CN111240451A - Heat dissipation method, electronic device and computer-readable storage medium - Google Patents
Heat dissipation method, electronic device and computer-readable storage medium Download PDFInfo
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- CN111240451A CN111240451A CN202010152558.7A CN202010152558A CN111240451A CN 111240451 A CN111240451 A CN 111240451A CN 202010152558 A CN202010152558 A CN 202010152558A CN 111240451 A CN111240451 A CN 111240451A
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- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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Abstract
The invention discloses a heat dissipation method, electronic equipment and a computer readable storage medium, wherein the method comprises the following steps: acquiring state parameters of the electronic equipment; adjusting the working parameter value of the heat dissipation device according to the state parameter; wherein the state parameters of the electronic device include at least two of: the working parameters of the electronic equipment, the electric quantity parameters of the electronic equipment and the current working parameters of the heat dissipation device. The heat dissipation method effectively improves the working efficiency of the heat dissipation device, so that the heat dissipation device can provide effective heat dissipation for the electronic equipment.
Description
Technical Field
The present invention relates to the field of mobile terminal device technologies, and in particular, to a heat dissipation method, an electronic device, and a computer-readable storage medium.
Background
With the continuous development of smart phones, the running speed of processors of smart phones is faster and faster, and heavy-load scenes are more and more, which leads to the power consumption of the smart phones to be larger and larger, so that the phenomenon of heat generation of the smart phones is more and more serious, the heat generation of the smart phones greatly affects the performance and the service life of the smart phones, and the use experience of users is also affected. In order to solve the problem of heat generation of the mobile phone, in recent years, the micro fan of the mobile phone has been gradually developed. At present, a driving circuit of a cooling fan of a smart phone is driven based on a constant voltage value, namely, the voltage value output to the fan is a constant value, so that the rotating speed of the fan is also a constant value, the driving efficiency of the fan is not high, and the fan cannot provide an effective cooling effect for the smart phone.
In view of the above, a new technical solution is needed to solve the above problems.
Disclosure of Invention
An object of the present invention is to provide a heat dissipation method to solve the problem that the operating parameter value of a heat dissipation device is a constant value, which results in low operating efficiency of the heat dissipation device.
In order to solve the technical problem, the invention is realized as follows:
a heat dissipation method is applied to electronic equipment, a heat dissipation device is arranged in the electronic equipment, and the method comprises the following steps:
acquiring state parameters of the electronic equipment;
adjusting the working parameter value of the heat dissipation device according to the state parameter; wherein the state parameters of the electronic device include at least two of: the working parameters of the electronic equipment, the electric quantity parameters of the electronic equipment and the current working parameters of the heat dissipation device.
In a second aspect, an embodiment of the present invention further provides an electronic device, where a heat dissipation device is built in the electronic device, and the electronic device includes:
the detection module is used for acquiring the state parameters of the electronic equipment;
the main control module is used for adjusting the working parameter value of the heat dissipation device according to the state parameter; wherein the state parameters of the electronic device include at least two of: the working parameters of the electronic equipment, the electric quantity parameters of the electronic equipment and the current working parameters of the heat dissipation device.
In a third aspect, an embodiment of the present invention further provides an electronic device, which includes a processor, a memory, and a computer program stored on the memory and executable on the processor, where the computer program, when executed by the processor, implements the steps of the heat dissipation method described above.
In a fourth aspect, the embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored, where the computer program, when executed by a processor, implements the steps of the heat dissipation method described above.
In the embodiment of the present invention, the state parameters of the electronic device are first obtained, and then the operating parameter values of the heat dissipation device are adjusted according to the state parameters, and the state parameters of the electronic device do not only include a single state parameter, but include at least two of the following: the working parameters of the electronic equipment, the electric quantity parameters of the electronic equipment and the current working parameters of the heat dissipation device, so that the heat dissipation method effectively improves the working efficiency of the heat dissipation device, and the heat dissipation device can provide effective heat dissipation for the electronic equipment.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic flow chart of a heat dissipation method according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a hardware structure of an electronic device implementing various embodiments of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a heat dissipation method which is applied to electronic equipment, namely, an execution main body of the method can be the electronic equipment. Referring to fig. 1, the method includes:
s1, acquiring the state parameters of the electronic equipment;
s2, adjusting the working parameter value of the heat sink according to the state parameter;
wherein the state parameters of the electronic device include at least two of: the working parameters of the electronic equipment, the electric quantity parameters of the electronic equipment and the current working parameters of the heat dissipation device.
