular to a method for self-compensating wavefront distortion of a gain module in a direct liquid-cooled thin-chip laser adopting cooling liquid to directly cool a gain medium and a direct gas-cooled thin-chip laser directly adopting gas to cool the gain medium, and the corresponding gain module and the direct liquid/gas-cooled thin-chip laser.
Background
The high-average-power solid laser has important application prospect in the fields of industry and national defense. The traditional technical route encounters different technical bottlenecks in the development process of realizing high average power output. In the conventional thin-plate laser, laser needs to be transmitted in a multiple reflection mode, and images are transmitted between the thin plates through a 4f system. Making the system bulky and difficult to machine and weld the wafer, introducing large aberrations within the cavity. In the published report, no further study was made after the power reached 30 kW. With MOPA amplified slab lasers, laser output of up to over 100kW has been reported abroad, although beam quality control is better. However, the cascade amplification of a plurality of laths makes the system more complex and less robust. The fiber laser has a small fiber core diameter, so that the single fiber output power can only reach about 10kW at present. In view of a series of bottleneck problems existing in the conventional laser, the direct liquid/air-cooled thin-chip laser is one of the technical routes for realizing high average power laser output by virtue of its efficient cooling capability and compact system structure, and is also one of the solid-state light sources with the highest potential for realizing weaponization. In a direct liquid/air cooled chip laser, a large number of gain chips are connected in series at an angle within a gain block. The cooling medium flows directly through the gaps between the sheets for cooling. The cooling device has the advantages of good cooling effect, compact structure, easy realization of high-power output and the like.
However, in direct liquid/air-cooled thin-chip lasers, the laser needs to repeatedly pass through the cooling liquid and the gain medium alternately. Resulting in a system that produces wavefront aberrations that are different from conventional solid state lasers and that have large values of wavefront aberrations. At present, wavefront distortion becomes a critical problem restricting further development of a direct liquid/air cooling thin-chip laser, so that the quality of output beams of the laser is poor, and practical application is difficult. How to reduce the wavefront distortion inside the gain block becomes a crucial issue.
Disclosure of Invention
The invention aims to: aiming at the existing problems, a method for realizing the self-compensation of the wave front distortion of the gain module of the direct liquid/air cooling thin-chip laser is provided. By selecting the dielectric material, the self-compensation of wavefront distortion is realized, and the wavefront distortion of the direct liquid/air-cooled thin-chip laser is reduced.
The technical scheme adopted by the invention is as follows:
a liquid/gas cooling thin-chip laser gain module wave front distortion self-compensating method, the gain module of the said laser adopts the cooling medium to flow the method of the runner that the gain medium forms directly through the gain medium to cool the gain medium, the said cooling medium is liquid cooling medium and/or gaseous cooling medium; the thermo-optic coefficient of the cooling medium is opposite in polarity to the thermo-optic coefficient of the gain medium.
The scheme selects the gain medium and the cooling medium with opposite thermo-optic coefficient polarities, and the wavefront distortions introduced by the gain medium and the cooling medium compensate each other, so that for the direct liquid/air-cooled thin-chip laser, the wavefront distortion of the direct liquid/air-cooled thin-chip laser is effectively reduced from the source through the selection of materials.
Further, the cooling medium and the gain medium correspond to each other, and the correspondence relationship is as follows: the wavefront distortion introduced by the cooling medium is of the same order of magnitude as the absolute value of the wavefront distortion introduced by the gain medium.
The introduction of the wave front distortion of the same order of magnitude enables a better wave front distortion self-compensation effect to be obtained between the two mediums.
Further, the gain medium is a laser crystal.
Further, the gain medium is a gain medium with a positive thermo-optic coefficient, and the cooling medium is a cooling medium with a negative thermo-optic coefficient.
Further, the gain medium is a gain medium with yttrium aluminum garnet as a doped matrix material, and the cooling medium is one or more of distilled water, deionized water or heavy water.
Further, the cooling medium is heavy water.
Furthermore, a flow field homogenizing device is arranged in front of and/or behind the gain medium and used for improving the uniformity of a cooling flow field and reducing the introduction of extra high-order aberration. A section of flow field homogenizing device is arranged after the cooling medium flows through the gain medium, so that the influence of the nonuniformity of a rear-end flow field on the uniformity of a front-end gain area flow field is avoided.
