CN111240447A

CN111240447A - Dustproof heat radiation structure for computer

Info

Publication number: CN111240447A
Application number: CN202010009846.7A
Authority: CN
Inventors: 曾俊
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-01-06
Filing date: 2020-01-06
Publication date: 2020-06-05

Abstract

The invention discloses a dustproof heat dissipation structure for a computer, and relates to the technical field of computer heat dissipation. The invention comprises a computer case, wherein a water storage tank is fixed at the bottom of the computer case, and a heat dissipation tank is fixed at the top of the computer case; the computer case is characterized in that heat conduction cavities are formed in the inner walls of the two sides of the computer case, absorbent cotton layers are fixed on the inner walls of the heat conduction cavities, and absorbent cotton slivers which penetrate through the heat conduction cavities and the water storage tank and extend to the inside of the water storage tank are fixed on the absorbent cotton layers in the heat conduction cavities. According to the invention, the heat conducting cavity is formed in the computer case, the heat radiating box is arranged at the top of the computer case, and the water storage tank and the absorbent cotton are matched for use, so that cooling water can be distributed on the surface of the computer case under the condition of no external force, heat emitted by the computer during working is absorbed by water, energy is not consumed, dust is prevented from entering the computer case, the size is small, water resource consumption is low, the heat radiating effect is good, and the use cost is low.

Description

Dustproof heat radiation structure for computer

Technical Field

The invention belongs to the technical field of computer heat dissipation, and particularly relates to a dustproof heat dissipation structure for a computer.

Background

The CPU and other parts of the computer generate heat during high-speed operation, and heat dissipation is a heat transfer process, so that the heat generated by the CPU and other parts is carried to other media, and the temperature of the CPU and other parts is controlled within a stable range.

Most of computer hosts in the prior art are provided with a radiating fan, but the radiating effect of the radiating fan still cannot meet the radiating requirement, and a large amount of dust is easily accumulated; the water cooling has large volume and weight, high use cost, large power consumption and poor energy conservation.

The prior published document CN 104699209B-computer spiral heat dissipation structure comprises a water storage box, a circulating spiral pipe, a circulating water pump, a plurality of air guide cylinders, a plurality of heat conduction supporting pieces, an air suction pump, a plurality of air guide pipes, a spiral pipe support, a refrigeration sheet, a mounting box, a plurality of mounting plates and a heat dissipation convection net; the installation box is provided with a plurality of installation plates, the heat dissipation convection net covers the upper end of the installation box, the water storage box is arranged in the installation box, the circulating spiral pipe is arranged above the water storage box through a spiral pipe support, the circulating water pump and the refrigerating sheet are arranged in the water storage box, and two ends of the circulating spiral pipe are connected with the circulating water pump; the air guide cylinders are connected to the circulating spiral pipe through the heat conduction supporting pieces, the air extracting pump is arranged in the mounting box, and the air guide pipes are connected with the air extracting pump and the air guide cylinders. The invention can radiate heat for the computer and the computer by air cooling and water cooling, thereby achieving the best and fastest radiating purpose, the air convection flow can be self-adapted according to the heating degree, and the invention plays a certain dustproof role while radiating. Although the technology can achieve a good heat dissipation effect, the size and the weight of the computer host are greatly increased in the using process, the using cost is higher, and the power consumption is greatly increased in the using process.

Disclosure of Invention

The invention aims to provide a dustproof heat dissipation structure for a computer, which is used for rapidly conducting heat inside the computer out of a case by utilizing heat exchange and water heat absorption evaporation without consuming extra electric energy, and preventing dust from entering the case in a sealed state, thereby solving the problems that the existing computer is easy to enter dust by using a plurality of fans for heat dissipation, and has large water cooling volume, high cost and high power consumption.