In the prior art, the working parameter value of the heat dissipation device is a constant value, and the heat dissipation device operates with the constant working parameter value no matter how the state parameter of the electronic equipment is, so that the working efficiency of the heat dissipation device is very low, and an effective heat dissipation effect cannot be provided for the electronic equipment. The heat dissipation method provided by the embodiment of the invention includes the steps of firstly obtaining a state parameter of the electronic equipment, and then adjusting an operating parameter value of the heat dissipation device according to the state parameter, wherein the state parameter of the electronic equipment does not only include a single state parameter, but also includes at least two of the following states: the working parameters of the electronic equipment, the electric quantity parameters of the electronic equipment and the current working parameters of the heat dissipation device, so that the heat dissipation method effectively improves the working efficiency of the heat dissipation device, and the heat dissipation device can provide effective heat dissipation for the electronic equipment.
In one embodiment, the operating parameters of the electronic device include: the touched position and the operating temperature of a touch device in the electronic equipment. The operating parameters of the electronic device further include: a load of an operating system in the electronic device and a temperature of a motherboard of the electronic device.
In one embodiment, the current operating parameters of the heat dissipation device include: a current voltage value of the heat sink, a current operating speed of the heat sink. The current running speed of the heat dissipation device can be further adjusted by adjusting the voltage value output to the heat dissipation device; specifically, the current operating speed of the heat sink is higher as the voltage value output to the heat sink is higher, and the current operating speed of the heat sink is lower as the voltage value output to the heat sink is lower.
In the heat dissipation method of the embodiment of the invention, at least two parameters of the working parameters of the electronic equipment, the electric quantity parameters of the electronic equipment and the current working parameters of the heat dissipation device are integrated to be used as a basis for adjusting the working parameter values of the heat dissipation device, and the working parameters of the electronic equipment and the current working parameters of the heat dissipation device respectively comprise a plurality of parameters.
In one embodiment, the heat dissipation device is a heat dissipation fan, the heat dissipation fan is built in a heat dissipation air duct, and the current operating parameters of the heat dissipation device include: and air pressure in the heat dissipation air duct.
In an embodiment, when the temperature of the motherboard of the electronic device is higher than a motherboard temperature threshold or the temperature of the motherboard of the electronic device is in an ascending trend, and meanwhile, when the temperature of a touched position of a touch device in the electronic device is higher than the electronic device temperature threshold, the current voltage value of the heat dissipation device is increased.
In an embodiment, when the temperature of the motherboard of the electronic device is lower than a motherboard temperature threshold or the temperature of the motherboard of the electronic device is in a downward trend, and meanwhile, the electronic device is not touched by a user or the temperature of a touched position of a touch device in the electronic device is lower than the electronic device temperature threshold, the current voltage value of the heat dissipation device is reduced.
In one embodiment, if the current operating speed of the heat sink is lower than an operating speed threshold, or the power parameter of the electronic device is higher than a power parameter threshold, or the load value of an operating system in the electronic device is higher than a load threshold, the current voltage value of the heat sink is increased.
In one embodiment, if the current operating speed of the heat sink is higher than an operating speed threshold, or the power parameter of the electronic device is lower than a power parameter threshold, or the load value of an operating system in the electronic device is lower than a load threshold, the current voltage value of the heat sink is decreased.
The heat dissipation method comprehensively considers the working parameters of a plurality of electronic devices, the electric quantity parameters of the electronic devices and the current working parameters of the heat dissipation device according to the actual use scene of a user, improves the driving efficiency of the heat dissipation device and reduces the system power consumption of the electronic devices. Specifically, compared with the method that only one parameter value is considered, the heat dissipation method provided by the embodiment of the invention at least has the following advantages: when the heat dissipation device is blocked due to unsmooth operation, the temperature of the motherboard of the electronic device is higher and higher, and if the operating parameter value of the heat dissipation device is adjusted only according to the temperature of the motherboard of the electronic device, the voltage value output by the electronic device to the heat dissipation device is increased, and then the operation speed of the heat dissipation device is increased, which may cause serious consequences, such as damage to the heat dissipation device.
If the user does not touch the electronic device, the voltage value output to the heat sink does not need to be increased, so that the power consumption of the system is prevented from being increased.
If the user touches the electronic device, but the temperature of the touched position of the touch device is not higher than the temperature threshold of the electronic device, the voltage value output to the heat dissipation device does not need to be increased, and the increase of the system power consumption is avoided.