Further, when the crystal flow direction length of the gain medium is 20mm, the crystal thickness of the gain medium is 1.4 +/-0.5 mm, and the flow channel thickness of the cooling medium is 0.1-0.5 mm.
The invention also provides a gain module of the direct liquid/air cooling thin-chip laser, which comprises a cooling medium, wherein the gain medium is provided with a flow channel and directly flows through the flow channel to cool the gain medium, and the cooling medium is a liquid cooling medium and/or a gas cooling medium; the gain medium thermo-optic coefficient is opposite in polarity to the gain medium thermo-optic coefficient.
The gain module of the thin-chip laser is formed by selecting the gain medium with opposite thermo-optic coefficient polarities and the cooling medium, so that the wavefront distortion introduced by the two media is mutually compensated, and the wavefront distortion of the direct liquid/air-cooled thin-chip laser is effectively reduced from the source.
Further, the cooling medium and the gain medium correspond to each other, and the correspondence relationship is as follows: the introduced wavefront distortion is of the same order of magnitude as the wavefront distortion introduced by the gain medium.
Further, a flow field homogenizing device is arranged in front of and/or behind the gain medium. The cooling medium firstly flows through the flow field homogenizing device, and the uniformity of the flow field is improved. The cooling medium flows through the flow channel directly after flowing through the flow field homogenizing device to cool the gain medium. A section of flow field homogenizing device is arranged after the cooling medium flows through the gain medium, so that the influence of the nonuniformity of a rear-end flow field on the uniformity of a front-end gain area flow field is avoided. .
The invention also provides a direct liquid/air cooling thin-film laser, and the gain module of the thin-film laser is the gain module.
The thin-chip laser device with the design effectively reduces the problem of wavefront distortion through the gain module of the thin-chip laser device.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. by the method, the self-compensation of the wave front distortion is realized by optimizing the types of the gain medium and the cooling liquid, and the wave front distortion of the system can be reduced from the source. The output power and the beam quality of the laser are improved.
2. The invention is simple to implement, and the system performance can be greatly improved by simply changing the original laser.
3. The invention is an innovation of material selection, so the scheme is stable and the implementation is reliable.
Drawings
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
fig. 1 is a structural diagram of a gain module of a direct liquid/air-cooled thin-plate laser.
In the figure: the device comprises a laser gain module, a cooling flow field rectifying device, a flow field homogenizing device, a gain module outer frame, a laser gain medium front extension section, a cooling flow channel, a laser gain medium, a cooling medium flowing in the cooling flow channel, a laser gain medium rear extension section and a laser gain module cooling medium outlet, wherein the laser gain module cooling medium inlet is 1, the cooling flow field rectifying device is 2, the flow field homogenizing device is 3, the gain module outer frame is 4, the laser gain medium front extension section is 5, the cooling flow channel is 6 between the laser gain media.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification (including any accompanying claims, abstract) may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
Example one
The embodiment discloses a method for self-compensating wave front distortion of a gain module of a liquid/air cooled thin-chip laser.
Direct liquid/gas cooled chip lasers typically have a chip solid gain medium directly immersed in a cooling medium. The matrix materials of commonly used thin-sheet solid gain media are mainly in the following categories: 1. glass; 2. oxides such as sapphire, garnet, alumina, and sulfur oxide; 3. phosphates and silicates; 4. tungstate, molybdate, vanadate, and beryllite salts; 5. a fluoride compound; 6. a ceramic material. Some of these materials have a positive thermo-optic coefficient, such as Yttrium Aluminum Garnet (YAG); some materials have negative thermo-optic coefficients, such as Yttrium Lithium Fluoride (YLF). The cooling medium commonly used in the direct liquid-cooled chip laser mainly comprises deionized water, heavy water, carbon tetrachloride, tetrachloroethylene, siloxane, aromatic compounds, halogenated hydrocarbon and various refractive index matching fluids. Wherein the thermo-optic coefficients of the more typical heavy water, tetrachloroethylene and carbon tetrachloride are all negative numbers. The cooling medium commonly used in the direct air-cooled thin-chip laser is high-speed helium gas or the like. In the present embodiment, through the analysis of the material characteristics, the gain medium and the cooling medium with opposite polarity of thermo-optic coefficients are preferred: and selecting a solid material gain medium with a positive thermo-optic coefficient and a liquid/gas material cooling medium with a negative thermo-optic coefficient, or selecting a solid material gain medium with a negative thermo-optic coefficient and a liquid/gas material cooling medium with a positive thermo-optic coefficient, thereby realizing the self-compensation of the wave front distortion of the direct liquid/cooling starting thin-plate laser gain module. The cooling medium may be selected from a liquid cooling medium, or a mixture of both.