In order to solve the technical problems, the invention is realized by the following technical scheme:

the invention relates to a dustproof heat dissipation structure for a computer, which comprises a computer case, wherein a water storage tank is fixed at the bottom of the computer case, and a heat dissipation tank is fixed at the top of the computer case;

the computer case is characterized in that heat conduction cavities are formed in the inner walls of the two sides of the computer case, absorbent cotton layers are fixed on the inner walls of the heat conduction cavities, and absorbent cotton slivers which penetrate through the heat conduction cavities and the water storage tank and extend into the water storage tank are fixed on the absorbent cotton layers in the heat conduction cavities;

a heat conduction pipe with one end communicated with the heat conduction cavity is fixed at the top of the computer case, and the other end of the heat conduction pipe penetrates through the heat dissipation box and is communicated with the interior of the heat dissipation box;

a heat absorption plate is fixed at the bottom of the inner wall of the heat dissipation box, a heat exchange rod is fixed at the bottom of the heat absorption plate, the bottom end of the heat exchange rod penetrates through the top of the computer case, a water storage cotton layer is fixedly arranged on the upper surface of the heat absorption plate, and heat dissipation fins penetrate through the top of the heat dissipation box;

a water feeding pipe penetrates through the bottom of one side surface of the heat dissipation box, a flow guide pipe penetrates through the bottom of the other side surface of the heat dissipation box, a return pipe is fixed at the water outlet end of the flow guide pipe, and the bottom end of the return pipe penetrates through the top of the water storage tank and is communicated with the interior of the water storage tank;

the bottom end of the water adding pipe penetrates through the water storage tank, a drainage cotton sliver is fixedly arranged inside the water adding pipe, the water absorbing end of the drainage cotton sliver extends to the bottom of the inner wall of the water storage tank, and the water outlet end of the drainage cotton sliver is in contact with the water storage cotton layer.

Furthermore, a water injection pipe penetrates through one side of the top of the water storage tank, and a water drainage pipe penetrates through the bottom of the top of the water storage tank.

Further, the fixed heat dissipation strip that is provided with of absorber plate top equidistance, the heat exchange stick includes the fixed rod and extends the stick, fixed rod and absorber plate fixed connection, the spread groove has all been seted up to fixed rod bottom and extension stick bottom, extend excellent top be fixed with spread groove complex spliced pole.

Furthermore, the return pipe comprises an outer sleeve, and a filter screen layer, a sand filter layer, a filter cotton layer, an active carbon adsorption layer and a polymer sterilization layer are sequentially fixed in the outer sleeve from top to bottom.

Furthermore, the absorbent cotton layer, the absorbent cotton sliver, the water storage cotton layer and the drainage cotton sliver are all made of absorbent cotton or absorbent sponge.

Furthermore, the bottom of the computer case is provided with a water outlet communicated with the heat conducting cavity, and the top of the water storage tank is provided with a through hole matched with the water outlet.

The invention has the following beneficial effects:

1. the heat conducting cavity is arranged in the computer case, the heat radiating case is arranged at the top of the heat conducting cavity, and the water storing case and the absorbent cotton are matched for use, so that cooling water can be distributed on the surface of the computer case under the condition of no external force, heat emitted by the computer during working is absorbed by water, the water is heated and evaporated to take away a large amount of heat, water vapor formed after evaporation is condensed by the heat radiating fins with lower temperature in the heat radiating case, the released heat is led out by the heat radiating fins, and condensed water drops fall and are gathered and then led into the water storing case again through the return pipe to complete heat radiation.

2. The heat conducting cavity is formed in the inner wall of the computer case, so that a large amount of heat can be transferred through the inner wall of the case in the using process and can act simultaneously with water absorption and heat dissipation, and the heat dissipation effect is further improved.

3. The invention can filter and sterilize the cooling water by using the return pipe, thereby avoiding the deterioration of water quality after long-time use.

Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a dustproof heat dissipation structure for a computer according to the present invention;

FIG. 2 is a schematic structural diagram of a computer case;

FIG. 3 is a schematic view of the structure of the heat sink portion of FIG. 1;

fig. 4 is a schematic view of the structure of the return pipe.