Referring to fig. 2, an embodiment of the present invention further provides an electronic device 20, in which a heat dissipation device is built, and the electronic device includes: the detection module 21 is configured to obtain a state parameter of the electronic device; the main control module 22 is used for adjusting the working parameter value of the heat dissipation device according to the state parameter; wherein the state parameters of the electronic device include at least two of: the working parameters of the electronic equipment, the electric quantity parameters of the electronic equipment and the current working parameters of the heat dissipation device.
The electronic device provided by the embodiment of the present invention can implement each process implemented by the electronic device in any of the above embodiments of the heat dissipation method, and details are not repeated here to avoid repetition.
In this embodiment, the working parameter value of the heat dissipation device is not always constant, but the main control module 22 adjusts the working parameter value of the heat dissipation device in real time according to the state parameter of the electronic device obtained by the detection module 21, so as to effectively improve the working efficiency of the heat dissipation device, and enable the heat dissipation device to provide an effective heat dissipation effect for the electronic device.
Fig. 3 is a schematic diagram of a hardware structure of an electronic device 100 for implementing various embodiments of the present invention, where the electronic device 100 includes, but is not limited to: radio frequency unit 101, network module 102, audio output unit 103, input unit 104, sensor 105, display unit 106, user input unit 107, interface unit 108, memory 109, processor 110, and power supply 111. Those skilled in the art will appreciate that the electronic device configuration shown in fig. 1 does not constitute a limitation of the electronic device, and that the electronic device may include more or fewer components than shown, or some components may be combined, or a different arrangement of components. In the embodiment of the present invention, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like.
A processor 110, configured to obtain a status parameter of the electronic device; and adjusting the working parameter value of the heat dissipation device according to the state parameter of the electronic equipment.
In this embodiment, first, a state parameter of the electronic device is obtained, and then an operating parameter value of the heat dissipation device is adjusted according to the state parameter, where the state parameter of the electronic device does not only include a single state parameter, but includes at least two of the following: the working parameters of the electronic equipment, the electric quantity parameters of the electronic equipment and the current working parameters of the heat dissipation device, thereby effectively improving the working efficiency of the heat dissipation device and enabling the heat dissipation device to provide effective heat dissipation for the electronic equipment.
It should be understood that, in the embodiment of the present invention, the radio frequency unit 101 may be used for receiving and sending signals during a message transmission or call process, and specifically, after receiving downlink data from a base station, the downlink data is processed by the processor 110; in addition, the uplink data is transmitted to the base station. Typically, radio frequency unit 101 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. In addition, the radio frequency unit 101 can also communicate with a network and other devices through a wireless communication system.
The electronic device provides wireless broadband internet access to the user via the network module 102, such as assisting the user in sending and receiving e-mails, browsing web pages, and accessing streaming media.
The audio output unit 103 may convert audio data received by the radio frequency unit 101 or the network module 102 or stored in the memory 109 into an audio signal and output as sound. Also, the audio output unit 103 may also provide audio output related to a specific function performed by the electronic apparatus 100 (e.g., a call signal reception sound, a message reception sound, etc.). The audio output unit 103 includes a speaker, a buzzer, a receiver, and the like.
The input unit 104 is used to receive an audio or video signal. The input Unit 104 may include a Graphics Processing Unit (GPU) 1041 and a microphone 1042, and the Graphics processor 1041 processes image data of a still picture or video obtained by an image capturing device (e.g., a camera) in a video capturing mode or an image capturing mode. The processed image frames may be displayed on the display unit 106. The image frames processed by the graphic processor 1041 may be stored in the memory 109 (or other storage medium) or transmitted via the radio frequency unit 101 or the network module 102. The microphone 1042 may receive sound and may be capable of processing such sound into audio data. The processed audio data may be converted into a format output transmittable to a mobile communication base station via the radio frequency unit 101 in case of a phone call mode.
The electronic device 100 also includes at least one sensor 105, such as a light sensor, motion sensor, and other sensors. Specifically, the light sensor includes an ambient light sensor that can adjust the brightness of the display panel 1061 according to the brightness of ambient light, and a proximity sensor that can turn off the display panel 1061 and/or a backlight when the mobile terminal 100 is moved to the ear. As one of the motion sensors, the accelerometer sensor can detect the magnitude of acceleration in each direction (generally three axes), detect the magnitude and direction of gravity when stationary, and can be used to identify the posture of the mobile terminal (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), and vibration identification related functions (such as pedometer, tapping); the sensors 105 may also include fingerprint sensors, pressure sensors, iris sensors, molecular sensors, gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., which are not described in detail herein.