Preferably, in order to improve the self-compensation effect of the wavefront distortion, it is necessary to ensure that the wavefront distortion introduced by the cooling medium and the gain medium are in the same order of magnitude.
Preferably, in order to achieve a better wave front distortion self-compensation effect, a corresponding cooling flow field homogenizing device is arranged in front of and/or behind the gain area of the laser, so that the uniformity of the cooling flow field is improved.
In one embodiment, a YAG (yttrium aluminum garnet) crystal is used as a doping matrix material of a laser gain medium, water (including distilled water, deionized water and heavy water) is used as a cooling medium Nd, and the corresponding thermo-optic coefficient is 7.3 x 10 when the output wavelength of the YAG medium is 1064nm-6K-1. The thermo-optic coefficient of water is-1.3X 10-4K-1. Although the difference is about two orders of magnitude, when the laser is in operation, it is considered that the temperature rise of the cooling liquid occurs mainly in the fluid boundary layer, and the temperature rise of the laser gain medium occurs in the whole thickness region. Both introduce wavefront distortions of roughly the same order of magnitude in absolute value. Meanwhile, the wavefront distortion numerical value introduced by the laser gain medium is a positive number, and the wavefront distortion numerical value introduced by the water is a negative number, so that the laser gain medium and the water can realize a better wavefront distortion self-compensation effect.
Since the temperature rise of the cooling liquid mainly occurs in the fluid boundary layer, and the temperature rise of the gain medium occurs in the whole thickness area, the thickness of the gain medium has a large influence on the wavefront distortion self-compensation effect. In order to achieve a better self-compensation effect, the thickness of the gain medium needs to be optimized. As a preferred embodiment, when the YAG crystal is cooled by heavy water, if the flow direction length of the crystal is 20mm, the crystal thickness is 1.4 +/-0.5 mm, and the flow channel thickness is between 0.1 and 0.5mm, the optimal self-compensation effect can be realized.
Example two
Referring to fig. 1, the present embodiment discloses a gain module of a liquid/gas cooled thin-film laser, which includes a cooling medium 8 and a gain medium 7, wherein the gain medium forms a flow channel 6, the cooling medium 8 directly flows into the flow channel 6, the gain medium 7 is cooled during the flow channel 6, and the cooling medium 8 is a liquid cooling medium and/or a gas cooling medium; the thermo-optic coefficient of the cooling medium 8 is opposite in polarity to the thermo-optic coefficient of the gain medium 7.
In front and/or behind the gain medium 7, a flow field homogenizing device 3 is provided to homogenize the cooling flow field entering the gain module. Further, a cooling flow field rectifying device 2 is further arranged at the inlet of the cooling medium to rectify the cooling flow field and improve the homogenization of the flow field.
EXAMPLE III
As shown in fig. 1, the present embodiment discloses a gain module of a liquid/gas cooled thin-film laser, which includes a cooling flow field rectifying device 2, a flow field homogenizing device 3, a gain module outer frame 4, a gain medium front extension section 5, a laser gain medium 7, and a gain medium rear extension section 9. The gain medium is formed with a flow channel 6. A cooling medium 8 directly enters the gain module through an inlet 1 of a gain module outer frame 4, is homogenized by a flow field rectifying device 2 and a flow field homogenizing device 3, then flows into a flow channel 6, flows out from a cooling medium outlet 10, and cools a gain medium 7 in the process of flowing through the flow channel 6, wherein the cooling medium 8 is a liquid cooling medium and/or a gas cooling medium; the gain medium 7 and the cooling medium 8 have opposite polarities of thermo-optic coefficients. The flow field rectifying and homogenizing device is used for improving the uniformity of a cooling flow field and reducing the introduction of extra high-order aberration.
In order to improve the self-compensation effect of the wavefront distortion, it is necessary to ensure that the wavefront distortion introduced by the cooling medium 8 and the gain medium 7 are of the same order of magnitude.
