CN111243980B - Transfer piece, transfer method and preparation method of transfer piece - Google Patents
Transfer piece, transfer method and preparation method of transfer piece Download PDFInfo
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- CN111243980B CN111243980B CN201811447681.0A CN201811447681A CN111243980B CN 111243980 B CN111243980 B CN 111243980B CN 201811447681 A CN201811447681 A CN 201811447681A CN 111243980 B CN111243980 B CN 111243980B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The application provides a transfer member, a transfer method and a preparation method of the transfer member. The transfer member includes: a substrate; the accommodating frame is arranged on the substrate, and an accommodating structure is arranged in each accommodating frame respectively to accommodate one corresponding electronic device; the accommodating structure in the accommodating frame is in a first state so that the electronic device is fixed in the accommodating frame; the accommodating structure of the accommodating frame is in a second state to release the electronic device. The transfer piece can transfer the electronic device conveniently.
Description
Technical Field
The application relates to the field of electronic devices, in particular to a transfer piece, a transfer method and a preparation method of the transfer piece.
Background
In the equipments used in daily life, the electronic devices are commonly used, and when the equipments are manufactured, the electronic devices are generally required to be transferred to the driving panel. The miniaturization of electronic devices is becoming one of the development trends, for example, the application of Micro light Emitting diodes (Micro-LEDs) in display devices, i.e., the integration of a plurality of Micro-sized Light Emitting Diodes (LEDs) on a display panel, is becoming one of the development trends of the current display technology.
When the electronic device needs to be transferred to the driving panel, the electronic device is difficult to be conveniently grabbed and transferred based on the current technology.
Disclosure of Invention
The application provides a transfer piece, a transfer method and a preparation method of the transfer piece, and aims to solve the problem that the prior art cannot realize convenient grabbing and transferring of electronic devices.
In order to solve the above technical problem, the present application provides a transfer member, the transfer member including: a substrate; the accommodating frame is arranged on the substrate, and an accommodating structure is arranged in each accommodating frame respectively to accommodate one corresponding electronic device; the accommodating structure in the accommodating frame is in a first state so that the electronic device is fixed in the accommodating frame; the accommodating structure of the accommodating frame is in a second state to release the electronic device.
In order to solve the above technical problem, the present application further provides a transfer method, where the transfer method includes: aligning a transfer piece and the electronic device, wherein the transfer piece comprises at least one accommodating frame, and each accommodating frame aligns the corresponding electronic device; moving the transfer piece to enable the electronic device to be accommodated in the accommodating frame, and enabling the accommodating structure in the accommodating frame to be in a first state to enable the electronic device to be fixed in the accommodating frame; and placing the transfer member containing the electronic device on the target substrate, and placing the containing structure of the containing frame in a second state to release the electronic device, so as to place the electronic device on the target panel.
In order to solve the above technical problem, the present application also provides a method of manufacturing a transfer member for transferring an individual electronic device to a driving panel, the method including: depositing a containment frame body material on a first substrate; patterning the receiving frame body material to form at least one receiving frame body, wherein each receiving frame body comprises a bottom part contacting with the first substrate, a first side part and a second side part connecting the bottom part, and the bottom part, the first side part and the second side part form a receiving frame with an opening; injecting an elastic barrier film material into the cavity; heating the elastic barrier film material by extrusion of a die to form an elastic barrier film attached to the accommodating frame body; removing the mold, and covering a second substrate on the structure to seal the opening of the accommodating frame, wherein the second substrate is used as a substrate of the transfer member; removing the first substrate to expose the bottom of the accommodating frame; a corresponding through hole is formed in the area, corresponding to the accommodating frame, of the second substrate; injecting a deformation body into the accommodating frame through the through hole; filling a heating element in the through hole to seal the through hole; the bottom of the receiving frame is etched away to expose the elastic barrier film corresponding to the bottom to form the transfer member.