The display unit 106 is used to display information input by a user or information provided to the user. The Display unit 106 may include a Display panel 1061, and the Display panel 1061 may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like.
The user input unit 107 may be used to receive input numeric or character information and generate key signal inputs related to user settings and function control of the mobile terminal. Specifically, the user input unit 107 includes a touch panel 1071 and other input devices 1072. Touch panel 1071, also referred to as a touch screen, may collect touch operations by a user on or near the touch panel 1071 (e.g., operations by a user on or near touch panel 1071 using a finger, stylus, or any suitable object or attachment). The touch panel 1071 may include two parts of a touch detection device and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 110, and receives and executes commands sent by the processor 110. In addition, the touch panel 1071 may be implemented in various types, such as a resistive type, a capacitive type, an infrared ray, and a surface acoustic wave. In addition to the touch panel 1071, the user input unit 107 may include other input devices 1072. Specifically, other input devices 1072 may include, but are not limited to, a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which are not described in detail herein.
Further, the touch panel 1071 may be overlaid on the display panel 1061, and when the touch panel 1071 detects a touch operation thereon or nearby, the touch panel 1071 transmits the touch operation to the processor 110 to determine the type of the touch event, and then the processor 110 provides a corresponding visual output on the display panel 1061 according to the type of the touch event. Although in fig. 3, the touch panel 1071 and the display panel 1061 are two independent components to implement the input and output functions of the electronic device, in some embodiments, the touch panel 1071 and the display panel 1061 may be integrated to implement the input and output functions of the electronic device, and is not limited herein.
The interface unit 108 is an interface for connecting an external device to the electronic apparatus 100. For example, the external device may include a wired or wireless headset port, an external power supply (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device having an identification module, an audio input/output (I/O) port, a video I/O port, an earphone port, and the like. The interface unit 108 may be used to receive input (e.g., data information, power, etc.) from an external device and transmit the received input to one or more elements within the electronic apparatus 100 or may be used to transmit data between the electronic apparatus 100 and the external device.
The memory 109 may be used to store software programs as well as various data. The memory 109 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required by at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may store data (such as audio data, a phonebook, etc.) created according to the use of the cellular phone, and the like. Further, the memory 109 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
The processor 110 is a control center of the electronic device, connects various parts of the entire electronic device using various interfaces and lines, performs various functions of the electronic device and processes data by operating or executing software programs and/or modules stored in the memory 109 and calling data stored in the memory 109, thereby performing overall monitoring of the electronic device. Processor 110 may include one or more processing units; preferably, the processor 110 may integrate an application processor, which mainly handles operating systems, user interfaces, application programs, etc., and a modem processor, which mainly handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 110.
The electronic device 100 may further include a power source 111 (such as a battery) for supplying power to each component, and preferably, the power source 111 may be logically connected to the processor 110 through a power management system, so as to implement functions of managing charging, discharging, and power consumption through the power management system.
In addition, the electronic device 100 includes some functional modules that are not shown, and are not described in detail herein.
Preferably, an embodiment of the present invention further provides an electronic device, which includes a processor 110, a memory 109, and a computer program stored on the memory 109 and executable on the processor 110, and when the computer program is executed by the processor 110, the steps of the heat dissipation method are implemented. The processes of the method embodiment can achieve the same technical effect, and are not described herein again to avoid repetition.
The embodiment of the invention also provides a computer readable storage medium, wherein a computer program is stored on the computer readable storage medium, and when the computer program is executed by a processor, the steps of the heat dissipation method are realized. The processes of the method embodiment can achieve the same technical effect, and are not described herein again to avoid repetition. The computer-readable storage medium may be a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (12)
1. A heat dissipation method is applied to electronic equipment, and is characterized in that a heat dissipation device is arranged in the electronic equipment, and the method comprises the following steps:
acquiring state parameters of the electronic equipment;
adjusting the working parameter value of the heat dissipation device according to the state parameter;
wherein the state parameters of the electronic device include at least two of: the working parameters of the electronic equipment, the electric quantity parameters of the electronic equipment and the current working parameters of the heat dissipation device.
2. The method for dissipating heat according to claim 1,
the operating parameters of the electronic device include: the touched position and the operating temperature of a touch device in the electronic equipment.