In one embodiment, a YAG crystal is used as the dopant host material for the laser gain medium 7, matching the corresponding thermo-optic coefficient of 7.3X 10 at a wavelength of 1064nm for the output wavelength of the Nd: YAG medium using water (including distilled water, deionized water and heavy water) as the cooling medium-6K-1. The thermo-optic coefficient of water is-1.3X 10-4K-1. Although the difference is about two orders of magnitude, when the laser is in operation, it is considered that the temperature rise of the cooling liquid mainly occurs in the fluid boundary layer, and the temperature rise of the laser gain medium 3 occurs in the entire thickness region. Both introduce wavefront distortions of roughly the same order of magnitude in absolute value. Meanwhile, the value of wavefront distortion introduced by the laser gain medium is positive, and the value of wavefront distortion introduced by water is positiveThe distortion numerical value is a negative number, and the negative number and the positive number can realize a better wave-front distortion self-compensation effect.
Since the temperature rise of the coolant mainly occurs in the fluid boundary layer and the temperature rise of the gain medium 7 occurs in the entire thickness region, the thickness of the gain medium 7 has a large influence on the wavefront distortion self-compensation effect. In order to achieve a better self-compensation effect, the thickness of the gain medium 7 needs to be optimized. In the gain module of this embodiment, heavy water is selected as the cooling medium 8, YAG crystal is selected as the gain medium 7, the crystal flow direction length is designed to be 20mm, the crystal thickness is selected to be 1.4 ± 0.5mm, and the thickness of the flow channel 1 is selected to be between 0.1 mm and 0.5 mm.
Example four
The present embodiment discloses a direct liquid/air-cooled thin-film laser, and the design point of the thin-film laser is that the gain module is the gain module in the second embodiment. The remaining components are identical to the existing components.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.
Claims (10)
1. A liquid/gas cooling thin-chip laser gain module wave front distortion self-compensating method, the gain module of the said laser adopts the cooling medium to flow the method of the runner that the gain medium forms directly through the gain medium to cool the gain medium, the said cooling medium is liquid cooling medium and/or gaseous cooling medium; wherein a thermo-optic coefficient of the cooling medium is opposite in polarity to a thermo-optic coefficient of the gain medium.
2. The method of self-compensating for wavefront distortion in gain module of liquid/air-cooled chip laser as claimed in claim 1, wherein the cooling medium and the gain medium are corresponding to each other, and the relationship between them is: the wavefront distortion introduced by the cooling medium is of the same order of magnitude as the absolute value of the wavefront distortion introduced by the gain medium.
3. The method of self-compensating for wavefront distortion in a gain module of a liquid/air-cooled chip laser as claimed in claim 1, wherein the gain medium is a laser crystal.
4. The method for self-compensating for wavefront distortion of gain module of liquid/air-cooled chip laser as claimed in any one of claims 1 to 3, wherein the gain medium is a gain medium with positive thermo-optic coefficient, and the cooling medium is a cooling medium with negative thermo-optic coefficient.
5. The method of claim 4, wherein the gain medium is a doped substrate material of yttrium aluminum garnet, and the cooling medium is one or more of distilled water, deionized water or heavy water.
6. The method of self-compensating for wavefront distortion in a gain module of a liquid/air cooled chip laser as claimed in claim 5, wherein the cooling medium is heavy water.
7. The method of claim 6, wherein when the crystal flow direction length of the gain medium is 20mm, the crystal thickness of the gain medium is 1.4 ± 0.5mm, and the channel thickness of the cooling medium is 0.1-0.5 mm.
8. A gain module of a direct liquid/air cooling thin-chip laser comprises a cooling medium and a gain medium, wherein the gain medium is provided with a flow channel, the cooling medium directly flows through the flow channel to cool the gain medium, and the cooling medium is a liquid cooling medium and/or a gas cooling medium; wherein a thermo-optic coefficient of the gain medium is opposite in polarity to a thermo-optic coefficient of the gain medium.
9. The gain module of a thin-chip laser as claimed in claim 8, wherein the cooling medium and the gain medium correspond to each other in a relationship of: the introduced wavefront distortion is of the same order of magnitude as the wavefront distortion introduced by the gain medium.
10. The gain module of the thin-chip laser as claimed in claim 8 or 9, wherein a flow field homogenizing device is provided in front of and/or behind the gain medium to homogenize uniformity of the cooling flow field.
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Application publication date: 20200605 |