The transfer piece comprises at least one accommodating frame, each accommodating frame is internally provided with an accommodating structure to accommodate one corresponding electronic device, the accommodating structure can enable the electronic device to be fixed in the accommodating frame when in a first state, and the accommodating structure can release the electronic device when in a second state. Therefore, the accommodating structure is in the first state, the electronic device can be fixedly picked up, the transfer piece is moved, the electronic device is transferred to the target substrate, and then the accommodating structure is in the second state, so that the electronic device can be released, and the transfer of the electronic device is completed. Therefore, the transfer piece can realize convenient transfer of the electronic device.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural view of an embodiment of a transfer member of the present application;
FIG. 2 is a schematic view of the transfer member of FIG. 1 in a first state;
FIG. 3 is a schematic structural view of another embodiment of a transfer member of the present application;
FIG. 4 is a schematic structural view of yet another embodiment of a transfer member of the present application;
FIG. 5 is a schematic view of the transfer member of FIG. 4 in a first state;
FIG. 6 is a schematic flow chart diagram illustrating an embodiment of a transfer method of the present application;
FIG. 7 is a schematic process flow diagram of one embodiment of the transfer method shown in FIG. 6;
FIG. 8 is a schematic flow chart diagram illustrating one embodiment of a method of making a transfer member according to the present application;
FIG. 9 is a schematic process diagram of an embodiment of the manufacturing method shown in FIG. 8.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures associated with the present application are shown in the drawings, not all of them. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
The transfer member of the present application is used to effect transfer of an electronic device to a drive panel. Under the current trend of electronic device miniaturization, the transfer member of the application is also particularly suitable for transferring the micro electronic device, and certainly, the transfer member of the application can also be used for non-micro electronic devices. In addition, the transfer piece not only can transfer independent electronic devices, but also can transfer batch electronic devices. By taking the micro light-emitting diode as an example, the transfer of the micro light-emitting diodes in batches can be realized. The micro light emitting diodes are used for realizing self-luminescence of pixels in a display panel, one micro light emitting diode is used as one pixel point, and in the current display panel, the number of the pixel points is generally thousands, so that thousands of micro light emitting diodes are correspondingly arranged on the display panel. The transfer piece that this application provided sets up the holding structure in holding the frame, realizes picking up and releasing electronic device through holding structure's different states to the completion is to the transfer of electronic device.
Specifically, please refer to fig. 1 and fig. 2 for a transfer device of the present application, fig. 1 is a schematic structural diagram of an embodiment of a transfer member of the present application, and fig. 2 is a schematic structural diagram of the transfer member in fig. 1 in a first state. The transfer member 100 of the present embodiment includes a substrate 11 and at least one receiving frame 12.
The substrate 11 is used for carrying the accommodating frame 12 for fixing and transferring the electronic device 101, and the material selected for the substrate 11 may be a transparent or non-transparent material, such as silicon or Pyrex glass.
The transfer member 100 includes at least one accommodating frame 12, that is, the accommodating frame 12 may be one or more, and the corresponding transfer member 100 may transfer one electronic device 101 or transfer a plurality of electronic devices 101. The receiving frame 12 is disposed on the substrate 11 and includes a first side portion 121 and a second side portion 122, and the first side portion 121 and the second side portion 122 form a receiving frame 12 having an opening 123. The opening 123 of the receiving frame 12 is slightly larger than the maximum cross-sectional area of the target electronic device 101, and the receiving frame 12 may be shaped like a square frame, as shown in fig. 1; in other embodiments, the shape of the receiving frame 12 may be trapezoidal, etc.
In the following, taking the pickup of a plurality of electronic devices 101 as an example, the transfer member 100 is provided with a plurality of accommodating frames 12, and the accommodating frames 12 have the same size and shape, so as to facilitate the transfer of a large number of electronic devices 101 of the same type; or a part of the receiving frame 12 is of a first size and a first shape and another part of the receiving frame 12 is of a second size and a second shape to transfer a large number of different types of electronic devices 101.
The accommodating frame 12 is provided with an accommodating structure 13 therein, and the electronic device 101 is mainly picked up and released by the accommodating structure 13 in the embodiment. The accommodating structure 13 can be changed into different states, and in the first state, the electronic device 101 can be fixed in the accommodating frame 12; in the second state there is no anchoring effect on the electronic device 101 and the electronic device 101 may be released.