3. The method for dissipating heat according to claim 2, wherein the operating parameters of the electronic device comprise: a load of an operating system in the electronic device and a temperature of a motherboard of the electronic device.
4. The method of claim 1, wherein the current operating parameters of the heat dissipation device comprise: a current voltage value of the heat sink, a current operating speed of the heat sink.
5. The method as claimed in claim 4, wherein the heat dissipation device is a heat dissipation fan, the heat dissipation fan is disposed in a heat dissipation air duct, and the current operating parameters of the heat dissipation device include: and air pressure in the heat dissipation air duct.
6. The heat dissipation method as claimed in claim 3, wherein if the temperature of the motherboard is higher than a motherboard temperature threshold or the temperature of the motherboard is in a rising trend, the voltage value of the heat dissipation device is adjusted to be increased if the temperature of the touched position of the touch device is higher than an electronic device temperature threshold.
7. The heat dissipation method as claimed in claim 3, wherein if the temperature of the motherboard is lower than a motherboard temperature threshold or the temperature of the motherboard is in a downward trend, if the electronic device is not touched by the user or the temperature of the touched position of the touch device is lower than an electronic device temperature threshold, the voltage value of the heat dissipation device is adjusted to be decreased.
8. The method for dissipating heat according to claim 3, wherein in a case that the power parameter of the electronic device is higher than the power parameter threshold, if the current operating speed of the heat sink is lower than the operating speed threshold and the load value of an operating system in the electronic device is higher than the load threshold, the voltage value of the heat sink is adjusted to be increased.
9. The method for dissipating heat according to claim 3, wherein in a case that the power parameter of the electronic device is lower than a power parameter threshold, if a current operating speed of the heat sink is higher than an operating speed threshold and a load value of an operating system in the electronic device is lower than a load threshold, the voltage value of the heat sink is adjusted to be decreased.
10. An electronic device with a heat dissipation device built therein, comprising:
the detection module is used for acquiring the state parameters of the electronic equipment;
the main control module is used for adjusting the working parameter value of the heat dissipation device according to the state parameter; wherein the state parameters of the electronic device include at least two of: the working parameters of the electronic equipment, the electric quantity parameters of the electronic equipment and the current working parameters of the heat dissipation device.
11. An electronic device comprising a processor, a memory, and a computer program stored on the memory and executable on the processor, the computer program, when executed by the processor, implementing the steps of the heat dissipation method as claimed in any one of claims 1 to 9.
12. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the heat dissipation method according to any one of claims 1 to 9.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113672466A (en) * | 2021-08-23 | 2021-11-19 | 联想(北京)有限公司 | Control method and device and electronic equipment |
| CN113985991A (en) * | 2021-10-26 | 2022-01-28 | 歌尔科技有限公司 | Head-mounted device management method and device, head-mounted device and computer storage medium |
| CN116483180A (en) * | 2023-03-10 | 2023-07-25 | 苏州振畅智能科技有限公司 | Intelligent control method, system, equipment and medium of active heat dissipation device |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201252712Y (en) * | 2008-08-11 | 2009-06-03 | 洋鑫科技股份有限公司 | Heat-dissipating support with touch-control induction keys |
| CN103092292A (en) * | 2011-10-28 | 2013-05-08 | 宏碁股份有限公司 | Portable computer and system effectiveness adjusting method thereof |
| CN103269193A (en) * | 2013-05-06 | 2013-08-28 | 德清县金宇达电气有限公司 | Major loop circuit of two-phase direct current brushless temperature control fan |