In the drawings, the components represented by the respective reference numerals are listed below:

1-computer case, 101-heat conduction cavity, 102-absorbent cotton layer, 103-absorbent cotton sliver, 104-water outlet hole, 2-water storage tank, 3-heat dissipation tank, 4-heat conduction pipe, 5-heat absorption plate, 6-heat exchange rod, 7-water storage cotton layer, 8-heat dissipation fin, 9-water feeding pipe, 10-flow guide pipe, 11-return pipe, 1101-outer sleeve pipe, 1102-filter screen layer, 1103-sand filter layer, 1104-filter cotton layer, 1105-active carbon adsorption layer, 1106-polymer sterilization layer, 12-drainage cotton sliver, 13-water injection pipe and 14-water discharge pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, the present invention is a dustproof heat dissipation structure for a computer, including a computer case 1, a water storage tank 2 fixed at the bottom of the computer case 1, and a heat dissipation tank 3 fixed at the top of the computer case 1.

The computer case 1 is provided with heat conduction cavity 101 on the inner wall of both sides, is fixed with cotton layer 102 that absorbs water on the heat conduction cavity 101 inner wall, is fixed with on the cotton layer 102 that absorbs water in the inside heat conduction cavity 101 and runs through heat conduction cavity 101, storage water tank 2 and extend to the inside cotton strip 103 that absorbs water of storage water tank 2.

The top of the computer case 1 is fixed with a heat conduction pipe 4 with one end communicated with the heat conduction cavity 101, and the other end of the heat conduction pipe 4 penetrates through the heat dissipation box 3 and is communicated with the inside of the heat dissipation box 3.

The bottom of the inner wall of the heat dissipation box 3 is fixed with a heat absorption plate 5, the bottom of the heat absorption plate 5 is fixed with a heat exchange rod 6, the bottom end of the heat exchange rod 6 penetrates through the top of the computer case 1, the upper surface of the heat absorption plate 5 is fixed with a water storage cotton layer 7, and the top of the heat dissipation box 3 penetrates through a heat dissipation fin 8.

3 side bottom of heat dissipation case runs through has water pipe 9, and 3 another side bottom of heat dissipation case runs through has honeycomb duct 10, and honeycomb duct 10 water outlet end is fixed with back flow 11, and back flow 11 bottom runs through 2 tops of storage water tank and 2 inside intercommunications with the storage water tank.

The bottom end of the water adding pipe 9 penetrates through the water storage tank 2, the drainage cotton sliver 12 is fixedly arranged inside the water adding pipe 9, the water absorbing end of the drainage cotton sliver 12 extends to the bottom of the inner wall of the water storage tank 2, and the water outlet end of the drainage cotton sliver 12 is in contact with the water storage cotton layer 7.

A water injection pipe 13 penetrates through one side of the top of the water storage tank 2, and a water discharge pipe 14 penetrates through the bottom of the top of the water storage tank 2.

Referring to fig. 3, the top of the absorber plate 5 is fixedly provided with heat dissipating strips at equal intervals, the heat exchanging rod 6 comprises a fixing rod and an extending rod, the fixing rod is fixedly connected with the absorber plate 5, the bottom end of the fixing rod and the bottom end of the extending rod are both provided with connecting grooves, and the top end of the extending rod is fixedly provided with a connecting column matched with the connecting grooves.

Referring to fig. 4, the return pipe 11 includes an outer casing 1101, and a filter screen layer 1102, a sand filter layer 1103, a filter cotton layer 1104, an activated carbon adsorption layer 1105 and a polymer sterilization layer 1106 are sequentially fixed inside the outer casing 1101 from top to bottom.

The absorbent cotton layer 102, the absorbent cotton sliver 103, the water storage cotton layer 7 and the drainage cotton sliver 12 are all made of absorbent cotton or absorbent sponge.

Referring to fig. 1, the bottom of the computer case 1 is provided with a water outlet 104 communicating with the heat conducting cavity 101, and the top of the water storage tank 2 is provided with a through hole matching with the water outlet 104.