The process of transferring the electronic device 101 through the accommodating structure 13 can be understood by referring to fig. 2, after the accommodating frame 12 aligns the electronic device 101 and accommodates the electronic device 101 into the accommodating frame 12 through the opening 123, the accommodating structure 13 in the accommodating frame 12 is in the first state to fix the electronic device 101 in the accommodating frame 12; after the transfer member 100, which fixedly accommodates the electronic device 101, is moved to a corresponding position of the target substrate, the accommodating structure 13 of the accommodating frame 12 is brought into the second state to release the electronic device 101, thereby placing the electronic device 101 on the target substrate.
Specifically, the state of the accommodating structure can be changed by controlling different conditions. The receiving structure 13 further includes a deformation body 131 and an elastic blocking film 132. Wherein, the elastic barrier film 132 is disposed on the inner wall of the accommodating frame 12, and forms a cavity for accommodating the deformation body 131 with the substrate 11.
The elastic barrier film 132 is deformed to wrap the electronic device 101 therein, the deformation body 131 is deformed along with the deformation of the elastic barrier film 132, and the deformation body 131 can fix the electronic device 101 in the accommodating frame 12 in the first state and can release the electronic device 101 in the second state.
The deformable body 131 may be a liquid, and may be a liquid at room temperature, and may be cooled to be solidified so as to be in a first state, i.e., a solid state, and when the deformable body 131 is a solid state, it may be heated to be released from being solidified so as to be in a second state, i.e., a liquid state.
The specific process for realizing the transfer of the electronic device 101 is as follows: an elastic barrier film 132 and a liquid deformable body 131 to enclose the electronic device 101. The deformable body 131 is subjected to a temperature reduction treatment to be cured, and the cured deformable body 131 increases in volume and exerts a certain pressure on the electronic device 101, so that the friction between the elastic barrier film 132 and the electronic device 101 is increased, and the electronic device 101 can be fixed in the housing frame 12. After the transfer member 100 accommodating the electronic device 101 is moved to the target substrate, the deformable body 131 is heated to be restored to the liquid state, the shape of the elastic barrier film 132 is changed, the contact area and pressure between the elastic barrier film 132 and the electronic device 101 are reduced, and the friction between the elastic barrier film 132 and the electronic device 101 is reduced, so that the electronic device 101 cannot be fixed in the accommodating frame 12, that is, the electronic device 101 is released.
The liquid deformable body 131 may be specifically a liquid metal, water, oil, or the like. In this embodiment, the deformation body 131 is made of liquid metal, which is more easily changed into solid state than water or oil. For example, the gallium-indium alloy is used as the deformable body 131, and the melting point of the gallium-indium alloy is 15.5 ℃, so that the gallium-indium alloy of the deformable body 131 can be changed into a solid state only by cooling the gallium-indium alloy to be lower than 15.5 ℃, and the gallium-indium alloy of the deformable body 131 can be changed into a liquid state by heating the gallium-indium alloy to be higher than 15.5 ℃.
The deformable body 131 may be a thermal expansion material, specifically, particles or flakes, and is filled in a cavity formed between the elastic barrier film 132 and the substrate 11, and is deformable along with the elastic barrier film 132. It can be heated to expand it to a first state and contract it to a second state after cooling. In the process of realizing the transfer of the electronic device 101, similarly to the liquid deformation body 131, the deformation body 131 of the thermal expansion material is also changed between the first state and the second state, and in the first state, the expanded deformation body 131 can generate a pressure to the electronic device 101, so that the electronic device 101 can be fixed in the housing frame 12. In the second state, the expanded transformation body 131 is restored, thereby releasing the electronic device 101.
The deformable body 131 of the thermal expansion material may specifically include expanded graphite or the like. At normal temperature, the expanded graphite is in a flake form, and when the expanded graphite is heated, the flake form of the expanded graphite is changed into a worm form, and at the moment, the expanded graphite is loose in structure, porous and bent, the surface area is enlarged, and the surface energy is improved, so that the electronic device 101 is fixed.