| CN203767175U (en) * | 2013-08-30 | 2014-08-13 | 浙江大学 | Electrical control cabinet of heat dissipation type packing machine |
| US20140312843A1 (en) * | 2013-04-22 | 2014-10-23 | Chervon (Hk) Limited | Battery pack cooling and charging device and method |
| CN104871109A (en) * | 2012-12-17 | 2015-08-26 | 惠普发展公司，有限责任合伙企业 | Temperature based on touching portable computing device |
| US20160187023A1 (en) * | 2014-12-30 | 2016-06-30 | Vivint, Inc. | Floating thermostat plate |
| CN105828577A (en) * | 2016-03-28 | 2016-08-03 | 联想(北京)有限公司 | Electronic device and control method thereof |
| CN106125592A (en) * | 2016-06-17 | 2016-11-16 | 联想(北京)有限公司 | A kind of method of heat radiation firmware of upgrading and electronic equipment |
| US20170205838A1 (en) * | 2016-01-14 | 2017-07-20 | Cooler Master Co., Ltd. | Intelligent control method and device |
| CN108429551A (en) * | 2018-01-31 | 2018-08-21 | 京东方科技集团股份有限公司 | The control method and electronic equipment of a kind of electronic equipment |
| CN110286728A (en) * | 2019-06-27 | 2019-09-27 | 联想(北京)有限公司 | Radiator monitoring method, device and electronic equipment |
| CN110580092A (en) * | 2019-09-10 | 2019-12-17 | 苏州蜗牛数字科技股份有限公司 | Terminal heat dissipation method and device and computer readable storage medium |
| US20200033920A1 (en) * | 2018-07-28 | 2020-01-30 | Microsoft Technology Licensing, Llc | Optimized touch temperature thermal management |
| CN210033925U (en) * | 2018-12-29 | 2020-02-07 | 先控捷联电气股份有限公司 | Fan speed regulating device and fan equipment |
-
2020
- 2020-03-06 CN CN202010152558.7A patent/CN111240451B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201252712Y (en) * | 2008-08-11 | 2009-06-03 | 洋鑫科技股份有限公司 | Heat-dissipating support with touch-control induction keys |
| CN103092292A (en) * | 2011-10-28 | 2013-05-08 | 宏碁股份有限公司 | Portable computer and system effectiveness adjusting method thereof |
| CN104871109A (en) * | 2012-12-17 | 2015-08-26 | 惠普发展公司，有限责任合伙企业 | Temperature based on touching portable computing device |
| US20140312843A1 (en) * | 2013-04-22 | 2014-10-23 | Chervon (Hk) Limited | Battery pack cooling and charging device and method |
| CN103269193A (en) * | 2013-05-06 | 2013-08-28 | 德清县金宇达电气有限公司 | Major loop circuit of two-phase direct current brushless temperature control fan |
| CN203767175U (en) * | 2013-08-30 | 2014-08-13 | 浙江大学 | Electrical control cabinet of heat dissipation type packing machine |
| US20160187023A1 (en) * | 2014-12-30 | 2016-06-30 | Vivint, Inc. | Floating thermostat plate |
| US20170205838A1 (en) * | 2016-01-14 | 2017-07-20 | Cooler Master Co., Ltd. | Intelligent control method and device |
| CN105828577A (en) * | 2016-03-28 | 2016-08-03 | 联想(北京)有限公司 | Electronic device and control method thereof |
| CN106125592A (en) * | 2016-06-17 | 2016-11-16 | 联想(北京)有限公司 | A kind of method of heat radiation firmware of upgrading and electronic equipment |
| CN108429551A (en) * | 2018-01-31 | 2018-08-21 | 京东方科技集团股份有限公司 | The control method and electronic equipment of a kind of electronic equipment |
| US20200033920A1 (en) * | 2018-07-28 | 2020-01-30 | Microsoft Technology Licensing, Llc | Optimized touch temperature thermal management |
| CN210033925U (en) * | 2018-12-29 | 2020-02-07 | 先控捷联电气股份有限公司 | Fan speed regulating device and fan equipment |
| CN110286728A (en) * | 2019-06-27 | 2019-09-27 | 联想(北京)有限公司 | Radiator monitoring method, device and electronic equipment |
| CN110580092A (en) * | 2019-09-10 | 2019-12-17 | 苏州蜗牛数字科技股份有限公司 | Terminal heat dissipation method and device and computer readable storage medium |
Non-Patent Citations (2)
| Title |
|---|
| GARY BURNETT等: ""A study of unidirectional swipe gestures on in-vehicle touch screens"", 《ACM》 * |
| 纪少波等: ""适用于电子风扇控制器的调试装置开发"", 《内燃机与动力装置》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113672466A (en) * | 2021-08-23 | 2021-11-19 | 联想(北京)有限公司 | Control method and device and electronic equipment |
| CN113985991A (en) * | 2021-10-26 | 2022-01-28 | 歌尔科技有限公司 | Head-mounted device management method and device, head-mounted device and computer storage medium |
| CN113985991B (en) * | 2021-10-26 | 2024-06-07 | 歌尔科技有限公司 | Headset management method and device, headset and computer storage medium |
| CN116483180A (en) * | 2023-03-10 | 2023-07-25 | 苏州振畅智能科技有限公司 | Intelligent control method, system, equipment and medium of active heat dissipation device |
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