One specific application of this embodiment is: during the use, the inside cooling water that adds the capacity in storage water tank 2, the saturated storage of cold water is in cotton layer 102 absorbs water under the effect of cotton strip 103 absorbs water, the saturated storage of cold water is in cotton layer 7 stores water under the effect of drainage cotton strip, when computer machine case 1 dispels the heat, cotton layer 102 absorbs water, the cooling water heat absorption evaporation of cotton layer 7 stores water, the vapor gathering meets the lower radiating fin 8 condensation of temperature and drips on cotton layer 7 stores water in the radiator tank, cotton layer 7 stores water absorbs water after saturation, unnecessary moisture is through honeycomb duct 10, the return pipe 11 gets back to storage water tank 2 and recycles, the water resource consumption is few, do not consume the electric energy, use cost is low, the radiating effect is good, and can effectually block the entering of dust.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides a dustproof heat radiation structure for computer, includes computer machine case (1), its characterized in that: a water storage tank (2) is fixed at the bottom of the computer case (1), and a heat dissipation tank (3) is fixed at the top of the computer case (1);

the computer case is characterized in that heat conduction cavities (101) are formed in the inner walls of two sides of the computer case (1), absorbent cotton layers (102) are fixed on the inner walls of the heat conduction cavities (101), and absorbent cotton slivers (103) which penetrate through the heat conduction cavities (101) and the water storage tank (2) and extend to the interior of the water storage tank (2) are fixed on the absorbent cotton layers (102) in the heat conduction cavities (101);

a heat conduction pipe (4) with one end communicated with the heat conduction cavity (101) is fixed at the top of the computer case (1), and the other end of the heat conduction pipe (4) penetrates through the heat dissipation box (3) and is communicated with the interior of the heat dissipation box (3);

a heat absorption plate (5) is fixed at the bottom of the inner wall of the heat dissipation box (3), a heat exchange rod (6) is fixed at the bottom of the heat absorption plate (5), the bottom end of the heat exchange rod (6) penetrates through the top of the computer case (1), a water storage cotton layer (7) is fixedly arranged on the upper surface of the heat absorption plate (5), and heat dissipation fins (8) penetrate through the top of the heat dissipation box (3);

a water feeding pipe (9) penetrates through the bottom of one side face of the heat dissipation box (3), a flow guide pipe (10) penetrates through the bottom of the other side face of the heat dissipation box (3), a return pipe (11) is fixed at the water outlet end of the flow guide pipe (10), and the bottom end of the return pipe (11) penetrates through the top of the water storage tank (2) and is communicated with the interior of the water storage tank (2);

the water storage tank (2) is run through to filler (9) bottom, the inside fixed drainage silver (12) that is provided with of filler (9), drainage silver (12) absorb water the end and extend to storage tank (2) inner wall bottom, drainage silver (12) play water end and the cotton layer of retaining (7) contact.

2. The dustproof heat dissipation structure for the computer according to claim 1, wherein a water injection pipe (13) penetrates through one side of the top of the water storage tank (2), and a water drainage pipe (14) penetrates through the bottom of the top of the water storage tank (2).

3. The dustproof heat dissipation structure for the computer of claim 1, wherein the top of the heat absorbing plate (5) is fixedly provided with heat dissipation strips at equal intervals, the heat exchange rod (6) comprises a fixed rod and an extension rod, the fixed rod is fixedly connected with the heat absorbing plate (5), the bottom end of the fixed rod and the bottom end of the extension rod are both provided with a connection groove, and the top end of the extension rod is fixedly provided with a connection column matched with the connection groove.

4. The dustproof heat dissipation structure for the computer of claim 1, wherein the return pipe (11) comprises an outer sleeve (1101), and a filter screen layer (1102), a sand filter layer (1103), a filter cotton layer (1104), an activated carbon adsorption layer (1105) and a polymer sterilization layer (1106) are sequentially fixed inside the outer sleeve (1101) from top to bottom.

5. The dustproof heat dissipation structure for the computer according to claim 1, wherein the absorbent cotton layer (102), the absorbent cotton sliver (103), the water storage cotton layer (7) and the drainage cotton sliver (12) are made of absorbent cotton or absorbent sponge.

6. The dustproof heat dissipation structure for the computer according to claim 1, wherein the bottom of the computer case (1) is provided with a water outlet (104) communicated with the heat conduction cavity (101), and the top of the water storage tank (2) is provided with a through hole matched with the water outlet (104).