The variant 131 may be a supersaturated solution which can be crystallized and solidified under pressure to be in a first state, and after being heated, the solution state, that is, a second state, can be recovered by releasing the crystallization and solidification. In the process of transferring the electronic device 101, the deformation 131 of the supersaturated solution, similar to the deformation 131 of the liquid, can fix the electronic device 101 in the containing frame 12 when solidified, and can release the electronic device 101 when being restored to the liquid state. In addition, when the deformation 131 of the supersaturated solution wraps up the electronic device 101, the electronic device 101 has a certain acting force on the supersaturated solution, so that the supersaturated solution can be crystallized and solidified.
The elastic barrier film 132 may be an elastic material such as rubber, and the surface of the elastic barrier film 132 may have viscosity, so that the electronic device 101 may be ensured by the viscosity when the electronic device 101 is picked up. The surface of the elastic barrier film 132 is weakly adhesive to ensure that the elastic barrier film 132 can be pulled to be detached from the electronic device 101 when the electronic device 101 is released. The elastic barrier film 132 may be vulcanized rubber, or an adhesive may be applied to the surface of the elastic barrier film 132.
For the deformable bodies 131 of different materials mentioned in the present embodiment, the deformable bodies 131 need to be heated, so the transfer member 100 of the present embodiment further includes a heating member 14 for generating heat to make the deformable bodies 131 in the first state or the second state. The heating member 14 may be disposed on the substrate 11 in contact with the receiving frame 12 to heat the transformation body 131, or in direct contact with the transformation body 131 to heat. And in particular to fig. 1 and 3, fig. 3 is a schematic structural view of another embodiment of the transfer member of the present application.
Wherein through holes 111 are formed in the substrate 11, each through hole 111 corresponds to one of the receiving frames 12, and the heating members 14 are disposed in the through holes 111. In fig. 1, the through hole 111 is not communicated with the accommodating frame 12, the heating element 14 heats the deformation body 131 through the accommodating frame 12, and the accommodating frame 12 is made of a heat conductive material. In fig. 3, the through hole 111 is communicated with the accommodating frame 12, and the heating member 14 is required to fill and seal the through hole 111, and at this time, the heating member 14 directly heats the deformation body 131.
Further, the deformation body 131 is confined in the accommodating frame 12 by the elastic barrier film 132, and the elastic barrier film 132 is disposed in the accommodating frame 12, and the deformation body 131 occupies a part of the space, for example, 1/2 or 1/3 of the space, of the inner space of the accommodating frame 12 to leave a space for accommodating the electronic device 101. If the remaining space of the space inside the receiving frame 12, excluding the space occupied by the transformation body 131 and the elastic barrier film 132, is insufficient to receive the electronic device 101, the transfer member 100 is not easy to pick up the electronic device 101.
In other embodiments, the deformation body 131 may occupy the entire inner space of the receiving frame 12. As shown in fig. 4 and 5, fig. 4 is a schematic structural view of a further embodiment of the transfer member of the present application, and fig. 5 is a schematic structural view of the transfer member of fig. 4 in a first state. The transfer member 100 further includes at least one transition cavity 15, which corresponds to at least one accommodating frame 12, is located between the substrate 11 and the accommodating frame 12, and is communicated with the accommodating frame 12. At this time, when the electronic device 101 is picked up, the excessive deformation body 131 may flow into the transition cavity 15, and then the accommodation pickup of the electronic device 101 is realized.
In addition, in the present embodiment, the temperature of the deformable body 131 is reduced by using a refrigerator to reduce the temperature of the entire transfer member 100.
Specifically, if the deformable body 131 is a liquid, the transfer member 100 is integrally cooled, and the accommodating structure 13 in each accommodating frame 12 can solidify the pickup electronic device 101; selective release transfer of the electronic device 101 is achieved by selectively heating the heating member 14 after transfer to the target substrate.
If the deformable body 131 is a thermal expansion material, the heating member 14 is selectively heated to expand to pick up the electronic device 101; after the transfer to the target substrate, the entire temperature is lowered, and the selective transfer to the electronic device 101 is realized.
If the deformation body is supersaturated solution, each accommodating structure 13 can pick up the electronic device 101, and after the deformation body is transferred to the target substrate, the heating element 14 is selectively heated, so that the electronic device 101 can be selectively released and transferred.
In this embodiment, the electronic device 101 is a micro light emitting diode, and the target substrate is a driving panel in a micro light emitting diode display panel. The electronic device 101 may also be a capacitor, a transistor, a balance spring, a spiral spring, or other electronic devices; the target substrate may also be a printed circuit board, a flexible printed circuit board, or the like.
The transfer member 100 of the embodiment achieves picking and releasing of the electronic device 101 through control of different states of the accommodating structure 13 in the accommodating frame 12 to transfer the electronic device 101 onto a target substrate, thereby manufacturing an electronic apparatus. Specifically, the micro light emitting diode can be transferred to a driving panel, thereby manufacturing the display panel. The accommodating frame 12 may also be provided in a plurality of numbers, and further may be arranged in an array, so as to realize the transfer of a plurality of electronic devices. Also, the state of each containment structure 13 may be individually controlled to achieve selective transfer of electronic devices.
Corresponding to the transfer member 100 of the above embodiment, the present application further provides a transfer method, specifically referring to fig. 6 and fig. 7, fig. 6 is a schematic flow diagram of an embodiment of the transfer method of the present application, and fig. 7 is a schematic process diagram of an embodiment of the transfer method shown in fig. 6.
The transferring method of the present embodiment is applied to the transferring member 100 of the above embodiment, and for the specific structure of the transferring member 100, please refer to fig. 1 to fig. 5, which is not described herein again. With reference to the process schematic diagram of fig. 7, the transferring method of the embodiment includes the following steps. The variant is described as a liquid.
S41: and aligning the transfer piece and the electronic device, wherein the transfer piece comprises at least one accommodating frame, and each accommodating frame aligns one corresponding electronic device respectively.
In conjunction with process 1 in fig. 7, the transfer member 100 is moved to above the plurality of electronic devices 101, so that the accommodating frames 12 on the transfer member 100 are located right above the corresponding electronic devices 101.
S42: and moving the transfer piece to enable the accommodating structure in the accommodating frame to wrap the electronic device, wherein the accommodating structure comprises a deformation body and an elastic barrier film wrapping the deformation body.
S43: and carrying out low-temperature treatment on the solidified deformation body to enable the accommodating structure to be in a first state so as to fix the electronic device in the accommodating frame.
In conjunction with process 2 in fig. 5, step S42 moves the transfer member 100 downward to allow the electronic device 101 to enter the housing through the opening 123 of the corresponding receiving frame 12. At this time, the deformation body 131 and the elastic barrier film 132 in the receiving frame 12 are deformed to wrap the electronic device 101 due to the pressing of the electronic device 101, and the elastic barrier film 132 is in contact with most of the outer surface of the electronic device 101.
Step 43 is to lower the ambient temperature of the space where the transfer member 100 is located, cure the low-temperature-treated deformed body 131, and increase the pressure between the elastic barrier film 132 and the electronic device 101, so that the frictional force between the elastic barrier film 132 and the electronic device 101 is increased, wherein the frictional force between the elastic barrier film 132 and the electronic device 101 is sufficient to fix the electronic device 101 within the housing frame 12.
S44: the transfer member containing the electronic device is placed on the target substrate.
In which the transfer member 100 is moved so that the electronic device 101 in the accommodating frame 12 of the transfer member 100 is moved on the target substrate 102, in conjunction with the processes 3 and 4 in fig. 7.
In this embodiment, the electronic device 101 is a micro light emitting diode, and the target substrate 102 is a driving panel of a micro light emitting diode display panel.
S45: and carrying out heating treatment to remove the deformation body so as to enable the accommodating structure to be in the second state, thereby releasing the electronic device on the target substrate.
In connection with the process 5 in fig. 7, the heating member 14 in the plurality of through holes 13 of the control substrate 11 generates heat sufficient to partially or entirely release the deformed body 131 from the cured state by the heating member 14. At this time, the frictional force between the elastic barrier film 132 and the electronic device 101 is not enough to fix the electronic device 101 within the receiving frame 12. The transfer member 100 releases the electronic device 101, thereby placing the electronic device 101 on the target substrate 102.
Further, the heating members 14 are individually controlled by drive circuits distributed on the substrate. In step S45, the electronic device 101 without the dead spots is ensured by controlling the one or more heating members 14 to be not operated so that the temperature of the deformable body 131 in the corresponding accommodating frame 12 is not enough to release the deformable body 131 from the cured state.
In the transfer method of the present embodiment, the electronic devices 101 can be picked up and released in large quantities efficiently by the low-temperature treatment and heating of the deformation body 131; meanwhile, the deformation body 131 and the elastic barrier film 132 are used for wrapping and grabbing, so that the electronic device 101 is prevented from being damaged in the grabbing process; further, in the transfer process, if there is a defective dot in the plurality of electronic devices 101, it is possible to ensure that the defective dot is not caught by a separate heat treatment or the defective dot is not released at the time of placement, and the selective transfer is performed.
In response to the transfer member 100 disclosed in the above embodiment, the present application further provides a method for manufacturing a transfer member, specifically referring to fig. 8 and fig. 9, where fig. 8 is a schematic flow chart of an embodiment of the method for manufacturing a transfer member of the present application, and fig. 9 is a schematic process diagram of an embodiment of the method for manufacturing a transfer member shown in fig. 8.
The preparation method of the embodiment is applied to the transfer member 100 disclosed in the above embodiment, and for the specific structure of the transfer member 100, please refer to fig. 1 to 5, which is not described herein again. With reference to the schematic process diagram of fig. 9, the method for manufacturing a transfer member of this embodiment includes the following steps:
s61: a containment frame body material is deposited on the first substrate.
S62: the containment frame body material is patterned to form at least one containment frame body.
Wherein each receiving frame 12 includes a bottom 120 contacting the first substrate, a first side 121 and a second side 122 connecting the bottom 120.
S63: and injecting an elastic barrier film material into the cavity.
S64: the elastomeric barrier film material is heated by die pressing to form an elastomeric barrier film 132 that is applied to the containment frame.
S65: the mold is removed and a second substrate, which serves as the substrate 11 of the transfer member, is covered on the above structure to seal the opening of the receiving frame.
S66: the first substrate is removed to expose the bottom 120 of the receiving frame 12.
S67: corresponding through holes 111 are formed in the area of the accommodating frame corresponding to the second substrate.
S68: the deformation body 131 is injected into the receiving frame 12 through the through hole 111.
S69: the heating member 14 is filled in the through-hole 111 to seal the through-hole 111.
S60: the bottom portion 120 of the receiving frame 12 is etched away to expose the elastic barrier film 132 corresponding to the bottom portion to form the transfer member 100.
Among them, the electronic device 101 of the present embodiment is an LED light emitting device, and the driving panel 102 is a driving panel in an LED display panel.
Wherein, the above step S61, step S62, step S63 and step S64 correspond to the process 1, the process 2, the process 3 and the process 4 in fig. 9, respectively; the above step S65 corresponds to the processes 5 and 6 in fig. 9; the above-described step S66, step S67, step S68, step S69, and step 60 correspond to the process 7, the process 8, the process 9, the process 10, and the process 11 in fig. 9, respectively.
The above detailed description is provided for the transfer unit provided in the embodiments of the present application, and the principle and the implementation of the present application are explained in detail by applying specific examples, and the above description of the embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (9)
1. A transfer member, characterized in that it comprises:
a substrate;
the accommodating frames are arranged on the substrate, and each accommodating frame is internally provided with an accommodating structure for accommodating a corresponding electronic device;
wherein the accommodating structure in the accommodating frame is in a first state so that the electronic device is fixed in the accommodating frame; the accommodating structure of the accommodating frame is in a second state to release the electronic device;
the accommodating structure comprises:
a deformable body;
the elastic barrier film is arranged on the inner wall of the accommodating frame, and a cavity for accommodating the deformation body is formed between the elastic barrier film and the substrate;
wherein the elastic barrier film is deformed to encase the electronic device therein; the deformation body is in a first state so as to fix the electronic device in the accommodating frame, and the deformation body is in a second state so as to release the electronic device;
the transfer member further comprises a heating member for generating heat to heat the deformation body so that the deformation body is in the first state or the second state.
2. The transfer member according to claim 1, wherein the deformable body is liquid, and is in a first state by cooling and solidifying and in a second state by heating and releasing solidification;
or the deformation body is made of a thermal expansion material, the thermal expansion is in a first state, and the temperature reduction contraction is in a second state;
or the deformation body is supersaturated solution, and is in a first state through crystallization and solidification under the action of external force, and is in a second state through heating and crystallization and solidification removal.
3. The transfer member according to claim 1, wherein the base plate is provided with at least one through hole corresponding to the at least one accommodating frame;
the transfer member comprises at least one heating member respectively disposed in the at least one through hole; the heating element is used for generating heat so as to enable the deformation body to be in a first state or a second state.
4. The transfer member according to claim 3, wherein the heating member fills the through hole, the through hole communicating with the housing frame.
5. The transfer member of claim 1, wherein the transfer member includes at least one transition cavity corresponding to the at least one receiving frame, respectively, between the substrate and the receiving frame; the transition cavity is communicated with the accommodating frame.
6. The transfer member of claim 1, wherein the elastomeric barrier film surface has an adhesive property.
7. The transfer member of claim 1 wherein said electronic device is a micro light emitting diode.
8. A transfer method, characterized in that the transfer method comprises:
aligning a transfer piece and electronic devices, wherein the transfer piece comprises at least one accommodating frame, and each accommodating frame is aligned with one corresponding electronic device;
moving the transfer piece to enable the electronic device to be accommodated in the accommodating frame, and enabling an accommodating structure in the accommodating frame to be in a first state to enable the electronic device to be fixed in the accommodating frame;
placing the transfer member accommodating the electronic device on a target substrate, and placing the accommodating structure of the accommodating frame in a second state to release the electronic device, thereby placing the electronic device on the target substrate;
wherein, holding structure includes:
a deformable body;
the elastic barrier film is arranged on the inner wall of the containing frame, and a cavity for containing the deformation body is formed between the elastic barrier film and the substrate;
wherein the elastic barrier film is deformed to encase the electronic device therein; the deformation body is in a first state so as to fix the electronic device in the accommodating frame, and the deformation body is in a second state so as to release the electronic device;
the transfer member further comprises a heating member for generating heat to heat the deformation body so that the deformation body is in the first state or the second state.
9. A method of making a transfer, the method comprising:
depositing a containment frame body material on a first substrate;
patterning the receiving frame body material to form at least one receiving frame body, wherein each receiving frame body comprises a bottom portion contacting the first substrate, a first side portion and a second side portion connecting the bottom portion, and the bottom portion, the first side portion and the second side portion form a receiving frame with an opening;
injecting an elastic barrier film material into the cavity;
heating the elastic barrier film material through the extrusion of a die to form an elastic barrier film attached to the accommodating frame body;
removing the mold, and covering a second substrate on the structure after the mold is removed to seal the opening of the containing frame, wherein the second substrate is used as a substrate of the transfer member;
removing the first substrate to expose the bottom of the accommodating frame;
a corresponding through hole is formed in the area, corresponding to the accommodating frame, of the second substrate;
injecting a deformation body into the accommodating frame through the through hole;
filling a heating element in the through hole to seal the through hole;
etching away a bottom portion of the receiving frame to expose the elastic barrier film corresponding to the bottom portion to form the transfer member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811447681.0A CN111243980B (en) | 2018-11-29 | 2018-11-29 | Transfer piece, transfer method and preparation method of transfer piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811447681.0A CN111243980B (en) | 2018-11-29 | 2018-11-29 | Transfer piece, transfer method and preparation method of transfer piece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111243980A CN111243980A (en) | 2020-06-05 |
| CN111243980B true CN111243980B (en) | 2022-10-28 |
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| CN108257905A (en) * | 2018-01-10 | 2018-07-06 | 歌尔股份有限公司 | Transfer method, display device and the electronic equipment of micro- light emitting diode |
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| CN201307584Y (en) * | 2008-09-28 | 2009-09-09 | 常州新区佳讯电子器材有限公司 | Fast transfer mold for diodes |
| US8349116B1 (en) * | 2011-11-18 | 2013-01-08 | LuxVue Technology Corporation | Micro device transfer head heater assembly and method of transferring a micro device |
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